CN213915749U

CN213915749U - Semiconductor production mould

Info

Publication number: CN213915749U
Application number: CN202022660242.7U
Authority: CN
Inventors: 韩印
Original assignee: Shenzhen Hanken Technology Co ltd
Current assignee: Shenzhen Hanken Technology Co ltd
Priority date: 2020-11-17
Filing date: 2020-11-17
Publication date: 2021-08-10
Anticipated expiration: 2030-11-17

Abstract

The utility model discloses a semiconductor production mould, including base, forming die piece, stamping bar, spring, punching press board, heating pipe and boss, the base is located the bottom of whole device, the base inboard is equipped with the boss, the base upper end is equipped with the bed die, the bed die inboard is equipped with the heating pipe, the bed die upper end is equipped with the forming die piece, be equipped with on the cope match-die set the stamping bar, the stamping bar bottom is equipped with the punching press board, the punching press board both ends all are equipped with the spring, it has the fixed column to go up mould evenly distributed all around. The utility model discloses a punching press board is stamped it, because need carry out thermal treatment to the mould among the mould stamping process, makes its efficiency uprise at stamping process, and this device is equipped with the heating pipe and heats the mould, improves the fashioned efficiency of mould, is equipped with the boss on the base of device, makes the stamping process play the guard action to whole device, prolongs the life of mould.

Description

Semiconductor production mould

Technical Field

The utility model relates to a semiconductor production technical field particularly, relates to a semiconductor production mould.

Background

Dies, various moulds and tools for obtaining the desired products by injection, blow, extrusion, die-casting or forging, smelting, stamping, etc. in industrial production, in short, a die is a tool for making shaped articles, which tool is composed of various parts, and different dies are composed of different parts. The die is widely used for blanking, die forging, cold heading, extrusion, powder metallurgy part pressing and pressure casting, and in the forming processing of compression molding or injection molding of products such as engineering plastics, rubber, ceramics and the like, the die has a specific contour or an inner cavity shape, the blank can be separated (blanked) according to the contour shape by applying the contour shape with the cutting edge, and the blank can obtain a corresponding three-dimensional shape by applying the inner cavity shape. The mold generally comprises a movable mold and a fixed mold (or a male mold and a female mold), which can be separated and closed, wherein a workpiece is taken out when the movable mold and the fixed mold are separated, and a blank is injected into a mold cavity for forming when the movable mold and the fixed mold are closed. The die is a precise tool, has a complex shape, bears the expansion force of a blank, has higher requirements on structural strength, rigidity, surface hardness, surface roughness and processing precision, the development level of die production is one of important marks of the mechanical manufacturing level, and the application of the die improves the production efficiency of modern industry.

The existing die for semiconductor production still has certain defects, the packaging is not uniform enough, the runner is too long, the packaging effect is influenced, and the waste of plastic packaging materials is caused, so that the problem is solved by providing the die for semiconductor production.

An effective solution to the problems in the related art has not been proposed yet.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a semiconductor production mould to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a semiconductor production mould, includes base, bed die, forming die piece, goes up mould, stamping rod, spring, punching press board, heating pipe and boss, the base is located the bottom of whole device, the base inboard is equipped with the boss, the base upper end is equipped with the bed die, the bed die inboard is equipped with the heating pipe, the bed die upper end is equipped with the forming die piece, forming die piece upper end is equipped with go up the mould, upward be equipped with on the mould stamping rod, the stamping rod bottom is equipped with the punching press board, punching press board both ends all are equipped with the spring, it has the fixed column to go up mould evenly distributed all around.

Further, the base is fixedly connected with the lower die, and the reinforcing block in the base is made of metal.

Furthermore, fixing grooves are uniformly distributed on the periphery of the lower die and are sleeved on the fixing columns.

Further, go up the mould upper end and be equipped with the recess, the recess communicates with last mould.

Furthermore, the forming die block is fixed on the lower die, and a stamping groove is formed in the forming die block.

Furthermore, a buffer rod is arranged on the spring and fixed on the upper die.

Compared with the prior art, the utility model discloses following beneficial effect has:

(1) the utility model relates to a semiconductor production mould, this device is through last mould and the seamless coincidence of bed die, on putting into finished product mould piece with the mould that will need the punching press, carry out the punching press to it through the punching press board, because need carry out heat treatment to the mould among the mould stamping process, make its efficiency uprise in stamping process, this device is equipped with the heating pipe and heats the mould, improve the fashioned efficiency of mould, be equipped with the boss on the base of device, make its stamping process play the guard action to whole device, the life of extension mould.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a semiconductor production mold according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of the inside of a semiconductor production mold according to an embodiment of the present invention.

Reference numerals:

1. a base; 2. a lower die; 3. forming a mold block; 4. an upper die; 5. a stamping rod; 6. a groove; 7. a buffer rod; 8. a spring; 9. stamping the plate; 10. punching a groove; 11. fixing grooves; 12. heating a tube; 13. a reinforcing block; 14. and (5) fixing the column.

Detailed Description

The following, with reference to the drawings and the detailed description, further description of the present invention is made:

referring to fig. 1-2, according to the embodiment of the present invention, a semiconductor production mold includes a base 1, a lower mold 2, a forming mold block 3, an upper mold 4, a stamping rod 5, a spring 8, a stamping plate 9, a heating pipe 12, and a reinforcing block 13, wherein the base 1 is located at the bottom end of the entire apparatus, the reinforcing block 13 is disposed at the inner side of the base 1, the lower mold 2 is disposed at the upper end of the base 1, the heating pipe 12 is disposed at the inner side of the lower mold 2, the forming mold block 3 is disposed at the upper end of the lower mold 2, the upper mold 4 is disposed at the upper end of the forming mold block 3, the stamping rod 5 is disposed on the upper mold 4, the stamping plate 9 is disposed at the bottom end of the stamping rod 5, the spring 8 is disposed at both ends of the stamping plate 9, and fixing columns 11 are uniformly distributed around the upper mold 4.

Through the above technical scheme of the utility model, base 1 and 2 fixed connection of bed die, boss 13 in the base 1 is the metal material, and boss 13's effect is the bearing capacity of protection mould, evenly distributed has fixed slot 14 all around on the bed die 2, fixed slot 14 cup joints in fixed column 11, it is equipped with recess 6 to go up 4 upper ends of mould, recess 6 and last mould 4 intercommunication, forming die piece 3 is fixed in on the bed die 2, be equipped with stamping groove 10 on the forming die piece 3, be equipped with buffer beam 7 on the spring 8, buffer beam 7 is fixed in on last mould 4.

When specifically using, the utility model relates to a semiconductor production mould, this device is through last mould 4 and 2 seamless coincidences of bed die, put into finished product mould piece 3 with the mould that will need the punching press on, carry out the punching press to it through ram plate 9, because the mould stamping process needs carry out heat treatment to the mould, make its efficiency uprise at stamping process, this device is equipped with heating pipe 12 and heats the mould, improve the fashioned efficiency of mould, be equipped with boss 13 on the base 1 of device, play the guard action to whole device in making its stamping process, the life of extension mould.

In the description of the present invention, it should be noted that the terms "top", "bottom", "one side", "the other side", "front", "back", "middle part", "inside", "top", "bottom", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, which is only for the convenience of description and simplification of the description, but does not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, as they may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The semiconductor production die is characterized by comprising a base (1), a lower die (2), a forming die block (3), an upper die (4), a stamping rod (5), a spring (8), a stamping plate (9), a heating pipe (12) and a reinforcing block (13), wherein the base (1) is positioned at the bottom end of the whole device, the reinforcing block (13) is arranged on the inner side of the base (1), the lower die (2) is arranged at the upper end of the base (1), the heating pipe (12) is arranged on the inner side of the lower die (2), the forming die block (3) is arranged at the upper end of the lower die (2), the upper die (4) is arranged at the upper end of the forming die block (3), the stamping rod (5) is arranged at the bottom end of the stamping rod (5), the springs (8) are arranged at two ends of the stamping plate (9), fixing columns (11) are uniformly distributed on the periphery of the upper die (4).

2. A semiconductor production mould according to claim 1, characterized in that the base (1) is fixedly connected with the lower mould (2), and the reinforcing block (13) in the base (1) is made of metal.

3. The semiconductor production mold according to claim 1, wherein fixing grooves (14) are uniformly distributed around the lower mold (2), and the fixing grooves (14) are sleeved on the fixing columns (11).

4. A semiconductor production mould according to claim 1, characterized in that the upper mould (4) is provided with a groove (6) at its upper end, said groove (6) communicating with the upper mould (4).

5. A semiconductor production mould according to claim 1, characterized in that the forming mould block (3) is fixed on the lower mould (2), and the forming mould block (3) is provided with a stamping groove (10).

6. A semiconductor production mould according to claim 1, characterized in that the spring (8) is provided with a buffer rod (7), and the buffer rod (7) is fixed on the upper mould (4).