CN114957925A - Epoxy resin composite insulating medium of single-component ultraviolet photosensitive microcapsule, preparation method and application - Google Patents
Epoxy resin composite insulating medium of single-component ultraviolet photosensitive microcapsule, preparation method and application Download PDFInfo
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- 239000003094 microcapsule Substances 0.000 title claims abstract description 40
- 239000002131 composite material Substances 0.000 title claims abstract description 39
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- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 31
- 238000002360 preparation method Methods 0.000 title claims abstract description 8
- 239000000203 mixture Substances 0.000 claims abstract description 32
- 239000002245 particle Substances 0.000 claims abstract description 21
- 229910004298 SiO 2 Inorganic materials 0.000 claims abstract description 20
- 238000000034 method Methods 0.000 claims abstract description 11
- 238000003756 stirring Methods 0.000 claims abstract description 11
- 238000001035 drying Methods 0.000 claims abstract description 9
- 239000004593 Epoxy Substances 0.000 claims abstract description 7
- 238000004140 cleaning Methods 0.000 claims abstract description 4
- 238000007872 degassing Methods 0.000 claims abstract description 4
- 239000011162 core material Substances 0.000 claims description 19
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 18
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims description 15
- 239000008367 deionised water Substances 0.000 claims description 12
- 229910021641 deionized water Inorganic materials 0.000 claims description 12
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 claims description 10
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 claims description 10
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 claims description 9
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 claims description 9
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 9
- 239000000839 emulsion Substances 0.000 claims description 8
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims description 7
- 239000004202 carbamide Substances 0.000 claims description 7
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 claims description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 6
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 6
- 238000006243 chemical reaction Methods 0.000 claims description 6
- 239000003995 emulsifying agent Substances 0.000 claims description 6
- 238000001914 filtration Methods 0.000 claims description 6
- 238000002156 mixing Methods 0.000 claims description 6
- 235000019270 ammonium chloride Nutrition 0.000 claims description 5
- GVGUFUZHNYFZLC-UHFFFAOYSA-N dodecyl benzenesulfonate;sodium Chemical compound [Na].CCCCCCCCCCCCOS(=O)(=O)C1=CC=CC=C1 GVGUFUZHNYFZLC-UHFFFAOYSA-N 0.000 claims description 5
- SOOZEQGBHHIHEF-UHFFFAOYSA-N methyltetrahydrophthalic anhydride Chemical compound C1C=CCC2C(=O)OC(=O)C21C SOOZEQGBHHIHEF-UHFFFAOYSA-N 0.000 claims description 5
- 229940080264 sodium dodecylbenzenesulfonate Drugs 0.000 claims description 5
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 claims description 4
- ZDHCZVWCTKTBRY-UHFFFAOYSA-N omega-Hydroxydodecanoic acid Natural products OCCCCCCCCCCCC(O)=O ZDHCZVWCTKTBRY-UHFFFAOYSA-N 0.000 claims description 4
- DKEGCUDAFWNSSO-UHFFFAOYSA-N 1,8-dibromooctane Chemical compound BrCCCCCCCCBr DKEGCUDAFWNSSO-UHFFFAOYSA-N 0.000 claims description 3
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 claims description 3
- 239000008098 formaldehyde solution Substances 0.000 claims description 3
- 230000002378 acidificating effect Effects 0.000 claims description 2
- 238000004945 emulsification Methods 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims description 2
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 238000005538 encapsulation Methods 0.000 claims 1
- 238000011160 research Methods 0.000 abstract description 3
- 239000000126 substance Substances 0.000 abstract description 2
- 238000006116 polymerization reaction Methods 0.000 abstract 1
- 238000004088 simulation Methods 0.000 abstract 1
- 238000000967 suction filtration Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 description 6
- 239000011810 insulating material Substances 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 239000002775 capsule Substances 0.000 description 3
- 238000000399 optical microscopy Methods 0.000 description 3
- 239000008187 granular material Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- VOBUAPTXJKMNCT-UHFFFAOYSA-N 1-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound CCCCCC(OC(=O)C=C)OC(=O)C=C VOBUAPTXJKMNCT-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N Acrylic acid Chemical compound OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- ODGAOXROABLFNM-UHFFFAOYSA-N polynoxylin Chemical compound O=C.NC(N)=O ODGAOXROABLFNM-UHFFFAOYSA-N 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000011897 real-time detection Methods 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000001878 scanning electron micrograph Methods 0.000 description 1
