CN114944317A - Electron microscope imaging method - Google Patents
Electron microscope imaging method Download PDFInfo
- Publication number
- CN114944317A CN114944317A CN202210398201.6A CN202210398201A CN114944317A CN 114944317 A CN114944317 A CN 114944317A CN 202210398201 A CN202210398201 A CN 202210398201A CN 114944317 A CN114944317 A CN 114944317A
- Authority
- CN
- China
- Prior art keywords
- sample
- imaging
- electron microscope
- parameters
- samples
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003384 imaging method Methods 0.000 title claims abstract description 124
- 238000000034 method Methods 0.000 claims description 31
- 238000010438 heat treatment Methods 0.000 claims description 15
- 230000004075 alteration Effects 0.000 claims description 11
- 238000010894 electron beam technology Methods 0.000 claims description 8
- 206010010071 Coma Diseases 0.000 claims description 3
- 201000009310 astigmatism Diseases 0.000 claims description 3
- 238000001493 electron microscopy Methods 0.000 claims description 2
- 238000000926 separation method Methods 0.000 claims 1
- 230000008569 process Effects 0.000 description 14
- 230000000694 effects Effects 0.000 description 10
- 239000000463 material Substances 0.000 description 10
- 230000005540 biological transmission Effects 0.000 description 9
- 238000002474 experimental method Methods 0.000 description 9
- 229910052787 antimony Inorganic materials 0.000 description 6
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 6
- 238000012986 modification Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 238000009826 distribution Methods 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 238000001000 micrograph Methods 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 description 1
- 229910052982 molybdenum disulfide Inorganic materials 0.000 description 1
- 239000002064 nanoplatelet Substances 0.000 description 1
- 239000002071 nanotube Substances 0.000 description 1
- 239000002070 nanowire Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- PCLURTMBFDTLSK-UHFFFAOYSA-N nickel platinum Chemical compound [Ni].[Pt] PCLURTMBFDTLSK-UHFFFAOYSA-N 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
- H01J37/261—Details
- H01J37/265—Controlling the tube; circuit arrangements adapted to a particular application not otherwise provided, e.g. bright-field-dark-field illumination
Landscapes
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
Abstract
Embodiments of the present description provide an electron microscope imaging method, including: holding a sample holder carrying at least two samples including a first sample and at least one second sample at an imaging position of an electron microscope; adjusting an imaging parameter of the electron microscope based on the first sample; performing an imaging operation on the at least one second sample based on the imaging parameters.
Description
Technical Field
The present disclosure relates to the field of electronic imaging technologies, and in particular, to an imaging method for an electron microscope.
Background
With the development of electron microscope technology, more and more types of samples can be observed and imaged under high-power and high-resolution through an electron microscope (for example, a spherical aberration correction transmission electron microscope), and more references are provided for the deep study of the composition, structure and the like of various substances. However, the requirement of the electron microscope on the imaging state is very high, and once the imaging parameters are not properly adjusted, the imaging effect is directly influenced. The imaging state is usually adjusted by a standard sample, and after the adjustment is completed, the standard sample is taken out and put into a sample to be imaged for observation and imaging. However, the imaging state of the electron microscope is often unstable, and the adjusted imaging parameters are easily changed in the process of taking and placing the sample, so that the imaging effect is influenced. In addition, a good imaging state cannot be maintained for a long time, and the imaging state may change in the imaging process, and at this time, a standard sample needs to be put in again for debugging, which affects the imaging efficiency and the imaging effect. Therefore, it is necessary to provide an electron microscope imaging method that improves imaging efficiency and imaging effect.
Disclosure of Invention
Embodiments of the present description provide an electron microscope imaging method, including: holding a sample holder carrying at least two samples including a first sample and at least one second sample at an imaging position of an electron microscope; adjusting an imaging parameter of the electron microscope based on the first sample; performing an imaging operation on the at least one second sample based on the imaging parameters.
In some embodiments, the first sample is a standard sample.
In some embodiments, the distance between the first sample and an adjacent second sample is less than a first distance threshold.
In some embodiments, the spacing between adjacent ones of the at least one second sample is less than a second distance threshold.
In some embodiments, the at least two samples are uniformly distributed on the sample holder.
