CN114975217A - Support piece for improving deformation of substrate - Google Patents
Support piece for improving deformation of substrate Download PDFInfo
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- CN114975217A CN114975217A CN202210446631.0A CN202210446631A CN114975217A CN 114975217 A CN114975217 A CN 114975217A CN 202210446631 A CN202210446631 A CN 202210446631A CN 114975217 A CN114975217 A CN 114975217A
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- substrate
- negative pressure
- support
- adsorption
- deformation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention belongs to the technical field of precision manufacturing equipment, and particularly relates to a support member for improving deformation of a substrate, which is used for supporting the substrate in a precision etching process, wherein the support member is an annular support member and is used for supporting the substrate from the peripheral edge part of the substrate, and an adsorption part is arranged at the contact part of the support member and the substrate; the adsorption part is used for eliminating edge warping generated after the substrate is placed on the support. The invention improves the deformation of the thin substrate caused by the action of gravity, compensates the influence of the gravity on the effective area of the substrate by applying the adsorption force or pressure on the edge of the substrate, prevents the deformation of the edge area of the substrate, ensures the structural resolution and uniformity of the substrate and improves the processing efficiency of the substrate.
Description
Technical Field
The invention belongs to the technical field of precision manufacturing equipment, and particularly relates to a supporting piece for improving deformation of a substrate.
Background
In a precision etching process, a wafer or substrate is usually placed on a flat support table, and the substrate is uniformly adsorbed on the support table by vacuum adsorption. If the active area of the substrate has been provided with the sensing structure or has not been processed, the substrate may be damaged or contaminated by impurity particles in the active area during the vacuum adsorption process.
In order to overcome the above problems and avoid damage or contamination of the active area of the substrate, it has been currently proposed to support the substrate at its inactive area (peripheral edge). In this case, since the substrate is supported only in the narrow region of the edge, the active region is in a suspended state, and the substrate may be bent downward by gravity to different degrees according to the thickness, size and rigidity of the substrate. During etching, the substrate may be deformed to cause the distance between the photomask and the substrate in different regions, which may result in too low structure resolution and non-uniformity, resulting in reduced yield.
The existing substrate supporting method mostly adopts a method of edge region supporting, which can avoid the damage and pollution of the substrate during vacuum adsorption, but the edge supporting method can deform the center of the substrate under the action of gravity, so that the distance between the photomask and the substrate is changed, the too low structural resolution and non-uniformity are caused, and the yield and efficiency are affected. This deformation is greater, particularly for thinner substrates.
Disclosure of Invention
In view of the above, the present invention provides a support for improving deformation of a substrate, which improves deformation of a thin substrate caused by gravity, compensates an effect of gravity on an effective area of the substrate by applying an adsorption force or pressure to an edge of the substrate, prevents deformation from occurring in the edge area of the substrate, ensures structural resolution and uniformity of the substrate, and improves processing efficiency.
In order to achieve the technical purpose, the invention adopts the following specific technical scheme:
a supporter for improving deformation of a substrate is used for supporting the substrate in a precision etching process, the supporter is an annular supporter and is used for supporting the substrate from the peripheral edge part of the substrate, and a contact part of the supporter and the substrate is provided with an adsorption part; the adsorption part is used for eliminating edge warping generated after the substrate is placed on the support.
Further, the adsorption part is a negative pressure adsorption tank.
Furthermore, from the diffusion direction of the gravity center point of the substrate, the adsorption force rule of the negative pressure adsorption groove on the substrate is increased.
Furthermore, the negative pressure adsorption tanks are in a plurality of groups; the adsorption part generates negative pressure at the negative pressure adsorption groove based on a negative pressure device and an air guide pipe; the negative pressure device is used for generating gas negative pressure and is connected with the negative pressure adsorption tanks based on the gas guide pipes.
Furthermore, the adsorption force of the negative pressure adsorption groove on the substrate increases gradually from the diffusion direction of the gravity center point of the substrate.
Further, the negative pressure device is respectively connected with the negative pressure adsorption tanks based on the plurality of air guide pipes.
Furthermore, each negative pressure adsorption groove is annularly distributed on the support piece.
