CN114910188A - Temperature detection control device for processing head of fiber laser - Google Patents

Temperature detection control device for processing head of fiber laser Download PDF

Info

Publication number
CN114910188A
CN114910188A CN202210323415.7A CN202210323415A CN114910188A CN 114910188 A CN114910188 A CN 114910188A CN 202210323415 A CN202210323415 A CN 202210323415A CN 114910188 A CN114910188 A CN 114910188A
Authority
CN
China
Prior art keywords
temperature
module
processing head
fiber laser
cylinder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202210323415.7A
Other languages
Chinese (zh)
Inventor
熊云
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CN202210323415.7A priority Critical patent/CN114910188A/en
Publication of CN114910188A publication Critical patent/CN114910188A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01KMEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K13/00Thermometers specially adapted for specific purposes
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01KMEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/02Means for indicating or recording specially adapted for thermometers
    • G01K1/024Means for indicating or recording specially adapted for thermometers for remote indication
    • GPHYSICS
    • G08SIGNALLING
    • G08CTRANSMISSION SYSTEMS FOR MEASURED VALUES, CONTROL OR SIMILAR SIGNALS
    • G08C17/00Arrangements for transmitting signals characterised by the use of a wireless electrical link
    • G08C17/02Arrangements for transmitting signals characterised by the use of a wireless electrical link using a radio link
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/02Constructional details
    • H01S3/04Arrangements for thermal management
    • H01S3/042Arrangements for thermal management for solid state lasers

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Electromagnetism (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Plasma & Fusion (AREA)
  • Optics & Photonics (AREA)
  • Laser Beam Processing (AREA)

Abstract

The invention discloses a temperature detection control device for a fiber laser processing head, and relates to the technical field of laser cladding equipment. The upper end of the wireless temperature measuring device is provided with a storage module, and one side of the storage module is provided with a clamping device. The invention can enable the detection control device to work efficiently in a wireless transmission mode under the combined action of the MCU, the lithium battery, the RF module, the thermosensitive semiconductor and the temperature sensor, avoid the condition that the temperature cannot be detected when the signal is weak, improve the precision of temperature detection, monitor the temperature change condition of the processing head at any time under the combined action of the central processing unit, the power supply module, the temperature display module, the alarm module, the driving circuit and the cooling fan, and avoid the damage of the processing head caused by overhigh temperature.

Description

Temperature detection control device for processing head of fiber laser
Technical Field
The invention relates to the technical field of laser cladding equipment, in particular to a temperature detection control device for a processing head of a fiber laser.
Background
The high-power fiber laser can be used as a light source of equipment for laser cutting, welding, three-dimensional laser forming and the like, and the application field of the high-power fiber laser relates to automobiles, aerospace, energy sources and the like. The output power of the high-power optical fiber laser is from hundreds of watts to dozens of kilowatts, the medium for generating and transmitting laser is a quartz optical fiber, the laser power from a few kilowatts to dozens of kilowatts is generated and transmitted in the quartz optical fiber with the core diameter of dozens of micrometers, and the heat dissipation of the optical fiber and an optical fiber device is important, so the high-power optical fiber laser is extremely important for controlling the internal temperature. The following problems exist in the prior art:
1. the temperature detection control device of the existing fiber laser processing head has low temperature detection efficiency, and can not work normally due to weak signals;
2. the existing temperature detection control device for the processing head of the fiber laser cannot adjust the threshold value of the fiber laser and cannot fix the processing head, so that the temperature detection is blocked.
Disclosure of Invention
In order to solve the technical problems, the technical scheme adopted by the invention is as follows:
the utility model provides a fiber laser processing head temperature detection controlling means, includes the main part, the inside of main part is provided with threshold value adjusting device, one side of threshold value adjusting device is provided with wireless temperature measuring device. The device comprises a wireless temperature measuring device, a storage module, a clamping device, a temperature monitoring device, a control module and a pumping source, wherein the storage module is arranged at the upper end of the wireless temperature measuring device, the clamping device is arranged on one side of the storage module, the temperature monitoring device is arranged on one side of the wireless temperature measuring device, the control module is arranged on one side of the temperature monitoring device, and the pumping source is arranged on the other side of the threshold adjusting device; the temperature monitoring device comprises a central processing unit, a power supply module, a temperature display module, an alarm module, a driving circuit and a cooling fan, wherein the power supply module is positioned at the upper end of the central processing unit, and the driving circuit is positioned at one side of the central processing unit; the power supply module is characterized in that an electric wire is arranged between the central processing unit and the power supply module, the input end of the central processing unit is electrically connected with the output end of the power supply module through the electric wire, a connecting wire is arranged between the driving circuit and the central processing unit, and the output end of the central processing unit is electrically connected with the input end of the driving circuit through the connecting wire.
The technical scheme of the invention is further improved as follows: the temperature display module is positioned on the other side of the central processing unit, the cooling fan is positioned on one side of the driving circuit, and the alarm module is positioned on one side of the temperature display module.
The technical scheme of the invention is further improved as follows: the temperature display device is characterized in that a wire is arranged between the driving circuit and the heat dissipation fan, the output end of the driving circuit is electrically connected with the input end of the heat dissipation fan through the wire, and the output end of the central processing unit is in signal connection with the input end of the temperature display module.
The technical scheme of the invention is further improved as follows: clamping device includes screw thread post, plug, spring, goes up clamp splice, slide bar, clamp splice down, the plug is located one side of screw thread post, the spring is located the lower extreme of screw thread post, it is located the lower extreme of spring to go up the clamp splice, the slide bar is located the lower extreme of clamp splice, the clamp splice is located the lower extreme of slide bar down.
The technical scheme of the invention is further improved as follows: be provided with the spout between slide bar and the lower clamp splice, the lower extreme of slide bar passes through the spout and the upper end swing joint of clamp splice down, be provided with the notch between bolt and the screw thread post, one side of bolt is passed through the notch and can be dismantled with one side of screw thread post and be connected, the lower extreme of spring winding and screw thread post, be provided with the interface between spring and the last clamp splice, the upper end fixed connection of interface and last clamp splice is passed through to the lower extreme of spring.
The technical scheme of the invention is further improved as follows: the threshold value adjusting device comprises a lens cone, a semiconductor refrigerator, a side face vertical groove, a blocking layer and a metal cylinder, wherein the semiconductor refrigerator is located on one side of the lens cone, the blocking layer is located on the other side of the lens cone, the metal cylinder is located on one side of the blocking layer, the side face vertical groove is located at the front end of the lens cone, the semiconductor refrigerator comprises a metal conducting plate, a cylinder, a power supply interface, a cold end and a hot end, the cylinder is located at the upper end and the lower end of the metal conducting plate, the power supply interface is located at the upper end of the cylinder, the cold end is located on one side of the metal conducting plate, and the hot end is located on one side of the cold end.
The technical scheme of the invention is further improved as follows: a connecting hole is arranged between the lens cone and the semiconductor refrigerator, one side of the semiconductor refrigerator is fixedly connected with one side of the lens cone through the connecting hole, a strong glue is arranged between the lens cone and the blocking layer, the other side of the lens cone is fixedly connected with one side of the blocking layer through the strong glue, a clamping groove is arranged between the blocking layer and the metal cylinder, the other side of the blocking layer is detachably connected with one side of the metal cylinder through the clamping groove, a welding block is arranged between the lens cone and the side vertical groove, the rear end of the side vertical groove is fixedly connected with the front end of the lens cone through the welding block, a notch is arranged between the metal current-conducting plate and the cylinder, the lower end of the cylinder is detachably connected with the upper end of the metal current-conducting plate through the notch, an electric wire is arranged between the cylinder and the power interface, and the output end of the power interface is electrically connected with the input end of the cylinder through the electric wire, one side of the cold end is electrically connected with one side of the metal conductive plate through a lead.
The technical scheme of the invention is further improved as follows: the wireless temperature measuring device comprises an MCU, a lithium battery, an RF module, a thermosensitive semiconductor and a temperature sensor, wherein the lithium battery is located inside the MCU, the thermosensitive semiconductor is located on one side of the MCU, the temperature sensor is located on one side of the thermosensitive semiconductor, and the RF module is located at the front end of the thermosensitive semiconductor.
The technical scheme of the invention is further improved as follows: the input end of the thermosensitive semiconductor is electrically connected with the output end of the temperature sensor through a wire, and the input end of the MCU is electrically connected with the output end of the lithium battery through an electric wire.
Due to the adoption of the technical scheme, compared with the prior art, the invention has the technical progress that:
1. the invention provides a fiber laser processing head temperature detection control device, which can enable the detection control device to work efficiently in a wireless transmission mode under the combined action of an MCU, a lithium battery, an RF module, a thermosensitive semiconductor and a temperature sensor, avoid the problem that the temperature cannot be detected when a signal is weak, improve the temperature detection precision, enable the MCU and the RF module to enhance the signal receiving intensity by supplying electric energy through the lithium battery, detect the temperature of a processing head through the temperature sensor, and further improve the temperature detection efficiency through the thermosensitive semiconductor.
2. The invention provides a temperature detection control device for a fiber laser processing head, which can enable the device to be more stable in detection and difficult to generate deviation under the combined action of a threaded column, a plug, a spring, an upper clamping block, a sliding rod and a lower clamping block.
3. The invention provides a temperature detection control device for a processing head of a fiber laser, which can monitor the temperature change condition of the processing head at any time under the combined action of a central processing unit, a power supply module, a temperature display module, an alarm module, a driving circuit and a cooling fan, can prevent the processing head from being damaged due to overhigh temperature, can process the processing head at the first time, receives a temperature signal through the central processing unit, transmits the temperature signal to the temperature display module for displaying, and enables the alarm module to sound if the temperature is overhigh, and the cooling fan to work, thereby effectively cooling the surface of the processing head.
4. The invention provides a temperature detection control device for a processing head of an optical fiber laser, which can effectively adjust the threshold value in the optical fiber laser under the combined action of a lens cone, a metal conductive plate, a cylinder, a power interface, a cold end, a hot end, a side vertical groove, a blocking layer and the metal cylinder, prevent the processing head from being damaged due to overhigh internal heat, provide energy required by electron flow by a direct current power supply on the metal conductive plate, and after the power supply is turned on, an electron cathode starts to pass through the cylinder, the heat is absorbed by the cylinder, the lens cone discharges the heat, the heat is transmitted to the other side from one side to cause temperature difference to form the cold end and the hot end, the cold end is connected with a heat source, and the hot end discharges the heat, thereby achieving the effect of cooling.
Drawings
Fig. 1 is a schematic structural diagram of a fiber laser processing head temperature detection control device of the invention;
FIG. 2 is a schematic structural diagram of a temperature monitoring device according to the present invention;
FIG. 3 is a schematic structural view of the clamping device of the present invention;
FIG. 4 is a schematic structural diagram of a wireless temperature measuring device according to the present invention;
FIG. 5 is a schematic structural diagram of a threshold adjustment apparatus according to the present invention;
fig. 6 is a schematic structural view of the semiconductor cooler of the present invention.
In the figure: 1. a main body; 2. a control module; 3. a clamping device; 31. a threaded post; 32. plugging; 33. A spring; 34. an upper clamping block; 35. a slide bar; 36. a lower clamping block; 4. a temperature monitoring device; 41. a central processing unit; 42. a power supply module; 43. a temperature display module; 44. an alarm module; 45. a drive circuit; 46. a heat radiation fan; 5. a storage module; 6. a wireless temperature measuring device; 61. MCU; 62. a lithium battery; 63. An RF module; 64. a heat-sensitive semiconductor; 65. a temperature sensor; 7. a pump source; 8. a threshold value adjusting means; 81. a lens barrel; 82. a semiconductor refrigerator; 821. a metal conductive plate; 822. a cylinder; 823. a power interface; 824. a cold end; 825. a hot end; 83. a side vertical groove; 84. a barrier layer; 85. a metal cylinder.
Detailed Description
The present invention will be described in further detail with reference to the following examples:
example 1
As shown in fig. 1-3, the invention provides a temperature detection control device for a fiber laser processing head, which comprises a main body 1, wherein a threshold adjusting device 8 is arranged inside the main body 1, and a wireless temperature measuring device 6 is arranged on one side of the threshold adjusting device 8. The upper end of the wireless temperature measuring device 6 is provided with a storage module 5, one side of the storage module 5 is provided with a clamping device 3, one side of the wireless temperature measuring device 6 is provided with a temperature monitoring device 4, one side of the temperature monitoring device 4 is provided with a control module 2, and the other side of the threshold value adjusting device 8 is provided with a pumping source 7; the temperature monitoring device 4 comprises a central processing unit 41, a power supply module 42, a temperature display module 43, an alarm module 44, a driving circuit 45 and a cooling fan 46, wherein the power supply module 42 is positioned at the upper end of the central processing unit 41, and the driving circuit 45 is positioned at one side of the central processing unit 41; be provided with the electric wire between central processing unit 41 and the power module 42, central processing unit 41's input passes through electric wire and power module 42's output electric connection, be provided with the connecting wire between drive circuit 45 and the central processing unit 41, central processing unit 41's output passes through connecting wire and drive circuit 45's input electric connection, temperature display module 43 is located central processing unit 41's opposite side, radiator fan 46 is located one side of drive circuit 45, alarm module 44 is located one side of temperature display module 43, be provided with the wire between drive circuit 45 and the radiator fan 46, drive circuit 45's output passes through wire and radiator fan 46's input electric connection, central processing unit 41's output and temperature display module 43's input signal connection.
In this embodiment, the temperature change of the machining head can be monitored at any time, the machining head can be prevented from being damaged due to overhigh temperature, the machining head can be processed at the first time, the central processing unit 41 receives the temperature signal and transmits the temperature signal to the temperature display module 43 for displaying, and if the temperature is overhigh, the alarm module 44 sounds, the cooling fan 46 works to effectively cool the surface of the machining head.
Example 2
As shown in fig. 1-3, on the basis of embodiment 1, the present invention provides a technical solution: preferably, the clamping device 3 includes a threaded column 31, a plug 32, a spring 33, an upper clamping block 34, a sliding rod 35, and a lower clamping block 36, the plug 32 is located at one side of the threaded column 31, the spring 33 is located at the lower end of the threaded column 31, the upper clamping block 34 is located at the lower end of the spring 33, the sliding rod 35 is located at the lower end of the upper clamping block 34, the lower clamping block 36 is located at the lower end of the sliding rod 35, a sliding slot is provided between the sliding rod 35 and the lower clamping block 36, the lower end of the sliding rod 35 is movably connected with the upper end of the lower clamping block 36 through the sliding slot, a slot opening is provided between the plug 32 and the threaded column 31, one side of the plug 32 is detachably connected with one side of the threaded column 31 through the slot opening, the spring 33 is wound around the lower end of the threaded column 31, an interface is provided between the spring 33 and the upper clamping block 34, and the lower end of the spring 33 is fixedly connected with the upper end of the upper clamping block 34 through the interface.
In this embodiment, the device can be better and more stable during detection, and is not prone to deviation, the machining head is placed between the upper clamping block 34 and the lower clamping block 36, the size of the opening is adjusted through the sliding rod 35, so that machining heads with different sizes can be clamped conveniently, the threaded column 31 is screwed tightly to compress the spring 33 below the threaded column 31, the plug 32 is inserted into one side of the threaded column 31 to limit the threaded column, the machining head can be clamped and fixed firmly, and the detection control device can detect the temperature of the machining head conveniently.
Example 3
As shown in fig. 1-3, on the basis of embodiment 1, the present invention provides a technical solution: preferably, the threshold adjustment device 8 includes a lens barrel 81, a semiconductor refrigerator 82, a lateral vertical slot 83, a barrier layer 84, and a metal cylinder 85, the semiconductor refrigerator 82 is located at one side of the lens barrel 81, the barrier layer 84 is located at the other side of the lens barrel 81, the metal cylinder 85 is located at one side of the barrier layer 84, the lateral vertical slot 83 is located at the front end of the lens barrel 81, the semiconductor refrigerator 82 includes a metal conductive plate 821, a cylinder 822, a power interface 823, a cold end 824, and a hot end 825, the cylinder 822 is located at the upper and lower ends of the metal conductive plate 821, the power interface 823 is located at the upper end of the cylinder 822, the cold end 824 is located at one side of the metal conductive plate 821, the hot end 825 is located at one side of the cold end 824, a connection hole is disposed between the lens barrel 81 and the semiconductor refrigerator 82, one side of the semiconductor refrigerator 82 is fixedly connected to one side of the lens barrel 81 through the connection hole, a strong adhesive is disposed between the lens barrel 81 and the barrier layer 84, lens cone 81's opposite side is through powerful glue and one side fixed connection of barrier layer 84, be provided with the draw-in groove between barrier layer 84 and the metal cylinder 85, the opposite side of barrier layer 84 passes through the draw-in groove and can dismantle with one side of metal cylinder 85 and be connected, lens cone 81 erects to be provided with the welding piece between the groove 83 with the side, the front end fixed connection of welding piece and lens cone 81 is passed through to the rear end that the groove 83 was erected to the side, be provided with the notch between metal current conducting plate 821 and the cylinder 822, the lower extreme of cylinder 822 passes through the notch and can dismantle with the upper end of metal current conducting plate 821 and be connected, be provided with the electric wire between cylinder 822 and the power source 823, the input electric connection of electric wire and cold junction 823 is passed through to the output of power source 823, one side electric connection of wire and metal current conducting plate 821 is passed through to one side of 824.
In this embodiment, the threshold in the fiber laser can be effectively adjusted, so as to prevent the damage of the processing head due to the excessive internal heat, the dc power supply on the metal conductive plate 821 provides the energy required by the electron flow, after the power supply is turned on, the electron cathode starts to go through the cylinder 822, the heat is absorbed by the heat and goes to the lens barrel 81, the heat is released again, the heat is sent to the other side from one side to cause the temperature difference, so as to form the cold end 824 and the hot end 825, the cold end 824 is connected to the heat source, and the hot end 825 discharges the heat, thereby achieving the effect of cooling.
Example 4
As shown in fig. 1-3, on the basis of embodiment 1, the present invention provides a technical solution: preferably, the wireless temperature measuring device 6 comprises an MCU61, a lithium battery 62, an RF module 63, a thermal semiconductor 64 and a temperature sensor 65, the lithium battery 62 is located inside the MCU61, the thermal semiconductor 64 is located on one side of the MCU61, the temperature sensor 65 is located on one side of the thermal semiconductor 64, the RF module 63 is located at the front end of the thermal semiconductor 64, the input end of the thermal semiconductor 64 is electrically connected to the output end of the temperature sensor 65 through a wire, and the input end of the MCU61 is electrically connected to the output end of the lithium battery 62 through a wire.
In this embodiment, the detection control device can operate efficiently by wireless transmission, so as to avoid the situation that the temperature cannot be detected when the signal is weak, the accuracy of temperature detection can be improved, the power is supplied by the lithium battery 62, so that the MCU61 and the RF module 63 can enhance the intensity of signal reception, the temperature sensor 65 can detect the temperature of the processing head, and the temperature-sensitive semiconductor 64 can further improve the efficiency of temperature detection.
The working principle of the fiber laser processing head temperature detection control device will be described in detail below.
As shown in fig. 1-3, when the temperature detection control device is used, the device can be detected more stably by the clamping device 3, and the deviation is not easy to occur, the processing head is placed between the upper clamping block 34 and the lower clamping block 36, the opening size is adjusted by the sliding rod 35 between the upper clamping block and the lower clamping block, so that the processing head with different sizes can be clamped conveniently, the threaded column 31 is screwed down to compress the spring 33 below the threaded column, the plug 32 is inserted into one side of the threaded column 31 to limit the threaded column, so that the processing head can be firmly clamped and fixed, the temperature detection control device can detect the temperature of the processing head conveniently, the temperature monitoring device 4 can monitor the temperature change condition of the processing head at any time, the processing head can be prevented from being damaged due to overhigh temperature, the processing head can be processed at the first time, the central processor 41 receives a temperature signal and transmits the temperature signal to the temperature display module 43 to display, and the alarm module 44 sounds if the temperature is overhigh, the heat radiation fan 46 works to effectively radiate the surface of the processing head, the threshold value in the fiber laser can be effectively adjusted through the threshold value adjusting device 8, the damage of the processing head caused by overhigh internal heat is prevented, the direct current power supply on the metal conductive plate 821 provides energy required by electron current, after the power supply is switched on, the electron cathode starts to move, firstly, the electron cathode passes through the cylinder 822, the heat absorbed is absorbed and then is discharged to the lens barrel 81, the heat is transmitted to the other side from one side to cause temperature difference to form a cold end 824 and a hot end 825, the cold end 824 is connected with a heat source, the hot end 825 discharges the heat, the effect of cooling is achieved, the detection control device can work efficiently through a wireless transmission mode through the wireless temperature measuring device 6, the problem that the temperature cannot be detected when the signal is weak is avoided, the accuracy of temperature detection can be improved, and the lithium battery 62 provides electric energy, the MCU61 and the RF module 63 can enhance the intensity of signal reception, and the temperature sensor 65 can detect the temperature of the processing head, and the thermal semiconductor 64 can further improve the efficiency of temperature detection.
The present invention has been described in general terms in the foregoing, but it will be apparent to those skilled in the art that modifications and improvements can be made thereto based on the present invention. Therefore, modifications or improvements are within the scope of the invention without departing from the spirit of the inventive concept.

Claims (9)

1. The utility model provides a fiber laser processing head temperature detection controlling means, includes main part (1), its characterized in that: the temperature-measuring device is characterized in that a threshold value adjusting device (8) is arranged inside the main body (1), and a wireless temperature-measuring device (6) is arranged on one side of the threshold value adjusting device (8). A storage module (5) is arranged at the upper end of the wireless temperature measuring device (6), a clamping device (3) is arranged on one side of the storage module (5), a temperature monitoring device (4) is arranged on one side of the wireless temperature measuring device (6), a control module (2) is arranged on one side of the temperature monitoring device (4), and a pumping source (7) is arranged on the other side of the threshold adjusting device (8);
the temperature monitoring device (4) comprises a central processing unit (41), a power supply module (42), a temperature display module (43), an alarm module (44), a driving circuit (45) and a cooling fan (46), wherein the power supply module (42) is positioned at the upper end of the central processing unit (41), and the driving circuit (45) is positioned at one side of the central processing unit (41);
be provided with the electric wire between central processing unit (41) and power module (42), the input of central processing unit (41) passes through the output electric connection of electric wire and power module (42), be provided with the connecting wire between drive circuit (45) and central processing unit (41), the output of central processing unit (41) passes through the input electric connection of connecting wire and drive circuit (45).
2. The fiber laser processing head temperature detection control device according to claim 1, characterized in that: the temperature display module (43) is located on the other side of the central processing unit (41), the heat dissipation fan (46) is located on one side of the driving circuit (45), and the alarm module (44) is located on one side of the temperature display module (43).
3. The fiber laser processing head temperature detection control device according to claim 2, characterized in that: a lead is arranged between the driving circuit (45) and the heat radiation fan (46), the output end of the driving circuit (45) is electrically connected with the input end of the heat radiation fan (46) through the lead, and the output end of the central processing unit (41) is in signal connection with the input end of the temperature display module (43).
4. The fiber laser machining head temperature detection control device according to claim 1, characterized in that: clamping device (3) include screw thread post (31), plug (32), spring (33), go up clamp splice (34), slide bar (35), lower clamp splice (36), plug (32) are located one side of screw thread post (31), spring (33) are located the lower extreme of screw thread post (31), it is located the lower extreme of spring (33) to go up clamp splice (34), slide bar (35) are located the lower extreme of last clamp splice (34), lower clamp splice (36) are located the lower extreme of slide bar (35).
5. The fiber laser processing head temperature detection control device according to claim 4, characterized in that: be provided with the spout between slide bar (35) and lower clamp splice (36), the lower extreme of slide bar (35) passes through the spout and the upper end swing joint of lower clamp splice (36), be provided with the notch between bolt (32) and screw post (31), the notch can be dismantled with one side of screw post (31) and be connected in one side of bolt (32), the lower extreme of spring (33) winding and screw post (31), be provided with the interface between spring (33) and last clamp splice (34), the upper end fixed connection of interface and last clamp splice (34) is passed through to the lower extreme of spring (33).
6. The fiber laser processing head temperature detection control device according to claim 1, characterized in that: the threshold value adjusting device (8) comprises a lens cone (81), a semiconductor refrigerator (82), a side vertical groove (83), a barrier layer (84) and a metal cylinder (85), the semiconductor refrigerator (82) is positioned at one side of the drawtube (81), the barrier layer (84) is positioned at the other side of the drawtube (81), the metal cylinder (85) is positioned at one side of the barrier layer (84), the side vertical groove (83) is positioned at the front end of the lens cone (81), the semiconductor refrigerator (82) comprises a metal conducting plate (821), a cylinder (822), a power interface (823), a cold end (824) and a hot end (825), the cylinder (822) is positioned at the upper end and the lower end of the metal conductive plate (821), the power interface (823) is positioned at the upper end of the cylinder (822), the cold end (824) is located on one side of a metal conductive plate (821) and the hot end (825) is located on one side of the cold end (824).
7. The fiber laser processing head temperature detection control device according to claim 6, characterized in that: be provided with the connecting hole between lens cone (81) and semiconductor cooler (82), one side fixed connection of connecting hole and lens cone (81) is passed through to one side of semiconductor cooler (82), be provided with the super glue between lens cone (81) and barrier layer (84), one side fixed connection of opposite side through super glue and barrier layer (84) of lens cone (81), be provided with the draw-in groove between barrier layer (84) and metal cylinder (85), the opposite side of barrier layer (84) passes through the draw-in groove and can dismantle with one side of metal cylinder (85) and be connected, be provided with the welding block between lens cone (81) and the side vertical groove (83), the rear end of side vertical groove (83) passes through the front end fixed connection of welding block and lens cone (81), be provided with the notch between metal current conducting plate (821) and cylinder (822), the lower extreme of cylinder (822) passes through the notch and can dismantle with the upper end of metal current conducting plate (821) and be connected, be provided with the electric wire between cylinder (822) and power interface (823), the output of power interface (823) passes through the input electric connection of electric wire and cylinder (822), one side of cold junction (824) passes through one side electric connection of wire and metal conducting plate (821).
8. The fiber laser processing head temperature detection control device according to claim 1, characterized in that: the wireless temperature measuring device (6) comprises an MCU (61), a lithium battery (62), an RF module (63), a thermosensitive semiconductor (64) and a temperature sensor (65), wherein the lithium battery (62) is located inside the MCU (61), the thermosensitive semiconductor (64) is located on one side of the MCU (61), the temperature sensor (65) is located on one side of the thermosensitive semiconductor (64), and the RF module (63) is located at the front end of the thermosensitive semiconductor (64).
9. The fiber laser processing head temperature detection control device according to claim 8, characterized in that: the input end of the thermosensitive semiconductor (64) is electrically connected with the output end of the temperature sensor (65) through a lead, and the input end of the MCU (61) is electrically connected with the output end of the lithium battery (62) through an electric wire.
CN202210323415.7A 2022-03-29 2022-03-29 Temperature detection control device for processing head of fiber laser Pending CN114910188A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210323415.7A CN114910188A (en) 2022-03-29 2022-03-29 Temperature detection control device for processing head of fiber laser

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210323415.7A CN114910188A (en) 2022-03-29 2022-03-29 Temperature detection control device for processing head of fiber laser

Publications (1)

Publication Number Publication Date
CN114910188A true CN114910188A (en) 2022-08-16

Family

ID=82763035

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210323415.7A Pending CN114910188A (en) 2022-03-29 2022-03-29 Temperature detection control device for processing head of fiber laser

Country Status (1)

Country Link
CN (1) CN114910188A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117260151A (en) * 2023-11-09 2023-12-22 湖北双航机电装备科技有限公司 Pipeline welding tool

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117260151A (en) * 2023-11-09 2023-12-22 湖北双航机电装备科技有限公司 Pipeline welding tool
CN117260151B (en) * 2023-11-09 2024-03-05 湖北双航机电装备科技有限公司 Pipeline welding tool

Similar Documents

Publication Publication Date Title
CN114910188A (en) Temperature detection control device for processing head of fiber laser
CN111442835A (en) Laser chip test platform
WO2020248931A1 (en) Myriawatt-level ultra-high power full fiber continuous fiber laser system
CN201821002U (en) Semiconductor laser module for multi-luminescent unit
CN105167847A (en) Multi-wavelength semiconductor laser operating system
CN206806719U (en) A kind of QCW optical fiber lasers
CN112221020A (en) Semiconductor laser galvanometer treatment system
WO2020048239A1 (en) High-power optical fiber laser gain optical fiber heat-dissipating device
CN213969509U (en) Laser welding machine
US6449295B1 (en) Method and system for generating laser light
CN205144726U (en) High -power semiconductor laser device of performing operation
CN111884021A (en) Portable wind-cooling optical fiber laser system
CN105167848A (en) High-power semiconductor laser operation system
CN210986787U (en) A heat dissipation protection device for electromechanical device
CN211345921U (en) Heat radiation structure of photomultiplier detection unit
CN219998700U (en) Automatic cooling solid laser
CN108375837A (en) A wordline laser device for Machine Vision Detection blue light
CN106443910A (en) Precise temperature control coupled platform device for photoelectronic device
JP2005117963A (en) Water temperature control system for water tank
CN218732385U (en) Cooling device of carbon dioxide laser tube
CN220473844U (en) Constant temperature type sheet metal component of barrel machine
CN214518453U (en) PCB milling cutter welding set
CN211978114U (en) Laser chip test platform
CN217115152U (en) Semiconductor laser special for displaying mini LED repair welding
CN220797410U (en) Heat radiation structure of semiconductor laser

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination