CN114938567A - High-aspect-ratio filling HDI (high Density interconnection) plated board and manufacturing method thereof - Google Patents
High-aspect-ratio filling HDI (high Density interconnection) plated board and manufacturing method thereof Download PDFInfo
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- CN114938567A CN114938567A CN202210702460.3A CN202210702460A CN114938567A CN 114938567 A CN114938567 A CN 114938567A CN 202210702460 A CN202210702460 A CN 202210702460A CN 114938567 A CN114938567 A CN 114938567A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16F—SPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
- F16F15/00—Suppression of vibrations in systems; Means or arrangements for avoiding or reducing out-of-balance forces, e.g. due to motion
- F16F15/02—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems
- F16F15/04—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems using elastic means
- F16F15/06—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems using elastic means with metal springs
- F16F15/067—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems using elastic means with metal springs using only wound springs
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
Abstract
The invention discloses a high aspect ratio plug-fill-plated HDI plate and a manufacturing method thereof. According to the high aspect ratio HDI filling and plating plate and the manufacturing method thereof, the heat dissipation performance and the bending resistance of the HDI plate are improved through the heat dissipation and bending resistance device, the resistance and the service performance of the HDI plate are improved through the protective and scratch-resistant device, and the stability of the HDI plate is improved through the installation of the damping device.
Description
Technical Field
The invention relates to the technical field of HDI (high Density interconnection) boards, in particular to a high-aspect-ratio filling and plating HDI board and a manufacturing method thereof.
Background
HDI is an abbreviation for high density interconnect and is a technique for producing printed circuit boards, a circuit board with a relatively high line distribution density using micro-blind buried via technology. Particularly, with the rapid development of industries such as artificial intelligence, unmanned driving, internet of things, electronic communication and the like, the requirement on the accuracy of the HDI board is higher and higher. 1. The existing HDI board has high line distribution density due to the use of a micro-blind buried hole technology, so that the volume is reduced and the precision is improved, but the heat dissipation of the HDI board is also a problem, and the line and working elements on the HDI board are also easily damaged once the HDI board is bent; 2. the HDI board of current is after the installation, and especially the product receives when the outside rocks, and then will lead to HDI board vibrations, leads to its fixed screw to produce not hard up to influence the fixed effect of HDI board. Therefore, the HDI board with the high aspect ratio and the manufacturing method thereof are provided.
Disclosure of Invention
The invention mainly aims to provide a high aspect ratio plug-fill-plated HDI board and a manufacturing method thereof, which can effectively solve the problems in the background art.
In order to achieve the purpose, the invention adopts the technical scheme that:
the high aspect ratio fills in and plates HDI board and preparation method thereof, includes HDI board No. one, HDI board No. two is installed to HDI board upper end, HDI board No. one the lower extreme installs three HDI boards, HDI board No. one, two HDI boards and three HDI board upper ends all install the circuit layer, HDI board No. one, two HDI boards and three HDI board upper end left part and upper end right part all opened a plurality of blind holes, HDI board No. two HDI boards and three HDI board left end and right-hand member install supplementary heat abstractor jointly, supplementary heat abstractor left end and right-hand member install installation damping device jointly, installation damping device left end and right-hand member install supplementary fixing device jointly, No. two HDI board upper ends are installed the protection and are prevented cutting and rub the device, No. three HDI board lower extreme installs heat dissipation folding device.
Preferably, the anti device of buckling of heat dissipation includes polyimide board and PP bending resistant folding layer, a plurality of heat conduction post is installed to polyimide board lower extreme, heat conduction carbon fiber layer is installed to PP bending resistant folding layer lower extreme, heat conduction silicone grease layer is installed to heat conduction carbon fiber layer lower extreme, PP bending resistant folding layer, heat conduction carbon fiber layer and heat conduction silicone grease layer upper end are opened jointly and are had a plurality of cylinder connector, PP bending resistant folding layer, heat conduction carbon fiber layer and heat conduction silicone grease layer pass through the cylinder connector and install at polyimide board lower extreme, polyimide board is installed at No. three HDI board lower extremes.
Preferably, the device is prevented cutting and rubbed by fingers in protection includes the PI layer, polyester film layer is installed to PI layer lower extreme, the polytetrafluoroethylene layer is installed to polyester film layer lower extreme, the bond line is installed to polytetrafluoroethylene layer lower extreme, the PI layer is installed in No. two HDI board upper ends through the bond line.
