CN114921200A - Compound dust-binding adhesive, and components, preparation method and application thereof - Google Patents
Compound dust-binding adhesive, and components, preparation method and application thereof Download PDFInfo
- Publication number
- CN114921200A CN114921200A CN202210468286.0A CN202210468286A CN114921200A CN 114921200 A CN114921200 A CN 114921200A CN 202210468286 A CN202210468286 A CN 202210468286A CN 114921200 A CN114921200 A CN 114921200A
- Authority
- CN
- China
- Prior art keywords
- parts
- weight
- compound
- dust
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/02—Homopolymers or copolymers of acids; Metal or ammonium salts thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/04—Acids; Metal salts or ammonium salts thereof
- C08F220/06—Acrylic acid; Methacrylic acid; Metal salts or ammonium salts thereof
Abstract
The invention discloses a compound dust-binding adhesive, and components, a preparation method and application thereof, wherein the viscosity of the compound dust-binding adhesive before curing is 300-500 MPa s, the specific gravity of the compound adhesive dust is 1.08Kg/L, the bonding strength of the cured compound adhesive dust is 2-3 MPa, the hardness value of the cured compound dust-binding adhesive is 55-65 Shore A, the curing of the compound dust-binding adhesive is completed within 25-35 minutes at the temperature of 5-35 ℃ and the relative humidity of 5-60% before curing, the cost of the compound dust-binding adhesive is low, the production cost of enterprises is reduced, meanwhile, the compound dust-binding adhesive is produced by adopting materials such as acrylic acid, methyl acrylate, hydroxyethyl acrylate and the like, has excellent water resistance, aging resistance and weather resistance, is suitable for various environments, has strong applicability, and has multiple purposes of dust adsorption, plastic or metal bonding and the like.
Description
Technical Field
The invention relates to a dust-binding adhesive, in particular to a compound dust-binding adhesive, and components, a preparation method and application thereof, which are applied to the technical field of dust-binding adhesives.
Background
With the development of society and the advancement of technology, the coming and continuous development of the internet era, the living standard of people is higher and higher, the requirement on the quality of life is higher and higher, and the requirement on electronic products is higher and higher. The camera has important application in smart phones, bracelets, notebook computers and the like to acquire images or pictures.
The shooting that accompanies people requires more and more highly, and its camera module is when dispatching from the factory, for preventing that the dust from entering into the camera module, influences the performance of camera module, needs to install the protection meson outside the camera module to protect the camera module.
However, in the production process of the protective mesons, the transportation process of the protective mesons and the installation process of the camera module, dust may enter, so that the performance of the camera module is affected, the problems of high defective rate and high production cost are caused.
Disclosure of Invention
Aiming at the fact that no dust-sticking adhesive for removing dust and foreign matters is found in the prior art, the invention provides the compound dust-sticking adhesive and the components, the preparation method and the application thereof.
The technical scheme adopted by the invention for solving the technical problems is as follows: the viscosity of the compound dust-binding adhesive before curing is 300-500 MPa & s, the specific gravity of the compound dust-binding adhesive is 1.08Kg/L, the bonding strength of the compound dust-binding adhesive after curing is 2-3 MPa, the hardness value of the compound dust-binding adhesive after curing is 55-65 Shore A, and the curing is completed within 25-35 minutes at the temperature of 5-35 ℃ and the relative humidity of 5-60% before curing.
Further, before the compound dust-binding adhesive is cured, the curing is accelerated at the temperature of 50-80 ℃.
Further, the appearance of the compound adhesive dust glue before curing is milky white, and the appearance of the compound adhesive dust glue after curing is transparent.
The compound dust-binding adhesive comprises, by weight, 20-30 parts of acrylic acid, 15-25 parts of methyl acrylate, 5-10 parts of hydroxyethyl acrylate, 5-6 parts of a blocked polyurethane emulsion, 0.5-2 parts of a surfactant, 1-5 parts of a leveling agent, 0.5-2 parts of an antibacterial agent and 2-5 parts of a thickening agent.
Further, the compound dust-binding adhesive comprises 23-27 parts by weight of acrylic acid, 18-22 parts by weight of methyl acrylate, 7-8 parts by weight of hydroxyethyl acrylate, 5.4-5.6 parts by weight of end-capped polyurethane emulsion, 1-1.5 parts by weight of surfactant, 2.5-3 parts by weight of leveling agent, 1-1.5 parts by weight of antibacterial agent and 3-4 parts by weight of thickening agent.
Further, the compound dust-binding adhesive comprises 25 parts by weight of acrylic acid, 20 parts by weight of methyl acrylate, 7.5 parts by weight of hydroxyethyl acrylate, 5.5 parts by weight of blocked polyurethane emulsion, 1.25 parts by weight of surfactant, 2.75 parts by weight of leveling agent, 1.25 parts by weight of antibacterial agent and 3.5 parts by weight of thickening agent.
A preparation method of the compound dust-binding adhesive comprises the following steps:
1. placing 20-30 parts by weight of acrylic acid, 15-25 parts by weight of methyl acrylate, 5-10 parts by weight of hydroxyethyl acrylate and 45-55 parts by weight of water in reaction equipment, heating to raise the temperature of the mixture to 70-90 ℃, preserving the heat for 2-5 hours, and stirring;
2. stopping heating the mixture, cooling to 60 ℃, preserving heat, dropwise adding end-capped polyurethane emulsion, heating to 70-90 ℃, preserving heat, modifying by end-capped polyurethane emulsion juice for 1-1.5 hours, and cooling to room temperature to obtain a mixture;
3. and (2) sequentially adding 0.5-2 parts by weight of a surfactant, 1-5 parts by weight of a leveling agent, 0.5-2 parts by weight of an antibacterial agent and 2-5 parts by weight of a thickening agent into the mixture in a compound mixing device, uniformly mixing, and standing for 24 hours to prepare the compound dust-binding adhesive.
Further, the number of stirring rotations is 1000 to 3000 rpm.
Furthermore, the dropping speed of the blocked polyurethane emulsion is 0.4-0.5 kg/min.
The application of the compound dust-binding adhesive is characterized in that the compound dust-binding adhesive is used for adsorbing dust; or for bonding to plastics or metals.
The invention has the beneficial effects that: the compound dust-binding adhesive has low cost, is beneficial to reducing the production cost of enterprises, is produced from materials such as acrylic acid, methyl acrylate, hydroxyethyl acrylate and the like, has excellent water resistance, aging resistance and weather resistance, is suitable for various environments, has strong applicability, and has multiple purposes of dust adsorption, plastic or metal bonding and the like.
Detailed Description
In order that the above objects, features and advantages of the present invention may be more clearly understood, the present invention is described in further detail below with reference to specific embodiments, it should be noted that the embodiments and features of the embodiments of the present application may be combined with each other without conflict.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, however, the present invention may be practiced otherwise than as specifically described herein, and thus the scope of the present invention is not limited by the specific embodiments disclosed below.
The performance test criteria used in the following examples were:
the viscosity is measured according to the GB/T2794-2013 standard;
the specific gravity was determined according to GB/T13354-;
the bonding strength is measured according to the GB/T2792-2014 standard;
the hardness was measured according to GB/T2411-2008 standard.
Example 1, a method of making a compound dusting glue, the method comprising the steps of:
1.25 parts by weight of acrylic acid, 20 parts by weight of methyl acrylate, 7.5 parts by weight of hydroxyethyl acrylate and 50 parts by weight of water were placed in a reaction apparatus, and the mixture was heated to 80 ℃ and kept at the temperature for 3 hours while stirring with the number of stirring revolutions of 2000 rpm.
2. Stopping heating the mixture, cooling to 60 ℃, keeping the temperature, dropwise adding the end-capped polyurethane emulsion, wherein the acceleration rate of liquid drops is 0.5 kg/min and 5.5 parts by weight in total, heating to 80 ℃, keeping the temperature, modifying by end-capped polyurethane emulsion juice for 1.5 hours, cooling to room temperature, and discharging the mixture, wherein the temperature can be cooled by water cooling or air cooling.
3. The mixture is added with 1.25 weight parts of surfactant, 2.75 weight parts of flatting agent, 1.25 weight parts of antibacterial agent and 3.5 weight parts of thickening agent in a compound mixing device in sequence, and after being uniformly mixed, the mixture is kept stand for 24 hours to prepare the compound dust-sticking adhesive.
Example 2, a method of making a compound dusting glue, comprising the steps of:
1. 20 parts by weight of acrylic acid, 15 parts by weight of methyl acrylate, 5 parts by weight of hydroxyethyl acrylate and 45 parts by weight of water were placed in a reaction apparatus, and the mixture was heated to 70 ℃ and kept warm for 5 hours while stirring at 3000 rpm.
2. Stopping heating the mixture, cooling to 60 ℃, keeping the temperature, dropwise adding the end-capped polyurethane emulsion, wherein the acceleration rate of liquid drops is 0.5 kg/min, and the total weight is 5 parts, heating to 80 ℃, keeping the temperature, modifying by end-capped polyurethane emulsion juice for 1.5 hours, cooling to room temperature, and discharging the mixture, wherein the temperature can be cooled by water cooling or air cooling.
3. And (3) sequentially adding 2 parts by weight of surfactant, 5 parts by weight of flatting agent, 2 parts by weight of antibacterial agent and 5 parts by weight of thickening agent into the mixture in a compound mixing device, uniformly mixing, and standing for 24 hours to prepare the compound dust-binding adhesive.
Example 3, a method of making a compound dusting glue, comprising the steps of:
1. placing 30 parts by weight of acrylic acid, 25 parts by weight of methyl acrylate, 10 parts by weight of hydroxyethyl acrylate and 55 parts by weight of water in reaction equipment, heating the mixture to 90 ℃, preserving the temperature for 2 hours, and stirring, wherein the stirring rotation frequency is 1000 rpm;
2. stopping heating the mixture, cooling to 60 ℃, keeping the temperature, dropwise adding the end-capped polyurethane emulsion, wherein the acceleration rate of liquid drops is 0.5 kg/min, and is 6 parts by weight in total, heating to 80 ℃, keeping the temperature, modifying by end-capped polyurethane emulsion juice for 1 hour, cooling to room temperature, and discharging the mixture, wherein the temperature can be cooled by water cooling or air cooling.
3. The mixture is added with 2 weight parts of surfactant, 3 weight parts of flatting agent, 1.25 weight parts of antibacterial agent and 4 weight parts of thickening agent in sequence in a compound mixing device, and after being uniformly mixed, the mixture is kept stand for 24 hours to prepare the compound dust-binding adhesive.
Example 4, a method of making a compound dusting glue, comprising the steps of:
1. placing 27 parts by weight of acrylic acid, 22 parts by weight of methyl acrylate, 7 parts by weight of hydroxyethyl acrylate and 50 parts by weight of water in reaction equipment, heating the mixture to 80 ℃, preserving the temperature for 3 hours, and stirring, wherein the stirring rotation frequency is 2000 rpm;
2. stopping heating the mixture, cooling to 60 ℃, keeping the temperature, dropwise adding the end-capped polyurethane emulsion, wherein the acceleration rate of liquid drops is 0.5 kg/min and 5.5 parts by weight in total, heating to 80 ℃, keeping the temperature, modifying by end-capped polyurethane emulsion juice for 1.5 hours, cooling to room temperature, and discharging the mixture, wherein the temperature can be cooled by water cooling or air cooling.
3. The mixture is added with 1.5 weight parts of surfactant, 2.5 weight parts of flatting agent, 51 weight parts of antibacterial agent and 3 weight parts of thickening agent in sequence in a compound mixing device, and after being uniformly mixed, the mixture is kept stand for 24 hours to prepare the compound dust-binding adhesive.
The compound dust-binding adhesive prepared by the method can be used for adsorbing dust; or the adhesive is used for bonding plastic or metal, the viscosity of the compound dust-binding adhesive before curing is 300-500 MPa & s, the specific gravity of the compound dust-binding adhesive is 1.08Kg/L, the bonding strength of the compound dust-binding adhesive after curing is 2-3 MPa, and the hardness value of the compound dust-binding adhesive after curing is 55-65 Shore A. The visual appearance of the compound dust-binding adhesive is milky white before curing, and the visual appearance of the compound dust-binding adhesive is transparent after curing.
Before the compound dust-binding glue is cured, the curing is completed within 25-35 minutes at the temperature of 5-35 ℃ and the relative humidity of 5-60%. Furthermore, before the compound dust-binding glue is cured, the curing is accelerated at the temperature of 50-80 ℃.
The reaction equipment can be a high-speed dispersion emulsion machine, the model IKA-2000 is preferred, the compound mixing equipment can be a homogeneous emulsifying pan GMT-100, the surfactant can be fatty alcohol polyoxyethylene ether AEO-7, the leveling agent can be Pick BYK-348, the antibacterial agent can be Dimei RP-4, the thickening agent can be carboxymethyl cellulose CMC-10, and other similar substances can be selected for substitution.
It is to be understood that the invention is not limited to the examples described above, but that modifications and variations may be effected thereto by those of ordinary skill in the art in light of the foregoing description, and that all such modifications and variations are intended to be within the scope of the invention as defined by the appended claims.
Claims (10)
1. The compound dust-binding adhesive is characterized by having a viscosity of 300-500 MPa & s before curing, a specific gravity of 1.08Kg/L, a bonding strength of 2-3 MPa after curing, a hardness value of 55-65 Shore A after curing, and a curing time of 25-35 minutes at a temperature of 5-35 ℃ and a relative humidity of 5-60% before curing.
2. The compound adhesive dust glue of claim 2, wherein the compound adhesive dust glue is accelerated to cure at a temperature of 50-80 ℃ before curing.
3. The compound dusting glue of claim 2 where the compound dusting glue is milky white in visual appearance before curing and transparent after curing.
4. The composition of claim 3, wherein the composition comprises 20 to 30 parts by weight of acrylic acid, 15 to 25 parts by weight of methyl acrylate, 5 to 10 parts by weight of hydroxyethyl acrylate, 5 to 6 parts by weight of a blocked polyurethane emulsion, 0.5 to 2 parts by weight of a surfactant, 1 to 5 parts by weight of a leveling agent, 0.5 to 2 parts by weight of an antibacterial agent, and 2 to 5 parts by weight of a thickener.
5. The composition of the compound dust-binding adhesive according to claim 4, wherein the compound dust-binding adhesive comprises 23 to 27 parts by weight of acrylic acid, 18 to 22 parts by weight of methyl acrylate, 7 to 8 parts by weight of hydroxyethyl acrylate, 5.4 to 5.6 parts by weight of blocked polyurethane emulsion, 1 to 1.5 parts by weight of surfactant, 2.5 to 3 parts by weight of leveling agent, 1 to 1.5 parts by weight of antibacterial agent and 3 to 4 parts by weight of thickener.
6. The composition of claim 4, wherein the composition comprises 25 parts by weight of acrylic acid, 20 parts by weight of methyl acrylate, 7.5 parts by weight of hydroxyethyl acrylate, 5.5 parts by weight of blocked polyurethane emulsion, 1.25 parts by weight of surfactant, 2.75 parts by weight of leveling agent, 1.25 parts by weight of antibacterial agent, and 3.5 parts by weight of thickener.
7. A method of making the compound of claim 1, comprising the steps of:
1. placing 20-30 parts by weight of acrylic acid, 15-25 parts by weight of methyl acrylate, 5-10 parts by weight of hydroxyethyl acrylate and 45-55 parts by weight of water in reaction equipment, heating to raise the temperature of the mixture to 70-90 ℃, preserving the heat for 2-5 hours, and stirring;
2. stopping heating the mixture, cooling to 60 ℃, preserving heat, dropwise adding the end-capped polyurethane emulsion, heating to 70-90 ℃, preserving heat, modifying by using end-capped polyurethane emulsion juice for 1-1.5 hours, and cooling to room temperature to obtain a mixture;
3. and (2) sequentially adding 0.5-2 parts by weight of a surfactant, 1-5 parts by weight of a leveling agent, 0.5-2 parts by weight of an antibacterial agent and 2-5 parts by weight of a thickening agent into the mixture in a compound mixing device, uniformly mixing, and standing for 24 hours to prepare the compound dust-binding adhesive.
8. The method for preparing a compound dust-binding adhesive according to claim 7, wherein the number of stirring rotations is 1000-3000 rpm.
9. The method of claim 7, wherein the dropping rate of the blocked polyurethane emulsion is 0.4-0.5 kg/min.
10. Use of a compound dusting powder according to claim 1 for the adsorption of dust; or for bonding to plastics or metals.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210468286.0A CN114921200A (en) | 2022-04-29 | 2022-04-29 | Compound dust-binding adhesive, and components, preparation method and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210468286.0A CN114921200A (en) | 2022-04-29 | 2022-04-29 | Compound dust-binding adhesive, and components, preparation method and application thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114921200A true CN114921200A (en) | 2022-08-19 |
Family
ID=82806111
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210468286.0A Pending CN114921200A (en) | 2022-04-29 | 2022-04-29 | Compound dust-binding adhesive, and components, preparation method and application thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114921200A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104163884A (en) * | 2013-05-20 | 2014-11-26 | 3M创新有限公司 | Curable acrylic acid compound, acrylic acid adhesive tape, acrylic acid rubber roller, and preparation method of acrylic acid rubber roller |
| EP3162864A1 (en) * | 2015-11-02 | 2017-05-03 | Shin-Etsu Chemical Co., Ltd. | Adhesion promoter, addition curable organopolysiloxane resin composition and semiconductor apparatus |
| CN110016306A (en) * | 2019-03-13 | 2019-07-16 | 广东京华新材料科技股份有限公司 | A kind of Dust adhering roller film glue and preparation method thereof |
| CN110655900A (en) * | 2019-10-24 | 2020-01-07 | 上海昀通电子科技有限公司 | Ultraviolet curing cleaning glue, preparation method and application thereof |
| CN111909631A (en) * | 2020-08-24 | 2020-11-10 | 临沂天勤塑业有限公司 | Bactericidal emulsion pressure-sensitive adhesive, dust-sticking pad and preparation method thereof |
-
2022
- 2022-04-29 CN CN202210468286.0A patent/CN114921200A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104163884A (en) * | 2013-05-20 | 2014-11-26 | 3M创新有限公司 | Curable acrylic acid compound, acrylic acid adhesive tape, acrylic acid rubber roller, and preparation method of acrylic acid rubber roller |
| EP3162864A1 (en) * | 2015-11-02 | 2017-05-03 | Shin-Etsu Chemical Co., Ltd. | Adhesion promoter, addition curable organopolysiloxane resin composition and semiconductor apparatus |
| CN110016306A (en) * | 2019-03-13 | 2019-07-16 | 广东京华新材料科技股份有限公司 | A kind of Dust adhering roller film glue and preparation method thereof |
| CN110655900A (en) * | 2019-10-24 | 2020-01-07 | 上海昀通电子科技有限公司 | Ultraviolet curing cleaning glue, preparation method and application thereof |
| CN111909631A (en) * | 2020-08-24 | 2020-11-10 | 临沂天勤塑业有限公司 | Bactericidal emulsion pressure-sensitive adhesive, dust-sticking pad and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105255418B (en) | A kind of preparation method of high transparency flexible-epoxy adhesive | |
| CN103013401B (en) | Binder composition and bonding film | |
| CN105086916A (en) | High-light-transmittance UV-moisture dual-curing adhesive | |
| CN113372842B (en) | Antistatic polyurethane protective film and preparation method thereof | |
| CN106189802B (en) | A kind of solvent-free high non-yellow stain polyurethane mirror surface resin and preparation method thereof thoroughly of UV solidification | |
| CN104379694B (en) | Polarization plates adhesive composite, with the polarization plates of bonding agent and display device | |
| CN105368297B (en) | high-temperature-resistant vacuum plating UV coating and preparation method and application thereof | |
| CN107057612A (en) | A kind of high transmission rate acrylate pressure sensitive adhesive and preparation method thereof | |
| CN105295783A (en) | Adhesive composition and display device | |
| CN104974709A (en) | UV moisture dual-curing type acrylate pressure-sensitive adhesive and preparation method thereof | |
| CN108913007A (en) | A kind of greasy dirt mattess oil rub resistance primer resin and its synthetic method | |
| CN111732887A (en) | Solvent-based spray photocuring antibacterial coating and preparation method and application thereof | |
| CN107756579A (en) | A kind of production method of anti-corrosion bamboo flooring | |
| CN102102007A (en) | Radiation cured adhesive for indium tin oxide (ITO) circuit and module protection | |
| CN114058313B (en) | High-adhesion thermosetting adhesive film and preparation method and application thereof | |
| CN113773771B (en) | Pressure-sensitive adhesive with low stripping force and polaroid | |
| CN107541173B (en) | A kind of solar energy backboard adhesive and preparation method thereof | |
| CN114921200A (en) | Compound dust-binding adhesive, and components, preparation method and application thereof | |
| CN102391470A (en) | Preparation method for ionic liquid terminated polyurethane acrylate | |
| CN103834326B (en) | High strength single-component carpenter splicing adhesive and preparation method thereof | |
| CN113528041A (en) | Flame-retardant antistatic protective film and preparation method thereof | |
| CN110819282B (en) | Epoxy-based long-afterglow fluorescent anti-slip adhesive and preparation method thereof | |
| CN105745294A (en) | Surface-protecting adhesive sheet, and method for using surface-protecting adhesive sheet | |
| WO2015058679A1 (en) | Aqueous bicomponent acrylic acid-polyurethane resin and preparation method therefor | |
| MX2009006131A (en) | Unsaturated polyester resins functionalised by unsaturated cycloaliphatic imides for coating and moulding compositions. |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |