CN114985361A - Automatic control cleaning device and control cleaning method for MEMS chip - Google Patents
Automatic control cleaning device and control cleaning method for MEMS chip Download PDFInfo
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- CN114985361A CN114985361A CN202210941656.8A CN202210941656A CN114985361A CN 114985361 A CN114985361 A CN 114985361A CN 202210941656 A CN202210941656 A CN 202210941656A CN 114985361 A CN114985361 A CN 114985361A
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- 238000004140 cleaning Methods 0.000 title claims abstract description 222
- 238000000034 method Methods 0.000 title claims abstract description 23
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 318
- 238000001514 detection method Methods 0.000 claims abstract description 69
- 238000005070 sampling Methods 0.000 claims abstract description 64
- 239000008367 deionised water Substances 0.000 claims abstract description 38
- 229910021641 deionized water Inorganic materials 0.000 claims abstract description 38
- 238000010521 absorption reaction Methods 0.000 claims abstract description 28
- 238000005507 spraying Methods 0.000 claims abstract description 25
- 150000002500 ions Chemical class 0.000 claims description 52
- 239000007921 spray Substances 0.000 claims description 50
- 239000007788 liquid Substances 0.000 claims description 33
- 239000012528 membrane Substances 0.000 claims description 20
- 150000001450 anions Chemical class 0.000 claims description 17
- 150000001768 cations Chemical class 0.000 claims description 17
- 239000003011 anion exchange membrane Substances 0.000 claims description 16
- 238000005341 cation exchange Methods 0.000 claims description 16
- 238000012544 monitoring process Methods 0.000 claims description 9
- 238000003860 storage Methods 0.000 claims description 7
- 230000001105 regulatory effect Effects 0.000 claims description 6
- 230000001276 controlling effect Effects 0.000 claims description 5
- 238000007599 discharging Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 230000000694 effects Effects 0.000 abstract description 7
- 238000012360 testing method Methods 0.000 abstract description 5
- 239000000243 solution Substances 0.000 description 9
- 238000005406 washing Methods 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 238000005260 corrosion Methods 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 4
- 239000002699 waste material Substances 0.000 description 4
- 230000000712 assembly Effects 0.000 description 3
- 238000000429 assembly Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 229910001414 potassium ion Inorganic materials 0.000 description 3
- 239000012530 fluid Substances 0.000 description 2
- 238000005086 pumping Methods 0.000 description 2
- 239000002351 wastewater Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000000909 electrodialysis Methods 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 238000011086 high cleaning Methods 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000011897 real-time detection Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/024—Cleaning by means of spray elements moving over the surface to be cleaned
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/14—Removing waste, e.g. labels, from cleaning liquid; Regenerating cleaning liquids
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/46—Treatment of water, waste water, or sewage by electrochemical methods
- C02F1/469—Treatment of water, waste water, or sewage by electrochemical methods by electrochemical separation, e.g. by electro-osmosis, electrodialysis, electrophoresis
- C02F1/4693—Treatment of water, waste water, or sewage by electrochemical methods by electrochemical separation, e.g. by electro-osmosis, electrodialysis, electrophoresis electrodialysis
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Life Sciences & Earth Sciences (AREA)
- Electrochemistry (AREA)
- Analytical Chemistry (AREA)
- Molecular Biology (AREA)
- Health & Medical Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Hydrology & Water Resources (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Water Supply & Treatment (AREA)
- Organic Chemistry (AREA)
- Cleaning By Liquid Or Steam (AREA)
Abstract
The invention belongs to the field of control and test devices, and discloses an automatic control cleaning device and a control cleaning method for an MEMS chip, which comprise the following steps: the MEMS chip carrier is arranged above the sampling detection assembly, the spraying cleaning assembly is arranged above the sampling detection assembly, and the deionized water inlet is communicated with the inlet of the spraying cleaning assembly; the atomic absorption spectrophotometer is connected with the water outlet at the bottom of the sampling detection assembly; an electromagnetic valve and a micropump are arranged at the water inlet of the spraying cleaning assembly, the deionized water inlet, the water tank inlet and the water outlet of the sampling detection assembly, the electromagnetic valve is used for realizing the connection and disconnection of a pipeline, and the micropump is used for providing kinetic energy for moving a medium in the pipeline; the acquisition controller is electrically connected with the electromagnetic valve and the micro pump; according to the invention, through automatic control and automatic test of cleaning after the MEMS chip is corroded, the cleaning effect and cleaning efficiency of the MEMS chip are greatly improved, the yield is improved, and the production cost is reduced.
Description
Technical Field
The invention belongs to the field of control and test devices, and particularly relates to an automatic control cleaning device and a control cleaning method for an MEMS (micro-electromechanical system) chip.
Background
The chip is the basis of electronic products, is the core of high technology, and is the key for the development of future technology. The production process of the chip is complex, has dozens of working procedures, and mainly comprises the following steps: the method comprises the steps of chip design, oxidation diffusion, photoetching, ion implantation, corrosion, cleaning, electrostatic sealing and the like, wherein the corrosion and the cleaning of the chip are one of key technologies for chip production.
The corrosion is a key process for producing the MEMS chip, and usually a solution such as KOH is used, after the MEMS chip is corroded, K, OH plasma attached to the MEMS chip exists on the MEMS chip, and the existence of these ions will seriously affect the stability performance of the MEMS chip, so the MEMS chip is washed with deionized water after the MEMS chip is corroded to remove the ions attached to the MEMS chip.
Taking a silicon-based pressure sensitive chip as an example, the sensitive silicon resistor is isolated by a PN junction, and the chip cannot stably work due to PN junction leakage and surface leakage. The largest cause of leakage is the presence of mobile ions. A difficulty with silicon-based pressure sensitive chips relative to integrated circuits is double-sided MEMS processing. Since a pressure-sensitive silicon diaphragm is required to be produced by etching, etching of a suitable diaphragm thickness for pressure sensing is required on the back side after the front side circuit is processed. The common corrosive liquid in the membrane corrosion process is KOH, a silicon chip inevitably contacts potassium ions, the quality of the chip is reduced due to the existence of movable potassium ions, the output of the chip is unstable, and the stability of the MEMS chip is a key problem in practical application and is the basis of all performances. The MEMS chip is unstable, parameters cannot be accurately measured, accuracy indexes are not referred, and stability is the first guarantee of reliability. Therefore, the cleaning effect after the etching of the MEMS chip plays an important role in the performance of the entire MEMS chip.