In some embodiments, the at least one second sample differs in species or sample parameters.
In some embodiments, the imaging parameters include at least one of spherical aberration, coma, astigmatism, distortion, or chromatic aberration.
In some embodiments, said performing an imaging operation on said at least one second sample based on said imaging parameters comprises: setting imaging conditions corresponding to the at least one second sample respectively; sequentially performing the imaging operation on the at least one second sample based on the imaging conditions.
In some embodiments, the imaging conditions include at least one of a current magnitude of the electron beam, a heating temperature, a convergence angle, a collection angle, an acquisition time, an imaging multiple, or an imaging resolution.
In some embodiments, the method further comprises: determining at least one target image corresponding to the at least one second sample respectively based on the imaging operation result; and dynamically displaying the at least one target image.
In the embodiment of the present specification, a sample carrying at least two samples (including a first sample and at least one second sample) is held at an imaging position of an electron microscope, imaging parameters of the electron microscope are adjusted based on the first sample (for example, a standard sample), and then an imaging operation is performed on at least one second sample (for example, a sample to be imaged) based on the adjusted imaging parameters. The standard sample and the sample to be imaged are simultaneously placed into an electron microscope, imaging parameters are debugged based on the standard sample, and after the debugging is completed, only the sample support needs to be subjected to micro adjustment (for example, the sample support is slightly moved), so that the imaging operation of the sample to be imaged can be realized, the standard sample does not need to be taken out and then placed into the sample to be imaged, the imaging efficiency is improved, the disturbance of the sample replacing process on the imaging parameters can be avoided, and the imaging effect is improved.
Drawings
The present description will be further explained by way of exemplary embodiments, which will be described in detail by way of the accompanying drawings. These embodiments are not intended to be limiting, and in these embodiments like numerals are used to indicate like structures, wherein:
fig. 1 is a flow chart of an exemplary electron microscope imaging method, shown in accordance with some embodiments of the present description.
FIG. 2 is a schematic view of an exemplary electron microscope sample rod and sample holder, shown in accordance with some embodiments of the present description.
Fig. 3A-3C are schematic diagrams of exemplary sample distributions, according to some embodiments herein.
Fig. 4A and 4B are spherical aberration corrected transmission electron microscope images of antimony two-dimensional materials according to some embodiments of the present description.
Detailed Description
In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings used in the description of the embodiments will be briefly described below. It is obvious that the drawings in the following description are only examples or embodiments of the present description, and that for a person skilled in the art, the present description can also be applied to other similar scenarios on the basis of these drawings without inventive effort. Unless otherwise apparent from the context, or otherwise indicated, like reference numbers in the figures refer to the same structure or operation.
It should be understood that "system", "apparatus", "unit" and/or "module" as used herein is a method for distinguishing different components, elements, parts, portions or assemblies at different levels. However, other words may be substituted by other expressions if they accomplish the same purpose.
As used in this specification and the appended claims, the terms "a," "an," "the," and/or "the" are not intended to be inclusive in the singular, but rather are intended to be inclusive in the plural, unless the context clearly dictates otherwise. In general, the terms "comprises" and "comprising" merely indicate that steps and elements are included which are explicitly identified, that the steps and elements do not form an exclusive list, and that a method or apparatus may include other steps or elements.
Flow charts are used in this description to illustrate operations performed by a system according to embodiments of the present description. It should be understood that the preceding or following operations are not necessarily performed in the exact order in which they are performed. Rather, the various steps may be processed in reverse order or simultaneously. Meanwhile, other operations may be added to the processes, or a certain step or several steps of operations may be removed from the processes.
FIG. 1 is a flow chart of an exemplary electron microscopy imaging method according to some embodiments herein. In some embodiments, the process 100 may be performed automatically by a control system. For example, the process 100 may be implemented by control instructions, and the control system controls each component to complete each operation of the process 100 based on the control instructions. In some embodiments, the process 100 may be performed semi-automatically. For example, one or more of the operations of the process 100 may be performed manually by an operator. In some embodiments, one or more additional operations not described may be added and/or one or more operations discussed herein may be deleted upon completion of flow 100. Additionally, the order of the operations shown in FIG. 1 is not intended to be limiting. As shown in fig. 1, the process 100 may include the following steps.
