CN114928801A

CN114928801A - Chip packaging structure and preparation method thereof

Info

Publication number: CN114928801A
Application number: CN202210497932.6A
Authority: CN
Inventors: 宋祥祎; 高源�
Original assignee: Forehope Electronic Ningbo Co Ltd
Current assignee: Forehope Electronic Ningbo Co Ltd
Priority date: 2022-05-09
Filing date: 2022-05-09
Publication date: 2022-08-19

Abstract

The embodiment of the invention provides a chip packaging structure and a preparation method of the chip packaging structure, and relates to the technical field of semiconductor packaging. And sound pressure can be prevented from being directly transmitted into the second sound cavity, and the sound pressure is prevented from impacting the silicon microphone chip. Compared with the prior art, the volume of the sound cavity is greatly increased by arranging the first sound cavity, the second sound cavity and the sound inlet cavity, the sensitivity and the signal-to-noise ratio of a product are greatly increased by adopting multiple directions for receiving sound, the silicon vibrating diaphragm can be prevented from cracking due to the fact that the silicon vibrating diaphragm is impacted by sound pressure, the silicon vibrating diaphragm of the silicon microphone chip cannot be influenced even if the sound pressure changes greatly, and the reliability of the product is ensured.

Description

Chip packaging structure and preparation method thereof

Technical Field

The invention relates to the technical field of semiconductor packaging, in particular to a chip packaging structure and a preparation method of the chip packaging structure.

Background

With the rapid development of the semiconductor industry, microphones have been widely used in various electronic products in the consumer field, wherein silicon microphones have been widely used in mobile terminals due to the characteristics of small size, strong stability, and the like. The silicon microphone includes a MEMS (Micro Electro Mechanical System) chip, and the MEMS chip includes a silicon diaphragm and a silicon back plate. The MEMS chip has the working principle that the silicon vibrating diaphragm is subjected to sound pressure interference to generate deformation by utilizing the pressure gradient generated by sound change, so that the capacitance value between the silicon vibrating diaphragm and the silicon back plate is changed, the sound pressure signal is converted into a voltage signal, the sound of the existing MEMS silicon wheat product is designed from a single hole or a single direction and enters the MEMS chip and the metal cover, the sound cavity of the MEMS chip is small, when the sound signal is very weak, the sound pressure signal is weaker, so that the MEMS silicon wheat product is caused, and the sensitivity and the signal-to-noise ratio are reduced. Meanwhile, since the silicon diaphragm on the MEMS chip is very sensitive to the change of sound pressure, the external sound pressure in the prior art is directly contacted with the silicon diaphragm on the MEMS chip, and therefore when the strength of the change of the sound pressure exceeds a certain value, the silicon diaphragm can be broken due to the impact of the high-strength sound pressure.

Disclosure of Invention

The invention aims to provide a chip packaging structure and a preparation method of the chip packaging structure, which can increase the volume of a sound cavity, improve the sensitivity and the signal-to-noise ratio of a product, avoid the breakage of a silicon vibrating diaphragm caused by sound pressure impact and ensure the reliability of the product.

Embodiments of the invention may be implemented as follows:

in a first aspect, the present invention provides a chip package structure, including:

a substrate;

a silicon microphone chip and a control chip attached to the substrate;

a packaging cover plate attached to the substrate and covering the silicon oatmeal chip and the control chip;

the packaging cover plate comprises an inner cover plate, an outer cover plate and a sound inlet box, the inner cover plate is covered on the substrate and is provided with a first sound cavity, the silicon microphone chip and the control chip are contained in the first sound cavity, the outer cover plate is covered outside the inner cover plate and is provided with a second sound cavity, the first sound cavity is communicated with the second sound cavity, the sound inlet box is arranged on the outer cover plate and protrudes upwards relative to the outer cover plate, the sound inlet box is provided with a sound inlet cavity communicated with the second sound cavity, a plurality of sound inlet holes are formed in the peripheral side wall of the sound inlet box, and the plurality of sound inlet holes are communicated with the sound inlet cavity.

In an alternative embodiment, the top wall of the inner cover plate is provided with a first sound transmission hole for communicating the first sound cavity and the second sound cavity.

In an alternative embodiment, the first sound transmission hole and the sound inlet box are arranged in a staggered mode, so that the sound inlet cavity and the first sound transmission hole are arranged in a staggered mode.

In an alternative embodiment, a second sound transmission hole is formed in a side wall of the inner cover plate, and the second sound transmission hole is used for communicating the first sound cavity and the second sound cavity.

In an alternative embodiment, the sound inlet box is multiple, and the multiple sound inlet boxes are distributed at the center and two sides of the top of the outer cover plate at intervals.

In an alternative embodiment, the number of the sound inlet boxes is two, and the two sound inlet boxes are arranged on two side edges of the top of the outer layer cover plate.

In an alternative embodiment, the side walls of the sound inlet box are recessed inwards to form a ring groove, and the sound inlet holes are located above the ring groove.

In an optional implementation manner, the chip packaging structure further includes a plastic package body, the plastic package body is disposed on the substrate and covers the outer cover plate, the plastic package body partially covers the sound inlet box, and the plurality of sound inlet holes are located above the plastic package body.

In an optional embodiment, a height of a side surface of the plastic package body away from the substrate relative to the substrate is greater than or equal to a height of a side wall of the ring groove away from the substrate relative to the substrate, so that the plastic package body covers the ring groove.

In an optional implementation mode, the annular is a plurality of, and is a plurality of the annular interval sets up advance on the lateral wall around the sound box, and every it all is located a plurality ofly to advance the sound hole the top of annular, the plastic envelope body cladding is a plurality of on the annular.

In an optional embodiment, a laser character groove is formed in a surface of one side, away from the substrate, of the plastic package body, and a depth of the laser character groove is smaller than or equal to a distance between the surface of one side, away from the substrate, of the plastic package body and the outer cover plate.

In a second aspect, the present invention provides a method for preparing a chip packaging structure, for preparing the chip packaging structure according to any one of the foregoing embodiments, the method comprising:

providing a substrate;

a silicon microphone chip and a control chip are pasted on the substrate;

mounting a packaging cover plate on the substrate, wherein the packaging cover plate covers the silicon microphone chip and the control chip;

the packaging cover plate comprises an inner cover plate, an outer cover plate and a sound inlet box, the inner cover plate is covered on the base plate and provided with a first sound cavity, the silicon microphone chip and the control chip are all accommodated in the first sound cavity, the outer cover plate is covered outside the inner cover plate and provided with a second sound cavity, the first sound cavity is communicated with the second sound cavity, the sound inlet box is arranged on the outer cover plate and is upwards protruded relative to the outer cover plate, the sound inlet box is provided with a sound inlet cavity communicated with the second sound cavity, a plurality of sound inlet holes are formed in the peripheral side wall of the sound inlet box, and the plurality of sound inlet holes are communicated with the sound inlet cavity.

In an alternative embodiment, after the step of mounting a package cover plate on the substrate, the preparation method further includes:

forming a plastic package body on the substrate;

the plastic package body is wrapped outside the outer layer cover plate, the plastic package body partially wraps the sound inlet box, and the plurality of sound inlet holes are all located above the plastic package body.

The beneficial effects of the embodiment of the invention include, for example:

