CN114950872A - Coating system and method for conductive adhesive on inner wall of current collector hole - Google Patents

Coating system and method for conductive adhesive on inner wall of current collector hole Download PDF

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Publication number
CN114950872A
CN114950872A CN202210482059.3A CN202210482059A CN114950872A CN 114950872 A CN114950872 A CN 114950872A CN 202210482059 A CN202210482059 A CN 202210482059A CN 114950872 A CN114950872 A CN 114950872A
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China
Prior art keywords
coating
hole
current collector
gluing
conductive adhesive
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CN202210482059.3A
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Chinese (zh)
Inventor
宋艳芳
陈为
陈奥辉
董笑
吴钢锋
李桂花
魏伟
孙予罕
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Shanghai Advanced Research Institute of CAS
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Shanghai Advanced Research Institute of CAS
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Priority to CN202210482059.3A priority Critical patent/CN114950872A/en
Publication of CN114950872A publication Critical patent/CN114950872A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C7/00—Apparatus specially designed for applying liquid or other fluent material to the inside of hollow work
    • B05C7/02—Apparatus specially designed for applying liquid or other fluent material to the inside of hollow work the liquid or other fluent material being projected
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C13/00—Means for manipulating or holding work, e.g. for separate articles
    • B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

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  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

The invention provides a coating system and a coating method of conductive adhesive on the inner wall of a current collector hole, wherein the coating method comprises the following steps: s1, providing a coating system; s2, fixing the current collector on a positioning tool; s3, controlling the movement of the electric cylinder positioning component by using a positioning controller, and positioning the positions of the gluing head and the hole; s4, feeding the conductive adhesive into a gluing tank by using a feeding controller, controlling the single glue-spitting amount of a gluing head by using a glue amount control valve, and controlling the gluing head to extrude or spray the conductive adhesive for multiple times by using a gluing controller and coating the conductive adhesive on the inner wall of the hole; and S5, repeating the steps S3 and S4, and sequentially coating conductive adhesive on the inner walls of the holes of the current collector hole array. The coating system is simple in design, and can be used for automatically coating the conductive adhesive on the inner wall of the current collector hole quickly and efficiently; and the uniformity and the repeatability of coating can be ensured, so that the electrode has excellent conductivity after being inserted into the hole, and the large-scale production efficiency is greatly improved.

Description

Coating system and method for conductive adhesive on inner wall of current collector hole
Technical Field
The invention belongs to the technical field of electrochemical redox reactions, and particularly relates to a coating system and a coating method for a conductive adhesive on the inner wall of a current collector hole.
Background
Under the drive of the national strategic target of '2060 carbon neutralization', the process of energy structure transformation and novel energy industry development is accelerated in China. The rapid development of the development and utilization of renewable energy sources in China provides strong support for green and low-carbon transformation of energy sources. The development of electrochemical process synthetic fuel or chemicals driven by renewable electric energy has important significance for improving energy structure, driving economic and social sustainable development and industrial upgrading.
Compared with an electrochemical reaction system with a single electrode, the electrochemical reaction system constructed based on the electrode array consisting of a plurality of same electrodes can greatly improve the electrochemical conversion efficiency, and is beneficial to large-scale production and application. Therefore, the electrode array electrochemical reaction system can better meet the industrial production requirement of renewable electric energy driving electrochemical process synthetic fuel or chemicals.
In an electrode array, good contact and electrical conductivity between the electrodes and the current collector are one of the key factors affecting the performance of the electrochemical reaction. The coating of the conductive adhesive can ensure good electronic conduction between the conductive adhesive and the conductive adhesive, and is beneficial to the implementation of electrochemical reaction. However, the coating of the conductive adhesive is generally performed manually at present, and the coating amount is not uniform, the time consumption is long, the labor is wasted, and the large-scale production and application are not facilitated.
Therefore, there is a need to provide an improved solution to the above-mentioned deficiencies of the prior art.
Disclosure of Invention
In view of the above drawbacks of the prior art, an object of the present invention is to provide a system and a method for coating conductive adhesive on inner walls of current collector holes, which are used to solve the problems of non-uniform coating amount, long time consumption, labor-consuming process and inconvenience for mass production when the conductive adhesive is manually coated in the prior art.
In order to achieve the above and other related objects, the present invention provides a coating system for conductive adhesive on inner walls of holes of a current collector, the coating system is used for coating the conductive adhesive on the inner walls of the holes of the current collector, a plurality of holes are drilled on the current collector, and the plurality of holes are arranged in an array to form a hole-hole array;
the coating system includes:
the storage unit comprises a storage tank, a discharge hole is formed in the storage tank, and the conductive adhesive stored in the storage tank is discharged from the discharge hole;
the glue spreading unit comprises a glue spreading tank, a glue spreading head and a glue amount control valve, wherein a feed port is formed in the glue spreading tank and is connected with the discharge port through a feed pipeline; the gluing head is arranged at the bottom of the gluing tank and communicated with the gluing tank, and is used for coating conductive adhesive on the inner wall of the hole; the glue amount control valve is arranged above the gluing tank and used for controlling the gluing amount of the gluing head for single gluing;
the positioning unit comprises a fixed base, a positioning tool and an electric cylinder positioning assembly, the positioning tool is arranged on the fixed base, and the current collector is fixedly arranged on the positioning tool and is positioned below the gluing unit; the electric cylinder positioning assembly is used for positioning the position between the gluing head and the inner wall of the hole;
the control unit comprises a feeding controller, a positioning controller and a gluing controller, wherein the feeding controller is used for feeding the conductive glue stored in the reservoir into the gluing tank through a feeding pipeline; the positioning controller is connected with the electric cylinder positioning assembly and is used for controlling the electric cylinder positioning assembly to position the gluing head; and the gluing controller is used for controlling the gluing head to spray or extrude quantitative conductive adhesive to the inner wall of the hole.
Preferably, the electric cylinder positioning assembly comprises an X-axis electric cylinder, a Y-axis electric cylinder and a Z-axis electric cylinder, the X-axis electric cylinder and the Z-axis electric cylinder are connected with the gluing unit, the Y-axis electric cylinder is mounted on the positioning tool, the X-axis electric cylinder and the Y-axis electric cylinder are used for positioning the gluing unit in the horizontal direction, so that the gluing head is positioned right above the hole, and the Z-axis electric cylinder is used for positioning the gluing head in the height direction, so that the gluing head extends into the inner wall of the hole.
Preferably, the air inlet has still been seted up on the gluing jar, the input of air inlet is connected with air feeder, the rubber coating controller with air feeder connects for the air input that the control got into in the gluing jar, in order to control the gluing head coats the conducting resin in the hole inner wall.
Preferably, the glue coating tank is further provided with a mist port, an input end of the mist port is connected with a mist making device, and the mist making device inputs mist into the glue coating tank so as to atomize the conductive adhesive.
The invention also provides a coating method of the conductive adhesive on the inner wall of the current collector hole, which comprises the following steps:
s1, providing the coating system of the conductive adhesive on the inner wall of the current collector hole as claimed in any one of claims 1-4;
s2, fixedly placing the current collector on a positioning tool;
s3, controlling the movement of the electric cylinder positioning component by using a positioning controller to position the positions of the glue coating head and the hole;
s4, feeding the conductive adhesive into a gluing tank by using a feeding controller, accurately controlling the single glue-spitting amount of a gluing head by using a glue amount control valve, and controlling the gluing head to extrude or spray the conductive adhesive for multiple times by using a gluing controller and coating the conductive adhesive on the inner wall of each hole;
and S5, repeating the steps S3 and S4, and sequentially coating conductive adhesive on the inner walls of the holes of the current collector hole array.
Preferably, the current collector is one of stainless steel, aluminum, silver and copper metal conductive materials; the current collector is a tubular, rod-shaped or block-shaped current collector; the length of mass flow body is 2 ~ 60cm, the internal diameter of mass flow body is 1 ~ 20mm, the external diameter of mass flow body is 2 ~ 50mm, the wall thickness of mass flow body is 1 ~ 10 mm.
Preferably, the hole of boring on the mass flow body is the round hole, the internal diameter of hole is 0.1 ~ 5mm, the degree of depth of hole is 1 ~ 10mm, and adjacent two in same row interval between the hole is 0.2 ~ 5mm, adjacent two rows distance between the hole is 0.2 ~ 5 mm.
Preferably, in step S3, the positioning controller is used to control the movement of the electric cylinder positioning assembly to position the position of the glue applying head and the hole, specifically: firstly, a positioning controller is adopted to control an X-axis electric cylinder and a Y-axis electric cylinder, so that a gluing head moves to the position above a hole, and then a Z-axis electric cylinder is controlled, so that the gluing head extends into the inner wall of the hole and the depth of the gluing head extending into the inner wall of the hole is controlled.
Preferably, the feeding controller in step S4 is a pneumatic controller; adopt feed controller feeds into the coating tank with the conducting resin in, specifically do: controlling the amount of argon or nitrogen passing through the storage tank by using a feeding controller, so that the conductive adhesive is fed into the coating tank from the storage tank; wherein the flow rate of introducing argon or nitrogen is 10-1000 mL/min.
Preferably, the feed controller in step S4 is a pump pressure controller; adopt feed controller feeds into the coating jar with conducting resin, specifically is: and feeding the conductive adhesive from the storage tank into the coating tank by adopting a feeding controller in a pumping mode.
Preferably, the feeding flow rate of the conductive paste into the coating material tank in the step S4 is 1 to 100 mL/min.
Preferably, the single glue discharging amount in the step S4 is less than or equal to 0.1 mL.
Preferably, in the step S4, the gluing controller is adopted to control the gluing head to coat the conductive adhesive on the inner wall of each hole for 1-5 times.
Preferably, the conductive paste in step S4 is a conductive silver paste.
As described above, the coating system and method of the conductive adhesive on the inner wall of the current collector hole of the invention have the following beneficial effects:
the invention provides a coating system of conductive adhesive on the inner wall of a current collector hole, which is simple in design and fully automatic, and comprises a storage unit, a gluing unit, a positioning unit and a control unit, wherein an electric cylinder positioning assembly in the positioning unit can realize automatic positioning between the gluing unit and the current collector hole under the control of a positioning controller, and automatically control the depth of a gluing head extending into the inner wall of the hole, so that the conductive adhesive can be coated on the inner wall of the current collector hole in a full-automatic manner quickly and efficiently; in addition, the feeding speed of the conductive adhesive in the coating tank is automatically controlled through the feeding controller, the single glue spraying amount of the gluing head is realized through the glue amount control valve, the coating uniformity is ensured, meanwhile, the gluing controller is used for automatically controlling the gluing head to spray or extrude quantitative conductive adhesive onto the inner wall of the hole, the coating uniformity and repeatability are ensured, the electrode is ensured to have excellent conductivity after being inserted into the hole, and the large-scale production efficiency is greatly improved.
The coating system and the coating method can effectively simplify the conductive adhesive coating procedure of the inner wall of the surface hole of the current collector in the batch assembly process of the electrode array, and have the advantages of simple and convenient operation, cost saving and easy scale production; the conductive paste is suitable for coating the inner walls of the holes on the surface of the current collector when various electrodes are assembled in batches, and has wide industrial prospect and value.
Drawings
Fig. 1 is a schematic structural diagram of a system for coating conductive adhesive on the inner walls of current collector holes according to an embodiment of the present invention.
Fig. 2 is a schematic structural diagram of a current collector with an array of holes drilled therein according to an embodiment of the present invention.
Description of the element reference numerals
100 current collector
101 holes
201 reservoir
202 discharge hole
203 conductive adhesive
301 glue spreading tank
302 glue spreading head
303 glue amount control valve
304 feed inlet
305 air inlet
306 mist port
400 feed pipe
501 fixed base
502 positioning tool
Detailed Description
The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and effects of the present invention will be easily understood by those skilled in the art from the disclosure of the present specification. The invention is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention.
Please refer to fig. 1 and fig. 2. It should be noted that the drawings provided in the present embodiment are only for illustrating the basic idea of the present invention, and the components related to the present invention are only shown in the drawings rather than drawn according to the number, shape and size of the components in actual implementation, and the type, quantity and proportion of the components in actual implementation may be changed freely, and the layout of the components may be more complicated.
The invention provides a coating system of conductive adhesive on the inner wall of a current collector hole, which is simple in design and fully automatic, and comprises a storage unit, a gluing unit, a positioning unit and a control unit, wherein an electric cylinder positioning assembly in the positioning unit can realize automatic positioning between the gluing unit and the current collector hole under the control of a positioning controller, and automatically control the depth of a gluing head extending into the inner wall of the hole, so that the conductive adhesive can be coated on the inner wall of the current collector hole in a full-automatic manner quickly and efficiently; in addition, the feeding speed of the conductive adhesive in the coating tank is automatically controlled through the feeding controller, the single glue discharging amount of the gluing head is realized through the glue amount control valve, the uniformity of coating is ensured, meanwhile, the gluing controller automatically controls the gluing head to spray or extrude quantitative conductive adhesive onto the inner wall of the hole, the uniformity and the repeatability of coating are ensured, so that the electrode has excellent conductivity after being inserted into the hole, and the large-scale production efficiency is greatly improved; the coating system and the coating method can effectively simplify the conductive adhesive coating procedure of the inner wall of the surface hole of the current collector in the batch assembly process of the electrode array, and have the advantages of simple and convenient operation, cost saving and easy scale production; the conductive adhesive is suitable for coating the inner wall of the surface hole of the current collector when various electrodes are assembled in batches, and has wide industrial prospect and value.
The invention provides a coating system for conductive adhesive 203 on the inner walls of current collector holes, which is used for coating the conductive adhesive 203 on the inner walls of the holes 101 of a current collector 100, wherein a plurality of holes 101 are drilled on the current collector 100, and the holes 101 are arranged in an array form to form a hole 101 array;
the coating system of the present invention comprises: the device comprises a storage unit, a gluing unit, a positioning unit and a control unit; the storage unit comprises a storage tank 201, a discharge port 202 is formed in the storage tank 201, and the conductive adhesive 203 stored in the storage tank 201 is discharged from the discharge port 202; the gluing unit comprises a gluing tank 301, a gluing head 302 and a glue amount control valve 303, wherein the gluing tank 301 is provided with a feeding hole 304, and the feeding hole 304 is connected with the discharging hole 202 through a feeding pipeline 400; the gluing head 302 is arranged at the bottom of the gluing tank 301 and communicated with the gluing tank 301, and the gluing head 302 is used for coating the conductive adhesive 203 on the inner wall of the hole 101; the glue amount control valve 303 is arranged above the gluing tank 301 and is used for controlling the gluing amount of the single gluing of the gluing head 302; the positioning unit comprises a fixed base 501, a positioning tool 502 and an electric cylinder positioning assembly, the positioning tool 502 is arranged on the fixed base 501, and the current collector 100 is fixedly arranged on the positioning tool 502 and is positioned below the gluing unit; the electric cylinder positioning assembly is used for positioning the position between the gluing head 302 and the inner wall of the hole 101; the control unit comprises a feeding controller, a positioning controller and a gluing controller, wherein the feeding controller is used for feeding the conductive glue 203 stored in the reservoir 201 into the gluing tank 301 through a feeding pipeline 400; the positioning controller is connected with the electric cylinder positioning assembly and is used for controlling the electric cylinder positioning assembly to position the gluing head 302; the glue controller is used for controlling the glue head 302 to spray or extrude a certain amount of conductive glue 203 to the inner wall of the hole 101.
Specifically, the reservoir 201 is a hermetic reservoir 201 and is a quartz glass reservoir 201; the feeding controller is a pump pressure controller or an air pressure controller, and when the feeding controller is the pump pressure controller, the feeding of the conductive adhesive 203 is realized by a feeding pump; when the feeding controller is a pneumatic controller, an air inlet end is further formed in the storage tank 201, the input end of the air inlet end is connected with an air storage device, the feeding controller is connected with the air storage device to control the air storage device to enable air to enter the storage tank 201 from the air inlet end at a certain air inlet speed, so that the conductive adhesive 203 is fed from the discharge port 202, then enters the feed port 304 through the feeding pipeline 400, and then enters the gluing tank 301; in addition, the function of the glue applying head 302 is to apply the conductive glue 203 to the inner wall of the hole 101, in this embodiment, the glue applying head 302 is a needle-type glue applying head 302 or a spray-type glue applying head 302, but the specific structure of the glue applying head 302 is not limited herein.
Specifically, the glue amount control valve 303 may be configured as an injector principle, and the glue amount control valve 303 is rotated to a certain scale to control the glue discharging amount each time, but the specific structure of the glue amount control valve 303 is not limited herein.
By way of example, the electric cylinder positioning assembly (not shown in the figure) includes an X-axis electric cylinder, a Y-axis electric cylinder and a Z-axis electric cylinder, both of which are connected to the glue applying unit, the Y-axis electric cylinder is mounted on the positioning fixture 502, the X-axis electric cylinder and the Y-axis electric cylinder are used for positioning the position of the glue applying unit in the horizontal direction so that the glue applying head 302 is positioned right above the hole 101, and the Z-axis electric cylinder is used for positioning the position of the glue applying head 302 in the height direction so that the glue applying head 302 extends into the inner wall of the hole 101.
Specifically, the X-axis electric cylinder is used for moving the gluing unit on the X axis, and the Y-axis electric cylinder drives the positioning tool 502 to move on the Y axis, so as to drive the current collector 100 to move in the Y axis direction, where the X axis and the Y axis are both horizontal directions; after the glue coating head 302 of the glue coating unit is aligned with the hole 101 of the current collector 100, the height of the glue coating head 302 is moved through the Z-axis electric cylinder, so that the glue coating head 302 extends into the inner wall of the hole 101, the depth of the glue coating head 302 extending into the inner wall of the hole 101 can be controlled, and the position between the glue coating head 302 and the inner wall of the hole 101 can be accurately positioned. However, the specific structures, types, etc. of the X-axis electric cylinder, the Y-axis electric cylinder, and the Z-axis electric cylinder are not excessively limited, and the specific positions of the X-axis electric cylinder and the Z-axis electric cylinder on the glue spreading unit, and the specific positions of the Y-axis electric cylinder on the positioning tool 502 are not excessively limited.
By way of example, the moving directions of the X-axis electric cylinder, the Y-axis electric cylinder and the Z-axis electric cylinder are perpendicular to each other, and the positioning accuracy of the X-axis electric cylinder, the Y-axis electric cylinder and the Z-axis electric cylinder in the X-axis, the Y-axis and the Z-axis is not more than 0.05mm, such as the positioning accuracy is 0.01mm, 0.02mm, 0.03mm, 0.04mm, 0.05mm, and the like.
Specifically, the electric cylinder converts the rotary motion of the servo motor into linear motion by a modularized product with the integrated design of the servo motor and the lead screw, and simultaneously converts the accurate rotating speed control and the accurate torque control of the servo motor into accurate speed control, accurate position control and accurate thrust control.
As an example, the glue tank 301 further has an air inlet 305, an input end of the air inlet 305 is connected to an air supply device (not shown in the figure), and the glue controller is connected to the air supply device and is configured to control an amount of air entering the glue tank 301 so as to control the glue head 302 to coat the conductive glue 203 on the inner wall of the hole 101.
As an example, the glue tank 301 is further provided with a mist opening 306, and an input end of the mist opening 306 is connected with a mist generating device (not shown in the figure) which inputs the mist into the glue tank 301 to atomize the conductive adhesive 203.
Specifically, when the gluing head 302 coats the conductive adhesive 203 on the inner wall of the hole 101, the glue amount control valve 303 controls the glue discharging amount each time, the air inflow entering the gluing tank 301 is controlled by the gluing controller, so that the gluing head 302 can be stably controlled to glue the inner wall of the hole 101, and the uniformity and repeatability of gluing are ensured; the mist entering from the mist port 306 atomizes the conductive adhesive 203, and the atomized conductive adhesive 203 is sprayed out from the adhesive coating head 302 and is sprayed to the periphery of the inner wall of the hole 101, so that the adhesive coating is more uniform.
In order to better understand the coating device of the conductive adhesive 203 on the inner wall of the current collector hole, the invention also provides a coating method of the conductive adhesive 203 on the inner wall of the current collector hole, which comprises the following steps:
s1, providing a coating system for the conductive adhesive 203 on the inner wall of the hole 101 of the current collector 100;
s2, fixedly placing the current collector 100 on the positioning tool 502;
s3, controlling the movement of the electric cylinder positioning component by using a positioning controller to position the positions of the gluing head 302 and the hole 101;
s4, feeding the conductive adhesive 203 into the gluing tank 301 by using a feeding controller, accurately controlling the single glue-spitting amount of the gluing head 302 by using the glue amount control valve 303, and then controlling the gluing head 302 to extrude or spray the conductive adhesive 203 for multiple times by using the gluing controller and coating the conductive adhesive 203 on the inner wall of each hole 101;
s5, repeating steps S3 and S4, and sequentially coating the conductive paste 203 on the inner walls of the holes 101 of the hole 101 array of the current collector 100.
As an example, the current collector 100 is one of stainless steel, aluminum, silver, copper metal conductive materials.
Specifically, the current collector 100 is used for inputting a gas-phase reactant to the hollow fiber electrode and performing electron conduction, so that the current collector 100 is a conductive material, and the material, length, and inner and outer diameters of the current collector 100 need to be adjusted in consideration of mass transfer and heat dissipation processes of the reactant in the reaction process.
As an example, the current collector 100 is a tubular, rod-shaped, or block current collector 100; the length of the current collector 100 is 2-60 cm, such as 2cm, 5cm, 10cm, 20cm, 30cm, 40cm, 50cm, 60cm, etc., the inner diameter of the current collector 100 is 1-20 mm, such as 1mm, 3mm, 5mm, 10mm, 15mm, 20mm, etc., the outer diameter of the current collector 100 is 2-50 mm, such as 2mm, 5mm, 10mm, 20mm, 30mm, 40mm, 45mm, 50mm, etc., and the wall thickness of the current collector 100 is 1-10 mm, such as 1mm, 3mm, 5mm, 7mm, 9mm, 10mm, etc.
Preferably, the current collector 100 is a tubular current collector 100.
By way of example, the holes 101 drilled in the current collector 100 are circular holes, the inner diameters of the holes 101 are 0.1-5 mm, such as 0.1mm, 0.5mm, 1mm, 2mm, 3mm, 4mm, 5mm, etc., the depths of the holes 101 are 1-10 mm, such as 1mm, 3mm, 5mm, 7mm, 9mm, 10mm, etc., the distance between two adjacent holes 101 in the same row is 0.2-5 mm, such as 0.2, 0.5mm, 1mm, 2mm, 3mm, 4mm, 5mm, etc., and the distance between two adjacent rows of holes 101 is 0.2-5 mm, such as 0.2, 0.5mm, 1mm, 2mm, 3mm, 4mm, 5mm, etc.
Specifically, if the hole 101 array is mxn, m rows are provided, the number of holes 101 in each row is n, and m and n are natural integers greater than 0; the inner diameter of the holes 101 is set to match the outer diameter of the hollow fiber electrode, and the distance between every two adjacent rows of holes 101 interfere with the gas-phase reactant inlet.
Specifically, when the holes 101 of the current collector 100 are circular holes, the electrodes pre-inserted into the holes 101 of the current collector 100 are also rod-shaped electrodes or hollow fiber electrodes.
In addition, the shape of the electrode pre-inserted into the hole 101 of the current collector 100 is matched with the shape of the hole 101, and the shape of the electrode pre-inserted into the hole 101 of the current collector 100 comprises a hollow fiber electrode, a round rod electrode, a sheet electrode, a diamond rod electrode and the like; in other embodiments, the holes 101 may also be square holes, rectangular holes or rhombic holes; the electrode corresponding to the insertion is shaped as a sheet electrode or a rhombus-bar electrode.
As an example, in step S3, the positioning controller is used to control the movement of the electric cylinder positioning assembly to position the glue applying head 302 and the hole 101, specifically: firstly, an X-axis electric cylinder and a Y-axis electric cylinder are controlled by a positioning controller, so that a gluing head 302 moves to the upper part of a hole 101, and then a Z-axis electric cylinder is controlled, so that the gluing head 302 extends into the inner wall of the hole 101 and the depth of the gluing head 302 extending into the inner wall of the hole 101 is controlled.
Specifically, the positioning controller controls the X-axis electric cylinder, the Y-axis electric cylinder and the Z-axis electric cylinder to realize the positioning between the gluing head 302 and the inner wall of the hole 101, so as to further ensure the coating accuracy, and the positioning accuracy of the X-axis electric cylinder, the Y-axis electric cylinder and the Z-axis electric cylinder on the X-axis, the Y-axis and the Z-axis is not more than 0.05mm, such as the positioning accuracy is 0.01mm, 0.02mm, 0.03mm, 0.04mm, 0.05mm and the like.
As an example, the feed controller in step S4 is a pneumatic controller; adopt feed controller to feed conducting resin 203 to the coating jar, specifically be: controlling the amount of argon or nitrogen passing into the reservoir 201 by using a feeding controller, so that the conductive adhesive 203 is fed into the coating tank from the reservoir 201; wherein the flow rate of introducing argon or nitrogen is 10-1000 mL/min, such as 10mL/min, 50mL/min, 100mL/min, 300mL/min, 500mL/min, 700mL/min, 900mL/min, 1000mL/min, etc.
As an example, the feed controller is a pump pressure controller; adopt the feed controller to feed conducting resin 203 to the coating jar, specifically be: the conductive paste 203 is fed from the reservoir 201 to the paint can by means of a pump pressure using a feed controller.
As an example, the feeding flow rate of the conductive adhesive 203 into the paint can is 1-100 mL/min, such as 1mL/min, 5mL/min, 10mL/min, 30mL/min, 50mL/min, 70mL/min, 90mL/min, 100mL/min, and the like.
For example, the amount of glue dispensed per time is less than or equal to 0.1mL, such as 0.01mL, 0.02mL, 0.04mL, 0.06mL, 0.08mL, 0.1mL, etc.
Specifically, the feeding rate of the conductive adhesive 203 in the coating tank is automatically controlled through the feeding controller, the adhesive amount control valve 303 is used for realizing the single adhesive discharging amount of the coating head 302, the coating uniformity and repeatability are ensured, the electrode is ensured to have excellent conductivity after being inserted into the hole 101, and the large-scale production efficiency is greatly improved.
As an example, the conductive paste 203 is a conductive silver paste.
Specifically, the conductive silver paste is used for connection between the current collector 100 and the electrode, ensuring excellent electron conduction; the conductive silver adhesive is formed by combining conductive particles together under the bonding action of matrix resin to form a conductive path, so that conductive connection of a bonded material is realized.
Preferably, the conductive silver adhesive is a normal-temperature cured or heating cured conductive silver adhesive.
As an example, in step S4, the gluing controller is used to control the gluing head 302 to apply the conductive glue 203 to the inner wall of each hole 101 for 1 to 5 times, such as 1 time, 2 times, 3 times, 4 times, and 5 times.
Specifically, a multiple coating mode is adopted, so that the uniformity and repeatability of coating can be better ensured, and the electrode has excellent conductivity after being inserted into the hole 101.
The following describes a coating system and a coating method for the conductive paste 203 on the inner wall of the current collector hole 101 according to the present invention with reference to specific embodiments. The following examples are given to facilitate a better understanding of the invention, but do not limit the invention.
Example 1
The present embodiment provides a device and a method for coating a conductive adhesive 203 on an inner wall of a current collector hole, where the device in this embodiment includes: the device comprises a storage unit, a gluing unit, a positioning unit and a control unit;
the storage unit comprises a storage tank 201, a discharge port 202 is formed in the storage tank 201, and the conductive adhesive 203 stored in the storage tank 201 is discharged from the discharge port 202;
the gluing unit comprises a gluing tank 301, a gluing head 302 and a glue amount control valve 303, wherein the gluing tank 301 is provided with a feeding hole 304, and the feeding hole 304 is connected with the discharging hole 202 through a feeding pipeline 400; the gluing head 302 is arranged at the bottom of the gluing tank 301 and communicated with the gluing tank 301, and the gluing head 302 is used for coating the conductive adhesive 203 on the inner wall of the hole 101; the glue amount control valve 303 is arranged above the gluing tank 301 and is used for controlling the gluing amount of the single gluing of the gluing head 302; wherein, the last air inlet 305 that has still seted up of rubber coating jar 301, the input of air inlet 305 is connected with air feeder, and the rubber coating controller is connected with air feeder for the air input that gets into rubber coating jar 301 is controlled to control the gluing head 302 with conducting resin 203 coat in hole 101 inner wall.
The positioning unit comprises a fixed base 501, a positioning tool 502 and an electric cylinder positioning assembly, the positioning tool 502 is arranged on the fixed base 501, and the current collector 100 is fixedly arranged on the positioning tool 502 and is positioned below the gluing unit; the electric cylinder positioning assembly is used for positioning the position between the gluing head 302 and the inner wall of the hole 101; the control unit comprises a feeding controller, a positioning controller and a gluing controller, wherein the feeding controller is used for feeding the conductive glue 203 stored in the reservoir 201 into the gluing tank 301 through a feeding pipeline 400; the positioning controller is connected with the electric cylinder positioning assembly and is used for controlling the electric cylinder positioning assembly to position the gluing head 302; the gluing controller is used for controlling the gluing head 302 to spray or extrude a certain amount of conductive adhesive 203 to the inner wall of the hole 101; wherein, electric jar locating component includes X axle electric jar, Y axle electric jar and Z axle electric jar, and X axle electric jar and Z axle electric jar all are connected with the rubber coating unit, and Y axle electric jar is installed on location frock 502, and X axle electric jar and Y axle electric jar are used for the position of location rubber coating unit in the horizontal direction, make rubber coating head 302 be located hole 101 directly over, and Z axle electric jar is used for the position of location rubber coating head 302 in the direction of height, makes rubber coating head 302 stretch into hole 101 inner wall.
The coating method in this embodiment includes the steps of:
s1, providing a coating system for the conductive adhesive 203 on the inner wall of the hole 101 of the current collector 100;
s2, fixedly placing the current collector 100 on the positioning tool 502; the current collector 100 is made of stainless steel and is tubular, the outer diameter of the current collector 100 is 13mm, the inner diameter of the current collector 100 is 9mm, the wall thickness of the current collector 100 is 2mm, and the length of the current collector 100 is 190 mm; drilling 270 holes 101 at a position 10mm away from one end of a current collector 100, wherein the holes are arranged in 90 single rows, and the number of the holes is three; wherein the diameter of the hole 101 is 0.5mm, the holes 101 are round holes, the distance between the centers of two adjacent holes 101 is 0.5mm, and the distance between two adjacent rows is 0.5 mm;
s3, controlling an X-axis electric cylinder and a Y-axis electric cylinder by using a positioning controller to enable the gluing head 302 to move above the hole 101, and then controlling a Z-axis electric cylinder to enable the gluing head 302 to extend into the inner wall of the hole 101 and control the depth of the gluing head 302 extending into the inner wall of the hole 101 so as to position the gluing head 302 and the hole 101;
s4, feeding the conductive adhesive 203 into the coating tank from the storage tank 201 by adopting a feeding controller in a pumping manner, controlling the flow rate of the conductive adhesive 203 fed into the coating tank from the storage tank within a range of 50mL/min, accurately controlling the single glue-spitting amount of the gluing head 302 through the glue amount control valve 303, and then controlling the gluing head 302 to extrude quantitative conductive adhesive 203 by adopting the gluing controller and coating the conductive adhesive 203 on the inner wall of each hole 101 for 3 times; wherein the single glue-spitting amount is less than or equal to 0.1 mL;
and S5, repeating the steps S3 and S4, and sequentially coating the inner walls of the 270 holes 101 of the hole 101 array of the current collector 100 with the conductive adhesive 203.
The hollow fiber electrode with a proper outer diameter is inserted into the array of the holes 101 of the current collector 100 coated with the conductive adhesive 203 in the embodiment, and the hollow fiber electrode array is assembled for electrochemical catalytic reaction, so that the application of large-scale electrochemical conversion is promoted.
Example 2
The present embodiment provides an apparatus and a method for coating a conductive adhesive 203 on an inner wall of a current collector hole, and the coating apparatus in this embodiment is the same as that in embodiment 1, and is not described herein again.
The coating method in this embodiment includes the steps of:
s1, providing a coating system of the conductive adhesive 203 on the inner wall of the hole 101 of the current collector 100;
s2, fixedly placing the current collector 100 on the positioning tool 502; the current collector 100 is made of stainless steel and is tubular, the outer diameter of the current collector 100 is 13mm, the inner diameter of the current collector 100 is 4mm, the wall thickness of the current collector 100 is 4.5mm, and the length of the current collector 100 is 190 mm; drilling 210 holes 101 at a position 10mm away from one end of the current collector 100, wherein the holes are arranged in a single row of 70, and the number of the holes is three; wherein the diameter of the hole 101 is 0.8mm, the holes 101 are round holes, the distance between the centers of two adjacent holes 101 is 0.8mm, and the distance between two adjacent rows is 0.8 mm;
s3, controlling an X-axis electric cylinder and a Y-axis electric cylinder by using a positioning controller to enable the gluing head 302 to move above the hole 101, and then controlling a Z-axis electric cylinder to enable the gluing head 302 to extend into the inner wall of the hole 101 and control the depth of the gluing head 302 extending into the inner wall of the hole 101 so as to position the gluing head 302 and the hole 101;
s4, feeding the conductive adhesive 203 into the paint tank from the storage tank 201 by adopting a feeding controller in a pumping mode, controlling the flow rate of the conductive adhesive 203 fed into the paint tank from the storage tank within the range of 100mL/min, accurately controlling the single glue spitting amount of the glue coating head 302 through the glue amount control valve 303, and then controlling the glue coating head 302 to extrude quantitative conductive adhesive 203 to coat the inner wall of each hole 101 for 1 time by adopting the glue coating controller; wherein the single glue-spitting amount is less than or equal to 0.1 mL;
and S5, repeating the steps S3 and S4, and sequentially coating the inner walls of the 210 holes 101 of the hole 101 array of the current collector 100 with the conductive adhesive 203.
The hollow fiber electrode with a proper outer diameter is inserted into the array of the holes 101 of the current collector 100 coated with the conductive adhesive 203 in the embodiment, and the hollow fiber electrode array is assembled for electrochemical catalytic reaction, so that the application of large-scale electrochemical conversion is promoted.
Example 3
The present embodiment provides a device and a method for coating a conductive adhesive 203 on the inner wall of a current collector hole, and the coating device in this embodiment is the same as that in embodiment 1, and is not repeated herein.
The coating method in this embodiment includes the steps of:
s1, providing a coating system of the conductive adhesive 203 on the inner wall of the hole 101 of the current collector 100;
s2, fixedly placing the current collector 100 on the positioning tool 502; the current collector 100 is made of stainless steel and is tubular, the outer diameter of the current collector 100 is 19mm, the inner diameter of the current collector 100 is 4mm, the wall thickness of the current collector 100 is 7.5mm, and the length of the current collector 100 is 383 mm; drilling 600 holes 101 at a position 10mm away from one end of a current collector 100, wherein the holes are arranged in a single row of 200, and the number of the holes is three; wherein the diameter of the hole 101 is 0.8mm, the holes 101 are round holes, the distance between the centers of two adjacent holes 101 is 0.8mm, and the distance between two adjacent rows is 0.8 mm;
s3, controlling an X-axis electric cylinder and a Y-axis electric cylinder by using a positioning controller to enable the gluing head 302 to move above the hole 101, and then controlling a Z-axis electric cylinder to enable the gluing head 302 to extend into the inner wall of the hole 101 and control the depth of the gluing head 302 extending into the inner wall of the hole 101 so as to position the gluing head 302 and the hole 101;
s4, feeding the conductive adhesive 203 into the coating tank from the storage tank 201 by adopting a feeding controller in a pumping manner, controlling the flow rate of the conductive adhesive 203 fed into the coating tank from the storage tank within the range of 1mL/min, accurately controlling the single glue-spitting amount of the gluing head 302 through the glue amount control valve 303, and then controlling the gluing head 302 to extrude quantitative conductive adhesive 203 to coat the inner wall of each hole 101 for 5 times by adopting the gluing controller; wherein the single glue-spitting amount is less than or equal to 0.1 mL;
and S5, repeating the steps S3 and S4, and sequentially coating the conductive adhesive 203 on the inner walls of the 600 holes 101 of the hole 101 array of the current collector 100.
The hollow fiber electrode with a proper outer diameter is inserted into the array of the holes 101 of the current collector 100 coated with the conductive adhesive 203 in the embodiment, and the hollow fiber electrode array is assembled for electrochemical catalytic reaction, so that the application of large-scale electrochemical conversion is promoted.
Example 4
The present embodiment provides a device and a method for coating a conductive adhesive 203 on the inner wall of a current collector hole, where the difference between the coating device in this embodiment and embodiment 1 is as follows: the glue coating tank 301 is also provided with a mist port 306, the input end of the mist port 306 is connected with a mist making device, and the mist making device inputs the mist into the glue coating tank 301 so as to atomize the conductive adhesive 203; other structures are the same as those in embodiment 1, and are not described again.
The coating method in this example differs from example 1 in that: in the step S4, a feeding controller is used to pass argon or nitrogen gas into the storage tank 201 at a flow rate of 500mL/min by means of air pressure, so that the flow rate of the conductive adhesive 203 fed into the paint tank from the storage tank is controlled within a range of 1-100 mL/min, the single glue-spitting amount of the glue-applying head 302 is accurately controlled by the glue amount control valve 303, the mist introduced from the mist port 306 atomizes the conductive adhesive 203, and then the glue-applying controller is used to control the glue-applying head 302 to spray quantitative conductive adhesive 203 to coat the inner wall of each hole 101 for 3 times; other methods and steps are the same as those in embodiment 1, and are not described herein again.
The hollow fiber electrode with a proper outer diameter is inserted into the array of the holes 101 of the current collector 100 coated with the conductive adhesive 203 in the embodiment, and the hollow fiber electrode array is assembled for electrochemical catalytic reaction, so that the application of large-scale electrochemical conversion is promoted.
Example 5
The present embodiment provides an apparatus and a method for coating a conductive adhesive 203 on an inner wall of a current collector hole, where the apparatus in this embodiment is different from that in embodiment 2 in that: the glue coating tank 301 is also provided with a mist port 306, the input end of the mist port 306 is connected with a mist making device, and the mist making device inputs the mist into the glue coating tank 301 so as to atomize the conductive adhesive 203; the other structures are the same as those in embodiment 2, and are not described again.
The coating method in this example differs from example 2 in that: in the step S4, a feeding controller is used to pass argon or nitrogen gas into the storage tank 201 at a flow rate of 10mL/min by means of air pressure, so that the flow rate of the conductive adhesive 203 fed into the paint tank from the storage tank is controlled within a range of 1-100 mL/min, the single glue-spitting amount of the glue-applying head 302 is accurately controlled by the glue amount control valve 303, the mist introduced from the mist port 306 atomizes the conductive adhesive 203, and then the glue-applying controller is used to control the glue-applying head 302 to spray quantitative conductive adhesive 203 to coat the inner wall of each hole 101 for 5 times; other methods and steps are the same as those in embodiment 2, and are not described herein again.
The hollow fiber electrode with a proper outer diameter is inserted into the array of the holes 101 of the current collector 100 coated with the conductive adhesive 203 in the embodiment, and the hollow fiber electrode array is assembled for electrochemical catalytic reaction, so that the application of large-scale electrochemical conversion is promoted.
Example 6
The present embodiment provides an apparatus and a method for coating a conductive paste 203 on an inner wall of a current collector hole, where the apparatus in this embodiment is different from that in embodiment 3 in that: the glue coating tank 301 is also provided with a mist port 306, the input end of the mist port 306 is connected with a mist making device, and the mist making device inputs the mist into the glue coating tank 301 so as to atomize the conductive adhesive 203; the other structures are the same as those in embodiment 3, and are not described again.
The coating method in this example differs from example 3 in that: in the step S4, a feeding controller is used to pass argon or nitrogen gas into the storage tank 201 at a flow rate of 1000mL/min by means of air pressure, so that the flow rate of the conductive adhesive 203 fed into the paint tank from the storage tank is controlled within a range of 1-100 mL/min, the single glue-spitting amount of the glue-applying head 302 is accurately controlled by the glue amount control valve 303, the mist introduced from the mist port 306 atomizes the conductive adhesive 203, and then the glue-applying controller is used to control the glue-applying head 302 to spray quantitative conductive adhesive 203 to coat the inner wall of each hole 101 for 1 time; other methods and steps are the same as those in embodiment 3, and are not described herein again.
The hollow fiber electrode with a proper outer diameter is inserted into the array of the holes 101 of the current collector 100 coated with the conductive adhesive 203 in the embodiment, and the hollow fiber electrode array is assembled for electrochemical catalytic reaction, so that the application of large-scale electrochemical conversion is promoted.
Example 7
The present embodiment provides an apparatus and a method for coating a conductive adhesive 203 on an inner wall of a current collector hole, and the coating apparatus in this embodiment is the same as that in embodiment 1, and is not described herein again.
The coating method in this example differs from example 1 in that: the current collector 100 in step S2 is made of aluminum, and other steps and methods are the same as those in embodiment 1 and are not described again.
The hollow fiber electrode with a proper outer diameter is inserted into the array of the holes 101 of the current collector 100 coated with the conductive adhesive 203 in the embodiment, and the hollow fiber electrode array is assembled for electrochemical catalytic reaction, so that the application of large-scale electrochemical conversion is promoted.
Example 8
The present embodiment provides an apparatus and a method for coating a conductive adhesive 203 on an inner wall of a current collector hole, and the coating apparatus in this embodiment is the same as that in embodiment 2, and is not described herein again.
The coating method in this example differs from example 2 in that: the current collector 100 in step S2 is made of aluminum, and other steps and methods are the same as those in embodiment 2 and are not repeated herein.
The hollow fiber electrode with a proper outer diameter is inserted into the array of the holes 101 of the current collector 100 coated with the conductive adhesive 203 in the embodiment, and the hollow fiber electrode array is assembled for electrochemical catalytic reaction, so that the application of large-scale electrochemical conversion is promoted.
Example 9
The present embodiment provides an apparatus and a method for coating a conductive adhesive 203 on an inner wall of a current collector hole, and the coating apparatus in this embodiment is the same as that in embodiment 3, and is not described herein again.
The coating method in this example differs from example 3 in that: the current collector 100 in step S2 is made of aluminum, and other steps and methods are the same as those in embodiment 3 and are not repeated herein.
The hollow fiber electrode with a proper outer diameter is inserted into the array of the holes 101 of the current collector 100 coated with the conductive adhesive 203 in the embodiment, and the hollow fiber electrode array is assembled for electrochemical catalytic reaction, so that the application of large-scale electrochemical conversion is promoted.
Example 10
The present embodiment provides an apparatus and a method for coating a conductive adhesive 203 on an inner wall of a current collector hole, and the coating apparatus in this embodiment is the same as that in embodiment 4, and is not described herein again.
The coating method in this example differs from example 4 in that: the current collector 100 in step S4 is made of aluminum, and other steps and methods are the same as those in embodiment 4 and are not repeated herein.
The hollow fiber electrode with a proper outer diameter is inserted into the array of the holes 101 of the current collector 100 coated with the conductive adhesive 203 in the embodiment, and the hollow fiber electrode array is assembled for electrochemical catalytic reaction, so that the application of large-scale electrochemical conversion is promoted.
Example 11
The present embodiment provides an apparatus and a method for coating a conductive adhesive 203 on an inner wall of a current collector hole, and the coating apparatus in this embodiment is the same as that in embodiment 5, and is not described herein again.
The coating method in this example differs from example 5 in that: the current collector 100 in step S2 is made of aluminum, and other steps and methods are the same as those in embodiment 5 and are not described again.
The hollow fiber electrode with a proper outer diameter is inserted into the array of the holes 101 of the current collector 100 coated with the conductive adhesive 203 in the embodiment, and the hollow fiber electrode array is assembled for electrochemical catalytic reaction, so that the application of large-scale electrochemical conversion is promoted.
Example 12
The present embodiment provides an apparatus and a method for coating a conductive adhesive 203 on an inner wall of a current collector hole, and the coating apparatus in this embodiment is the same as that in embodiment 6, and is not described herein again.
The coating method in this example differs from example 6 in that: the current collector 100 in step S2 is made of aluminum, and other steps and methods are the same as those in embodiment 6 and are not described again.
The hollow fiber electrode with a proper outer diameter is inserted into the array of the holes 101 of the current collector 100 coated with the conductive adhesive 203 in the embodiment, and the hollow fiber electrode array is assembled for electrochemical catalytic reaction, so that the application of large-scale electrochemical conversion is promoted.
Example 13
The present embodiment provides an apparatus and a method for coating a conductive adhesive 203 on an inner wall of a current collector hole, and the coating apparatus in this embodiment is the same as that in embodiment 1, and is not described herein again.
