CN114993040A - Heat treatment apparatus - Google Patents

Heat treatment apparatus Download PDF

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Publication number
CN114993040A
CN114993040A CN202111046701.5A CN202111046701A CN114993040A CN 114993040 A CN114993040 A CN 114993040A CN 202111046701 A CN202111046701 A CN 202111046701A CN 114993040 A CN114993040 A CN 114993040A
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China
Prior art keywords
heat treatment
transport
processed
temperature
support
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Pending
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CN202111046701.5A
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Chinese (zh)
Inventor
中谷淳司
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JTEKT Thermo Systems Corp
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Koyo Thermo Systems Co Ltd
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Publication of CN114993040A publication Critical patent/CN114993040A/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27FURNACES; KILNS; OVENS; RETORTS
    • F27BFURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B17/00Furnaces of a kind not covered by any preceding group
    • F27B17/0016Chamber type furnaces
    • F27B17/0033Chamber type furnaces the floor of the furnaces consisting of the support carrying the charge, e.g. car type furnaces
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27FURNACES; KILNS; OVENS; RETORTS
    • F27DDETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D21/00Arrangements of monitoring devices; Arrangements of safety devices
    • F27D21/0014Devices for monitoring temperature
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27FURNACES; KILNS; OVENS; RETORTS
    • F27DDETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D3/00Charging; Discharging; Manipulation of charge
    • F27D3/04Ram or pusher apparatus
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27FURNACES; KILNS; OVENS; RETORTS
    • F27DDETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D5/00Supports, screens, or the like for the charge within the furnace
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67098Apparatus for thermal treatment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67248Temperature monitoring
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742Mechanical parts of transfer devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00Technologies related to metal processing
    • Y02P10/20Recycling

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
  • Tunnel Furnaces (AREA)
  • Waste-Gas Treatment And Other Accessory Devices For Furnaces (AREA)
  • Heat Treatments In General, Especially Conveying And Cooling (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention provides a heat treatment apparatus which does not generate thermal shock to a member to be treated when the member to be treated is conveyed into a heat treatment furnace and supported by a support. The heat treatment apparatus includes: a heat treatment furnace forming a heat treatment space; a support disposed within the heat treatment space; a conveying device for supporting the object to be processed on the support after conveying the object to be processed from outside the heat treatment space to inside the heat treatment space; and a temperature detection device for detecting the temperature of the object to be processed conveyed into the heat treatment device by the conveying device. The transport device determines a timing of supporting the object to be processed, which is transported into the heat treatment device by the transport device, on the support based on the temperature detected by the temperature detection device.

Description

Heat treatment apparatus
Technical Field
The present invention relates to a heat treatment apparatus including a mechanism for carrying an object to be treated in and out of a heat treatment furnace by a transport rod.
Background
In a heat treatment apparatus for carrying an object to be treated into a heat treatment furnace and performing heat treatment, the object to be treated is conveyed from outside the heat treatment furnace, and the object to be treated is supported by a support member in the heat treatment furnace and then subjected to heat treatment.
For example, in patent document 1, a preparation chamber 40 is provided at a carrying-in/out port (opening) of a furnace body through a baffle plate, the carrying-in/out port carrying in an object to be processed. The object to be processed is supported by the support mechanism in the preparation chamber 40 and then carried into the furnace body by the arm. Then, the object to be processed is transferred to the support in the furnace body. If such a preparation chamber is provided, there is an advantage that the structure of the heat treatment apparatus can be simplified and miniaturization can be achieved.
Further, according to the structure shown in patent document 2, the object to be processed is conveyed from the outside of the heat treatment furnace, and the substrate to be processed is lowered in the heat treatment container and mounted on the processing table. At this time, since the temperature of the object to be processed is low, a sufficient fall time is secured to reduce the temperature difference between the processing stage and the substrate. Thus, the temperature difference between the processing table and the substrate is eliminated, and the peeling of the film deposited on the processing table is reduced.
Patent document 1: japanese patent laid-open publication No. 2017-117850
Patent document 2: japanese patent laid-open publication No. 2001-250782
Disclosure of Invention
However, in any of the above heat treatment apparatuses, when the member to be treated conveyed into the heat treatment furnace is supported by the support members in the furnace, there is a possibility that thermal shock is generated.
For example, in the heat treatment apparatus described in patent document 1, when the object to be treated is supported in the furnace, the temperature difference between the support and the object to be treated is not considered. Therefore, if the temperature difference between the both is large, there is a possibility that thermal shock is generated when the support comes into contact with the object to be processed.
In the heat processing apparatus described in patent document 2, it is considered that the lift pins 14 supporting the substrate to be processed in the heat processing container are already heated, although a sufficient lowering time is secured to reduce the temperature difference between the processing table and the substrate when the substrate to be processed is lowered in the heat processing container and mounted on the processing table. Therefore, when the object to be processed is mounted on the lift pins 14, a temperature difference between the distal end portions of the lift pins 14 and the object to be processed becomes large, and thermal shock is generated in some portions.
As described above, in the conventional heat treatment apparatus, when the object to be treated is conveyed from the outside and supported by the supporter in the heat treatment furnace, the object to be treated which is not in a high-temperature state in the furnace is supported by the supporter having a high temperature, and heat damage is generated in the object to be treated. As a result, cracks or breakages (fractures) occur in the object to be treated.
The invention aims to provide a heat treatment device which does not generate thermal shock to a member to be treated when the member to be treated is conveyed in a heat treatment furnace and supported by a support.
The heat treatment apparatus of the present invention includes:
a heat treatment furnace that forms a heat treatment space and performs heat treatment on an object to be treated in the heat treatment space;
a support disposed within the heat treatment space;
and a conveying device for supporting the object to be processed on the support after conveying the object to be processed from outside the heat treatment space into the heat treatment space.
Further, the heat treatment apparatus is provided with a temperature detection device for detecting the temperature of the object to be treated conveyed into the heat treatment apparatus by the conveying device,
the transport device determines a timing of supporting the object to be processed, which is transported into the heat treatment device by the transport device, on the support based on the temperature detected by the temperature detection device.
In the present invention, the object to be processed is a workpiece to be subjected to heat treatment, and includes a tray for supporting the workpiece (the same applies hereinafter).
The object to be treated is carried from outside the heat treatment space into the heat treatment space, and then supported by the support member provided in the heat treatment space. Then, the timing of the support is adjusted. That is, the time is adjusted by the temperature detection device based on the temperature of the object to be processed conveyed into the heat treatment device.
By controlling in this manner, the object to be processed conveyed into the heat treatment apparatus can be heated in the heat treatment space and then supported by the support. Thus, the temperature difference between the support member and the object to be processed is not high when the object to be processed is supported by the support member, and thermal shock is not generated on the object to be processed.
When the temperature detected by the temperature detection device is higher than the damage temperature, the conveying device supports the object to be processed conveyed into the heat treatment device by the conveying device on the support. The damage temperature is a temperature at which the object to be treated is cracked or broken by thermal shock, that is, a temperature at which the object to be treated is damaged by thermal shock generated by a temperature difference between the object to be treated and the support when the object to be treated is supported by the support.
The temperature detection device detects the temperature of the object to be processed without contacting the object to be processed. A radiation thermometer is generally used as such a temperature detection device.
According to the present invention, when the object to be processed is conveyed into the heat treatment furnace and supported by the support member, the object to be processed is supported after reaching a certain high temperature, and therefore, the object to be processed can be prevented from being damaged by thermal shock.
Drawings
Fig. 1 (a) and 1 (B) are side views showing the schematic configuration of a heat treatment apparatus according to an embodiment of the present invention.
Fig. 2 is a plan view of the tip end portion (first end portion) of the transport rod.
Fig. 3a is a side view, fig. 3B is a plan view of the distal end (first end) of the transport rod, fig. 3C is an end view, and fig. 3D is an external perspective view.
Fig. 4 is a view showing a positional relationship between the object to be processed and the support in the z direction of the heat treatment space.
Fig. 5 (a) and 5 (B) are views showing the behavior of the transport rod and the support.
Fig. 6 is a view showing an opening formed in the front wall of the transport chamber and the transport rod.
Fig. 7 (a) and 7 (B) are views showing an example of the configuration of the switching device.
Fig. 8 (a), 8 (B), 8 (C), 8 (D), and 8 (E) are views showing steps from the outside of the heat treatment apparatus to the time of heat treatment.
Fig. 9 (a), 9 (B), 9 (C), and 9 (D) are views showing steps from after the heat treatment of the object to be treated to the time when the object to be treated is taken out of the heat treatment apparatus.
Fig. 10 is a flowchart showing the overall operation.
Fig. 11 (a) and 11 (B) are diagrams conceptually showing another example of the support.
Fig. 12 is a partial plan view of a configuration of a derivative example of the transport rod.
Fig. 13 is a diagram showing a configuration of a derivative example of rotating the transport rod.
Fig. 14 is a view showing a partial configuration of another derivative example of rotating the transport rod.
Description of the reference numerals:
10: a heat treatment device; 20: a heat treatment furnace; 21: a front wall; 30: a delivery chamber; 31: a front wall; 32: a heat insulating wall; 39: a throwing port; 41. 42: a conveying rod; 50: a conveying device; 51: a rod holding member; 60: a switching device; 63: a bonding plate; 200: a heat treatment space; 201: an opening; 230-233: a support member; 240: a heat source; 300: a conveying space; 301: an opening; 302: an opening; 411: the side surface of the conveying rod 41; 412. 422: a support member; 421: the side surface of the conveying rod 42; 423: the outer peripheral end of the support 422; 601: a shaft member; 602: an actuator; 611: a rotating shaft; 612: a sliding plate; 613: a groove of the sliding plate 612; 614: a pin; 621: a rotating shaft; 622: a sliding plate; 623: a groove of the slide plate 622; 624: a pin; 4111: a first end of the transport rod 41; 4112: a second end portion of the conveying rod 41; 4211: a first end of the transport rod 42; 4212: a second end portion of the conveying rod 42; and WK: an object to be treated.
Detailed Description
A heat treatment apparatus according to an embodiment of the present invention will be described with reference to the drawings. Fig. 1 (a) and 1 (B) are schematic structural side views of a heat treatment apparatus according to an embodiment of the present invention. In fig. 1 (a) and 1 (B), cross-sectional views of the conveyance chamber and the heat treatment furnace are shown. Fig. 1 (a) shows a case where the object to be treated is located in the conveyance chamber, and fig. 1 (B) shows a case where the object to be treated is located in the heat treatment furnace. Fig. 2 is a plan view of the tip end portion (first end portion) of the transport rod. Fig. 3a is a side view, fig. 3B is a plan view of the distal end portion (first end portion) of the transport rod, fig. 3C is an end view, and fig. 3D is an external perspective view. Fig. 4 is a view showing a positional relationship between the object to be processed and the support in the z direction of the heat treatment space.
Hereinafter, the height direction is referred to as the z direction, the moving direction of the transport lever is referred to as the x direction, and the direction orthogonal to the x direction is referred to as the y direction.
(Overall Structure of Heat treatment apparatus 10)
As shown in fig. 1 (a), 1 (B), and 2, the heat treatment apparatus 10 includes a heat treatment furnace 20, a conveyance chamber 30, a conveyance rod 41, a conveyance rod 42, a conveyance device 50, and a switching device 60.
The heat treatment furnace 20 and the transfer chamber 30 are arranged in one direction (x direction in fig. 1a and 1B). The heat treatment furnace 20 is connected to the transfer chamber 30.
The heat treatment furnace 20 has a heat treatment space (inner space) 200 for performing a heat treatment on the object to be treated. The heat treatment furnace 20 is constituted by a room in which the atmosphere of the heat treatment space 200 is maintained. A gas introduction unit (not shown) is provided in the wall structure above the heat treatment furnace 20, and a predetermined atmosphere gas (heat treatment gas) is introduced into the heat treatment space 200 from the gas introduction unit.
In the heat treatment space 200, support members 230 to 233 for supporting the object WK to be treated and a heat source 240 are arranged. The supporting members 230 to 233 are made of ceramic having a rod shape as a whole and a thin tip, and are held in the heat treatment space 200 by a holding member not shown so as to extend in the z direction. As shown in FIG. 4, the 4 supporting members 230 to 233 are arranged in two rows in the x direction and in two rows in the y direction. The front end positions of the supporting members 230 to 233 are located at positions higher than the upper ends of the conveying rods 41 and 42.
The heat source 240 is disposed at a position close to the upper wall and a position close to the lower wall of the heat treatment space 200. However, the heat source 240 is not limited to this, and may be disposed on the side of the heat treatment space 200. The heat source 240 may be any heat source capable of uniformly heating the object to be treated WK supported by the support members 230 to 233.
An opening 201 is formed in one side wall (front wall 21) of the walls constituting the heat treatment furnace 20. An opening 201 extends through the front wall 21. The heat treatment space 200 of the heat treatment furnace 20 is connected to the conveyance space (inner space) 300 of the conveyance chamber 30 through the opening 201.
A hole is formed in the center of the other wall (upper wall) constituting the heat treatment furnace 20. The heat source 240 provided in a position close to the other wall (upper wall) is also provided with another hole in a position corresponding to the hole. A radiation thermometer 250 as a temperature detection device is disposed in these two holes via a window portion. As will be described later, the radiation thermometer 250 detects the temperature of the object WK to be processed conveyed into the heat treatment furnace. The window portion may be formed of a window glass that does not absorb the wavelength (several μ to 10 μ or less) of the radiation emitted from the radiation thermometer 250.
The transfer chamber 30 has a transfer space 300. An opening 301 and an opening 302 are formed in one side wall (front wall 31) of the walls constituting the conveyance chamber 30 (see fig. 5). Openings 301, 302 extend through the front wall 31. The transport rod 41 and the transport rod 42 can move forward and backward by using these openings 301 and 302.
The transport chamber 30 is provided with an insulating wall 32. The heat insulating wall 32 is disposed near the end of the transfer chamber 30 on the heat treatment furnace 20 side. The heat insulating wall 32 is movable, and can switch between the connection and disconnection between the space on the side connected to the opening 201 and the space on the side connected to the opening 301 in the conveyance space 300.
The conveyance rod 41 and the conveyance rod 42 are rod-shaped (in the present application, cylindrical) extending in one direction. The material of the conveyance rod 41 and the conveyance rod 42 is stainless steel (SUS) which is hard to corrode.
The extending direction of the conveying rods 41 and 42 is parallel to the arrangement direction of the heat treatment furnace 20 and the conveying chamber 30. The transport rod 41 and the transport rod 42 are disposed in parallel with a predetermined distance therebetween. The arrangement direction of the transport rods 41 and 42 is a direction perpendicular to the x-direction and the z-direction (y-direction in fig. 1A and 1B). The distance Ws (see fig. 2) between the transport rod 41 and the transport rod 42 is larger than the dimension of the support members 230 to 233 in the y direction in consideration of the lengths of the support member 412 and the support member 422, which will be described later.
The transport rod 41 and the transport rod 42 are inserted through a second opening formed in the front wall 31 of the transport chamber 30. The first end 4111 in the extending direction of the conveyance lever 41 and the first end 4211 (see fig. 2) in the extending direction of the conveyance lever 42 are disposed inside the conveyance chamber 30, and the second end 4112 in the extending direction of the conveyance lever 41 and the second end 4212 (see fig. 6) in the extending direction of the conveyance lever 42 are disposed outside the conveyance chamber 30.
As described later, the transport lever 41 and the transport lever 42 rotate by 45 degrees, respectively. The state of the stick is referred to as "stick state a" when the rotation angle is 0 degrees, and the state of the stick is referred to as "stick state B" when the rotation angle is 45 degrees. As will be described later in detail, the transport rod 41 and the transport rod 42 repeat the following steps.
A conveying rod 41 and a conveying rod 42,
in the transport chamber 30, the object WK is received from above in a rod state B (step 1). Setting the object WK to be processed.
(step 2) moves forward in the rod state B and moves the first end portions 4111 and 4211 into the heat treatment furnace 20.
(step 3) when the temperature of the object WK rises to a predetermined temperature, the rod state A is set. Whether or not the temperature has risen to the prescribed temperature is determined by the output of the radiation thermometer 250. At this time, the object WK is placed on and supported by 4 supporting members 230 to 233. Heat-treating the object WK.
(step 4) moves backward in the rod state a, and moves the first end portions 4111, 4211 into the conveyance chamber 30.
When the heat treatment of the object WK is completed, the first end portions 4111 and 4211 are moved into the heat treatment furnace 20 in the rod state a (step 5).
The rod state B is set (step 6). At this time, the object WK is received and supported by the supporting members 230 to 233.
(step 7) moves backward in the rod state B, and moves the first end portions 4111, 4211 into the conveyance chamber 30.
(step 8) the object WK is taken out in the rod state B.
The first end 4111 of the transport lever 41 in the extending direction in the x direction and the first end 4211 of the transport lever 42 in the extending direction are located at the same position, and the second end 4112 of the transport lever 41 in the extending direction and the second end 4212 of the transport lever 42 in the extending direction are located at the same position.
The transfer device 50 is disposed on the side opposite to the side connected to the heat treatment furnace 20 with reference to the transfer chamber 30. That is, the transfer device 50 is disposed outside the transfer chamber 30 and the heat treatment furnace 20. The transport device 50 is connected to the transport rod 41 and the transport rod 42 via a rod holding member 51. The conveyance lever 41 and the conveyance lever 42 are held by the lever holding member 51 in a state (lever state a and lever state B) in which they can rotate in the direction along the respective side surfaces.
The conveyor 50 moves in the x direction in the front-rear direction. By the movement of the transport device 50, the transport rod 41 and the transport rod 42 also move in the x direction in the front-rear direction. Thus, as shown in fig. 1A, when the transport device 50 is located at the first end of the movement range, a portion of the first end 4111 of the transport lever 41 and a portion of the first end 4211 of the transport lever 42 are disposed in the transport space 300 of the transport chamber 30. On the other hand, as shown in fig. 1B, when the transport device 50 is located at the second end of the movement range, a portion of the first end 4211 of the transport rod 42 and a portion of the first end 4211 of the transport rod 42 are disposed in the heat treatment space 200 of the heat treatment furnace 20.
The conveyor 50 is disposed outside and apart from the heat treatment furnace 20. Therefore, the conveying device 50 does not require a heat dissipation measure. The transport device 50 can be constructed of inexpensive, popular products.
As described above, in the heat treatment apparatus 10, the object WK placed on the first end 4111 of the conveyance lever 41 and the first end 4211 of the conveyance lever 42 is carried into the heat treatment furnace 20 through the opening 201 in the conveyance chamber 30 (fig. 1a → fig. 1B). The temperature of the object WK to be processed carried into the heat treatment furnace 20 is low, but when the temperature in the heat treatment furnace 20 rises to a predetermined temperature, the object is in a rod state B → a rod state A, and is supported by the supports 230 to 233. At this time, since the temperature of the object WK is sufficiently heated, thermal shock is not generated to the object WK when the object WK is supported by the supporting members 230 to 233.
The thermal shock to the object WK depends on the thermal shock temperature characteristics of the material of the object WK. The thermal shock temperature characteristic is a temperature characteristic that withstands a sharp temperature change. For example, alumina in ceramics has a thermal shock temperature of about 200 ℃.
Therefore, the temperature difference between the processed object WK and the supporting members 230-233 is controlled to be within the thermal shock temperature when the processed object WK is supported by the supporting members 230-233. For example, when the vicinity of the supported point of the object WK is alumina, the object WK is heated until the temperature difference is within 200 ℃. Specific examples of thermal control are described below.
The temperature in the heat-treating furnace 20 is maintained at 1300 ℃. Immediately before the object WK is carried into the heat treatment furnace 20, the temperature of the object WK is normal temperature. When the object WK is carried into the heat treatment furnace 20, the object WK is heated. At this time, since the object WK is supported by the conveyance rods 41 and 42 in the rod state B, there is no thermal shock to the object WK. When the temperature of the object WK rises to 1100 deg.C or higher, the conveying rods 41 and 42 are set to the rod state A. At this time, the temperature difference between the object WK and the support members 230 to 233 is 200 ℃ or less. Therefore, no thermal shock is generated to the object WK. In the present example, the damage temperature of the present invention is 1100 ℃ or lower, in which the temperature difference between the both is 200 ℃ or higher.
The supporting members 230 to 233 may be formed by only the tip end portion thereof with another member. Thus, the tip portion can be easily replaced even if it is broken. Further, the tip portion may be replaced according to the characteristics of the object WK. The distal end portion may be attached to the main body portion by, for example, a screw structure.
Next, the switching device 60 and the transport rods 41 and 42 will be described.
The switching device 60 is connected to the second end 4112 of the conveyance lever 41 and the second end 4212 of the conveyance lever 42. The switching device 60 includes a rotation assisting mechanism that rotates the transport lever 41 and the transport lever 42 in directions along the respective side surfaces and maintains the state in either the lever state a or the lever state B.
A support 412 for supporting the object WK is disposed on the transport rod 41, and a support 422 is disposed on the transport rod 42.
As shown in fig. 2, the number of the supports 412 is 2, and 2 supports 412 are connected to the vicinity of the first end 4111 of the transport rod 41 (the portion of the first end 4111 of the transport rod 41). The 2 supports 412 are disposed at intervals LS412 in the extending direction of the transport rod 41. The interval LS412 is determined by the size of the object WK to be processed supported during conveyance in the x direction or the size of the object WK, and 2 supports 412 are determined to be in contact with the back surface of the object WK.
The 2 support members 412 are connected to the side surface 411 of the transport rod 41. The 2 support members 412 protrude from the side surface 411 toward the conveying rod 42. The projecting amount L412 of the 2 supports 412 is determined by the displacement amount in the height direction of the object WK to be processed.
As shown in fig. 3A to 3D, the 2 supports 412 are round rods and have outer peripheral ends 413 at the front ends. Thus, when the object WK is supported, the outer peripheral end 413 abuts against the rear surface of the object WK. That is, the support 412 can support the object WK in a point manner. Therefore, the contact of the support 412 with the object WK can be suppressed to the minimum. This can suppress occurrence of a local temperature difference in the object WK due to heat dissipation via the support 412 in contact with the object WK, for example, and occurrence of thermal influence such as deformation of the object WK. Further, by arranging 2 supports 412 in the x direction, the object WK can be stably supported.
As shown in fig. 2, the number of the support members 422 is 2, and 2 support members 422 are connected to the vicinity of the first end portion 4211 of the transport lever 42 (the portion of the first end portion 4211 of the transport lever 42). The 2 supports 422 are arranged at intervals LS422 in the extending direction of the transport rod 42. The interval LS422 is determined by the size of the object WK to be processed supported during conveyance in the x direction, and 2 supports 422 are determined to be in contact with the back surface of the object WK.
The 2 support members 422 are connected to the side 421 of the transport rod 42. The 2 support members 422 project from the side surface 421 toward the conveying rod 41. The projecting amount L422 of the 2 supports 422 is determined by the displacement amount in the height direction of the object WK to be processed.
Fig. 5 (a) and 5 (B) are schematic diagrams showing the operation of the transport rod and the support. Fig. 5 (a) shows a lever state B, and fig. 5 (B) shows a lever state a.
The 2 bearings 422 are round rods, like the 2 bearings 412, and have outer peripheral ends 423 at the front ends (see fig. 5). Thus, in the rod state B, when the object WK is supported, the outer peripheral end 423 abuts against the rear surface of the object WK. That is, the support 422 can support the object WK in a point manner. Therefore, the contact of the support 422 with the object WK to be processed can be suppressed to the minimum. This can suppress occurrence of a local temperature difference in the object WK due to heat dissipation via the support 422 in contact with the object WK, for example, and occurrence of thermal influence such as deformation of the object WK.
Further, by further arranging 2 support pieces 422 along the x direction, the object WK to be processed can be stably supported. Here, the support members 412 and 422 are examples of round rods, but the present invention is not limited to this, and any member may be used as long as it can support the object to be processed in a point contact manner, such as a triangular prism or polygonal prism rod or a rod having a hemispherical tip.
(behavior of the carrying rods 41 and 42 and the supporting members 412 and 422)
As described above, the transfer lever 41 and the transfer lever 42 are rotated by the switching device 60. Thereby, the support 412 and the support 422 can be brought into the posture in the lever state B (45-degree rotation) shown in fig. 5 (a) and the posture in the lever state a shown in fig. 5 (B).
In the rod state B, the tip of the support 412 is positioned above the upper end of the transport rod 41, and the tip of the support 422 is positioned above the upper end of the transport rod 42. Further, as shown in fig. 5 (a), in the rod state B, the object WK to be treated supported by the tips of the supports 412 and 422 is disposed above the upper ends of the supports 230 to 233.
The rod state a (0 degree rotation) is a state in which the tip of the support 412 is below the upper end of the transport rod 41 and the tip of the support 422 is below the upper end of the transport rod 42.
Therefore, by using this switching, the object WK to be processed is placed on the supports 412 and the supports 422 in the rod state B in the transfer chamber 30, and is directly transferred into the heat treatment furnace 20, whereby the object WK to be processed is conveyed to above the supports 230 to 233.
When the object WK is heated to a predetermined temperature, the rod state A is switched, and the object WK is released from the support by the support 412 and the support 422 and placed on the supports 230 to 233.
After the object WK is heat-treated in the heat treatment space 200, when the conveying rods 41 and 42 are inserted into the heat treatment furnace 20 in the rod state a, the conveying rods 41 and 42 are disposed below the object WK. That is, the conveying rods 41 and 42 are disposed in the heat treatment furnace 20 without interfering with the object WK.
In this state, the transport levers 41 and 42 are rotated 45 degrees to switch to the lever state B. Then, the object WK to be treated is switched from being supported by the supporting members 230 to 233 to being supported by the supporting members 412 and 422. Thus, the object WK to be treated is separated from the supporting members 230 to 233. Then, the object WK is conveyed while maintaining this state, and the object WK is carried out from the heat treatment furnace 20 to the conveyance chamber 30.
Thus, by using the structure of the present embodiment, the object WK to be processed can be conveyed from the conveying chamber 30 into the heat treatment furnace 20 without changing the position of the conveying rods 41 and 42 in the height direction, and can be supported by the supports 230 to 233 after being heated to a predetermined temperature. Then, the object WK is heat-treated, lifted from the support members 230 to 233, and conveyed from the heat treatment furnace 20 into the conveyance chamber 30.
Thus, the height of the opening 201 can be set to a level from the lower ends of the conveyance rods 41 and 42 to the upper surface of the object WK. Therefore, the opening area of the opening 201 can be reduced, and the heat of the heat treatment furnace 20 and the filled gas can be suppressed from leaking into the transfer chamber 30 through the opening 201. That is, the temperature and atmosphere of the heat treatment furnace 20 can be prevented from changing due to the presence of the opening 201. However, in a preferred embodiment, the cooling gas P is set to be the same as the gas inside the heat treatment space 200 so that the heat treatment space 200 and the transfer space 300 have the same atmosphere. Alternatively, the main components of both are the same. Thus, even if the opening 201 is repeatedly opened and closed by the heat insulating wall 32, the atmospheres in the heat treatment space 200 and the transport space 300 can be kept the same.
Further, a driving device including the switching device 60 and the conveying device 50 is provided at a position outside and apart from the heat treatment furnace 20 and the conveying chamber 30. Therefore, the switching device 60 and the conveying device 50 may be configured by using inexpensive general-purpose components, instead of components that cope with high heat.
In addition, by using the structure of the present embodiment, the height of the conveyance chamber 30 can be reduced. This can reduce the volume of the transfer chamber 30, reduce the amount of gas used for the transfer chamber 30, and reduce the replacement time of the atmosphere in the transfer chamber 30.
Further, by using the structure of the present embodiment, the opening areas of the openings 301 and 302 can be reduced. Fig. 6 is a view showing an opening formed in the front wall of the transport chamber and the transport rod.
As described above, in the heat treatment apparatus 10, the transport rods 41 and 42 move only in the x direction and do not move in the z direction. Therefore, the openings 301 and 302 may have any size as long as the transport rods 41 and 42 are inserted therethrough, and may have a shape along the outer shape (circumferential surface) of the transport rods 41 and 42, for example, a shape slightly larger than the outer shape of the transport rods 41 and 42. For example, the openings 301 and 302 may be circular openings having the same shape and the substantially same size as the cross-sectional shape of the transport rods 41 and 42.
More specifically, the diameter of the opening 301
Figure BDA0003248032250000121
As long as the diameter of the rod 41 for conveyance
Figure BDA0003248032250000122
Approximately the same degree and larger. At this time, the opening 301 is straightDiameter of pipe
Figure BDA0003248032250000123
The closer to the diameter of the conveying rod 41
Figure BDA0003248032250000125
The better. Further, the diameter of the opening 301
Figure BDA0003248032250000124
It is only necessary to be shorter than the distance H41 between the lower end of the transport rod 41 and the upper end of the support 412 in the first posture of the support 412.
Likewise, the diameter of the opening 302
Figure BDA0003248032250000126
As long as the diameter of the rod 42 for conveying
Figure BDA0003248032250000127
Approximately the same degree and larger. At this time, the diameter of the opening 302
Figure BDA0003248032250000128
The closer to the diameter of the conveying rod 42
Figure BDA00032480322500001210
The better. Further, the diameter of the opening 302
Figure BDA0003248032250000129
It is only necessary to be shorter than the distance H42 between the lower end of the transport rod 42 and the upper end of the support 422 in the first posture of the support 422.
With this configuration, the opening areas of the openings 301 and 302 can be reduced. This can reduce the area of the communication between the transfer chamber 30 and the outside via the openings 301 and 302. Therefore, the influence of the external temperature and the atmosphere on the internal temperature and the atmosphere of the transfer chamber 30 can be reduced. Further, the influence of the internal temperature and atmosphere of the heat treatment furnace 20 via the transfer chamber 30 can be reduced.
The switching device 60 for rotating the transport levers 41 and 42 is realized by, for example, the configuration shown in fig. 7 (a) and 7 (B). Fig. 7 (a) and 7 (B) are views showing an example of the configuration of the switching device, in which fig. 7 (a) corresponds to the lever state B of fig. 5 (a), and fig. 7 (B) corresponds to the lever state a of fig. 5 (B).
As shown in fig. 7 (a) and 7 (B), the switching device 60 includes a rotation shaft 611, a rotation shaft 621, a sliding plate 612, a sliding plate 622, a coupling plate 63, a shaft member 601, and an actuator 602.
The rotation shaft 611 has a shape extending from the transport rod 41 toward the transport rod 42. A first end of the rotating shaft 611 is fixed to a second end 4112 of the conveying lever 41. The second end of the rotating shaft 611 is connected with the sliding plate 612. At this time, a groove 613 extending in the y direction is formed in the sliding plate 612, and the second end of the rotating shaft 611 is slidably connected to the sliding plate 612 by fitting a pin 614 disposed at the second end into the groove 613.
The rotation shaft 621 is shaped to extend from the transport lever 42 toward the transport lever 41. The first end of the rotating shaft 621 is fixed to the second end 4212 of the transport lever 42. The second end of the rotation shaft 621 is connected to the sliding plate 622. At this time, a groove 623 extending in the y direction is formed in the sliding plate 622, and the second end of the rotating shaft 621 is slidably connected to the sliding plate 622 by fitting a pin 624 disposed at the second end into the groove 623.
The sliding plate 612 and the sliding plate 622 are fixed to the coupling plate 63. More specifically, the sliding plate 612 is fixed to a first end portion in the y direction in the coupling plate 63, and the sliding plate 622 is fixed to a second end portion in the y direction in the coupling plate 63.
A first end of a shaft member 601 extending in the z direction is connected to the center of the coupling plate 63 in the y direction. The second end of the shaft member 601 is connected to the actuator 602.
In such a configuration, the actuator 602 changes the length of the shaft member 601, thereby changing the positions of the coupling plate 63, the slide plate 612, and the slide plate 622 in the z direction. Along with this change, the pin 614 moves (slides) in the groove 613, and the pin 624 moves (slides) in the groove 623. Then, the rotation shaft 611 rotates with the movement of the pin 614, and the rotation shaft 621 rotates with the movement of the pin 624. The rotation of the rotation shafts 611 and 621 causes the transportation levers 41 and 42 to rotate.
By using such a configuration for the switching device 60, the rotation of the transport lever 41 and the rotation of the transport lever 42 can be synchronized. Therefore, the object WK can be stably lifted.
The heat treatment apparatus 10 having the above-described configuration performs the heat treatment of the object WK by performing the treatment shown in fig. 8 and 9, for example.
Fig. 8 (a), 8 (B), 8 (C), 8 (D), and 8 (E) are views showing steps from the outside of the heat treatment apparatus to the time when the object WK is fed to the heat treatment apparatus and the heat treatment is performed. Fig. 9 (a), 9 (B), 9 (C), and 9 (D) are views showing steps from after the heat treatment of the object WK to the time when the object WK is taken out of the heat treatment apparatus. Fig. 10 shows the steps shown in fig. 8 and 9 in a flowchart.
First, as shown in fig. 8 a, the object WK to be processed is input from the input port 39 in a state where the first end portions 4111, 4211 of the conveyance rods 41, 42 are positioned in the conveyance chamber 30 (ST 1). At this time, the supports 412 and 422 are in the rod state B, and the object WK is placed on the supports 412 and 422. In this state, the heat insulating wall 32 is provided so as to separate the conveyance space 300 of the conveyance chamber 30 into a side where the conveyance rods 41 and 42 are present and a side connected to the opening 201. This can prevent the inlet 39 from directly connecting to the opening 201. As described above, after the object WK is input, the input port 39 is closed. Then, when the object WK to be processed is introduced into the conveyance chamber 30, the conveyance chamber 30 is replaced to remove the outside air mixed from the introduction port 39. The replacement process is performed by supplying a purge gas such as nitrogen gas into the transfer chamber 30, and the air in the transfer chamber 30 is purged by the purge gas. Thereby, the atmosphere in the transfer chamber 30 is replaced with an inert gas atmosphere such as nitrogen gas.
Next, as shown in fig. 8 (B), the heat insulating wall 32 is moved upward with the inlet 39 closed. This allows the conveyance rods 41 and 42 and the object WK to be carried into the heat treatment furnace 20 through the opening 201.
Next, as shown in fig. 8C, the transport device 50 moves the transport rods 41 and 42 (ST2), and the first end portions 4111 and 4211 of the transport rods 41 and 42 are inserted into the heat treatment furnace 20. Thus, the object WK to be processed is conveyed to the upper part of the supporting members 230-233.
In this state, the object WK is heated. The temperature of the object WK is measured by the radiation thermometer 250, and the temperature is waited for until the temperature reaches a predetermined temperature (ST3, ST 4).
Next, when the temperature of the object WK reaches the predetermined temperature, it is determined that the object WK is supported by the supports 230 to 233, and as shown in fig. 8 (D), the supports 412 and 422 are switched from the bar state B to the bar state a, and the object WK is supported by the supports 230 to 233 (ST 5).
Next, as shown in fig. 8 (E), the transport device 50 moves the transport levers 41 and 42, and retracts the first end portions 4111 and 4211 of the transport levers 41 and 42 into the transport chamber 30 (ST 6). In this state, the heat insulating wall 32 moves downward, and separates the conveyance space 300 of the conveyance chamber 30 into a side where the conveyance rods 41 and 42 are present and a side connected to the opening 201. In other words, the heat insulating wall 32 is configured to close the opening 201, and forms a closed space.
Then, in this state, the heat treatment furnace 20 is controlled to a predetermined temperature and atmosphere, and the object WK is heat-treated for a predetermined time (ST 7).
After the object WK is heat-treated, the heat insulating wall 32 moves upward as shown in fig. 9 (a). Then, the conveyance rods 41 and 42 are moved, and the first end portions 4111 and 4211 of the conveyance rods 41 and 42 reach below the object WK to be processed in the heat treatment furnace 20 (ST 8). At this time, since the supports 412 and 422 are in the lever state a, even if the first end portions 4111 and 4211 of the conveyance levers 41 and 42 approach the object WK, the first end portions do not collide with the object WK.
Subsequently, as shown in fig. 9 (B), the supports 412 and 422 are switched from the rod state a to the rod state B, and the object WK to be processed is lifted from the supports 230 to 233. Then, the object WK is supported by the supports 412 and 422 (ST 9).
Next, as shown in fig. 9C, the transport device 50 moves the transport rods 41 and 42 to move the first end portions 4111 and 4211 of the transport rods 41 and 42 into the transport chamber 30 (ST 10). Thereby, the object WK to be processed is carried out from the heat treatment furnace 20 to the conveyance chamber 30.
Next, as shown in fig. 9 (D), the heat insulating wall 32 moves downward, and the conveyance space 300 of the conveyance chamber 30 is separated into a side where the conveyance rods 41 and 42 are present and a side connected to the opening 201. In this state, the object WK to be treated is taken out of the heat treatment apparatus 10 by opening the inlet 39 (ST 11).
In such a heat treatment process, the opening 201 between the heat treatment furnace 20 and the transfer chamber 30 and the opening 301 between the transfer chamber 30 and the outside affect the maintenance of the atmosphere in the heat treatment furnace 20 and the transfer chamber 30. However, by providing the structure of the present embodiment, the opening areas of the openings 201 and 301 can be reduced, and the influence on the maintenance of the atmosphere in the heat treatment furnace 20 and the transfer chamber 30 can be suppressed. That is, loss of the openings 201 and 301 to the maintenance of the atmospheres in the heat treatment furnace 20 and the transfer chamber 30 can be suppressed, and the atmospheres in the heat treatment furnace 20 and the transfer chamber 30 can be effectively maintained.
Further, since the object WK is heated to a predetermined temperature in ST4 and then supported by the supporting members 230 to 233, thermal shock does not occur when the object WK is supported by the supporting members 230 to 233.
(other examples of the manner of switching the supporting member)
In the above description, the embodiment in which the positions of the tips of the supports 412 and 422 in the height direction (z direction) are changed by rotating the transport levers 41 and 42 is shown. However, the positions of the tips of the supports 412 and 422 in the height direction can be changed by other configurations. Fig. 11 (a) and 11 (B) are diagrams conceptually showing another example of the support. Fig. 11 (a) and 11 (B) are views seen from the first end side of the support.
The supports 412 and 422 have a rod state B shown in fig. 11 (a) protruding from the upper ends of the transport rods 41 and 42 and a rod state a shown in fig. 11 (B) housed in the transport rods 41 and 42. The mechanism for projecting the support members 412 and 422 from the upper ends of the transport rods 41 and 42 or housing the support members 41 and 42 in the transport rods 41 and 42 may be a mechanism for physically pushing out or pulling in the support members 412 and 422, or a mechanism for pushing out or pulling in the support members 412 and 422 using compressed air or the like. Other mechanisms are also possible. Even with such a configuration, the same operational effects as those of the configuration using the mechanism for rotating the transport levers 41 and 42 described above can be obtained.
Further, in the above description, the example in which the pair of conveyance levers 41 and 42 are used as the conveyance levers has been described, but the above configuration is not limited thereto, and one conveyance lever may be used. At this time, one transport rod 41 can be moved to carry the object WK into the heat treatment furnace 20.
Fig. 12 is a partial plan view showing a configuration of a derivative example of the transport rod. For example, as shown in fig. 12, one transport rod 41 may be branched into two branches at its distal end, and the supports 412 and 422 may be disposed at one end and the other end of the two branches, respectively. In this case, for example, as in the case of the example shown in fig. 11 (a) and 11 (B), the switching between the lever state B and the lever state a of the supports 412 and 422 can be switched between the lever state B protruding from one end and the other end of the bifurcated portion and the lever state a accommodated in the one end and the other end of the bifurcated portion.
In the above description, the atmosphere furnace is used as the heat treatment furnace 20, but the above configuration is not limited to the atmosphere furnace, and can be applied to heat treatment furnaces of other specifications.
(other example of rotating the transport rods 41 and 42)
In the above description, the transport levers 41 and 42 are rotated by the switching device 60 including the actuator 602, but the transport levers 41 and 42 may be rotated by the motor 650.
Fig. 13 shows an embodiment in which the motor 650 is provided at the second end 4112 of the transport lever 41, and the motor 651 is provided at the second end 4212 (see fig. 7) of the transport lever 42. The stators of the motors 650 and 651 are fixed to the conveying device 50, and the rotating portions of the rotors of the motors are coupled to the second end 4112 and the second end 4212, respectively. Preferably, the motors 650 and 651 are each constituted by a stepping motor that rotates by a predetermined angle. Further, the motor 650 and the motor 651 are synchronized by a control circuit outside the figure, and their rotation angles are controlled to be the same. In this way, the motors 650 and 651 are provided at the second end 4112 and the second end 4212, thereby simplifying the structure.
(other example of rotating the transport rods 41 and 42)
Fig. 14 shows another example of rotating the transport levers 41 and 42.
In this embodiment, the switching device 60 is provided as a structure including a rack and pinion mechanism. The switching device 60 includes a rack and pinion mechanism 700 provided on the second end 4112 side of the conveyance lever 41 and a rack and pinion mechanism 800 provided on the second end 4212 side of the conveyance lever 42.
The rack and pinion mechanism 700 includes: a pinion 702 coupled to the second end 4112 of the conveyance lever 41; a bar-shaped rack 703 meshed with the pinion 702; and a cylinder 701 that moves the rack 703 up and down. Likewise, the rack and pinion mechanism 800 includes: a pinion 802 coupled to the second end 4212 of the transport rod 42; a bar-shaped rack 803 that meshes with the pinion 802; and a cylinder 801 for moving the rack 803 up and down. Further, a control unit (not shown) for controlling the cylinders 701 and 801 is provided. The control unit synchronously controls the cylinders 701 and 801 to move the rack 703 and the rack 803 up and down by the same amount. Fig. 14 (a) shows that the rack 703 and the rack 803 are moved upward to reach the lever state B, and fig. 14 (B) shows that the rack 703 and the rack 803 are moved downward from the lever state B to reach the lever state a.
In this way, even if the switching device 60 is provided with the rack and pinion mechanism, the transport levers 41 and 42 can be rotated by the same predetermined angle.
The foregoing description of the embodiments is illustrative in all respects and should not be taken as limiting. The scope of the present invention is indicated not by the description of the above embodiments but by the claims. Further, the present invention includes meanings equivalent to the claims and all modifications within the scope of the claims.

Claims (3)

1. A heat treatment apparatus is characterized by comprising:
a heat treatment furnace that forms a heat treatment space and performs heat treatment on an object to be treated in the heat treatment space;
a support disposed within the heat treatment space;
a conveying device for supporting the object to be processed on the support after conveying the object to be processed from outside the heat treatment space into the heat treatment space; and
a temperature detection device for detecting the temperature of the object to be processed conveyed into the heat treatment device by the conveying device,
the transport device determines a timing of supporting the object to be processed, which is transported into the heat treatment device by the transport device, on the support based on the temperature detected by the temperature detection device.
2. The thermal processing device of claim 1,
the damage temperature is a temperature of the object to be processed at which the object to be processed is damaged by thermal shock generated by a temperature difference between the object to be processed and the support when the object to be processed is supported by the support,
the conveying device supports the object to be processed conveyed into the heat treatment device by the conveying device on the support when the temperature detected by the temperature detecting device is higher than the damage temperature.
3. The heat treatment apparatus according to claim 1 or 2,
the temperature detection device detects the temperature of the object to be processed without contacting the object to be processed.
CN202111046701.5A 2021-03-02 2021-09-06 Heat treatment apparatus Pending CN114993040A (en)

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