At present, the MEMS chip is manually cleaned by deionized water after being corroded, the cleaning is carried out for 30-60 min by adopting flowing deionized water, the content of ions in water is not detected on line in real time, water resources are wasted, the cleaning effect cannot be ensured, the MEMS chip is unstable due to residual potassium ions, the yield of the MEMS chip is difficult to improve, and great hidden danger is brought to the performance of the MEMS chip; meanwhile, the efficiency of manual cleaning is low, and the cost of the MEMS chip is increased.
Disclosure of Invention
In order to solve the problems of water resource waste, poor cleaning effect and the like caused by manual cleaning, the invention provides an MEMS chip automatic control cleaning device and a control method thereof, wherein the MEMS chip automatic control cleaning device has the advantages of good cleaning effect, high cleaning efficiency, small using amount of ionized water, simple operation and convenient use, and comprises:
the sampling detection assembly is of a groove structure and is used for containing cleaning liquid after the MEMS chip is cleaned and detecting the conductivity of the cleaning liquid;
the MEMS chip frame is arranged above the sampling detection assembly and is used for containing an MEMS chip to be cleaned;
the spraying and cleaning component is arranged above the sampling and detecting component and is used for spraying and cleaning the MEMS chip in the MEMS chip frame;
the deionized water inlet is communicated with the inlet of the spray cleaning component and is used for introducing deionized water into the spray cleaning component;
the water outlet is communicated with a water outlet at the bottom of the sampling detection assembly and is used for discharging the cleaning liquid in the sampling detection assembly;
an adjustable DC voltage source electrically connected to the sampling detection assembly, the adjustable DC voltage source configured to: providing a potential difference for the cleaning liquid in the sampling detection assembly, and separating anions and cations in the cleaning liquid;
the atomic absorption spectrophotometer is communicated with a water outlet at the bottom of the sampling detection assembly and is used for detecting the ion content in the cleaning liquid of the sampling detection assembly;
the water tank is communicated with a water outlet at the bottom of the sampling detection assembly and is used for recovering the cleaning liquid with low ion content in the sampling detection assembly and introducing the cleaning liquid with low ion content into the spraying cleaning assembly again;
the electromagnetic valves are used for realizing the on-off of a pipeline, and the micro pump is used for providing kinetic energy for moving media in the pipeline;
the acquisition controller is electrically connected with the electromagnetic valve and the micropump; the collection controller is configured to control the electromagnetic valve and the micro pump to be started and closed according to the conductivity and the ion content of the cleaning liquid;
a regulated DC power supply electrically connected to the acquisition controller and the sampling detection assembly, the regulated DC power supply configured to: and supplying power to the acquisition controller and the sampling detection assembly.
Further, the apparatus further comprises a monitoring host, and the acquisition controller further comprises: an Ethernet interface;
the Ethernet interface is connected with the monitoring host through a network.
Further, the sampling detection assembly comprises: a base;
the washing tank is divided into three areas, namely an anode area, a middle area and a cathode area, by the cation exchange membrane and the anion exchange membrane;
the anode area is provided with an anode, the anode is fixed in the cleaning tank through a support, the bottom of the anode area is provided with an anode water outlet, and the anode water outlet is provided with a hole at the bottom of the cleaning tank and penetrates through the base;
the bottom of the middle area is provided with a middle water outlet, and the middle water outlet is provided with a hole at the bottom of the cleaning tank and penetrates through the base;
the cathode area is provided with a cathode, the cathode is fixed in the cleaning tank through a support, the bottom of the cathode area is provided with a cathode water outlet, and the cathode water outlet is opened at the bottom of the cleaning tank and penetrates through the base;
the anode is connected with the anode of the adjustable direct current voltage source, and the cathode is connected with the cathode of the adjustable direct current voltage source;
the anode water outlet, the cathode water outlet and the middle water outlet are all communicated with the water outlet through pipelines.
Furthermore, the anode region is provided with a first conductivity meter, the middle region is provided with a second conductivity meter, the cathode region is provided with a third conductivity meter, and the first conductivity meter, the second conductivity meter and the third conductivity meter are all fixed in the cleaning tank through supports; the first conductivity meter, the second conductivity meter and the third conductivity meter are all electrically connected with a direct current stabilized voltage power supply; the acquisition controller also comprises an analog quantity input interface which is electrically connected with the first conductivity meter, the second conductivity meter and the third conductivity meter.
Furthermore, the spraying and cleaning assembly comprises a first spraying and cleaning assembly and a second spraying and cleaning assembly, and the first spraying and cleaning assembly and the second spraying and cleaning assembly are arranged on two sides of the MEMS chip frame.
Furthermore, the first spray cleaning assembly comprises a first spray assembly water inlet, a first nozzle assembly, a first ball screw module and a first ball screw module bracket; the first ball screw module is fixedly connected above the middle area through the first ball screw module bracket;
the second spray cleaning assembly comprises a second spray assembly water inlet, a second nozzle assembly, a second ball screw module and a second ball screw module bracket; the second ball screw module is fixedly connected above the middle area through the second ball screw module bracket;
each of the first nozzle assembly and the second nozzle assembly includes at least three rotating nozzles; the first ball screw module and the second ball screw module are configured to drive the rotating nozzle to reciprocate along the horizontal or vertical direction of the placement direction of the MEMS chip.
Further, the cation exchange membrane and the anion exchange membrane are selectively permeable membranes;
the cation exchange membrane is configured to allow cations located in the intermediate zone to pass from the intermediate zone into the cathode zone;
the anion exchange membrane is configured to allow anions located in the intermediate zone to pass from the intermediate zone to the anode zone.
