CN114989906A - Preparation method of intelligent PCB (printed circuit board) cleaning agent - Google Patents
Preparation method of intelligent PCB (printed circuit board) cleaning agent Download PDFInfo
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- CN114989906A CN114989906A CN202110223452.6A CN202110223452A CN114989906A CN 114989906 A CN114989906 A CN 114989906A CN 202110223452 A CN202110223452 A CN 202110223452A CN 114989906 A CN114989906 A CN 114989906A
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- 239000012459 cleaning agent Substances 0.000 title claims abstract description 39
- 238000002360 preparation method Methods 0.000 title claims abstract description 35
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims abstract description 33
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims abstract description 32
- 238000004140 cleaning Methods 0.000 claims abstract description 21
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical class O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 19
- 239000011259 mixed solution Substances 0.000 claims abstract description 18
- -1 polydimethylsiloxane Polymers 0.000 claims abstract description 17
- 239000000243 solution Substances 0.000 claims abstract description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 15
- 239000008367 deionised water Substances 0.000 claims abstract description 14
- 229910021641 deionized water Inorganic materials 0.000 claims abstract description 14
- IEJIGPNLZYLLBP-UHFFFAOYSA-N dimethyl carbonate Chemical compound COC(=O)OC IEJIGPNLZYLLBP-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000004342 Benzoyl peroxide Substances 0.000 claims abstract description 11
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 claims abstract description 11
- 235000019400 benzoyl peroxide Nutrition 0.000 claims abstract description 11
- 239000004205 dimethyl polysiloxane Substances 0.000 claims abstract description 11
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims abstract description 11
- 238000000034 method Methods 0.000 claims abstract description 7
- 238000005303 weighing Methods 0.000 claims abstract description 7
- 238000006243 chemical reaction Methods 0.000 claims abstract description 4
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 claims description 27
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 15
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims description 10
- 239000002253 acid Substances 0.000 claims description 10
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 claims description 10
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 claims description 9
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 claims description 9
- 238000003756 stirring Methods 0.000 claims description 8
- 239000008096 xylene Substances 0.000 claims description 8
- COBPKKZHLDDMTB-UHFFFAOYSA-N 2-[2-(2-butoxyethoxy)ethoxy]ethanol Chemical compound CCCCOCCOCCOCCO COBPKKZHLDDMTB-UHFFFAOYSA-N 0.000 claims description 6
- 239000011521 glass Substances 0.000 claims description 6
- 239000002244 precipitate Substances 0.000 claims description 5
- 230000002378 acidificating effect Effects 0.000 claims description 4
- 238000001914 filtration Methods 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 4
- USFZMSVCRYTOJT-UHFFFAOYSA-N Ammonium acetate Chemical compound N.CC(O)=O USFZMSVCRYTOJT-UHFFFAOYSA-N 0.000 claims description 3
- 239000005695 Ammonium acetate Substances 0.000 claims description 3
- UOERMRVQROMDTA-UHFFFAOYSA-N C(C)O[SiH](OCC)OCC.CCC Chemical compound C(C)O[SiH](OCC)OCC.CCC UOERMRVQROMDTA-UHFFFAOYSA-N 0.000 claims description 3
- 229940043376 ammonium acetate Drugs 0.000 claims description 3
- 235000019257 ammonium acetate Nutrition 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 230000007935 neutral effect Effects 0.000 claims description 3
- 238000001556 precipitation Methods 0.000 claims description 3
- 230000001105 regulatory effect Effects 0.000 claims description 3
- 238000002791 soaking Methods 0.000 claims description 3
- 239000006228 supernatant Substances 0.000 claims description 3
- 238000012360 testing method Methods 0.000 claims description 3
- SBGFNHWKIOFPRM-UHFFFAOYSA-N 1-[2-(2-hydroxyethoxy)ethoxy]hexan-2-ol Chemical compound CCCCC(O)COCCOCCO SBGFNHWKIOFPRM-UHFFFAOYSA-N 0.000 claims description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 2
- 238000006386 neutralization reaction Methods 0.000 claims description 2
- 239000000741 silica gel Substances 0.000 claims 1
- 229910002027 silica gel Inorganic materials 0.000 claims 1
- 239000003344 environmental pollutant Substances 0.000 abstract description 10
- 231100000719 pollutant Toxicity 0.000 abstract description 10
- 230000008569 process Effects 0.000 abstract description 5
- 239000000843 powder Substances 0.000 abstract description 3
- 230000006378 damage Effects 0.000 abstract description 2
- 238000012423 maintenance Methods 0.000 abstract description 2
