CN114924621B

CN114924621B - Electronic equipment

Info

Publication number: CN114924621B
Application number: CN202210494917.6A
Authority: CN
Inventors: 黄�隆; 李匡; 赵敏
Original assignee: Honor Device Co Ltd
Current assignee: Honor Device Co Ltd
Priority date: 2022-05-07
Filing date: 2022-05-07
Publication date: 2023-04-07
Anticipated expiration: 2042-05-07
Also published as: CN114924621A

Abstract

The application discloses electronic equipment includes: the device comprises a support base plate, a heating device, a heated device and a foot pad device. The supporting bottom plate is provided with a top surface and a bottom surface which are oppositely arranged in a first direction; the heating device is positioned on one side of the supporting bottom plate, which is faced by the top surface; the heating element is in heat conduction connection with the heating element, and a heat conducting air cavity is arranged in the heating element; the callus on the sole device has relative stiff end and flexible end in the first direction, the direction of the directional flexible end of stiff end is unanimous with the direction of the directional bottom surface of supporting baseplate of top surface of supporting baseplate, stiff end and supporting baseplate relatively fixed, the callus on the sole device has the first state, at the first state, flexible end protrusion in the bottom surface of supporting baseplate, the callus on the sole device has the regulation air cavity, adjust air cavity and heat conduction air cavity intercommunication in order to form sealed air cavity, the callus on the sole device receives the expend with heat and contract with cold of gaseous change in the sealed air cavity to stretch out and draw back in the first direction. In the electronic equipment of the embodiment of the application, the heat dissipation of the electronic equipment is facilitated, and manual operation of a user is not needed.

Description

Electronic equipment

Technical Field

The present application relates to the field of electronic technology, and in particular, to an electronic device.

Background

With the development of electronic technology, users have increasingly high requirements for the functions of electronic devices such as notebook computers. In order to meet the use requirements of users, more electronic components are integrated in the electronic equipment. The increase in the number of electronic components increases the overall heat generation amount of the electronic device. In order to improve the heat dissipation capability of the electronic device, a supporting base plate of the electronic device is usually provided with a foot pad device, and when the electronic device is supported on a supporting surface (e.g., a table top), the foot pad device can isolate the electronic device from the supporting surface so as to facilitate the flow of air between the supporting surface and the electronic device. The height dimension design of the foot pad device is crucial, and if the height dimension design of the foot pad device is small, the distance between the electronic equipment and the bearing surface is small, which is not favorable for heat dissipation of the electronic equipment. If the height dimension of the foot pad device is designed to be larger, heat dissipation is facilitated, but the thickness of the whole machine and the portability of the electronic equipment are affected by the increase of the foot pad device. Therefore, the existing electronic equipment has the contradiction between the thickness of the whole machine and the heat dissipation performance.

Disclosure of Invention

The embodiment of the application provides an electronic device, which has good heat dissipation performance and is beneficial to reducing the thickness of the whole device.

In order to achieve the above purpose, the embodiments of the present application adopt the following technical solutions:

according to the electronic equipment of this application embodiment, include: the heating device comprises a supporting base plate, a heating device, a heated device and a foot pad device. The supporting bottom plate is provided with a top surface and a bottom surface which are oppositely arranged in a first direction; the heating device is positioned on one side of the top surface of the supporting bottom plate; the heating part is positioned on one side, facing the top surface of the supporting base plate, and is in heat conduction connection with the heating device, and a heat conduction air cavity is formed in the heating part; the callus on the sole device has relative stiff end and flexible end in the first direction, the direction of the directional flexible end of stiff end is unanimous with the direction of the directional bottom surface of supporting baseplate of top surface of supporting baseplate, stiff end and supporting baseplate relatively fixed, the callus on the sole device has the first state, at the first state, flexible end protrusion in the bottom surface of supporting baseplate, the callus on the sole device has the regulation air cavity, regulation air cavity and heat conduction air cavity intercommunication are in order to form sealed air cavity, the callus on the sole device receives the expend with heat and contract with cold change of gaseous in sealed air cavity to stretch out and draw back in the first direction, with the height of the flexible end protrusion in the bottom surface of supporting baseplate under the at least regulation first state.

In the electronic equipment of the embodiment of the application, the heat conducting air cavity of the heated part is communicated with the adjusting air cavity of the foot pad device to form the sealed air cavity, and meanwhile, the heated part is in heat conduction connection with the heating device. The heat absorbed by the heated part can change along with the change of the heat productivity of the heating device, so that the gas in the sealed gas cavity expands with heat and contracts with cold. Thus, when the gas in the sealed gas cavity expands due to the heat generation of the heating device of the electronic equipment, the foot pad device is triggered by the expansion of the gas in the sealed gas cavity to extend, so that the height of the part, protruding out of the bottom surface of the supporting bottom plate, of the foot pad device is increased, the distance between the electronic equipment and the bearing surface can be increased, and the heat dissipation of the electronic equipment is facilitated. When the gas in the sealed air cavity is reduced or does not generate heat and generate cold due to the heat generation of the heating device of the electronic equipment, the foot pad device is triggered and shortened by the cold of the gas in the sealed air cavity, so that the height dimension of the protrusion of the foot pad device on the bottom surface of the supporting base plate is reduced, the space dimension between the electronic equipment and the bearing surface can be reduced, and the carrying of the electronic equipment is facilitated. In addition, in the embodiment of the application, the telescopic length of the foot pad device is combined with the heat productivity of the heating device of the electronic equipment, and the telescopic length of the foot pad device is adjusted steplessly according to different heat productivities of the heating device of the electronic equipment, so that the heat dissipation of the electronic equipment is facilitated, and the manual operation of a user is not needed.

In some embodiments provided herein, the foot pad device includes a fixed part and a movable foot, the fixed part has a fixed end, the movable foot is connected to the fixed part and movable in a first direction relative to the fixed part, an end of the movable foot away from the fixed part is a telescopic end, and the air conditioning chamber is located between the movable foot and the fixed part. From this, simple structure is convenient for realize moreover that the callus on the sole device receives the expend with heat and contract with cold of the gaseous change of adjusting the air cavity and triggers flexible.

In some embodiments provided herein, the fixed member and the movable foot enclose a cavity that serves as a conditioned air chamber. Thus, the structure is simple.

In some embodiments provided herein, a footpad apparatus includes an air bag having a conditioning air chamber fixedly coupled to a movable foot and a fixed member, respectively. Thus, the structure is simple.

In some embodiments provided herein, the stationary member and the movable foot enclose a cavity for receiving the air bag. Therefore, the protection effect on the air bag is favorably improved.

In some embodiments provided herein, the peripheral wall of the air bag has a plurality of peaks and a plurality of valleys, the peaks and valleys alternating in the first direction. Thereby, the expansion and contraction of the airbag in the first direction is facilitated.

In some embodiments provided herein, the fixing member includes a fixing disk and an annular fixing ring, the fixing disk has a fixing end, an axial end of the fixing ring is connected to a surface of the fixing disk facing the moving foot to enclose a first cavity with the fixing disk, and the cavity includes at least a portion of the first cavity. Therefore, the structure is simple and convenient to realize.

In some embodiments provided by the present application, the movable foot includes a connecting plate and an annular connecting ring, one end of the connecting ring is connected to the connecting plate around the edge, and the other end of the connecting ring extends toward the fixing part to form a second cavity with the connecting plate, and the second cavity includes at least part of the second cavity. Therefore, the structure is simple and convenient to realize.

In some embodiments provided by the present application, the fixing component includes a fixing disc and an annular fixing ring, the fixing disc has a fixing end, and an axial end of the fixing ring is connected with a surface of the fixing disc facing the moving foot; wherein, the clamping ring sets up in the periphery of retainer plate, and perhaps, the retainer plate sets up in the periphery of clamping ring. Therefore, the structure is simple and convenient to realize.

In some embodiments provided herein, the foot pad device further comprises a flexible sealing ring sealed between the connecting ring and the fixing ring. This is advantageous in improving the sealing property of the cavity.

In some embodiments provided herein, the foot pad device further includes an anti-separation fastener, the fixing component is fixedly connected to the anti-separation fastener, and the moving foot is movably connected to the anti-separation fastener in the first direction. Therefore, the fixing component and the movable foot can be conveniently detached.

In some embodiments provided by the present application, the fixing member includes a fixing disk having a clamping hole penetrating the fixing disk in the first direction, and the anti-drop clamping member includes a clamping portion clamped in the clamping hole. Thereby, assembly is facilitated.

In some embodiments provided by the present application, the clamping hole includes a first hole section and a second hole section, the first hole section is located on a side of the second hole section far away from the moving foot and is communicated with the second hole section, and a cross-sectional area of the first hole section is larger than a cross-sectional area of the second hole section to form a step portion; the clamping part is supported on the step part and clamped in the first hole section; the anti-drop joint spare still includes the slide bar, and the slide bar links to each other with the fixed surface of the orientation second hole section of joint portion, and the slide bar passes the second hole section. Therefore, the structure is simple, and the assembly is convenient.

In some embodiments provided by the present application, the moving foot includes an annular connecting ring, the connecting ring has a sliding groove on an outer circumferential surface thereof, and the sliding groove extends along the first direction to a side end surface of the connecting ring facing the fixing part to form an opening; the anti-drop clamping piece comprises a sliding rod, the sliding rod penetrates through the opening, part of the sliding rod is located in the sliding groove, and the sliding rod is in sliding fit with the sliding groove in the first direction. Thus, the structure is simple.

In some embodiments provided by the present application, the sliding grooves respectively have first anti-slip projections on groove walls of the sliding grooves which are oppositely arranged in the circumferential direction of the moving foot; the side walls of the part, which is positioned in the sliding groove, of the sliding rod, which are opposite to each other are respectively provided with a second anti-falling lug, the second anti-falling lugs are opposite to the first anti-falling lugs in the first direction and are positioned on one side, which is far away from the fixed end, of the first anti-falling lugs. Thereby, the disengagement of the disengagement prevention catch from the slide groove can be prevented.

In some embodiments provided by the application, the anti-falling clamping pieces are multiple, and the multiple anti-falling clamping pieces are distributed at intervals in the circumferential direction of the moving foot. From this, utilize a plurality of anticreep joint spares to be connected with removal foot and fixed part respectively on the one hand to improve the reliability that removes foot and fixed part and be connected, on the other hand can also prevent that anticreep joint spare from breaking away from the sliding tray.

In some embodiments provided herein, an electronic device includes: the air duct is used for communicating the adjusting air cavity with the heat conducting air cavity by the aid of the air duct. Therefore, the structural layout in the electronic equipment is optimized.

In some embodiments provided herein, an electronic device includes a housing having a support floor, and a heat generating component and a heat receiving component are both located within the housing.

In some embodiments provided herein, the housing has an air inlet and an air outlet, the air inlet is located on the support base plate; the electronic equipment also comprises a heat dissipation fan and a heat conducting piece, wherein the heat dissipation fan is provided with a fan inlet and a fan outlet, the fan inlet is communicated with the air inlet, the fan outlet is communicated with the air outlet, and a radiator is arranged between the fan outlet and the air outlet; the heat conducting member includes a first portion thermally coupled to the heat sink and a second portion thermally coupled to the heat generating device. Therefore, the radiating effect of the heating device is improved.

In some embodiments provided by the present application, the heat receiving part, the heat generating device, and the second part are located on the same side of the cooling fan in the second direction, and in the first direction, the second part is stacked between the heat receiving part and the heat generating device, and the second part is in heat conduction connection with the heat receiving part, where the second direction is perpendicular to the first direction. The arrangement is favorable for optimizing the structural layout and realizing the compactness of the structure.

In some embodiments provided herein, the heat receiving member has a first surface facing the heat generating device, an orthogonal projection of the second portion on the first surface overlaps the first surface to form an overlapping region, a region of the first surface excluding the overlapping region is a non-overlapping region, the heat generating device has a first heat generating portion in the non-overlapping region of the orthogonal projection of the first surface, and a second heat generating portion in the overlapping region of the orthogonal projection of the first surface, the second heat generating portion is in thermal transfer connection with the second portion, and the second portion is in thermal transfer connection with the heat receiving member in the overlapping region. Therefore, on one hand, more heat of the heating device is favorably transferred to the heat conducting piece, and on the other hand, more heat of the heating device is favorably transferred to the heated piece.

In some embodiments provided herein, a surface of the heat receiving member facing the heat generating device has an avoidance groove, and the second portion is fitted in the avoidance groove. Thereby improving the heat conduction effect between the second part and the heated piece and the reliability of the joint between the second part and the heated piece.

