CN114953646A - Preparation method of copper-clad plate for mini LED backboard and copper-clad plate - Google Patents

Preparation method of copper-clad plate for mini LED backboard and copper-clad plate Download PDF

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Publication number
CN114953646A
CN114953646A CN202210649879.7A CN202210649879A CN114953646A CN 114953646 A CN114953646 A CN 114953646A CN 202210649879 A CN202210649879 A CN 202210649879A CN 114953646 A CN114953646 A CN 114953646A
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resin
copper
plate
parts
preparation
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Inventor
李凌云
杨永亮
刘政
郑宝林
栾好帅
徐凤
史晓杰
姜晓亮
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SHANDONG JINBAO ELECTRONICS CO Ltd
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SHANDONG JINBAO ELECTRONICS CO Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
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    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
    • B32B5/26—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer another layer next to it also being fibrous or filamentary
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    • H01L33/58—Optical field-shaping elements
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    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
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    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
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    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B32B2307/3065—Flame resistant or retardant, fire resistant or retardant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B32B2307/416—Reflective
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
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    • C—CHEMISTRY; METALLURGY
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Abstract

The invention discloses a preparation method of a copper-clad plate for a mini LED backboard, which comprises the following steps: (1) preparing glue solution; (2) after the electronic-grade glass fiber cloth is soaked in the resin prepared in the step (1), the resin is processed by a sizing machine at the temperature of 100-200 ℃ to prepare a prepreg; (3) stacking a plurality of prepregs prepared in the step (2) together, and covering a copper foil on each of two sides to obtain a plate; and (3) correspondingly superposing the plate and the stainless steel plate up and down, sending the plate and the stainless steel plate into a vacuum press, and carrying out hot pressing to obtain the copper-clad plate for the mini LED backboard. The invention also provides the copper-clad plate prepared by the preparation method. The invention adopts uvioresistant epoxy resin, BT resin and SMA resin as main resin, Tg is more than or equal to 220 ℃, Z-axis CTE is less than or equal to 15 ppm/DEG C, and the invention has the following heat resistance: t288 is more than 120min, and the heat resistance is better, and dimensional stability is better, and anti ultraviolet, resistant radiation, reflectivity are high.

Description

Preparation method of copper-clad plate for mini LED backboard and copper-clad plate
Technical Field
The invention relates to the technical field of copper-clad plate production, in particular to a preparation method of a copper-clad plate for a mini LED (light-emitting diode) back plate and the copper-clad plate.
Background
As one of the countries with the most potential development of global electronics, under the drive of the vigorous demands of terminals such as televisions, displays, wearable devices and vehicle-mounted displays, the Mini LED industry is expected to rapidly increase in the coming years. On the premise of thinning the Mini LED, the high requirements of display and backlight effects provide new challenges for processing accuracy such as thickness uniformity, smoothness, alignment degree and the like of the PCB back plate, and in addition, a large number of LED chips and driving ICs are arranged on the PCB back plate, so that the Tg point of the back plate needs to be high, the PCB back plate needs to be subjected to various external forces in the process of processing the Mini LED, and the thickness uniformity, the size stability and the like of the back plate are very important to maintain. At present, the copper-clad plate for the mini LED back plate also has to solve the problems.
In patent CN 114085636A, a resin composition using novolac epoxy resin, alicyclic epoxy resin and benzoxazine resin as main body resins is disclosed, and the prepared epoxy glass cloth-based copper-clad laminate can reach Tg not less than 150 ℃; z-axis CTE is less than or equal to 3.0%; in terms of heat resistance: TD is more than or equal to 400 ℃, and T288 is more than 60 min.
Disclosure of Invention
Aiming at the defects in the prior art, the invention provides a preparation method of a copper-clad plate for a mini LED backboard and the copper-clad plate, wherein the Tg of the prepared copper-clad plate is more than or equal to 220 ℃, the CTE of a Z axis is less than or equal to 15 ppm/DEG C, and the heat resistance is as follows: t288 is more than 120min, and the heat resistance is better, and dimensional stability is better, and anti ultraviolet, resistant radiation, reflectivity are high.
In order to solve the technical problem, the embodiment of the invention discloses a preparation method of a copper-clad plate for a mini LED backboard, which comprises the following steps:
(1) preparing glue solution: mixing 20-40 parts of special epoxy resin, 20-40 parts of modified BT resin, 20-40 parts of SMA resin, 5-20 parts of hexahydrophthalic anhydride, 5-30 parts of phosphorus-containing flame retardant, 0.1-20 parts of crosslinking curing agent and curing accelerator, 5-20 parts of toughening agent, 0.1-1 part of coupling agent, 40-100 parts of solvent and 50-150 parts of filling material in parts by weight, emulsifying and stirring uniformly;
(2) after the electronic-grade glass fiber cloth is soaked in the resin prepared in the step (1), a prepreg is prepared through a sizing machine at the temperature of 100-200 ℃, and the gel content is controlled to be 45-55%;
(3) stacking a plurality of prepregs prepared in the step (2) together, and covering a copper foil on each of two sides to obtain a plate; and (3) correspondingly superposing the plate and the stainless steel plate up and down, sending the plate and the stainless steel plate into a vacuum press, and carrying out hot pressing to obtain the copper-clad plate for the mini LED backboard.
On the basis of the technical scheme, the invention can be further improved as follows:
further, in the step (1), the SMA resin may be dissolved in a solvent in advance to prepare a solution, so as to promote rapid dissolution.
Further, in the step (1), the special epoxy resin is one or a mixture of two of ultraviolet-resistant and anti-radiation epoxy resin, polyacrylate modified novolac epoxy resin and cyanate modified epoxy resin.
The special epoxy resin can be Japanese xylonite 2021P alicyclic epoxy resin, the epoxy equivalent is 130-130g/Eq, the chroma (P-l-Co) is 50max, the high temperature resistance, the yellowing resistance, the weather resistance, the transparency are good, the halogen content is low, and the electrical insulation property is excellent; the SMA resin is a copolymer of styrene and maleic anhydride, the copolymerization ratio is 6:1, the molecular weight of the SMA resin is between 6000-6500, and the structural formula is as follows:
Figure BDA0003684917010000021
wherein x and y are 6:1, y is more than or equal to 1 and less than or equal to 500, and n is a positive integer.
Further, in the step (1), the modified BT resin is one or two of diene-terminated rodlike imide modified BT resin or long-chain bismaleimide modified cyanate resin.
Further, in the step (1), the phosphorus-containing flame retardant is one or two of a phosphazene compound or resorcinol bis [ bis (2, 6-dimethylphenyl) ] phosphate.
Furthermore, the phosphorus content of the phosphazene compound is 13 wt%, and the phosphazene compound is an inorganic compound which is formed by arranging P, N alternating double bonds into a main chain structure, exists in a ring or linear structure, is a product formed by connecting phenoxy to phosphorus atoms, and is a product formed by combining an inorganic compound and an organic compound by introducing the phenoxy, and is a good halogen-free environment-friendly flame retardant. The phosphazene compound has the following structural formula:
Figure BDA0003684917010000031
the resorcinol bis [ bis (2, 6-dimethylphenyl) ] phosphate is a polycondensation type phosphate flame retardant and contains 10.5 wt% of phosphorus.
Further, in the step (1), the crosslinking curing agent and the curing accelerator are one or two of 2-ethyl-4-methylimidazole or amine catalysts, the toughening agent is one or two of hydrogenated styrene butadiene rubber or phenol biphenyl type epoxy resin, the coupling agent is KH-570, and the solvent is one or more of toluene, acetone, butanone and xylene. Among them, isophoronediamine is preferable as the amine catalyst.
Further, in the step (1), the filling material is one or a mixture of more than two of rutile type titanium dioxide, alumina, mica powder and spherical silicon, and the particle size is 0.5-20 μm.
Wherein, TiO in the titanium dioxide 2 The content is 95 percent, the average grain diameter is 3-5 mu m, and the maximum grain diameter is not more than 20 mu m; whiteness degree>95 percent. The filler material is added last.
Further, in the step (2), the electronic grade glass fiber cloth is treated by a silane coupling agent, and the electronic grade glass fiber cloth is any one of E glass fiber cloth or NE glass fiber cloth. The gel time of the prepreg was controlled at 180-.
Further, in the step (3), the hot-pressing conditions are that the temperature is 100- 2 And the hot pressing time is 150-.
The number of prepregs can be adjusted according to different thickness requirements, after the plate and the stainless steel plate are correspondingly overlapped up and down, the high heat-resistant felt is firstly paved, and then the plate is sent into a vacuum press for hot pressing for 120-240 min.
The embodiment of the invention also discloses a copper-clad plate for the mini LED backboard, which is prepared by adopting the preparation method.
Compared with the prior art, the invention has the following beneficial effects:
(1) the epoxy resin disclosed by the invention is resistant to radiation and high temperature, and is matched with a high-reflection white filler, so that the prepared backboard is good in reflectivity, strong in weather resistance and high in Tg (glass transition temperature);
(2) the modified BT resin has extremely low Coefficient of Thermal Expansion (CTE), and meets the requirements on alignment and processing precision when the mini LED backboard is used;
(3) the SMA resin in the invention can greatly improve the Tg value and the thermal deformation temperature of the copper-clad plate;
(4) the hexahydrophthalic anhydride is micromolecular anhydride, so that the crosslinking density is improved, the heat resistance of the hexahydrophthalic anhydride can be improved, the free volume is reduced, the toughness is improved, the water absorption is reduced, the stress generated in the high-temperature lead-free welding process of the manufactured PCB is reduced, and the Tg is higher;
(5) the flame retardant has a unique self-extinguishing function, has a higher thermal decomposition temperature and a flame retardant effect, can reach UL-94 VO-level flame retardant performance, and has a flame retardant performance greatly superior to that of a traditional flame retardant system; and smoke and toxic gas are few, so that the material is an environment-friendly flame-retardant material and can meet the requirements of European Union RollS instruction and WEEE instruction;
(6) the filler added into the glue solution, such as rutile titanium dioxide, has the advantages of high reflectivity, yellowing resistance, ultraviolet resistance, small particle size and good dispersibility, and the prepared PCB has low molding shrinkage, thermal expansion coefficient and good dimensional stability;
(7) the copper-clad plate material prepared by the invention has the CTE (coefficient of thermal expansion) as low as 15 ppm/DEG C, the Tg as high as 220 ℃, T288>120min and the reflectivity (A state) > 90%, meets the requirements of a mini LED on heat resistance, dimensional stability and the like, and greatly improves the packaging efficiency and the reliability of a PCB (printed circuit board).
Detailed Description
The following description of the embodiments of the present invention is provided for illustrative purposes, and other advantages and effects of the present invention will become apparent to those skilled in the art from the present disclosure. While the invention will be described in conjunction with the preferred embodiments, it is not intended that the features of the invention be limited to that embodiment. On the contrary, the invention is described in connection with the embodiments for the purpose of covering alternatives or modifications that may be extended based on the claims of the present invention. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The invention may be practiced without these particulars. Moreover, some of the specific details have been left out of the description in order to avoid obscuring or obscuring the focus of the present invention. It should be noted that the embodiments and features of the embodiments may be combined with each other without conflict.
Example 1
A preparation method of a copper-clad plate for a mini LED backboard comprises the following steps:
(1) preparing resin glue solution: according to the weight portion, 20 portions of special epoxy resin (2021P alicyclic epoxy resin), 40 portions of diene end capping rod-shaped imide modified BT resin, 30 portions of SMA resin (copolymerization ratio is 6: 1), 7 portions of hexahydrophthalic anhydride, 30 portions of phosphorus-containing flame retardant phosphazene compound, 0.07 portion of 2-ethyl-4 methylimidazole, 10 portions of flexibilizer (hydrogenated nitrile rubber), 0.5 portion of coupling agent KH-570, 100 portions of butanone, 90 portions of filling material titanium dioxide and 20 portions of filling material ball silicon are mixed, emulsified and stirred uniformly;
(2) after the electronic grade 2116 glass fiber cloth is soaked in the resin prepared in the step (1), a prepreg is prepared by a gluing machine at 140 ℃, the glue content is controlled to be 45-55%, and the gelling time is 200 +/-20 seconds;
(3) stacking a plurality of prepregs prepared in the step (2) together, and covering a copper foil on each of two sides to obtain a plate; laminating the plate and stainless steel plate, feeding into vacuum press, and heating at 220 deg.C and 120kgf/cm 2 And (4) carrying out hot pressing for 180min under the condition to obtain the copper-clad plate for the mini LED backboard.