Further, the width of the negative pressure adsorption groove is 0.5-1.5 mm.
Furthermore, the adsorption force of each negative pressure adsorption groove can be adjusted according to the surface type of the substrate.
Further, the support further comprises a plurality of fastening screw holes, each fastening screw hole for fixing the support into the lithographic apparatus.
By adopting the technical scheme, the invention can bring the following beneficial effects:
1) the invention does not introduce extra support, can avoid unnecessary damage and pollution of the base plate;
2) the process adjusting process is simple, and the processing efficiency can be effectively improved;
3) the invention can compensate the deformation of the effective area of the substrate by changing the adsorption pressure, and can effectively improve the processing yield.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic view of a support member supporting a substrate for improving substrate deformation according to an embodiment of the present invention;
FIG. 2 is a structural diagram of a support for improving substrate deformation without supporting a substrate according to an embodiment of the present invention;
FIG. 3 is a partially enlarged view of the structure of the negative pressure adsorption tank according to the embodiment of the present invention;
FIG. 4 is a diagram illustrating a comparison between the deformation states of the substrate and the quartz substrate in the state where the suction force of 1bar and the suction force of 0 bar are applied to each negative pressure suction groove in the embodiment of the present invention;
FIG. 5 is a graph showing the relationship between different adsorption forces and the maximum deformation of a quartz substrate according to an embodiment of the present invention;
FIG. 6 is a schematic view of the connection between each negative pressure adsorption tank and the negative pressure device according to the embodiment of the present invention;
wherein: 1. a substrate; 2. a support member; 3. fastening screw holes; 4. a negative pressure adsorption tank; 5. a gas-guide tube; 6. a negative pressure device.
Detailed Description
Embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and effects of the present invention will be easily understood by those skilled in the art from the disclosure of the present specification. It should be apparent that the described embodiments are only some embodiments of the present invention, and not all embodiments. The invention is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention. It is to be noted that the features in the following embodiments and examples may be combined with each other without conflict. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It is noted that various aspects of the embodiments are described below within the scope of the appended claims. It should be apparent that the aspects described herein may be embodied in a wide variety of forms and that any specific structure and/or function described herein is merely illustrative. Based on the disclosure, one skilled in the art should appreciate that one aspect described herein may be implemented independently of any other aspects and that two or more of these aspects may be combined in various ways. For example, an apparatus may be implemented and/or a method practiced using any number of the aspects set forth herein. Additionally, such an apparatus may be implemented and/or such a method may be practiced using other structure and/or functionality in addition to one or more of the aspects set forth herein.
It should be noted that the drawings provided in the following embodiments are only for illustrating the basic idea of the present invention, and the drawings only show the components related to the present invention rather than the number, shape and size of the components in practical implementation, and the type, quantity and proportion of the components in practical implementation can be changed freely, and the layout of the components can be more complicated.
In addition, in the following description, specific details are provided to facilitate a thorough understanding of the examples. However, it will be understood by those skilled in the art that the aspects may be practiced without these specific details.
In one embodiment of the present invention, a support for improving substrate deformation is provided for supporting a substrate 1 during a precision etching process, as shown in fig. 1 and 2, the support 2 is an annular support 2 for supporting the substrate 1 from a peripheral edge portion of the substrate 1, and a contact portion with the substrate 1 is provided with a suction portion; the suction portion is used to eliminate edge warpage generated after the substrate 1 is placed on the support 2.
In this embodiment, the substrate 1 is wafer-level glass or the like for precision etching, the support 2 is provided with a support portion matching with the peripheral edge shape of the non-edge region of the substrate 1, and the support portion is supported by surface contact or line contact in a manner different from a narrow region in multipoint contact;
the high accuracy requirement of accurate etching process, base plate 1 need carry out the accurate positioning before the etching process and during the etching process, consequently this embodiment should not adopt glue to adsorb, moreover because the edge warpage of base plate 1 is little warpage, base plate 1 can produce strain deformation in fixed modes such as mechanical fastening, the skew, the deformation of base plate 1 can aggravate at mechanical fastening base plate 1 edge, consequently the absorption portion of this embodiment is flexible absorption, and the specific mode this embodiment of flexible absorption does not do the restriction.
In one embodiment, the suction portion is a negative pressure suction groove 4. The negative pressure adsorption groove 4 of the embodiment is arranged on the supporting part of the supporting part 2, and generates continuous adsorption force after the positioning of the substrate 1 is completed; the adsorption force needs to be uniform, and the edge of the substrate 1 is ensured not to generate warping which is not beneficial to photoetching accurate positioning. Meanwhile, the vector of the suction force needs to keep the center of gravity of the substrate 1 unaffected when the substrate 1 is sucked. The adsorption surface of the negative pressure adsorption tank 4 of the embodiment is annularly distributed or sectionally arranged; the shape is a geometrical shape such as a polygon, a circle, etc., and the specific shape of the adsorption surface is not limited in this embodiment.
In one embodiment, the suction force of the negative pressure suction groove 4 increases regularly in the diffusion direction from the center point of gravity of the substrate 1. Since the edge warpage of the substrate 1 is caused by self-gravity, the more distant the substrate 1 is placed on the support 2, the more severe the warpage of the region from the center of gravity of the substrate 1; the adsorption force of the negative pressure adsorption groove 4 of the embodiment sets a specific increase rule that the adsorption force is far away from the gravity center point of the substrate 1 according to the gravity center point of the specific substrate 1 and the specific shape of the substrate 1, and ensures that the edge warpage of the substrate 1 is eliminated.
In one embodiment, the negative pressure adsorption tanks 4 are in a plurality of groups; the adsorption part generates negative pressure at the negative pressure adsorption tank 4 based on the negative pressure device 6 and the air duct 5; the negative pressure device 6 is used for generating gas negative pressure and is connected with each negative pressure adsorption tank 4 based on each gas guide pipe 5. The negative pressure adsorption tanks 4 of this embodiment are arranged into a plurality of groups on the basis of the functions completed according to the above embodiments, and the gas ducts 5 are used to transmit the gas negative pressure respectively or in groups, so as to complete the "increase of the adsorption force rule of the negative pressure adsorption tanks 4" in the above embodiments.
In one embodiment, the suction force of each negative pressure suction groove 4 increases in the direction extending outward from the central region of the substrate 1. The specific distribution of the shapes of the negative pressure adsorption grooves 4 in this embodiment is as shown in fig. 2 and 3, and a plurality of adsorption grooves with strip-shaped adsorption surfaces are adopted, and a plurality of groups of adsorption grooves parallel or extending to each other are arranged on the whole adsorption surface of one edge of the substrate 1, so as to ensure that the adsorption surface of the edge can be fully covered. It should be noted that, when the shape of one edge of the substrate 1 is not a straight line, the arrangement of the suction grooves is rated according to the specific shape of the edge, and it is necessary to ensure that the suction surface of the edge can be sufficiently covered. In the present embodiment, the negative pressure suction grooves 4 extending from the center of the substrate 1 to the near side and the far side increase the suction force in a sequential increasing manner.
In one embodiment, as shown in fig. 6, the negative pressure device 6 is connected to each negative pressure adsorption tank 4 based on a plurality of air ducts 5. In this embodiment, in order to reduce the manufacturing cost and the control cost, one negative pressure device 6 is used to connect all the negative pressure adsorption tanks 4.
In one embodiment, the negative pressure adsorption grooves 4 are annularly distributed on the support 2. In one embodiment, the substrate is a quartz substrate, and the support 2 has two key structures, namely a fastening screw hole 3 and a negative pressure adsorption groove 4. As shown in fig. 1 and 2, fig. 3 is an enlarged view of the negative pressure adsorption tank 4. Wherein the fastening screw holes 3 are used for fixing the support 2 to the table of the lithography machine, which is not shown in this embodiment since it plays a role. The negative pressure adsorption groove 4 is used for vacuum adsorption when the quartz substrate 1 is lapped on the support member 2, and deformation of the thin quartz substrate caused by gravity can be effectively improved through the vacuum adsorption effect of the negative pressure adsorption groove 4.
In order to more intuitively show that the deformation of the thin quartz substrate can be significantly improved by the vacuum adsorption of the negative pressure adsorption tank 4, this embodiment analyzes the deformation of the quartz substrate 1 by a finite element simulation method. In this embodiment, the quartz substrate 1 has a size of 240mm × 6mm, wherein the effective area is 210mm × 210mm, the outside of the effective area overlaps the support 2, and 7 negative pressure adsorption grooves 4 having a width of 1mm are formed at the edge of the support.
Under the action of gravity, the maximum deformation of an effective area of the quartz substrate 1 with the thickness of 6mm is 731.6nm under the action of no vacuum adsorption force; when the quartz substrate 1 was subjected to a vacuum adsorption force of 1bar by the negative pressure adsorption tank 4, the maximum deformation of the effective region of the quartz substrate 1 was 287.3nm, which was reduced by 60.7%, as shown in fig. 4.
This embodiment gives the relationship between the different adsorption forces and the maximum deformation of the quartz substrate 1, as shown in fig. 5. The relationship between the maximum deformation ymm of the quartz substrate 1 and the adsorption force xbar is: y-0.0034 x + 0.2933. Therefore, when the adsorption force is about 86bar, the deformation of the quartz substrate 1 in the effective area due to the gravity action is close to zero, and meanwhile, the adsorption force of each negative pressure adsorption groove is adjustable according to the surface type of the substrate.
Therefore, the method can estimate the processes of the substrates with different thicknesses in advance, prevent the deformation of the substrate supported in the edge area, ensure the structural resolution and uniformity of the substrate, and improve the processing efficiency.
The above description is only for the specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. A support member for improving deformation of a substrate, for supporting the substrate in a precision etching process, wherein the support member is an annular support member for supporting the substrate from an outer peripheral edge portion of the substrate, and a contact portion with the substrate is provided with an adsorption portion; the adsorption part is used for eliminating edge warping generated after the substrate is placed on the support.
2. The support for improving deformation of a substrate of claim 1, wherein: the adsorption part is a negative pressure adsorption groove.
3. The support for improving deformation of a substrate of claim 2, wherein: and the adsorption force rule of the negative pressure adsorption groove on the substrate is increased from the diffusion direction of the gravity center point of the substrate.
4. The support for improving deformation of a substrate of claim 3, wherein: the negative pressure adsorption tanks are in a plurality of groups; the adsorption part generates negative pressure at the negative pressure adsorption groove based on a negative pressure device and an air guide pipe; the negative pressure device is used for generating gas negative pressure and is connected with the negative pressure adsorption tanks based on the gas guide pipes.
5. The support for improving deformation of a substrate of claim 4, wherein: and the adsorption force of the negative pressure adsorption groove on the substrate increases progressively from the diffusion direction of the gravity center point of the substrate.
6. The support for improving deformation of a substrate of claim 5, wherein: the negative pressure device is respectively connected with the negative pressure adsorption tanks based on the air guide pipes.
7. The support for improving deformation of a substrate of claim 6, wherein: each negative pressure adsorption groove is annularly distributed on the support piece.
8. The support for improving deformation of a substrate of claim 7, wherein: the width of the negative pressure adsorption groove is 0.5-1.5 mm.
9. The support for improving deformation of a substrate of claim 8, wherein: the adsorption force of each negative pressure adsorption groove can be adjusted according to the surface shape of the substrate.
10. A support for improving deformation of a substrate according to any of claims 1-9, wherein: the support member further comprises a plurality of fastening screw holes, each of which is used for fixing the support member to precision manufacturing equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210446631.0A CN114975217A (en) | 2022-04-26 | 2022-04-26 | Support piece for improving deformation of substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210446631.0A CN114975217A (en) | 2022-04-26 | 2022-04-26 | Support piece for improving deformation of substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114975217A true CN114975217A (en) | 2022-08-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210446631.0A Pending CN114975217A (en) | 2022-04-26 | 2022-04-26 | Support piece for improving deformation of substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114975217A (en) |
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2022
- 2022-04-26 CN CN202210446631.0A patent/CN114975217A/en active Pending
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