CN114955197B

CN114955197B - Electronic equipment suit

Info

Publication number: CN114955197B
Application number: CN202210532167.7A
Authority: CN
Inventors: 刘国龙
Original assignee: Vivo Mobile Communication Co Ltd
Current assignee: Vivo Mobile Communication Co Ltd
Priority date: 2022-05-16
Filing date: 2022-05-16
Publication date: 2024-06-25
Anticipated expiration: 2042-05-16
Also published as: CN114955197A

Abstract

The embodiment of the application discloses an electronic equipment set, which comprises electronic equipment and a packaging box; the packaging box comprises a lining structure, wherein the lining structure comprises a bottom support and a plurality of side blocking parts which are arranged on the edge of the bottom support in a surrounding mode, and the bottom support and the side blocking parts form a containing space for containing the electronic equipment in a surrounding mode; when the electronic equipment is arranged in the storage space, a start-up key of the electronic equipment and one of the side blocking parts are close to each other, at least one of the side blocking parts and the start-up key comprises a shape memory alloy structure part, and after the shape memory alloy structure part deforms, the side blocking part is matched with the start-up key to press the start-up key.

Description

Electronic equipment suit

Technical Field

The application belongs to the technical field of terminal equipment, and particularly relates to an electronic equipment set.

Background

At present, after the production test of intelligent terminal products such as mobile phones, the intelligent terminal products can be shut down and put into a packaging box, and plastic packaging, anti-disassembly and anti-counterfeiting labels are arranged outside the packaging box and used for ensuring that the mobile phones are complete and free from pollution. In this case, once the mobile phone is packaged, the mobile phone cannot be started without unpacking the packaging box, but when the starting requirement exists, an operator must unpack the packaging box to take out the mobile phone and trigger the mobile phone to start. However, when the mobile phone is disassembled for operation, the mobile phone is stained, materials and labor cost are also brought to repackaging, and even after part of the packaging boxes are disassembled, users are not satisfied.

Disclosure of Invention

The embodiment of the application aims to provide an electronic equipment set, which solves the problem that the starting-up of the existing terminal product cannot be realized by a non-contact method under the condition of not dismantling a packaging box after the packaging box is put into the packaging box for packaging.

The embodiment of the application provides an electronic equipment set, which comprises electronic equipment and a packaging box;

the packaging box comprises a lining structure, wherein the lining structure comprises a bottom support and a plurality of side blocking parts which are surrounded on the edge of the bottom support, and the bottom support and the side blocking parts are surrounded to form a containing space for containing the electronic equipment;

When the electronic equipment is arranged in the storage space, a start-up key of the electronic equipment and one of the side blocking parts are close to each other, at least one of the side blocking parts and the start-up key comprises a shape memory alloy structure part, and after the shape memory alloy structure part deforms, the side blocking part is matched with the start-up key to press the start-up key.

In the embodiment of the application, the starting key of the electronic equipment is set to be a shape memory alloy material, or the side blocking part of the lining structure of the electronic equipment accommodated in the packaging box is set to contain the shape memory alloy material, so that the shape memory alloy material can be driven to deform under the control of temperature, the starting of the electronic equipment can be triggered in a non-contact mode under the condition of not dismantling the packaging box, and the functions of software upgrading, individual customization and the like of the electronic equipment under the condition of not dismantling the packaging box are realized.

Additional aspects and advantages of the application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the application.

Drawings

The foregoing and/or additional aspects and advantages of the application will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:

FIG. 1 is a schematic illustration of an electronic device package according to an embodiment of the present application;

FIG. 2 is a second schematic diagram of an electronic device package according to an embodiment of the present application;

FIG. 3 is a third schematic illustration of an electronic device package according to an embodiment of the present application;

FIG. 4 is a fourth schematic structural illustration of an electronic device package according to an embodiment of the present application;

Fig. 5 is a schematic structural diagram of a circuit structure in an electronic device according to an embodiment of the present application.

Reference numerals:

100. Packaging box; 110. a liner structure; 111. a bottom support; 112. a side blocking part; 113. a deformation zone; 114. a microwave absorbing material structure; 120. an outer packing box body; 200. an electronic device; 210. a start key; 220. an application processor; 230. a power management chip; 240. and a battery.

Detailed Description

Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements throughout or elements having like or similar functionality. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.

The features of the application "first", "second" and the like in the description and in the claims may be used for the explicit or implicit inclusion of one or more such features. In the description of the present application, unless otherwise indicated, the meaning of "a plurality" is two or more. Furthermore, in the description and claims, "and/or" means at least one of the connected objects, and the character "/", generally means that the associated object is an "or" relationship.

In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present application.

In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present application will be understood in specific cases by those of ordinary skill in the art.

The electronic equipment set provided by the embodiment of the application is described in detail below through specific embodiments and application scenes thereof with reference to the accompanying drawings.

According to an embodiment of the present application, there is provided an electronic device package, see fig. 1 to 4, comprising an electronic device 200 and a package box 100.

After the production test, the electronic device 200 is turned off and put into the package 100 for being stored for transportation and sale.

In an embodiment of the present application, referring to fig. 1 to 4, the package box 100 includes a lining structure 110, the lining structure 110 includes a base 111 and a plurality of side blocking portions 112 surrounding an edge of the base 111, and the base 111 and the plurality of side blocking portions 112 may enclose a receiving space for receiving the electronic device 200.

That is, when the electronic device 200 is accommodated in the package box 100, the electronic device 200 may be placed in a specific accommodation space formed on the liner structure 110. That is, the electronic device 200 is supported by the built-in lining structure 110 in the package box 100, and thus, the electronic device 200 and the auxiliary devices such as the charging wire can be stored in the package box 100 separately.

Referring to fig. 1, when the electronic device 200 is disposed in the storage space, the power-on key 210 of the electronic device 200 and one of the side-stop portions 112 of the plurality of side-stop portions 112 are close to each other, at least one of the side-stop portions 112 and the power-on key 210 includes a shape memory alloy structure portion, and after the shape memory alloy structure portion is deformed, the side-stop portion 112 cooperates with the power-on key 210 to press the power-on key 210.

Wherein the shape memory alloy structure portion has different crystal structures at different temperatures based on the characteristics of the material, and can take different shapes when the temperature changes.

For example, the shape is normal in use at low temperatures. The high temperature shape is set to be extended outward based on the low temperature shape, such as the expansion/increase of the volume of the shape memory alloy structure.

It should be noted that, the electronic device is generally provided with a power-on key, and the power-on key can be used for controlling the power-on and power-off operations of the electronic device. Referring to fig. 1-4, an on-key 210 on an electronic device 200 is shown in an embodiment of the application.

However, in the prior art, for a packaged electronic device (for example, a mobile phone), it is common to remove the package box 100 outside the electronic device 200, then take the electronic device 200 out of the package box 100, and then control the start of the start key 210 by directly pressing the start key 210 manually, so as to start the electronic device.

In the embodiment of the application, for example, the start key 210 of the electronic device 200 is made of a shape memory alloy material, or the side blocking part 112 of the lining structure 110 of the electronic device 200 in the packaging box 100 is made of a shape memory alloy material, so that the corresponding shape memory alloy structure parts can be driven to deform under the control of different temperatures, the start of the electronic device 200 can be triggered in a non-contact manner by an external designated tool under the condition of not dismantling the packaging box 100, and the functions of software upgrading, personalized customization and the like of the electronic device 200 under the condition of not dismantling the packaging box 100 are realized.

For example, referring to fig. 1, the power-on key 210 of the electronic device 200 is configured as a shape memory alloy structural part made of a shape memory alloy material partially or wholly, and the power-on key 210 is disposed in abutment with one side blocking part 112 of the liner structure 110 or at a smaller distance, when the electronic device 200 and the packaging box 100 are placed together in a higher temperature environment, the power-on key 210 is in a certain deformation in the high temperature environment, so that the power-on key 210 extends towards the inner wall of one side blocking part 112, and at the same time, the power-on key 210 of the electronic device 200 is pressed by the inner wall of the side blocking part 112 by a reaction force, and after the power-on key 210 is continuously pressed for several seconds, the non-contact power-on without disassembling the packaging box 100 is completed. That is, the electronic apparatus 200 is turned on via the package 100.