Example 2
A preparation method of a copper-clad plate for a mini LED backboard comprises the following steps:
(1) preparing resin glue solution: according to the weight parts, 30 parts of special epoxy resin (polyacrylate modified novolac epoxy resin), 20 parts of diene-terminated rod-shaped imide modified BT resin, 40 parts of SMA resin (copolymerization ratio is 6: 1), 10 parts of hexahydrophthalic anhydride, 20 parts of resorcinol bis [ bis (2, 6-dimethylphenyl) (the content of phosphate phosphorus is 10.5 percent by weight), 0.05 part of 2-ethyl-4-methylimidazole, 0.5 part of isophorone diamine, 10 parts of flexibilizer (hydrogenated nitrile rubber), 0.5 part of coupling agent KH-570, 80 parts of butanone, 20 parts of toluene, 70 parts of filling material titanium dioxide and 40 parts of filling material mica powder are mixed, emulsified and stirred uniformly;
(2) dipping electronic grade 7628 glass fiber cloth in the resin glue solution prepared in the step (1), passing through a glue applicator at 140 ℃, controlling the gelling time to be 200 +/-20 seconds, preparing a prepreg, and controlling the glue content to be 43-46%;
(3) taking 6 prepregs prepared in the step (2) to be stacked together, and covering a 35-micrometer copper foil on each of two sides to obtain a plate; laminating the plate and stainless steel plate, spreading high heat-resistant felt, feeding into vacuum press, heating at 215 deg.C and 150kgf/cm 2 And (4) carrying out hot pressing for 200min under the condition to obtain the copper-clad plate for the mini LED backboard.
Comparative example
A preparation method of a copper-clad plate comprises the following steps:
(1) preparing resin glue solution: according to parts by weight, 40 parts of PPE resin (dihydroxy-terminated polyphenyl ether oligomer), 140 parts of dicyclopentadiene epoxy resin, 10 parts of DDS (4,4' -diaminodiphenyl sulfone) resin, 0.3 part of cross-linking curing agent 2-methyl-4-ethylimidazole, 0.5 part of dispersing agent BYK-W903, 100 parts of solvent acetone, 20 parts of flame retardant tetrabromobisphenol A and 40 parts of filling material high-purity superfine spherical nano amorphous silicon micro powder are mixed, emulsified and stirred uniformly;
(2) dipping electronic-grade glass fiber cloth in the resin glue solution prepared in the step (1), and passing through a gluing machine at 170 ℃ to control the gelling time to be 95 seconds to prepare a prepreg;
(3) taking 6 prepregs obtained in the step (2) to be overlaid together, and covering 18-micrometer copper foils on two sides of each prepreg to obtain a plate; laminating the plate and stainless steel plate, spreading high heat-resistant felt, feeding into vacuum press at 240 deg.C and 120kgf/cm 2 And hot pressing for 180min under the condition to obtain the copper-clad plate.
The experimental data of the performance tests of the samples obtained in examples 1-2 and comparative example are shown in Table 1.
TABLE 1 comparison of the data from the various performance tests of the samples from examples 1-2 and comparative examples
Figure BDA0003684917010000061
As can be seen from Table 1, the copper-clad plate material prepared in the example 1-2 has Z-CTE (coefficient of thermal expansion) as low as 15 ppm/DEG C, Tg as high as 220 ℃, T288>120min and reflectivity (A state) > 90%, compared with the comparative example, the copper-clad plate prepared in the example 1-2 has excellent test effects of Z-CTE, Tg, T288 and reflectivity, and the copper-clad plate prepared in the invention is proved to have lower CTE, higher Tg, higher heat resistance and higher reflectivity. The service condition of the mini LED backboard can be met.
In the resin glue solution, modified BT resin and special epoxy resin are used as main body resin, hexahydrophthalic anhydride is introduced as micromolecule, and biphenyl group is introduced in an epoxy resin framework, so that the heat resistance of the resin glue solution can be improved, the free volume is reduced, the toughness is improved, the water absorption is reduced, and the stress generated in the high-temperature lead-free welding process of the manufactured PCB is reduced. The addition of styrene-maleic anhydride copolymer (SMA resin) increases the glass transition and heat distortion temperature. The modified BT resin not only retains the original excellent heat resistance and low metal ion migration resistance of the BT resin, but also has good dimensional stability, namely low CTE, and greatly improves the dielectric property and the mechanical processing property of the BT resin. The special epoxy resin resists ultraviolet and radiation, and the reflectivity of the copper-clad plate is improved together with the added titanium dioxide. The copper-clad plate material prepared by the invention has the CTE (coefficient of thermal expansion) as low as 15 ppm/DEG C, the Tg as high as 220 ℃, T288>120min and the reflectivity (A state) > 90%, meets the requirements of a mini LED on heat resistance, dimensional stability and the like, and greatly improves the packaging efficiency and the reliability of a PCB (printed circuit board).
While the invention has been described with reference to certain preferred embodiments thereof, it will be understood by those skilled in the art that the foregoing is a more particular description of the invention than is possible with reference to the specific embodiments, which are not to be construed as limiting the invention. Various changes in form and detail, including simple deductions or substitutions, may be made by those skilled in the art without departing from the spirit and scope of the invention.

Claims (10)

1. A preparation method of a copper-clad plate for a mini LED backboard is characterized by comprising the following steps:
(1) preparing glue solution: mixing 20-40 parts of special epoxy resin, 20-40 parts of modified BT resin, 20-40 parts of SMA resin, 5-20 parts of hexahydrophthalic anhydride, 5-30 parts of phosphorus-containing flame retardant, 0.1-20 parts of crosslinking curing agent and curing accelerator, 5-20 parts of toughening agent, 0.1-1 part of coupling agent, 40-100 parts of solvent and 50-150 parts of filling material in parts by weight, emulsifying and stirring uniformly;
(2) after the electronic-grade glass fiber cloth is soaked in the resin prepared in the step (1), the resin is processed by a sizing machine at the temperature of 100-200 ℃ to prepare a prepreg;
(3) stacking a plurality of prepregs prepared in the step (2) together, and covering a copper foil on each of two sides to obtain a plate; and (3) correspondingly superposing the plate and the stainless steel plate up and down, sending the plate and the stainless steel plate into a vacuum press, and carrying out hot pressing to obtain the copper-clad plate for the mini LED backboard.
2. The preparation method according to claim 1, wherein in the step (1), the special epoxy resin is one or a mixture of two of ultraviolet-resistant and radiation-resistant epoxy resin, polyacrylate-modified novolac epoxy resin and cyanate ester-modified epoxy resin.
3. The preparation method according to claim 1, wherein in the step (1), the modified BT resin is one or both of a diene-terminated rod-shaped imide modified BT resin and a long-chain bismaleimide modified cyanate resin.
4. The method according to claim 1, wherein in step (1), the phosphorus-containing flame retardant is one or both of a phosphazene compound and resorcinol bis [ bis (2, 6-dimethylphenyl) ] phosphate.
5. The method of claim 4, wherein the phosphazene compound contains 13 wt% phosphorus, and the phosphazene compound has the following structural formula:
Figure FDA0003684913000000011
the phosphorus content of the resorcinol bis [ bis (2, 6-dimethylphenyl) ] phosphate was 10.5% by weight.
6. The preparation method according to claim 1, wherein in the step (1), the crosslinking curing agent and the curing accelerator are one or two of 2-ethyl-4-methylimidazole and amine catalysts, the toughening agent is one or two of hydrogenated styrene butadiene rubber or phenol biphenyl type epoxy resin, the coupling agent is KH-570, and the solvent is one or more of toluene, acetone, butanone and xylene.
7. The preparation method according to claim 1, wherein in the step (1), the filler is one or a mixture of more than two of rutile titanium dioxide, alumina, mica powder and spherical silica, and the particle size is 0.5-20 μm.
8. The preparation method according to claim 1, wherein in the step (2), the electronic-grade glass fiber cloth is treated by a silane coupling agent, and the electronic-grade glass fiber cloth is any one of E glass fiber cloth or NE glass fiber cloth.
9. The method according to claim 1, wherein in the step (3), the hot pressing condition is a temperature of 100 ℃ and a pressure of 70 to 150kgf/cm 2 And the hot pressing time is 150-.
10. A copper-clad plate for a mini LED backboard is characterized in that the copper-clad plate is prepared by the preparation method of any one of claims 1-9.
CN202210649879.7A 2022-06-09 2022-06-09 Preparation method of copper-clad plate for mini LED backboard and copper-clad plate Pending CN114953646A (en)

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