The coating method in this example differs from example 1 in that: the current collector 100 in step S2 is made of silver, and other steps and methods are the same as those in embodiment 1 and are not described again.
The hollow fiber electrode with a proper outer diameter is inserted into the array of the holes 101 of the current collector 100 coated with the conductive adhesive 203 in the embodiment, and the hollow fiber electrode array is assembled for electrochemical catalytic reaction, so that the application of large-scale electrochemical conversion is promoted.
Example 14
The present embodiment provides an apparatus and a method for coating a conductive adhesive 203 on an inner wall of a current collector hole, and the coating apparatus in this embodiment is the same as that in embodiment 2, and is not described herein again.
The coating method in this example differs from example 2 in that: the current collector 100 in step S2 is made of silver, and other steps and methods are the same as those in embodiment 2 and are not described again.
The hollow fiber electrode with a proper outer diameter is inserted into the array of the holes 101 of the current collector 100 coated with the conductive adhesive 203 in the embodiment, and the hollow fiber electrode array is assembled for electrochemical catalytic reaction, so that the application of large-scale electrochemical conversion is promoted.
Example 15
The present embodiment provides an apparatus and a method for coating a conductive adhesive 203 on an inner wall of a current collector hole, and the coating apparatus in this embodiment is the same as that in embodiment 3, and is not described herein again.
The coating method in this example differs from example 3 in that: the current collector 100 in step S2 is made of silver, and other steps and methods are the same as those in embodiment 3 and are not described again.
The hollow fiber electrode with a suitable outer diameter is inserted into the array of holes 101 of the current collector 100 coated with the conductive adhesive 203 in this embodiment, and assembled into a hollow fiber electrode array for electrochemical catalytic reaction, thereby promoting the application of large-scale electrochemical conversion.
Example 16
The present embodiment provides an apparatus and a method for coating a conductive adhesive 203 on an inner wall of a current collector hole, and the coating apparatus in this embodiment is the same as that in embodiment 4, and is not described herein again.
The coating method in this example differs from example 4 in that: the current collector 100 in step S4 is made of silver, and other steps and methods are the same as those in embodiment 4 and are not described again.
The hollow fiber electrode with a suitable outer diameter is inserted into the array of holes 101 of the current collector 100 coated with the conductive adhesive 203 in this embodiment, and assembled into a hollow fiber electrode array for electrochemical catalytic reaction, thereby promoting the application of large-scale electrochemical conversion.
Example 17
The present embodiment provides an apparatus and a method for coating a conductive adhesive 203 on an inner wall of a current collector hole, and the coating apparatus in this embodiment is the same as that in embodiment 5, and is not described herein again.
The coating method in this example differs from example 5 in that: the current collector 100 in step S4 is made of silver, and other steps and methods are the same as those in embodiment 5 and are not described again.
The hollow fiber electrode with a suitable outer diameter is inserted into the array of holes 101 of the current collector 100 coated with the conductive adhesive 203 in this embodiment, and assembled into a hollow fiber electrode array for electrochemical catalytic reaction, thereby promoting the application of large-scale electrochemical conversion.
Example 18
The present embodiment provides a device and a method for coating conductive adhesive 203 on the inner walls of current collector holes, the coating device in this embodiment is the same as that in embodiment 6, and details are not repeated herein.
The coating method in this example differs from example 6 in that: the current collector 100 in step S4 is made of silver, and other steps and methods are the same as those in embodiment 6 and are not described again.
The hollow fiber electrode with a proper outer diameter is inserted into the array of the holes 101 of the current collector 100 coated with the conductive adhesive 203 in the embodiment, and the hollow fiber electrode array is assembled for electrochemical catalytic reaction, so that the application of large-scale electrochemical conversion is promoted.
Example 19
The present embodiment provides an apparatus and a method for coating a conductive adhesive 203 on an inner wall of a current collector hole, and the coating apparatus in this embodiment is the same as that in embodiment 1, and is not described herein again.
The coating method in this example differs from example 1 in that: the current collector 100 in step S2 is made of copper material, and other steps and methods are the same as those in embodiment 1, and are not described again here.
The hollow fiber electrode with a proper outer diameter is inserted into the array of the holes 101 of the current collector 100 coated with the conductive adhesive 203 in the embodiment, and the hollow fiber electrode array is assembled for electrochemical catalytic reaction, so that the application of large-scale electrochemical conversion is promoted.
Example 20
The present embodiment provides an apparatus and a method for coating a conductive adhesive 203 on an inner wall of a current collector hole, and the coating apparatus in this embodiment is the same as that in embodiment 2, and is not described herein again.
The coating method in this example differs from example 2 in that: the current collector 100 in step S2 is made of copper material, and other steps and methods are the same as those in embodiment 2 and are not described again here.
The hollow fiber electrode with a proper outer diameter is inserted into the array of the holes 101 of the current collector 100 coated with the conductive adhesive 203 in the embodiment, and the hollow fiber electrode array is assembled for electrochemical catalytic reaction, so that the application of large-scale electrochemical conversion is promoted.
Example 21
The present embodiment provides an apparatus and a method for coating a conductive adhesive 203 on an inner wall of a current collector hole, and the coating apparatus in this embodiment is the same as that in embodiment 3, and is not described herein again.
The coating method in this example differs from example 3 in that: the current collector 100 in step S2 is made of copper material, and other steps and methods are the same as those in embodiment 3, and are not described again here.
The hollow fiber electrode with a proper outer diameter is inserted into the array of the holes 101 of the current collector 100 coated with the conductive adhesive 203 in the embodiment, and the hollow fiber electrode array is assembled for electrochemical catalytic reaction, so that the application of large-scale electrochemical conversion is promoted.
Example 22
The present embodiment provides an apparatus and a method for coating a conductive adhesive 203 on an inner wall of a current collector hole, and the coating apparatus in this embodiment is the same as that in embodiment 4, and is not described herein again.
The coating method in this example differs from example 4 in that: the current collector 100 in step S4 is made of copper material, and other steps and methods are the same as those in embodiment 4 and are not described again here.
The hollow fiber electrode with a proper outer diameter is inserted into the array of the holes 101 of the current collector 100 coated with the conductive adhesive 203 in the embodiment, and the hollow fiber electrode array is assembled for electrochemical catalytic reaction, so that the application of large-scale electrochemical conversion is promoted.
Example 23
The present embodiment provides a device and a method for coating conductive adhesive 203 on the inner walls of current collector holes, the device in this embodiment is the same as the device in embodiment 5, and details are not repeated herein.
The coating method in this example differs from example 5 in that: the current collector 100 in step S4 is made of copper material, and other steps and methods are the same as those in embodiment 5, and are not described again here.
The hollow fiber electrode with a proper outer diameter is inserted into the array of the holes 101 of the current collector 100 coated with the conductive adhesive 203 in the embodiment, and the hollow fiber electrode array is assembled for electrochemical catalytic reaction, so that the application of large-scale electrochemical conversion is promoted.
Example 24
The present embodiment provides an apparatus and a method for coating a conductive adhesive 203 on an inner wall of a current collector hole, and the coating apparatus in this embodiment is the same as that in embodiment 6, and is not described herein again.
The coating method in this example differs from example 6 in that: the current collector 100 in step S4 is made of copper material, and other steps and methods are the same as those in embodiment 6 and are not described herein again.
The hollow fiber electrode with a proper outer diameter is inserted into the array of the holes 101 of the current collector 100 coated with the conductive adhesive 203 in the embodiment, and the hollow fiber electrode array is assembled for electrochemical catalytic reaction, so that the application of large-scale electrochemical conversion is promoted.
In summary, the invention provides a coating system of conductive adhesive on the inner wall of a current collector hole, which is simple in design and fully automatic, and comprises a storage unit, a gluing unit, a positioning unit and a control unit, wherein an electric cylinder positioning assembly in the positioning unit can realize automatic positioning between the gluing unit and the current collector hole under the control of a positioning controller, and automatically control the depth of a gluing head extending into the inner wall of the hole, so that the conductive adhesive can be coated on the inner wall of the current collector hole in a full-automatic manner quickly and efficiently; in addition, the feeding speed of the conductive adhesive in the coating tank is automatically controlled through the feeding controller, the single glue discharging amount of the gluing head is realized through the glue amount control valve, the uniformity of coating is ensured, meanwhile, the gluing controller automatically controls the gluing head to spray or extrude a certain amount of conductive adhesive onto the inner wall of the hole, the uniformity and the repeatability of coating are ensured, so that the electrode has excellent conductivity after being inserted into the hole, and the large-scale production efficiency is greatly improved; the coating system and the coating method can effectively simplify the conductive adhesive coating procedure of the inner wall of the surface hole of the current collector in the batch assembly process of the electrode array, and have the advantages of simple and convenient operation, cost saving and easy scale production; the conductive adhesive is suitable for coating the inner wall of the surface hole of the current collector when various electrodes are assembled in batches, and has wide industrial prospect and value. Therefore, the invention effectively overcomes various defects in the prior art and has high industrial utilization value.
The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.

Claims (10)

1. A coating system for conductive adhesive on the inner wall of a current collector hole is characterized in that the coating system is used for coating the conductive adhesive on the inner wall of the current collector hole, a plurality of holes are drilled on a current collector, and the holes are arranged in an array to form a hole array;
the coating system comprises:
the storage unit comprises a storage tank, a discharge hole is formed in the storage tank, and the conductive adhesive stored in the storage tank is discharged from the discharge hole;
the glue spreading unit comprises a glue spreading tank, a glue spreading head and a glue amount control valve, wherein a feed port is formed in the glue spreading tank and is connected with the discharge port through a feed pipeline; the gluing head is arranged at the bottom of the gluing tank and communicated with the gluing tank, and is used for coating conductive adhesive on the inner wall of the hole; the glue amount control valve is arranged above the gluing tank and used for controlling the gluing amount of the gluing head for single gluing;
the positioning unit comprises a fixed base, a positioning tool and an electric cylinder positioning assembly, the positioning tool is arranged on the fixed base, and the current collector is fixedly arranged on the positioning tool and is positioned below the gluing unit; the electric cylinder positioning assembly is used for positioning the position between the gluing head and the inner wall of the hole;
the control unit comprises a feeding controller, a positioning controller and a gluing controller, wherein the feeding controller is used for feeding the conductive glue stored in the reservoir into the gluing tank through a feeding pipeline; the positioning controller is connected with the electric cylinder positioning assembly and is used for controlling the electric cylinder positioning assembly to position the gluing head; and the gluing controller is used for controlling the gluing head to spray or extrude quantitative conductive adhesive to the inner wall of the hole.
2. The system of claim 1, wherein the coating of conductive paste on the inner walls of the current collector holes comprises: the electric cylinder locating component comprises an X-axis electric cylinder, a Y-axis electric cylinder and a Z-axis electric cylinder, the X-axis electric cylinder and the Z-axis electric cylinder are connected with the gluing unit, the Y-axis electric cylinder is installed on the locating tool, the X-axis electric cylinder and the Y-axis electric cylinder are used for locating in the horizontal direction, the position of the gluing unit is made, the gluing head is located right above the hole, and the Z-axis electric cylinder is used for locating in the height direction, the position of the gluing head is made, and the gluing head stretches into the inner wall of the hole.
3. The system of claim 1, wherein the coating of conductive paste on the inner walls of the current collector holes comprises: the air inlet has still been seted up on the gluing jar, the input of air inlet is connected with air feeder, the gluing controller with air feeder connects for the air input that the control got into in the gluing jar, in order to control the gluing head coats the conducting resin in the hole inner wall.
4. The system of claim 1, wherein the coating of conductive paste on the inner walls of the current collector holes comprises: the coating tank is also provided with a mist port, the input end of the mist port is connected with a mist making device, and the mist making device inputs mist into the coating tank so as to atomize the conductive adhesive.
5. A coating method of conductive adhesive on the inner wall of a current collector hole is characterized by comprising the following steps: the coating method comprises the following steps:
s1, providing the coating system of the conductive adhesive on the inner wall of the current collector hole as claimed in any one of claims 1-4;
s2, fixedly placing the current collector on a positioning tool;
s3, controlling the movement of the electric cylinder positioning component by using a positioning controller to position the positions of the glue coating head and the hole;
s4, feeding the conductive adhesive into a gluing tank by using a feeding controller, accurately controlling the single glue-spitting amount of a gluing head by using a glue amount control valve, and controlling the gluing head to extrude or spray the conductive adhesive for multiple times by using a gluing controller and coating the conductive adhesive on the inner wall of each hole;
and S5, repeating the steps S3 and S4, and sequentially coating conductive adhesive on the inner walls of the holes of the current collector hole array.
6. The system of claim 5, wherein the coating of conductive paste on the inner walls of the current collector holes comprises: the current collector is one of stainless steel, aluminum, silver and copper metal conductive materials; the current collector is a tubular, rod-shaped or block-shaped current collector; the length of mass flow body is 2 ~ 60cm, the internal diameter of mass flow body is 1 ~ 20mm, the external diameter of mass flow body is 2 ~ 50mm, the wall thickness of mass flow body is 1 ~ 10 mm.
7. The system of claim 5, wherein the coating system comprises: the hole of boring on the mass flow body is the round hole, the internal diameter of hole is 0.1 ~ 5mm, the degree of depth of hole is 1 ~ 10mm, and adjacent two in same row interval between the hole is 0.2 ~ 5mm, adjacent two rows distance between the hole is 0.2 ~ 5 mm.
8. The system of claim 5, wherein the coating of conductive paste on the inner walls of the current collector holes comprises: in step S3, the positioning controller is used to control the movement of the electric cylinder positioning assembly for positioning the positions of the glue applying head and the hole, specifically: firstly, a positioning controller is adopted to control an X-axis electric cylinder and a Y-axis electric cylinder, so that a gluing head moves to the position above a hole, and then a Z-axis electric cylinder is controlled, so that the gluing head extends into the inner wall of the hole and the depth of the gluing head extending into the inner wall of the hole is controlled.
9. The system of claim 5, wherein the coating of conductive paste on the inner walls of the current collector holes comprises: in the step S4, the feeding controller is a pneumatic controller; adopt feed controller feeds into the coating jar with conducting resin, specifically is: controlling the amount of argon or nitrogen passing through the storage tank by using a feeding controller, so that the conductive adhesive is fed into the coating tank from the storage tank; wherein the flow rate of introducing argon or nitrogen is 10-1000 mL/min.
10. The system of claim 5, wherein the coating of conductive paste on the inner walls of the current collector holes comprises: step S4 includes any one or combination of the following:
the feeding controller is a pumping pressure controller; adopt feed controller feeds into the coating tank with the conducting resin in, specifically do: feeding the conductive adhesive into the coating tank from the storage tank by adopting a feeding controller in a pumping pressure mode;
the feeding flow rate of the conductive adhesive fed into the coating tank is 1-100 mL/min;
the single glue-spitting amount is less than or equal to 0.1 mL;
controlling the gluing head to coat the conductive adhesive on the inner wall of each hole for 1-5 times by using a gluing controller;
the conductive adhesive is conductive silver adhesive.
CN202210482059.3A 2022-05-05 2022-05-05 Coating system and method for conductive adhesive on inner wall of current collector hole Pending CN114950872A (en)

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