For another example, referring to fig. 2, one of the side stops 112, which is in contact with or spaced a small distance apart from the start key 210, itself includes a shape memory structure. When the whole electronic device is in a high-temperature environment, the shape memory alloy structure portion of the side barrier portion 112 is deformed, and extends toward the start-up key 210 to continuously press the start-up key 210 of the electronic device 200, and after waiting for several seconds, the non-contact start-up without unpacking the package can 100 can be completed. I.e. the electronic device 200 is turned on via the package 100.

In the solution provided in the embodiment of the present application, when a power-on request occurs, an operator does not need to disassemble the package 100 to take out the electronic device 200 and trigger the electronic device 200 to power on. Thereby avoiding the pollution to the electronic equipment caused by the operation of unpacking the outer package of the electronic equipment 200, and the increase of material and labor cost caused by repacking, and avoiding the occurrence of discontent condition of the user caused by the disassembling trace of the packing box 100.

In addition, referring to fig. 5, the electronic device 200 of the embodiment of the present application may further include an application processor 220, a power management chip 230, and a battery 240.

The application processor 220 can be responsible for software system operation, realization of product terminal functions, and control of peripheral devices, and is a control center of the whole system; part of the application processor 220 may also contain AOSP (normally open coprocessor, always on sub processor)), which may continue to operate with the electronic device 200 off.

The power management chip 230 (also called PMIC), which is an integrated circuit with an integrated MCU and multiple power outputs, is mainly responsible for receiving the power-on signal and outputting the power required by the application processor and the peripheral devices.

Wherein, the battery 240 is a system energy source, and still supplies power to the power management chip 230, the NFC chip, etc. after the electronic device 200 is turned off.

The electronic device 200 of the embodiment of the application can trigger the electronic device 200 to start up in a non-contact mode through an external designated tool under the condition of not dismantling the packaging box 100. The circuit structure formed by the application processor 220, the power management chip 230 and the battery 240 is matched, so that the functions of upgrading software, customizing individuality and the like of the electronic equipment 200 are realized under the condition that the packaging box 100 is not dismounted.

In some examples of the application, referring to fig. 1, at least part of the start-up key 210 is the shape memory alloy structure, and the start-up key 210 can switch between a first shape and a second shape under different temperature driving;

When the shape of the power-on key 210 is the first shape, the power-on key 210 is in contact with or spaced from an inner wall of one of the side blocking portions 112;

in the case that the shape of the start key 210 is the second shape, the start key 210 can extend toward the inner wall of one of the side blocking portions 112 in the plurality of side blocking portions 112, so that the start key 210 is pressed by the inner wall of the side blocking portion 112.

In embodiments of the present application, the power-on key 210 of the electronic device 200 may be designed to be at least partially formed of a shape memory alloy material, such that a shape memory alloy structure may be formed or integrally formed thereon. Because the shape memory alloy material has different crystal structures at different temperatures, when the temperature changes, the power-on key 210 of the electronic device 200 can take on different shapes, such as the first shape and the second shape, and the second shape of the power-on key 210 is that the extension to one side stop 112 originally contacted with the power-on key is generated on the basis of the first shape.

For example, at low temperatures (a temperature may be set to B ℃, and at or below B ℃) the power-on key 210 made of a shape memory alloy material (or a shape memory alloy structure formed locally on the power-on key 210) is in a normal use state. At a high temperature (a temperature may be set to be a ℃ and above a temperature of a) the start-up key 210 made of the shape memory alloy material is set to extend outwards based on the low temperature shape, and the whole volume is increased, so that the start-up key 210 can be abutted against the inner wall of the side blocking portion 112 or be set at intervals to be abutted against the inner wall of the side blocking portion 112, and at the same time, the inner wall of the side blocking portion 112 can apply a reaction force to the start-up key 210 of the electronic device 200 to press the start-up key 210. When the power-on key 210 is pressed for more than a few seconds, the power-on of the electronic device 200 can be achieved.

