CN114905343B - Glass processing method assisted by hard particle photoacoustic resonance - Google Patents
Glass processing method assisted by hard particle photoacoustic resonance Download PDFInfo
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- CN114905343B CN114905343B CN202210549578.7A CN202210549578A CN114905343B CN 114905343 B CN114905343 B CN 114905343B CN 202210549578 A CN202210549578 A CN 202210549578A CN 114905343 B CN114905343 B CN 114905343B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
- B24B1/04—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
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- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
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Abstract
The invention relates to the technical field of integrated circuit processing, in particular to a hard particle optoacoustic resonance assisted glass processing method. A method for processing glass assisted by photoacoustic resonance of hard particles, comprising the following steps: step (a), determining a region to be processed of glass, and soaking the glass to be processed in a working solution added with hard particles; applying ultrasonic vibration to the working solution, and simultaneously coupling by using laser and ultrasound, wherein: when positive pressure is applied to the working solution by ultrasonic vibration, laser is used for irradiating the region to be processed of the glass, so that hard particles in the working solution collide with the region to be processed or are ground, and the material in the region to be processed is removed. The glass processing method assisted by the hard particle photoacoustic resonance effectively improves the precision of glass processing, the processing precision can reach 50nm, the integrated circuit packaging requirement can be basically met, the processing efficiency is high, and the problems of low punching precision and low processing efficiency of the existing ultrasonic glass are solved.
Description
Technical Field
The invention relates to the technical field of integrated circuit processing, in particular to a hard particle optoacoustic resonance assisted glass processing method.
Background
Glass has wide application in the field of integrated circuits, and the current processing method for glass is generally low in efficiency and low in precision. The prior main processing mode is to use monocrystalline silicon as a mask to corrode glass, for example, china invention CN201710206914.7 discloses a mask method for glass corrosion, which can avoid thermal stress caused by anodic bonding temperature, has simple operation, but has weaker bonding force between the glass and a silicon wafer, is easy to separate, and has larger lateral corrosion. For another example, laser drilling, chinese invention CN202010351925.6 discloses a method for drilling glass by vibrating mirror, which cuts and etches glass layer by layer, with slow speed, low efficiency and larger edge collapse.
There are also ultrasonic punching methods used in the prior art, wherein the ultrasonic punching method is a combination of mechanical impact and polishing action of abrasive particles under the action of ultrasonic vibration and ultrasonic cavitation, wherein the impact action of the abrasive particles is mainly influenced by the amplitude, feeding pressure and the like of a tool, and the range of processable pore diameter is 0.1-90mm, which is far from sufficient for the field of integrated circuit processing. In order to solve the problems existing in the prior art and in the actual situation, there is an urgent need for an efficient and accurate glass processing method.
Disclosure of Invention
Aiming at the problems of the background technology, the invention aims to provide a glass processing method assisted by hard particle photoacoustic resonance, which effectively improves the precision of glass processing, can reach 50nm in processing precision, can basically meet the packaging requirement of an integrated circuit, has high processing efficiency, and solves the problems of low punching precision and low processing efficiency of the traditional ultrasonic glass.
To achieve the purpose, the invention adopts the following technical scheme:
a method for processing glass assisted by photoacoustic resonance of hard particles, comprising the following steps:
step (a), determining a region to be processed of glass, and soaking the glass to be processed in a working solution added with hard particles;
applying ultrasonic vibration to the working solution, and simultaneously coupling by using laser and ultrasound, wherein: when positive pressure is applied to the working solution by ultrasonic vibration, laser is used for irradiating the region to be processed of the glass, so that hard particles in the working solution collide with the region to be processed or are ground, and the material in the region to be processed is removed; when negative pressure is applied to the working solution by ultrasonic vibration, laser is used for irradiating a region to be processed of the glass for ablation;
and (c) continuing the circulation of applying positive pressure and negative pressure to the working fluid by ultrasonic vibration in the step (b) until the area to be processed of the glass reaches a preset processing standard.
Further, the hard particles in the working solution are boron carbide, cubic phase boron nitride or tungsten carbide, and the particle size of the hard particles is 1-200 mu m.
Further described, the working solution is a mixture of tungsten carbide and ethylene glycol, wherein the mass ratio of the tungsten carbide to the ethylene glycol is 1: (2-2.5).
Further, a black pigment is added to the working fluid.
Further, hydrogen fluoride is added to the working fluid.
Further, in the step (b), when the ultrasonic vibration applies positive pressure to the working liquid, the laser is used to irradiate the region to be processed of the glass, the liquid around the surface to be processed is vaporized by the laser irradiation to form bubbles, the bubbles are broken to enable the hard particles to collide with or grind the region to be processed, and thus the material of the region to be processed is removed, wherein the energy of the laser pulse is represented by the following relation:
wherein: e is laser single pulse energy, D is laser spot irradiation diameter, D= (1-10) D Hard particles P is bubble collapse pressure, p=10 to 1000mpa, h is working fluid evaporation enthalpy, R is gas constant, and T is thermodynamic temperature of the bubble.
In the step (b), the working fluid is subjected to ultrasonic vibration by using a laser ultrasonic mechanism, and simultaneously, laser is emitted by using the laser ultrasonic mechanism to be coupled together with ultrasonic, the laser ultrasonic mechanism comprises an ultrasonic amplitude transformer, a laser emitter and a damper, the laser emitter is arranged in the ultrasonic amplitude transformer, the damper is arranged between the ultrasonic amplitude transformer and the laser emitter, and a laser emission port of the laser emitter is coaxially arranged with the ultrasonic amplitude transformer.
Further, in the step (b), the direction of ultrasonic vibration is perpendicular to the surface to be processed, and the vibration frequency of the ultrasonic horn is 10 kHz-100 kHz.
Further illustratively, the step (a) further includes washing and drying the glass prior to determining the region of the glass to be processed.
Further, the step (c) further includes a step (d) of monitoring the processing effect by the CCD vision monitoring system, and if the processing preset standard is not met, increasing the number of hard particles in the working fluid, increasing the frequency and the action time of the ultrasonic vibration, and repeating the steps (a) to (c).
Compared with the prior art, the embodiment of the invention has the following beneficial effects:
1. according to the invention, ultrasonic vibration is applied to working solution, laser is simultaneously used for coupling in combination with ultrasound, when the ultrasonic vibration applies positive pressure to the working solution, laser is simultaneously used for irradiating a to-be-processed area of glass, at the moment, the laser irradiation leads liquid around the to-be-processed surface to be gasified to form bubbles, the bubbles are broken to lead hard particles to collide or grind the to-be-processed area, so that the material of the to-be-processed area is removed, when the ultrasonic vibration applies negative pressure to the working solution, the laser is used for irradiating the to-be-processed area of the glass to ablate, the laser irradiation leads the material to be removed, the negative pressure of the ultrasonic action can suck out the material, and the material is prevented from depositing on the to-be-processed surface, thereby effectively improving the precision of glass processing, enabling the processing precision to reach 50nm, being capable of basically meeting the packaging requirement of an integrated circuit, and having high processing efficiency, and solving the problems of low punching precision and low processing efficiency of the existing ultrasonic glass;
2. the hardness of the boron carbide, the cubic phase boron nitride or the tungsten carbide is high, so that the effect of collision or grinding with a region to be processed is good, and the material removal effect of the region to be processed is good;
3. the working solution is prepared by using the combination of the tungsten carbide and the ethylene glycol, the impact or grinding effect with the area to be processed is good, the material removal effect of the area to be processed is good, further, by limiting the mass ratio of the tungsten carbide to the ethylene glycol, if the mass ratio of the tungsten carbide to the ethylene glycol is too high, the fluidity of the working solution is poor, the material removal effect is affected, and if the mass ratio of the tungsten carbide to the ethylene glycol is too low, the impact or grinding effect of the hard particles to the area to be processed is poor, and the processing efficiency is reduced.
Drawings
FIG. 1 is a schematic process diagram of a hard particle photoacoustic resonance assisted glass processing method according to one embodiment of the present invention;
FIG. 2 is an enlarged schematic illustration of the processing of a hard particle photoacoustic resonance-assisted glass processing method according to one embodiment of the present invention;
FIG. 3 is a schematic diagram of the structure of a laser ultrasonic mechanism of a hard particle photoacoustic resonance assisted glass processing method according to one embodiment of the present invention with portions broken away;
wherein: the device comprises a laser ultrasonic mechanism 1, an ultrasonic amplitude transformer 11, a laser emitter 12, a damper 13, glass 2, working fluid 3, hard particles 31 and bubbles 4.
Detailed Description
A method for processing glass assisted by photoacoustic resonance of hard particles, comprising the following steps:
step (a), determining a region to be processed of glass, and soaking the glass to be processed in a working solution added with hard particles;
applying ultrasonic vibration to the working solution, and simultaneously coupling by using laser and ultrasound, wherein: when positive pressure is applied to the working solution by ultrasonic vibration, laser is used for irradiating the region to be processed of the glass, so that hard particles in the working solution collide with the region to be processed or are ground, and the material in the region to be processed is removed; when negative pressure is applied to the working solution by ultrasonic vibration, laser is used for irradiating a region to be processed of the glass for ablation;
and (c) continuing the circulation of applying positive pressure and negative pressure to the working fluid by ultrasonic vibration in the step (b) until the area to be processed of the glass reaches a preset processing standard.
The ultrasonic vibration is applied to the working solution, the laser is simultaneously used for coupling in combination with the ultrasonic, when the ultrasonic vibration applies positive pressure to the working solution, the laser is simultaneously used for irradiating the region to be processed of the glass, at the moment, the laser irradiation leads the liquid around the surface to be processed to be gasified to form bubbles, the bubbles are broken to lead the hard particles to collide or grind the region to be processed, thereby removing the material in the region to be processed, when the ultrasonic vibration applies negative pressure to the working solution, the laser is used for irradiating the region to be processed of the glass to ablate, the laser irradiation leads the material to be removed, the negative pressure of the ultrasonic effect can suck out the material, the material is prevented from being deposited on the surface to be processed, thereby effectively improving the precision of glass processing, the processing precision can reach 50nm, the packaging requirement of an integrated circuit can be basically met, the processing efficiency is high, and the problems of low punching precision and low processing efficiency of the existing ultrasonic glass are solved.
In the step (b), when the ultrasonic vibration applies a positive pressure to the working fluid, the laser light irradiates the region to be processed of the glass, and when the ultrasonic vibration applies a negative pressure to the working fluid, the laser light irradiates the same region to be processed of the glass.
Further, the hard particles in the working solution are boron carbide, cubic phase boron nitride or tungsten carbide, and the particle size of the hard particles is 1-200 mu m.
The hardness of boron carbide, cubic phase boron nitride or tungsten carbide is high for bump or grinding effect is good with waiting to process the district, and it is effectual to wait to process regional material's removal, in addition, through limiting the size of stereoplasm granule, if the size of stereoplasm granule is too big, can make the removal rate of material too fast, be difficult to control the removal rate of material, lead to the machining precision to descend, if the size of stereoplasm granule is undersize, remove inefficiency, influence holistic machining efficiency.
Preferably, the working solution is a mixture of tungsten carbide and ethylene glycol, wherein the mass ratio of the tungsten carbide to the ethylene glycol is 1: (2-2.5).