- 230000002035 prolonged effect Effects 0.000 abstract description 2
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 230000009471 action Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 239000002351 wastewater Substances 0.000 description 2
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- LTCGPBFXHHQAIG-UHFFFAOYSA-N C(C)O[SiH](OCC)OCC.OCCN(CCC)CCO Chemical compound C(C)O[SiH](OCC)OCC.OCCN(CCC)CCO LTCGPBFXHHQAIG-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005202 decontamination Methods 0.000 description 1
- 230000003588 decontaminative effect Effects 0.000 description 1
- 238000009791 electrochemical migration reaction Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 150000002632 lipids Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/261—Alcohols; Phenols
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/02—Inorganic compounds
- C11D7/20—Water-insoluble oxides
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/24—Hydrocarbons
- C11D7/245—Hydrocarbons cyclic
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/263—Ethers
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/265—Carboxylic acids or salts thereof
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/266—Esters or carbonates
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/28—Organic compounds containing halogen
- C11D7/30—Halogenated hydrocarbons
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
-
- C11D2111/22—
Abstract
The application relates to the technical field of circuit board cleaning agents, and discloses a preparation method of an intelligent PCB circuit board cleaning agent, which comprises the following steps: firstly, weighing the following components in parts by weight; secondly, selecting a preparation instrument; thirdly, dropwise adding a preparation solution into the reaction kettle; fourthly, adding the solution into the prepared mixed solution; fifthly, performing acid-base regulation on the prepared mixed solution; and sixthly, adding deionized water. This application is novel through increasing methyl alcohol, ethanol, benzoyl peroxide, modified silica gel, polydimethylsiloxane and dimethyl carbonate, has improved the cleaning capacity to the scaling powder residual to long service life, the consumed energy is low, and is dry fast, and preparation simple process, it is convenient to use, has avoided the remaining of the multiple ionic type of circuit board surface and non-ionic type pollutant, prevents to cause the low resistance route, thereby leads to electronic circuit board's electrical function to receive destruction, has prolonged the live time of circuit board, has reduced the maintenance cost.
Description
Technical Field
The application relates to the technical field of circuit board cleaning agents, in particular to a preparation method of an intelligent PCB circuit board cleaning agent.
Background
Electronic circuit boards are one of the important parts in the electronic industry, and the production process of the electronic circuit boards is subjected to a plurality of process stages, each of which is polluted to different degrees, so that various deposits or impurities remain on the surfaces of the electronic circuit boards, and the pollutants can reduce the performance of products and even cause the failure of the products.
The pollutants on the electronic circuit board are various and can be classified into two categories of ionic type and non-ionic type, the ionic type pollutants are contacted with moisture in the environment and are subjected to electrochemical migration after being electrified to form a dendritic structural body, so that a low-resistance path is formed, the electrical function of the electronic circuit board is damaged, the non-ionic type pollutants can penetrate through an insulating layer of the electronic circuit board, dendritic crystals grow below the surface layer, besides the ionic type pollutants and the non-ionic type pollutants, granular pollutants such as solder balls, floating points in solder grooves, dust and the like, the existing circuit board cleaning agent is poor in decontamination capability, various pollutant residues are easily caused, the cleaning capability of scaling powder residues is low, the existing cleaning agent is inconvenient to use, and multiple matched devices are provided, so that the preparation method of the intelligent PCB cleaning agent is provided.
Content of application
To prior art's not enough, this application provides a preparation method of intelligence PCB circuit board cleaner, has the advantage of the strong long service life of dirt-removing power, has solved the inconvenient big problem of consumed energy of current cleaner scaling powder residue clearance, has the advantage that uses convenient corollary equipment few, has solved the problem that the required equipment price of current cleaner is high needs clear up waste water.
In order to achieve the above purpose, the present application provides the following technical solutions: a preparation method of an intelligent PCB circuit board cleaning agent comprises the following operation steps;
firstly, weighing the following components in parts by weight of methanol, ethanol, alcohol, dichloromethane, 2-5 parts of butyl acetate, dimethyl carbonate, isopropyl acid, xylene, amine acetate, deionized water, a pH regulator, azobisisobutylamidine diacid hydrochloric acid, benzoyl peroxide, polydimethylsiloxane, modified silica gel and triethylene glycol monobutyl ether.
Secondly, selecting a preparation instrument: burette, reation kettle, weighing bottle, funnel, glass stick, acid-base test paper.
Thirdly, dropwise adding a preparation solution into the reaction kettle: modified silica gel, methanol, ethanol, alcohol, dichloromethane, isopropyl acid, xylene, azodiisobutylaminodiamidate hydrochloric acid, benzoyl peroxide, polydimethylsiloxane and triethylene glycol butyl ether are dripped into the mixture and are uniformly stirred by a glass rod for 5 to 15 minutes.
Fourthly, adding a solution into the prepared mixed solution: butyl acetate, dimethyl carbonate and ammonium acetate are added dropwise, and the prepared mixed solution is stirred for the second time, wherein the stirring time is 10-15 minutes.
Fifthly, acid-base adjustment is carried out on the prepared mixed solution: and (4) dropwise adding a pH regulator, and regulating the pH value of the prepared mixed solution to make the pH value of the mixed solution weak.
Sixthly, adding deionized water: adding deionized water into the stirred neutral mixed solution, oscillating for 20 minutes by ultrasonic waves, standing for precipitation, taking supernatant, and filtering the precipitate.
Preferably, the modified silica gel is prepared by modifying activated silica gel with propane triethoxysilane.
Preferably, the material share proportion is 10-15 parts of methanol, 15-18 parts of ethanol, 5-10 parts of alcohol, 1-3 parts of dichloromethane, 2-5 parts of butyl acetate, 2-4 parts of dimethyl carbonate, 5-8 parts of isopropyl acid, 1.2-1.6 parts of xylene, 1.2-4 parts of amine acetate, 50-60 parts of deionized water, 2-5 parts of azodiisobutylaminodiamidinate hydrochloride, 1-3 parts of benzoyl peroxide, 2-3 parts of polydimethylsiloxane, 5-10 parts of modified silica gel and 2-3 parts of butyl cellosolve.
Preferably, the PH regulator accounts for 0.1-0.5%.
Preferably, the cleaning agent is prepared under the condition of normal temperature to 60 ℃.
Preferably, the cleaning agent is used for cleaning the circuit board by a thermal soaking method or ultrasonic waves.
Preferably, the cleaning agent is colorless transparent liquid, the cleaning process of the cleaning agent is set to three-groove three-time cleaning or four-groove four-time cleaning, and the single cleaning time of each groove is three to five minutes.
Preferably, the interval time between the two times of stirring is less than ten minutes, large-area precipitates are prevented from being formed, the cleaning agent is weakly acidic through the two times of stirring and acid-base neutralization, and the acid-base value is 4-6.
The application has the following beneficial effects:
1. according to the preparation method of the intelligent PCB cleaning agent, the cleaning capacity of the flux residues is improved by adding the methanol, the ethanol, the benzoyl peroxide, the modified silica gel, the polydimethylsiloxane and the dimethyl carbonate, the service life is long, the energy consumption is low, the drying is fast, the preparation process is simple, the use is convenient, the residues of various ionic and non-ionic pollutants on the surface of a circuit board are avoided, a low-resistance path is prevented from being caused, the electrical function of the electronic circuit board is damaged, the service time of the circuit board is prolonged, and the maintenance cost is reduced.
2. This preparation method of intelligence PCB circuit board cleaner, through increasing PH regulator, alcohol, modified silica gel, deionized water, isopropyl acid and dimethyl carbonate, this reagent solution need not handle pure water equipment and waste water when clearing up the circuit board, has reduced the operation degree of difficulty, and the cleaner environmental protection can not cause the damage to the human body, and required equipment low price, and corollary equipment is few, has improved the clean efficiency to the circuit board.
Detailed Description
All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The application provides a technical scheme: a preparation method of an intelligent PCB circuit board cleaning agent comprises the following steps:
firstly, weighing the following components in parts by weight of methanol, ethanol, alcohol, dichloromethane, butyl acetate 2-5 parts, dimethyl carbonate, isopropyl acid, xylene, amine acetate, deionized water, a pH regulator, azobisisobutylamidine diacid hydrochloric acid, benzoyl peroxide, polydimethylsiloxane, modified silica gel and modified silica gel, modifying activated silica gel by using propane triethoxysilane, adding the activated silica gel into a toluene solution of 3- [ bis (2-hydroxyethyl) amino ] propane triethoxysilane, soaking for 18-24 hours, filtering, washing, drying, and then performing reflux treatment in an inorganic acid aqueous solution for 8-10 hours, wherein the material proportion of the triethylene glycol monobutyl ether is 10-15 parts of methanol, 15-18 parts of ethanol, 5-10 parts of alcohol, 1-3 parts of dichloromethane, 1-3 parts of, 2-5 parts of butyl acetate, 2-4 parts of dimethyl carbonate, 5-8 parts of isopropyl acid, 1.2-1.6 parts of dimethylbenzene, 1.2-4 parts of amine acetate, 50-60 parts of deionized water, 2-5 parts of azodiisobutylaminodiamidinate diacid hydrochloride, 1-3 parts of benzoyl peroxide, 2-3 parts of polydimethylsiloxane, 5-10 parts of modified silica gel and 2-3 parts of butyl triethylene glycol ether.
Secondly, selecting a preparation instrument: burette, reation kettle, weighing bottle, funnel, glass stick, acid-base test paper.
Thirdly, dropwise adding a preparation solution into the reaction kettle: modified silica gel, methanol, ethanol, alcohol, dichloromethane, isopropyl acid, xylene, azodiisobutylaminodiamidate hydrochloric acid, benzoyl peroxide, polydimethylsiloxane and triethylene glycol butyl ether are dripped into the mixture and are uniformly stirred by a glass rod for 5 to 15 minutes.
Fourthly, adding a solution into the prepared mixed solution: butyl acetate, dimethyl carbonate and ammonium acetate are added dropwise, the prepared mixed solution is stirred for the second time, the stirring time is 10-15 minutes, the cleaning agent is prepared at the temperature of normal temperature to 60 ℃, the phenomenon that the internal structure of lipid substances is damaged due to high temperature, so that the prepared cleaning agent has deviation in properties is avoided, the interval time between two times of stirring is less than ten minutes, and large-area precipitation is prevented from being formed.
Fifthly, carrying out acid-base regulation on the prepared mixed solution: and (3) dropwise adding a pH regulator, and regulating the pH value of the prepared mixed solution to be weakly acidic, wherein the pH regulator accounts for 0.1-0.5%. Through adjusting the pH value of the prepared cleaning agent, the obtained cleaning agent is prevented from being acidic, so that the surface of the circuit board is corroded and damaged, the weak acidity is maintained through the cleaning agent, the cleaning of floating points, dust, solder balls and the like on the surface of the circuit board is facilitated, and the cleaning efficiency of the circuit board is improved.
Sixthly, adding deionized water: adding deionized water into the stirred neutral mixed liquid, oscillating for 20 minutes by ultrasonic waves, standing and precipitating, taking supernatant, and filtering precipitates, wherein the cleaning agent is colorless transparent liquid, and is used for cleaning a circuit board by adopting a hot-dipping method or ultrasonic waves, and is used for cleaning the surface of the circuit board by adopting a hot-dipping or ultrasonic wave mode, the cleaning procedure is set to be three-time cleaning of a third tank or four-time cleaning of a fourth tank, if conditions allow that the number of the tanks can be properly increased, each tank is cleaned for 3-5 minutes, the cleaning agent is dried by strong (or hot) air, the dirtiest first tank is recycled when the cleaning agent is replaced, the second tank is replaced by the first tank, the third tank is replaced by the second tank, the fourth tank is replaced by the third tank, and a new clean cleaning agent is added into the fourth tank. When the workpiece is lifted out of the bath solution, the workpiece is drained for 30s from the bath solution and then placed into the next bath solution, so that waste and pollution among bath solutions are reduced.
