CN114952625A - Grinding fluid supply nozzle, system and grinding equipment - Google Patents
Grinding fluid supply nozzle, system and grinding equipment Download PDFInfo
- Publication number
- CN114952625A CN114952625A CN202110195143.2A CN202110195143A CN114952625A CN 114952625 A CN114952625 A CN 114952625A CN 202110195143 A CN202110195143 A CN 202110195143A CN 114952625 A CN114952625 A CN 114952625A
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- Prior art keywords
- filter
- slurry
- grinding
- slurry supply
- grinding fluid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000000227 grinding Methods 0.000 title claims abstract description 77
- 239000012530 fluid Substances 0.000 title claims abstract description 54
- 239000002002 slurry Substances 0.000 claims abstract description 77
- 238000005498 polishing Methods 0.000 claims abstract description 24
- 238000001914 filtration Methods 0.000 claims description 31
- 239000011148 porous material Substances 0.000 claims description 23
- 230000003247 decreasing effect Effects 0.000 claims description 2
- 239000002245 particle Substances 0.000 abstract description 31
- 239000004065 semiconductor Substances 0.000 abstract description 19
- 238000000034 method Methods 0.000 description 9
- 230000000694 effects Effects 0.000 description 6
- 239000007921 spray Substances 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 230000007547 defect Effects 0.000 description 5
- 238000007689 inspection Methods 0.000 description 4
- 238000004220 aggregation Methods 0.000 description 3
- 230000002776 aggregation Effects 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 239000003082 abrasive agent Substances 0.000 description 2
- 238000005457 optimization Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Abstract
The invention provides a grinding fluid supply nozzle, comprising: a slurry filter having an inlet in communication with the slurry supply unit; a slurry nozzle in communication with the filter outlet. There is also provided a slurry supply system comprising: the grinding fluid supply module is used for providing grinding fluid; the slurry supply head according to any one of the above claims, wherein the slurry supply head is in communication with the slurry supply module through a pipe. There is also provided a grinding apparatus comprising: rotating the platform; the grinding pad is arranged on the upper surface of the grinding platform; the slurry supply system of any one of the above claims, wherein the slurry supply nozzle is disposed above the polishing pad. The invention can filter the large-particle aggregate and avoid the scratch formed on the surface of the semiconductor device by the large-particle aggregate.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a grinding fluid supply nozzle, a grinding fluid supply system and grinding equipment.
Background
In the chemical mechanical polishing, the semiconductor device and the polishing pad are moved relative to each other, and at the same time, the polishing agent is supplied onto the polishing pad, and the surface of the semiconductor device is planarized by a physical action of abrasive particles in the polishing agent and the semiconductor device and a chemical reaction of chemical substances in the polishing agent and the semiconductor device.
In the process of implementing the invention, the inventor finds that at least the following technical problems exist in the prior art: in order to avoid the abrasive in the abrasive from being aggregated during supply to form aggregates of large particles, the aggregates of large particles easily scratch the semiconductor device during grinding, resulting in surface defects of the semiconductor device.
Disclosure of Invention
The grinding fluid supply nozzle, the grinding fluid supply system and the grinding equipment provided by the invention can filter large-particle aggregates, and prevent the large-particle aggregates from forming scratches on the surface of a semiconductor device.
In a first aspect, the present invention provides a slurry supply head, comprising:
the grinding fluid filter comprises a filter inlet, a filtering unit and a filter outlet which are sequentially communicated along the supply direction of the grinding fluid; wherein the filter inlet is used for communicating with a grinding fluid supply module;
a slurry nozzle in communication with the filter outlet.
Optionally, the slurry filter comprises more than two slurry filter units connected in series; the filtering pore diameters of more than two grinding fluid filtering units are sequentially decreased progressively along the supply direction of the grinding fluid.
Optionally, the filtration pore size of the filtration unit is no greater than 10 microns.
Optionally, the grinding fluid filtering device further comprises a filtering shell, wherein the filtering shell is provided with at least one mounting cavity, and the grinding fluid filtering unit is detachably arranged in the mounting cavity.
In a second aspect, the present invention provides a slurry supply system, comprising:
the grinding fluid supply module is used for providing grinding fluid;
the polishing slurry supply head of any one of the above embodiments, wherein the polishing slurry supply head is in communication with the polishing slurry supply module through a pipe.
Optionally, the outlet of the slurry supply module is provided with a supply module filter, and the outlet of the supply module filter is communicated with the slurry supply spray head through a pipeline.
Optionally, the filter pore size of the supply module filter is not larger than the filter pore size of the slurry filter.
Optionally, the filter pore size of the supply module filter is 1-10 microns.
Optionally, the length of the conduit is no less than 3 meters.
