CN114994082A - Double-precision mark point pattern structure and identification method - Google Patents
Double-precision mark point pattern structure and identification method Download PDFInfo
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- CN114994082A CN114994082A CN202210738524.5A CN202210738524A CN114994082A CN 114994082 A CN114994082 A CN 114994082A CN 202210738524 A CN202210738524 A CN 202210738524A CN 114994082 A CN114994082 A CN 114994082A
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- 238000000034 method Methods 0.000 title claims abstract description 8
- 239000007787 solid Substances 0.000 claims abstract description 44
- 239000011248 coating agent Substances 0.000 claims abstract description 5
- 238000000576 coating method Methods 0.000 claims abstract description 5
- 230000009977 dual effect Effects 0.000 claims 2
- 208000032825 Ring chromosome 2 syndrome Diseases 0.000 description 11
- 238000010586 diagram Methods 0.000 description 9
- 208000035217 Ring chromosome 1 syndrome Diseases 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/08—Measuring arrangements characterised by the use of optical techniques for measuring diameters
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
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- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Inking, Control Or Cleaning Of Printing Machines (AREA)
Abstract
A double-precision mark point pattern structure and an identification method are disclosed, wherein a mark point is composed of a large ring, a small ring and a solid circle; big ring, little ring and solid circle three are concentric to by interior outside is in proper order: the solid ring, the small ring and the large ring are not in contact with each other; the diameter of the solid circle 3 is 0.7 mm; the inner diameter of the small circular ring 2 is 1.5mm, and the outer diameter is 1.8 mm; the inner diameter of the large circular ring 1 is 3.4mm, and the outer diameter is 4.0 mm; when the ink is coated, the ink coating 4 is positioned in the large circular ring, covers the solid circle 3 and the small circular ring 2 and does not exceed the inner diameter of the large circular ring 1; through exposing the printing ink picture layer, can compare with the position of solid circle and little ring according to the development after the printing ink picture layer is exposed, can judge two kinds of precisions simultaneously, compare in the traditional mark that can only judge a precision, when another kind of precision need be judged, need increase another group mark point, this mark point practices thrift the PCB space more, has improved the utilization ratio in PCB space.
Description
Technical Field
The invention relates to the field of circuit board printing, in particular to a double-precision mark dot pattern structure and an identification method.
Background
After the components on the PCB are installed, the mark points are generally required to be used for checking the accuracy of the surface mount, however, the existing mark points only can monitor and identify one accuracy and cannot meet two accuracy requirements, if the components on one PCB have the components with two accuracy requirements, the mark points with two accuracy are required to be manufactured for checking, and whether the two accuracy requirements are met or not is checked, so that the space of the PCB is excessively occupied.
Disclosure of Invention
The technical scheme adopted by the invention is as follows: a double-precision mark point pattern structure is characterized in that mark points are composed of large circular rings, small circular rings and solid circles; big ring, little ring and solid circle three are concentric to by interior outside is in proper order: the solid circle, the small circle and the big circle are not contacted with each other.
Further, the diameter of the solid circle is larger than 0.1 mm; the difference between the outside diameter and the inside diameter of the small circular ring is larger than 0.15 mm.
Further, the distance from the solid circular edge to the inner edge of the small circular ring is more than 0.2 mm; the distance from the outer edge of the small circular ring to the inner edge of the large circular ring is more than 0.2 mm.
A double-precision mark point identification method comprises the following steps:
s1, coating an ink layer in the large circular ring, and covering the small circular ring and the solid circle;
s2, exposing the ink layer;
and S3, observing the exposed mark points, and judging the precision deviation according to the position of the development of the ink layer after exposure.
Furthermore, the exposure light source is annular, and the diameter of the outer edge of the light source is smaller than the diameter of the outer side of the small ring and larger than the diameter of the inner side of the small ring; the diameter of the inner edge of the light source is smaller than that of the solid circle.
Due to the adoption of the technical scheme, the invention has the beneficial effects that: the traditional mark points can only identify one precision, if the other precision needs to be identified, another group of mark points needs to be added, but the mark points provided by the invention can identify two precisions simultaneously without adding the mark points, thereby greatly saving the PCB space.
Drawings
FIG. 1 is a schematic diagram showing the positional relationship between a large ring, a small ring and a solid circle according to the present invention.
FIG. 2 is a schematic representation of the ink coating pattern of the present invention.
FIG. 3 is a schematic view of an exposure light source pattern according to the present invention.
FIG. 4 is a schematic diagram of the mark dot after being coated with an ink layer.
FIG. 5 is a schematic diagram showing the size ratio of the exposure light source to the mark point.
FIG. 6 is a schematic diagram of an ideal state after exposure according to the present invention.
FIG. 7 is a schematic diagram of the invention showing the deviation of the precision after exposure is greater than 0 and less than 0.05 mm.
FIG. 8 is a schematic diagram of the present invention showing the deviation of the precision after exposure equal to 0.05 mm.
FIG. 9 is a schematic diagram of the invention showing the deviation of the precision after exposure greater than 0.05mm and less than 0.075 mm.
FIG. 10 is a schematic diagram of the invention showing the accuracy deviation after exposure equal to 0.075 mm.
FIG. 11 is a schematic diagram of the invention showing the accuracy deviation after exposure greater than 0.075 mm.
Reference numerals
A large circular ring-1; a small circular ring-2; solid circle-3; ink layer-4; solid circles of ink layers-41; ink layer ring-42.
Detailed Description
In the embodiment, after the PCB is subjected to surface mounting, the PCB is checked to check whether the surface mounting precision meets the requirement, and the surface mounting precision is checked when the surface mounting with the precision requirements of 0.05mm and 0.075mm simultaneously exists on the PCB for example;
1-5, a double precision mark dot pattern structure, the mark dot is composed of a big ring, a small ring and a solid circle; big ring 1, little ring 2 and solid circle 3 three are concentric to by interior outside being in proper order: the solid circle 3, the small circle 2 and the large circle 1 are not contacted with each other; the diameter of the solid circle 3 is larger than 0.1 mm; the difference value between the outer side diameter and the inner side diameter of the small ring 2 is more than 0.15mm, and the distance from the edge of the solid circle 3 to the edge of the inner side of the small ring 2 is more than 0.2 mm; the distance from the outer edge of the small ring 2 to the inner edge of the large ring 1 is more than 0.2 mm;
the diameter of the solid circle 3 is 0.7 mm; the inner diameter of the small circular ring 2 is 1.5mm, and the outer diameter is 1.8 mm; the inner diameter of the large circular ring 1 is 3.4mm, and the outer diameter is 4.0 mm; the ink coating 4 is positioned in the large circular ring, covers the solid circle 3 and the small circular ring 2 and does not exceed the inner diameter of the large circular ring 1;
a double-precision mark point identification method comprises the following steps:
firstly, ink is coated on mark points, and an ink layer 4 is positioned in the large circular ring 1, covers the small circular ring 2 and the solid circle 1 and does not exceed the inner diameter of the large circular ring 1; then, carrying out exposure treatment, wherein the exposure light source is circular, the inner diameter is 0.6mm, and the outer diameter is 1.65 mm;
ideally, the distance from the outer edge of the exposure light source to the outer edge of the small circular ring should be 0.075 mm. The distance from the inner side edge of the exposure light source to the edge of the solid circle 3 is 0.05mm, the exposure is carried out at the moment, an image obtained after the exposure is finished is shown in fig. 6, the distance from the edge of the solid circle 3 to the edge of the remaining ink layer solid circle 41 after the exposure is finished is 0.05mm, the distance from the inner side edge of the small circle 2 to the inner side edge of the remaining ink layer circle 42 after the exposure is finished is 0.075, the exposure is in an ideal state at the moment, and no deviation occurs;
when the deviation is more than 0 and less than 0.05mm, the image obtained should be such that the minimum distance from the edge of the solid circle 3 to the edge of the ink layer solid circle 41 remaining after the end of exposure is less than 0.05mm and more than 0, as shown in fig. 7.
When the deviation is equal to 0.05mm, the obtained image is that, as shown in fig. 8, the edge of the solid circle 3 is tangent to the ink layer solid circle 41 left after the exposure is finished, and the ink layer solid circle 41 is located in the solid circle 3;
when the deviation is greater than 0.05mm and less than 0.075mm, the obtained image is that, as shown in fig. 9, the edge of the solid ink circle 41 exceeds the solid circle 3, and the inner edge of the ink layer circle 42 is located inside the outer edge of the small circle 2;
when the deviation is equal to 0.075mm, the obtained image should be that, as shown in fig. 10, the inner edge of the ink layer ring 42 is tangent to the outer edge of the small ring 2, and the inner edge of the ink layer ring 42 does not exceed the outer edge of the small ring 2;
when the deviation is more than 0.075mm, the image obtained should be such that, as shown in fig. 11, the inner edge of ink layer ring 42 exceeds the outer edge of small ring 2;
the working principle is as follows: when two components with the precision requirements of 0.05mm and 0.075mm exist on a PCB at the same time, when the PCB is checked whether the two components with the precision requirements reach all the precision requirements, firstly, the PCB is placed under an exposure machine for exposing a mark, and is positioned by taking reference points around the PCB as a reference, after the positioning is finished, the exposure machine is started to expose the mark point, after the exposure is finished, the PCB is taken out and is placed under a microscope for checking the mark point to observe, and whether the mark point is qualified is judged; by way of example: when the precision requirements of two components on the PCB are 0.05mm and 0.075mm, respectively, after the exposure is finished, if the observed image is as shown in fig. 9 or fig. 10, that is, the edge of the solid ink layer circle 41 exceeds the solid circle 3, and the edge of the inner side of the ink layer circle 42 is located inside the outer edge of the small circle 2, or the edge of the inner side of the ink layer circle 42 is tangent to the outer edge of the small circle 2, it indicates that the precision deviation is not greater than 0.075mm, that is, the component with the precision requirement of 0.075mm is qualified, and the component with the precision requirement of 0.05mm is not qualified; if the observed image is as shown in any one of figures 6, 7 and 8, the precision deviation does not exceed 0.05mm, namely, both precision requirements are met; if the observed image is as shown in fig. 11, which means that the precision deviation is larger than 0.075mm, the components with two different precision requirements are not qualified.
Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art within the scope of the present invention.
Claims (5)
1. A double-precision mark point pattern structure is characterized in that mark points are composed of large circular rings, small circular rings and solid circles; big ring, little ring and solid circle three are concentric to by interior outside is in proper order: solid circle, small circle, big circle, and all do not contact between the three.
2. A dual precision mark dot pattern structure as claimed in claim 1, wherein said solid circle has a diameter greater than 0.1 mm; the difference between the outside diameter and the inside diameter of the small circular ring is larger than 0.15 mm.
3. A dual precision mark dot pattern structure as claimed in claim 2, wherein the distance from the edge of said solid circle to the inner edge of said small circle is greater than 0.2 mm; the distance from the outer edge of the small circular ring to the inner edge of the large circular ring is more than 0.2 mm.
4. A double-precision mark point identification method is characterized by comprising the following steps:
s1, coating an ink layer in the large circular ring, and covering the small circular ring and the solid circle;
s2, exposing the ink layer;
and S3, observing the exposed mark points, and judging the precision deviation according to the position of the development of the ink layer after exposure.
5. The method of claim 4, wherein the exposure light source is circular, and the outside edge diameter of the light source is smaller than the outside diameter of the small ring and larger than the inside diameter of the small ring; the diameter of the inner edge of the light source is smaller than that of the solid circle.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210738524.5A CN114994082A (en) | 2022-06-28 | 2022-06-28 | Double-precision mark point pattern structure and identification method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210738524.5A CN114994082A (en) | 2022-06-28 | 2022-06-28 | Double-precision mark point pattern structure and identification method |
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| CN114994082A true CN114994082A (en) | 2022-09-02 |
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| CN202210738524.5A Pending CN114994082A (en) | 2022-06-28 | 2022-06-28 | Double-precision mark point pattern structure and identification method |
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Citations (10)
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|---|---|---|---|---|
| DE19548378A1 (en) * | 1995-12-27 | 1997-07-03 | Bran & Luebbe | Process and device combination for establishing the comparability of spectrometer measurements |
| CN101646304A (en) * | 2008-08-05 | 2010-02-10 | 比亚迪股份有限公司 | Alignment method for printed circuit board |
| JP2010050148A (en) * | 2008-08-19 | 2010-03-04 | Toshiba Corp | Method of measuring misalignment, and misalignment inspection mark |
| CN202143295U (en) * | 2011-07-13 | 2012-02-08 | 龚晓刚 | PCB with positioned mark point |
| CN102765249A (en) * | 2012-07-10 | 2012-11-07 | 上海大学 | Machine vision detection method based on four-colour printed matter registration detection marks |
| CN102866576A (en) * | 2012-08-27 | 2013-01-09 | 京东方科技集团股份有限公司 | Mask plate group and method for determining alignment precision range by using mask plate group |
| CN106767502A (en) * | 2016-12-06 | 2017-05-31 | 合肥工业大学 | A kind of circle codification index point with start information |
| CN208077248U (en) * | 2017-07-31 | 2018-11-09 | 深圳市海思科自动化技术有限公司 | A kind of Mark points visual identifying system |
| CN112788833A (en) * | 2021-01-12 | 2021-05-11 | 日月光半导体(上海)有限公司 | Printed circuit board and method for detecting interlayer position offset of printed circuit board |
| CN113218952A (en) * | 2021-04-25 | 2021-08-06 | 华南理工大学 | Method, device, equipment and medium for detecting multi-scale appearance defects of IC packaging carrier plate |
-
2022
- 2022-06-28 CN CN202210738524.5A patent/CN114994082A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19548378A1 (en) * | 1995-12-27 | 1997-07-03 | Bran & Luebbe | Process and device combination for establishing the comparability of spectrometer measurements |
| CN101646304A (en) * | 2008-08-05 | 2010-02-10 | 比亚迪股份有限公司 | Alignment method for printed circuit board |
| JP2010050148A (en) * | 2008-08-19 | 2010-03-04 | Toshiba Corp | Method of measuring misalignment, and misalignment inspection mark |
| CN202143295U (en) * | 2011-07-13 | 2012-02-08 | 龚晓刚 | PCB with positioned mark point |
| CN102765249A (en) * | 2012-07-10 | 2012-11-07 | 上海大学 | Machine vision detection method based on four-colour printed matter registration detection marks |
| CN102866576A (en) * | 2012-08-27 | 2013-01-09 | 京东方科技集团股份有限公司 | Mask plate group and method for determining alignment precision range by using mask plate group |
| CN106767502A (en) * | 2016-12-06 | 2017-05-31 | 合肥工业大学 | A kind of circle codification index point with start information |
| CN208077248U (en) * | 2017-07-31 | 2018-11-09 | 深圳市海思科自动化技术有限公司 | A kind of Mark points visual identifying system |
| CN112788833A (en) * | 2021-01-12 | 2021-05-11 | 日月光半导体(上海)有限公司 | Printed circuit board and method for detecting interlayer position offset of printed circuit board |
| CN113218952A (en) * | 2021-04-25 | 2021-08-06 | 华南理工大学 | Method, device, equipment and medium for detecting multi-scale appearance defects of IC packaging carrier plate |
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