CN114953350A - Forming die for high-precision chip - Google Patents
Forming die for high-precision chip Download PDFInfo
- Publication number
- CN114953350A CN114953350A CN202210517109.7A CN202210517109A CN114953350A CN 114953350 A CN114953350 A CN 114953350A CN 202210517109 A CN202210517109 A CN 202210517109A CN 114953350 A CN114953350 A CN 114953350A
- Authority
- CN
- China
- Prior art keywords
- die
- chip
- production
- cavity
- mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 claims abstract description 47
- 238000005266 casting Methods 0.000 claims abstract description 11
- 239000012530 fluid Substances 0.000 claims abstract description 11
- 238000010438 heat treatment Methods 0.000 claims abstract description 11
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 230000001681 protective effect Effects 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 238000003754 machining Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000000018 DNA microarray Methods 0.000 description 2
- 230000008676 import Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005323 electroforming Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005180 public health Effects 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/2602—Mould construction elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
- B29C33/3842—Manufacturing moulds, e.g. shaping the mould surface by machining
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/27—Sprue channels ; Runner channels or runner nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/72—Heating or cooling
- B29C45/73—Heating or cooling of the mould
- B29C45/7331—Heat transfer elements, e.g. heat pipes
Abstract
The invention relates to a die for forming a high-precision chip, which specifically comprises a rack, wherein an upper die production die and a lower die production die are arranged on the rack, a workbench is arranged on the rack, the upper die production die and the lower die production die are fixed on the workbench, a casting fluid inlet is arranged on the upper die production die, the upper die production die comprises an upper die cavity, the lower die production die comprises a lower die cavity, the lower die cavity and the upper die cavity can respectively abut against two sides of the casting fluid inlet, and a heating plate is arranged on the lower die cavity; the invention meets the requirement of high-precision chip manufacture in quality, can greatly reduce the production cost of the die and improves the working efficiency.
Description
Technical Field
The invention relates to the technical field of chip manufacturing, in particular to a high-precision chip forming die.
Background
In the production process of the chip, a mold is required to be used for injection molding, and due to different structures of the chips with different purposes, a large number of mold cores of the chips with different purposes are required, so that the manufacturing cost of the mold core has great influence on the whole production cost, the industrialized development of the chip can be promoted, and more kinds of chip products can serve the public health; in the prior art, a machining process method is used, however, the surface precision of the injection mold core manufactured by the machining process method is difficult, so that the technical use and popularization of manufactured biochips are influenced, the application of the biochips is further influenced, and a mold for forming the high-precision chips is designed.
Disclosure of Invention
The present invention aims to solve at least to some extent one of the technical problems in the related chip. Therefore, the invention provides a die for forming a high-precision chip.
The technical scheme adopted by the invention for solving the technical problems is as follows: the utility model provides a be used for high-accuracy chip forming die, this be used for high-accuracy chip moulded die specifically includes the frame, be equipped with mould production mould and chip lower mould production mould on the chip in the frame, be provided with the workstation in the frame, mould production mould and chip lower mould production mould are gone up to fixed chip on the workstation, set up the casting fluid import on the mould production mould on the chip, mould production mould includes the die cavity on the chip, chip lower mould production mould includes die cavity down, die cavity and last die cavity can support respectively in the both sides of casting fluid import down, be equipped with the hot plate down on the die cavity.
In a preferred embodiment of the present invention, a heating rod is disposed inside the heating plate.
In a preferred embodiment of the present invention, a protective pad is disposed in the work table.
In a preferred embodiment of the present invention, the material of the upper die and the lower die is stainless steel or aluminum.
The invention has the beneficial effects that: after the structure is adopted, the die is manufactured by machining and electroforming processes, and the die can be used for manufacturing high-precision chips in quality in a plastic injection mode, so that the production cost of the die can be greatly reduced, and the working efficiency is improved.
Drawings
FIG. 1 is a schematic view of the structure of the present invention;
in the figure: the die comprises a frame 1, a die upper die production die 2, a die lower die production die 3, a workbench 4, a casting fluid inlet 5, an upper die cavity 6, a lower die cavity 7, a heating plate 8 and a heating rod 9.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
Example 1:
as shown in fig. 1, a mold for forming a high-precision chip specifically comprises a frame 1, wherein a chip upper mold production mold 2 and a chip lower mold production mold 3 are arranged on the frame 1, a workbench 4 is arranged on the frame 1, the chip upper mold production mold 2 and the chip lower mold production mold 3 are fixed on the workbench 4, a casting fluid inlet 5 is arranged on the chip upper mold production mold 2, the chip upper mold production mold 2 comprises an upper cavity 6, the chip lower mold production mold 3 comprises a lower cavity 7, the lower cavity 7 and the upper cavity 6 can respectively abut against two sides of the casting fluid inlet 5, and a heating plate 8 is arranged on the lower cavity 7.