At step 110, the sample bearing the at least two samples is held in an imaging position of an electron microscope.
In some embodiments, the electron microscope may comprise a transmission electron microscope, a spherical aberration corrected transmission electron microscope, a chromatic aberration corrected transmission electron microscope, a scanning electron microscope, or the like, or any combination thereof.
In some embodiments, a sample holder (e.g., sample holder 20 shown in fig. 2) carrying at least two samples may be placed at the front end (e.g., 11 shown in fig. 2) of a sample rod (e.g., transmission electron microscope sample rod 10 shown in fig. 2) and the sample rod placed at an imaging station within an electron microscope.
In some embodiments, the sample holder may comprise a copper mesh, a gold mesh, a nickel mesh, a molybdenum mesh, or the like, or any combination thereof.
In some embodiments, the at least two samples may include a first sample and at least one second sample.
In some embodiments, the first sample can be a standard sample. In some embodiments, the standard sample may include cross-grading gold standards, strontium titanate standards, and the like. In some embodiments, the first sample may be used to adjust or tune an imaging state or imaging parameters of the electron microscope.
In some embodiments, the second sample may be a sample to be imaged, for example, an antimony two-dimensional material, molybdenum disulfide, platinum-nickel alloy, bismuth ferrite, etc., which may be determined according to actual needs.
In some embodiments, the species or sample parameters of the at least one second sample may be different or at least partially different from each other. In some embodiments, the type of sample may embody the form, material, constituent elements, and the like of the sample. In some embodiments, the sample parameters may be indicative of the nature, size, preparation or synthesis conditions, etc. of the sample. For example, the at least one second sample may comprise a nanowire sample, a nanoplatelet sample, a nanotube sample, or the like. For another example, the at least one second sample may include copper, platinum, molybdenum, or the like. For another example, the at least one second sample may include a plurality of samples whose synthesis times are different. For another example, the at least one second sample may include a plurality of samples prepared at different heating temperatures.
In some embodiments, the species or sample parameters of the at least one second sample may be different. For example, the at least one second sample may be a plurality of samples having the same material and/or substantially the same thickness.
In some embodiments, the at least two samples may be uniformly distributed on the sample holder. Further description of the at least two samples can be found in FIGS. 3A-3C and will not be repeated here.
At step 120, based on the first sample, an imaging parameter of the electron microscope is adjusted.
In some embodiments, the imaging parameters of the electron microscope may include imaging parameters including spherical aberration, coma, astigmatism, distortion, chromatic aberration, and the like, or any combination thereof.
In some embodiments, the adjustment of the imaging parameters may be accomplished by an automated commissioning system of the electron microscope. In some embodiments, the adjustment of the imaging parameters may be accomplished manually.
At step 130, an imaging operation is performed on the at least one second sample based on the imaging parameters.
In some embodiments, after the adjustment of the imaging parameters is completed based on the first sample (e.g., the standard sample), the sample holder may be moved slightly and the imaging operation may be performed on the second sample.
In some embodiments, the movement of the sample holder 20 may be achieved by moving the sample rod 10. For example, the sample rod 10 may be rotated or translated to effect movement of the sample holder 20.
In some embodiments, the imaging conditions corresponding to the at least one second sample may be set, and the imaging operation may be performed on the at least one second sample in sequence based on the corresponding imaging conditions.
In some embodiments, the imaging conditions may include current magnitude of the electron beam, heating temperature, convergence angle, collection angle, acquisition time, imaging magnification, imaging resolution, and the like, or any combination thereof.
For example only, assuming that 5 second samples of the same type and/or sample parameters are included, the electron beam current levels corresponding to the 5 second samples (e.g., a1, a2, A3, a4, and a5, respectively) may be set, and then the 5 second samples may be sequentially imaged at the corresponding electron beam current levels. Accordingly, images corresponding to 5 beam current magnitudes, respectively, can be obtained. And further, the influence of the electron beam current on the sample can be researched by analyzing the image information.
As yet another example, still assuming that 5 second samples of the same kind and/or sample parameters are included, the heating temperatures corresponding to the 5 second samples (e.g., T1, T2, T3, T4, and T5, respectively) may be set, and then the imaging operation may be performed while sequentially performing the heating process on the 5 second samples at the corresponding heating temperatures. Accordingly, images corresponding to 5 heating temperatures, respectively, can be obtained. Further, the influence of the heating temperature on the sample can be studied by analyzing the image information. It should be noted that, in the transmission electron microscope, different positions of the sample heating stage can achieve different heating temperatures (for example, the edge heating temperature is high, the center heating temperature is low), and the sample heating stage can move synchronously with the sample holder, so that heating and imaging can be performed simultaneously.
As yet another example, assuming that 5 second samples different in kind and/or sample parameters are included, the imaging operation may be performed on the 5 second samples sequentially at the same beam current level. Accordingly, images corresponding to 5 samples of different types and/or sample parameters can be obtained. And further, the influence of the specific electron beam current on different samples can be researched by analyzing image information.
In some embodiments, after the imaging operation is performed on the at least one second sample, at least one target image (e.g., images corresponding to the 5 electron beam current magnitudes described above) corresponding to the at least one second sample may be determined based on the imaging operation result. Further, at least one target image may be dynamically presented. For example, 5 target images can be dynamically displayed in sequence from small to large according to the magnitude of the beam current.
In some embodiments, at least one target image may be presented by a display device (e.g., a display screen) of an electron microscope. In some embodiments, the at least one target image may be presented by any display device, which is not limited by this specification.
By dynamically displaying at least one target image, the influence of different imaging conditions on the sample can be dynamically and clearly seen, and the subsequent further analysis or research is facilitated.
It should be noted that the above description related to the flow 100 is only for illustration and explanation, and does not limit the applicable scope of the present application. Various modifications and changes to flow 100 will be apparent to those skilled in the art in light of this disclosure. However, such modifications and variations are intended to be within the scope of the present application.
Fig. 3A-3C are schematic diagrams of exemplary sample distributions, according to some embodiments herein.
As shown in fig. 3A, the at least two samples include a first sample 1 and a second sample 2, which are respectively disposed at both sides of the sample holder.
As shown in fig. 3B, the at least two samples include a first sample 1 and second samples 2-1, 2-2 and 2-3, 4 samples are uniformly distributed along the circumferential direction of the sample holder.
As shown in fig. 3C, the at least two samples include a first sample 1 and second samples 2-1, 2-2, 2-3, 2-4, 2-5, 2-6, and 2-7, and 8 samples are uniformly distributed along the circumferential direction of the sample holder.
It should be noted that the above distribution is only an example and is not a limitation, and the at least two samples may be distributed on the sample holder in other forms.
In some embodiments, in combination with the foregoing, after the tuning of the imaging parameters is completed based on the first sample, the sample holder needs to be moved to perform the imaging operation of the second sample. In order to minimize the movement of the sample holder and thus minimize the disturbance to the imaging state or imaging parameters, the distance between the first sample and the adjacent second sample needs to be smaller than the first distance threshold.
In some embodiments, the first distance threshold may be 0.6mm-0.1 mm. In some embodiments, the first distance threshold may be 0.55mm-0.15 mm. In some embodiments, the first distance threshold may be 0.5mm-0.2 mm. In some embodiments, the first distance threshold may be 0.45mm-0.25 mm. In some embodiments, the first distance threshold may be 0.4mm-0.3 mm. In some embodiments, the first distance threshold may be 0.35 mm.
In some embodiments, in combination with the foregoing, when imaging operations are to be performed on multiple second samples, the sample holder also needs to be moved accordingly. In order to minimize the movement of the sample holder and thus minimize the disturbance to the imaging state or imaging parameters, the spacing between adjacent second samples needs to be less than the second distance threshold.
In some embodiments, the second distance threshold may be 0.6mm-0.1 mm. In some embodiments, the second distance threshold may be 0.55mm-0.15 mm. In some embodiments, the second distance threshold may be 0.5mm-0.2 mm. In some embodiments, the second distance threshold may be 0.45mm-0.25 mm. In some embodiments, the second distance threshold may be 0.4mm-0.3 mm. In some embodiments, the second distance threshold may be 0.35 mm.
In some embodiments, the first and second distance thresholds may be the same or different.
Example 1
Fig. 4A and 4B are spherical aberration corrected transmission electron microscope images of antimony two-dimensional materials according to some embodiments of the present description.
In order to verify and explain the improvement of the imaging effect of the imaging method described in the embodiment of the present specification, comparative experiments (referred to as experiment one and experiment two) were performed. And preparing the antimony two-dimensional material transmission electron microscope sample under the same preparation condition for carrying out the first experiment and the second experiment. The concrete description is as follows:
experiment one: firstly, debugging imaging parameters based on a standard sample, then taking out the standard sample, and then putting the sample to be imaged (an antimony two-dimensional material sample) into an electron microscope for imaging operation. The imaging results are shown in fig. 4A.
Experiment two: the standard sample and the sample to be imaged (antimony two-dimensional material sample) are simultaneously placed on a sample holder and placed on an imaging position of an electron microscope, imaging parameters are adjusted based on the standard sample, and then the sample holder is slightly moved and the sample to be imaged is subjected to imaging operation. The imaging results are shown in fig. 4B.
As can be seen from the comparison of fig. 4A and 4B, the imaging effect of experiment two is significantly better than that of experiment one.
The beneficial effects that may be brought by the embodiments of the present application include, but are not limited to: 1) the standard sample and the sample to be imaged are simultaneously placed into an electron microscope, imaging parameters are debugged based on the standard sample, and after the debugging is finished, only the sample support needs to be subjected to micro adjustment (for example, the sample support is slightly moved), so that the imaging operation of the sample to be imaged can be realized, the sample to be imaged is not required to be placed into the sample to be imaged after the standard sample is taken out, the imaging efficiency is improved, the disturbance of the sample replacing process on the imaging parameters can be avoided, and the imaging effect is improved. 2) The distance between the adjacent samples is smaller than the distance threshold value, so that the movement of the sample holder can be as small as possible, the disturbance to the imaging state or the imaging parameters can be reduced as much as possible, and the imaging effect can be improved. 3) The imaging operation is respectively carried out on the samples based on different imaging conditions, the imaging of the samples of the same type and/or sample parameters under different imaging conditions and/or the imaging of the samples of different types and/or sample parameters under the same imaging conditions can be realized in a single imaging without carrying out multiple times of debugging and multiple times of sample replacement, the imaging efficiency is improved, meanwhile, unnecessary errors introduced in the sample debugging and replacement processes can be reduced, and the accuracy of subsequent analysis and research is improved.
It is to be noted that different embodiments may produce different advantages, and in different embodiments, the advantages that may be produced may be any one or combination of the above, or any other advantages that may be obtained.
Having thus described the basic concept, it will be apparent to those skilled in the art that the foregoing detailed disclosure is to be regarded as illustrative only and not as limiting the present specification. Various modifications, improvements and adaptations to the present description may occur to those skilled in the art, although not explicitly described herein. Such modifications, improvements and adaptations are proposed in the present specification and thus fall within the spirit and scope of the exemplary embodiments of the present specification.
Also, the description uses specific words to describe embodiments of the description. Reference throughout this specification to "one embodiment," "an embodiment," and/or "some embodiments" means that a particular feature, structure, or characteristic described in connection with at least one embodiment of the specification is included. Therefore, it is emphasized and should be appreciated that two or more references to "an embodiment" or "one embodiment" or "an alternative embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, some features, structures, or characteristics of one or more embodiments of the specification may be combined as appropriate.
Additionally, the order in which elements and sequences are described in this specification, the use of numerical letters, or other designations are not intended to limit the order of the processes and methods described in this specification, unless explicitly stated in the claims. While various presently contemplated embodiments of the invention have been discussed in the foregoing disclosure by way of example, it is to be understood that such detail is solely for that purpose and that the appended claims are not limited to the disclosed embodiments, but, on the contrary, are intended to cover all modifications and equivalent arrangements that are within the spirit and scope of the embodiments herein. For example, although the system components described above may be implemented by hardware devices, they may also be implemented by software-only solutions, such as installing the described system on an existing server or mobile device.
Similarly, it should be noted that in the preceding description of embodiments of the present specification, various features are sometimes grouped together in a single embodiment, figure, or description thereof for the purpose of streamlining the disclosure aiding in the understanding of one or more of the embodiments. This method of disclosure, however, is not intended to imply that more features than are expressly recited in a claim. Indeed, the embodiments may be characterized as having less than all of the features of a single embodiment disclosed above.
Numerals describing the number of components, attributes, etc. are used in some embodiments, it being understood that such numerals used in the description of the embodiments are modified in some instances by the use of the modifier "about", "approximately" or "substantially". Unless otherwise indicated, "about", "approximately" or "substantially" indicates that the number allows a variation of ± 20%. Accordingly, in some embodiments, the numerical parameters used in the specification and claims are approximations that may vary depending upon the desired properties of the individual embodiments. In some embodiments, the numerical parameter should take into account the specified significant digits and employ a general digit-preserving approach. Notwithstanding that the numerical ranges and parameters setting forth the broad scope of the range are approximations, in the specific examples, such numerical values are set forth as precisely as possible within the scope of the application.
For each patent, patent application publication, and other material, such as articles, books, specifications, publications, documents, etc., cited in this specification, the entire contents of each are hereby incorporated by reference into this specification. Except where the application history document does not conform to or conflict with the contents of the present specification, it is to be understood that the application history document, as used herein in the present specification or appended claims, is intended to define the broadest scope of the present specification (whether presently or later in the specification) rather than the broadest scope of the present specification. It is to be understood that the descriptions, definitions and/or uses of terms in the accompanying materials of the present specification shall control if they are inconsistent or inconsistent with the statements and/or uses of the present specification.
Finally, it should be understood that the embodiments described herein are merely illustrative of the principles of the embodiments described herein. Other variations are also possible within the scope of the present description. Thus, by way of example, and not limitation, alternative configurations of the embodiments of the specification can be considered consistent with the teachings of the specification. Accordingly, the embodiments of the present description are not limited to only those embodiments explicitly described and depicted herein.
Claims (10)
1. A method of electron microscopy imaging, the method comprising:
holding a sample carrying at least two samples, including a first sample and at least one second sample, in an imaging position of an electron microscope;
adjusting an imaging parameter of the electron microscope based on the first sample;
performing an imaging operation on the at least one second sample based on the imaging parameters.
2. The method of claim 1, wherein the first sample is a standard sample.
3. The method of claim 1, wherein a separation distance between the first sample and an adjacent second sample is less than a first distance threshold.
4. The method of claim 1, wherein a spacing between adjacent ones of the at least one second sample is less than a second distance threshold.
5. The method of claim 1, wherein the at least two samples are uniformly distributed on the sample holder.
6. The method of claim 1, wherein the at least one second sample differs in species or sample parameters.
7. The method of claim 1, wherein the imaging parameters include at least one of spherical aberration, coma, astigmatism, distortion, or chromatic aberration.
8. The method of claim 1, wherein said performing an imaging operation on said at least one second sample based on said imaging parameters comprises:
setting imaging conditions corresponding to the at least one second sample respectively;
sequentially performing the imaging operation on the at least one second sample based on the imaging conditions.
9. The method of claim 8, wherein the imaging conditions include at least one of a current magnitude of an electron beam, a heating temperature, a convergence angle, a collection angle, an acquisition time, an imaging magnification, or an imaging resolution.
10. The method of claim 8, wherein the method further comprises:
determining at least one target image corresponding to the at least one second sample respectively based on the imaging operation result;
and dynamically displaying the at least one target image.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210398201.6A CN114944317A (en) | 2022-04-15 | 2022-04-15 | Electron microscope imaging method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210398201.6A CN114944317A (en) | 2022-04-15 | 2022-04-15 | Electron microscope imaging method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114944317A true CN114944317A (en) | 2022-08-26 |
Family
ID=82906465
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210398201.6A Pending CN114944317A (en) | 2022-04-15 | 2022-04-15 | Electron microscope imaging method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114944317A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013077514A1 (en) * | 2011-11-21 | 2013-05-30 | 한국기초과학지원연구원 | Auxiliary device for loading samples on grid for tem observation |
| CN108389769A (en) * | 2017-11-15 | 2018-08-10 | 华东师范大学 | A kind of universal scanning electron microscope sample pedestal |
| CN210897190U (en) * | 2019-12-30 | 2020-06-30 | 江苏厚生新能源科技有限公司 | Adjust convenient scanning electron microscope sample platform |
| CN113192816A (en) * | 2021-04-26 | 2021-07-30 | 中国科学院物理研究所 | Electron microscope carrier net, preparation method thereof and microscope product |
| CN113504410A (en) * | 2021-09-13 | 2021-10-15 | 南通海星电子股份有限公司 | Method for measuring contact resistance of electrode foil for aluminum electrolytic capacitor |
| CN215342494U (en) * | 2021-04-26 | 2021-12-28 | 中国科学院物理研究所 | Electron microscope carrier net and electron microscope |
-
2022
- 2022-04-15 CN CN202210398201.6A patent/CN114944317A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013077514A1 (en) * | 2011-11-21 | 2013-05-30 | 한국기초과학지원연구원 | Auxiliary device for loading samples on grid for tem observation |
| CN108389769A (en) * | 2017-11-15 | 2018-08-10 | 华东师范大学 | A kind of universal scanning electron microscope sample pedestal |
| CN210897190U (en) * | 2019-12-30 | 2020-06-30 | 江苏厚生新能源科技有限公司 | Adjust convenient scanning electron microscope sample platform |
| CN113192816A (en) * | 2021-04-26 | 2021-07-30 | 中国科学院物理研究所 | Electron microscope carrier net, preparation method thereof and microscope product |
| CN215342494U (en) * | 2021-04-26 | 2021-12-28 | 中国科学院物理研究所 | Electron microscope carrier net and electron microscope |
| CN113504410A (en) * | 2021-09-13 | 2021-10-15 | 南通海星电子股份有限公司 | Method for measuring contact resistance of electrode foil for aluminum electrolytic capacitor |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Eisenstein et al. | Parallel cryo electron tomography on in situ lamellae | |
| TWI673750B (en) | Sample observation device and sample observation method | |
| JP5558088B2 (en) | Method for identifying distortion in particle optic devices | |
| EP2652537B1 (en) | Automated depiction of predetermined regions in series of sections | |
| US20160170197A1 (en) | Calibration of microscopy systems | |
| DE102018209562B3 (en) | Apparatus and methods for inspecting and / or processing an element for photolithography | |
| CN110411946B (en) | Method for focusing camera image in digital slice scanner | |
| CN113272820A (en) | Full-automatic SEM sampling system for electron beam image enhancement | |
| US11373366B2 (en) | Method for improving modeling speed of digital slide scanner | |
| Shade et al. | Experimental measurement of surface strains and local lattice rotations combined with 3D microstructure reconstruction from deformed polycrystalline ensembles at the micro-scale | |
| DE102018202728A1 (en) | Method for operating a particle beam device and particle beam device for carrying out the method | |
| DE102019133685A1 (en) | Information processing system and procedures | |
| Ortega et al. | High temporal-resolution scanning transmission electron microscopy using sparse-serpentine scan pathways | |
| JPWO2011152303A1 (en) | Charged particle beam equipment with automatic aberration correction method | |
| EP3655810B1 (en) | Light sheet microscopy method for generating a volume image of a sample, and light sheet microscope | |
| Hansen et al. | Influence of noise-generating factors on cross-correlation electron backscatter diffraction (EBSD) measurement of geometrically necessary dislocations (GNDs) | |
| JP6909886B2 (en) | Image estimation method and system | |
| Mullarkey et al. | Using your beam efficiently: Reducing electron dose in the STEM via flyback compensation | |
| Mittelberger et al. | Automated image acquisition for low-dose STEM at atomic resolution | |
| CN114944317A (en) | Electron microscope imaging method | |
| Quigley et al. | Cost and capability compromises in STEM instrumentation for low-voltage imaging | |
| NZ714911A (en) | Processes for preparing foam composites | |
| JP3657891B2 (en) | Electron microscope calibration method and electron microscope calibration standard sample | |
| DE102011084829A1 (en) | Microscopy of several samples with optical microscopy and particle beam microscopy | |
| DE10337241B4 (en) | Distortion-corrected magnetic resonance measurement and magnetic resonance apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |