CN114980680A - Water-cooling heat dissipation power amplifier cabinet - Google Patents

Water-cooling heat dissipation power amplifier cabinet Download PDF

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Publication number
CN114980680A
CN114980680A CN202210621311.4A CN202210621311A CN114980680A CN 114980680 A CN114980680 A CN 114980680A CN 202210621311 A CN202210621311 A CN 202210621311A CN 114980680 A CN114980680 A CN 114980680A
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CN
China
Prior art keywords
water
cooling
interface
water inlet
cabinet
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Pending
Application number
CN202210621311.4A
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Chinese (zh)
Inventor
贾志鹏
梁毅
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Beijing Youwei Precision Measurement And Control Technology Research Co ltd
Beijing U Precision Tech Co Ltd
Original Assignee
Beijing U Precision Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Beijing U Precision Tech Co Ltd filed Critical Beijing U Precision Tech Co Ltd
Priority to CN202210621311.4A priority Critical patent/CN114980680A/en
Publication of CN114980680A publication Critical patent/CN114980680A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20627Liquid coolant without phase change
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20272Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention discloses a water-cooling heat dissipation power amplifier cabinet, which comprises a cabinet body and at least one water blocking box arranged in the cabinet body, wherein the water blocking box is arranged on the inner side surface of the cabinet body; the water cooling device comprises a plurality of layers of water cooling plates, wherein a cooling water channel is arranged in any one water cooling plate, a joint boss is arranged on the side surface of each water cooling plate, two ends of each cooling water channel extend to the joint boss to form a water inlet interface and a water return interface, and the joint bosses are hermetically arranged in the water retaining box; the cabinet body is provided with a total water inlet interface and a total water return interface, and the total water inlet interface and the total water return interface are used for supplying cooling water to each water-cooling plate through the water inlet interface and the water return interface of each joint boss through pipelines. The invention completely isolates the cooling water loop from the electric loop, and the water retaining box and the water collecting tray are both provided with the leakage detection belt, so that the water inlet valve can be cut off in time when the cooling water leaks, and the operation is safer and more reliable. Through the heat dissipation fins arranged at the bottom of the upper water cooling plate, small-range air circulation can be realized, and the temperature of the driver is reduced.