The heating plate 8 is internally provided with a heating rod 9.
A protective pad is arranged in the working table 4.
The upper die 2 and the lower die 3 are made of stainless steel or aluminum.
Example 2:
as shown in fig. 1, a mold for forming a high-precision chip specifically comprises a frame 1, wherein a chip upper mold production mold 2 and a chip lower mold production mold 3 are arranged on the frame 1, a workbench 4 is arranged on the frame 1, the chip upper mold production mold 2 and the chip lower mold production mold 3 are fixed on the workbench 4, a casting fluid inlet 5 is arranged on the chip upper mold production mold 2, the chip upper mold production mold 2 comprises an upper cavity 6, the chip lower mold production mold 3 comprises a lower cavity 7, and the lower cavity 7 and the upper cavity 6 can respectively abut against two sides of the casting fluid inlet 5.
In the description herein, references to the description of the terms "one embodiment," "certain embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
In summary, although the present invention has been described with reference to the preferred embodiments, the above-described preferred embodiments are not intended to limit the present invention, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, therefore, the scope of the present invention shall be determined by the appended claims.
Claims (4)
1. The utility model provides a be used for high-accuracy chip forming die which characterized in that: the die for the high-precision chip specifically comprises a rack, wherein a chip upper die production die and a chip lower die production die are arranged on the rack, a workbench is arranged on the rack, the chip upper die production die and the chip lower die production die are fixed on the workbench, a casting fluid inlet is arranged on the chip upper die production die, the chip upper die production die comprises an upper die cavity, the chip lower die production die comprises a lower die cavity, the lower die cavity and the upper die cavity can respectively abut against two sides of the casting fluid inlet, and a heating plate is arranged on the lower die cavity.
2. The die for forming the high-precision chip as claimed in claim 1, wherein: and a heating rod is arranged in the heating plate.
3. The die for forming the high-precision chip as claimed in claim 1, wherein: a protective pad is arranged in the workbench.
4. The die for forming the high-precision chip as claimed in claim 1, wherein: the upper die production die and the lower die production die are made of stainless steel or aluminum.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210517109.7A CN114953350A (en) | 2022-05-13 | 2022-05-13 | Forming die for high-precision chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210517109.7A CN114953350A (en) | 2022-05-13 | 2022-05-13 | Forming die for high-precision chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114953350A true CN114953350A (en) | 2022-08-30 |
Family
ID=82981055
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210517109.7A Pending CN114953350A (en) | 2022-05-13 | 2022-05-13 | Forming die for high-precision chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114953350A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120291976A1 (en) * | 2011-05-17 | 2012-11-22 | Erik Gotlund | Side frame and bolster for a railway truck and method for manufacturing same |
| CN210362268U (en) * | 2019-08-07 | 2020-04-21 | 青岛海力威新材料科技股份有限公司 | Rubber injection mold structure |
| CN210552708U (en) * | 2019-07-09 | 2020-05-19 | 成都汉芯国科集成技术有限公司 | Injection mold of semiconductor chip |
| CN215151206U (en) * | 2020-12-21 | 2021-12-14 | 苏州首肯机械有限公司 | Semiconductor packaging press convenient to temperature regulation |
-
2022
- 2022-05-13 CN CN202210517109.7A patent/CN114953350A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120291976A1 (en) * | 2011-05-17 | 2012-11-22 | Erik Gotlund | Side frame and bolster for a railway truck and method for manufacturing same |
| CN210552708U (en) * | 2019-07-09 | 2020-05-19 | 成都汉芯国科集成技术有限公司 | Injection mold of semiconductor chip |
| CN210362268U (en) * | 2019-08-07 | 2020-04-21 | 青岛海力威新材料科技股份有限公司 | Rubber injection mold structure |
| CN215151206U (en) * | 2020-12-21 | 2021-12-14 | 苏州首肯机械有限公司 | Semiconductor packaging press convenient to temperature regulation |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20220830 |