When the electronic device 200 needs to be started without removing the package box 100, the whole electronic device package may be placed in, for example, an incubator and heated to a temperature above a ℃, and the start key 210 will deform to extend toward one side stop 112. Since the power-on key 210 is tightly attached to one side block 112 of the liner structure 110 when the electronic device 200 is placed, the power-on key 210 will be pressed inwards by the reaction force of the inner wall of the side block 112, and the power-on of the electronic device 200 is completed after a few seconds.

In addition, it should be noted that the power-on key 210 on the electronic device 200 may be made of a shape memory alloy material as a whole to form a shape memory alloy bonding portion, or may be made of a shape memory alloy material to form a shape memory alloy structure portion locally, which can be flexibly adjusted by a person skilled in the art according to the needs, and the embodiment of the application is not limited thereto.

In some examples of the application, referring to fig. 2, a deformation region 113 is at least partially disposed on an inner wall of one of the side barrier portions 112 of the plurality of side barrier portions 112, and the shape memory alloy structural portion is disposed on the deformation region 113, and the shape memory alloy structural portion is switchable between a third shape and a fourth shape at different temperatures;

in the case that the shape of the shape memory alloy structure is the third shape, the shape memory alloy structure is in contact with or spaced from the start key 210;

In the case that the shape of the shape memory alloy structure is the fourth shape, the shape memory alloy structure can be extended toward the start key 210 to press the start key 210.

That is, in the embodiment of the present application, a deformation area 113 may be further disposed on at least one side blocking portion 112 of the liner structure 110, and a shape memory alloy structure portion may be formed on the deformation area 113, which is equivalent to forming a driving structure on the side blocking portion 112, and based on the property of the material, the shape memory alloy structure portion on the deformation area 113 may generate deformation itself under the condition of temperature change, so as to trigger the start-up key 210 to realize start-up of the electronic device 200.

For example, when the electronic device 200 is placed in the liner structure 110 of the package box 100, the power-on key 210 of the electronic device 200 is in contact with (or spaced apart from) the shape memory alloy structure on the deformation region 113 (but with a smaller spacing). Based on the difference of the crystal structures of the shape memory alloy materials at different temperatures, when the temperatures change, the shape memory alloy structure can take on different shapes, such as the third shape and the fourth shape, wherein the fourth shape can be that the shape memory alloy structure generates the extension deformation to the power-on key 210 originally contacted with the shape memory alloy structure on the basis of the third shape, so that the shape memory alloy structure can support the power-on key 210, and the power-on of the electronic device 200 is completed after a few seconds.

That is, in the embodiment of the present application, the shape memory alloy structure portion may be directly formed on the deformation area 113 of one side stop portion 112 of the lining structure 110, and in the low temperature state, the shape memory alloy structure portion may be attached to or close to the power-on key 210 of the electronic device 200, but the power-on key 210 is not stressed. In the high temperature state, the shape memory alloy structure is deformed based on the shape memory alloy material, and can be used to squeeze the power-on key 210 of the electronic device 200, so that the power-on key 210 is stressed to complete power-on.

In addition, it should be noted that, in the embodiment of the present application, the inner wall of one side blocking portion 112 contacting with the start key 210 of the electronic device 200 may be made of a shape memory alloy material, that is, the deformation region 113 may cover the inner wall of the side blocking portion 112; of course, the shape memory alloy structure portion may be disposed in a local area, and those skilled in the art may flexibly adjust the shape memory alloy structure portion according to needs, which is not particularly limited in the embodiment of the present application.

In some examples of the application, referring to fig. 2, the start key 210 is opposite the shape memory alloy structure; alternatively, two shape memory alloy structures are symmetrically arranged on the deformation area 113, and orthographic projections of two opposite side portions of the start key 210 on the deformation area 113 are respectively overlapped with the two shape memory alloy structures.

In the embodiment of the present application, the deformation zone 113 is located on the inner wall of one side stop 112 of the liner structure 110 (the side stop 112 needs to be in contact with the start key 210 of the electronic device 200), that is, on the package box 100. The power-on key 210 is located, for example, on a side frame of the electronic device 200. In order to make the shape memory alloy structure portion on the deformation area 113 more accurately align with the start-up key 210 to extrude after the deformation, so as to start up the electronic device 200, the position of the deformation area 113 on the side blocking portion 112 needs to be reasonably set according to the position of the start-up key 210.