Preferably, supplementary heat abstractor includes the mounting bracket, all install insulating heat-conducting glue on inner wall and the back inner wall before the mounting bracket, a plurality of draw-in groove has all been opened to mounting bracket left end and right-hand member, radiating fin is all installed to mounting bracket front end and rear end, the mounting bracket is installed at HDI board left end and right-hand member No. one.
Preferably, installation damping device includes L type support frame and No. two L type support frames, the installation screw is all installed to L type support frame and No. two L type support frame upper end front portions and upper end rear portion, a set of damping spring is all installed to the one end that L type support frame and No. two L type support frames correspond, L type support frame and No. two L type support frames pass through the draw-in groove and install respectively at mounting bracket left end and right-hand member.
Preferably, supplementary fixing device includes link and No. two links, the cardboard is all installed to link and No. two link upper end front portions and upper end rear portion, four fixed screw is all installed to the cardboard upper end, four screw fixation groove has all been opened to two liang of one ends that correspond of cardboard, link is installed in L type support frame left end No. one, No. two link are installed at L type support frame right-hand member No. two.
Preferably, the plurality of heat conduction columns are distributed in a rectangular array by taking the polyimide plate as a center path, and the positions of the heat conduction columns and the positions of the column connecting ports correspond up and down.
Preferably, the screw fixing groove is consistent with the installation screw in size and corresponds to the installation screw in position up and down.
A high aspect ratio fills and plates HDI board and its preparation method, its step is as follows:
firstly, carrying out inner layer circuit treatment on a first HDI board (1), a second HDI board (7) and a third HDI board (8);
secondly, pressing the first HDI board (1), the second HDI board (7) and the third HDI board (8), and forming blind holes (the aspect ratio of the blind holes is more than 1.5: 1);
(III) copper deposition, electroplating and other processes;
and (IV) carrying out power-on test.
Compared with the prior art, the invention has the following beneficial effects:
1. the polyimide plate on the heat dissipation and bending resistant device has good creep resistance, excellent mechanical property and good flame retardance, and has very good electrical insulating property and dimensional stability, so that the use performance of the HDI plate is improved, the heat of the HDI plate can be transferred into the heat-conducting carbon fiber layer and the heat-conducting silicone grease layer through the plurality of heat-conducting columns on the polyimide plate, the heat-conducting carbon fiber has good mechanical property, electric conductivity and excellent heat conduction and radiation heat dissipation capacity, the fibrous high-heat-conducting carbon powder prepared from the carbon fiber is fibrous, the heat-conducting orientation can be designed, the heat-conducting silicone grease has high heat conductivity, excellent heat conductivity, good electrical insulating property, wide use temperature, good use stability, lower consistency and good construction performance, so that the heat dissipation performance of the HDI plate is improved, and when the HDI plate is bent under the action of external force, the PP on the PP anti-buckling layer is colorless and semitransparent thermoplastic light general plastic, and has chemical resistance, heat resistance, electrical insulation, high-strength mechanical property and good anti-buckling property.
2. When the upper part of the HDI plate is scratched, the PI layer on the protective scratching-preventing device has the characteristics of corrosion resistance, fatigue resistance, damage resistance, impact resistance, small density, low noise, long service life and the like and excellent high and low temperature performance, the polyester film layer is a colorless transparent glossy film generally, and has excellent mechanical performance, high rigidity, hardness and toughness, puncture resistance, friction resistance, high temperature resistance and low temperature resistance, so that the use performance of the circuit board is improved, and the polytetrafluoroethylene layer has excellent chemical stability, corrosion resistance, sealing performance, high lubrication non-adhesiveness, electric insulativity and good ageing resistance, so that the resistance and the use performance of the HDI plate are improved.
3. The HDI board has the advantages that the insulating heat-conducting glue on the auxiliary heat-radiating device is convenient to use, high in bonding strength, elastic after being cured, resistant to impact and vibration and the like, the cured product also has good heat conduction and heat radiation functions and excellent high-low temperature resistance and electrical performance, and heat of the front end and the rear end of the HDI board is transmitted to the heat-radiating fins through the insulating heat-conducting glue, so that the HDI board is further radiated.
4. Through installing L type support frame and No. two L type support frames on the damping device and installing at HDI board both ends by damping spring, receive when rocking when the device, cushion the shock attenuation through damping spring, consolidate the installation screw by the screw fixed slot through the cardboard on the supplementary fixing device in addition to it is not hard up to prevent that the installation screw from receiving to produce when rocking, and then has improved the stability of HDI board.