In a third aspect, the present invention provides a grinding apparatus comprising:
rotating the platform;
the grinding pad is arranged on the upper surface of the grinding platform;
the slurry supply system of any one of the above claims, wherein the slurry supply nozzle is disposed above the polishing pad.
According to the technical scheme provided by the invention, the grinding fluid filter is arranged on the spray head, and the tail end of the supply of the grinding fluid is filtered, so that large-particle aggregates are prevented from appearing in the flattening process of the semiconductor device, and the semiconductor device is prevented from being scratched by the large-particle aggregates. According to the technical scheme provided by the invention, substances causing defects can be prevented from flowing into the grinding pad, so that the damage of devices is reduced, the yield of products is improved, and the inspection frequency of equipment is reduced.
Drawings
FIG. 1 is a schematic view of a polishing apparatus according to an embodiment of the present invention.
Detailed Description
Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. It should be understood that the description is illustrative only and is not intended to limit the scope of the present disclosure. Moreover, in the following description, descriptions of well-known structures and techniques are omitted so as to not unnecessarily obscure the concepts of the present disclosure.
Various structural schematics according to embodiments of the present disclosure are shown in the figures. The figures are not drawn to scale, wherein certain details are exaggerated and possibly omitted for clarity of presentation. The shapes of various regions, layers, and relative sizes and positional relationships therebetween shown in the drawings are merely exemplary, and deviations may occur in practice due to manufacturing tolerances or technical limitations, and a person skilled in the art may additionally design regions/layers having different shapes, sizes, relative positions, as actually required.
In the context of the present disclosure, when a layer/element is referred to as being "on" another layer/element, it can be directly on the other layer/element or intervening layers/elements may be present. In addition, if a layer/element is "on" another layer/element in one orientation, then that layer/element may be "under" the other layer/element when the orientation is reversed.
In a first aspect, an embodiment of the present invention provides a slurry supply head, as shown in fig. 1, including:
the grinding fluid filter comprises a filter inlet, a filtering unit and a filter outlet which are sequentially communicated along the supply direction of the grinding fluid; wherein the filter inlet is used for communicating with a grinding fluid supply module; in some embodiments, the filtering pore size of the slurry filter is slightly larger than the desired abrasive particle size, so that particles larger than the desired abrasive particle size are filtered and prevented from flowing onto the polishing pad 6 to scratch the semiconductor device.
A slurry nozzle in communication with the filter outlet. In some embodiments, the slurry nozzle is directly connected to the outlet of the slurry filter, so that the slurry is directly supplied to the polishing pad 6 through the nozzle after being filtered, thereby preventing the abrasive from being aggregated through a long distance flow, and thus preventing the formation of large particle aggregates, which may scratch the semiconductor device.
In the technical scheme provided by the embodiment, the grinding fluid filter is arranged on the spray head, and the tail end of the supply of the grinding fluid is filtered, so that large-particle aggregates are prevented from appearing in the flattening process of the semiconductor device, and the semiconductor device is prevented from being scratched by the large-particle aggregates. The technical scheme provided by the embodiment can avoid the substance causing the defects from flowing into the grinding pad 6, thereby reducing the damage of the device, improving the yield of the product and reducing the inspection frequency of the equipment.
In some alternative embodiments, the slurry filter comprises more than two slurry filter units 4 in series; the filter pore diameters of two or more of the polishing slurry filter units 4 decrease in sequence along the supply direction of the polishing slurry. In some embodiments, multiple filtration of the slurry is possible by performing filtration through a plurality of slurry filtration units 4 connected in series, thereby improving the filtration effect. Meanwhile, the aperture of the grinding fluid filtering unit 4 is sequentially reduced along the supply direction of the grinding fluid, so that the filtering effect on the grinding fluid can be ensured, and the nozzle blockage caused by the aggregation of particles with various particle sizes on the same grinding fluid supply unit can be avoided.
As an alternative embodiment, the filtration pore size of the filtration unit 4 is not greater than 10 microns. In some embodiments, the abrasive particles required during the grinding process are generally no larger than 10 microns, and the specific particle size requirement may be determined according to the requirement, for example, the filter pore size of the filter unit 4 may be selected to be 10 microns, 5 microns or 2 microns.
As an alternative embodiment, the grinding fluid filtering device further comprises a filtering shell 5, wherein the filtering shell 5 is provided with at least one mounting cavity, and the grinding fluid filtering unit 4 is detachably arranged in the mounting cavity. In some embodiments, the filter housing 5 is configured to have a plurality of mounting cavities, and a filter may be disposed in each mounting cavity, thereby increasing the effectiveness of the filtration through multiple filtrations. It is also possible to install the filter unit 4 in only one installation cavity, depending on the requirements. When a plurality of filter units 4 are installed, the filter pore size can be set from large to small, thereby gradually improving the filtering effect. The removable mounting facilitates replacement of the filter unit 4. For example, when a plurality of filters are provided and the filter pore sizes are arranged from large to small, the pore sizes of the aggregates are usually concentrated in a specific size, and therefore, a situation may occur in which a part of the filter unit 4 is blocked by the aggregates, and at this time, only a part of the filter unit 4 needs to be replaced, and therefore, the filter unit 4 is detachably mounted in the mounting cavity, and the part in which the filter unit is blocked can be conveniently replaced.
