CN114975158A - Cleaning device and chemical mechanical polishing device - Google Patents
Cleaning device and chemical mechanical polishing device Download PDFInfo
- Publication number
- CN114975158A CN114975158A CN202110195144.7A CN202110195144A CN114975158A CN 114975158 A CN114975158 A CN 114975158A CN 202110195144 A CN202110195144 A CN 202110195144A CN 114975158 A CN114975158 A CN 114975158A
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- cleaning
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- cleaning brush
- particle
- swing arm
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- 238000004140 cleaning Methods 0.000 title claims abstract description 143
- 239000000126 substance Substances 0.000 title claims abstract description 15
- 238000005498 polishing Methods 0.000 title claims abstract description 12
- 239000002245 particle Substances 0.000 claims abstract description 139
- 238000009826 distribution Methods 0.000 claims abstract description 55
- 238000004891 communication Methods 0.000 claims abstract description 12
- 238000012544 monitoring process Methods 0.000 claims abstract description 7
- 230000007246 mechanism Effects 0.000 claims description 16
- 239000012459 cleaning agent Substances 0.000 claims description 10
- 238000005406 washing Methods 0.000 claims description 7
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 12
- 238000000034 method Methods 0.000 description 7
- 239000008187 granular material Substances 0.000 description 6
- 230000006870 function Effects 0.000 description 3
- 230000033001 locomotion Effects 0.000 description 3
- 230000015654 memory Effects 0.000 description 3
- 239000012530 fluid Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000007517 polishing process Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 210000000078 claw Anatomy 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
-
- B08B1/12—
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- B08B1/20—
-
- B08B1/32—
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/022—Cleaning travelling work
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention provides a cleaning device and a chemical mechanical polishing device. And a cleaning brush component is also arranged on the supporting structure and comprises a cleaning brush for cleaning the surface of the wafer. And a particle monitor is arranged on the supporting structure and used for monitoring the particle distribution condition of the surface of the wafer. The wafer particle distribution monitoring system further comprises a controller which is in communication connection with the particle monitor to receive the wafer particle distribution information sent by the particle monitor. And the controller is also in communication connection with the cleaning brush assembly so as to control the cleaning brush assembly to directly clean the particles on the surface of the wafer according to the received particle distribution information of the wafer, thereby improving the cleaning effect and the overall yield.
Description
Technical Field
The invention relates to the technical field of semiconductor manufacturing, in particular to a cleaning device and a chemical mechanical polishing device.
Background
As memories such as DRAM (Dynamic Random Access Memory) are integrated and downsized, the density of circuit structures inside the memories is gradually increased, and the line width of metal lines forming the circuit structures and the distance between two adjacent metal lines are also gradually decreased. The resulting small-sized defects also gradually have a large impact on the yield of the finished memory. In the chemical mechanical polishing process, the surface of the wafer is first subjected to chemical mechanical polishing. After the chemical mechanical polishing is finished, the surface of the wafer needs to be cleaned to remove the contaminants and residual particles on the surface of the wafer. In the prior art, when the wafer is cleaned, the wafer rotates, and the cleaning brush repeatedly moves from the center to the edge for cleaning.
Disclosure of Invention
The invention provides a cleaning device and a chemical mechanical polishing device, which are used for controlling a cleaning brush component to directly clean particles on the surface of a wafer according to the monitored particle distribution condition on the surface of the wafer, so that the cleaning effect is improved, and the overall yield is improved.
In a first aspect, the present invention provides a cleaning apparatus comprising a support structure, and a turntable disposed on the support structure for holding a wafer thereon. And a cleaning brush component is also arranged on the supporting structure and comprises a cleaning brush for cleaning the surface of the wafer. And a particle monitor is arranged on the supporting structure and used for monitoring the particle distribution condition of the surface of the wafer. The wafer particle distribution monitoring system further comprises a controller which is in communication connection with the particle monitor to receive the wafer particle distribution information sent by the particle monitor. And the controller is also in communication connection with the rotating table and the cleaning brush assembly so as to control the cleaning brush assembly to directly clean the particles on the surface of the wafer according to the received particle distribution information of the wafer.