- 238000004626 scanning electron microscopy Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/22—Expanded, porous or hollow particles
- C08K7/24—Expanded, porous or hollow particles inorganic
- C08K7/26—Silicon- containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Manufacturing Of Micro-Capsules (AREA)
Abstract
The invention discloses an epoxy resin composite insulating medium of single-component ultraviolet photosensitive microcapsule, a preparation method and application thereof, wherein the preparation method comprises the following steps: the purple photosensitive microcapsule is prepared by the original polymerization method, and a powdery microcapsule sample is obtained by cleaning, suction filtration and drying. Preparing photosensitive microcapsule and modified nano SiO 2 Fully stirring and degassing the particles, pouring the particles into a mold, and curing to obtain the photosensitive microcapsule/nano SiO 2 Epoxy resin composite medium. The test researches the microstructure, chemical composition and thermal stability of the microcapsule and the electrical intrinsic performance of the composite material, and the excellent ultraviolet shielding performance and self-repairing characteristic of the composite material are verified by performing ultraviolet irradiation and micro-damage simulation tests on the composite material, and the final result shows that: composite media in retaining epoxy materialThe self-repairing to mechanical damage is realized while the intrinsic performance is good.
Description
Technical Field
The invention belongs to the field of composite insulating medium materials, and particularly relates to an epoxy resin composite insulating medium of a single-component ultraviolet photosensitive microcapsule and self-repairing characteristic research thereof.
Background
Epoxy resins are widely used as insulating materials for electrical devices due to low processing cost, stable chemical structure, and good insulating properties. However, the epoxy resin material has limited toughness and is prone to generate tiny crack damage during production, transportation and operation, so that the material performance is reduced, and even insulation breakdown is induced. Researches show that the diameter of the crack is usually micron scale, the crack is difficult to observe by naked eyes, and real-time detection cannot be carried out under the electrified operation state of equipment, so that the damaged part can only be maintained or replaced after power failure, and the stable operation of a power system is seriously influenced. If the epoxy resin insulating material has self-repairing capability, the epoxy resin insulating material can be automatically detected and actively repaired at the initial stage of micro damage generation, so that the problems can be fundamentally solved, and the epoxy resin insulating material has important significance for long-term safe and stable operation of equipment.
Disclosure of Invention
The invention provides an epoxy resin composite insulating medium of a single-component ultraviolet photosensitive microcapsule, a preparation method and application aiming at the defects in the prior art.
In view of this, the present invention provides a method for preparing a composite insulating medium and an application thereof.
A preparation method of an epoxy resin composite insulating medium comprises the following steps:
s1, mixing KH-550 with ethanol, and adding SiO nanoparticles 2 Stirring the particles for 1-3 h, filtering, collecting and drying the mixture to prepare the surface modified nano SiO 2 Particles;
s2, deionized water, sodium dodecyl benzene sulfonate, resorcinol and ammonium chloride are mixed and dissolved in water bath at the temperature of 30-50 ℃ to obtain an emulsifier; adding a photosensitive core material into the emulsifier for emulsification for 20-40 min to prepare a stable core material emulsion;
s3, dissolving urea and formaldehyde solution in deionized water at room temperature, and adjusting the pH value of the solution to be alkaline by triethylamine to obtain a mixture;
s4, slowly adding the mixture prepared in s3 into the core material emulsion, adjusting the mixture to be acidic by using citric acid, heating the mixture to 65 ℃ in a water bath, stirring the mixture for 3 hours, and after the reaction is finished, cleaning, filtering and drying the reaction solution to obtain a powdery microcapsule sample for later use.
s5, fully stirring the bisphenol A diglycidyl ether DGEBA and the methyl tetrahydrophthalic anhydride MTHPA to obtain a mixture; photosensitive microcapsule and modified nano SiO 2 Adding the particles into the mixture to obtain a mixture a, sufficiently stirring and degassing the mixture a, pouring the mixture a into a mold, and respectively curing at 90 ℃ and 110 ℃ for 2h and 4h to obtain photosensitive microcapsule/nano SiO 2 Epoxy resin composite medium.
In the technical scheme of the invention: s1 silane coupling agent KH-550 and nano SiO 2 The mass of the particles is 1: 5-15; preferably: s1 silane coupling agent KH-550 and nano SiO 2 The mass of the particles is 1: 8-12.
The technical scheme of the invention is as follows: the drying in s1 is carried out for 22-26 h under the condition of 60-80 ℃, and then for 10-14 h under the condition of 120-140 ℃.
The technical scheme of the invention is as follows: in s2, the mass ratio of deionized water to sodium dodecyl benzene sulfonate to resorcinol to ammonium chloride to the photosensitive core material is 180-220: 0.1-1: 0.1-1: 15-25:
the technical scheme of the invention is as follows: the photosensitive core material in s2 is prepared by sequentially mixing the following components in a mass ratio of 1: 0.2-0.8: 0.05-0.15 of epoxy acrylate EA, 1, 6-hexanediol diacrylate HDDA and benzoin isobutyl ether BIE.
The technical scheme of the invention is as follows: the volume ratio of urea, formaldehyde and deionized water in s3 is 1: 1-5: 10-30;
preferably: s3 wherein the volume ratio of urea, formaldehyde and deionized water is 1: 1-3: 15 to 20.
The technical scheme of the invention is as follows: the mass ratio of the mixture prepared in s3 in s4 to the core material emulsion is 1-5: 1-5.
The technical scheme of the invention is as follows: photosensitive microcapsule and modified nano SiO in s5 2 The mass of the particles is 5-15: 1; the mass ratio of the bisphenol A diglycidyl ether DGEBA to the methyl tetrahydrophthalic anhydride MTHPA to the epoxy accelerator DMP-30 is 1: 0.5-1: 0.01-0.05; the content of the photosensitive microcapsules in the mixture a is 2-10 wt%.
An epoxy resin composite insulating medium is prepared by the method.
In the technical scheme of the invention, the epoxy resin composite insulating medium is applied to the aspect of insulating paint or insulating packaging of electrical equipment.
The invention has the beneficial effects that:
1) nano SiO in composite medium matrix 2 The particles have good ultraviolet shielding performance, can prevent the capsule core repairing agent from being cured in advance, and better ensures the reactivity of the capsule core repairing agent.
2) Nano SiO 2 The introduction of the particles and the photosensitive microcapsules ensures that the epoxy material realizes the self-repairing function and simultaneously ensures the good intrinsic electrical property.
3) Photosensitive microcapsule/nano SiO 2 The epoxy resin insulating composite medium has good mechanical damage self-repairing and electrical performance self-recovery capabilities, and the damage self-repairing rate and the electrical performance self-recovery rate can reach 80-90%.
Drawings
FIG. 1 shows the microscopic morphology and particle size distribution of the photosensitive microcapsules of the present invention.
FIG. 2 is a cross-sectional SEM image and EDS elemental distribution diagram of the composite media.
FIG. 3 is a scratch pattern of a pure epoxy/composite sample according to the present invention.
Detailed Description
The present invention is further illustrated by the following specific examples so that those skilled in the art can better understand the present invention and can practice it, but the examples are not intended to limit the present invention.
The following abbreviations are defined: EA is epoxy acrylate, HDDA is hexanediol diacrylate, and BIE is benzoin isobutyl ether.
Example 1
The preparation method of the composite insulating material comprises the following steps:
s1, adding 0.6g of silane coupling agent KH-550 and 200mL of ethanol solution (95%) into 500mL of beaker, stirring for dissolving, and adding 6g of nano SiO 2 The granules were stirred for 2 h. Filtering and collecting the mixture, and drying at 70 deg.C and 130 deg.C for 24 hr and 12 hr respectively to obtain surface modified nanometer SiO 2 The granules are ready for use.
s2, mixing 200mL deionized water, 0.5g sodium dodecyl benzene sulfonate, 0.5g resorcinol and 0.5g ammonium chloride, and dissolving in water bath at 40 deg.C to obtain the emulsifier. To the above emulsifier was added 20g of photosensitive core material (EA: HDDA: BIE ═ 1: 0.6: 0.08) and emulsified for 30min to prepare a stable core material emulsion.
s3, dissolving urea and a formaldehyde solution in deionized water (mass ratio is 1: 2: 20) at room temperature, and adjusting the pH value of the solution to be alkaline (pH is 8-9) by using triethylamine to obtain a mixture;
s4, the mixture prepared in s3 with a mass ratio of 1:1 was slowly added to the core material emulsion, adjusted to acidity (pH 4) with citric acid, warmed to 65 ℃ in a water bath and stirred for 3 h. And after the reaction is finished, cleaning, filtering and drying the reaction solution to obtain a powdery microcapsule sample for later use.
s5, mixing DGEBA, MTHPA and DMP-30 according to the mass ratio of 1: 0.85: 0.02 was sufficiently stirred to obtain 50g of a mixture b. Photosensitive microcapsule 1.25g and modified nano SiO 0.125g 2 Adding the particles into the mixture, stirring thoroughly, degassing, pouring into a mold, and curing at 90 deg.C and 110 deg.C for 2 hr and 4 hr respectively to obtain photosensitive microcapsule/nanometer SiO 2 Epoxy resin composite medium.
The micro-morphology of the microcapsules was observed by Optical Microscopy (OM) and Scanning Electron Microscopy (SEM) on the microcapsule powders obtained in s1, s2, s3 and s4 of example 1.
As shown in fig. 1(a) and (b), the microcapsule is in a regular spherical shape, and the urea formaldehyde shell of the microcapsule has a rough and dense surface and good dispersibility. FIG. 1(c) shows the particle size distribution of the microcapsules measured by a laser particle size analyzer, and it can be seen from the figure that the particle size distribution of the microcapsules is uniform and mostly concentrated in the range of 100 to 200 μm.
In order to characterize the ultraviolet shielding performance of the composite substrate, the cross section of the composite self-repairing medium is observed by using a scanning electron microscope, and as can be seen from fig. 2, the microcapsule is not exposed to the surface of the material due to the action of the self gravity. EDS element analysis is carried out on the section, so that the Si element is uniformly distributed in the matrix, and the microcapsule can be protected by ultraviolet shielding.
Herein, a scalpel (#11) was used to simulate damage to the material surface, and the self-healing properties of the composite media were observed by an Optical Microscope (OM). Fig. 3(a) is a scratch damage of the surface of the pure epoxy resin sample, and it can be seen that the damage channel is accompanied by a marked burr-like scratch. Fig. 3(b) is a scratch damage on the surface of the composite media, where the microcapsule core repair agent did not flow out completely and no uv light was applied, and it can be seen that the damage morphology is similar to that of the neat epoxy sample.
Fig. 3(c) shows the state of scratch damage on the surface of the self-repairing composite medium after irradiation of ultraviolet light, and it can be seen that the damage degree is greatly reduced, the width of the damage channel is obviously reduced, and the burr-shaped damage almost completely disappears because the capillary effect capsule core repairing agent fills the damage channel.
In conclusion, the photosensitive resin microcapsule/epoxy resin prepared by the invention can still keep good intrinsic electrical performance according to the insulating medium, and shows good mechanical damage self-repairing and electrical performance self-recovering capabilities, the damage self-repairing rate and the electrical performance self-recovering rate can reach 80-90%,
the above-mentioned embodiments are merely preferred embodiments for fully illustrating the present invention, and the scope of the present invention is not limited thereto. The equivalent substitution or change made by the technical personnel in the technical field on the basis of the invention is all within the protection scope of the invention. The protection scope of the invention is subject to the claims.
Example 2
In this example, photosensitive microcapsules/nano SiO 2 were prepared in the same manner as in example 1 except that the photosensitive microcapsules in S5 were changed to 2.5g 2 Epoxy resin composite medium.
Example 3
In this example, photosensitive microcapsules/nano SiO 2 were prepared in the same manner as in example 1 except that the photosensitive microcapsules in S5 were changed to 5g 2 Epoxy resin composite medium.
Claims (10)
1. A preparation method of an epoxy resin composite insulating medium is characterized by comprising the following steps:
s1 mixing silane coupling agent KH-550 with ethanol, and adding nanometer SiO 2 Stirring the particles for 1-3 h, filtering, collecting and drying the mixture to prepare the surface modified nano SiO 2 Particles;
s2, deionized water, sodium dodecyl benzene sulfonate, resorcinol and ammonium chloride are mixed and dissolved in water bath at 30-50 ℃ to obtain an emulsifier; adding a photosensitive core material into the emulsifier for emulsification for 20-40 min to prepare a stable core material emulsion;
s3, dissolving urea and formaldehyde solution in deionized water at room temperature, and adjusting the pH value of the solution to be alkaline by triethylamine to obtain a mixture;
s4, slowly adding the mixture prepared in s3 into the core material emulsion, adjusting the mixture to be acidic by using citric acid, heating the mixture to 65 ℃ in a water bath, stirring the mixture for 3 hours, and after the reaction is finished, cleaning, filtering and drying the reaction solution to obtain a powdery microcapsule sample for later use.
s5, fully stirring the bisphenol A diglycidyl ether DGEBA and the methyl tetrahydrophthalic anhydride MTHPA to obtain a mixture; photosensitive microcapsule and modified nano SiO 2 Adding the particles into the mixture to obtain a mixture a, sufficiently stirring and degassing the mixture a, pouring the mixture a into a mold, and respectively curing at 90 ℃ and 110 ℃ for 2h and 4h to obtain photosensitive microcapsule/nano SiO 2 Epoxy treeA lipid-complexed medium.
2. The method for preparing the epoxy resin composite insulating medium according to claim 1, wherein: s1 silane coupling agent KH-550 and nano SiO 2 The mass of the particles is 1: 5-15; preferably: s1 silane coupling agent KH-550 and nano SiO 2 The mass of the particles is 1: 8-12.
3. The method for preparing the epoxy resin composite insulating medium according to claim 1, wherein: the drying in s1 is carried out for 22-26 h under the condition of 60-80 ℃, and then for 10-14 h under the condition of 120-140 ℃.
4. The method for preparing the epoxy resin composite insulating medium according to claim 1, characterized in that: in s2, the mass ratio of deionized water to sodium dodecyl benzene sulfonate to resorcinol to ammonium chloride to the photosensitive core material is 180-220: 0.1-1: 0.1-1: 15 to 25.
5. The method for preparing an epoxy resin composite insulating medium according to claim 1 or 4, characterized in that: the photosensitive core material in s2 is prepared by sequentially mixing the following components in a mass ratio of 1: 0.2-0.8: 0.05-0.15 of epoxy acrylate EA, 1, 6-hexanediol diacrylate HDDA and benzoin isobutyl ether BIE.
6. The method for preparing the epoxy resin composite insulating medium according to claim 1, wherein: the mass ratio of urea, formaldehyde and deionized water in s3 is 1: 1-5: 10-30;
preferably: s3 wherein the volume ratio of urea, formaldehyde and deionized water is 1: 1-3: 15 to 20.
7. The method for preparing the epoxy resin composite insulating medium according to claim 1, wherein: the mass ratio of the mixture prepared in s3 in s4 to the core material emulsion is 1-5: 1-5.
8. The method for preparing the epoxy resin composite insulating medium according to claim 1, wherein: photosensitive microcapsule and modified nano SiO in s5 2 The mass of the particles is 5-15: 1; the mass ratio of the bisphenol A diglycidyl ether DGEBA, the methyl tetrahydrophthalic anhydride MTHPA and the epoxy accelerator DMP-30 is 1: 0.5-1: 0.01-0.05; the content of the photosensitive microcapsules in the mixture a is 2-10 wt%.
9. An epoxy resin composite insulating medium is characterized in that: the medium is prepared by the method of claim 1.
10. Use of the epoxy resin composite insulating medium according to claim 9 as an insulating coating or an insulating encapsulation for electrical equipment.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115895195A (en) * | 2022-08-10 | 2023-04-04 | 重庆大学 | Mechanical crack damage self-repairing epoxy resin composite insulating material and preparation method thereof |
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| CN102773053A (en) * | 2012-08-14 | 2012-11-14 | 西北工业大学 | Urea-formaldehyde resin coated epoxy acrylic resin microcapsule for resin-base self-repair coating and preparation method thereof |
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