CN114980510A

CN114980510A - System for bluetooth module circuit board

Info

Publication number: CN114980510A
Application number: CN202210698901.7A
Authority: CN
Inventors: 王浚霖
Original assignee: Victory Concept Industries Co ltd
Current assignee: Victory Concept Industries Co ltd
Priority date: 2022-06-20
Filing date: 2022-06-20
Publication date: 2022-08-30

Abstract

The invention relates to a system for a Bluetooth module circuit board, which comprises a circuit board and an integrated circuit, wherein a top signal layer of the circuit board comprises an adjacent antenna area and a semiconductor packaging area, an antenna pattern is formed by a metal conductive material positioned in the antenna area, the semiconductor packaging area is provided with an IC pad and a plurality of pads electrically connected with the IC pad, the antenna pattern is coupled to one of the pads close to the antenna area, and the integrated circuit is bonded to the IC pad of the circuit board through a ball grid array.

Description

System for bluetooth module circuit board

Technical Field

The present invention relates generally to circuit boards and, in particular embodiments, to a system for bluetooth module circuit boards.

Background

Due to rapid advances in semiconductor technology and communication technology, the demand for integrated circuits including bluetooth modules (bluetooth modules include a bluetooth chip and an antenna) is increasing. The transceiving distance of the current integrated circuit comprising the Bluetooth module is about 15-20 meters, and particularly, the transceiving distance is reduced by half or even not to reach a distance of 10 meters when barriers (such as solid walls, metal blocks and the like) exist, so that the communication transmission at a longer distance cannot be realized. And the integrated circuit including the bluetooth module at present adopts half-hole technology encapsulation basically, so the interference killing feature is relatively poor.

Disclosure of Invention

According to one embodiment, a Top signal Layer (Top Layer) of a circuit board includes adjacent antenna areas and semiconductor package areas. The metal conductive material located in the antenna area forms an antenna pattern. The semiconductor package region is provided with an Integrated Circuit (IC) pad for bonding an IC to the circuit board through a Ball Grid Array (BGA), and a plurality of pads electrically connected to the IC pad, wherein the pads correspond to interface pins (interface pins) for Radio Frequency (RF) input or output on the IC. The antenna pattern is coupled to one of the pads near the antenna area.

In order to avoid other interference sources from influencing the receiving and transmitting of signals, an antenna pattern is integrated on a top signal layer of the circuit board, the antenna pattern formed by metal conductive materials has the effect similar to a high-frequency receiving coil, so that the receiving of the signals is realized, and the antenna pattern is coupled to the bonding pads, so that the received signals are directly connected to the vicinity of interface pins of the IC, the distance is short, the probability of being interfered is greatly reduced, and the integrity of the signals is ensured, so that the circuit can decode accurately.

According to the testing method of international bluetooth, the bluetooth module system provided by the embodiment can realize the transceiving distance of more than 20M, and even realize good receiving and transmitting actions at the distance of 36M, and has high response speed when independently powered and operated in an open environment.

Drawings

For a more complete understanding of the present invention and the advantages thereof, reference is now made to the detailed description and accompanying drawings, in which:

FIG. 1a illustrates a front view of an embodiment of a Bluetooth module system;

FIG. 1b illustrates a bottom view of an embodiment of a Bluetooth module system;

FIG. 2 illustrates a detailed layout view of the top signal layers of an embodiment circuit board.

Corresponding reference characters and symbols in the various drawings indicate corresponding parts, unless otherwise indicated. The drawings are drawn for clarity of illustrating relevant aspects of the embodiments and are not necessarily to scale.

Detailed Description

The making and using of various embodiments are discussed in detail below. However, it should be understood that the various embodiments described herein may be applied in a wide variety of specific environments. The specific embodiments discussed are merely illustrative of specific ways to make and use the various embodiments and should not be construed in a limited sense.

According to one embodiment, the circuit board is provided with via holes in the semiconductor package area, the via holes including a through via (via) extending from the top conductive layer to the bottom conductive layer of the circuit board, and a blind via extending from one side of the circuit board to the middle conductive layer.

In one embodiment, the antenna pattern of the antenna area of the circuit board includes an antenna and a transmission line, the antenna being coupled to the pad through the transmission line. The connection of the transmission line to the pad may be surrounded by a via to ensure a low impedance path between the top conductive layer of the circuit board layer and the bottom conductive layer of the circuit board proximate the transmission line. In physically tight and crowded areas of the circuit board, the diameter of the vias may be reduced to maintain coupling between the top and bottom conductive layers.

In one embodiment, several vias are disposed on the IC pad, and these vias disposed on the IC pad can perform the dual duties of migrating heat from the IC and promoting High Frequency (HF) transitions.