In the above solution, the particle monitor is arranged, the particle monitor monitors particle distribution information on the surface of the wafer, and then the particle monitor is sent to the controller, and the controller controls the cleaning brush assembly to directly clean the particles on the surface of the wafer according to the received particle distribution information on the wafer. Compared with the prior art, the method has the advantages that only after the cleaning brush is repeatedly moved from the center to the edge of the wafer for cleaning, the subsequent procedures are directly carried out, after the cleaning, the particle distribution information on the surface of the wafer is monitored through the particle monitor to monitor whether particles exist on the surface of the wafer, and the cleaning brush assembly is controlled by the controller to directly clean the particles on the surface of the wafer according to the monitored particle distribution information, so that the cleaning effect is improved, and the overall yield is improved.
In one embodiment, the particle distribution information includes particle distribution position information, particle size information, and particle distribution density information of the wafer surface.
In a specific embodiment, a cleaning cavity is further arranged on the supporting structure, and the rotating platform and the cleaning brush assembly are both positioned in the cleaning cavity. And the cleaning cavity is provided with an opening, and the wafer is put into or taken out of the cleaning cavity through the opening. A particle monitor is mounted at the opening to monitor particle distribution information of the wafer surface.
In one specific embodiment, the cleaning brush assembly further comprises a nozzle embedded in the cleaning brush and used for spraying cleaning agent to the surface of the wafer so as to clean particles which can not be cleaned only by the cleaning brush.
In a specific embodiment, the cleaning brush has a disk shape, and the nozzle is embedded in the central position of the cleaning brush, so as to improve the effect of removing particles on the surface of the wafer through the cleaning brush and the cleaning agent.
In a specific embodiment, the support structure is further provided with a swing arm mechanism capable of swinging in a plane parallel to the surface of the wafer, and the cleaning brush is mounted on the swing arm mechanism.
In one embodiment, the swing arm mechanism includes a hollow swing arm, and a first driving unit that drives the swing arm to swing in a plane parallel to a surface of the wafer. Wherein, the first drive unit is connected with the controller in a communication way. The cleaning brush is assembled at the end part of the swing arm, and a supply pipe communicated with the nozzle for supplying the nozzle with cleaning agent is arranged in the swing arm in a penetrating way. The feeding pipe is arranged in the hollow swing arm in a penetrating mode, so that the feeding pipe is prevented from influencing the movement of the cleaning brush and the swing arm mechanism.
In a specific embodiment, the cleaning brush is slidably mounted on the swinging arm, and the sliding direction of the cleaning brush relative to the swinging is vertical to the surface of the wafer. And a second driving unit for driving the cleaning brush to slide on the swing arm is further arranged on the swing arm, and the second driving unit is in communication connection with the controller.
In a second aspect, the present invention further provides a chemical mechanical polishing apparatus, which includes any one of the above cleaning apparatuses.
In the above solution, the particle monitor is arranged, the particle monitor monitors particle distribution information on the surface of the wafer, and then sends the particle monitor to the controller, and the controller controls the cleaning brush assembly to directly clean the particles on the surface of the wafer according to the received particle distribution information on the wafer. Compared with the prior art, the method has the advantages that only after the cleaning brush is repeatedly moved from the center to the edge of the wafer for cleaning, the subsequent procedures are directly carried out, after the cleaning, the particle distribution information on the surface of the wafer is monitored through the particle monitor to monitor whether particles exist on the surface of the wafer, and the cleaning brush assembly is controlled by the controller to directly clean the particles on the surface of the wafer according to the monitored particle distribution information, so that the cleaning effect is improved, and the overall yield is improved.
In a particular embodiment, the support structure is further provided with a loading portion, the particle monitor being mounted at the loading portion location. So that the particle monitor can monitor the particle distribution on the surface of the wafer.
Drawings
Fig. 1 is a schematic structural diagram of a cleaning apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic view of a cleaning brush according to an embodiment of the present invention and a wafer in one state;
FIG. 3 is a schematic view of a cleaning brush and a nozzle for cleaning a surface of a wafer according to an embodiment of the present invention;
fig. 4 is a flowchart of the operation of the cleaning apparatus according to the embodiment of the present invention.
Reference numerals:
10-wafer 11-turntable 12-clamping structure
20-cleaning brush 21-nozzle 22-supply tube
30-particle monitor 40-controller
50-swing arm 51-first drive unit 60-particle
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
For convenience of understanding the cleaning apparatus provided in the embodiment of the present invention, an application scenario of the cleaning apparatus provided in the embodiment of the present invention for cleaning a wafer that has just undergone chemical mechanical polishing is described below. The cleaning device will be described in detail with reference to the accompanying drawings.
Referring to fig. 1, a cleaning apparatus according to an embodiment of the present invention includes a support structure (not shown), and a turntable 11 disposed on the support structure and configured to hold a wafer 10 thereon. When the supporting structure is arranged, the supporting structure is a structure with a supporting function, such as a frame structure, a support structure and the like. A turntable 11 is disposed on the support structure, and the turntable 11 can rotate relative to the support structure to rotate the wafer 10. Referring to fig. 1, the rotary stage 11 may include a disc-shaped supporting stage and a driving motor for driving the supporting stage to rotate at a fixed point along an axis of the supporting stage, and the driving motor drives the supporting stage to rotate so as to drive the wafer 10 to rotate. With continued reference to fig. 1, a clamping structure 12 for clamping the wafer 10 may be provided on the turntable 11 so as to hold the wafer 10 on the turntable 11 and prevent the wafer 10 from being thrown out when the turntable 11 rotates. When the holding structure 12 is provided, a holding claw may be employed as the holding structure 12.
Referring to fig. 1, 2 and 3, a cleaning brush assembly including a cleaning brush 20 for cleaning a surface of the wafer 10 is further provided on the support structure. When the brush 20 is provided, referring to fig. 1, 2, and 3, the shape of the brush 20 may be a disk shape. With continued reference to fig. 1, a particle monitor 30 is also disposed on the support structure, the particle monitor 30 being configured to monitor a particle distribution on the surface of the wafer 10. And a controller 40 is also provided, wherein the controller 40 is communicatively connected to the turntable 11 and the particle monitor 30 to receive the particle distribution information of the wafer 10 sent by the particle monitor 30. And the controller 40 is also in communication with the cleaning brush assembly to control the cleaning brush assembly to directly clean the particles on the surface of the wafer 10 according to the received particle distribution information of the wafer 10. By providing the particle monitor 30, the particle monitor 30 monitors the particle distribution information of the surface of the wafer 10, and then the particle monitor 30 is sent to the controller 40, and the controller 40 controls the cleaning brush assembly to directly clean the particles on the surface of the wafer 10 according to the received particle distribution information of the wafer 10.
Compared with the prior art in which only the cleaning brush is repeatedly moved from the center to the edge of the wafer for cleaning and then the subsequent processes are directly performed, in the scheme of the application, after cleaning, the particle distribution information on the surface of the wafer 10 is monitored through the particle monitor 30 to monitor whether particles exist on the surface of the wafer 10, and the controller 40 controls the cleaning brush assembly to directly clean the particles on the surface of the wafer 10 according to the monitored particle distribution information, so that the cleaning effect is improved, and the overall yield is improved.
Referring to fig. 1, 2 and 3, the cleaning brush assembly may further include a nozzle 21 embedded in the cleaning brush 20 for spraying a cleaning agent to the surface of the wafer 10, so as to clean particles that cannot be cleaned only by the cleaning brush 20, thereby improving the cleaning effect and the cleaning efficiency. The cleaning agent may be a cleaning liquid or a cleaning gas. The cleaning fluid may be a chemical cleaning fluid. When the brush 20 has a disk shape, the nozzle 21 may be fitted to the center of the brush 20 in order to improve the effect of removing particles on the surface of the wafer 10 by the brush 20 and the cleaning agent. When the granules are cleaned according to the information on the distribution positions of the granules monitored by the granule monitor 30, as shown in fig. 3, a cleaning agent is first sprayed to the granules 60 through the nozzle 21, and then the granules 60 are cleaned by the cleaning brush 20 to remove the granules 60, thereby improving the cleaning effect and the cleaning quality.
Referring to fig. 1, a swing arm mechanism capable of swinging in a plane parallel to the surface of the wafer 10 may be further disposed on the support structure, and the cleaning brush 20 is mounted on the swing arm mechanism, and the swing arm mechanism drives the cleaning brush 20 to move, so as to clean different positions on the surface of the wafer 10. When specifically provided, the swing arm mechanism may include a hollow swing arm 50, and a first driving unit 51 that drives the swing arm 50 to swing in a plane parallel to the surface of the wafer 10. The washing brush 20 is fitted at an end position of the swing arm 50, and a supply tube 22 communicating with the nozzle 21 to supply the nozzle 21 with the cleaning agent is perforated in the swing arm 50. The supply tube 22 is inserted into the hollow swing arm 50, thereby preventing the supply tube 22 from affecting the movement of the brush 20 and the swing arm mechanism. When the first driving unit 51 is provided, the first driving unit 51 may be a driving motor. And the first driving unit 51 is in communication connection with the controller 40, so that the controller 40 controls the swinging arm mechanism to drive the cleaning brush 20 for fine adjustment by sending a control signal to the first driving unit 51. It should be understood that the mechanism for moving the cleaning brush 20 is not limited to the above-described swing arm mechanism, and other motion mechanisms capable of moving the cleaning brush 20 to clean different positions on the surface of the wafer 10 can be adopted.
It is also possible to have the brush 20 slidably fitted to the swing arm 50 with the sliding direction of the brush 20 relative to the swing being perpendicular to the surface of the wafer 10. The swing arm 50 is further provided with a second driving unit for driving the washing brush 20 to slide on the swing arm 50. When the second driving unit is provided, the second driving unit may be a driving motor to drive the washing brush 20 to slide in the up and down direction with respect to the swing arm 50. And the second driving unit is communicatively connected to the controller 40 so that the controller 40 sends a control signal to the second driving unit to control the washing brush 20 to move up and down.
When the controller 40 is provided, a device having a control function such as an industrial personal computer or a mobile terminal may be used as the controller 40.
In addition, a cleaning chamber may be provided on the supporting structure, and the rotating table 11 and the cleaning brush assembly are both located in the cleaning chamber. The cleaning chamber may also have an opening through which the wafer 10 is placed into or removed from the cleaning chamber.
When the particle monitor 30 monitors the particle distribution on the surface of the wafer 10, the particle distribution information includes the particle distribution position information, the particle size information, and the particle distribution density information on the surface of the wafer 10, that is, the particle distribution position, the particle size, and the particle distribution density on the surface of the wafer 10 are monitored by the particle monitor 30, and when the rework cleaning is performed, the cleaning brush 20 can be directly used to clean the particles on the position, so that the surface of the wafer 10 does not need to be cleaned completely, and the cleaning efficiency and the cleaning quality are improved. And different cleaning modes can be selected according to the particle size and the particle distribution density to remove the particles on the surface of the wafer 10. The particle monitor 30 may specifically be constituted by a camera device having an identification function. Additionally, a particle monitor 30 may be mounted at the opening to facilitate monitoring particle distribution information about the surface of the wafer 10. It should be understood that the position of the particle monitor 30 is not limited to the above-described embodiment, and may be set at other positions. For example, the particle monitor 30 may also be disposed inside the wash chamber.
When the communication connection between the rotary table 11, the first driving unit 51, and the second driving unit and the controller 40 is implemented, the controller 40 may be connected to the rotary table 11, the first driving unit 51, and the second driving unit in a wired manner, so as to improve the stability of the transmission of the control signal. Of course, a wireless connection mode may also be adopted, for example, a bluetooth connection mode may be adopted.
In operation, as shown in fig. 4, a chemical mechanical polishing process is performed on the surface of the wafer 10, and then the cleaning apparatus in the embodiment of the present application is used to clean the surface of the wafer 10. Specifically, the entire surface of the wafer 10, that is, the entire surface of the wafer 10 is cleaned by the brush 20. Then, the particle monitor 30 monitors the surface of the wafer 10 to monitor whether particles are still on the surface of the wafer 10, and obtains the position information, the size information and the density information of the particle distribution. Thereafter, the wafer 10 is placed on the turntable 11, and the cleaning brush 20 directly cleans the particles at the position information acquired by the particle monitor 30, so as to improve the cleaning efficiency and the cleaning effect.
By providing the particle monitor 30, the particle monitor 30 monitors the particle distribution information of the surface of the wafer 10, and then the particle monitor 30 is sent to the controller 40, and the controller 40 controls the cleaning brush assembly to directly clean the particles on the surface of the wafer 10 according to the received particle distribution information of the wafer 10. Compared with the prior art in which only the cleaning brush is repeatedly moved from the center to the edge of the wafer for cleaning and then the subsequent processes are directly performed, in the scheme of the application, after cleaning, the particle distribution information on the surface of the wafer 10 is monitored by the particle monitor 30 to monitor whether particles exist on the surface of the wafer 10, and the controller 40 controls the cleaning brush assembly to directly clean the particles on the surface of the wafer 10 according to the monitored particle distribution information, so that the cleaning effect is improved.
In addition, the embodiment of the invention also provides a chemical mechanical polishing device which comprises any one cleaning device. By providing the particle monitor 30, the particle monitor 30 monitors the particle distribution information of the surface of the wafer 10, and then the particle monitor 30 is sent to the controller 40, and the controller 40 controls the cleaning brush assembly to directly clean the particles on the surface of the wafer 10 according to the received particle distribution information of the wafer 10. Compared with the prior art in which only the cleaning brush is repeatedly moved from the center to the edge of the wafer for cleaning and then the subsequent processes are directly performed, in the scheme of the application, after cleaning, the particle distribution information on the surface of the wafer 10 is monitored through the particle monitor 30 to monitor whether particles exist on the surface of the wafer 10, and the controller 40 controls the cleaning brush assembly to directly clean the particles on the surface of the wafer 10 according to the monitored particle distribution information, so that the cleaning effect is improved, and the overall yield is improved.
A load port may also be provided on the support structure where the particle monitor 30 is mounted to facilitate monitoring of the particle distribution on the surface of the wafer 10 by the particle monitor 30. Specifically, the loading portion may be disposed at an opening of the cleaning chamber so that the particle monitor 30 can monitor the particle distribution on the surface of the wafer 10.
The above description is only for the specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. A cleaning device, comprising:
a support structure;
a rotary table disposed on the support structure for holding a wafer thereon;
the cleaning brush assembly is arranged on the supporting structure and comprises a cleaning brush for cleaning the surface of the wafer;
a particle monitor disposed on the support structure for monitoring particle distribution information of the wafer surface;
a controller communicatively coupled to the particle monitor to receive particle distribution information of the wafer sent by the particle monitor; and the controller is also in communication connection with the rotating table and the cleaning brush component so as to control the cleaning brush component to directly clean the particles on the surface of the wafer according to the received particle distribution information of the wafer.
2. The cleaning apparatus of claim 1, wherein the particle distribution information comprises particle distribution location information, particle size information, and particle distribution density information of the wafer surface.
3. The cleaning apparatus defined in claim 1, wherein the support structure further comprises a cleaning chamber, the turntable and the cleaning brush assembly being located in the cleaning chamber;
the cleaning cavity is provided with an opening, and the wafer is put into or taken out of the cleaning cavity through the opening; the particle monitor is mounted at the opening.
4. The cleaning apparatus as recited in claim 1, wherein the cleaning brush assembly further comprises a nozzle embedded within the cleaning brush for spraying cleaning agent onto the surface of the wafer.
5. The washing apparatus as recited in claim 4, wherein the washing brush has a shape of a disk, and the nozzle is fitted to a central position of the washing brush.
6. The cleaning apparatus according to claim 4, wherein a swing arm mechanism capable of swinging in a plane parallel to the surface of the wafer is further provided to the support structure, and the cleaning brush is mounted on the swing arm mechanism.
7. The cleaning apparatus defined in claim 6, wherein the swing arm mechanism comprises:
a hollow swing arm;
the first driving unit drives the swing arm to swing in a plane parallel to the surface of the wafer, and the first driving unit is in communication connection with the controller;
wherein the cleaning brush is assembled at the end position of the swing arm; and a supply pipe which is communicated with the nozzle and supplies cleaning agent to the nozzle is arranged in the swing arm in a penetrating way.
8. The cleaning apparatus as claimed in claim 7, wherein said cleaning brush is slidably mounted on said swinging arm, and a sliding direction of said cleaning brush with respect to said swinging arm is perpendicular to a surface of said wafer;
still be provided with the drive on the swing arm the cleaning brush is in gliding second drive unit on the swing arm, just second drive unit with controller communication connection.
9. A chemical mechanical polishing apparatus comprising the cleaning apparatus according to any one of claims 1 to 8.
10. The chemical mechanical polishing apparatus of claim 9, wherein a loading portion is further provided on the support structure, the particle monitor being mounted at the loading portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110195144.7A CN114975158A (en) | 2021-02-20 | 2021-02-20 | Cleaning device and chemical mechanical polishing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110195144.7A CN114975158A (en) | 2021-02-20 | 2021-02-20 | Cleaning device and chemical mechanical polishing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114975158A true CN114975158A (en) | 2022-08-30 |
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ID=82954273
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110195144.7A Pending CN114975158A (en) | 2021-02-20 | 2021-02-20 | Cleaning device and chemical mechanical polishing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114975158A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116329151A (en) * | 2023-05-30 | 2023-06-27 | 沈阳和研科技股份有限公司 | Packaged brush cleaning device and cleaning method |
-
2021
- 2021-02-20 CN CN202110195144.7A patent/CN114975158A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116329151A (en) * | 2023-05-30 | 2023-06-27 | 沈阳和研科技股份有限公司 | Packaged brush cleaning device and cleaning method |
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