The deformation area 113 may be designed to correspond to the position of the start key 210, that is, the above-mentioned opposite arrangement. Thus, after the shape memory alloy bonding portion located in the deformation area 113 is deformed by extending toward the power-on key 210, it can be directly aligned to the power-on key 210 to press, so as to realize the power-on of the electronic device 200.

It should be noted that the shape memory alloy structure portion on the deformation area 113 may be designed to be larger than the power-on key 210, so that the power-on of the electronic device 200 may be achieved under the condition of reducing the alignment accuracy of the shape memory alloy structure portion and the power-on key 210, so as to prevent the electronic device 200 from being offset in the liner structure 110.

In the embodiment of the present application, the shape memory alloy structures are symmetrically distributed on the left and right sides of the power-on key 210 on the deformation area 113, so that after the shape memory alloy structures extend towards the power-on key 210, the left and right sides of the power-on key 210 can be mutually matched and pressed, and the power-on of the electronic device 200 can be realized.

In some examples of the application, referring to fig. 2, the shape memory alloy structure is a shape memory alloy coating or sheet.

In the embodiment of the present application, a specific deformation region 113 may be provided on the inner wall of one of the side barrier portions 112 of the lining structure 110, and a shape memory alloy structure portion made of a shape memory alloy material may be directly formed on the deformation region 113, as described above, and the effect thereof will not be repeated herein.

The specific form of the shape memory alloy structure on the side stop 112 may include a plurality of forms.

Such as a shape memory alloy coating or a shape memory alloy sheet, etc. Both of these forms do not affect the size and structure of the liner structure 110, and do not affect the size of the receiving space on the liner structure 110 for receiving electronic devices. No major changes to liner structure 110 are required.

In the embodiment of the present application, a thinner shape memory alloy coating or a shape memory alloy elastic sheet is added on the inner wall of one side blocking portion 112 (i.e. the position of the deformation region 113) of the lining structure 110 of the packaging box 100, and in the low temperature state, the shape memory alloy coating or the shape memory alloy elastic sheet can be attached to or close to the power-on key 210 of the electronic device 200, so that the power-on key 210 is not stressed, and deformation is generated to press inwards in the high temperature state, thereby the power-on key 210 is stressed to complete the power-on of the electronic device 200.

In some examples of the application, referring to fig. 3 and 4, a microwave absorbing material structure 114 is disposed on one of the side barrier portions 112, and the microwave absorbing material structure 114 generates heat after absorbing microwaves and transmits the heat to the shape memory alloy structure portion.

In an embodiment of the present application, a microwave absorbing material may also be added to the side stops 112. The microwave absorbing material heats up after absorbing microwaves, thereby transferring heat to the shape memory alloy structural portion of the deformation region 113, so that the shape memory alloy structural portion is deformed due to temperature change after absorbing heat.

The microwave absorbing materials described above are mainly dielectric materials between metals and insulators.

Optionally, the microwave absorbing material comprises a textile fiber material, paper, wood, ceramic, water, paraffin, and the like.

In some examples of the present application, as shown in fig. 3, the microwave absorbing material structure 114 and the deformation zone 113 are disposed on an inner wall of one of the side barrier portions 112, and the microwave absorbing material structure 114 and the shape memory alloy structure portion are in contact or connected to each other.

In the embodiment of the present application, not only the shape memory alloy structure portion but also the microwave absorbing material structure 114 are provided on the side stopper portion 112.

One of the layout modes is as follows: the shape memory alloy structure portion and the microwave absorbing material structure 114 are disposed on the same side of the side shielding portion 112, that is, both are disposed on the inner wall of the side shielding portion 112 and are in contact with each other or connected with each other, so that the heat absorbed by the microwave absorbing material structure 114 can be more directly transferred to the shape memory alloy structure portion of the deformation area 113, so that the shape memory alloy structure portion is deformed due to temperature change, and the start-up key 210 of the electronic device 200 is extruded, thereby realizing start-up of the electronic device 200.

In some examples of the application, as shown in fig. 4, the microwave absorbing material structure 114 and the shape memory alloy structure portion are disposed adjacent; the microwave absorbing material structure 114 is disposed on an outer wall of one of the side guards 112, and the shape memory alloy structure is disposed on an inner wall of one of the side guards 112.