Drawings
FIG. 1 is an overall structural view of a high aspect ratio underfill-coated HDI board and a method of making the same according to the present invention;
FIG. 2 is a schematic structural diagram of a heat dissipation buckling-resistant apparatus of a high aspect ratio filling HDI board and a manufacturing method thereof according to the present invention;
FIG. 3 is a schematic structural diagram of a protective anti-scratching device of a high aspect ratio plug-fill plated HDI plate and a manufacturing method thereof according to the present invention;
FIG. 4 is a structural diagram of an auxiliary heat sink of a high aspect ratio underfill-coated HDI board and a method of making the same according to the present invention;
FIG. 5 is a schematic structural diagram of a mounting damping device of a high aspect ratio packed and plated HDI board and a manufacturing method thereof according to the present invention;
FIG. 6 is a schematic structural diagram of an HDI (high-aspect-ratio) plug-fill-plated board and an auxiliary fixing device of a manufacturing method thereof according to the present invention.
In the figure: 1. a HDI board I; 2. a heat dissipation bending-resistant device; 3. a protective anti-scratch device; 4. an auxiliary heat sink; 5. installing a damping device; 6. an auxiliary fixing device; 7. a second HDI board; 8. a third HDI board; 9. blind holes; 10. a circuit layer; 20. a polyimide plate; 21. a heat-conducting column; 22. PP bending-resistant layer; 23. a heat conductive carbon fiber layer; 24. a thermally conductive silicone layer; 25. a cylinder connector; 30. a PI layer; 31. a polyester film layer; 32. a polytetrafluoroethylene layer; 33. an adhesive layer; 40. a mounting frame; 41. a card slot; 42. a heat dissipating fin; 43. insulating heat-conducting glue; 50. a first L-shaped support frame; 51. a second L-shaped support frame; 52. a damping spring; 53. mounting screws; 60. a first connecting frame; 61. a second connecting frame; 62. clamping a plate; 63. fixing screws; 64. screw fixing groove.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", and the like indicate orientations or positional relationships based on orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be configured in a specific orientation, and operate, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, such as "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
As shown in fig. 1-6, the high aspect ratio plug filling and plating HDI board and the manufacturing method thereof comprise a first HDI board 1, a second HDI board 7 mounted at the upper end of the first HDI board 1, a third HDI board 8 mounted at the lower end of the first HDI board 1, circuit layers 10 mounted at the upper ends of the first HDI board 1, the second HDI board 7 and the third HDI board 8, the first HDI board 1, a plurality of blind holes 9 are all opened to No. two HDI boards 7 and No. three HDI 8 upper end left parts and upper end right parts, HDI board 1, No. two HDI boards 7 and No. three HDI 8 left ends and right-hand member install supplementary heat abstractor 4 jointly, install damping device 5 jointly at supplementary heat abstractor 4 left ends and right-hand member, install damping device 5 left end and right-hand member and install supplementary fixing device 6 jointly, No. two HDI boards 7 upper ends are installed and are protected and prevent cutting to pieces device 3 of rubbing, No. three HDI board 8 lower extremes are installed heat dissipation bending resistance and are folded device 2.
The heat dissipation anti-bending device 2 comprises a polyimide plate 20 and a PP anti-bending layer 22, a plurality of heat conduction columns 21 are mounted at the lower end of the polyimide plate 20, a heat conduction carbon fiber layer 23 is mounted at the lower end of the PP anti-bending layer 22, a heat conduction silicone grease layer 24 is mounted at the lower end of the heat conduction carbon fiber layer 23, a plurality of cylinder connectors 25 are jointly formed at the upper ends of the PP anti-bending layer 22, the heat conduction carbon fiber layer 23 and the heat conduction silicone grease layer 24, the PP anti-bending layer 22, the heat conduction carbon fiber layer 23 and the heat conduction silicone grease layer 24 are mounted at the lower end of the polyimide plate 20 through the cylinder connectors 25, and the polyimide plate 20 is mounted at the lower end of a third HDI plate 8; the plurality of heat-conducting columns 21 are distributed in a rectangular array with the polyimide plate 20 as a center, and the positions of the heat-conducting columns 21 correspond to the positions of the column connectors 25 up and down. The polyimide plate 20 on the heat dissipation and bending resistant device 2 has good creep resistance, excellent mechanical property and good flame retardance, and has very good electrical insulating property and dimensional stability, so that the use performance of the HDI plate is improved, the heat of the HDI plate can be transferred into the heat-conducting carbon fiber layer 23 and the heat-conducting silicone grease layer 24 through the plurality of heat-conducting columns 21 on the polyimide plate 20, the heat-conducting carbon fiber has good mechanical property, electric conductivity and excellent heat conduction and radiation heat dissipation capacity, the fibrous high-heat-conduction carbon powder made of the carbon fiber is fibrous, the heat conduction orientation can be designed, the heat-conducting silicone grease has high heat conductivity, excellent heat conductivity, good electrical insulating property, wider use temperature, good use stability, lower consistency and good construction performance, so that the heat dissipation performance of the HDI plate is improved, when the HDI board is bent by an external force, PP on the PP anti-buckling layer 22 is a colorless and translucent thermoplastic lightweight general-purpose plastic, and has chemical resistance, heat resistance, electrical insulation, high-strength mechanical properties, and good anti-buckling properties.
The protective and anti-scratching device 3 comprises a PI layer 30, a polyester film layer 31 is installed at the lower end of the PI layer 30, a polytetrafluoroethylene layer 32 is installed at the lower end of the polyester film layer 31, an adhesive layer 33 is installed at the lower end of the polytetrafluoroethylene layer 32, and the PI layer 30 is installed at the upper end of the second HDI plate 7 through the adhesive layer 33. When the upper part of the HDI board is scratched, the PI layer 30 on the protective scratching-preventing device 3 has the characteristics of corrosion resistance, fatigue resistance, damage resistance, impact resistance, low density, low noise, long service life and the like and excellent high and low temperature performance, the polyester film layer 31 is a colorless transparent glossy film usually, the mechanical performance is excellent, the rigidity, the hardness and the toughness are high, the puncture resistance, the friction resistance and the high temperature and low temperature resistance are realized, the service performance of the circuit board is improved, and the polytetrafluoroethylene layer 32 has excellent chemical stability, corrosion resistance, sealing performance, high lubrication non-adhesiveness, electric insulation performance and good ageing resistance, so that the resistance and the service performance of the HDI board are improved.
The auxiliary fixing device 6 comprises a first connecting frame 60 and a second connecting frame 61, clamping plates 62 are respectively arranged at the front parts of the upper ends and the rear parts of the upper ends of the first connecting frame 60 and the second connecting frame 61, fixing screws 63 are respectively arranged at the upper ends of the four clamping plates 62, screw fixing grooves 64 are respectively formed in two corresponding ends of the four clamping plates 62, the first connecting frame 60 is arranged at the left end of the first L-shaped supporting frame 50, and the second connecting frame 61 is arranged at the right end of the second L-shaped supporting frame 51; the screw fixing groove 64 corresponds to the mounting screw 53 in position up and down in accordance with the size thereof.
It should be noted that the invention is a high aspect ratio plug-filled and plated HDI board and a manufacturing method thereof, the polyimide board 20 on the heat dissipation and bending resistant device 2 has not only good creep resistance, excellent mechanical property and good flame retardance, but also very good electrical insulation property and dimensional stability, thereby improving the service performance of the HDI board, and the heat of the HDI board can be transferred to the heat-conducting carbon fiber layer 23 and the heat-conducting silicone grease layer 24 through the plurality of heat-conducting columns 21 on the polyimide board 20, the heat-conducting carbon fiber has not only good mechanical property, electrical conductivity and excellent heat-conducting and radiation-radiating capacity, the fibrous high heat-conducting carbon powder made of the carbon fiber is fibrous, the heat-conducting orientation can be designed, the heat-conducting silicone grease has high heat conductivity, excellent heat conductivity, good electrical insulation property, wide use temperature and good use stability, the HDI plate has low consistency and good construction performance, so that the heat dissipation performance of the HDI plate is improved, when the HDI plate is bent under an external force, the PP on the PP bending-resistant layer 22 is colorless semitransparent thermoplastic light universal plastic, the HDI plate has chemical resistance, heat resistance, electric insulation, high-strength mechanical performance and good bending resistance, the insulating heat-conducting glue 43 on the auxiliary heat dissipation device 4 has the characteristics of convenience in use, high bonding strength, elasticity after curing, impact resistance, vibration resistance and the like, the cured product has good heat conduction and heat dissipation functions and excellent high-low temperature resistance and electric performance, the heat at the front end and the rear end of the HDI plate is transferred to the heat dissipation fins 42 through the insulating heat-conducting glue 43, so that the HDI plate is further dissipated, and when the upper part of the HDI plate is scratched, the PI layer 30 on the protective anti-scratching device 3 has corrosion resistance, The polyester film layer 31 is a high molecular plastic film which is usually colorless and transparent and glossy, has excellent mechanical properties, high rigidity, hardness and toughness, puncture resistance, friction resistance, high temperature resistance and low temperature resistance, thereby improving the service performance of the circuit board, the polytetrafluoroethylene layer 32 has excellent chemical stability, corrosion resistance, sealing property, high lubrication non-sticking property, electric insulation property and good anti-aging endurance, thereby improving the resistance and the use performance of the HDI plate, when the device is shaken, the damping spring 52 is used for buffering and damping, and the mounting screws 53 are reinforced by the screw fixing grooves 64 through the catching plates 62 of the auxiliary fixture 6, thereby prevent that mounting screw 53 from receiving to produce when rocking and become flexible, and then improved the stability of HDI board.
A high aspect ratio fills and plates HDI board and its preparation method, its step is as follows:
firstly, carrying out inner layer circuit treatment on a first HDI board (1), a second HDI board (7) and a third HDI board (8);
secondly, pressing the first HDI board (1), the second HDI board (7) and the third HDI board (8), and forming blind holes (the aspect ratio of the blind holes is more than 1.5: 1);
(III), copper deposition, electroplating and other process treatments;
and (IV) carrying out power-on test.
The foregoing shows and describes the general principles and features of the present invention, together with the advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are given by way of illustration of the principles of the present invention, but that various changes and modifications may be made without departing from the spirit and scope of the invention, and such changes and modifications are within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (9)
1. A high aspect ratio fills up and plates HDI board, includes HDI board (1) No. one, its characterized in that: no. two HDI boards (7) are installed to first HDI board (1) upper end, No. three HDI boards (8) are installed to first HDI board (1) lower extreme, circuit layer (10) are all installed to first HDI board (1), No. two HDI board (7) and No. three HDI board (8) upper end, a plurality of blind hole (9) have all been opened to first HDI board (1), No. two HDI board (7) and No. three HDI board (8) upper end left part and upper end right part, supplementary heat abstractor (4) are installed jointly to first HDI board (1), No. two HDI board (7) and No. three HDI board (8) left end and right-hand member, installation damping device (5) are installed jointly to installation damping device (5) left end and right-hand member, install supplementary fixing device (6) jointly to cut the upper end and prevent scraping and scratch board (3) are installed to second HDI board (7), and a heat dissipation bending-resistant device (2) is installed at the lower end of the third HDI plate (8).
2. A high aspect ratio underfill HDI board in accordance with claim 1, wherein: heat dissipation buckling-resistant device (2) include polyimide board (20) and PP buckling-resistant layer (22), a plurality of heat conduction post (21) are installed to polyimide board (20) lower extreme, heat conduction carbon fiber layer (23) are installed to PP buckling-resistant layer (22) lower extreme, heat conduction silicone grease layer (24) are installed to heat conduction carbon fiber layer (23) lower extreme, open jointly on PP buckling-resistant layer (22), heat conduction carbon fiber layer (23) and heat conduction silicone grease layer (24) has a plurality of cylinder connector (25), install at polyimide board (20) lower extreme through cylinder connector (25) PP buckling-resistant layer (22), heat conduction carbon fiber layer (23) and heat conduction silicone grease layer (24), polyimide board (20) are installed at No. three HDI board (8) lower extreme.
3. A high aspect ratio underfill HDI board in accordance with claim 1, wherein: device (3) are prevented cutting and are rubbed including PI layer (30) in the protection, polyester film layer (31) are installed to PI layer (30) lower extreme, polytetrafluoroethylene layer (32) are installed to polyester film layer (31) lower extreme, bondlines (33) are installed to polytetrafluoroethylene layer (32) lower extreme, install in No. two HDI board (7) upper end in PI layer (30) through bondlines (33).
4. A high aspect ratio underfill HDI board in accordance with claim 1, wherein: supplementary heat abstractor (4) include mounting bracket (40), all install insulating heat-conducting glue (43) on inner wall and the back inner wall before mounting bracket (40), a plurality of draw-in groove (41) have all been opened to mounting bracket (40) left end and right-hand member, radiating fin (42) are all installed to mounting bracket (40) front end and rear end, mounting bracket (40) are installed at HDI board (1) left end and right-hand member.
5. A high aspect ratio underfill coated HDI board according to claim 4 wherein: installation damping device (5) are including L type support frame (50) and No. two L type support frames (51), installation screw (53) are all installed to L type support frame (50) and No. two L type support frames (51) upper end front portions and upper end rear portion, a set of damping spring (52) are all installed to the one end that L type support frame (50) and No. two L type support frames (51) correspond, install respectively at mounting bracket (40) left end and right-hand member through draw-in groove (41) L type support frame (50) and No. two L type support frames (51).
6. A high aspect ratio underfill HDI board in accordance with claim 5, wherein: supplementary fixing device (6) are including link (60) and No. two link (61), link (60) and No. two link (61) upper end front portions and upper end rear portion all install cardboard (62), four fixed screw (63), four are all installed to cardboard (62) upper end screw fixed slot (64) have all been opened to two liang of one end that correspond of cardboard (62), link (60) are installed at L type support frame (50) left end No. one, No. two link (61) are installed at L type support frame (51) right-hand member No. two.
7. A high aspect ratio underfill coated HDI board in accordance with claim 2 wherein: the plurality of heat conduction columns (21) are distributed in a rectangular array by taking the polyimide plate (20) as a center path, and the positions of the heat conduction columns (21) correspond to the positions of the column body connecting ports (25) up and down.
8. A high aspect ratio underfill HDI board in accordance with claim 6, wherein: the screw fixing groove (64) is consistent with the mounting screw (53) in size and corresponds to the mounting screw in position up and down.
9. A high aspect ratio underfill HDI board and method of making the same as claimed in claims 1 to 8, comprising the steps of:
firstly, carrying out inner layer circuit treatment on a first HDI board (1), a second HDI board (7) and a third HDI board (8);
secondly, pressing the first HDI board (1), the second HDI board (7) and the third HDI board (8), and forming blind holes (the aspect ratio of the blind holes is more than 1.5: 1);
(III), copper deposition, electroplating and other process treatments;
and (IV) carrying out power-on test.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210702460.3A CN114938567A (en) | 2022-06-20 | 2022-06-20 | High-aspect-ratio filling HDI (high Density interconnection) plated board and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210702460.3A CN114938567A (en) | 2022-06-20 | 2022-06-20 | High-aspect-ratio filling HDI (high Density interconnection) plated board and manufacturing method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007128986A (en) * | 2005-11-01 | 2007-05-24 | Polymatech Co Ltd | Thermally conductive member and method of manufacturing same |
| CN105357873A (en) * | 2015-10-23 | 2016-02-24 | 深圳市仁创艺电子有限公司 | Packed and plated HDI plate with high aspect ratio and fabrication method of packed and plated HDI plate |
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| CN216491237U (en) * | 2021-12-08 | 2022-05-10 | 深圳市超峰科宇科技有限公司 | Prevent accurate circuit board of PCB multilayer that layer is inclined to one side |
| CN216600202U (en) * | 2021-11-26 | 2022-05-24 | 深圳市嘉纳电子有限公司 | HDI circuit board of high performance high density |
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| JP2007128986A (en) * | 2005-11-01 | 2007-05-24 | Polymatech Co Ltd | Thermally conductive member and method of manufacturing same |
| CN105357873A (en) * | 2015-10-23 | 2016-02-24 | 深圳市仁创艺电子有限公司 | Packed and plated HDI plate with high aspect ratio and fabrication method of packed and plated HDI plate |
| CN215420939U (en) * | 2021-07-08 | 2022-01-04 | 深圳市联合多层线路板有限公司 | Mixed-compression stepped high-frequency multilayer blind hole circuit board |
| CN216123020U (en) * | 2021-11-03 | 2022-03-22 | 深圳市裕惟兴电子有限公司 | Multilayer printed circuit board with high binding force |
| CN216600202U (en) * | 2021-11-26 | 2022-05-24 | 深圳市嘉纳电子有限公司 | HDI circuit board of high performance high density |
| CN216357477U (en) * | 2021-12-01 | 2022-04-19 | 深圳市咏华宇电子有限公司 | Multilayer metal PCB board |
| CN216491237U (en) * | 2021-12-08 | 2022-05-10 | 深圳市超峰科宇科技有限公司 | Prevent accurate circuit board of PCB multilayer that layer is inclined to one side |
| CN114401581A (en) * | 2022-03-01 | 2022-04-26 | 深圳市容大电路有限公司 | Asymmetric copper-thick double-sided aluminum substrate and processing method thereof |
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