the embodiment of the invention provides a chip packaging structure and a preparation method of the chip structure. Simultaneously still be provided with into sound box on the outer apron, and advance the sound box and have the sound chamber of advancing with second sound chamber intercommunication, advance and seted up a plurality of sound holes on the lateral wall all around of sound box, a plurality of sound holes all communicate with advancing the sound chamber. Through setting up into sound box to advance sound box and set up into the sound hole on the lateral wall, advance the sound hole and set up along direction all around, can realize the sound structure of advancing of a plurality of passageways on the one hand, promote the product and advance sound efficiency, and the radio reception scope is wider, and the radio reception effect is better. On the other hand, the sound pressure can be prevented from being directly transmitted into the second sound cavity, and the sound pressure is prevented from impacting the silicon microphone chip. Compared with the prior art, the volume of the sound cavity is greatly increased by arranging the first sound cavity, the second sound cavity and the sound inlet cavity, the sound is received in multiple directions by adopting porous sound inlet, the sensitivity and the signal-to-noise ratio of a product are greatly increased, meanwhile, the silicon vibrating diaphragm is prevented from cracking due to the fact that sound pressure impacts the silicon microphone chip by adopting the side wall sound inlet, the silicon vibrating diaphragm of the silicon microphone chip cannot be influenced even if the sound pressure changes greatly by arranging the sound inlet box, and the reliability of the product is ensured.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and those skilled in the art can also obtain other related drawings based on the drawings without inventive efforts.

Fig. 1 is a cross-sectional structural view of a chip package structure according to a first embodiment of the invention;

fig. 2 is a first modified cross-sectional structure diagram of a chip package structure according to a first embodiment of the invention;

fig. 3 is a second modified cross-sectional structure diagram of the chip package structure according to the first embodiment of the invention;

fig. 4 is a block diagram illustrating a method for manufacturing a chip package structure according to a first embodiment of the present invention;

fig. 5 is a cross-sectional structural view of a chip package structure according to a second embodiment of the invention;

FIG. 6 is an enlarged partial schematic view of VI of FIG. 5;

fig. 7 is a top view of a chip package structure according to a second embodiment of the invention;

fig. 8 is a cross-sectional structural view of a chip package structure according to a third embodiment of the invention;

FIG. 9 is an enlarged partial view of IX in FIG. 8.

Icon: 100-chip package structure; 110-a substrate; 120-silicon microphone chip; 130-a control chip; 140-a package cover plate; 150-inner cover plate; 151-a first acoustic chamber; 152-a first sound transmission aperture; 153-second sound transmission hole; 160-outer cover plate; 161-a second sound cavity; 170-sound inlet box; 171-a sound inlet chamber; 172-sound inlet; 173-ring groove; 180-molding a package body; 181-laser character slot.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be obtained by a person skilled in the art without inventive step based on the embodiments of the present invention, are within the scope of protection of the present invention.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present invention, it should be noted that if the terms "upper", "lower", "inside", "outside", etc. indicate an orientation or a positional relationship based on that shown in the drawings or that the product of the present invention is used as it is, this is only for convenience of description and simplification of the description, and it does not indicate or imply that the device or the element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention.

Furthermore, the appearances of the terms "first," "second," and the like, if any, are only used to distinguish one description from another and are not to be construed as indicating or implying relative importance.

As disclosed in the background art, in the prior art, for the MEMS package structure, a single hole or a single direction is usually adopted to carry out sound, the sound receiving range is narrow, and the volume of the internal sound cavity is small, so that when the sound signal is very weak, the weaker sound pressure signal is, and it is difficult to accurately carry out sound pressure conduction, thereby resulting in the MEMS silicon microphone product, and the sensitivity and the signal to noise ratio are reduced. In addition, since the silicon diaphragm on the MEMS chip is very sensitive to the change of sound pressure, the external sound pressure in the prior art is directly contacted with the silicon diaphragm on the MEMS chip, and therefore when the strength of the change of the sound pressure exceeds a certain value, the silicon diaphragm can be broken due to the impact of the sound pressure with high strength.

In order to solve the above problems, the present invention provides a novel chip packaging structure and a method for manufacturing the chip packaging structure, and it should be noted that features in the embodiments of the present invention may be combined with each other without conflict.

First embodiment

Referring to fig. 1, the present embodiment provides a chip package structure 100, which can increase the volume of a sound cavity, increase the sound input range, increase the sensitivity and the signal-to-noise ratio of a product, and simultaneously avoid the silicon diaphragm from cracking due to sound pressure/sound impact, thereby ensuring the reliability of the product.

The chip package structure 100 provided by the embodiment includes a substrate 110, a silicon submount 120, a control chip 130, and a package cover plate 140, wherein the silicon submount 120 and the control chip 130 are attached to the substrate 110 at intervals, and the package cover plate 140 is attached to the substrate 110 and covers the silicon submount 120 and the control chip 130. The silicon microphone chip 120 and the control chip 130 are electrically connected to the substrate 110 by wire bonding, that is, the control chip 130 is electrically connected to the substrate 110 by wire bonding, and the silicon microphone chip 120 and the control chip 130 are electrically connected by wire bonding.

It should be noted that, in the present embodiment, the silicon microphone chip 120 is an MEMS chip, and the control chip 130 may be an ASIC chip (Application Specific Integrated Circuit).

Encapsulation apron 140 includes inlayer apron 150, outer apron 160 and sound inlet box 170, inlayer apron 150 covers and establishes on base plate 110, and have first sound chamber 151, silicon wheat chip 120 and control chip 130 all hold in first sound chamber 151, outer apron 160 covers and establishes outside inlayer apron 150, and have second sound chamber 161, first sound chamber 151 and second sound chamber 161 intercommunication, sound inlet box 170 sets up on outer apron 160, and it is protruding upwards for outer apron 160, and sound inlet box 170 has the sound inlet chamber 171 who communicates with second sound chamber 161, sound inlet box 170 has seted up a plurality of sound inlet holes 172 on the lateral wall all around, a plurality of sound inlet holes 172 all communicate with sound inlet chamber 171.

In this embodiment, the inner cover plate 150, the outer cover plate 160 and the sound inlet box 170 are integrally disposed and prepared before the chip is packaged, wherein the inner cover plate 150 and the outer cover plate 160 can be connected by a front side surface shell and a rear side surface shell, and fig. 1 in this embodiment is a cross-sectional view of the package cover plate 140 only, which can extend in the front-rear direction to form a three-dimensional package cover plate 140.

It should be noted that, here, the first sound cavity 151 and the second sound cavity 161 are communicated and used as a front sound cavity of the silicon microphone chip 120, compared with the conventional structure, the volume of the front sound cavity of the silicon microphone chip 120 is greatly increased here, so that the signal-to-noise ratio and the sensitivity of the silicon microphone chip 120 are greatly increased. Through setting up into sound box 170 to advance sound box 170 and set up into sound hole 172 on the lateral wall, advance sound hole 172 and set up along direction all around, can realize the sound structure of advancing of a plurality of passageways on the one hand, promote the product and advance sound efficiency, and the radio reception scope is wider, and the radio reception effect is better, increases the area of transmitting into that sound pressure/sound got into sound chamber 171 simultaneously, promotes inside acoustic pressure, thereby promotes silicon wheat product SNR and performance, further promotes silicon wheat chip 120's sensitivity. On the other hand, sound pressure/sound can be prevented from directly transmitting into the second sound cavity 161, and the sound pressure/sound is prevented from directly impacting the MEMS chip.

In the present embodiment, the top wall of the inner cover 150 is provided with a first sound transmission hole 152, and the first sound transmission hole 152 is used for communicating the first sound cavity 151 and the second sound cavity 161. Specifically, the first sound transmission hole 152 may be plural, and the plural first sound transmission holes 152 are used to communicate the upper second sound chamber 161 and the lower first sound chamber 151.

In the present embodiment, the first sound transmission hole 152 is offset from the sound inlet box 170, so that the sound inlet 171 is offset from the first sound transmission hole 152. Specifically, the first sound transmission hole 152 and the sound inlet cavity 171 are staggered, so that direct transmission of sound pressure/sound can be avoided, the purpose of sound pressure/sound buffering can be achieved, sound pressure/sound impact on the silicon oatmeal 120 caused by excessive sound pressure/sound change can be further avoided, and the reliability of the silicon oatmeal 120 is ensured.

In the present embodiment, the sidewall of the inner cover 150 is provided with a second sound transmission hole 153, and the second sound transmission hole 153 is used for communicating the first sound cavity 151 and the second sound cavity 161. Specifically, the second sound transmission holes 153 are disposed on the sidewalls of the two sides of the inner cover 150, so that the sound pressure/sound entering from the sound inlet 171 can be transmitted into the first sound cavity 151 from the first sound transmission holes 152, and can be transmitted through the second sound transmission holes 153, thereby further increasing the range of the sound inlet channel.

In this embodiment, the sound box 170 is multiple, and the multiple sound boxes 170 are spaced apart from each other at the center and on both sides of the top of the outer cover 160. Specifically, through setting up a plurality of sound boxes 170 that advance, on the one hand can realize stress balance everywhere, takes place warping phenomenon when avoiding subsequent plastic envelope effect, and on the other hand can further promote the quantity and the radio reception scope of sound hole 172 to further promote silicon wheat chip 120's sensitivity and SNR.

Referring to fig. 2, in another preferred embodiment of the present invention, there may be two sound inlet boxes 170, and two sound inlet boxes 170 are disposed on two side edges of the top of the outer cover 160. Specifically, the sound inlet boxes 170 may be respectively disposed at the left and right sides, thereby playing a role of preventing plastic package warpage.

In other preferred embodiments of the present invention, as shown in fig. 3, the sound inlet box 170 may be single, and the single sound inlet box 170 is disposed at the middle position of the outer cover plate 160.

In this embodiment, the sidewall of each sound inlet box 170 is recessed inward and forms a ring groove 173, and the sound inlet holes 172 are located above the ring groove 173. Specifically, by providing the annular groove 173, the sound inlet cavity 171 can be made to have an i-shape, which is more favorable for internal transmission of sound pressure/sound, and plays a role of sound pressure/sound buffering. Meanwhile, the position of the ring groove 173 is higher than the position of the outer cover plate 160, which can play a role of plastic package marking in the subsequent plastic package process, so that the plastic package material is plastically packaged to the ring groove 173. The ring groove 173 also increases the surface area of the sidewall of the sound inlet box 170, so that the bonding force between the subsequent plastic package material and the sound inlet box 170 is improved, and the stability of the product structure is facilitated.

Referring to fig. 4, the present embodiment further provides a method for manufacturing the chip package structure 100, where the method is used to manufacture the chip package structure 100, and the method includes the following steps:

s1: a substrate 110 is provided.

Specifically, a substrate 110 with pads may be provided, wherein the pads are located in a mounting area of the substrate 110, the mounting area is used for mounting the silicon chip 120 and the control chip 130, and the periphery of the mounting area is used for packaging the cover plate 140.

S2: the silicon microphone chip 120 and the control chip 130 are mounted on the substrate 110.

Specifically, the mounting of the chip may be completed in the mounting area on the substrate 110 using a conventional chip mounting process. After mounting, the electrical connection between the control chip 130 and the substrate 110 can be completed by wire bonding, and the electrical connection between the control chip 130 and the silicon die 120 can be completed by wire bonding.

S3: a package cover 140 is mounted on the substrate 110.

Specifically, the package cover 140 covers the control chip 130 and the silicon chip 120. The bottom of the package cover 140 may be adhered to the substrate 110 using an adhesive or soldering process, and it is necessary to ensure sealability so as to ensure normal sound transmission.

Wherein, the package cover plate 140 includes an inner cover plate 150, an outer cover plate 160 and a sound inlet box 170, the inner cover plate 150 is covered on the substrate 110 and has a first sound cavity 151, the silicon chip 120 and the control chip 130 are both accommodated in the first sound cavity 151, the outer cover plate 160 is covered outside the inner cover plate 150 and has a second sound cavity 161, the first sound cavity 151 is communicated with the second sound cavity 161, the sound inlet box 170 is arranged on the outer cover plate 160 and is upwardly protruded relative to the outer cover plate 160, the sound inlet box 170 has a sound inlet cavity 171 communicated with the second sound cavity 161, a plurality of sound inlet holes 172 are opened on the side wall around the sound inlet box 170, and the plurality of sound inlet holes 172 are all communicated with the sound inlet cavity 171.

In summary, in the chip package structure 100 provided in the present embodiment, the package cover plate 140 is covered on the substrate 110, the inner cover plate 150 of the package cover plate 140 has the first sound cavity 151, the outer cover plate 160 has the second sound cavity 161, and the first sound cavity 151 is communicated with the second sound cavity 161, so as to increase the volume of the sound cavity 171. Meanwhile, the outer cover plate 160 is provided with a sound inlet box 170, the sound inlet box 170 is provided with a sound inlet cavity 171 communicated with the second sound cavity 161, the side wall of the periphery of the sound inlet box 170 is provided with a plurality of sound inlet holes 172, and the sound inlet holes 172 are communicated with the sound inlet cavity 171. Through setting up into sound box 170 to advance sound box 170 and set up into sound hole 172 on the lateral wall, advance sound hole 172 and set up along direction all around, can realize the sound structure of advancing of a plurality of passageways on the one hand, promote the product and advance sound efficiency, and the radio reception scope is wider, and the radio reception effect is better. On the other hand, the sound pressure/sound can be prevented from directly transmitting into the second sound cavity 161, and the sound pressure/sound is prevented from impacting the MEMS chip. Meanwhile, the first sound transmission hole 152 and the second sound transmission hole 153 are respectively formed in the top wall and the side wall of the inner-layer cover plate 150, so that the range of a sound inlet channel can be further increased, and the sound pickup effect and the quality of a product are greatly improved.

Second embodiment

Referring to fig. 5 to fig. 7 in combination, the present embodiment provides a chip package structure 100, the basic structure and principle and the generated technical effect are the same as those of the first embodiment, and for the sake of brief description, reference may be made to corresponding contents in the first embodiment for parts not mentioned in the present embodiment.

In this embodiment, the chip package structure 100 further includes a plastic package body 180, the plastic package body 180 is disposed on the substrate 110 and covers the outer cover 160, the plastic package body 180 partially covers the sound inlet box 170, and the plurality of sound inlet holes 172 are located above the plastic package body 180. Specifically, the sound inlet box 170 may be single, the single sound inlet box 170 is disposed in the middle of the outer cover plate 160, and the plastic package body 180 completely covers the outer cover plate 160, so as to cover the joint between the outer cover plate 160 and the substrate 110, thereby protecting the joint, and avoiding the occurrence of a desoldering phenomenon between the outer cover plate 160 and the substrate 110 during a drop test.

In this embodiment, a height of a side surface of the plastic package body 180 away from the substrate 110 relative to the substrate 110 is greater than or equal to a height of a sidewall of the ring groove 173 away from the substrate 110 relative to the substrate 110, so that the plastic package body 180 covers the ring groove 173. Preferably, the annular groove 173 is a plastic package mark, that is, the plastic package material covers the annular groove 173 and completely covers the annular groove 173, and due to the arrangement of the annular groove 173, the surface area of the side wall of the sound inlet box 170 is increased, so that the contact area between the sound inlet box 170 and the plastic package body 180 is increased, the bonding force between the sound inlet box 170 and the plastic package body 180 is further improved, and the plastic package body 180 is prevented from being layered.

It should be noted that, the plastic package body 180 does not completely cover the sound inlet box 170, but exposes the portion above the ring groove 173, and the sound inlet holes 172 on the sound inlet box 170 are all located above the ring groove 173 and above the plastic package body 180, thereby ensuring the normal sound inlet of the sound inlet holes 172.

In this embodiment, the surface of the plastic package body 180 away from the substrate 110 is provided with a laser character groove 181, and the depth of the laser character groove 181 is smaller than or equal to the distance between the surface of the plastic package body 180 away from the substrate 110 and the outer cover plate 160. Specifically, the package cover 140 may be a metal cover, and the outer cover 160 may be a laser grooving stop layer to prevent the laser from breaking through the plastic package body 180 to expose the chip or the routing layer. Preferably, the laser character groove 181 is located above the outer layer cover plate 160, and the depth of the laser character groove is consistent with the thickness of the plastic package body 180 at the groove, and the outer layer cover plate 160 is used as a barrier layer, so that the problems that a transmission process prints characters on the plastic package body 180, and the laser power/energy is too large, which causes the printing characters on the surface of the plastic package body 180 to be too deep and burn through the plastic package body 180 can be effectively avoided.

The present embodiment further provides a method for manufacturing the chip package structure 100, the basic steps and principles thereof and the generated technical effects are the same as those of the first embodiment, and for brief description, reference may be made to corresponding contents in the first embodiment for the sake of brevity.

It should be noted that, in the present embodiment, the sound inlet box 170 is single and is disposed at the middle position of the outer layer cover plate 160, in other preferred embodiments, there may be a plurality of sound inlet boxes 170, and a plurality of sound inlet boxes 170 are disposed at the middle position and the two side edge positions of the outer layer cover plate 160, so as to play a role of stress release and prevent the plastic package body 180 from warping.

The method for manufacturing the chip package structure 100 provided in this embodiment is used to manufacture the chip package structure 100, and specifically includes the following steps:

s1: a substrate 110 is provided.

S3: a package cover 140 is mounted on the substrate 110.

Wherein the steps S1-S3 are the same as the first embodiment, except that in this embodiment, after the step S3, the following steps are further performed:

s4: a molding body 180 is formed on the substrate 110.

Specifically, the plastic package body 180 covers the outer cover plate 160 and partially covers the sound inlet box 170, and the sound inlet holes 172 are located above the plastic package body 180.

After the plastic package body 180 is manufactured, a cutting operation is required, and here, the plastic package body 180 can be separated along a cutting path by a cutting process using a diamond knife, so that a single chip package structure 100 is formed, and a final manufacturing process is completed. The cutting path is located away from the sound inlet box 170, so that the sound inlet 172 is not affected during cutting.

The embodiment provides a chip package structure 100 and a manufacturing method thereof, and the plastic package body 180 is used to cover the annular groove 173 of the sound inlet box 170, so that the bonding force between the plastic package body 180 and the sound inlet box 170 can be improved, and delamination of the plastic package body 180 is avoided. Meanwhile, the plastic package body 180 is wrapped outside the outer cover plate 160, and can wrap the welding/bonding part at the bottom of the outer cover plate 160, so that the weak part of the connection can be effectively protected, the phenomenon that the packaging cover plate 140 is welded and falls off can be avoided during a drop test, and the structural stability of a product is ensured.

Third embodiment

Referring to fig. 8 and 9, the present embodiment provides a chip package structure 100, the basic structure and principle and the generated technical effect are the same as those of the first embodiment or the second embodiment, and for the sake of brief description, corresponding contents in the first embodiment or the second embodiment may be referred to where not mentioned in part in the present embodiment.

In this embodiment, the chip package structure 100 further includes a plastic package body 180, the plastic package body 180 is disposed on the substrate 110 and covers the outer cover plate 160, the plastic package body 180 partially covers the sound inlet box 170, and the sound inlet holes 172 are located above the plastic package body 180.

In the embodiment, the number of the ring grooves 173 is multiple, the ring grooves 173 are disposed on the sidewall of the sound inlet box 170 at intervals, each sound inlet hole 172 is located above the ring grooves 173, and the plastic package body 180 covers the ring grooves 173. Specifically, the height of the sound inlet box 170 is greater than that in the first or second embodiment, so that a plurality of ring grooves 173 can be formed on the side wall of the sound inlet box 170, the ring grooves 173 are spaced and arranged in parallel, and the plastic package body 180 can completely cover the ring grooves 173, thereby further improving the bonding force between the plastic package body 180 and the sound inlet box 170, and avoiding the delamination of the plastic package body 180.

In addition, in the present embodiment, the plurality of annular grooves 173 are adopted, so that the sound inlet 171 has a plurality of i-shaped structures, and sound pressure/sound is prevented from directly transmitting into the second sound cavity 161 in the vertical direction. Meanwhile, the plurality of ring grooves 173 are arranged, so that a stress release effect can be achieved, and the plastic package body 180 is further prevented from being warped.

Preferably, two ring grooves 173 are exemplified in the present embodiment. Of course, in other preferred embodiments, the ring grooves 173 may be three, four, five, etc. extending in the vertical direction.

In summary, the chip package structure 100 provided in this embodiment, by providing the plurality of annular grooves 173, on one hand, the bonding force between the plastic package body 180 and the sound inlet box 170 can be increased, so as to prevent the plastic package body 180 from being layered, and on the other hand, the chip package structure can further play a role of sound pressure buffering, so as to prevent sound pressure/sound from directly transmitting into the second sound cavity 161. Meanwhile, the stress release effect can be achieved, and the plastic package body 180 is prevented from warping.

The above description is only for the specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.

Claims

1. A chip package structure, comprising:

a substrate;

a silicon microphone chip and a control chip attached to the substrate;

2. The chip package structure according to claim 1, wherein the top wall of the inner cover is provided with a first sound hole for communicating the first sound cavity and the second sound cavity.

3. The chip package structure according to claim 2, wherein the first sound transmission hole is offset from the sound inlet box, so that the sound inlet cavity is offset from the first sound transmission hole.

4. The chip package structure according to claim 1 or 2, wherein a second sound transmission hole is disposed on a side wall of the inner cover plate, and the second sound transmission hole is used for communicating the first sound cavity and the second sound cavity.

5. The chip package structure according to claim 1, wherein the sound inlet boxes are multiple, and the sound inlet boxes are distributed at intervals in the center and on two sides of the top of the outer cover plate.

6. The chip package structure according to claim 1, wherein the number of the sound inlet boxes is two, and the two sound inlet boxes are disposed on two side edges of the top of the outer cover plate.

7. The chip package structure of claim 1, wherein the sidewall of the periphery of the sound inlet box is recessed inward and forms a ring groove, and the plurality of sound inlet holes are all located above the ring groove.

8. The chip package structure according to claim 7, further comprising a plastic package body, wherein the plastic package body is disposed on the substrate and covers the outer cover plate, the plastic package body partially covers the sound inlet box, and the sound inlet holes are located above the plastic package body.

9. The chip package structure according to claim 8, wherein a height of a surface of the molding compound away from the substrate relative to the substrate is greater than or equal to a height of a sidewall of the ring groove away from the substrate relative to the substrate, so that the molding compound covers the ring groove.

10. The chip package structure according to claim 8, wherein the plurality of ring grooves are formed, the plurality of ring grooves are spaced apart from each other on a peripheral side wall of the sound inlet box, each sound inlet hole is located above the plurality of ring grooves, and the plastic package body covers the plurality of ring grooves.

11. The chip package structure according to claim 8, wherein a surface of the plastic package body on a side away from the substrate is provided with a laser character groove, and a depth of the laser character groove is smaller than or equal to a distance between the surface of the plastic package body on the side away from the substrate and the outer cover plate.

12. A method for manufacturing a chip package structure, wherein the method is used for manufacturing the chip package structure according to any one of claims 1 to 11, and the method comprises the following steps:

providing a substrate;

a silicon microphone chip and a control chip are pasted on the substrate;

13. The method for manufacturing a chip package structure according to claim 12, wherein after the step of mounting a package cover plate on the substrate, the method further comprises:

forming a plastic package body on the substrate;

the plastic package body is wrapped outside the outer layer cover plate, and partially wraps the sound inlet box, and the plurality of sound inlet holes are all located above the plastic package body.