It should be noted that, in this document, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, application, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, application, article, or apparatus.
Although embodiments of the present application have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the application, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. A preparation method of an intelligent PCB cleaning agent is characterized by comprising the following steps: the operation steps are as follows;
weighing the following components in parts by weight of methanol, ethanol, alcohol, dichloromethane, 2-5 parts of butyl acetate, dimethyl carbonate, isopropyl acid, xylene, amine acetate, deionized water, a pH regulator, azobisisobutylamidine diacid hydrochloric acid, benzoyl peroxide, polydimethylsiloxane, modified silica gel and butyl triethylene glycol ether.
Selecting a preparation instrument: burette, reation kettle, weighing bottle, funnel, glass stick, acid-base test paper.
Dropwise adding a preparation solution into the reaction kettle: modified silica gel, methanol, ethanol, alcohol, dichloromethane, isopropyl acid, xylene, azodiisobutylaminodiamidate hydrochloric acid, benzoyl peroxide, polydimethylsiloxane and triethylene glycol butyl ether are dripped into the mixture and are uniformly stirred by a glass rod for 5 to 15 minutes.
To the prepared mixed solution was added a solution: butyl acetate, dimethyl carbonate and ammonium acetate are added dropwise, and the prepared mixed solution is stirred for the second time, wherein the stirring time is 10-15 minutes.
And (3) carrying out acid-base regulation on the prepared mixed solution: and (4) dropwise adding a pH regulator, and regulating the pH value of the prepared mixed solution to make the pH value of the mixed solution weak.
Adding deionized water: adding deionized water into the stirred neutral mixed solution, oscillating for 20 minutes by ultrasonic waves, standing for precipitation, taking supernatant, and filtering precipitate.
2. The preparation method of the intelligent PCB cleaning agent as claimed in claim 1, wherein the preparation method comprises the following steps: the modified silica gel is prepared by modifying active silica gel with propane triethoxysilane.
3. The preparation method of the intelligent PCB cleaning agent as claimed in claim 1, wherein the preparation method comprises the following steps: the material comprises, by weight, 10-15 parts of methanol, 15-18 parts of ethanol, 5-10 parts of alcohol, 1-3 parts of dichloromethane, 2-5 parts of butyl acetate, 2-4 parts of dimethyl carbonate, 5-8 parts of isopropyl acid, 1.2-1.6 parts of xylene, 1.2-4 parts of amine acetate, 50-60 parts of deionized water, 2-5 parts of azodiisobutyramidate diacid hydrochloride, 1-3 parts of benzoyl peroxide, 2-3 parts of polydimethylsiloxane, 5-10 parts of modified silica gel and 2-3 parts of triethylene glycol monobutyl ether.
4. The preparation method of the intelligent PCB cleaning agent as claimed in claim 1, wherein the preparation method comprises the following steps: the PH regulator accounts for 0.1-0.5%.
5. The preparation method of the intelligent PCB cleaning agent as claimed in claim 1, wherein the preparation method comprises the following steps: the cleaning agent is prepared under the condition of normal temperature to 60 ℃.
6. The preparation method of the intelligent PCB cleaning agent as claimed in claim 1, wherein the preparation method comprises the following steps: when the cleaning agent is used for cleaning the circuit board, a thermal soaking method or ultrasonic waves are adopted for cleaning.
7. The preparation method of the intelligent PCB cleaning agent as claimed in claim 1, wherein the preparation method comprises the following steps: the cleaning agent is colorless transparent liquid, the cleaning procedure of the cleaning agent is set to three-groove three-time cleaning or four-groove four-time cleaning, and the single cleaning time of each groove is three to five minutes.
8. The preparation method of the intelligent PCB cleaning agent as claimed in claim 1, wherein the preparation method comprises the following steps: the interval time between the two times of stirring is less than ten minutes, large-area precipitates are prevented from being formed, the cleaning agent is weakly acidic through the two times of stirring and acid-base neutralization, and the acid-base value is 4-6.
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Application publication date: 20220902 |