Further, the anode water outlet comprises a first anode water outlet and a second anode water outlet; the cathode water outlets comprise a first cathode water outlet and a second cathode water outlet; the middle water outlets comprise a first middle water outlet and a second middle water outlet; the first anode water outlet and the first cathode water outlet are communicated with the atomic absorption spectrophotometer; the first middle water outlet is communicated with the water tank water inlet; the second anode water outlet, the second cathode water outlet and the second middle water outlet are communicated with the water outlet.
Furthermore, a second water level meter is arranged in the water tank and is electrically connected with the analog quantity input interface; and the middle area is provided with a first water level meter which is electrically connected with the analog quantity input interface.
The second aspect of the application provides a cleaning method and is applied to any one of the MEMS chip automatic control cleaning devices; the method comprises the following steps:
s1: pre-cleaning an MEMS chip and then placing the cleaned MEMS chip in the MEMS chip frame;
s2: the collection controller controls to open the deionized water inlet, controls the water inlet of the spray cleaning assembly to be communicated, sprays deionized water to wash the MEMS chip, and enables the cleaned liquid to flow into the sampling detection assembly for at least three minutes;
s3: the output of the adjustable direct current voltage source is controlled by the acquisition controller to form potential difference, so that the anions and the cations in the cleaned water in the sampling detection assembly are separated; the water with the lowest intermediate ion content enters the water tank through the water outlet for storage;
s4: the collection controller controls to close the deionized water inlet, open the water tank outlet, spray low-ion water to wash the MEMS chip, and the cleaned water flows into the sampling detection assembly; this step lasts at least three minutes;
s5: the output of the adjustable direct current voltage source is controlled to be unchanged by the acquisition controller, negative and positive ions in the cleaned water are continuously separated, the water with the lowest content of intermediate ions enters the water tank through the water outlet for storage, and other water containing ions is discharged to the water outlet from other water outlets;
s6: acquiring conductivity values of water in the sampling detection assembly through the acquisition controller, repeating the steps S4-S5 if any one of the conductivity values is higher than a first set value, and performing the step S7 if the conductivity values are lower than the first set value;
s7: controlling to close the outlet of the water tank through the acquisition controller, and performing step S8 after repeating steps S2-S3;
s8: acquiring conductivity values of water in the sampling detection assembly through the acquisition controller, repeating the step S7 if any one of the conductivity values is higher than a second set value, and performing the step S9 if the conductivity values are lower than the second set value;
s9: closing the water inlet of the water outlet through the acquisition controller, opening the water inlet of the atomic absorption spectrophotometer, reading the ion content detected by the atomic absorption spectrophotometer through the acquisition controller, and repeating the step S7 when the ion content value detected by the atomic absorption spectrophotometer is higher than a third set value; when the ion content value detected by the atomic absorption spectrophotometer is lower than a third set value, the cleaning work is finished;
wherein the first set value is greater than the second set value.
According to the technical scheme, the invention has the following beneficial effects: compared with the traditional manual cleaning, the cleaning efficiency of the MEMS chip can be greatly improved by adopting the MEMS chip automatic control cleaning device to clean the MEMS chip, the productivity of an MEMS chip production line is improved, and the labor cost of MEMS chip production is reduced. The method adopts the conductivity meter and the atomic absorption spectrophotometer to carry out double online detection on the ions in the water after the MEMS chip is cleaned, so that the cleaning quality of the MEMS chip can be greatly improved, the yield of the MEMS chip production is greatly improved, and the production cost of the MEMS chip is reduced; an electrodialysis method is adopted to separate ions in water after the MEMS chip is cleaned, and water in the middle area is repeatedly recycled for cleaning the MEMS chip, so that water resources can be utilized to the maximum extent, and waste of water resources is avoided; the MEMS chip is cleaned from a plurality of angles by adopting the reciprocating motion of the two-axis ball screw module in the left and right directions and the up and down directions and matching with a plurality of rotary nozzles, so that the cleaning quality of the MEMS chip is greatly improved, the yield of the MEMS chip production is greatly improved, and the production cost of the MEMS chip is reduced; the invention realizes the flexible control of the switching between the deionized water and the water in the middle area for the cleaning water of the MEMS chip by flexibly controlling a plurality of groups of electromagnetic valves and micropumps and matching with the application of a pipe fitting, thereby achieving the purposes of ensuring the cleaning quality of the MEMS chip and saving the water; the invention realizes that the MEMS chip is cleaned from two directions simultaneously, greatly improves the cleaning efficiency of the MEMS chip and greatly improves the cleaning effect of the MEMS chip.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the embodiments of the invention and, together with the description, serve to explain the principles of the embodiments of the invention. It is obvious that the drawings in the following description are only some of the embodiments of the invention, and that for a person skilled in the art, other drawings can be derived from them without inventive effort.
FIG. 1 is a schematic structural view of an automatic control cleaning device for an MEMS chip according to the present application;
FIG. 2 is a schematic structural diagram of a sampling test assembly of the present application;
FIG. 3 is a schematic structural view of a first spray cleaning assembly of the present application;
FIG. 4 is a schematic structural view of a second spray cleaning assembly of the present application;
FIG. 5 is a schematic flow chart of the apparatus of the present application for controlling the cleaning of a MEMS chip.
In the drawings, the components represented by the respective reference numerals are listed below:
1-base, 2-cleaning tank, 3-MEMS chip holder, 4-anode, 5-cathode, 6-cation exchange membrane, 7-anion exchange membrane, 8-first conductivity meter, 9-second conductivity meter, 10-third conductivity meter, 11-first water level meter, 12-second water level meter, 20-anode water outlet, 21-middle water outlet, 22-cathode water outlet, 23-first spray assembly water inlet, 24-first nozzle assembly, 25-first ball screw module, 26-first ball screw module support, 27-second spray assembly water inlet, 28-second nozzle assembly, 29-second ball screw module, 30-second ball screw module support, 31-deionized water inlet, 81-monitoring host, 82-adjustable direct current voltage source, 83-direct current stabilized power supply, 84-atomic absorption spectrophotometer, 85-acquisition controller, 86-spray cleaning component, 87-water tank, 88-sampling detection component, 89-water outlet, 201-first anode water outlet, 202-second anode water outlet, 211-first middle water outlet, 212-second middle water outlet, 221-first cathode water outlet, 222-second cathode water outlet, 861-first spray cleaning component and 862-second spray cleaning component.
Detailed Description
Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided to provide a thorough understanding of embodiments of the invention. One skilled in the relevant art will recognize, however, that the invention may be practiced without one or more of the specific details, or with other methods, apparatus, steps, and so forth. In other instances, well-known techniques have not been shown or described in detail to avoid obscuring aspects of embodiments of the invention.
As shown in fig. 1, a first aspect of the present application provides an automatic control cleaning device for a MEMS chip, which is provided with: a sampling detection component 88, a MEMS chip rack 3 and a spraying cleaning component 86 are arranged above the sampling detection component 88, and the spraying cleaning component 86 is provided with a deionized water inlet 31 connected with the spraying cleaning component 86 through a pipeline.
The sampling detection assembly 88 is of a groove structure and is used for containing cleaning liquid for cleaning the MEMS chip and detecting the conductivity of the cleaning liquid; during the use, will wait to wash the MEMS chip place on MEMS chip frame 3, spray cleaning component 86 and carry out the spray rinsing to the MEMS chip in MEMS chip frame 3 both sides deionized water entry 31 lets in deionized water, deionized water can by spray cleaning component 86 blowout and wash the ion of adhering to on the MEMS chip. During cleaning, the cleaning fluid will naturally flow into the sample detection assembly 88 and the sample detection assembly 88 will detect conductivity in the cleaning fluid.
The outlet below the sampling detection assembly 88 is connected with a water outlet 89, a water tank 87 and an atomic absorption spectrophotometer 84, the water outlet 89 discharges unnecessary waste water in the cleaning process, and low-ion water which can be repeatedly used for cleaning is discharged into the water tank 87 for circular cleaning, so that water resources are saved. An adjustable dc voltage source electrically connected to the sampling detection assembly 88 is also provided, the adjustable dc voltage source configured to: providing a potential difference for the cleaning liquid in the sampling detection assembly, and separating anions and cations in the cleaning liquid; and anion and cation solution formed after the anion and cation are separated is communicated with the atomic absorption spectrophotometer 84 through a pipeline. The atomic absorption spectrophotometer 84 detects the ion content in the cleaning liquid after cleaning, and if the ion content is higher than a predetermined value, the cleaning is continued, and if the ion content is lower than the predetermined value, the cleaning is ended. The device can accurately judge whether the cleaning quality of the MEMS chip meets the requirements by detecting the ion content in the cleaning liquid, prevent the conditions of incomplete and incomplete cleaning, and avoid excessive cleaning and resource waste.
The application also comprises electromagnetic valves and micropumps at the water inlet of the spray cleaning assembly 86, the deionized water inlet 31, the water tank 87 inlet and the water outlet of the sampling detection assembly 88, wherein the micropumps are used for providing kinetic energy for moving media in the pipeline; the electromagnetic valve and the micropump are electrically connected with the acquisition controller 85; the collection controller 85 can control the electromagnetic valve and the micropump to be started and closed, the electromagnetic valves are arranged at the water inlet of the spraying cleaning assembly 86, the deionized water inlet 31, the outlet of the water tank 87 inlet and the water outlet of the sampling detection assembly 88 to realize the on-off of pipelines, specifically, when the deionized water is used for cleaning, the electromagnetic valve at the outlet of the water tank 87 is closed, the electromagnetic valve at the deionized water inlet 31 is opened, and then the deionized water can be introduced for cleaning; when low-ion water is needed for cleaning, the electromagnetic valve at the outlet of the water tank 87 is opened, the electromagnetic valve at the deionized water inlet 31 is closed, and then the low-ion water can be introduced for washing. The other inlet and outlet solenoid valves are also used as in the above embodiments, and the solenoid valves can be placed according to practical situations, and in this application, the number and the type of the solenoid valves are not limited.
In this application, the acquisition controller 85 may acquire the conductivity detected by the sampling detection module 88 and the ion content detected by the atomic absorption spectrophotometer 84, and according to the comparison result between the conductivity and the ion content with a predetermined value, determines which step of the deionized water cleaning, the low-ion water cleaning or the cleaning is to be performed next, and according to the determination result, performs on-off control on each solenoid valve and the micropump, and correspondingly opens or closes the corresponding component channel in the device to complete the cleaning.
Further, as shown in fig. 2, in an embodiment provided herein, the sampling detection assembly 88 includes: a base 1;
the cleaning tank comprises a cleaning tank 2 arranged on the base 1, and a cation exchange membrane 6 and an anion exchange membrane 7 which are arranged in the cleaning tank 2, wherein the cation exchange membrane 6 and the anion exchange membrane 7 divide the cleaning tank 2 into three areas, namely an anode area, a middle area and a cathode area; the base 1 is tightly attached to the bottom of the cleaning tank 2, the cleaning tank is divided into three subareas through the cation exchange membrane 6 and the anion exchange membrane 7, and further, the cation exchange membrane 6 and the anion exchange membrane 7 are selective permeable membranes; the cation exchange membrane 6 is configured to allow cations located in the middle zone to enter the cathode zone from the middle zone; the anion exchange membrane 7 is configured to allow anions located in the intermediate zone to pass from the intermediate zone to the anode zone. Therefore, in this embodiment, the MEMS chip rack 3 and the spray cleaning assembly 86 are disposed right above the cleaning tank 2, so that when the cleaning solution flows into the cleaning tank, the cleaning solution firstly enters the middle area, cations will pass through the cation exchange membrane 6 and enter the cathode area in the middle area, and anions will pass through the anion exchange membrane 7 and enter the anode area, and the cleaning solution retained in the middle area is low-ion water, and can be introduced into the water tank 87 for storage.
The anode region is provided with an anode 4, the cathode region is provided with a cathode 5, the anode 4 and the cathode 5 are both fixed in the cleaning tank 2 through a bracket, the anode 4 is connected with the anode of the adjustable direct current voltage source 82, and the cathode 5 is connected with the cathode of the adjustable direct current voltage source 82; the anode and the cathode are electrified by the adjustable dc voltage source 82, and the voltage of the adjustable dc voltage source 82 is adjusted by the acquisition controller 85, so that a potential difference is formed between the cathode and the anode, cations are concentrated to the cathode region through the cation exchange membrane 6 due to positive charge, and anions are concentrated to the anode region through the anion exchange membrane 7 due to negative charge.
An anode water outlet 20 is formed in the bottom of the anode region, a middle water outlet 21 is formed in the bottom of the middle region, a cathode water outlet 22 is formed in the bottom of the cathode region, and the anode water outlet 20, the middle water outlet 21 and the cathode water outlet 22 are all opened at the bottom of the cleaning tank 2 and penetrate through the base 1; the anode water outlet 20, the cathode water outlet 22 and the middle water outlet 21 are all communicated with the water outlet 89 through pipelines. In this embodiment, the drain port 89 discharges the cleaning solution rich in ions in the anode region and the cathode region during cleaning.
In some embodiments of the present application, the automatic control cleaning device for MEMS chip further comprises a dc regulated power supply 83; the dc regulated power supply 83 is configured to: power is supplied to the acquisition controller 85 and the sample detection assembly 88. Specifically, as shown in fig. 2, in the embodiment provided by the present application, the anode region is provided with a first conductivity meter 8, the middle region is provided with a second conductivity meter 9, the cathode region is provided with a third conductivity meter 10, and the first conductivity meter 8, the second conductivity meter 9, and the third conductivity meter 10 are all fixed in the cleaning tank 2 through a bracket; the first conductivity meter 8, the second conductivity meter 9 and the third conductivity meter 10 are all electrically connected with a direct current stabilized voltage power supply 83. The conductivity meter is an instrument for measuring the conductivity of the electrolyte solution, in the embodiment of the present application, the conductivity meter is selected for detection, and in other embodiments, other instruments having the same function may also be selected, which is not limited in the present application.
According to the above embodiment, the conductivity meter is provided, and correspondingly, the acquisition controller 85 further includes an analog input interface, and the analog input interface is electrically connected to the first conductivity meter 8, the second conductivity meter 9, and the third conductivity meter 10. In the cleaning process, the first conductivity meter 8 measures the conductivity of the anode region, the second conductivity meter 9 measures the conductivity of the middle region, the third conductivity meter 10 measures the conductivity of the cathode region, the measured conductivity is transmitted to the acquisition controller 85 through the analog input interface, the acquisition controller 85 judges whether the conductivity meets the requirement according to a preset standard value, if the conductivity value is higher than the preset standard value, the deionized water is controlled to be repeatedly sprayed and washed until the detected conductivity value is lower than the standard value, and then the next step is carried out.
Further, in some embodiments, the apparatus further includes a monitoring host 81, and the acquisition controller 85 further includes: and the Ethernet interface is in network connection with the monitoring host 81. Through monitoring host computer 81 can be monitored the washing condition by personnel in the place of keeping away from the device, and when necessary, personnel can pass through monitoring host computer 81 is right gather controller 85 and issue control command, under the special circumstances, can require to suspend to wash or restart, adopt ethernet to carry out internet access, can carry out remote control, and personnel can keep away from equipment, guarantee operating personnel's safety.
As shown in fig. 3 and 4, the present application provides an embodiment of the spray cleaning assembly 86, and specifically, the spray cleaning assembly 86 includes a first spray cleaning assembly 861 and a second spray cleaning assembly 862, and the first spray cleaning assembly 861 and the second spray cleaning assembly 862 are disposed on two sides of the MEMS chip carrier 3. Through setting up two sets of washing subassemblies that spray, can diversified spray rinsing MEMS chip, avoid having the dead angle to leak to wash can wash not in place, also can set up in other embodiments and be more than two sets of washing subassemblies that spray, cross the washing in vertical direction, the restriction is not done to this application.
Specifically, the first spray cleaning assembly 861 comprises a first spray assembly water inlet 23, a first nozzle assembly 24, a first ball screw module 25 and a first ball screw module bracket 26; the first ball screw module 25 is fixedly connected above the middle area through the first ball screw module bracket 26;
the second spray cleaning assembly 862 comprises a second spray assembly water inlet 27, a second nozzle assembly 28, a second ball screw module 29 and a second ball screw module bracket 30; the second ball screw module 29 is fixedly connected above the intermediate section by the second ball screw module bracket 30. In this embodiment, a ball screw module is provided, and the first nozzle assembly 24 and the second nozzle assembly 28 can reciprocate along the horizontal or vertical direction of the MEMS chip placement direction under the driving of the ball screw. The MEMS chip frame 3 can be designed correspondingly according to the length of the ball screw, more MEMS chips can be placed, all the MEMS chips can be uniformly cleaned when the first nozzle assembly 24 and the second nozzle assembly 28 are cleaned in a reciprocating mode, and cleaning efficiency is improved. Further, each of the first and second nozzle assemblies 24, 28 includes at least three rotating nozzles; as shown in fig. 3, in this embodiment, a mode that each group of spray cleaning assemblies is matched with five rotary nozzles is adopted, and in other embodiments, when more than two groups of spray cleaning assemblies are adopted, the cleaning requirements can be met by correspondingly matching three rotary nozzles.
Further, in the present application, in order to ensure that the sampling detection assembly 88 can satisfy the functions of storing low-ion water into the water tank 87, discharging high-ion water, connecting the atomic absorption spectrophotometer 84, and the like, an embodiment of the water outlet of the sampling detection assembly 88 is provided, and specifically, as shown in fig. 2, the anode water outlet 20 includes a first anode water outlet 201 and a second anode water outlet 202; the cathode water outlet 22 comprises a first cathode water outlet 221 and a second cathode water outlet 222; the intermediate water outlet 21 comprises a first intermediate water outlet 211 and a second intermediate water outlet 212;
wherein the first anode water outlet 201 and the first cathode water outlet 221 are communicated with the atomic absorption spectrophotometer 84; when one round of cleaning is finished, other water outlets are closed, the first anode water outlet 201 and the first cathode water outlet 221 are opened, cleaning liquid is introduced into the atomic absorption spectrophotometer 84, a micropump or other equipment with a water pumping function can be adopted to pump the cleaning liquid, the atomic absorption spectrophotometer 84 can detect the ion content in the cleaning liquid, the result is transmitted to the acquisition controller 85, if the detected ion content is higher than a preset standard value, the cleaning is controlled to continue, if the detected ion content is lower than the standard value, the cleaning is finished, the cleaning degree of the MEMS chip can be accurately judged according to the ion content standard, and the cleaning quality of the MEMS chip can be ensured after the requirements are met.
The first intermediate water outlet 211 is communicated with the water inlet of the water tank 87; the first intermediate water outlet 211 is dedicated to storing low ion water in the water tank 87, avoiding waste.
The second anode water outlet 202, the second cathode water outlet 222 and the second intermediate water outlet 212 are communicated with the water outlet 89. In the cleaning process, the cleaning solution of the cathode region and the anode region which are not used for detection can be directly drained through the second anode water outlet 202 and the second cathode water outlet 222, when the cleaning is finished, the second middle water outlet 212 can be opened to drain all the cleaning solution, or when the sampling detection assembly 88 needs to be cleaned or repaired, the second anode water outlet 202, the second cathode water outlet 222 and the second middle water outlet 212 can be completely opened to drain the wastewater.
In some embodiments, the water tank 87 of the present application is provided with a second level gauge 12 therein, the second level gauge 12 being electrically connected to the analog input port, or the middle area is provided with a first level gauge 11, the first level gauge 11 being electrically connected to the analog input port. The water level gauge is an instrument capable of recording and detecting the water level of a water body, the water level gauge is arranged in the water tank 87 and the middle area, real-time detection can be achieved for the content of cleaning liquid in the water tank 87 and the sampling detection assembly 88, if the cleaning liquid is too much, certain cleaning liquid can be properly emptied, and overflow of equipment and potential safety hazards are avoided.
As shown in fig. 5, the present application provides an automatic control cleaning method for an MEMS chip based on the above automatic control cleaning apparatus for an MEMS chip, the cleaning steps are as follows:
s1: placing the pre-cleaned MEMS chip in the MEMS chip frame; the MEMS chips are arranged in the MEMS chip frame at intervals and cannot be stacked, otherwise, the middle MEMS chip cannot be cleaned.
S2: the collection controller controls the opening of the deionized water inlet, controls the connection of the water inlet of the spray cleaning assembly and connects the deionized water into the water inlet of the spray assembly; through acquisition controller control first ball screw module and second ball screw module are along MEMS chip and put the horizontal or vertical direction of orientation and do reciprocating motion, wash the MEMS chip of arranging in on the MEMS chip frame through a plurality of rotation type nozzles in the nozzle assembly, and this step uses deionized water to wash, will last 3 minutes at least, guarantees that the first round washes and can wash away most adnexed ion on the MEMS chip.
S3: the method comprises the following steps that water after an MEMS chip is cleaned flows into a cleaning tank, an anode and a cathode are respectively connected to a positive electrode and a negative electrode of an adjustable direct current voltage source, the output of the adjustable direct current voltage source is adjusted under the control of an acquisition controller, a potential difference is formed between the anode and the cathode, and under the action of voltage, positive ions and negative ions in the water in the cleaning tank respectively move towards the two ends of the cathode and the anode and respectively pass through a cation exchange membrane and an anion exchange membrane, so that the content of cations in a cathode region is high, the content of anions in an anode region is high, and the ion content in a middle region is lowest; pumping the water in the middle area into a water tank for storage through a water outlet of the middle area; in some embodiments, the water level condition in the cleaning tank can be continuously monitored by the first water level meter, and the water level condition in the water tank can be continuously monitored by the second water level meter, so that the water level control of the cleaning tank and the water tank is realized;
s4: the collection controller controls to close the deionized water inlet and open the water tank outlet, and low-ion water in the water tank is accessed to the water inlet of the spraying assembly; the acquisition controller controls the first ball screw module and the second ball screw module to reciprocate along the horizontal or vertical direction of the arrangement direction of the MEMS chip, and the MEMS chip arranged on the MEMS chip frame is cleaned through a plurality of rotary nozzles in the nozzle assembly, and the cleaning is carried out for at least 3 minutes by using low-ion water;
s5: the output of the adjustable direct current voltage source is controlled to be unchanged by the acquisition controller, negative and positive ions in the cleaned water are continuously separated, the water with the lowest content of intermediate ions enters the water tank through the water outlet for storage, and other water containing ions is discharged to the water outlet from other water outlets; in some embodiments, the water level condition in the cleaning tank can be continuously monitored by the first water level gauge and the water level condition in the water tank can be continuously monitored by the second water level gauge during the period, so that the water level control of the cleaning tank and the water tank is realized;
s6: respectively acquiring the measured values of the first conductivity meter, the second conductivity meter and the third conductivity meter through the acquisition controller, repeating the steps S4-S5 when the conductivity values of the cation area and the anion area are any one or both higher than a set value 1, and performing the step S7 when the conductivity values of the cation area and the anion area are both lower than a first set value;
s7: controlling to close the outlet of the water tank through the acquisition controller, and performing step S8 after repeating steps S2-S3;
s8: respectively acquiring the measured values of the first conductivity meter, the second conductivity meter and the third conductivity meter through the acquisition controller, repeating the step S7 when the conductivity values of the cation area and the anion area are any one or both higher than a set value 2, and performing the step S9 when the conductivity values of the cation area and the anion area are both lower than a second set value;
s9: closing the water inlet of the water outlet through the acquisition controller, opening the water inlet of the atomic absorption spectrophotometer, reading the ion content detected by the atomic absorption spectrophotometer through the acquisition controller, and repeating the step S7 when the ion content value detected by the atomic absorption spectrophotometer is higher than a third set value; and when the ion content value detected by the atomic absorption spectrophotometer is lower than a third set value, finishing the cleaning work of the MEMS chip.
Wherein the first set value is greater than the second set value;
in some embodiments, a water level meter is disposed in the water tank, and the content of the cleaning solution in the water tank and the sampling detection assembly can be detected in real time, for example, when the amount of water pre-stored in the water tank fails to meet the requirement for cleaning, the deionized water can be controlled to be replaced for cleaning, for example, when step S4 is executed, if the water level in the water tank is detected to be lower than the pre-set value, the outlet of the water tank is closed by the acquisition controller, the inlet of the deionized water is opened, and the deionized water is connected to the inlet of the spray assembly.
In some embodiments, if the last time the low ion water is washed is already stored in the water tank and the water level meets the preset amount requirement, the washing process may cross the steps S2 and S3 after the step S1 is completed, and other steps may be directly performed from the step S4.
From the above embodiment, the present application discloses an automatic control cleaning apparatus for an MEMS chip and a control method thereof, including: the MEMS chip carrier is arranged above the sampling detection assembly, and the spraying cleaning assembly is arranged above the sampling detection assembly; the water outlet, the atomic absorption spectrophotometer and the water tank are communicated with the water outlet at the bottom of the sampling detection assembly; an electromagnetic valve and a micropump are arranged at the water inlet of the spraying cleaning assembly, the deionized water inlet, the water tank inlet and the water outlet of the sampling detection assembly, the electromagnetic valve is used for realizing the connection and disconnection of a pipeline, and the micropump is used for providing kinetic energy for moving a medium in the pipeline; the acquisition controller is electrically connected with the electromagnetic valve and the micro pump; according to the invention, through automatic control and automatic test of cleaning after the MEMS chip is corroded, the cleaning effect and cleaning efficiency of the MEMS chip are greatly improved, the yield of the MEMS chip is improved, and the production cost of the MEMS chip is reduced.
Claims (10)
1. An MEMS chip automatic control belt cleaning device which characterized in that includes:
the sampling detection assembly (88), the sampling detection assembly (88) is a groove structure, and is used for containing cleaning liquid after the MEMS chip is cleaned and detecting the conductivity of the cleaning liquid;
the MEMS chip rack (3) is arranged above the sampling detection assembly (88) and is used for containing an MEMS chip to be cleaned;
the spray cleaning assembly (86) is arranged above the sampling detection assembly (88) and is used for spray cleaning the MEMS chip in the MEMS chip frame (3);
the deionized water inlet (31) is communicated with the inlet of the spray cleaning assembly (86) and is used for introducing deionized water into the spray cleaning assembly (86);
the water outlet (89) is communicated with a bottom water outlet of the sampling detection assembly (88) and is used for discharging the cleaning liquid in the sampling detection assembly (88);
an adjustable DC voltage source (82) electrically connected to the sampling detection assembly (88), the adjustable DC voltage source (82) configured to: providing a potential difference for the cleaning liquid in the sampling detection assembly (88) to separate anions and cations in the cleaning liquid;
the atomic absorption spectrophotometer (84) is communicated with a bottom water outlet of the sampling detection assembly (88) and is used for detecting the ion content in the cleaning liquid of the sampling detection assembly (88);
the water tank (87) is communicated with a bottom water outlet of the sampling detection assembly (88) and is used for recovering the cleaning liquid with low ion content in the sampling detection assembly (88) and introducing the cleaning liquid with low ion content into the spraying cleaning assembly (86) again;
the electromagnetic valves and the micropumps are arranged at a water inlet of the spraying cleaning assembly (86), a deionized water inlet (31), an inlet of the water tank (87) and a water outlet of the sampling detection assembly (88), the electromagnetic valves are used for realizing the on-off of a pipeline, and the micropumps are used for providing kinetic energy for moving media in the pipeline;
an acquisition controller (85) electrically connected with the electromagnetic valve and the micropump; the acquisition controller (85) is configured to control the solenoid valve and the micro pump to be turned on and off according to the conductivity and the ion content of the cleaning liquid;
a regulated DC power supply (83) electrically connected to the acquisition controller (85) and the sample detection assembly (88), the regulated DC power supply (83) configured to: power the acquisition controller (85) and the sampling detection assembly (88).
2. The automatic control cleaning device for the MEMS chip as claimed in claim 1, wherein the device further comprises a monitoring host (81), and the acquisition controller (85) further comprises: an Ethernet interface;
the Ethernet interface is connected with the monitoring host (81) through a network.
3. The MEMS chip automatic control cleaning device of claim 1, wherein the sampling detection assembly (88) comprises: a base (1);
the cleaning tank comprises a cleaning tank (2) arranged on the base (1), and a cation exchange membrane (6) and an anion exchange membrane (7) which are arranged in the cleaning tank (2), wherein the cation exchange membrane (6) and the anion exchange membrane (7) divide the cleaning tank (2) into three areas, namely an anode area, a middle area and a cathode area;
the anode area is provided with an anode (4), the anode (4) is fixed in the cleaning tank (2) through a support, the bottom of the anode area is provided with an anode water outlet (20), and the anode water outlet (20) is perforated at the bottom of the cleaning tank (2) and penetrates through the base (1);
a middle water outlet (21) is formed in the bottom of the middle area, and a hole is formed in the middle water outlet (21) at the bottom of the cleaning tank (2) and penetrates through the base (1);
the cathode area is provided with a cathode (5), the cathode (5) is fixed in the cleaning tank (2) through a support, the bottom of the cathode area is provided with a cathode water outlet (22), and the cathode water outlet (22) is opened at the bottom of the cleaning tank (2) and penetrates through the base (1);
the anode (4) is connected with the positive pole of the adjustable direct current voltage source (82), and the cathode (5) is connected with the negative pole of the adjustable direct current voltage source (82);
the anode water outlet (20), the cathode water outlet (22) and the middle water outlet (21) are all communicated with the water outlet (89) through pipelines.
4. The automatic control cleaning device for MEMS chip of claim 3,
the anode area is provided with a first conductivity meter (8), the middle area is provided with a second conductivity meter (9), the cathode area is provided with a third conductivity meter (10), and the first conductivity meter (8), the second conductivity meter (9) and the third conductivity meter (10) are fixed in the cleaning tank (2) through supports;
the first conductivity meter (8), the second conductivity meter (9) and the third conductivity meter (10) are all electrically connected with a direct current stabilized voltage power supply (83);
the acquisition controller (85) further comprises an analog quantity input interface, and the analog quantity input interface is electrically connected with the first conductivity meter (8), the second conductivity meter (9) and the third conductivity meter (10).
5. The automatic control cleaning device for MEMS chip according to claim 1,
the spraying cleaning assembly (86) comprises a first spraying cleaning assembly (861) and a second spraying cleaning assembly (862), and the first spraying cleaning assembly (861) and the second spraying cleaning assembly (862) are arranged on two sides of the MEMS chip frame (3).
6. The automatic control cleaning device for MEMS chip according to claim 5,
the first spray cleaning assembly (861) comprises a first spray assembly water inlet (23), a first nozzle assembly (24), a first ball screw module (25) and a first ball screw module bracket (26); the first ball screw module (25) is fixedly connected above the middle area through the first ball screw module bracket (26);
the second spray cleaning assembly (862) comprises a second spray assembly water inlet (27), a second nozzle assembly (28), a second ball screw module (29) and a second ball screw module bracket (30); the second ball screw module (29) is fixedly connected above the middle area through the second ball screw module bracket (30);
each of the first nozzle assembly (24) and the second nozzle assembly (28) including at least three rotating nozzles therein;
the first ball screw module (25) and the second ball screw module (29) are configured to drive the rotating nozzle to reciprocate along the horizontal or vertical direction of the arrangement direction of the MEMS chip.
7. The automatic control cleaning device for the MEMS chip according to claim 3, wherein the cation exchange membrane (6) and the anion exchange membrane (7) are selectively permeable membranes;
the cation exchange membrane (6) is configured to allow cations located in the intermediate zone to pass from the intermediate zone into the cathode zone;
the anion exchange membrane (7) is configured to allow anions located in the intermediate zone to pass from the intermediate zone to the anode zone.
8. The automatic control cleaning device for MEMS chip according to claim 3,
the anode water outlet (20) comprises a first anode water outlet (201) and a second anode water outlet (202); the cathode water outlet (22) comprises a first cathode water outlet (221) and a second cathode water outlet (222); the intermediate water outlet (21) comprises a first intermediate water outlet (211) and a second intermediate water outlet (212);
the first anode water outlet (201) and the first cathode water outlet (221) are communicated with the atomic absorption spectrophotometer (84);
the first middle water outlet (211) is communicated with the water inlet of the water tank (87);
the second anode water outlet (202), the second cathode water outlet (222) and the second intermediate water outlet (212) are communicated with the water outlet (89).
9. The automatic control cleaning device for MEMS chip according to claim 4,
a second water level meter (12) is arranged in the water tank (87), and the second water level meter (12) is electrically connected with the analog quantity input interface;
the middle area is provided with a first water level gauge (11), and the first water level gauge (11) is electrically connected with the analog quantity input interface.
10. An automatic control cleaning method for an MEMS chip, which is characterized in that the control cleaning method is applied to an automatic control cleaning device for the MEMS chip of any one of the claims 1-9;
s1: placing the pre-cleaned MEMS chip in the MEMS chip frame;
s2: the collection controller controls to open the deionized water inlet, controls the water inlet of the spray cleaning assembly to be communicated, sprays deionized water to wash the MEMS chip, and enables the cleaned liquid to flow into the sampling detection assembly for at least three minutes;
s3: the output of the adjustable direct current voltage source is controlled by the acquisition controller to form potential difference, so that the anions and the cations in the cleaned water in the sampling detection assembly are separated; the water with the lowest intermediate ion content enters the water tank through the water outlet for storage;
s4: the collection controller controls to close the deionized water inlet, open the water tank outlet, spray low-ion water to wash the MEMS chip, and the cleaned water flows into the sampling detection assembly; this step lasts at least three minutes;
s5: the output of the adjustable direct current voltage source is controlled to be unchanged by the acquisition controller, negative and positive ions in the cleaned water are continuously separated, the water with the lowest content of intermediate ions enters the water tank through the water outlet for storage, and other water containing ions is discharged to the water outlet from other water outlets;
s6: acquiring conductivity values of water in the sampling detection assembly through the acquisition controller, repeating the steps S4-S5 if any one of the conductivity values is higher than a first set value, and performing the step S7 if the conductivity values are lower than the first set value;
s7: controlling to close the outlet of the water tank through the acquisition controller, repeating the steps S2-S3 once, and then performing the step S8;
s8: acquiring conductivity values of water in the sampling detection assembly through the acquisition controller, repeating the step S7 if any one of the conductivity values is higher than a second set value, and performing the step S9 if the conductivity values are lower than the second set value;
s9: closing the water inlet of the water outlet through the acquisition controller, opening the water inlet of the atomic absorption spectrophotometer, reading the ion content detected by the atomic absorption spectrophotometer through the acquisition controller, and repeating the step S7 when the ion content value detected by the atomic absorption spectrophotometer is higher than a third set value; when the ion content value detected by the atomic absorption spectrophotometer is lower than a third set value, the cleaning work is finished;
wherein the first set value is greater than the second set value.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210941656.8A CN114985361B (en) | 2022-08-08 | 2022-08-08 | Automatic control cleaning device and control cleaning method for MEMS chip |
| PCT/CN2022/134790 WO2024031873A1 (en) | 2022-08-08 | 2022-11-28 | Device and method for automatically controlling cleaning of mems chip |
| GB2304383.9A GB2615659B (en) | 2022-08-08 | 2022-11-28 | Automatically controlled cleaning apparatus and controlled cleaning method for MEMS chip |
Applications Claiming Priority (1)
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| CN202210941656.8A CN114985361B (en) | 2022-08-08 | 2022-08-08 | Automatic control cleaning device and control cleaning method for MEMS chip |
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| CN114985361A true CN114985361A (en) | 2022-09-02 |
| CN114985361B CN114985361B (en) | 2022-10-28 |
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| WO (1) | WO2024031873A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024031873A1 (en) * | 2022-08-08 | 2024-02-15 | 国机传感科技有限公司 | Device and method for automatically controlling cleaning of mems chip |
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| WO2024031873A1 (en) | 2024-02-15 |
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