Fig. 1a and 1b show schematic diagrams of an embodiment of a bluetooth module system comprising an IC 102 and a circuit board 101, wherein the IC 102 may be any type of chip, wafer or circuit package. In various embodiments, IC 102 includes analog or digital circuitry for transmitting and receiving signals through an antenna, which may be included in circuit board 101.

Fig. 2 shows a layout view of the top signal layers of an embodiment circuit board 101 for a bluetooth module system. The top signal layer of the circuit board 101 includes an antenna area 300 and a semiconductor package area 200, an IC pad 201 is disposed in the semiconductor package area 200, and a plurality of pads 202 electrically connected to the IC pad 201, and a BGA (not shown) provides a connection between the circuit board 101 and the IC 102 and may include solder balls (solder balls) providing electrical and thermal connections. In some embodiments, IC 102 is a flip-chip (BGA) bonded to semiconductor package region 300. To dissipate heat generated in the IC 102, a thermal connection with solder balls is provided. The semiconductor package region 300 includes a metal conductive material therein to form an antenna pattern, the antenna pattern includes an antenna 301 and a transmission line 302 which are integrally connected, and the antenna 301 is coupled to one of the pads 202 in the semiconductor package region 200 through the transmission line 302. Pads 202 within semiconductor package area 200 correspond to interface pins on the IC for RF input or output.

As shown in fig. 2, the transmission line 302 is a differential signal line; however, in alternative embodiments, the transmission line 302 may be implemented as a single-ended transmission line. In some embodiments, bluetooth signals are transmitted or received on circuit board 101 through IC 102. The circuit board 101 also includes a via 400.

According to various embodiments, where bluetooth signals propagating in space are received or transmitted through the antenna 301, in some embodiments, disposing the via 400 adjacent to the contact portion of the transmission line 302 and the pad 202 may have the following functions: (1) the function of the via hole is electromagnetic shielding; (2) the function of the via hole is to thermally couple the heat-generating components on the top surface of the circuit board 101 to the bottom surface of the circuit board 101; and (3) the via hole provides a ground plane to be firmly coupled to a ground connection. As shown in fig. 2, the plurality of vias 400 form a via fence (via enclosure) or a via fence (via fence) around a contact portion between the transmission line 302 and the pad 202.

The IC pads 201 shown in fig. 2 correspond to the locations of the ICs 102 on the circuit board 101 in fig. 1 a. In various embodiments, an IC die or die stack may be bonded to the IC pad 201. The IC pad 201 may be used as a contact point (contact point) for attaching the BGA, thereby bonding a chip or an IC on the IC pad 201. A number of vias 203 are provided on the IC pad 201. According to various embodiments, the vias 203 may transfer thermal energy from the top surface of the circuit board 200 to the bottom surface of the circuit board 200.

The materials of the IC pad 201, the pad 202, the antenna 301, and the transmission line 302 shown in fig. 2 are all metallic conductive materials (e.g., copper) of an electrical wiring (electrical routing). In various embodiments, the sidewalls of via 400 are plated with a metallic conductive material.

In various embodiments, the circuit board 101 may be implemented with a series of layers, including layers of conductive material (e.g., copper) and laminates (such as high frequency laminates), specifically, the materials and thicknesses of the layers may be selected to: (1) having a suitable stiffness, (2) providing good bluetooth signal performance, (3) providing good electrical performance, and (4) maintaining cost effectiveness. The laminate may be implemented as a fiberglass and epoxy laminate.

According to one embodiment, a bluetooth module system includes a circuit board having IC pads, and an antenna pattern, and an integrated circuit. In this embodiment, the IC pads are configured to be coupled to an integrated circuit, the pads include signal pads configured to be coupled to an antenna pattern, and the plurality of vias are disposed adjacent to the signal pads.

All possible combinations of the technical features of the above embodiments may not be described for the sake of brevity, but should be considered as within the scope of the present disclosure as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. A circuit board is characterized in that a top signal layer of the circuit board comprises an antenna area and a semiconductor packaging area which are adjacent, wherein a metal conductive material positioned in the antenna area forms an antenna pattern, the semiconductor packaging area is provided with an IC pad and a plurality of pads which are electrically connected with the IC pad, and the antenna pattern is coupled to one of the pads close to the antenna area.

2. The circuit board of claim 1, wherein the antenna pattern comprises an integrally connected antenna and a transmission line, the antenna being coupled to one of the pads in the semiconductor package region through the transmission line.

3. The circuit board of claim 2, wherein the contact portions of the transmission line and the pad are adjacently disposed vias.

4. The circuit board of claim 4, wherein the IC pads have vias disposed thereon.

5. A Bluetooth modular system comprising the circuit board of any of claims 1-4 and an integrated circuit, the integrated circuit being bonded to the IC pads of the circuit board by a ball grid array.