The working solution is prepared by using the combination of the tungsten carbide and the ethylene glycol, the impact or grinding effect with the area to be processed is good, the material removal effect of the area to be processed is good, further, by limiting the mass ratio of the tungsten carbide to the ethylene glycol, if the mass ratio of the tungsten carbide to the ethylene glycol is too high, the fluidity of the working solution is poor, the material removal effect is affected, and if the mass ratio of the tungsten carbide to the ethylene glycol is too low, the impact or grinding effect of the hard particles to the area to be processed is poor, and the processing efficiency is reduced.
Preferably, a black pigment is further added to the working fluid.
By adding a black pigment to the working fluid, the absorptivity of the material to laser energy can be improved, and the processing efficiency can be further improved.
Preferably, hydrogen fluoride is also added to the working fluid.
The working fluid may be added with hydrogen fluoride without corroding the hard particles, and the working fluid containing hydrogen fluoride may be used to further improve the processing efficiency.
Further, in the step (b), when the ultrasonic vibration applies positive pressure to the working liquid, the laser is used to irradiate the region to be processed of the glass, the liquid around the surface to be processed is vaporized by the laser irradiation to form bubbles, the bubbles are broken to enable the hard particles to collide with or grind the region to be processed, and thus the material of the region to be processed is removed, wherein the energy of the laser pulse is represented by the following relation:
wherein: e is laser single pulse energy, D is laser spot irradiation diameter, D= (1-10) D Hard particles P is bubble collapse pressure, p=10 to 1000mpa, h is working fluid evaporation enthalpy, R is gas constant, and T is thermodynamic temperature of the bubble.
By calculating the laser monopulse energy according to the relational expression, different laser monopulse energies can be determined according to the sizes of different hard particles and the types of working liquids, so that the removal efficiency is improved.
In the step (b), the working fluid is subjected to ultrasonic vibration by using a laser ultrasonic mechanism, and simultaneously, laser is emitted by using the laser ultrasonic mechanism to be coupled together with ultrasonic, the laser ultrasonic mechanism comprises an ultrasonic amplitude transformer, a laser emitter and a damper, the laser emitter is arranged in the ultrasonic amplitude transformer, the damper is arranged between the ultrasonic amplitude transformer and the laser emitter, and a laser emission port of the laser emitter is coaxially arranged with the ultrasonic amplitude transformer.
Specifically, replace the instrument head that contacts with the material in the traditional ultrasonic processing with laser emitter, laser emitter transmits pulsed laser, realizes laser and ultrasonic vibration's coupling, and through with the attenuator set up in between the ultrasonic amplitude transformer with the laser emitter for laser emitter's laser emission mouth can not receive ultrasonic vibration's influence. Further stated, in the step (b), the laser ultrasonic mechanism is inserted into the working fluid and is close to the region to be processed of the glass, and the laser ultrasonic mechanism does not need to be in contact with the glass to be processed, so that the glass processing assisted by the photoacoustic resonance of the hard particles is realized.
Preferably, in the step (b), the direction of ultrasonic vibration is perpendicular to the surface to be processed, and the vibration frequency of the ultrasonic horn is 10kHz to 100kHz.
Specifically, the vibration frequency of the ultrasonic amplitude transformer is 10 kHz-100 kHz to obtain a resonance state, thereby ensuring the processing precision of glass and the processing efficiency.
Preferably, before the step (a) of determining the area to be processed of the glass, the method further comprises washing and drying the glass.
Before processing the glass, the glass is cleaned and dried, so that dust and dirt on the surface of the glass are removed, the subsequent processing precision can be ensured, the processing effect of the glass is ensured, and specifically, the glass is cleaned by using ethanol and is dried by using nitrogen.
Further, the step (c) further includes a step (d) of monitoring the processing effect by the CCD vision monitoring system, and if the processing preset standard is not met, increasing the number of hard particles in the working fluid, increasing the frequency and the action time of the ultrasonic vibration, and repeating the steps (a) to (c).
Specifically, the processing effect is monitored through the CCD visual monitoring system, if the processing preset standard is not met, an automatic signal processing and control system is used for regenerating a new processing scheme and path, the processing effect is improved by increasing the number of hard particles in the working solution and increasing the frequency and the action time of ultrasonic vibration, the processing procedure is repeated until the processing effect meets the preset standard, and after the processing is finished, the glass plate can be cleaned to remove residual particles, surface treatment and other subsequent processes are performed.
The technical scheme of the invention is further described by the following specific embodiments.
The present invention is described more fully below in order to facilitate an understanding of the present invention. This invention may be embodied in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
The examples are not to be construed as limiting the specific techniques or conditions described in the literature in this field or as per the specifications of the product. The reagents or apparatus used were conventional products commercially available without the manufacturer's attention.
Example 1
As shown in fig. 1 to 3, a hard particle photoacoustic resonance assisted glass processing method includes the steps of:
step (a), determining a region to be processed of glass 2 (specifically a glass plate), and immersing the glass 2 to be processed in a working solution 3 added with hard particles 31 (wherein the working solution 3 is a mixture of tungsten carbide and ethylene glycol, the granularity of the tungsten carbide is 50 mu m, and the mass ratio of the tungsten carbide to the ethylene glycol is 1:2;
applying ultrasonic vibration to the working solution 3 by using a laser ultrasonic mechanism 1, wherein the laser ultrasonic mechanism 1 comprises an ultrasonic amplitude transformer 11, a laser emitter 12 and a damper 13, the laser emitter 12 is arranged in the ultrasonic amplitude transformer 11, the damper 13 is arranged between the ultrasonic amplitude transformer 11 and the laser emitter 12, a laser emitting port of the laser emitter 12 is coaxially arranged with the ultrasonic amplitude transformer 11, simultaneously, laser is used for coupling in cooperation with ultrasonic, the ultrasonic vibration of the ultrasonic amplitude transformer 11 applies positive pressure to tungsten carbide in the working solution 3 for 1s, simultaneously, pulse laser is used for irradiating a region to be processed of the glass 2, the liquid around the surface to be processed is vaporized by the laser irradiation to form bubbles 4, and the bubbles 4 are broken to enable hard particles 31 (tungsten carbide) to collide with the region to be processed or grind, so that the material in the region to be processed is removed; the ultrasonic amplitude transformer 11 is vibrated ultrasonically to form negative pressure, and the area to be processed of the glass is irradiated by pulse laser to ablate for 0.5s;
and (c) continuing the circulation of applying positive pressure and negative pressure to the working solution 3 by ultrasonic vibration in the step (b) until the area to be processed of the glass 2 reaches a preset processing standard, and cleaning the circuit board by ethanol under the condition of adding ultrasonic after processing is finished, so as to remove the residual hard particles 31.
The above examples illustrate only a few embodiments of the invention, which are described in detail and are not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.
Claims (10)
1. The glass processing method assisted by the photoacoustic resonance of the hard particles is characterized by comprising the following steps of:
step (a), determining a region to be processed of glass, and soaking the glass to be processed in a working solution added with hard particles;
applying ultrasonic vibration to the working solution, and simultaneously coupling by using laser and ultrasound, wherein: when positive pressure is applied to the working solution by ultrasonic vibration, laser is used for irradiating the region to be processed of the glass, so that hard particles in the working solution collide with the region to be processed or are ground, and the material in the region to be processed is removed; when negative pressure is applied to the working solution by ultrasonic vibration, laser is used for irradiating a region to be processed of the glass for ablation;
and (c) continuing the circulation of applying positive pressure and negative pressure to the working fluid by ultrasonic vibration in the step (b) until the area to be processed of the glass reaches a preset processing standard.
2. The method for processing glass assisted by photoacoustic resonance of hard particles according to claim 1, wherein the hard particles in the working fluid are boron carbide, cubic boron nitride or tungsten carbide, and the particle size of the hard particles is 1 to 200 μm.
3. The method for processing hard particle photoacoustic resonance-assisted glass according to claim 2, wherein the working fluid is a mixture of tungsten carbide and ethylene glycol, wherein the mass ratio of tungsten carbide to ethylene glycol is 1: (2-2.5).
4. The method for processing glass assisted by photoacoustic resonance of hard particles according to claim 2, wherein a black pigment is further added to the working fluid.
5. The method for processing glass assisted by photoacoustic resonance of hard particles according to claim 2, wherein hydrogen fluoride is further added to the working fluid.
6. The method for processing glass assisted by photoacoustic resonance of hard particles according to claim 1, wherein in the step (b), when positive pressure is applied to the working liquid by ultrasonic vibration, a region to be processed of the glass is irradiated with laser light, the laser light irradiates the liquid around the surface to be processed to be vaporized into bubbles, the bubbles are broken to collide or grind the hard particles to the region to be processed, thereby accomplishing the removal of the material of the region to be processed, wherein the laser pulse energy is represented by the following relationship:
wherein: e is laserThe single pulse energy, D is the laser spot irradiation diameter, D= (1-10) D Hard particles P is bubble collapse pressure, p=10 to 1000mpa, h is working fluid evaporation enthalpy, R is gas constant, and T is thermodynamic temperature of the bubble.
7. The method for processing glass assisted by photoacoustic resonance of hard particles according to claim 1, wherein in the step (b), ultrasonic vibration is applied to the working fluid by using a laser ultrasonic mechanism, and simultaneously laser is emitted by using the laser ultrasonic mechanism to couple in cooperation with ultrasonic, the laser ultrasonic mechanism comprises an ultrasonic horn, a laser emitter and a damper, the laser emitter is installed in the ultrasonic horn, the damper is disposed between the ultrasonic horn and the laser emitter, and a laser emission port of the laser emitter is disposed coaxially with the ultrasonic horn.
8. The method for processing glass assisted by photoacoustic resonance of hard particles according to claim 7, wherein in the step (b), the direction of the ultrasonic vibration is perpendicular to the surface to be processed, and the vibration frequency of the ultrasonic horn is 10kHz to 100kHz.
9. The method of claim 1, wherein the step (a) further comprises washing and drying the glass before determining the region of the glass to be processed.
10. The method of claim 1, wherein the step (c) further comprises the step (d) of monitoring the processing effect by a CCD vision monitoring system, if the processing preset standard is not met, increasing the number of hard particles in the working fluid, increasing the frequency and the action time of the ultrasonic vibration, and repeating the steps (a) to (c).
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Citations (3)
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| CN112864026A (en) * | 2021-03-23 | 2021-05-28 | 成都迈科科技有限公司 | Process for processing TGV through hole by combining laser and HF wet etching |
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| CN113924276A (en) * | 2019-06-28 | 2022-01-11 | Hoya株式会社 | Method for manufacturing glass plate and method for manufacturing magnetic disk |
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| US7063596B2 (en) * | 2003-06-09 | 2006-06-20 | David Benderly | Vibratory material removal system, tool and method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113924276A (en) * | 2019-06-28 | 2022-01-11 | Hoya株式会社 | Method for manufacturing glass plate and method for manufacturing magnetic disk |
| CN112864026A (en) * | 2021-03-23 | 2021-05-28 | 成都迈科科技有限公司 | Process for processing TGV through hole by combining laser and HF wet etching |
| CN113732515A (en) * | 2021-09-26 | 2021-12-03 | 中国科学院宁波材料技术与工程研究所 | Controllable liquid flow-vibration coupling auxiliary laser milling and polishing processing method and system |
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| 超声波辅助飞秒激光加工光纤材料的工艺探索;刘斌;戴玉堂;殷广林;李涛;;中国激光(第03期);全文 * |
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