Description

Water-cooling heat dissipation power amplifier cabinet
Technical Field
The invention relates to the technical field of cabinet heat dissipation, in particular to a water-cooling heat dissipation power amplifier cabinet.
Background
With the rapid development of the chip industry, the integration level and the heating power of a power amplifier cabinet are higher and higher, the traditional heat pumping and exhausting method cannot solve the heat dissipation problems caused by the increasing heating power and the narrower and narrower heat dissipation space, so that the power amplifier cabinet needs to be cooled by adopting a water cooling mode, but the water cooling heat dissipation has better heat dissipation performance, and meanwhile, the leakage of a water cooling system also brings certain risks to electrical safety; the water cooling safety is considered, and the water cooling heat dissipation efficiency needs to be improved as much as possible according to the severe environmental requirements of the semiconductor industry; how to improve the water-cooling heat dissipation efficiency to the maximum extent, while keeping apart water route and circuit safely, the electric system of furthest protection is the difficult problem that water-cooling heat dissipation design has been.
However, in the prior art, there is no better scheme that can achieve both efficient cooling and water-electricity isolation, for example, in patent CN102548274A, air heat exchange is performed between the environment and the heat in the cabinet mainly through a pumping device, and the purpose of uniform heat dissipation in the electrical cabinet is achieved by means of reasonable arrangement of the air inlet and the air guide opening; the invention can be applied to the semiconductor industry, but the air heat exchange efficiency is not high, the heat dissipation requirement of a high-power driver is difficult to ensure, meanwhile, corresponding noise is necessarily generated by pumping and exhausting equipment, and the electromagnetic compatibility of the whole electric appliance cabinet can be influenced by the air inlet and the air guide opening which are arranged for achieving the purpose of uniform heat dissipation.
For example, patent CN111642117A discloses a liquid-cooled cabinet in the invention, which includes a cabinet unit, a plurality of carrying units and a liquid-cooled pipeline unit, wherein the carrying units are disposed inside the cabinet unit along a vertical direction, then, one side of an electronic device having an electrical adapter is exposed to a second side surface for placement, one side of the liquid-cooled board unit having a liquid inlet and a liquid outlet is exposed to a first side surface for placement, a wiring board is disposed adjacent to the second side surface, the first side surface is provided with a first liquid-cooled pipeline and a second liquid-cooled pipeline respectively communicated with the liquid-cooled board unit, and then the first liquid-cooled pipeline and the second liquid-cooled pipeline are communicated with an external liquid-cooled system, so as to perform liquid-cooled heat dissipation on the electronic device disposed in an accommodating space; thereby realize water and electricity separation, solved the cable that leads to when simply arranging electronic equipment and liquid cooling board in on the goods shelves and water-cooling pipeline overall arrangement chaotic technical problem to be difficult to cause water-cooling pipeline's leakage. However, in the invention, the cooling water loop and the electric loop are not thoroughly isolated, the cooling water pipeline joint has no protective measures for the inside and the outside of the cabinet, and potential safety hazards exist for the leakage of cooling water; the leakage detection is positioned at the bottom of the cabinet and needs to reach a certain liquid level, and the leakage alarm response is slow; the fault of a single case requires the removal of corresponding cooling water pipelines, and the replacement is inconvenient.
In conclusion, the existing cabinet water-cooling heat dissipation technology has no technical scheme for better solving the problems of high-efficiency water-cooling heat dissipation and water-electricity isolation.
Disclosure of Invention
In order to solve the above problems, the invention provides a water-cooling heat dissipation power amplifier cabinet, which comprises a cabinet body and at least one water blocking box arranged in the cabinet body, wherein the water blocking box is arranged on the inner side surface of the cabinet body;
the water cooling plate comprises a plurality of layers of water cooling plates, wherein a cooling water channel is arranged in any one water cooling plate, a joint boss is arranged on the side surface of each water cooling plate, two ends of each cooling water channel extend to the joint boss to form a water inlet interface and a water return interface, and the joint bosses are hermetically arranged in the water retaining box;
the cabinet body is provided with a total water inlet interface and a total water return interface, and the total water inlet interface and the total water return interface are used for supplying cooling water to each water-cooling plate through the water inlet interface and the water return interface of each joint boss through pipelines.
Optionally, the first circulating cooling pipeline connected with the total water inlet interface returns to the total water return interface through the water inlet interface and the water return interface of a part of the water cooling plates in sequence; and the second circulating cooling pipeline connected with the main water inlet interface returns to the main water return interface through the water inlet interface and the water return interface of the other part of the water cooling plate in sequence.
Optionally, the first circulating cooling pipeline, the second circulating cooling pipeline and the inlet end of the total inlet interface connection converge to the inlet main pipe, and the first circulating cooling pipeline, the second circulating cooling pipeline and the return end of the total return interface connection converge to the return main pipe.
Optionally, the total water inlet interface and the total water return interface of the cabinet are connected to the lower end of the cooling water inlet and outlet water manifold block through pipelines, the upper end of the cooling water inlet and outlet water manifold block is provided with a quick plug interface, and the total water inlet interface and the total water return interface are installed on the cooling water inlet and outlet water manifold block through the quick plug interface.
Optionally, the water blocking box includes an upper water blocking box and a lower water blocking box, the joint boss of one part of the water cooling plate is installed to the upper water blocking box, the joint boss of the other part of the water cooling plate is installed to the lower water blocking box, water leakage pipelines are arranged at the bottoms of the upper water blocking box and the lower water blocking box, the upper water blocking box is communicated to the lower water blocking box through the water leakage pipeline, and the water leakage pipeline of the lower water blocking box is communicated to the inside of the water collecting tray at the bottom of the outer side of the cabinet body.
Optionally, throttle valves are arranged on water inlet main pipes of the first circulating cooling pipeline and the second circulating cooling pipeline, and water flow sensors including temperature sensors and flow regulating valves are respectively installed on water return pipes of the first circulating cooling pipeline and the second circulating cooling pipeline.
Optionally, the upper water retaining box, the lower water retaining box and the water collecting tray are all provided with a leakage detection belt, a water inlet electromagnetic valve is arranged at the upstream of the throttle valve, the control system is connected with the water inlet electromagnetic valve, and the control system cuts off power supply of the power amplifier cabinet and closes the water inlet electromagnetic valve after monitoring a leakage signal or a disconnection signal.
Optionally, the lower end surface of each water cooling plate is provided with a heat radiation fin.
Optionally, the portion of the water chilling plate is used for installing the driver, and the other portion of the water chilling plate is used for installing the driver power supply device.
Optionally, a vertically through water gap is formed in the joint boss, an adapter plate is installed on one surface of the water gap, the adapter plate and the joint boss are sealed through a sealing ring, a pipe joint is arranged on the surface, back to the joint boss, of the adapter plate, and a blind plate for plugging the water gap on the side is installed on the other surface of the water gap.
The joint bosses of the water cooling plate are arranged in the sealed water retaining box in a centralized manner, so that the cooling water loop and the electric loop are completely isolated, the water cooling plate formed in an integrated manner is in direct contact with the driver, and the heat dissipation efficiency is higher. The leaked cooling water is guided to the water collecting box at the bottom of the cabinet body through the guide pipe between the water blocking boxes, so that the influence caused by leakage is reduced; the water blocking box and the water collecting box are internally provided with the leakage detection belt, so that cooling water inlet and main power supply of the cabinet body can be cut off in time when cooling water leaks, and leakage alarming is sent out to prevent fault expansion. Through the heat dissipation fins arranged at the bottom of the upper water cooling plate, small-range air circulation can be realized, and the temperature of the driver is reduced.
Drawings
The above features and technical advantages of the present invention will become more apparent and readily appreciated from the following description of the embodiments thereof taken in conjunction with the accompanying drawings.
Fig. 1 is a schematic perspective view illustrating a water-cooling power amplifier cabinet according to an embodiment of the present invention;
FIG. 2 is a schematic view of a cooling water channel of a water-cooled plate according to an embodiment of the present invention;
FIG. 3 is a schematic diagram showing a cooling circuit according to an embodiment of the present invention;
FIG. 4 is a first schematic view showing the connection of the water-cooled panels according to the embodiment of the present invention;
FIG. 5 is a second schematic view showing the connection of the water-cooled panels according to the embodiment of the present invention;
fig. 6 is a schematic connection diagram of a total water inlet and return interface according to an embodiment of the present invention.
Detailed Description
The embodiments of the present invention will be described below with reference to the accompanying drawings. Those of ordinary skill in the art will recognize that the described embodiments can be modified in various different ways, or combinations thereof, without departing from the spirit and scope of the present invention. Accordingly, the drawings and description are illustrative in nature and not intended to limit the scope of the claims. Furthermore, in the present description, the drawings are not drawn to scale and like reference numerals designate like parts.
The water-cooling heat dissipation power amplifier cabinet of this embodiment, as shown in fig. 1, the cabinet adopts the layered design, including the cabinet body, and set up at the internal retaining box of cabinet, multilayer water-cooling plate 22 from top to bottom. Multiple layers of support frames may be provided inside the cabinet, with the water-cooled panels 22 being secured to each layer of support frame. Except for the lowest layer, the driver 21 can be placed on the water cooling plate 22 of each layer, and the driver 21 can be fixed on the water cooling plate 22 through a pressing device and kept in close contact with the water cooling plate 22, so that the heat dissipation efficiency of the water cooling plate is improved. The lowest water-cooling plate 22 can be used for placing driver power supply equipment, the lowest water-cooling plate and the driver power supply equipment can be integrated together, and the driver power supply equipment can be detached from the power amplifier cabinet.
The water blocking box is arranged on the inner side surface of the cabinet body, and in order to adapt to the structural form of the power amplifier cabinet, the upper water blocking box 231 and the lower water blocking box 232 are adopted in the embodiment, but the number of the water blocking boxes is not limited in the embodiment, and the water blocking box can also be an integral water blocking box, and the upper water blocking box 231 and the lower water blocking box 232 are taken as examples for description hereinafter. The upper water blocking box 231 is used for isolating a joint boss of a water cooling plate for radiating the driver; the lower water blocking box 232 is used for isolating a joint boss of the lowest water cooling plate which enables the power supply equipment of the driver to radiate heat; in order to improve the cooling effect, the water cooling plate can be a metal plate which is integrally processed and formed.
As shown in fig. 2, a cross-sectional view of the water-cooling plate 22 is provided with a cooling water channel 34, the cooling water channel 34 is bent and roundly arranged in the water-cooling plate 22, a joint boss 33 is arranged on a side surface of the water-cooling plate 22, two ends of the cooling water channel 34 extend to the joint boss 33 to form a water inlet interface 31 and a water return interface 32, cooling water enters the cooling water channel 34 through the water inlet interface 31, and flows through the cooling water channel 34 in the water-cooling plate 22 in a circulating manner and flows out from the water return interface 32, so as to achieve the purpose of reducing the temperature of the water-cooling plate 22.
The connector boss 33 of the water-cooling plate 22 for installing the driver is installed in the upper water retaining box 231, the connector boss 33 of the water-cooling plate 22 for installing the power supply equipment of the driver is installed in the lower water retaining box 232, the upper water retaining box 231 and the lower water retaining box 232 are in a sealing state in normal operation, specifically, the connector boss 9 and the pipeline connecting positions in the upper water retaining box 231 and the lower water retaining box 232 are provided with sealing rings to prevent water dripping, and in normal operation, the upper water retaining box 231 and the lower water retaining box 232 can be sealed, so that the purpose of completely isolating a water path from a circuit is realized. The area of the top end of the frame corresponding to the sealing box is provided with a total water inlet interface 5 and a total water return interface 4, and the total water inlet interface and the total water return interface are used for supplying cooling water for the water-cooling plates through pipelines.
More specifically, as shown in fig. 4, a vertically through water gap is formed in the joint boss 33, an adapter plate 331 is installed on one surface of the water gap, the adapter plate 331 can be fixed on the joint boss 33 through screws, one surface of the adapter plate is in contact with the joint boss 33, a groove is formed in the surface of the adapter plate, a sealing ring is installed in the groove, the two surfaces are in closer contact, a sealing effect is achieved, and a pipe joint is arranged on the other surface of the adapter plate and is used for being connected with a water pipeline. The other side of the water inlet can be provided with a blind plate 332 to seal the side water inlet. That is to say, the adapter plate can be installed to the cooling water inlet and the cooling water outlet of water-cooling board obverse and reverse, can select entry and export according to actual conditions, and the one side that does not need can use the blind plate to block. The water cooling plates 22 are installed through rubber pipelines, the joints of the pipelines and the adapter plates are installed in an interference fit mode, and the joints are fastened through hoops, so that the pipelines are installed more hermetically. Preferably, the pipe joint and the water pipeline can adopt a quick-connection plug design, can be plugged and pulled out under the condition of water passing, and cannot cause the overflow of cooling water.
The joint boss 33 is fixed through a boss mounting hole groove 334 of the water blocking box, and a mounting gap is sealed by using a sealing material; all pipelines of the cabinet are concentrated in the water retaining box, and the pipelines for installing the cooling system are greatly reduced while water and electricity are isolated, so that the integration level of the cabinet is higher.
Further, the bottom of the upper water blocking box 231 and the bottom of the lower water blocking box 232 are both provided with a water leakage pipeline 11, the upper water blocking box 231 leads cooling water which accidentally leaks in the upper water blocking box 231 to the lower water blocking box 232 through the water leakage pipeline 11, the bottom of the lower water blocking box 232 discharges the leaked cooling water to the water collecting tray 13 at the bottom of the outer side of the cabinet 1 through the water leakage pipeline 11, the water collecting tray 13 can be, for example, a pull-out type, and the water collecting tray 13 has enough capacity to contain all cooling water left in the cooling water loop after the cold water inflow is cut off.
Furthermore, the cooling water flows in a local internal circulation mode, and a first circulation cooling pipeline connected with the total water inlet interface 5 returns to the total water return interface through a water inlet interface and a water return interface of the water cooling plate at the upper part in sequence; and the second circulating cooling pipeline connected with the main water inlet interface returns to the main water return interface through the water inlet interface and the water return interface of the water cooling plate at the lower part in sequence. Specifically, the first circulating cooling pipeline includes a first water inlet pipeline 61 and a first water return pipeline 41 branched from the water inlet main pipe 51, the first water inlet pipeline 61 is connected to the water inlet interface of the lowest one of the water-cooled panels on the upper portion, and the first water return pipeline 41 is sequentially connected to the water outlet interface and the water inlet interface of the water-cooled panel on the upper portion from bottom to top until being connected to the total water return interface 4.
Similarly, the second circulating cooling line includes a second water inlet line 52 and a second water return line 42 branched from the water inlet main 51, and the second water inlet line 52 and the second water return line 42 are sequentially connected to the water-cooled plate at the lower part from top to bottom. And, the second return pipe 42 and the first return pipe 41 are collected to the return main pipe and then return to the total return water connection. The upper and lower water-cooling plates may be divided as needed.
The total water inlet interface 5 and the total water return interface 4 of the cabinet are fixedly connected to the cooling water inlet and outlet water manifold block 54 through threaded pipelines, the outer side of the cooling water inlet and outlet water manifold block 54 can be provided with fast plugging interfaces, the total water inlet joint and the total water return joint can be inserted into the outer side of the cooling water inlet and outlet water manifold block 54 through fast plugs, and plugging can be carried out under the condition of water flowing without causing cooling water overflow. The cooling water inlet and outlet manifold block 54 has corresponding flow channels therein, and the pipeline joint, the sensor and the valve are all mounted by interference fit and fastened by pipe hoops.
Furthermore, a throttle valve 7 is arranged on the water inlet main pipe 51, 1 water flow sensor 10 with a temperature sensor and a flow regulating valve is respectively arranged on 2 water return pipelines in the upper water retaining box 231 and the lower water retaining box 232, and a control system monitors the cooling water flow and the cooling water temperature at any time; when the total inflow flow of the cooling water needs to be adjusted, the flow of the throttle valve 7 in the upper water blocking box 231 is adjusted through the observation hole 8 of the power amplifier cabinet 1.
Further, the upper water blocking box 231, the lower water blocking box 232 and the water collecting tray 13 are all internally provided with a leakage detection zone 12, the water inlet main pipe 51 is provided with a water inlet electromagnetic valve 6 at the upstream of the throttle valve 7, leakage signals can be sent to the power amplifier cabinet 1 at the first time when any connector leaks, the leakage detection zone 12 signals are collected and processed by a control system in the power amplifier cabinet 1, and when the control system in the power amplifier cabinet 1 monitors leakage, the control system can cut off the water inlet electromagnetic valve 6 in the power amplifier cabinet 1 in time. The control system simultaneously collects the wire break signals and cuts off the power supply of the main loop in time after monitoring the wire break signals.
The heat dissipation fins are arranged below each layer of the water cooling plate 22, so that the utilization efficiency of the water cooling plate 22 is improved, heat dissipated from the top of the driver 21 can be dissipated, and small-range air circulation can be realized and the temperature of the driver 21 is reduced through the heat dissipation fins arranged at the bottom of the upper layer of the water cooling plate.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (10)

1. A water-cooling heat dissipation power amplifier cabinet is characterized by comprising a cabinet body and at least one water blocking box arranged in the cabinet body, wherein the water blocking box is arranged on the inner side surface of the cabinet body;
the water cooling device comprises a plurality of layers of water cooling plates, wherein a cooling water channel is arranged in any one water cooling plate, a joint boss is arranged on the side surface of each water cooling plate, two ends of each cooling water channel extend to the joint boss to form a water inlet interface and a water return interface, and the joint bosses are hermetically arranged in the water retaining box;
the cabinet body is provided with a total water inlet interface and a total water return interface, and the total water inlet interface and the total water return interface are used for supplying cooling water to each water-cooling plate through the water inlet interface and the water return interface of each joint boss through pipelines.
2. The water-cooling heat dissipation power amplifier cabinet of claim 1, wherein the first circulating cooling pipeline connected with the total water inlet interface returns to the total water return interface through the water inlet interface and the water return interface of a part of the water-cooling plate in sequence; and the second circulating cooling pipeline connected with the main water inlet interface returns to the main water return interface through the water inlet interface and the water return interface of the other part of the water cooling plate in sequence.
3. The water-cooling heat dissipation power amplifier cabinet of claim 2, wherein the water inlet ends of the first and second circulating cooling pipelines connected to the total water inlet interface are converged into a water inlet main pipe, and the water return ends of the first and second circulating cooling pipelines connected to the total water return interface are converged into a water return main pipe.
4. The water-cooling heat dissipation power amplifier cabinet according to any one of claims 1 to 3, wherein the total water inlet interface and the total water return interface of the cabinet are connected to the lower end of the cooling water inlet/outlet manifold block through pipelines, the upper end of the cooling water inlet/outlet manifold block is provided with a quick plug interface, and the total water inlet joint and the total water return joint are mounted on the cooling water inlet/outlet manifold block through the quick plug interfaces.
5. The cabinet according to any one of claims 2 to 3, wherein the water-cooling heat dissipation power amplifier cabinet comprises an upper water retaining box and a lower water retaining box, the connector bosses of a part of the water cooling plates are mounted to the upper water retaining box, the connector bosses of another part of the water cooling plates are mounted to the lower water retaining box, water leakage pipelines are arranged at the bottoms of the upper water retaining box and the lower water retaining box, the upper water retaining box is communicated to the lower water retaining box through the water leakage pipelines, and the water leakage pipeline of the lower water retaining box is communicated to the inside of a water collecting tray at the bottom of the outer side of the cabinet body.
6. The cabinet according to claim 5, wherein a throttle valve is disposed on the water inlet main pipe of the first and second circulating cooling pipelines, and a water flow sensor including a temperature sensor and a flow control valve is disposed on the water return pipe of the first and second circulating cooling pipelines.
7. The water-cooling heat dissipation power amplifier cabinet according to claim 6, wherein the upper water blocking box, the lower water blocking box and the water collecting tray are all provided with a leakage detection zone, a water inlet electromagnetic valve is arranged at the upstream of the throttle valve, the control system is connected with the water inlet electromagnetic valve, and the control system cuts off power supply of the power amplifier cabinet and closes the water inlet electromagnetic valve after monitoring a leakage signal or a disconnection signal.
8. The cabinet according to claim 1, wherein the lower end of each water-cooled plate is provided with heat dissipating fins.
9. The cabinet according to claim 2, wherein the one portion of the water-cooled panels is used for installing the driver, and the other portion of the water-cooled panels is used for installing the driver power supply device.
10. The cabinet for a water-cooled heat dissipation power amplifier according to claim 1, wherein the joint boss is provided with a vertically through water gap, one surface of the water gap is provided with an adapter plate, the adapter plate and the joint boss are sealed by a sealing ring, one surface of the adapter plate opposite to the joint boss is provided with a pipe joint, and the other surface of the water gap is provided with a blind plate for plugging the water gap on the side.
CN202210621311.4A 2022-06-02 2022-06-02 Water-cooling heat dissipation power amplifier cabinet Pending CN114980680A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210621311.4A CN114980680A (en) 2022-06-02 2022-06-02 Water-cooling heat dissipation power amplifier cabinet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210621311.4A CN114980680A (en) 2022-06-02 2022-06-02 Water-cooling heat dissipation power amplifier cabinet

Publications (1)

Publication Number Publication Date
CN114980680A true CN114980680A (en) 2022-08-30

Family

ID=82960178

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210621311.4A Pending CN114980680A (en) 2022-06-02 2022-06-02 Water-cooling heat dissipation power amplifier cabinet

Country Status (1)

Country Link
CN (1) CN114980680A (en)

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Effective date of registration: 20230907

Address after: 100176 floor 2, building 2, yard 19, Kechuang 10th Street, economic and Technological Development Zone, Daxing District, Beijing (Yizhuang group, high-end industrial area, Beijing Pilot Free Trade Zone)

Applicant after: BEIJING U-PRECISION TECH Co.,Ltd.

Applicant after: Beijing Youwei Precision Measurement and Control Technology Research Co.,Ltd.

Address before: 100176 floor 2, building 2, yard 19, Kechuang 10th Street, economic and Technological Development Zone, Daxing District, Beijing (Yizhuang group, high-end industrial area, Beijing Pilot Free Trade Zone)

Applicant before: BEIJING U-PRECISION TECH Co.,Ltd.