In the embodiment of the present application, not only the shape memory alloy structure portion but also the microwave absorbing material structure 114 are provided on the side stopper portion 112. And the other layout mode is as follows: the shape memory alloy structure part and the microwave absorbing material structure 114 are respectively arranged at two sides of the side baffle part 112, namely, the two side baffle parts 112 are separated, so that the heat absorbed by the microwave absorbing material structure 114 can be conducted to the shape memory alloy structure part of the deformation area 113 through the side baffle part 112, and the shape memory alloy structure part is deformed due to temperature change so as to squeeze the start-up key 210 of the electronic equipment 200, thereby realizing the start-up of the electronic equipment 200.

It should be noted that when the microwave absorbing material structure 114 is disposed on the outer wall of the side barrier 112, it can absorb heat from the external environment much better and more quickly.

In some examples of the application, referring to fig. 3 and 4, the microwave absorbing material structure 114 is a coating or sheet of microwave absorbing material.

It should be noted that, when the microwave absorbing material structure 114 and the shape memory alloy structure portion are disposed on the inner wall of the side baffle portion 112, the microwave absorbing material structure 114 is disposed locally on the inner wall of the side baffle portion 112, and the area of the microwave absorbing material structure may be designed to be larger than that of the shape memory alloy structure portion, so that much heat is absorbed conveniently, and heat is better transferred to the shape memory alloy structure portion.

When the microwave absorbing material structure 114 and the shape memory alloy structure are disposed on two sides of the side guard 112, the microwave absorbing material structure 114 can cover the outer wall of the side guard 112 in a large area to absorb heat well and transfer heat to the shape memory alloy structure.

In some examples of the present application, the electronic device package further includes a clamping pin, the power-on key 210 is opposite to the shape memory alloy structure portion disposed on one of the side blocking portions 112, and the clamping pin is horizontally disposed between the power-on key 210 and the shape memory alloy structure portion.

Card holder pins are generally arranged in the electronic equipment set, so that an end user can conveniently take and put the card holder when using the electronic equipment. In conventional packages, the card holder pins are individually placed in special slots.

In the embodiment of the present application, the card support pin is designed to be placed between the power-on key 210 and one side stop 112 of the electronic device 200, so that when at least one of the power-on key 210 and the side stop 112 extends to the other, the power-on key 210 can be triggered to be pressed by the card support pin placed between them, thereby realizing the power-on of the electronic device 200.

It should be noted that the card holder pin portion may be disposed between the power-on key 210 and the side stopper 112. For example, one end of the clip pin contacts the power-on key 210, and the other end of the clip pin is inserted into the side stop 112, so that the size of the liner structure 110 is prevented from increasing due to the excessive space occupied by the clip pin between the power-on key 210 and the side stop 112.

In some examples of the application, referring to fig. 4, the package 100 includes an outer package body 120, a receiving cavity is formed in the outer package body 120, and the liner structure 110 is disposed in the receiving cavity.

It will be appreciated that the package 100 of the embodiments of the present application may be used to house and protect the electronic device 200 for ease of transportation and sale. The package 100 design may include two parts: the outer packaging box 120 and the inner lining structure 110, wherein the inner lining structure 110 is detachably disposed in the outer packaging box 120, and can be used for specially accommodating the electronic device 200, and other accessories of the electronic device 200 can be separated by the inner lining structure 110 to be accommodated in the outer packaging box 120, so as to be beneficial to protecting the electronic device 200.

In packaging the electronic device 200, the electronic device 200 may be placed on the liner structure 110, and then the liner structure 110 may be placed within the overpack box 120. The outer packaging box 120 is also provided with a plastic package, an anti-disassembly and anti-counterfeiting label, which is used for ensuring that the electronic equipment is complete and is not polluted.

It should be noted that the electronic device may be a terminal, or may be another device other than a terminal. For example, the electronic device may be, for example, a Mobile phone, a tablet computer, a notebook computer, a palm computer, a vehicle-mounted electronic device, a Mobile internet appliance (Mobile INTERNET DEVICE, MID), an augmented reality (augmented reality, AR)/Virtual Reality (VR) device, a robot, a wearable device, an ultra-Mobile personal computer (UMPC), a netbook or a Personal Digital Assistant (PDA), etc., and may also be a server, a network attached storage (Network Attached Storage, NAS), a personal computer (personal computer, PC), a Television (TV), an teller machine, a self-service machine, etc., which are not limited herein.

In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the application, the scope of which is defined by the claims and their equivalents.

Claims

1. An electronic device kit, characterized by comprising an electronic device (200) and a package (100);

The packaging box (100) comprises a lining structure (110), wherein the lining structure (110) comprises a bottom support (111) and a plurality of side blocking parts (112) which are arranged on the edge of the bottom support (111) in a surrounding mode, and the bottom support (111) and the side blocking parts (112) form a containing space for containing the electronic equipment (200) in a surrounding mode;

When the electronic device (200) is disposed in the accommodating space, a start-up key (210) of the electronic device (200) and one of the side blocking parts (112) of the plurality of side blocking parts (112) are close to each other, at least one of the side blocking parts (112) and the start-up key (210) comprises a shape memory alloy structure part, and after the shape memory alloy structure part is deformed, the side blocking part (112) is matched with the start-up key (210) to press the start-up key (210);

at least part of the start-up key (210) is the shape memory alloy structure, and the start-up key (210) can be switched between a first shape and a second shape at different temperatures;

when the shape of the start key (210) is the first shape, the start key (210) is in contact with or spaced from the inner wall of one of the side blocking parts (112) of the plurality of side blocking parts (112);

When the shape of the start key (210) is the second shape, the start key (210) can extend towards the inner wall of one side blocking part (112) of the plurality of side blocking parts (112), so that the start key (210) is pressed by the inner wall of the side blocking part (112).

2. The electronic device set according to claim 1, characterized in that a deformation zone (113) is provided at least partially on the inner wall of one of the side stops (112) of the plurality of side stops (112), the shape memory alloy structure being provided on the deformation zone (113), the shape memory alloy structure being switchable between a third shape and a fourth shape at different temperatures;

when the shape of the shape memory alloy structure is the third shape, the shape memory alloy structure is in contact with or spaced from the start key (210);

In case the shape of the shape memory alloy structure is the fourth shape, the shape memory alloy structure is extendable towards the start key (210) for pressing the start key (210).

3. The electronic device package of claim 2, wherein the start key (210) is opposite the shape memory alloy structure;

Or alternatively

The two shape memory alloy structural parts are symmetrically arranged on the deformation area (113), and orthographic projections of two opposite side parts of the start key (210) on the deformation area (113) are respectively overlapped with the two shape memory alloy structural parts.

4. The electronic device kit of claim 2, wherein the shape memory alloy structure is a shape memory alloy coating or a shape memory alloy sheet.

5. The electronic device set according to claim 2, wherein a microwave absorbing material structure (114) is provided on one of the side stops (112) of the plurality of side stops (112), the microwave absorbing material structure (114) being capable of generating heat after absorbing microwaves and conducting the heat to the shape memory alloy structure.

6. The electronic device set according to claim 5, wherein the microwave absorbing material structure (114) and the shape memory alloy structure portion are both disposed on an inner wall of one of the side barrier portions (112), and the microwave absorbing material structure (114) and the shape memory alloy structure portion are in contact with each other or connected to each other.

7. The electronic device kit of claim 5, wherein the microwave absorbing material structure (114) and the shape memory alloy structure portion are disposed adjacent;

Wherein the microwave absorbing material structure (114) is arranged on the outer wall of one side baffle part (112), and the shape memory alloy structure part is arranged on the inner wall of one side baffle part (112).

8. The electronic device kit according to claim 5, wherein the microwave absorbing material structure (114) is a microwave absorbing material coating or a microwave absorbing material sheet.

9. The electronic device set of claim 1, further comprising a card-holding thimble, wherein the power-on key (210) faces the shape memory alloy structure portion provided on one of the side-stop portions (112), and wherein the card-holding thimble is horizontally provided between the power-on key (210) and the shape memory alloy structure portion.