CN114963682A - Semiconductor second grade circulation refrigeration insulation can - Google Patents
Semiconductor second grade circulation refrigeration insulation can Download PDFInfo
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- CN114963682A CN114963682A CN202210564748.9A CN202210564748A CN114963682A CN 114963682 A CN114963682 A CN 114963682A CN 202210564748 A CN202210564748 A CN 202210564748A CN 114963682 A CN114963682 A CN 114963682A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 117
- 238000005057 refrigeration Methods 0.000 title claims abstract description 73
- 238000009413 insulation Methods 0.000 title claims abstract description 13
- 239000000498 cooling water Substances 0.000 claims abstract description 49
- 238000004321 preservation Methods 0.000 claims abstract description 34
- 238000001816 cooling Methods 0.000 claims abstract description 31
- 230000000694 effects Effects 0.000 claims abstract description 15
- 238000005086 pumping Methods 0.000 claims abstract description 9
- 229920000742 Cotton Polymers 0.000 claims abstract description 8
- 238000002347 injection Methods 0.000 claims description 12
- 239000007924 injection Substances 0.000 claims description 12
- 238000007789 sealing Methods 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 7
- 229910001220 stainless steel Inorganic materials 0.000 claims description 5
- 239000010935 stainless steel Substances 0.000 claims description 5
- 230000005540 biological transmission Effects 0.000 claims description 4
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- 238000001704 evaporation Methods 0.000 claims description 3
- 230000008020 evaporation Effects 0.000 claims description 3
- 230000002146 bilateral effect Effects 0.000 claims description 2
- 238000000034 method Methods 0.000 claims description 2
- 239000003507 refrigerant Substances 0.000 description 7
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 4
- 230000006835 compression Effects 0.000 description 4
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- 238000009835 boiling Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
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- 238000004880 explosion Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000009423 ventilation Methods 0.000 description 2
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- 241000533950 Leucojum Species 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 230000005679 Peltier effect Effects 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
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Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D31/00—Other cooling or freezing apparatus
- F25D31/005—Combined cooling and heating devices
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
- F25B21/04—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect reversible
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D17/00—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces
- F25D17/04—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating air, e.g. by convection
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D23/00—General constructional features
- F25D23/06—Walls
- F25D23/065—Details
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D29/00—Arrangement or mounting of control or safety devices
- F25D29/003—Arrangement or mounting of control or safety devices for movable devices
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D29/00—Arrangement or mounting of control or safety devices
- F25D29/005—Mounting of control devices
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D2201/00—Insulation
- F25D2201/10—Insulation with respect to heat
- F25D2201/14—Insulation with respect to heat using subatmospheric pressure
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B40/00—Technologies aiming at improving the efficiency of home appliances, e.g. induction cooking or efficient technologies for refrigerators, freezers or dish washers
Abstract
The invention relates to a semiconductor secondary circulation refrigeration heat preservation box, and belongs to the technical field of mobile refrigeration heat preservation. The device comprises a semiconductor refrigeration system, a vacuum-pumping shell, an internal cooling system, a high-energy light rechargeable battery and a dynamic function display panel; the vacuum-pumping shell comprises a vacuum box and a vacuum cover, and the semiconductor refrigeration system comprises a semiconductor and a semiconductor refrigerator; a bottom space is arranged between the bottom plate of the vacuum box and the bottom of the heat insulation box, and the high-energy light rechargeable battery and the semiconductor refrigerator are arranged in the bottom space; a primary cooling water tank is arranged at the bottom of the semiconductor refrigerator, and primary cooling water and degraded wet-warm cotton are arranged in the primary cooling water tank; the invention can effectively solve the problems of large influence of ambient temperature on the refrigeration temperature of the semiconductor refrigerator, low heat preservation effect, heavy weight of the refrigerator, high noise and the like.
Description
Technical Field
The invention relates to a semiconductor secondary circulation refrigeration heat preservation box, and belongs to the technical field of mobile refrigeration heat preservation.
Background
In the technical field of mobile refrigeration and heat preservation, heat preservation boxes, (vehicle-mounted) refrigerators and the like are widely applied to automobiles, yachts, medical treatment and the like in many developed and developing countries and become part of fast travel modes of people. With the generation and development of various high and new technologies and the application of new materials in the field of (vehicle-mounted) refrigerators, the overall product structure of the refrigerator is improved, the production process is continuously improved, and the working efficiency of the (vehicle-mounted) refrigerator is greatly improved.
The current refrigerators are mainly classified into the following categories according to the difference of refrigeration principles: 1. compression type refrigerator: the refrigerating system of the refrigerator is made by using the principle that a refrigerant with a boiling point lower than the boiling point is changed into steam in an evaporator to absorb heat. 2. An absorption refrigerator: the purpose of refrigeration is achieved by using an electric heating element as power and using a mode of continuously absorbing heat for diffusion by using the ammonia-water-hydrogen mixed solution, the refrigeration efficiency is low, and the cooling speed is relatively slow. 3. A semiconductor refrigerator: the refrigerator is also called as a thermoelectric refrigerator, and utilizes a P-N junction formed by special semiconductor materials to form a thermoelectric couple pair, generates a Peltier effect and utilizes direct current to refrigerate.
The refrigerator based on the three-point refrigeration principle mainly has the following technical limitations: 1. the refrigerants widely used in compression refrigerators at present are liquid ammonia and freon. The liquid ammonia refrigerant has low cost, poor temperature control effect, large weight of the compressor, unsuitability for moving and turnover use, easy volatilization and diffusion of liquid ammonia, strong pungent smell, damage to respiratory tract and skin mucosa of human body and certain damage to human health. When the concentration of ammonia in the air reaches a certain degree, the probability of explosion phenomenon when encountering open fire is high, and the explosion phenomenon has great danger, so that strict leakage prevention work needs to be done. Utilize freon refrigerant to work, improved security and refrigeration efficiency, but the noise is big, bulky, with high costs to freon gives off can cause serious pollution to the ozone layer in the air. 2. The absorption refrigerator is silent and free of fluorine, alternating current and direct current or gas, water and the like can be used as energy sources, but the refrigeration efficiency is low, the cost is high, and the power consumption is large. The absorption refrigerator and the compression refrigerator have a common limitation that the refrigerator body needs to be kept flat, and the working effect of the refrigerator body is easily influenced once the refrigerator body is inclined or inverted. 3. The semiconductor refrigerator does not need a refrigerant, and is green and environment-friendly; the device has no mechanical transmission structure, and has low noise, no abrasion and long service life during working; the refrigerating temperature can be adjusted by changing the current, and the flexibility is high. However, as a relatively new technology, there still exist some disadvantages to be overcome, such as large working current, low refrigeration efficiency at large capacity, large heat productivity, high requirement for heat dissipation conditions, and low heat preservation efficiency; the refrigeration speed is lower than that of compression type and absorption type equipment, and the refrigeration effect is required to be further improved.
Semiconductor refrigeration is one of the promising energy-saving and environment-friendly technologies in the refrigeration field, the heating function can be realized by shifting the anode and the cathode, the technical limit is broken through, and the temperature to be reached can be accurately set, so that the semiconductor refrigeration can play a higher role in the portable refrigeration and heat preservation field. In order to overcome the technical limitations, innovative technical directions should be focused on improving the refrigeration effect of the semiconductor refrigerator (adding a first-stage refrigeration before the semiconductor refrigeration), improving the working heat dissipation condition of the semiconductor refrigerator, taking measures to improve the temperature control performance of the semiconductor refrigerator, and the like.
Disclosure of Invention
In order to overcome the defects of the refrigerator designed based on the three traditional refrigeration technologies, the invention provides a semiconductor two-stage circulating refrigeration heat-preservation box, which is used for solving the problems that the refrigeration temperature of the semiconductor refrigerator is greatly influenced by the environmental temperature, the heat-preservation effect is lower, the weight of the refrigerator is heavy, the noise is high and the like.
In order to achieve the purpose, the invention provides the following technical scheme:
a semiconductor secondary circulation refrigeration heat preservation box comprises a semiconductor refrigeration system, a vacuumizing shell, an internal cold dissipation system, a high-energy light rechargeable battery and a dynamic function display panel;
the vacuum-pumping shell comprises a vacuum box and a vacuum cover, the vacuum box and the vacuum cover are respectively formed by a negative pressure cavity and a negative pressure support filled by a honeycomb-like hexagonal material, and a negative pressure cavity is defined between adjacent negative pressure supports;
the semiconductor refrigerating system comprises a semiconductor and a semiconductor refrigerator; the semiconductor is arranged on the upper surface of the bottom plate of the vacuum box and is connected with the semiconductor refrigerator at the lower part;
a bottom space is arranged between the bottom plate of the vacuum box and the bottom of the vacuum-pumping shell, and the high-energy light rechargeable battery and the semiconductor refrigerator are arranged in the bottom space; the high-energy light rechargeable battery is also connected with a charger; the semiconductor refrigerator is connected with the high-energy light rechargeable battery and the dynamic function display panel and is used for realizing temperature control; a primary cooling water tank is mounted at the bottom of the semiconductor refrigerator, primary cooling water and primary cooling wet cotton are arranged in the primary cooling water tank, the primary cooling wet cotton is soaked in the primary cooling water, and the outside of the primary cooling water tank is communicated with the outside of the vacuumizing shell through a primary cooling water injection pipe;
the internal cooling dissipation system comprises a cross flow fan, an external motor and a guide plate; bearings extend out of the cross flow fan and the external motor, fan magnets are mounted at the end portions of the bearings of the cross flow fan, motor magnets are mounted at the end portions of the bearings of the external motor, the motor magnets are located right below the fan magnets, the cross flow fan and the external motor are separated and fixed through sealing plates, and the sealing plates are arranged among holes of a bottom plate of the vacuum box; and flow guide plates are arranged on the outer sides of the cross flow fan and the semiconductor in the vacuum box.
Furthermore, when the cooling device is used, the external motor drives the motor magnet to rotate, the fan magnet is driven to rotate through magnetic force, and then the cross-flow fan is driven to rotate through the bearing, so that shaftless magnetic transmission is realized, the external motor is prevented from being wet, meanwhile, the cross-flow fan is protected by the flow guide plate, circulating flow cooling dissipation is realized, and frosting and damage of the semiconductor refrigerator are prevented; in addition, when the semiconductor refrigerator is used, the primary cooling water is injected into the primary cooling water tank through the primary cooling water injection pipe, the air above the primary cooling water tank is cooled through the evaporation of the primary cooling water to form primary cooling air, and then the primary cooling air is sucked into the semiconductor refrigerator through a cooling fan in the semiconductor refrigerator to take away the heat in the semiconductor refrigerator, so that the refrigeration is realized; and the first-stage cooling water in the first-stage cooling water tank is volatilized with higher speed under the action of a cooling fan of the semiconductor refrigerator, more heat of the semiconductor refrigerator is taken away, the refrigerating effect of the semiconductor refrigerator is improved, and the effect of reducing the refrigerating temperature by secondary circulation refrigeration is finally realized.
Further, the fan magnet and the motor magnet have the same diameter.
Further, the semiconductor refrigerator comprises two semiconductors and two semiconductor refrigerators; the high-energy light rechargeable battery and the charger are two.
Furthermore, each semiconductor refrigerator, each high-energy light rechargeable battery and each charger are correspondingly arranged and connected to form a group of semiconductor refrigeration equipment, and the two groups of semiconductor refrigeration equipment are arranged in the bottom space of the heat preservation box in a bilateral symmetry mode.
Further, a first-stage cooling water injection port is arranged on the outer side of the first-stage cooling water injection pipe.
Furthermore, a heating key and a refrigerating key are further arranged on the dynamic function display panel.
Further, the vacuumizing shell is a double-layer stainless steel shell.
Furthermore, a hidden handle is arranged on the left side of the vacuum cover, and the right side of the vacuum cover is connected with the vacuum box through a pivot; the dynamic function display panel is arranged at the top of the vacuum box and is opposite to the hidden handle; and a ventilation opening is formed in the lower part of the front side of the vacuum box.
Furthermore, the external motor and the motor magnet are arranged in the hole of the bottom plate of the vacuum box and are positioned at the lower part of the sealing plate.
Compared with (vehicle-mounted) refrigerators, heat-preservation boxes and the like in the prior art, the invention has the following advantages:
1. the heat preservation box adopts semiconductor refrigeration, does not need refrigerant refrigeration, does not worry about danger caused by refrigerant leakage, is not afraid of bumping, saves energy and protects environment; the volume of the heat insulation box can be freely controlled by matching two semiconductor refrigerators;
2. according to the heat preservation box, the stainless steel shell is vacuumized in a double-layer mode, the box cover is vacuumized, heat conduction is isolated, the heat preservation performance of the refrigerator is greatly enhanced compared with that of a traditional refrigerator, meanwhile, the thickness and the weight of the heat preservation box shell are reduced, and the effective internal volume is increased;
3. the vacuum-pumping shell of the insulation can is internally supported by negative pressure, so that the deformation of stainless steel materials caused by vacuum pumping is prevented, and the bionic honeycomb hexagonal structure material is adopted for filling, so that the insulation can has the advantages of high heat-preservation coefficient, high mechanical strength, good bearing performance and raw material saving;
4. the heat insulation box is provided with the internal cold dissipation system, so that the problem that the service life of a motor is shortened due to poor working conditions of a freezing chamber is solved, and a certain refrigeration effect is improved;
5. the cooling system in the heat insulation box adopts shaftless magnetic transmission, and through the arrangement of the external motor with the magnet and the internal through-flow fan with the magnet, perforation is not needed, so that the phenomena that the motor is wet and easily damaged in the box are avoided, the air channel of the through-flow fan is wide, the air speed and the air quantity are uniformly distributed, and the whole refrigeration effect is improved.