In some embodiments provided herein, the foot pad device and the heat receiving member are located on both sides of the heat dissipating fan in the second direction, the conditioning air chamber is in communication with the heat conducting air chamber via an air duct, and the air duct is in heat-conducting communication with the first portion. Thereby further improving the expansion and contraction effect of the sealed air cavity.

In some embodiments provided herein, the supporting base plate has a through hole, the foot pad device is disposed through the through hole, and the fixed end is located on a side of the supporting base plate facing the top surface. This facilitates the communication of the air cavity with the heat-conducting air cavity.

In some embodiments provided by the present application, the telescopic end always protrudes from the bottom surface of the support base plate.

In one possible design, the electronic device is a notebook computer, and the notebook computer includes a keyboard host, and the keyboard host includes a supporting base, a heating device, a heat receiving member, and a foot pad device. When the electronic equipment is placed on the bearing surface (such as a desktop and the like), the electronic equipment can be in contact with the bearing surface by using the foot pad device so as to adjust the gap between the electronic equipment and the bearing surface according to the temperature of a heating device of the electronic equipment, so that a heat dissipation space is formed between the shell of the electronic equipment and the bearing surface, the heat exchange between the electronic equipment and air is facilitated, the heat dissipation speed in the electronic equipment can be increased, and the heat dissipation performance can be further improved.

In one possible design, the foot pad device is disposed near the rear end of the keyboard main body. Therefore, the comfort of the user using the electronic equipment can be improved, and the fatigue can be relieved.

In one possible design, the notebook computer further includes: the supporting legs are arranged on the bottom surface of the supporting bottom plate and are arranged close to the front end of the keyboard host. Thus, the clearance between the electronic equipment and the supporting surface can be further increased, and the heat dissipation space of the electronic equipment can be further increased, so that the heat dissipation efficiency is improved.

In a possible design, the height of the supporting legs protruding from the bottom surface of the supporting base plate is less than or equal to the minimum height of the foot pad device protruding from the bottom surface of the supporting base plate. Therefore, the height of the supporting legs protruding out of the bottom surface of the supporting base plate is smaller than or equal to the minimum height of the foot pad device protruding out of the bottom surface of the supporting base plate, so that the comfort of a user using the electronic equipment can be improved, and the fatigue can be relieved.

In one possible design, the electronic device is a tablet computer, and the foot pad device is disposed on a back cover of the tablet computer.

Drawings

Fig. 1 is a schematic structural diagram of an electronic device according to some embodiments of the present application, where the electronic device is in an open state;

FIG. 2 is a schematic structural diagram of the electronic device shown in FIG. 1, wherein the electronic device is in a closed state;

FIG. 3 is a perspective view of a keyboard host in the electronic device shown in FIG. 1;

FIG. 4 is an exploded view of the keyboard host according to FIG. 3;

FIG. 5 is an exploded view of a C-shell according to other embodiments of the present application;

FIG. 6 is a schematic partial cross-sectional view of a keyboard in the keyboard host shown in FIG. 3;

FIG. 7 isbase:Sub>A schematic cross-sectional view of the keyboard host shown in FIG. 3 at line A-A;

FIG. 8 is a cross-sectional schematic view of the footpad assembly shown in FIG. 7 in which the shape defined by the dashed lines represents a partial structure of the support base;

FIG. 9 is a schematic structural diagram of a keyboard host of an electronic device according to further embodiments of the present application;

FIG. 10 is a schematic cross-sectional view of the keyboard host shown in FIG. 9 at line B-B;

FIG. 11 is an enlarged view of the portion circled at E in the keyboard host according to FIG. 10;

FIG. 12 is an exploded view of the keyboard host according to FIG. 9;

fig. 13 is a perspective cross-sectional view of the assembled foot pad device, heat receiver, and air duct of the keyboard master according to fig. 12;

FIG. 14 is a schematic diagram of a foot pad device in the keyboard host according to FIG. 12;

FIG. 15 is a schematic cross-sectional view taken along line H-H of the footpad assembly shown in FIG. 14;

FIG. 16 is a perspective view of a fixing element of the foot pad device according to FIG. 14;

FIG. 17 is a schematic cross-sectional view of the foot pad device of FIG. 14 after being engaged with an air nozzle;

FIG. 18 is an exploded view of a mobile foot from the foot pad device of FIG. 14;

FIG. 19 is a cross-sectional schematic view of a foot pad assembly engaged with an air faucet according to still other embodiments of the present application;

FIG. 20 is an exploded view of the foot pad device according to FIG. 14;

FIG. 21 is a schematic view of the movable foot of the foot pad device shown in FIG. 14 being engaged with the anti-separation fastener;

FIG. 22 is an enlarged view of a portion encircled at M in accordance with the footpad arrangement shown in FIG. 20;

FIG. 23 is a schematic view of the keyboard host of FIG. 9 from another perspective;

FIG. 24 is a schematic view of the keyboard host of FIG. 9 from another perspective, wherein the D-shell and the C-shell are in an exploded state;

FIG. 25a is a schematic view of the position relationship of the thermal module, the heat receiving member, the main plate, and the foot pad device shown in FIG. 24, wherein the heat receiving member, the main plate, and the heat conducting member are in an exploded state;

FIG. 25b is a schematic projection of the heated plate, the second portion and the heat generating device shown in FIG. 24 in a plane of the heated plate;

FIG. 26 is a schematic view of the thermal module, the heat sink, the main board, and the foot pad device shown in FIG. 24;

FIG. 27 is a cross-sectional schematic view of a footpad assembly in accordance with still other embodiments of the present application;

FIG. 28 is a schematic view of an air bladder in the footpad apparatus shown in FIG. 27;

FIG. 29 is a schematic diagram illustrating a partial cross-sectional view of a keyboard host according to some other embodiments of the present application;

FIG. 30 is a partially schematic cross-sectional view of a keyboard host according to other embodiments of the present application.

Detailed Description

In the embodiments of the present application, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature.

In the description of the embodiments of the present application, it should be noted that the terms "mounted," "connected," and "connected" are to be construed broadly and mean that, for example, "connected" may or may not be detachably connected; may be directly connected or indirectly connected through an intermediate. The term "fixedly connected" means that they are connected to each other and their relative positional relationship is not changed after the connection. "rotationally coupled" means coupled to each other and capable of relative rotation after being coupled. "slidably connected" means connected to each other and capable of sliding relative to each other after being connected.

In the embodiments of the present application, the terms "include", "include" or any other variations are intended to cover non-exclusive inclusions, so that a process, a method, an article, or an apparatus including a series of elements includes not only those elements but also other elements not explicitly listed, or further includes elements inherent to such a process, a method, an article, or an apparatus. Without further limitation, an element defined by the phrase "comprising one of 8230, and" comprising 8230does not exclude the presence of additional like elements in a process, method, article, or apparatus comprising the element.

In the embodiment of the present application, "and/or" is only one kind of association relationship describing an association object, and indicates that three relationships may exist, for example, a and/or B may indicate: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship.

The application provides an electronic device, which is a type of electronic device with a foot pad device. Specifically, the electronic device includes, but is not limited to, a tablet personal computer (tablet personal computer), a television, a laptop computer (laptop computer), a Personal Digital Assistant (PDA), a keyboard, a notebook computer (notebook), and other electronic devices.

Referring to fig. 1, fig. 1 is a schematic structural diagram of an electronic device 1000 according to some embodiments of the present disclosure, wherein the electronic device 1000 is in an open state. In this embodiment, the electronic device 1000 is a notebook computer. Specifically, the electronic device 1000 includes a display 200 and a keyboard host 100.

It should be noted that fig. 1 only schematically shows some components included in the electronic device 1000, and the actual shape, the actual size, the actual position and the actual configuration of the components are not limited by fig. 1 and the following drawings. In other examples, when the electronic device 1000 is another type of electronic device 1000, the electronic device 1000 may not include the display 200.

The display 200 is used to display images, video, and the like. The display 200 may be a flexible display or a rigid display. The display 200 may be an organic light-emitting diode (OLED) display, an active-matrix or active-matrix organic light-emitting diode (AMOLED) display, a mini-led (micro-organic light-emitting diode) display 200, a micro-led (micro-organic light-emitting diode) display, a micro-OLED (micro-organic light-emitting diode) display, a quantum dot light-emitting diode (QLED) display, or a Liquid Crystal Display (LCD).

The keyboard host 100 is used for inputting instructions and data, and controlling the display 200 to display images, videos, and the like according to the inputted instructions and data. Meanwhile, the keyboard host 100 is also used to play voice or music.

The keyboard main body 100 is rotatably connected with the display 200. The electronic device 1000 can be switched between the open state and the closed state by the rotatable connection of the keyboard host 100 and the display 200.

Referring to fig. 1, when the electronic device 1000 is in the open state, the display 200 and the keyboard host 100 form an included angle greater than 0 ° and less than 180 °. In this state, the user can control the display of the display 200 by operating the keyboard host 100, and at the same time, the user can view an image or video displayed on the display 200.

Referring to fig. 2, fig. 2 is a schematic structural diagram of the electronic device 1000 shown in fig. 1, wherein the electronic device 1000 is in a closed state. When the electronic device 1000 is in the closed state, the display 200 covers the keyboard host 100, and a display surface of the display 200 is opposite to a keyboard surface of the keyboard host 100. Under this state, can carry out anti-scratch, dustproof protection to the display surface of display 200 and the keyboard face of keyboard host computer 100, the electronic equipment 1000's of can also being convenient for simultaneously accomodate and carry.

Specifically, the keyboard host 100 may be connected to the display 200 through a hinge (not shown). In some examples, the hinge may be a damping hinge having a damping function, which may provide a damping force for relative rotation of the keyboard host 100 and the display 200, so that the electronic device 1000 can maintain a target open angle position between 0 ° and 180 °. So as to facilitate the use of the user. The target opening angle may be a fixed value between 0 ° and 180 °, or may be any value between 0 ° and 180 °, which is not specifically limited in the present application. In other examples, the shaft may not be a damped shaft.

For convenience of the following description of the embodiments, an XYZ coordinate system is established for the keyboard host 100. Specifically, the extending direction of the rotation axes of the keyboard main body 100 and the display 200 is defined as an X-axis direction (i.e., a second direction), the thickness direction of the keyboard main body 100 is defined as a Z-axis direction (i.e., a first direction), and a direction perpendicular to both the X-axis direction and the Z-axis direction is defined as a Y-axis direction. It is understood that the coordinate system of the keyboard host 100 can be flexibly configured according to actual needs, and is not limited in particular. Also, in the practical application process of the user, in the opened state of the electronic device 1000, the user faces the display surface of the display 200, such that the X-axis direction is the left-right direction of the user, the Y-axis direction is the front-back direction, and along the Y-axis direction, the direction close to the user is the front direction, and the direction close to the pivot axis of the keyboard main body 100 and the display 200 is the back direction.

Referring to fig. 3 and 4, fig. 3 is a perspective view of the keyboard host 100 in the electronic device 1000 shown in fig. 1, and fig. 4 is an exploded view of the keyboard host 100 shown in fig. 3. In the present embodiment, the keyboard main body 100 includes a housing 20, a keyboard 10, a main board 40, a heat generating device 401, and a foot pad device.

It should be noted that fig. 3 and fig. 4 only schematically show some components included in the keyboard host 100, and the actual shape, actual size, actual position and actual configuration of these components are not limited by fig. 3 and fig. 4 and the following drawings. When the electronic device 1000 is another type of electronic device, the electronic device 1000 may not include the keyboard 10.

The housing 20 serves to protect the internal structure of the keyboard main unit 100. When the user uses the electronic device 1000, the keyboard main unit 100 is in contact with the user or other external structures through the housing 20. This inevitably causes problems such as scratching, corrosion, etc. of the outer surface of the housing 20. In order to avoid this problem, the housing 20 may have certain properties of wear resistance, corrosion resistance, scratch resistance, etc., or the outer surface of the housing 20 may be coated with a layer of functional material for wear resistance, corrosion resistance, scratch resistance, etc.

In some embodiments, the housing 20 may be provided as a structural unit. That is, the housing 20 may be an integrally formed part, and the integrally formed housing 20 has higher structural strength and high processing efficiency.

In other embodiments, the housing 20 may be formed from a plurality of assembled parts. With continued reference to fig. 4, the housing 20 includes a C-shell 201 and a D-shell 202. The C shell 201 and the D shell 202 are aligned in the Z-axis direction to enclose an inner receiving space of the housing 20. Wherein the C-shell 201 may be between the display 200 and the D-shell 202 when the electronic device 1000 is in the closed state. The shell 20 is formed by assembling the C shell 201 and the D shell 202, so that the C shell 201 and the D shell 202 can be conveniently processed respectively, the die structures of the C shell 201 and the D shell 202 are facilitated to be simplified, the forming difficulty of the C shell 201 and the D shell 202 is reduced, and the processing and manufacturing difficulty of the shell 20 is further reduced.

Specifically, the C shell 201 may be fixedly connected to the D shell 202 in a snap-fit manner. The C-shell 201 may also be attached to the D-shell 202 by screws. The C-shell 201 may also be magnetically attached to the D-shell 202. The C-shell 201 may also be connected to the D-shell 202 by welding. Alternatively, in other embodiments, the C-shell 201 may also be fixedly connected to the D-shell 202 by glue or adhesive tape. This is not particularly limited in this application.

Specifically, referring to fig. 4, the c housing 201 includes a supporting plate 2011 and a first side frame 2012.

The carrier plate 2011 has a flat plate shape. Exemplary shapes of the carrier plate 2011 include, but are not limited to, rectangular, circular, or contoured. The carrier plate 2011 is used for carrying the keyboard 10, the motherboard 40, and other devices. Also, when the user uses the electronic device 1000, the bearing plate 2011 may also be used for bearing the hand of the user, so that the user can conveniently strike the keyboard 10.

The material of the carrier plate 2011 includes, but is not limited to, rigid plastic, metal, and a combination of plastic and metal. Like this, be favorable to improving the structural strength of loading board 2011 to improve the bearing effect of loading board 2011. In order to achieve light weight of the electronic device 1000, the material of the carrier plate 2011 may be hard plastic.

The first side frame 2012 is disposed around the periphery of the supporting plate 2011. When the C shell 201 and the D shell 202 are mated, the first side frame 2012 is connected between the bearing plate 2011 and the D shell 202. The bearing plate 2011 is provided with a plurality of avoiding holes 201a, and the plurality of avoiding holes 201a are used for avoiding key caps on the keyboard 10 mentioned below.

The material of the first side frame 2012 includes, but is not limited to, rigid plastic, metal, and a combination of plastic and metal. This is advantageous in improving the structural strength of the first side frame 2012. In order to achieve light weight of the electronic device 1000, the material of the first side frame 2012 may be selected to be hard plastic.

In some embodiments, please refer to fig. 4, the c housing 201 may be an integrated part, that is, the bearing plate 2011 and the first side frame 2012 form an integral structure. Therefore, the processing technology of the C shell 201 is simplified, the processing efficiency of the C shell 201 is improved, the production cost of the C shell 201 is reduced, and meanwhile, the structural strength of the C shell 201 is improved.

In other embodiments, referring to fig. 5, fig. 5 is an exploded view of a C-shell 201 according to other embodiments of the present application. Because the surface of loading board 2011 is the appearance face, when utilizing loading board 2011 to bear devices such as keyboard 10, probably need set up the mounting hole or set up mounting groove etc. at loading board 2011 is whole, and this can influence the outward appearance aesthetic property of loading board 2011, for the outward appearance of guaranteeing loading board 2011 is not influenced, the installation of each inside device of keyboard host computer 100 of can also being convenient for simultaneously, loading board 2011 includes loading board body 20111 and first medium plate 20112. The first middle plate 20112 is stacked on the surface of the carrier plate body 20111 facing the D-shell 202. Specifically, the first middle plate 20112 may be fixed to the carrier plate body 20111 by gluing, welding, or screwing. The first middle plate 20112 may be provided with a fixing structure, which includes, but is not limited to, a fixing hole, a screw hole, a fixing groove, a buckle or a rib, etc. to fix a part of the functional devices in the keyboard host 100. Illustratively, the first middle plate 20112 is made of plastic. Thus, the processing of the fixing structure on the first middle plate 20112 can be facilitated.

Specifically, please refer to fig. 5, a plurality of avoiding holes 201a are formed in the carrier plate body 20111, and the plurality of avoiding holes 201a are used for avoiding key caps of the keyboard 10 mentioned below. The first middle plate 20112 is provided with avoidance openings 201b at positions corresponding to the avoidance holes 201a, and the avoidance openings 201b are used for avoiding all keycaps. Of course, it is understood that in other examples, a plurality of avoiding openings 201b may also be disposed on the first middle plate 20112, and the plurality of avoiding openings 201b are in one-to-one correspondence with the plurality of avoiding holes 201a, so as to be used for avoiding key caps in the keyboard 10 mentioned below in a one-to-one correspondence manner.

Illustratively, the loading plate body 20111 and the first side frame 2012 are an integral structure, that is, the loading plate body 20111 and the first side frame 2012 are an integral part. Therefore, the processing technology of the C shell 201 is simplified, the processing efficiency of the C shell 201 is improved, the production cost of the C shell 201 is reduced, and meanwhile, the structural strength of the C shell 201 is improved.

With continued reference to fig. 4, the d-housing 202 includes a support base 2021. The support base 2021 is flat. Illustratively, the shape of the support floor 2021 includes, but is not limited to, rectangular, circular, or contoured.

The support base 2021 and the carrier plate 2011 are disposed opposite to each other in the Z-axis direction. The supporting base plate 2021 has a top surface and a bottom surface oppositely disposed in the Z-axis direction. The top surface of the support base 2021 faces the carrier plate 2011. When the electronic apparatus 1000 is placed on a carrying surface (e.g., a desktop), the bottom surface of the supporting base 2021 may face the carrying surface.

The phrase "the supporting bottom plate 2021 and the supporting plate 2011 are disposed opposite to each other" means that the two may be parallel to each other, and also allows a certain included angle, for example, the angle between the two is-25 ° to-25 °. It should be noted that the same description herein should be understood in the same way, and will not be described in detail hereinafter.

Illustratively, with continued reference to FIG. 4, the D-shell 202 is defined by a support floor 2021. Also illustratively, the D-housing 202 includes a support base 2021 and a second side frame (not shown). The second side frame is disposed around the edge of the support base 2021. When the C-shell 201 and the D-shell 202 are mated, the second side frame is connected between the supporting base plate 2021 and the C-shell 201.

The material of the supporting base plate 2021 includes, but is not limited to, rigid plastic, metal, and a combination of plastic and metal. This is advantageous for improving the structural strength of the supporting base 2021. In order to achieve light weight of the electronic apparatus 1000, the material of the supporting base plate 2021 may be selected to be hard plastic.

In other examples, when the electronic device 1000 is another type of electronic device, the housing 20 of the electronic device 1000 may not include the C-shell 201, and only include the D-shell 202.

The keyboard 10 is used for inputting instructions and data. The keyboard 10 may be fixed to the carrier plate 2011. Specifically, referring to fig. 6, fig. 6 is a schematic partial sectional view of the keyboard 10 in the keyboard host 100 shown in fig. 3. In the present embodiment, the keyboard 10 may include a fixing plate 102, an elevating member 103, an elastic member 105, a wiring board 104, and a plurality of key caps 101.

It should be noted that fig. 6 only schematically shows some components included in the keyboard 10, and the actual shape, the actual size, the actual position, and the actual configuration of these components are not limited by fig. 6 and the following drawings.

The fixing plate 102 serves as a structural "skeleton" of the keyboard 10, and mainly serves to support and fix the key caps 101, the elastic members 105, the circuit board 104, the elevating member 103, and the like. Specifically, the keyboard 10 may be fixed on the supporting plate 2011 by the fixing plate 102. Illustratively, the fixing plate 102 is fixed to the inner surface of the carrier plate 2011 by gluing, clipping, screwing, riveting, or heat fusing. Specifically, the plurality of avoiding holes 201a on the bearing plate 2011 are separated by the ribs 201c arranged in a staggered manner (referring to fig. 4), and the fixing plate 102 can be fixed on the ribs 201c through a hot melting process. Of course, in other examples, the fixing plate 102 may be fixed to the first side frame 2012 of the C-shell 201 or to the D-shell 202.

The shape of the fixation plate 102 includes, but is not limited to, rectangular, circular, oval, or contoured. The material of the fixing plate 102 includes, but is not limited to, metal, plastic, and a combination thereof.

The plurality of key caps 101 correspond to the plurality of avoiding holes 201a on the bearing plate 2011 one by one. Each escape hole 201a is used for the corresponding key cap 101 to pass through, so that the key cap 101 extends out of the housing 20.

The key cap 101 has a depressed position and a released position. The key cap 101 is movable relative to the fixed plate 102 in the thickness direction of the fixed plate 102 (i.e., in the Z-axis direction) to switch between a pressed position and a released position. Specifically, the lifting member 103 is disposed between the key cap 101 and the fixing plate 102, and the key cap 101 can be moved between the pressed position and the released position by the lifting member 103.

Specifically, the lifting member 103 is configured in a scissor-type structure. Specifically, the lifting member 103 includes a first lifter 1031 and a second lifter 1032. The first and

second lifting members

1031 and 1032 are arranged to cross, and the first and

second lifting members

1031 and 1032 are pivotally connected at the crossing position. The first lifting part 1031 is movably connected between the key cap 101 and the fixing plate 102, and the second lifting part 1032 is movably connected between the key cap 101 and the fixing plate 102. Thereby, the key cap 101 can be moved between the pressed position and the released position with respect to the fixing plate 102 by the scissor-foot connection design of the first and

second lifting members

1031, 1032.

The wiring board 104 is disposed on a side of the fixing plate 102 facing the key cap 101. And a switch (not shown) is provided on the wiring board 104 at a position corresponding to the key cap 101. The wiring Board 104 includes, but is not limited to, a thin film wiring Board 104 or a Flexible Printed Circuit Board (FPCB) 104.

The elastic member 105 is located between the key cap 101 and the circuit board 104. When a user presses the key cap 101 from a side toward which the key cap 101 faces, the elastic member 105 is elastically deformed to facilitate the key cap 101 to move further toward the fixing plate 102. When the key cap 101 is moved to the pressed position, the elastic member 105 may be deformed to a predetermined extent to trigger the switch. After the user removes the pressing action on the key cap 101, the elastic member 105 is restored to the initial state under the action of the resilience force of the elastic member 105, and in the process, the elastic member 105 drives the key cap 101 to move to the release position in the direction away from the fixing plate 102. The material of the elastic member 105 includes, but is not limited to, rubber and silicon.

Referring to fig. 7, fig. 7 isbase:Sub>A schematic cross-sectional view of the keyboard host 100 shown in fig. 3 atbase:Sub>A linebase:Sub>A-base:Sub>A. The line A-A is the direction of the plane enclosed by the line A-A and the arrows at the two ends of the line A-A. The same descriptions below should be understood in the same way, and are not repeated herein. The main board 40 is fixed in the housing 20. And the main board 40 is between the keyboard 10 and the supporting base 2021.

Specifically, with continued reference to fig. 7, a mounting plate 203 is disposed within the housing 20. The mounting board 203 is located on the side of the keyboard 10 facing the supporting base plate 2021, and is stacked on the supporting base plate 2021. The mounting plate 203 may be connected to a carrier plate 2011. Illustratively, the peripheral edge of the mounting plate 203 is formed with a flange 2031, the flange 2031 being adapted to couple to an inner surface of the carrier plate 2011.

The main board 40 is stacked and fixed on the side of the mounting board 203 facing the supporting base plate 2021. Illustratively, the main plate 40 may be secured to the mounting plate 203 by a threaded connection, snap fit, welding, or the like. Of course, it is understood that in other examples, the main board 40 may be fastened to the housing 20 by screwing, clipping, welding, etc.

The main board 40 is used for integrating a control chip. The control chip is located on the side of the main board 40 remote from the mounting board 203. The control chip may include a Central Processing Unit (CPU), a Graphics Processing Unit (GPU), an Application Processor (AP), a double data rate synchronous dynamic random access memory (DDR), a Universal Flash Storage (UFS), and the like. It can be understood that when the electronic apparatus 1000 is in operation, the electronic component such as the control chip generates heat, and the device generating heat during operation is the heat generating device 401. The heat generating device 401 may include at least one of a CPU and a GPU on the motherboard 40. That is, the heat generating device 401 includes a CPU, or the heat generating device 401 includes a GPU, or the heat generating device 401 includes a CPU and a GPU. Illustratively, the motherboard 40 and the control chip integrated on the motherboard 40 are integrally a heat generating device 401.

The main board 40 may be electrically connected to the circuit board 104 of the keyboard 10 for receiving information output by the keyboard 10, and the main board 40 may also be electrically connected to the display 200 for controlling the display 200 to display images or videos.

The main board 40 may be a hard circuit board, a flexible circuit board, or a rigid-flexible circuit board. The main board 40 may be an FR-4 dielectric board, a Rogers (Rogers) dielectric board, a hybrid FR-4 and Rogers dielectric board, or the like. Here, FR-4 is a code for a grade of flame-resistant material, and the Rogers dielectric plate is a high-frequency plate.

As the transistor density of various electronic components (particularly, CPUs) in the electronic apparatus 1000 increases, the electronic apparatus 1000 has an increasing demand for heat dissipation. In order to improve the heat dissipation performance of the electronic apparatus 1000, please continue to refer to fig. 7, the foot pad device 50 is fixed to the housing 20, and the foot pad device 50 protrudes from the bottom surface of the supporting base 2021. Thus, when the electronic device 1000 is supported on the supporting surface (e.g., a desktop), the foot pad device 50 can be in contact with the supporting surface to isolate the electronic device 1000 from the supporting surface, so that a heat dissipation space is formed between the electronic device 1000 and the supporting surface, which is convenient for air to flow between the supporting base plate 2021 and the supporting surface, so that the electronic device 1000 exchanges heat with air, which can increase the heat dissipation speed of the inside of the electronic device 1000, and is beneficial to improving the heat dissipation effect of the electronic device 1000.

It can be understood that the height dimension of the foot pad device 50 protruding from the bottom surface of the supporting base plate 2021 is important, and if the height dimension of the foot pad device 50 protruding from the bottom surface of the supporting base plate 2021 is smaller, the distance between the electronic apparatus 1000 and the desktop is smaller, which is not favorable for heat dissipation of the electronic apparatus 1000. If the height dimension of the foot pad device 50 protruding from the bottom surface of the supporting base plate 2021 is designed to be larger, the heat dissipation is facilitated, but the overall thickness of the electronic apparatus 1000 is increased, which is not favorable for the portability of the electronic apparatus 1000. Therefore, the conventional electronic apparatus 1000 has a contradiction between the thickness of the entire apparatus and the heat dissipation performance.

To solve the above problem, referring to fig. 8, fig. 8 is a schematic cross-sectional view of the foot pad device 50 shown in fig. 7, wherein a shape enclosed by a dotted line in fig. 8 represents a partial structure of the support base plate 2021. The foot pad device 50 includes a foot pad housing 501, a spring 502, and a moving foot 503. Wherein, the foot pad shell 501 is fixed on the bottom surface of the support base plate 2021. The side of the foot pad shell 501 remote from the support base 2021 is open to form an opening. One end of the moving foot 503 is located in the foot pad shell 501, and the other end of the moving foot passes through the opening to extend out of the foot pad shell 501 in the direction far away from the supporting bottom plate 2021. The spring 502 is disposed in the foot pad housing 501 and is compressed between the moving foot 503 and the foot pad housing 501. The inner peripheral surface of the foot pad case 501 is provided with a clip 5011. The portion of the movable foot 503 inside the foot pad shell 501 is provided with a first card slot 5031 and a second card slot 5032. The first card slot 5031 and the second card slot 5032 are spaced apart in the Z-axis direction, and the first card slot 5031 is located on one side of the second card slot 5032 close to the supporting bottom plate 2021. The first card slot 5031 and the second card slot 5032 extend in the entire circumferential direction of the moving leg 503. Meanwhile, a communication groove 5033 is further provided in a portion of the moving leg 503 located inside the foot pad case 501. The communication groove 5033 is located between the first and

second card grooves

5031, 5032 and is in communication with both the first and

second card grooves

5031, 5032.

When the user needs to adjust the height of the foot pad device 50, the moving foot 503 may be rotated so that the catch 5011 corresponds to the communication groove 5033. Then, the hand is released, the moving leg 503 moves away from the foot pad housing 501 under the action of the spring 502 until the catch 5011 enters the first catch groove 5031 along the communication groove 5033, and at this time, the moving leg 503 is rotated to shift the catch 5011 from the communication groove 5033, so as to raise the height of the foot pad device 50. When the user needs to lower the height of the foot pad device 50, the moving foot 503 may be rotated so that the catch 5011 corresponds to the communication groove 5033. Then, the moving leg 503 is pressed in the direction of the supporting base 2021 until the clip 5011 enters the second card slot 5032 along the communication slot 5033, and at this time, the moving leg 503 is rotated to shift the clip 5011 from the communication slot 5033.

However, in actual research, the inventors have found that the embodiment of fig. 8 may be adjusted for height of the footbed device 50. However, the height of the foot pad device 50 is adjusted by only two gears, and the gears are fewer, so that more gear adjustment cannot be realized. Moreover, adjustment of the foot pad device 50 requires manual adjustment by the user. Moreover, when the user uses the electronic device 1000, the user often has a high concentration degree, may not necessarily notice the heat generation condition of the electronic device 1000, and cannot adjust the height of the foot pad device 50 in time or neglect to adjust the height of the foot pad device 50, which is not favorable for the heat dissipation of the electronic device 1000.

To solve the technical problem of the electronic device 1000 in the embodiment shown in fig. 8, please refer to fig. 9-11, fig. 9 is a schematic structural diagram of a keyboard host 100 of the electronic device 1000 according to another embodiment of the present application; FIG. 10 is a schematic cross-sectional view of the keyboard host 100 shown in FIG. 9 at line B-B; fig. 11 is an enlarged view of a portion circled at E in the keyboard host 100 shown in fig. 10. The present embodiment is different from the above embodiments in that: the electronic apparatus 1000 includes the foot pad device 50 and the heat receiver 70.

It should be noted that fig. 9-11 only schematically show some components included in the keyboard host 100, and the actual shape, actual size, actual position and actual configuration of these components are not limited by fig. 9-11 and the following drawings.

Specifically, the footrest apparatus 50 has a fixed end 504a and a telescoping end 503a. The fixed end 504a and the telescopic end 503a are disposed opposite to each other in the Z-axis direction. And the direction in which the fixed end 504a points toward the telescopic end 503a coincides with the direction in which the top surface of the supporting base plate 2021 points toward the bottom surface of the supporting base plate 2021. For example, as shown in fig. 10 and 11, the direction in which the top surface of the supporting base plate 2021 points to the supporting bottom surface is the negative direction of the Z axis, and the direction in which the fixed end 504a points to the telescopic end 503a is also the negative direction of the Z axis.

The foot pad device 50 has a first state in which the extendable end 503a protrudes from the bottom surface of the support base 2021. This isolates the electronic device 1000 from the supporting surface by the contact of the retractable end 503a with the supporting surface when the foot pad device 50 is in the first state.

The foot pad device 50 is secured to the housing 20 by a securing end 504a. The fastening means between the foot pad device 50 and the housing 20 includes, but is not limited to, snap-fitting, screw-fastening, welding, gluing, or magnetic attachment.

In some examples, referring to fig. 11, the fixed end 504a is on a side of the top surface of the support base 2021 facing. In this way, the foot pad device 50 is fixed to the side of the top surface of the supporting base plate 2021 facing by the fixed end 504a, that is, the fixed end 504a is in the housing 20. Illustratively, the footrest apparatus 50 is fixed to the bearing plate 2011 or the first side frame 2012 by a fixing end 504 a; alternatively, when the D-shell 202 has a second side frame, the foot pad device 50 may also be secured to the second side frame by the securing end 504a.

To facilitate the extension of the footrest apparatus 50 from the supporting base plate 2021, the supporting base plate 2021 has a through hole 20211. The through hole 20211 penetrates the support base plate 2021 in the thickness direction (i.e., Z-axis direction) of the support base plate 2021. The foot pad device 50 is disposed through the through hole 20211, and the foot pad device 50 is retractable in the Z-axis direction to adjust a height of the retractable end 503a protruding out of the bottom surface of the supporting base plate 2021 after passing through the through hole 20211.

The through hole 20211 through which the foot pad device 50 is inserted means that the through hole 20211 can be passed by the foot pad device 50, and the through hole 20211 through which the foot pad device 50 is inserted includes the following conditions:

in the first case: after the side of the footrest device 50 facing the top surface of the support base plate 2021 passes through the through hole 20211, a portion of the footrest device 50 is always located on the side of the bottom surface of the support base plate 2021 facing, at this time, the retractable end 503a is always located on the side of the bottom surface of the support base plate 2021 facing, that is, the retractable end 503a always protrudes from the bottom surface of the support base plate 2021, and the footrest device 50 is always in the first state. Thus, when the footrest device 50 is extended or retracted, the adjustment range of the height of the extension end 503a protruding from the bottom surface of the support base plate 2021 can be widened, which is more convenient for the user to use.

In the second case: the foot pad device 50 may have a minimum length, and when the current length dimension of the retractable foot pad device 50 is equal to the minimum length, the retractable end 503a is located within the through hole 20211 and may be flush with the bottom surface of the support base 2021. When the footpad 50 continues to extend beyond the minimum length, the extendable end 503a protrudes from the bottom surface of the support base 2021, and the footpad 50 is in the first state.

In a third case: the foot pad device 50 may have a predetermined length, and when the current length dimension of the retractable foot pad device 50 is equal to the predetermined length, the retractable end 503a is located within the through hole 20211 and may be flush with the bottom surface of the support base 2021. When the footrest device 50 is extended to be longer than the predetermined length, the retractable end 503a can protrude from the bottom surface of the supporting base 2021, and the footrest device 50 is in the first state. When the footrest apparatus 50 is shortened to be less than the predetermined length, the bottom surface of the supporting base plate 2021 is protruded relative to the telescopic end 503a, and the telescopic end 503a may be located in the through hole 20211 or located on the side facing the top surface of the supporting base plate 2021.

Further, it is understood that in other examples, when the foot pad device 50 is integrally located on the side facing the bottom surface of the support base plate 2021, the telescopic end 503a is always located on the side facing the bottom surface of the support base plate 2021, that is, the telescopic end 503a always protrudes from the bottom surface of the support base plate 2021, and the foot pad device 50 may be fixed to the bottom surface of the support base plate 2021 by the fixing end 504a. At this time, the foot pad device 50 is always in the first state.

Therefore, regardless of whether the floor mat device 50 is inserted into the through hole 20211 or the floor mat device 50 is entirely located on the side facing the bottom surface of the support base plate 2021, the floor mat device 50 always has the first state in which the extensible end 503a protrudes from the bottom surface of the support base plate 2021, that is, the first state of the floor mat device 50 is considered as long as the extensible end 503a protrudes from the bottom surface of the support base plate 2011.

In addition, in the embodiment of the application, since the fixed end 504a of the foot pad device 50 is fixed relative to the housing 20, the distance between the fixed end 504a and the telescopic end 503a (i.e. the overall length of the foot pad device 50) can be adjusted by the telescopic arrangement of the foot pad device 50 in the Z-axis direction, so as to adjust the relative position relationship between the telescopic end 503a and the bottom surface of the supporting base plate 2021, thereby realizing the adjustment of the height of the telescopic end 503a protruding from the bottom surface of the supporting base plate 2021 in the first state, so that when the electronic device 1000 needs to be supported on a supporting surface (e.g. a desktop) by using the foot pad device 50, the telescopic end 503a can be in contact with the supporting surface, and the supporting base plate 2021 can be separated from the supporting surface by the portion of the foot pad device 50 protruding from the bottom surface of the supporting base plate 2021, thereby improving the heat dissipation effect.

Here, "the height of the telescopic end 503a protruding from the bottom surface of the supporting base plate 2021" refers to the distance between the telescopic end 503a and the bottom surface of the supporting base plate 2021 in the Z-axis direction.

Please continue to refer to fig. 10 in conjunction with fig. 12, wherein fig. 12 is an exploded view of the keyboard host 100 shown in fig. 9. The heat receiving member 70 is disposed in the case 20, and the heat receiving member 70 is thermally conductively connected to the heat generating device 401. The heat receiving member 70 and the heat generating device 401 may be in direct contact to realize heat conduction, or may be connected to the heat generating device 401 by other heat conducting structures (e.g., heat conducting glue and/or heat conducting silicone grease) to realize heat conduction.

Illustratively, the heat receiver 70 is located on a side of the main plate 40 facing the support base 2011 in the Z-axis direction. Thus, the heat receiving member 70 may be opposed to the heat generating device 401 on the main board 40 in the Z-axis direction to increase the amount of heat transferred from the heat generating device 401 to the heat receiving member 70.

The heat receiving member 70 has a flat plate shape. The shape of the heat receiver 70 includes, but is not limited to, a rectangular flat plate, a circular flat plate, a rhombic flat plate, an elliptical flat plate, or a deformed flat plate.

In order to increase the contact area of the heat receiving member 70 and the heat generating device 401, the orthographic projection of the heat generating device 401 on the heat receiving member 70 is within the outer circumferential contour of the heat receiving member 70.

Referring to fig. 13, fig. 13 is a perspective sectional view of the assembled foot pad device 50, heat receiver 70 and air duct 60 of the keyboard main unit 100 shown in fig. 9. The heat receiver 70 has a heat conductive air chamber 70a. The foot pad device 50 has a conditioned air chamber 50a (see fig. 11). The damper air chamber 50a and the heat conductive air chamber 70a communicate to form a sealed air chamber, which is filled with air. Here, the regulation air chamber 50a and the heat-conductive air chamber 70a may be directly communicated or may be communicated by an intermediate connecting medium such as an air duct as long as sealing of the sealed air chamber is ensured.

For example, the gas filled in the sealed gas cavity may include, but is not limited to, air, inert gas, carbon dioxide, or the like.

The foot pad device 50 is triggered to expand and contract in the Z-axis direction by the change of expansion with heat and contraction with cold of the gas in the sealed air cavity. It will be appreciated that the volume of the air chamber 50a can be adjusted by the expansion and contraction of the foot pad device 50, thereby maintaining the air pressure balance between the sealed air chamber and the external environment in which the electronic device 1000 is located.

Specifically, the movement strength of the gas molecules changes with the temperature change according to the expansion and contraction characteristics of the gas. During operation of the electronic device 1000, the heat generating device 401 generates heat, and the heat generating device 401 is thermally coupled to the heat receiving member 70. Thus, a part of the heat generated by the heat generating device 401 is transferred to the heat receiving member 70, and the heat on the heat receiving member 70 is transferred to the gas in the sealed gas chamber. When the temperature of the gas in the sealed gas cavity rises, the vibration amplitude of gas molecules is increased, and collision is generated among the gas molecules, so that the gas in the sealed gas cavity expands to cause the increase of the gas pressure in the sealed gas cavity. In order to maintain the air pressure balance between the sealed air cavity and the external environment of the electronic device 1000, the foot pad device 50 extends in the Z-axis direction away from the fixing end 504a, so as to increase the volume of the regulated air cavity 50a, and simultaneously increase the height of the retractable end 503a protruding from the bottom surface of the supporting base plate 2021, so as to increase the distance between the electronic device 1000 and the bearing surface, which is beneficial to the flow of more air between the electronic device 1000 and the bearing surface, and improves the heat dissipation effect on the electronic device 1000.

When the electronic device 1000 is switched from the normal operating state to the shutdown state, or the electronic device 1000 is switched from the normal operating state to the standby state, at this time, the heat generating device 401 of the electronic device 1000 does not generate heat or generates less heat, and the like, so that the heat transferred to the heat receiving device 70 is continuously reduced, or no heat is transferred to the heat receiving device 70, and the vibration amplitude of the gas molecules in the sealed air cavity is continuously reduced, which causes the air pressure of the sealed air cavity to be gradually reduced. In order to maintain the air pressure balance between the sealed air cavity and the external environment where the electronic device 1000 is located, the foot pad device 50 is shortened in the direction close to the fixed end 504a in the Z-axis direction, so as to reduce the volume of the adjusted air cavity 50a, and simultaneously, the height of the telescopic end 503a protruding out of the bottom surface of the supporting bottom plate 2021 is also reduced, which is beneficial to reducing the overall thickness of the electronic device 1000, and is more convenient to carry.

As can be seen from the above analysis, in the electronic apparatus 1000 according to the embodiment of the present application, the heat conductive air chamber 70a of the heat receiving member 70 is communicated with the conditioning air chamber 50a of the foot pad device 50 to form a sealed air chamber, and the heat receiving member 70 is thermally connected to the heat generating device 401. The heat absorbed by the heat receiving member 70 changes with the change of the heat generation amount of the heat generating device 401, so that the gas in the sealed air cavity expands with heat and contracts with cold. Thus, when the gas in the sealed air cavity expands due to the heat generated by the heat generating device 401 of the electronic device 1000, the foot pad device 50 is triggered by the expansion of the gas in the sealed air cavity to extend, so that the height of the portion of the foot pad device 50 protruding out of the bottom surface of the supporting base plate 2021 is increased, the size of the gap between the electronic device 1000 and the bearing surface can be increased, and the heat dissipation of the electronic device 1000 is facilitated. When the gas in the sealed air cavity is cooled down or not cooled down due to the heat of the heat generating device 401 of the electronic device 1000, the foot pad device 50 is triggered to be shortened by the cold of the gas in the sealed air cavity, so that the height dimension of the foot pad device 50 protruding out of the bottom surface of the supporting base plate 2021 is reduced, the distance dimension between the electronic device 1000 and the bearing surface can be reduced, and the carrying of the electronic device 1000 is facilitated. In addition, in the embodiment of the present application, the stretching length of the foot pad device 50 is combined with the heat value of the heat generating device 401 of the electronic device 1000, and the stretching length of the foot pad device 50 is steplessly adjusted according to the different heat values of the heat generating device 401 of the electronic device 1000, so that the heat dissipation of the electronic device 1000 is facilitated, and the user does not need to manually operate the electronic device.

With continued reference to fig. 13, in order to reasonably optimize the relative positions of the heat-receiving member 70 and the foot pad device 50 in the XY directions according to the structural layout in the housing 20, the electronic apparatus 1000 further includes an air duct 60. One end of the air duct 60 is communicated with the heat-conducting air chamber 70a, and the other end of the air duct 60 is communicated with the regulating air chamber 50a.

Specifically, the material of the air duct 60 includes, but is not limited to, metal, plastic, rubber, or silicone. Illustratively, the air duct 60 is a rubber hose or a silicone hose. Of course, it is understood that the air duct 60 may not be provided in the electronic apparatus 1000, and for example, the air conditioning chamber 50a is directly communicated with the air conductive chamber 70a.

In order to facilitate the foot pad device 50 to extend and contract in the Z-axis direction triggered by the change of expansion with heat and contraction with cold of the air in the adjusting air cavity 50a, please refer to fig. 14 and 15, fig. 14 is a schematic view of the foot pad device 50 in the keyboard host 100 shown in fig. 12; fig. 15 is a cross-sectional view of the footpad assembly 50 in accordance with fig. 14 taken along line H-H. The foot pad device 50 includes a fixed member 504 and a moving foot 503.

It should be noted that fig. 14 and 15 only schematically illustrate some of the components included in the footbed device 50, and the actual shape, actual size, actual location, and actual configuration of these components are not limited by fig. 14 and 15 and the following figures.

The fixing member 504 has a fixing end 504a. The fixing member 504 is fixed in the housing 20 by a fixing end 504a. The moving foot 503 is on the side of the fixed part 504 remote from the interior of the housing 20. The moving foot 503 is connected to the fixed member 504, and the moving foot 503 is movable in the Z-axis direction with respect to the fixed member 504. The moving leg 503 passes through the through hole 20211. The movable leg 503 is movably disposed with respect to the fixed member 504, so that the foot pad device 50 can be extended and contracted in the Z-axis direction. Here, the insertion of the moving foot 503 into the through hole 20211 is the same as the insertion of the foot pad device 50 into the through hole 20211, and the description thereof is omitted here.

With continued reference to fig. 15, the stationary member 504 and the movable leg 503 define a cavity. The cavity can be used as a tuning air chamber 50a, that is, the tuning air chamber 50a is enclosed by the fixed member 504 and the movable leg 503. Thus, when the air pressure in the sealed air cavity increases, the air in the sealed air cavity can push the moving leg 503 to move along the Z-axis direction in a direction away from the fixed end 504a. When the air pressure in the sealed air cavity decreases, the moving leg 503 moves toward the fixed end 504a along the Z-axis direction in order to maintain the air pressure balance with the external environment of the electronic device 1000. Therefore, the height of the movable foot 503 protruding from the bottom surface of the supporting bottom plate 2021 can be adjusted, and the structure is simple and the cost is low. It is understood that in other examples, the cavity may not be used as the conditioned air chamber 50a. As long as it is ensured that the air-conditioning chamber 50a is located between the fixed member 504 and the moving foot 503.

Specifically, referring to fig. 16 in conjunction with fig. 15, fig. 16 is a perspective view of a fixing element 504 of the footpad assembly 50 of fig. 14. The fixing member 504 includes a fixing plate 5041 and an annular fixing ring 5042. One axial end of the fixing ring 5042 is connected to a surface of the fixing plate 5041 facing the moving leg 503. The securing ring 5042 may enclose a first cavity 504b with a surface of the securing plate 5041 facing the moving foot 503. The cavity may comprise at least a portion of the first cavity 504b. The structure is simple, and the processing and the manufacturing are convenient.

The shape of the retainer ring 5042 includes, but is not limited to, a circular ring, a rectangular ring, a diamond ring, or a contoured ring. The material of the fixing ring 5042 includes, but is not limited to, metal or plastic.

The shape of the stationary plate 5041 includes, but is not limited to, rectangular, circular, oval, or contoured. The material of the fixing plate 5041 includes, but is not limited to, metal or plastic.

In some embodiments, the securing plate 5041 and the securing ring 5042 may be an integral piece. Thus, the process of manufacturing the fixing member 504 can be simplified, and the production cost can be reduced. In other examples, the fixing plate 5041 and the fixing ring 5042 may be separately manufactured and then connected by welding, gluing, clamping, or screwing.

In order to facilitate the mounting and positioning of the fixing member 504 on the moving leg 503 and ensure the reliability of the movement of the moving leg 503 in the Z-axis direction, the fixing member 504 has a rigid structure.

The fixing plate 5041 has a fixing end 504a, and the fixing member 504 is fixed to the carrier plate 2011 by the fixing plate 5041. In some embodiments, with continued reference to fig. 15 and 16, a portion of the securing plate 5041 located at the periphery of the securing ring 5042 defines a securing end 504a. The fixed end 504a has screw holes 50415. The surface of the carrier plate 2011 facing the supporting base plate 2021 has screw posts 20113 (with reference to fig. 11), and the electronic device 1000 further includes screws 90. The screw 90 is fixed to the screw post 20113 after passing through the screw hole 50415. Thereby achieving the fixation of the fixation member 504. Of course, it is understood that in other examples, the fixing plate 5041 may be fixed to the carrier plate 2011 by clamping, welding, gluing, or magnetic attraction.

The fixed plate 5041 is provided with a through hole 50412, and the through hole 50412 is located on the inner peripheral side of the fixed ring 5042. The regulated air chamber 50a communicates with the air duct 60 via the through hole 50412. The shape of the through-hole 50412 includes, but is not limited to, a circle, a square, an oval, or a profile. Of course, it is understood that in other examples, the through hole 50412 may be formed partially on the fixing plate 5041 and partially on the fixing ring 5042, as long as the fixing member 504 is ensured to have the through hole 50412 capable of communicating the adjusting air chamber 50a with the heat conductive air chamber 70a. Still alternatively, in other examples, the penetration hole 50412 is formed not in the fixed member 504 but in the movable foot 503 as long as it is ensured that the conditioning air chamber 50a of the foot pad device 50 and the heat-conductive air chamber 70a can communicate.

On the basis, in order to facilitate the connection between the air duct 60 and the through hole 50412, in some examples, please refer to fig. 17, and fig. 17 is a schematic cross-sectional view of the foot pad device 50 shown in fig. 14 and the air nozzle 60a after being matched. Electronic device 1000 also includes air cap 60a. The air nozzle 60a communicates the through hole 50412 with the air duct 60.

Specifically, one end of the air nozzle 60a is fixed in the through hole 50412. One end of the air duct 60 adjacent to the air nozzle 60a is inserted into the air nozzle 60a. The connection between the air nozzle 60a and the through hole 50412 includes, but is not limited to, clamping or gluing. The connection of the air nozzle 60a and the airway tube 60 includes, but is not limited to, clamping or gluing.

With continuing reference to fig. 17 in conjunction with fig. 18, fig. 18 is an exploded view of the mobile foot 503 of the foot mat device 50 of fig. 14. The moving foot 503 includes a main body. The body includes an attachment plate 5034 and an attachment collar 5035. The shape of web 5034 includes, but is not limited to, circular, rectangular, oval, or irregular. The connection plate 5034 can be made of metal, plastic, or other materials.

The connection ring 5035 is formed in a ring shape. And one end of the connecting ring 5035 is connected to the edge of the connecting plate 5034. In some examples, the connection between connection collar 5035 and connection plate 5034 includes, but is not limited to, adhesive, snap, weld, or screw connection. In other examples, the connecting rings 5035 and the connecting plates 5034 are integrally formed, so that the processing process of the movable leg 503 can be simplified, and the production cost of the movable leg 503 can be reduced. The material of the connection ring 5035 includes, but is not limited to, metal or plastic.

In order to ensure the reliability of the connection between the moving leg 503 and the fixing member 504 and the reliability of the movement of the moving leg 503 in the Z-axis direction, the main body is a rigid structure.

The other end of the connection ring 5035 extends in a direction close to the fixing part 504 to enclose a second cavity 503c with the connection plate 5034, the cavity including at least a part of the second cavity 503c.

Specifically, the connecting ring 5035 is disposed on the periphery of the fixing ring 5042. Of course, in other examples, the securing ring 5042 may be disposed at an outer periphery of the connecting ring 5035. Thus, the space enclosed by the fixing plate 5041, the fixing ring 5042, the connecting plate 5034 and the connecting ring 5035 is a cavity. Therefore, in addition to the first cavity 504b in the fixing member 504, the second cavity 503c is further provided in the moving leg 503, so that the volume of the cavity can be advantageously increased.

Of course, it is understood that in other examples, the moving foot 503 has the second cavity 503c and the fixed member 504 does not have the first cavity 504b. For example, the fixing member 504 may have a pillar shape, and the fixing member 504 is inserted into the second cavity 503c. In other examples, the fixed part 504 has the first cavity 504b and the moving foot 503 does not have the second cavity 503c. Illustratively, the moving leg 503 has a column shape, and the moving leg 503 is inserted into the first cavity 504b. As long as it is ensured that the fixed part 504 and the moving foot 503 can enclose a cavity.

With continued reference to fig. 18, in order to reliably support the foot pad device 50 on the carrying surface, the movable foot 503 further includes an anti-slip structure 5037. The anti-slip structure 5037 is disposed on the side of the main body away from the fixed end 504a. The anti-skid structures 5037 in this embodiment are anti-skid pads disposed on the connector plates 5034. Illustratively, the non-slip pad is a rubber pad, a silicone pad, a plastic pad, or the like. The non-slip mat can be fixed on the connection plate 5034 by gluing, clamping, screwing, etc. This improves the grip performance and wear resistance.

Of course, it is understood that in other examples, the anti-slip structure 5037 is an anti-slip bump formed on the surface of the connecting plate 5034 facing away from the fixed end 504a. The anti-slip protrusions protrude from the bottom surface of the connection plate 5034. Optionally, the anti-slip protrusions are integral with the connector plate 5034. From this, equally can improve skid resistance and wear resistance to improve callus on the sole device 50 support stability and reliability. In still other embodiments, the anti-slip structures 5037 can also be anti-slip grooves formed in the bottom surface of the connector plates 5034. The anti-slip groove is formed by the bottom surface of the connecting plate 5034 being recessed toward the direction close to the inside of the housing 20.

In order to improve the sealing performance of the cavity enclosed by the fixing part 504 and the moving foot 503. The coupling ring 5035 has an interference fit with the retaining ring 5042. This arrangement is advantageous in improving the sealing of the cavity during movement of the moving leg 503 with respect to the fixed member 504.

Of course, the present application is not limited thereto, and in other examples, please refer to fig. 19, and fig. 19 is a schematic cross-sectional view of a foot pad device 50 engaged with an air faucet 60a according to other embodiments of the present application. Foot pad device 50 further includes a flexible sealing ring 505. Flexible seal 505 seals between connecting ring 5035 and stationary ring 5042. This arrangement is advantageous in improving the sealing property of the cavity and preventing gas from leaking out during the movement of the movable leg 503 with respect to the fixed member 504.

It will be appreciated that the sealing of the cavity may be achieved in other ways, as long as it is ensured that the fixed member 504 and the movable leg 503 can enclose the sealed conditioned air cavity 50a.

To facilitate the installation of the flexible seal ring 505, preventing the flexible seal ring 505 from being detached from between the connecting ring 5035 and the fixing ring 5042 during the movement of the moving foot 503, in some examples where the connecting ring 5035 is provided at the outer periphery of the fixing ring 5042, the inner peripheral wall of the connecting ring 5035 has a groove extending in the entire circumferential direction of the connecting ring 5035, and/or the outer peripheral wall of the fixing ring 5042 has a groove extending in the entire circumferential direction of the fixing ring 5042, into which a portion of the flexible seal ring 505 is interference fitted. In other examples where the fixing ring 5042 is provided at the outer periphery of the connecting ring 5035, the outer peripheral wall of the connecting ring 5035 has a groove extending in the entire circumferential direction of the connecting ring 5035, and/or the inner peripheral wall of the fixing ring 5042 has a groove extending in the entire circumferential direction of the fixing ring 5042, into which a portion of the flexible seal ring 505 is interference fitted.

In order to further enhance the sealing effect of the flexible seal ring 505, in some examples in which the connecting ring 5035 is provided on the outer periphery of the fixing ring 5042, the entire inner peripheral wall of the connecting ring 5035 is covered by the flexible seal ring 505. The connection between the flexible seal 505 and the connection ring 5035 includes, but is not limited to, gluing, screwing, or integral molding. Alternatively, the entire peripheral wall of the fixing ring 5042 is covered with the flexible seal ring 505. The connection relationship between the flexible sealing ring 505 and the fixing ring 5042 includes but is not limited to gluing, screwing or integral molding. In other examples where the fixing ring 5042 is provided on the outer periphery of the connecting ring 5035, the entire outer peripheral wall of the connecting ring 5035 is covered with the flexible seal 505, or the entire inner peripheral wall of the fixing ring 5042 is covered with the flexible seal 505.

Referring to fig. 20, an exploded view of the footbed device 50 according to fig. 14 is shown in fig. 20, in addition to any of the embodiments of the footbed device 50 described above having a fixed component 504 and a moving foot 503. Foot pad device 50 also includes anti-disengagement snap-fit 506. The anti-slip clip 506 is used to connect the fixing member 504 and the moving leg 503. In some examples, with continued reference to fig. 20, the anti-disengagement latch 506 is fixed relative to the fixed part 504, and the moving leg 503 is movably connected to the anti-disengagement latch 506 in the Z-axis direction. Thereby, the pad device 50 is extended and contracted in the Z-axis direction by the movement of the moving foot 503. Of course, it is understood that in other examples, the anti-disengagement clamp 506 is fixed relative to the moving foot 503, and the anti-disengagement clamp 506 is movably coupled to the fixed component 504 in the Z-axis direction.

Referring to fig. 20, the anti-slip clip 506 includes a clip portion 5061 and a sliding bar 5062. The clamping portion 5061 is in the form of a sheet. Illustratively, the clamping portion 5061 is in the shape of a circular sheet, a rectangular sheet, an oval sheet, or a rectangular sheet.

The sliding bar 5062 is attached to a surface of the clip portion 5061 facing the moving foot 503. In some examples, the slide bar 5062 may be secured to the clip portion 5061 by an adhesive, snap, weld, or screw connection. In other examples, the sliding rod 5062 and the clamping portion 5061 may be integrally formed.

With continuing reference to fig. 20 and with reference to fig. 21, fig. 21 is a schematic view of the movable foot 503 and the anti-separation fastener 506 of the foot pad device 50 shown in fig. 14. The coupling ring 5035 has a sliding groove 5036 on its outer circumferential surface. The slide groove 5036 extends in the Z-axis direction to an end surface of the connection ring 5035 on the side facing the fixing part 504 to form an opening 5035c. A sliding rod 5062 passes through the opening 5035c. And a portion of the slide bar 5062 is positioned within the slide groove 5036. The opposite side walls of the part of the sliding rod 5062 located in the sliding groove 5036 are respectively provided with a second anti-slip bump 50621. In some examples, the second anti-slip projections 50621 may be fixed to the sliding bar 5062 by gluing, snapping, welding, or screwing. In other examples, the second anti-slip protrusion 50621 and the sliding rod 5062 may be an integral molding.

The side walls of the sliding groove 5036 opposite to each other in the circumferential direction of the moving leg 503 are respectively provided with a first anti-slip bump 50361. Illustratively, the first anti-slip bump 50361 is located at the opening 5035c. The first anti-falling bump 50361 and the second anti-falling bump 50621 are opposite to each other in the Z-axis direction, and the second anti-falling bump 50621 is located on the side of the first anti-falling bump 50361 away from the fixed end 504a. Thus, when the moving leg 503 moves in the direction away from the fixing member 504 along the Z-axis direction until the first anti-slip projections 50361 abut against the second anti-slip projections 50621, the sliding rod 5062 is prevented from being disengaged from the sliding groove 5036, and the foot pad device 50 is in the maximum extension state. "maximally extended state" refers to a state in which the footbed device 50 is extended to a maximum length.

When the moving foot 503 moves in the Z-axis direction toward the fixed member 504 until the end of the sliding rod 5062 away from the fixed end 504a abuts against the wall of the sliding groove 5036 facing the fixed end 504a, the foot pad device 50 is in a minimum extension state (as shown). "minimally elongated state" refers to a state in which the footpad means 50 may be shortened to a minimum length.

Referring to fig. 22, fig. 22 is an enlarged view of a portion of the footbed device 50 of fig. 20 circled at M. The fixing plate 5041 has a catching hole 50411. The snap-in bore 50411 includes a first bore section 504111 and a second bore section 504112. The first bore section 504111 is on a side of the second bore section 504112 distal to the moving foot 503. The first bore section 504111 communicates with the second bore section 504112. The cross-sectional area of the first bore section 504111 is greater than the cross-sectional area of the second bore section 504112 to form a step 504113. The clamping portion 5061 is supported by the step portion 504113 and clamped in the first hole segment 504111, and the sliding rod 5062 extends into the sliding groove 5036 after passing through the second hole segment 504112.

In the embodiment of the present application, the anti-drop fastener 506 is connected to the fixing member 504 by engaging the fastening portion 5061 with the fastening hole 50411, which is simple in structure and easy to assemble.

With continued reference to fig. 20-21, the anti-separation clip 506 can be used to improve the fixing effect of the fixing component 504 and the moving leg 503. The anti-slip fastener 506 is plural. The plurality of anti-slip clips 506 are distributed at intervals in the circumferential direction of the moving leg 503. Each anti-release catch 506 is fixed to the fixed plate 5041 in the same manner as the movable leg 503.

Referring to fig. 23, fig. 23 is a schematic view of the keyboard host 100 shown in fig. 9 from another view angle. The foot pad devices 50 may be two in number. The two foot pad devices 50 are spaced apart in the X-axis direction. Also, the two foot pad devices 50 are disposed close to the rotation axis of the display 200 and the keyboard main body 100. That is, the foot pad device 50 is disposed near the rear end of the keyboard main unit 100. Thus, the comfort of the user using the electronic apparatus 1000 can be improved, and the fatigue can be relieved.

Please continue to refer to fig. 23, in order to further increase the gap between the electronic apparatus 1000 and the supporting surface, so as to improve the heat dissipation efficiency. The keyboard host 100 further comprises a support foot 80. The supporting legs 80 are disposed on the bottom surface of the supporting base plate 2021, and the supporting legs 80 are disposed near the front end of the keyboard main body 100. The supporting feet 80 protrude downward from the bottom surface of the supporting base plate 2021.

The number of the supporting legs 80 is two, and the two supporting legs 80 are arranged at intervals in the X-axis direction. Specifically, the supporting foot 80 may be a hemispherical protrusion. Of course, the present application is not limited thereto, and in other examples, each of the supporting legs 80 has a strip-shaped structure, and the length direction of the supporting leg 80 is parallel to the X-axis direction. In other embodiments, the support foot 80 may be formed as an elongated protrusion extending along the X-axis direction.

Specifically, the telescopic end 503a is always located on the side of the bottom surface of the supporting bottom plate 2021, that is, the telescopic end 503a always protrudes from the bottom surface of the supporting bottom plate 2021. On the basis, the height of the supporting foot 80 protruding from the bottom surface of the keyboard main unit 100 is less than or equal to the minimum height of the telescopic end 503a protruding from the bottom surface of the supporting base plate 2021. Therefore, the height of the supporting legs 80 protruding from the bottom surface of the supporting base plate 2021 is less than or equal to the minimum height of the foot pad device 50 protruding from the bottom surface of the supporting base plate 2021, so that the comfort of the user using the electronic device 1000 can be improved, and the fatigue can be relieved.

Referring to fig. 23, in order to improve the reliability of the operation of the electronic components inside the electronic apparatus 1000 and prevent the electronic components from being burned out due to excessive heat generation and insufficient heat dissipation during the operation, the supporting base plate 2021 has an air inlet 20212, and the first side frame 2012 has an air outlet 20121. Thus, after entering the housing 20 from the air inlet 20212, the external air flow can take away heat in the housing 20 and be exhausted outside the electronic device 1000 from the air outlet 20121. This improves the air flow fluidity inside and outside the housing 20, and improves the heat dissipation performance of the electronic apparatus 1000. In addition, the air inlet 20212 on the supporting base plate 2021 has a certain hiding effect, which is beneficial to improving the integrity and the aesthetic property of the appearance of the electronic device 1000.

For example, with continued reference to fig. 23, the outlet 20121 may be located at the rear end of the first bezel 2012. That is, the air outlet 20121 is located at an end of the first side frame 2012 adjacent to the rotation axis of the keyboard main body 100 and the display 200. By means of the arrangement, the hidden effect of the air outlet 20121 can be improved.

Of course, it is understood that in other examples, the arrangement position of the air outlet 20121 is not limited to this, and in other examples, the air outlet 20121 may also be formed on the carrier plate 2011 or the supporting bottom plate 2021. The position of the air inlet 20212 is not limited to this, and in other examples, the air inlet 20212 may be disposed on the bearing plate 2011 or the first side frame 2012.

On the basis, in order to further improve the heat dissipation effect of the electronic device 1000, please refer to fig. 24, fig. 24 is a schematic view according to another view angle of the keyboard host 100 shown in fig. 9, wherein the D shell 202 and the C shell 201 are in an exploded state. The keyboard host 100 further comprises a heat dissipation module 30. The heat dissipation module 30 is disposed in the housing 20 for dissipating heat from the heat generating device 401, so as to ensure normal operation of the electronic device 1000. Specifically, the heat dissipation module 30 includes a heat dissipation fan 301, a heat conducting member 302 and a heat sink 303.

Referring to fig. 24, the heat dissipation fan 301 has a fan inlet 3011 and an air outlet 3012. The fan inlet 3011 is on one side of the fan in the Z-axis direction. The fan outlet 3012 is at one side of the fan in the Y-axis direction. The heat dissipation fan 301 is located between the air inlet 20212 and the air outlet 20121. The fan inlet 3011 is communicated with the air inlet 20212, and the fan outlet 3012 is communicated with the air outlet 20121. A heat sink 303 is disposed between the fan outlet 3012 of the heat dissipation fan 301 and the air outlet 20121.

Specifically, referring to fig. 24, the fan outlet 3012 is opposite to the air outlet 20121, that is, the fan outlet 3012 overlaps between the orthographic projection of the plane of the air outlet 20121 and the air outlet 20121. The fan inlet 3011 is opposite to the air inlet 20212, that is, the fan inlet 3011 overlaps between an orthographic projection of the plane where the air inlet 20212 is located and the air inlet 20212. Thus, the circulation path of the airflow in the housing 20 is shortened, the flow resistance of the airflow is reduced, and the heat dissipation effect is improved.

Referring to fig. 24 and fig. 25a, fig. 25a is a schematic diagram illustrating a positional relationship among the heat sink module 30, the heat receiving member 70, the main plate 40, and the foot pad device 50 shown in fig. 24, wherein the heat receiving member 70, the main plate 40, and the heat conducting member 302 are in an exploded state. The heat conductive member 302 includes a first portion 3021 and a second portion 3022. The first portion 3021 and the second portion 3022 are connected. Specifically, the first portion 3021 is at one end of the second portion 3022 in the X-axis direction. The first portion 3021 is thermally conductively connected to the heat sink 303. Specifically, the first portion 3021 is arranged in the Z-axis direction and thermally conductively coupled to the heat sink 303. The first portion 3021 and the heat sink 303 may be connected by a thermally conductive silicone or a thermally conductive adhesive or other thermally conductive media. The shape of the first portion 3021 includes, but is not limited to, a rectangular sheet, an oblong sheet, or an oval sheet.

The second portion 3022 is thermally conductively coupled to the heat generating device 401. Illustratively, the second portion 3022 may be connected to the heat generating device 401 through a thermal grease or a thermal glue or other thermal medium.

In this way, a part of the heat generated by the heat generating device 401 can be transferred to the heat sink 303 through the heat conductive member 302. Meanwhile, under the driving of the heat dissipation fan 301, the air flow enters the housing 20 from the air inlet 20212, and flows to the fan outlet 3012 through the fan inlet of the heat dissipation fan 301, and the air flow blown out from the fan outlet 3012 exchanges heat with the heat sink 303, flows to the air outlet 20121, and is discharged to the outside of the electronic device 1000 through the air outlet 20121, so as to achieve the purpose of dissipating heat from the heat generating device 401. Moreover, in the working process of the electronic apparatus 1000, when the heat generated by the heat generating device 401 is more and more, the expansion degree of the gas in the sealed air cavity is larger, the moving leg 503 is expanded in the direction away from the fixed end 504a in the Z-axis direction by the expansion of the gas in the sealed air cavity, so that the height of the telescopic end 503a protruding from the bottom surface of the supporting base plate 2021 is higher, that is, the larger the distance between the supporting base plate 2021 and the bearing surface is, the smoother the airflow flowing between the supporting base plate 2021 and the bearing surface is, thereby facilitating the heat dissipating fan 301 to drive more airflow from the air inlet 20212 into the housing 20, and improving the heat dissipating effect on the electronic apparatus 1000.

In order to facilitate the heat-conductive connection of the heat receiving member 70 and the heat-conductive member 302 with the heat generating device 401, the heat receiving member 70 and the second portion 3022 are on the same side of the radiator fan 301 in the X-axis direction. Further, in the Z-axis direction, the second portion 3022 is stacked between the heat receiving member 70 and the heat generating device 401, and the second portion 3022 is thermally conductively connected to the heat receiving member 70. The arrangement is favorable for optimizing the structural layout and realizing the compactness of the structure.

Referring to fig. 25b, fig. 25b is a schematic view of a projection of the heated plate 70, the second portion 3022 and the heat generating device 401 shown in fig. 24 onto a plane where the heated member 70 is located. The heat receiving member 70 has a first surface 701 facing the heat generating device 401. An orthographic projection of the second portion 3022 on the first surface 701 overlaps the first surface 701 to form an overlap region 7011. The area of the first surface 701 from which the overlap area is removed is a non-overlap area 7012. The heat generating device 401 has a first heat generating portion 4011 and a second heat generating portion 4012. An orthogonal projection of the first heat-generating portion 4011 on the first surface 701 is in a non-overlapping region 7012. The first heat generating portion 4011 is thermally conductively connected to the heat receiving member 70 at a non-overlapping area. A forward projection of the second heat generating portion 4012 on the first surface 701 is in an overlap region 7011. The second heat generating portion 4012 is in thermal heat transfer communication with the second portion 3022. The second portion 3022 is in thermally conductive communication with the heat sink 70 in the overlap region 7011. Thereby, it is facilitated that more heat of the heat generating device 401 is transferred to the heat conductive member 302 on the one hand, and more heat of the heat generating device 401 is transferred to the heat receiving member 70 on the other hand.

Illustratively, the second portion 3022 may be connected to the heat sink 70 by a thermally conductive silicone grease or adhesive or other thermally conductive medium. Illustratively, the heat generating device 401 and the second portion 3022 may be connected by a thermal grease or a thermal glue or other thermal medium. Illustratively, the heat generating device 401 and the heat receiving member 70 may be connected by a heat conductive silicone grease or a heat conductive adhesive or other heat conductive medium.

In other examples, the heat sink 70 may be directly thermally coupled to the heat-generating device 401 via the second portion 3022, such that heat generated by the heat-generating device 401 is transferred to the second portion 3022 and then transferred to the heat sink 70 via the second portion 3022.

Referring to fig. 26, fig. 26 is a schematic diagram illustrating a positional relationship among the heat dissipation module 30, the heat receiving element 70, the main board 40, and the foot pad device 50 shown in fig. 24. In order to improve the heat conduction effect between the second portion 3022 and the heat receiving member 70 and the reliability of the bonding therebetween, the surface of the heat receiving member 70 facing the heat generating device 401 has an avoidance groove 70b, and the second portion 3022 is fitted in the avoidance groove 70 b.

In any of the electronic apparatuses 1000 having the heat dissipation module 30, please refer to fig. 24-26, two heat dissipation fans 301 are provided, and the two heat dissipation fans 301 are spaced apart in the X-axis direction. The heat receiver 70 is located between the two heat dissipation fans 301. That is, the two radiator fans 301 and the heat receiving member 70 are arranged in the X-axis direction with the heat receiving member 70 interposed therebetween. Of course, it is understood that the number of the heat dissipation fans 301 is not limited thereto, and in other examples, the number of the heat dissipation fans 301 may be more than two, or one. In addition, the layout manner between the heat dissipation fan 301 and the heat receiving member 70 is not limited to this, and in other examples, the two heat dissipation fans 301 and the heat receiving member 70 may be arranged in sequence in the Y-axis direction, and the heat receiving member 70 may be located between the two heat dissipation fans 301 or may not be located between the two heat dissipation fans 301.

Specifically, the number of the first portions 3021 is two, and the two first portions 3021 are respectively located at both ends of the second portion 3022 in the X-axis direction. The two first portions 3021, the two radiator fans 301, and the heat sinks 303 at the fan outlets 3012 of the two radiator fans 301 correspond one to one. Each first portion 3021 is in thermally conductive communication with a corresponding heat sink 303.

In some examples, the material of the thermal conductor 302 may be copper. The good and ductility of metallic copper's thermal conductivity is higher, adopts metallic copper material preparation heat-conducting piece 302, can be when guaranteeing heat-conducting piece 302 thermal conductivity, makes heat-conducting piece 302 thin, has reduced heat-conducting piece 302's occupation space, can compromise electronic equipment 1000's radiating efficiency and frivolous design simultaneously.

In some examples, the thermal conductor 302 may be a heat pipe. The heat pipe comprises a pipe shell, a liquid absorption core and an end cover, wherein the pipe shell is of a hollow structure, and the liquid absorption core covers the inner wall of the pipe shell. Pumping the tube into negative pressure, filling a proper amount of working liquid, filling liquid into the capillary porous material of the liquid absorption core tightly attached to the inner wall of the tube, and sealing by an end cover. When one end (namely an evaporation section) of the heat pipe is heated, the liquid in the liquid absorption core is evaporated and vaporized, the vapor flows to the other end (namely a condensation section) under a tiny pressure difference to release heat and condense into liquid, and the liquid flows back to the evaporation section along the porous material under the action of capillary force. The heat is transferred to the heat sink 303 uniformly, and then dissipated by air, thereby improving the heat dissipation efficiency of the electronic device 1000 to a certain extent.

In other embodiments, the thermal conductor 302 may also be a thermal spreader. The vapor chamber is a vacuum chamber having a fine structure on the inner wall, and is usually made of copper, and the inside of the vacuum chamber is filled with a cooling liquid. When heat is conducted to the evaporation section from the heat source, the cooling liquid in the vacuum cavity starts to generate the gasification phenomenon of the cooling liquid after being heated in the environment with low vacuum degree, at the moment, heat energy is absorbed, the volume rapidly expands, the whole vacuum cavity is rapidly filled with gaseous cooling medium, and the condensation phenomenon can be generated when the gaseous working medium contacts a relatively cold area. The heat accumulated during evaporation is released by the condensation phenomenon, and the condensed cooling liquid returns to the evaporation heat source by the capillary tube of the microstructure, so that the operation is performed in the cavity repeatedly, a rapid heat transfer effect is achieved, the cooling liquid is uniformly distributed to the heat sink 303, and the heat energy is dissipated by air, so that the heat dissipation efficiency of the electronic device 1000 can be improved to a certain extent.

With continued reference to fig. 24-26, a foot pad device 50 is disposed on a side of the heat dissipation fan 301 away from the heat receiving member 70 in the X-axis direction. Also, in the Z-axis direction, the air duct 60 and the first portion 3021 are on the same side of the heat sink 303.

In some examples, the first portion 3021 is between the airway tube 60 and the heat sink 303 in the Z-axis direction. In other examples, referring to fig. 26, the airway tube 60 and the first portion 3021 are arranged in the Y-axis direction.

In order to improve the expansion and contraction effect of the sealed air chamber, the first part 3021 is in heat-conducting connection with the air duct 60. Illustratively, the first portion 3021 may be connected to the airway tube 60 by a thermally conductive silicone grease or adhesive or other thermally conductive medium.

Referring to fig. 27, fig. 27 is a cross-sectional view of a footpad assembly 50 in accordance with still other embodiments of the present application. The embodiment shown in fig. 27 differs from the embodiment shown in fig. 9-26 in that: the foot pad device 50 includes an air bladder 507. The air bag 507 has a regulating air chamber 50a. And the air chambers are fixedly connected with the moving legs 503 and the fixed members 504, respectively. Thus, when the air pressure in the air-conditioning chamber 50a increases, the air in the air-conditioning chamber 50a inflates the air bag 507, and the movable leg 503 is pushed by the air bag 507 to move in the Z-axis direction away from the fixed end 504a. When the air pressure in the adjustment air chamber 50a decreases, the volume of the air bag 507 decreases, so that the air bag 507 can drive the moving leg 503 to move along the Z-axis direction toward the fixed end 504a. Therefore, the height of the movable foot 503 protruding from the bottom surface of the supporting bottom plate 2021 can be adjusted, and the structure is simple and the cost is low.

On this basis, when the movable leg 503 and the fixed member 504 enclose a cavity, the air bag 507 can be accommodated in the cavity. In this way, airbag 507 can be protected by movable leg 503 and fixing member 504, and reliability of use of airbag 507 can be improved. In other examples, the fixed part 504 and the moving foot 503 do not form a cavity, so long as the air bag 507 is ensured between the moving foot 503 and the fixed part 504.

With continued reference to fig. 27, bladder 507 includes a bladder body 5071 and a nipple 5072. The surface of the fixed plate 5041 facing the moving leg 503 is provided with a stopper 50413. The retaining ring 50413 is disposed around the through hole 50412. The nipple 5072 is fitted around the outer circumference of the stopper 50413, so that the air-conditioning chamber 50a and the air-conducting chamber 70a can be communicated with each other. Illustratively, the nipple 5072 and the stop 50413 may have an interference fit, which may improve the reliability of the fit. In other examples, after the nipple 5072 is fitted over the limiting ring 50413, a strap may be wrapped around the periphery of the nipple 5072 to secure the nipple 5072 to the periphery of the limiting ring 50413.

Referring to fig. 28, fig. 28 is a schematic view of the bladder 507 of the footpad apparatus 50 in fig. 27. The peripheral wall of the airbag main body 5071 has a plurality of peaks and a plurality of valleys. The wave crests extend over the entire circumference of the balloon 507. The wave troughs extend over the entire circumference of the balloon 507. The wave crests and the wave troughs are alternately arranged in the Z-axis direction. Illustratively, bladder 507 may be configured in a bellows-like shape. This arrangement is more advantageous for the air bag 507 to extend or contract in the Z-axis direction, and is more advantageous for the air bag 507 to move the moving foot 503.

The material of the air bag 507 includes, but is not limited to, metal, rubber, plastic, or silicone.

Referring to fig. 29, fig. 29 is a partial cross-sectional view of a keyboard host 100 according to some other embodiments of the present application, and fig. 24 is different from the embodiments shown in fig. 9-26 in that: the foot pad device 50 is located on the side of the bottom surface of the support base 2021 that faces. Foot pad assembly 50 may be secured to the underside of support base 2021 by way of a mounting plate 5041. Illustratively, the fixing plate 5041 and the supporting base plate 2021 may be connected by gluing, clamping, screwing, welding or the like.

On the basis, the supporting base plate 2021 has a through hole 20211. The through hole 20211 may be used to communicate the regulating air chamber 50a and the heat conductive air chamber 70a. Illustratively, the through hole 20211 is aligned with and communicates with the through hole 50412 in the fixed disk 5041. The air nozzle 60a is respectively communicated with the through hole 20211 and the air duct 60.

Referring to fig. 30, fig. 30 is a partial cross-sectional view of a keyboard host 100 according to other embodiments of the present application. The foot pad device 50 no longer includes the fixed member 504 and the movable foot 503, but rather is comprised of one air bladder member. The material of the airbag component includes but is not limited to rubber, plastic or silica gel. Illustratively, the structure of the airbag component may be the same as the construction of the airbag 507 in the above-described embodiment.

In the description herein, particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present application.

Claims

1. An electronic device, comprising:

a support chassis having a top surface and a bottom surface oppositely disposed in a first direction;

the heating device is positioned on one side, which is faced by the top surface of the supporting bottom plate;

the heating part is positioned on one side, facing the top surface of the supporting base plate, of the supporting base plate and is in heat conduction connection with the heating device, and a heat conduction air cavity is formed in the heating part;

the foot pad device is provided with a fixed end and a telescopic end which are opposite to each other in the first direction, the fixed end points to the direction of the telescopic end and the direction of the top surface of the supporting bottom plate points to the bottom surface of the supporting bottom plate are consistent, the fixed end and the supporting bottom plate are relatively fixed, the foot pad device is provided with a first state, the telescopic end protrudes out of the bottom surface of the supporting bottom plate, the foot pad device is provided with an adjusting air cavity, the adjusting air cavity is communicated with the heat conduction air cavity to form a sealed air cavity, and the foot pad device stretches out and draws back in the first direction due to the change of expansion and contraction of air in the sealed air cavity so as to at least adjust the height of the telescopic end protruding out of the bottom surface of the supporting bottom plate in the first state.

2. The electronic device according to claim 1, wherein the foot pad means includes a fixed member having the fixed end and a movable foot connected to the fixed member and movable in a first direction with respect to the fixed member, an end of the movable foot remote from the fixed member is a telescopic end, and the adjustment air chamber is located between the movable foot and the fixed member.

3. The electronic device according to claim 2, wherein the fixed member and the movable foot enclose a cavity, and the cavity serves as the conditioned air chamber.

4. The electronic device of claim 2, wherein the foot pad assembly includes an air bag having the air-conditioning chamber, the air bag being fixedly coupled to the movable foot and the fixed member, respectively.

5. The electronic device of claim 4, wherein the fixed member and the movable foot enclose a cavity configured to receive the bladder.

6. The electronic device according to claim 4 or 5, wherein the peripheral wall of the air bag has a plurality of peaks and a plurality of valleys, the peaks and the valleys being alternately arranged in the first direction.

7. The electronic device according to claim 3 or 5, wherein the fixing member includes a fixing disk and an annular fixing ring, the fixing disk has the fixing end, an axial end of the fixing ring is connected to a surface of the fixing disk facing the movable foot to form a first cavity with the fixing disk, and the cavity includes at least a part of the first cavity.

8. The electronic device according to claim 3, 5 or 7, wherein the moving foot comprises a connecting plate and a ring-shaped connecting ring, one end of the connecting ring is connected to a periphery of an edge of the connecting plate, the other end of the connecting ring extends towards the fixing part to form a second cavity with the connecting plate, and the cavity comprises at least part of the second cavity.

9. The electronic device according to claim 8, wherein the fixing member includes a fixed disk having the fixing end and an annular fixed ring having an axial end connected to a surface of the fixed disk facing the moving foot;

wherein, the clamping ring set up in the periphery of retainer plate, perhaps, the retainer plate set up in the periphery of clamping ring.

10. The electronic device of claim 9, wherein the foot pad arrangement further comprises a flexible sealing ring sealed between the connecting ring and the fixing ring.

11. The electronic device of any of claims 2-10, wherein the foot pad arrangement further comprises a disengagement prevention latch, the fixed member being fixedly connected to the disengagement prevention latch, and the movable foot being movably connected to the disengagement prevention latch in the first direction.

12. The electronic device of claim 11, wherein the fixing member includes a fixing plate having a catching hole penetrating the fixing plate in a first direction,

the anti-drop clamping piece comprises a clamping portion, and the clamping portion is clamped in the clamping hole.

13. The electronic device of claim 12, wherein the engaging hole comprises a first hole section and a second hole section, the first hole section is located on a side of the second hole section away from the moving foot and is communicated with the second hole section, and a cross-sectional area of the first hole section is larger than a cross-sectional area of the second hole section to form a step;

the clamping part is supported on the step part and clamped in the first hole section;

the anti-drop clamping piece further comprises a sliding rod, the sliding rod is fixedly connected with the surface of the clamping portion, facing the second hole section, and penetrates through the second hole section.

14. The electronic device according to any one of claims 11 to 13, wherein the moving foot includes an annular connecting ring having a sliding groove on an outer peripheral surface thereof, the sliding groove extending in a first direction to a side end surface of the connecting ring facing the fixed member to form an opening;

the anti-drop clamping piece comprises a sliding rod, the sliding rod penetrates through the opening, part of the sliding rod is located in the sliding groove, and the sliding rod is in sliding fit with the sliding groove in the first direction.

15. The electronic device according to claim 14, wherein the sliding grooves have first anti-slip projections on groove walls thereof that are oppositely disposed in a circumferential direction of the moving leg, respectively;

the sliding rod is located on the side walls, opposite to each other, of the part in the sliding groove, second anti-falling bumps are arranged on the side walls, opposite to each other, of the part in the sliding groove, and the second anti-falling bumps are opposite to the first anti-falling bumps in the first direction and located on one side, far away from the fixed end, of the first anti-falling bumps.

16. The electronic device according to any one of claims 11 to 15, wherein the anti-disengagement snap-in members are plural, and the plural anti-disengagement snap-in members are distributed at intervals in a circumferential direction of the moving foot.

17. The electronic device of any of claims 2-16, comprising: the adjusting air cavity is communicated with the heat conducting air cavity by means of the air guide tube.

18. The electronic device of any of claims 2-17, wherein the electronic device comprises a housing having the support chassis, and wherein the heat generating component and the heat receiving component are both located within the housing.

19. The electronic device of claim 18, wherein the housing has an intake vent and an exhaust vent, the intake vent being on the support floor;

the electronic equipment further comprises a heat dissipation fan and a heat conducting piece, wherein the heat dissipation fan is provided with a fan inlet and a fan outlet, the fan inlet is communicated with the air inlet, the fan outlet is communicated with the air outlet, and a heat radiator is arranged between the fan outlet and the air outlet;

the heat conducting member includes a first portion and a second portion, the first portion being in thermally conductive communication with the heat sink, the second portion being in thermally conductive communication with the heat generating device.

20. The electronic device of claim 19, wherein the heat receiving member, the heat generating device, and the second portion are on a same side of the heat dissipation fan in a second direction, and the second portion is stacked between the heat receiving member and the heat generating device in the first direction, and is thermally conductive with the heat receiving member, wherein the second direction is perpendicular to the first direction.

21. The electronic device of claim 20, wherein the heat receiving part has a first surface facing the heat generating device, an orthogonal projection of the second portion on the first surface overlaps the first surface to form an overlapping region, an area of the first surface excluding the overlapping region is a non-overlapping region, the heat generating device has a first heat generating portion in the non-overlapping region at the orthogonal projection of the first surface, the first heat generating portion is in thermal conduction with the heat receiving part in the non-overlapping region, a second heat generating portion in the overlapping region at the orthogonal projection of the first surface, the second heat generating portion is in thermal conduction with the second portion, and the second portion is in thermal conduction with the heat receiving part in the overlapping region.

22. The electronic apparatus according to claim 20 or 21, wherein a surface of the heat receiving member facing the heat generating device has an avoiding groove, and the second portion is fitted in the avoiding groove.

23. The electronic device of any one of claims 20-22, wherein the foot pad means and the heat receiving member are located on opposite sides of the heat dissipation fan in the second direction, and the conditioned air chamber is in communication with the conductive air chamber via an air duct in thermally conductive communication with the first portion.

24. The electronic device according to any one of claims 1-23, wherein the supporting base plate has a through hole, the foot pad device is disposed through the through hole, and the fixed end is located on a side of the supporting base plate facing the top surface.

25. The electronic device of any of claims 1-24, wherein the telescoping end always protrudes above the bottom surface of the support base.