In a second aspect, embodiments of the present invention provide a slurry supply system, as shown in fig. 1, including:
a grinding fluid supply module 1 for supplying grinding fluid; in some embodiments, the slurry supply module 1 may be an external slurry supply pipe 3, or may be a container containing slurry, and functions to provide a source of slurry.
The slurry supply head according to any one of the above claims, wherein the slurry supply head is in communication with the slurry supply module 1 via a conduit 3. In some embodiments, the slurry supply nozzle is generally located at a relatively long distance from the slurry supply module 1, and when the slurry is transported in the conduit 3, the slurry may be aggregated to form large aggregates, so that any one of the slurry supply nozzles can be used to filter out the aggregated large aggregates, thereby preventing the large aggregates from flowing into the polishing pad 6 and scratching the semi-island device.
In the technical scheme provided by the embodiment, the grinding fluid filter is arranged on the spray head, and the tail end of the supply of the grinding fluid is filtered, so that large-particle aggregates are prevented from appearing in the flattening process of the semiconductor device, and the semiconductor device is prevented from being scratched by the large-particle aggregates. The technical scheme provided by the embodiment can avoid the substance causing the defects from flowing into the grinding pad 6, thereby reducing the damage of the device, improving the yield of the product and reducing the inspection frequency of the equipment.
As an alternative embodiment, the outlet of the slurry supply module 1 is provided with a supply module filter 2, and the outlet of the supply module filter 2 is communicated with the slurry supply nozzle through a pipeline 3. In some embodiments, the grinding fluid usually contains grinding media with larger particle size and being out of specification, therefore, in the present embodiment, the supply module filter 2 is disposed at the outlet of the grinding fluid supply module 1 to filter out the grinding media with larger particle size, so as to avoid the grinding media from gathering on the grinding fluid filter of the grinding fluid supply nozzle, thereby greatly reducing the blockage of the grinding fluid filter.
As an alternative embodiment, the filter pore size of the supply module filter 2 is not larger than the filter pore size of the slurry filter. In some embodiments, the supply module filter 2 is generally used to filter the abrasives or other impurities with large particle size in the grinding fluid, and the filtering of the grinding fluid can ensure that the abrasives in the grinding fluid output from the grinding fluid supply module 1 have a proper abrasive particle size. The slurry filter is mainly used for filtering large particle aggregates formed by the aggregation of the abrasive. In the present embodiment, the filter pore size of the supply module is set to be small in order to make the abrasive to be output from the polishing liquid supply module 1 have an appropriate abrasive particle size.
As an alternative embodiment, the filter pore size of the supply module filter 2 is 1 to 10 μm. The filter pore size of the supply module filter 2 is generally to ensure that the slurry supply module 1 is capable of supplying slurry with an abrasive having a suitable particle size. Thus, the pore size of the supply module filter 2 may be set according to requirements, for example, may be set to 1 micron, 5 microns, or 10 microns.
As an alternative embodiment, the length of the pipe 3 is not less than 3 meters. In some embodiments, the slurry filter is designed to filter large particle aggregates formed by abrasive aggregates, and thus, has a more significant effect on systems transported by longer pipelines 3. In the embodiment, the length of the pipeline 3 is set to be not less than 3 meters, so that a relatively obvious optimization effect can be achieved. For a system with a short pipeline 3, the abrasive aggregation condition is not obvious, and the optimization effect of the spray head with the grinding fluid filter is not obvious.
In a third aspect, embodiments of the present invention provide a grinding apparatus, as shown in fig. 1, comprising:
a rotary platform 7;
a polishing pad 6 disposed on the upper surface of the polishing platen;
the slurry supply system according to any of the above claims, wherein the slurry supply nozzle is disposed above the polishing pad 6.
In the technical scheme provided by the embodiment, the grinding fluid filter is arranged on the spray head, and the tail end of the supply of the grinding fluid is filtered, so that large-particle aggregates are prevented from appearing in the flattening process of the semiconductor device, and the semiconductor device is prevented from being scratched by the large-particle aggregates. The technical scheme provided by the embodiment can avoid the substance causing the defects from flowing into the grinding pad 6, thereby reducing the damage of the device, improving the yield of the product and reducing the inspection frequency of the equipment.
In the above description, the technical details of patterning, etching, and the like of each layer are not described in detail. It will be appreciated by those skilled in the art that layers, regions, etc. of the desired shape may be formed by various technical means. In addition, in order to form the same structure, those skilled in the art can also design a method which is not exactly the same as the method described above. In addition, although the embodiments are described separately above, this does not mean that the measures in the embodiments cannot be used in advantageous combination.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are also within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope of the claims.
Claims (10)
1. A slurry supply showerhead, comprising:
the grinding fluid filter comprises a filter inlet, a filtering unit and a filter outlet which are sequentially communicated along the supply direction of the grinding fluid; wherein the filter inlet is used for communicating with a grinding fluid supply module;
a slurry nozzle in communication with the filter outlet.
2. The slurry supply head of claim 1, wherein the slurry filter comprises two or more slurry filter units connected in series; the filtering pore diameters of more than two grinding fluid filtering units are sequentially decreased progressively along the supply direction of the grinding fluid.
3. The slurry supply nozzle according to claim 2, further comprising a filter housing having at least one mounting cavity, said slurry filter unit being removably disposed within said mounting cavity.
4. The slurry supply head of claim 1, wherein the filter unit has a filter pore size of not greater than 10 μm.
5. A slurry supply system, comprising:
the grinding fluid supply module is used for providing grinding fluid;
the slurry supply head of any one of claims 1 to 4, wherein the slurry supply head is in communication with the slurry supply module via a conduit.
6. The slurry supply system according to claim 5, wherein the outlet of the slurry supply module has a supply module filter, and the outlet of the supply module filter communicates with the slurry supply head through a pipe.
7. The slurry supply system according to claim 5, wherein the filter pore size of the supply module filter is not larger than the filter pore size of the slurry filter.
8. The slurry supply system according to claim 5, wherein the filter pore size of the supply module filter is 1-10 μm.
9. The slurry supply system according to claim 5, wherein the length of the pipe is not less than 3 m.
10. A grinding apparatus, comprising:
rotating the platform;
the grinding pad is arranged on the upper surface of the grinding platform;
the polishing slurry supply system of any one of claims 5 to 9, wherein the polishing slurry supply nozzle is disposed above the polishing pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110195143.2A CN114952625A (en) | 2021-02-20 | 2021-02-20 | Grinding fluid supply nozzle, system and grinding equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110195143.2A CN114952625A (en) | 2021-02-20 | 2021-02-20 | Grinding fluid supply nozzle, system and grinding equipment |
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| Publication Number | Publication Date |
|---|---|
| CN114952625A true CN114952625A (en) | 2022-08-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110195143.2A Pending CN114952625A (en) | 2021-02-20 | 2021-02-20 | Grinding fluid supply nozzle, system and grinding equipment |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1384061A (en) * | 2001-05-08 | 2002-12-11 | 栗田工业株式会社 | Abrasive recovering apparatus |
| CN202062311U (en) * | 2011-04-12 | 2011-12-07 | 铜陵市三科电子有限责任公司 | Sand pulp circulating device of piezoid grinding machine |
| CN202147220U (en) * | 2011-07-25 | 2012-02-22 | 长沙迈科轴承有限公司 | Device for recycling and reusing grinding liquid |
| CN102365716A (en) * | 2009-03-25 | 2012-02-29 | 应用材料公司 | Point of use recycling system for cmp slurry |
| CN205287846U (en) * | 2015-12-11 | 2016-06-08 | 广东长盈精密技术有限公司 | Cutting fluid filter device |
| JP2020199600A (en) * | 2019-06-11 | 2020-12-17 | 株式会社荏原製作所 | Supply device of polishing liquid, supply method, and substrate polishing method |
-
2021
- 2021-02-20 CN CN202110195143.2A patent/CN114952625A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1384061A (en) * | 2001-05-08 | 2002-12-11 | 栗田工业株式会社 | Abrasive recovering apparatus |
| CN102365716A (en) * | 2009-03-25 | 2012-02-29 | 应用材料公司 | Point of use recycling system for cmp slurry |
| CN202062311U (en) * | 2011-04-12 | 2011-12-07 | 铜陵市三科电子有限责任公司 | Sand pulp circulating device of piezoid grinding machine |
| CN202147220U (en) * | 2011-07-25 | 2012-02-22 | 长沙迈科轴承有限公司 | Device for recycling and reusing grinding liquid |
| CN205287846U (en) * | 2015-12-11 | 2016-06-08 | 广东长盈精密技术有限公司 | Cutting fluid filter device |
| JP2020199600A (en) * | 2019-06-11 | 2020-12-17 | 株式会社荏原製作所 | Supply device of polishing liquid, supply method, and substrate polishing method |
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