6. The insulation can is additionally provided with the primary cooling wet cotton and the primary cooling water cooling air, cold air enters the semiconductor refrigeration cooling system, the refrigeration effect of the semiconductor secondary system is improved by reducing the temperature of the air entering the semiconductor refrigerator, and the refrigeration temperature is reduced;
7. the functional display panel of the incubator is an intelligent display screen, and dynamic display is carried out on the screen: heating, solar luminescence, refrigeration and snowflake rotation;
8. the refrigeration structure semiconductor of the insulation can be used for a heating function by transposition of the anode and the cathode of a power supply, so that refrigeration and heating double choices are realized, and the technical limit is broken through;
9. the incubator of the invention is equipped with high-energy light batteries. The refrigerator can be charged for power storage, can work uninterruptedly in the moving process, overcomes the limitation that the traditional refrigerator can only work under the condition of being connected with a power supply, and realizes uninterrupted work without an external power supply in moving.
The semiconductor secondary circulation refrigeration heat preservation box has precise design and control principle, and is intelligent and convenient to operate. Compared with the traditional semiconductor refrigerator, the refrigerator has the advantages that the working efficiency is improved, the refrigeration effect is enhanced, the heat preservation performance is good, the mechanical strength is high, uninterrupted work without external power supply in moving is realized, a plurality of defects of the traditional refrigerator are overcome, and a new idea and a new way are provided for technical innovation of a novel insulation can.
Drawings
FIG. 1 is a schematic view of a semiconductor two-stage circulation refrigeration incubator of the present invention;
FIG. 2 is a cross-sectional view corresponding to the position of section P in FIG. 1;
FIG. 3 is a cross-sectional view A-A of FIG. 2;
fig. 4 is a sectional view taken along line B-B of fig. 2.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-4, the semiconductor two-stage circulation refrigeration heat preservation box of the present invention includes a semiconductor refrigeration system, a vacuum shell, an internal cooling system, a high-energy light rechargeable battery 71 and a dynamic function display panel 92. The vacuum-pumping shell is a double-layer stainless steel shell and comprises a vacuum box 21 and a vacuum cover 23, the vacuum box 21 and the vacuum cover 23 are both internally composed of a negative pressure cavity 41 and negative pressure supports 42 filled with honeycomb-like hexagonal materials, and a negative pressure cavity 41 is defined between every two adjacent negative pressure supports 42.
The semiconductor refrigeration system includes a semiconductor 11 and a semiconductor refrigerator 12. The semiconductor 11 is disposed on the upper surface of the bottom plate of the vacuum box 21 and is connected to the lower semiconductor refrigerator 12.
As shown in fig. 2-3, a bottom space is provided between the bottom plate of the vacuum box 21 and the bottom of the heat insulation box, and a high-energy light rechargeable battery 71 and a semiconductor refrigerator 12 are provided in the bottom space. A charger 72 is also connected to the high-energy lightweight rechargeable battery 71. The semiconductor refrigerator 12 is connected to the high-energy light rechargeable battery 71 and the dynamic function display panel 92 for temperature control, and the dynamic function display panel 92 may further be provided with a heating key and a cooling key for switching between heating and cooling. The bottom of the semiconductor refrigerator 12 is provided with a first-stage cooling water tank 81, the first-stage cooling water tank 81 is internally provided with first-stage cooling water 83 and first-stage cooling wet cotton 82, the first-stage cooling wet cotton 82 is soaked in the first-stage cooling water 83, and the outside of the first-stage cooling water tank 81 is communicated with the outside of the vacuumizing shell through a first-stage cooling water injection pipe 84. The outer side of the primary cooling water injection pipe 84 is provided with a primary cooling water injection port 85.
In this embodiment, as shown in FIGS. 1-2, a hidden handle 91 is attached to the left side of the vacuum lid 23 and the right side is pivotally connected to the vacuum box 21. The dynamic function display panel 92 is disposed on the top of the vacuum box 21, and is disposed opposite to the hidden handle 91. A ventilation opening 93 is provided in a lower front portion of the vacuum box 21.
As shown in fig. 2-4, the internal cooling system includes a cross flow fan 33, an external motor 35, and a baffle 32. Bearings extend out of the cross flow fan 33 and the external motor 35, the fan magnet 31 is mounted at the end of the bearing of the cross flow fan 33, the motor magnet 34 is mounted at the end of the bearing of the external motor 35, the motor magnet 34 is located right below the fan magnet 31, and the fan magnet 31 and the motor magnet 34 have the same diameter. The cross flow fan 33 and the external motor 35 are separated and fixed by a sealing plate, and the sealing plate is arranged between the holes of the bottom plate of the vacuum box 21. The external motor 35 and the motor magnet 34 are disposed in the hole of the bottom plate of the vacuum chamber 21 and located below the sealing plate. A baffle 32 is provided outside the cross flow fan 33 and the semiconductor 11 in the vacuum chamber 21.
When the device is used, the external motor 35 drives the motor magnet 34 to rotate, the fan magnet 31 is driven to rotate through magnetic force, the through-flow fan 33 is driven to rotate through the bearing, shaftless magnetic transmission is achieved, the external motor 35 is prevented from being wet, meanwhile, the through-flow fan 33 is protected by the guide plate 32, circulating flow cooling dissipation is achieved, and frosting and damage to the semiconductor refrigerator 12 are prevented. In addition, when the semiconductor refrigerator is used, the primary cooling water 83 is injected into the primary cooling water tank 81 through the primary cooling water injection pipe 84, the air above the primary cooling water tank 81 is cooled through the evaporation of the primary cooling water 83 to form primary cooling air, and then the primary cooling air is sucked into the semiconductor refrigerator 12 through the cooling fan in the semiconductor refrigerator 12 to take away the heat in the semiconductor refrigerator 12, so that refrigeration is realized. The first-stage cooling water 83 in the first-stage cooling water tank 81 is accelerated to volatilize under the action of the cooling fan of the semiconductor refrigerator 12, takes away more heat of the semiconductor refrigerator 12, improves the refrigeration effect of the semiconductor refrigerator 12, and finally realizes the effect of reducing the refrigeration temperature by the second-stage circulating refrigeration.
In the present embodiment, as shown in fig. 2, the semiconductor refrigerator includes two semiconductors 11 and two semiconductor refrigerators 12. The high-energy lightweight rechargeable battery 71 and the charger 72 are also two. Each semiconductor 11, each semiconductor refrigerator 12, each high-energy light rechargeable battery 71 and each charger 72 are correspondingly arranged and connected into a group of semiconductor refrigeration equipment, and the two groups of semiconductor refrigeration equipment are arranged in the bottom space of the heat preservation box in a left-right symmetrical mode.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that various changes, modifications, equivalents, and improvements may be made without departing from the spirit and scope of the invention.
Claims (10)
1. A semiconductor two-stage circulating refrigeration heat-preservation box comprises a semiconductor refrigeration system, a vacuum-pumping shell, an internal cold-dispersing system, a high-energy light rechargeable battery (71) and a dynamic function display panel (92); the method is characterized in that:
the vacuum-pumping shell comprises a vacuum box (21) and a vacuum cover (23), the vacuum box (21) and the vacuum cover (23) are both internally composed of a negative pressure cavity (41) and negative pressure supports (42) filled with honeycomb-like hexagonal materials, and a negative pressure cavity (41) is defined between every two adjacent negative pressure supports (42);
the semiconductor refrigeration system comprises a semiconductor (11) and a semiconductor refrigerator (12); the semiconductor (11) is arranged on the upper surface of the bottom plate of the vacuum box (21) and is connected with the semiconductor refrigerator (12) at the lower part;
a bottom space is arranged between the bottom plate of the vacuum box (21) and the bottom of the heat insulation box, and the high-energy light rechargeable battery (71) and the semiconductor refrigerator (12) are arranged in the bottom space; the high-energy light rechargeable battery (71) is also connected with a charger (72); the semiconductor refrigerator (12) is connected with the high-energy light rechargeable battery (71) and the dynamic function display panel (92) and is used for realizing temperature control; a primary cooling water tank (81) is installed at the bottom of the semiconductor refrigerator (12), primary cooling water (83) and primary cooling wet cotton (82) are arranged inside the primary cooling water tank (81), the primary cooling wet cotton (82) is soaked in the primary cooling water (83), and the outside of the primary cooling water tank (81) is communicated with the outside of the vacuumizing shell through a primary cooling water injection pipe (84);
the internal cooling system comprises a cross flow fan (33), an external motor (35) and a guide plate (32); bearings extend out of the cross-flow fan (33) and the external motor (35), a fan magnet (31) is mounted at the end of the bearing of the cross-flow fan (33), a motor magnet (34) is mounted at the end of the bearing of the external motor (35), the motor magnet (34) is located right below the fan magnet (31), the cross-flow fan (33) and the external motor (35) are separated and fixed through a sealing plate, and the sealing plate is arranged between holes of a bottom plate of the vacuum box (21); and a flow guide plate (32) is arranged outside the cross-flow fan (33) and the semiconductor (11) in the vacuum box (21).
2. The semiconductor secondary circulation refrigeration heat preservation box of claim 1, characterized in that: when the device is used, the external motor (35) drives the motor magnet (34) to rotate, the fan magnet (31) is driven to rotate through magnetic force, the through-flow fan (33) is driven to rotate through the bearing, shaftless magnetic transmission is achieved, the external motor (35) is prevented from being wet, meanwhile, the through-flow fan (33) is protected by the guide plate (32), circulating flow cooling dissipation is achieved, and the semiconductor refrigerator (12) is prevented from being frosted and damaged; in addition, when the semiconductor refrigerator is used, the primary cooling water (83) is injected into the primary cooling water tank (81) through the primary cooling water injection pipe (84), air above the primary cooling water tank (81) is cooled through evaporation of the primary cooling water (83) to form primary refrigerating air, and then the primary refrigerating air is sucked into the semiconductor refrigerator (12) through a radiating fan in the semiconductor refrigerator (12) to take away heat in the semiconductor refrigerator (12) so as to realize refrigeration; and the first-stage cooling water (83) in the first-stage cooling water tank (81) is accelerated to volatilize under the action of a cooling fan of the semiconductor refrigerator (12), more heat of the semiconductor refrigerator is taken away, the refrigerating effect of the semiconductor refrigerator is improved, and the effect of reducing the refrigerating temperature by secondary circulation refrigeration is finally realized.
3. The semiconductor secondary circulation refrigeration heat preservation box of claim 1, characterized in that: the fan magnet (31) and the motor magnet (34) have the same diameter.
4. The semiconductor secondary circulation refrigeration heat preservation box of claim 1, characterized in that: the semiconductor refrigerator comprises two semiconductors (11) and two semiconductor refrigerators (12); the high-energy light rechargeable battery (71) and the charger (72) are both also two.
5. The semiconductor secondary circulation refrigeration heat preservation box of claim 4, characterized in that: each semiconductor (11), each semiconductor refrigerator (12), each high-energy light rechargeable battery (71) and each charger (72) are correspondingly arranged and connected into a group of semiconductor refrigeration equipment, and the two groups of semiconductor refrigeration equipment are arranged in the bottom space of the heat preservation box in a bilateral symmetry mode.
6. The semiconductor secondary circulation refrigeration heat preservation box of claim 1, characterized in that: the outer side of the first-stage cooling water injection pipe (84) is provided with a first-stage cooling water injection port (85).
7. The semiconductor secondary circulation refrigeration heat preservation box of claim 1, characterized in that: and the dynamic function display panel (92) is also provided with a heating key and a refrigerating key.
8. The semiconductor secondary circulation refrigeration heat preservation box of claim 1, characterized in that: the vacuumizing shell is a double-layer stainless steel shell.
9. The semiconductor secondary circulation refrigeration heat preservation box of claim 1, characterized in that: the left side of the vacuum cover (23) is provided with a hidden handle (91), and the right side of the vacuum cover is pivotally connected with the vacuum box (21); the dynamic function display panel (92) is arranged at the top of the vacuum box (21) and is opposite to the hidden type handle (91); the lower part of the front side of the vacuum box (21) is provided with a vent (93).
10. The semiconductor secondary circulation refrigeration heat preservation box of claim 1, characterized in that: the external motor (35) and the motor magnet (34) are arranged in the hole of the bottom plate of the vacuum box (21) and are positioned at the lower part of the sealing plate.
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| CN202210564748.9A CN114963682B (en) | 2022-05-23 | 2022-05-23 | Semiconductor two-stage circulation refrigeration insulation can |
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| CN202210564748.9A CN114963682B (en) | 2022-05-23 | 2022-05-23 | Semiconductor two-stage circulation refrigeration insulation can |
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