CN114905343A - Hard particle photoacoustic resonance assisted glass processing method - Google Patents
Hard particle photoacoustic resonance assisted glass processing method Download PDFInfo
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- CN114905343A CN114905343A CN202210549578.7A CN202210549578A CN114905343A CN 114905343 A CN114905343 A CN 114905343A CN 202210549578 A CN202210549578 A CN 202210549578A CN 114905343 A CN114905343 A CN 114905343A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
- B24B1/04—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
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Abstract
The invention relates to the technical field of integrated circuit processing, in particular to a hard particle photoacoustic resonance assisted glass processing method. A hard particle photoacoustic resonance assisted glass processing method comprises the following steps: determining a region to be processed of glass, and soaking the glass to be processed in working solution added with hard particles; step (b), applying ultrasonic vibration to the working solution, and simultaneously using laser to cooperate with ultrasonic for coupling, wherein: when the ultrasonic vibration applies positive pressure to the working solution, laser is used for irradiating the to-be-processed area of the glass, so that hard particles in the working solution collide or grind with the to-be-processed area, and the material of the to-be-processed area is removed. The hard particle photoacoustic resonance assisted glass processing method effectively improves the glass processing precision which can reach 50nm, can basically meet the integrated circuit packaging requirements, has high processing efficiency, and solves the problems of low punching precision and low processing efficiency of the conventional ultrasonic glass.
Description
Technical Field
The invention relates to the technical field of integrated circuit processing, in particular to a hard particle photoacoustic resonance assisted glass processing method.
Background
Glass has wide application in the field of integrated circuits, and the current processing method for glass generally has low efficiency and low precision. The current main processing mode is to use monocrystalline silicon as a mask to corrode glass, for example, the invention CN201710206914.7 in China discloses a mask method for glass corrosion, which can avoid thermal stress caused by anodic bonding temperature, is simple to operate, but has weak bonding force between glass and a silicon wafer, is easy to separate, and has larger lateral corrosion of glass. For another example, CN202010351925.6 of china discloses a method for drilling holes on glass by using vibrating mirror laser, which is used to cut and etch glass layer by layer, and has slow speed, low efficiency and large edge breakage of drilled edge.
The existing method also uses ultrasonic perforation, the mode of ultrasonic perforation is the comprehensive result of the mechanical impact and polishing action of abrasive particles under the action of ultrasonic vibration and ultrasonic cavitation action, wherein the impact action of abrasive particles is the main, but the method is limited by the influence of the amplitude, the feeding pressure and the like of a tool, the range of the hole diameter which can be processed is 0.1-90mm, and the processing range is far from being insufficient for the field of integrated circuit processing. In order to solve the problems in the prior art and the actual situation, an efficient and accurate glass processing method is urgently needed.
Disclosure of Invention
Aiming at the problems in the prior art, the invention aims to provide a hard particle photoacoustic resonance assisted glass processing method, which can effectively improve the glass processing precision which can reach 50nm, basically meet the integrated circuit packaging requirements, has high processing efficiency and solves the problems of low drilling precision and low processing efficiency of the conventional ultrasonic glass.
In order to achieve the purpose, the invention adopts the following technical scheme:
a hard particle photoacoustic resonance assisted glass processing method comprises the following steps:
determining a region to be processed of glass, and soaking the glass to be processed in working solution added with hard particles;
step (b), applying ultrasonic vibration to the working solution, and simultaneously using laser to cooperate with ultrasonic to carry out coupling, wherein: when positive pressure is applied to the working solution by ultrasonic vibration, laser is used for irradiating a to-be-processed area of the glass, so that hard particles in the working solution collide with or are ground with the to-be-processed area, and the material of the to-be-processed area is removed; when the ultrasonic vibration applies negative pressure to the working solution, the laser is used for irradiating the area to be processed of the glass to ablate;
and (c) continuously applying positive pressure and negative pressure to the working solution by the ultrasonic vibration in the step (b) until the area to be processed of the glass reaches a preset processing standard.
Further, the hard particles in the working solution are boron carbide, cubic phase boron nitride or tungsten carbide, and the particle size of the hard particles is 1-200 μm.
Further, the working solution is a mixture of tungsten carbide and ethylene glycol, wherein the mass ratio of the tungsten carbide to the ethylene glycol is 1: (2-2.5).
In addition, the working solution is also added with black pigment.
Further, hydrogen fluoride is added to the working fluid.
Further, in the step (b), when the ultrasonic vibration applies positive pressure to the working solution, laser is used for irradiating the to-be-processed area of the glass, the laser irradiation vaporizes the liquid around the to-be-processed surface to form bubbles, the bubbles are broken to make hard particles collide or grind the to-be-processed area, and thus the removal of the material of the to-be-processed area is realized, wherein the laser pulse energy is represented by the following relation:
in the formula: e is laser single pulse energy, D is laser spot irradiation diameter, and D is (1-10) D Hard particles P is bubble breakThe cracking pressure is 10-1000 MPa, H is the evaporation enthalpy of the working solution, R is a gas constant, and T is the thermodynamic temperature of the bubbles.
Further, in the step (b), a laser ultrasonic mechanism is used to apply ultrasonic vibration to the working fluid, and simultaneously, the laser ultrasonic mechanism is used to emit laser to cooperate with ultrasonic for coupling, the laser ultrasonic mechanism includes an ultrasonic amplitude transformer, a laser emitter and a damper, the laser emitter is installed in the ultrasonic amplitude transformer, the damper is arranged between the ultrasonic amplitude transformer and the laser emitter, and a laser emitting port of the laser emitter is arranged coaxially with the ultrasonic amplitude transformer.
In the step (b), the direction of the ultrasonic vibration is perpendicular to the surface to be processed, and the vibration frequency of the ultrasonic horn is 10kHz to 100 kHz.
More specifically, before the step (a) of determining the area of the glass to be processed, the step (a) further comprises cleaning and drying the glass.
And (c) further comprising a step (d) of monitoring the processing effect through a CCD visual monitoring system, increasing the number of the hard particles in the working fluid if the processing effect does not reach the processing preset standard, increasing the frequency and the acting time of the ultrasonic vibration, and repeating the steps (a) to (c).
Compared with the prior art, the embodiment of the invention has the following beneficial effects:
1. the invention applies ultrasonic vibration to the working solution, simultaneously uses laser to be coupled with ultrasonic, when the ultrasonic vibration applies positive pressure to the working solution, simultaneously uses the laser to irradiate the area to be processed of the glass, at the moment, the laser irradiation leads the liquid around the surface to be processed to be vaporized to form bubbles, the bubbles are broken to lead hard particles to collide with or grind the area to be processed, thereby realizing the removal of the material of the area to be processed, when the ultrasonic vibration applies negative pressure to the working solution, the area to be processed of the glass is irradiated by the laser to be ablated, the material is removed by the laser irradiation, the negative pressure of the ultrasonic action can suck the material, the material is prevented from being deposited on the surface to be processed, thereby effectively improving the processing precision of the glass, the processing precision can reach 50nm, the packaging requirement of an integrated circuit can be basically met, the processing efficiency is high, and the problems that the existing ultrasonic glass has low drilling precision, The problem of low processing efficiency;
2. the hardness of boron carbide, cubic phase boron nitride or tungsten carbide is high, so that the collision or grinding effect with a region to be processed is good, the removal effect of materials in the region to be processed is good, in addition, by limiting the size of hard particles, if the size of the hard particles is too large, the removal speed of the materials is too high, the removal speed of the materials is difficult to control, the processing precision is reduced, and if the size of the hard particles is too small, the removal efficiency is too low, and the overall processing efficiency is influenced;
3. through the combination of using tungsten carbide and ethylene glycol, make the working solution, it is effectual to collide with the regional emergence of waiting to process or grind, it is effectual to treat the removal of regional material of processing, furthermore, through the mass ratio of injecing tungsten carbide and ethylene glycol, if the mass ratio of tungsten carbide and ethylene glycol is too high, then can make the mobility of working solution worsen, influence the effect of getting rid of material, if the mass ratio of tungsten carbide and ethylene glycol is too low, then can lead to the effect that hard particle and the regional emergence of waiting to process collide with or grind to worsen, reduce machining efficiency.
Drawings
FIG. 1 is a schematic process diagram of a hard particle photoacoustic resonance assisted glass processing method according to one embodiment of the present invention;
FIG. 2 is an enlarged schematic view of the process of the hard particle photoacoustic resonance assisted glass processing method according to one embodiment of the present invention;
FIG. 3 is a schematic diagram of a laser ultrasonic mechanism of a hard particle photoacoustic resonance assisted glass processing method according to one embodiment of the present invention in partial cross-sectional configuration;
wherein: the device comprises a laser ultrasonic mechanism 1, an ultrasonic amplitude transformer 11, a laser emitter 12, a damper 13, glass 2, working liquid 3, hard particles 31 and air bubbles 4.
Detailed Description
A hard particle photoacoustic resonance assisted glass processing method comprises the following steps:
determining a region to be processed of glass, and soaking the glass to be processed in working solution added with hard particles;
step (b), applying ultrasonic vibration to the working solution, and simultaneously using laser to cooperate with ultrasonic to carry out coupling, wherein: when positive pressure is applied to the working solution by ultrasonic vibration, laser is used for irradiating a to-be-processed area of the glass, so that hard particles in the working solution collide with or are ground with the to-be-processed area, and the material of the to-be-processed area is removed; when the ultrasonic vibration applies negative pressure to the working solution, the laser is used for irradiating the area to be processed of the glass to ablate;
and (c) continuously applying positive pressure and negative pressure to the working solution by the ultrasonic vibration in the step (b) until the area to be processed of the glass reaches a preset processing standard.
By applying ultrasonic vibration to the working liquid and simultaneously using laser to be coupled with the ultrasonic, when the ultrasonic vibration applies positive pressure to the working liquid, simultaneously, laser is used for irradiating the area to be processed of the glass, at the moment, the laser irradiation enables the liquid around the surface to be processed to be vaporized to form bubbles, the bubbles are broken to enable the hard particles to collide or grind the area to be processed, thereby realizing the removal of the material of the area to be processed, when the ultrasonic vibration applies negative pressure to the working solution, the area to be processed of the glass is irradiated by laser to ablate, the material is removed by the laser irradiation, the negative pressure of the ultrasonic action can suck out the material to prevent the material from depositing on the surface to be processed, thereby effectively improving the processing precision of the glass, the processing precision can reach 50nm, the packaging requirement of the integrated circuit can be basically met, and the processing efficiency is high, and the problems of low punching precision and low processing efficiency of the existing ultrasonic glass are solved.
In the step (b), the region to be processed of the glass is irradiated with the laser light when the ultrasonic vibration applies the positive pressure to the working solution, and the region to be processed of the glass is irradiated with the laser light when the ultrasonic vibration applies the negative pressure to the working solution.
Further, the hard particles in the working solution are boron carbide, cubic phase boron nitride or tungsten carbide, and the particle size of the hard particles is 1-200 μm.
The hardness of boron carbide, cubic phase boron nitride or tungsten carbide is high for with wait to process regional bump or grind effectually, wait to process regional material get rid of effectually, in addition, through the size of injecing the stereoplasm granule, if the size of stereoplasm granule is too big, can make the removal rate of material too fast, be difficult to control the removal rate of material, lead to the machining precision to descend, if the size undersize of stereoplasm granule, then get rid of efficiency too low, influence holistic machining efficiency.
Preferably, the working solution is a mixture of tungsten carbide and ethylene glycol, wherein the mass ratio of the tungsten carbide to the ethylene glycol is 1: (2-2.5).
Through the combination of using tungsten carbide and ethylene glycol, make the working solution, it is effectual to collide with the regional emergence of waiting to process or grind, it is effectual to treat the removal of regional material of processing, furthermore, through the mass ratio of injecing tungsten carbide and ethylene glycol, if the mass ratio of tungsten carbide and ethylene glycol is too high, then can make the mobility of working solution worsen, influence the effect of getting rid of material, if the mass ratio of tungsten carbide and ethylene glycol is too low, then can lead to the effect that hard particle and the regional emergence of waiting to process collide with or grind to worsen, reduce machining efficiency.
Preferably, a black pigment is further added to the working solution.
By adding the black pigment into the working solution, the absorption rate of the material to laser energy can be improved, and the processing efficiency is further improved.
Preferably, hydrogen fluoride is further added to the working fluid.
On the other hand, if the hard particles are not corroded, hydrogen fluoride may be added to the working fluid, and the working fluid containing hydrogen fluoride can be used to further improve the processing efficiency.
Further, in the step (b), when the ultrasonic vibration applies positive pressure to the working solution, laser is used for irradiating the to-be-processed area of the glass, the laser irradiation vaporizes the liquid around the to-be-processed surface to form bubbles, the bubbles are broken to make hard particles collide or grind the to-be-processed area, and thus the removal of the material of the to-be-processed area is realized, wherein the laser pulse energy is represented by the following relation:
in the formula: e is laser single pulse energy, D is laser spot irradiation diameter, and D is (1-10) D Hard particles P is bubble bursting pressure, P is 10-1000 MPa, H is evaporation enthalpy of the working solution, R is a gas constant, and T is thermodynamic temperature of the bubbles.
The laser single pulse energy is calculated through the relational expression, different laser single pulse energies can be determined according to different sizes of hard particles and different types of working liquid, and therefore the removal efficiency is improved.
Further, in the step (b), a laser ultrasonic mechanism is used to apply ultrasonic vibration to the working fluid, and simultaneously, the laser ultrasonic mechanism is used to emit laser to cooperate with ultrasonic for coupling, the laser ultrasonic mechanism includes an ultrasonic horn, a laser emitter and a damper, the laser emitter is installed in the ultrasonic horn, the damper is arranged between the ultrasonic horn and the laser emitter, and a laser emitting port of the laser emitter is arranged coaxially with the ultrasonic horn.
Specifically, a tool head in contact with a material in traditional ultrasonic machining is replaced by a laser transmitter, the laser transmitter transmits pulse laser to realize coupling of laser and ultrasonic vibration, and the damper is arranged between the ultrasonic amplitude transformer and the laser transmitter, so that a laser transmitting port of the laser transmitter is not affected by the ultrasonic vibration. Furthermore, in the step (b), the laser ultrasonic mechanism is inserted into the working solution and is close to the to-be-processed area of the glass, and the hard particle photoacoustic resonance-assisted glass processing is realized without contacting the to-be-processed glass.
Preferably, in the step (b), the direction of the ultrasonic vibration is perpendicular to the processed surface, and the vibration frequency of the ultrasonic horn is 10kHz to 100 kHz.
Specifically, the vibration frequency of the ultrasonic horn is 10kHz to 100kHz to obtain a resonance state, ensure the processing precision of glass, and ensure the processing efficiency.
Preferably, before the step (a) of determining the region of the glass to be processed, the step further comprises washing and drying the glass.
Before processing glass, through wasing and drying glass, get rid of the dust filth on glass surface, can guarantee subsequent machining precision, guarantee glass's processing effect, specifically, use ethanol to wash glass to weather with nitrogen gas.
More specifically, the step (c) is followed by a step (d) of monitoring the processing effect through a CCD visual monitoring system, if the processing preset standard is not met, increasing the number of hard particles in the working fluid, increasing the frequency and action time of ultrasonic vibration, and repeating the steps (a) to (c).
Specifically, through CCD visual monitoring system monitoring processing effect, if not reach processing and predetermine the standard, then use automatic signal processing and control system to regenerate new processing scheme and route, through increasing the quantity of stereoplasm granule in the working solution to and increase ultrasonic vibration's frequency and acting time, improve the processing effect, the repeated machining process, until the processing effect reaches and predetermines the standard, after accomplishing processing, can also wash the glass board, get rid of remaining granule, and carry out follow-up processes such as surface treatment.
The technical solution of the present invention is further described below by way of specific embodiments.
In order to facilitate an understanding of the present invention, a more complete description of the present invention is provided below. The present invention may be embodied in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
The examples, where specific techniques or conditions are not indicated, are to be construed according to the techniques or conditions described in the literature in the art or according to the product specifications. The reagents or instruments used are not indicated by the manufacturer, and are all conventional products commercially available.
Example 1
As shown in fig. 1 to 3, a hard particle photoacoustic resonance assisted glass processing method comprises the following steps:
step (a), determining a region to be processed of glass 2 (specifically a glass plate), and soaking the glass 2 to be processed in a working solution 3 added with hard particles 31 (wherein the working solution 3 is a mixture of tungsten carbide and ethylene glycol, the particle size of the tungsten carbide is 50 μm, and the mass ratio of the tungsten carbide to the ethylene glycol is 1: 2;
step (b), applying ultrasonic vibration to the working solution 3 by using a laser ultrasonic mechanism 1, wherein the laser ultrasonic mechanism 1 comprises an ultrasonic amplitude transformer 11, a laser emitter 12 and a damper 13, the laser transmitter 12 is installed in the ultrasonic horn 11, the damper 13 is arranged between the ultrasonic horn 11 and the laser transmitter 12, the laser emitting port of the laser emitter 12 is arranged coaxially with the ultrasonic amplitude transformer 11, meanwhile, laser is used for coupling with ultrasound, the ultrasonic vibration of the ultrasonic amplitude transformer 11 applies positive pressure to the tungsten carbide in the working solution 3 for 1s, meanwhile, pulse laser is used for irradiating the area to be processed of the glass 2, liquid around the surface to be processed is vaporized by the laser irradiation to form bubbles 4, and the bubbles 4 are broken to enable the hard particles 31 (tungsten carbide) to collide with or grind the area to be processed, so that the material of the area to be processed is removed; the ultrasonic amplitude transformer 11 ultrasonically vibrates to form negative pressure, and the pulse laser is used for irradiating the area to be processed of the glass to ablate for 0.5 s;
and (c) continuously applying positive pressure and negative pressure to the working solution 3 by ultrasonic vibration in the step (b) until the area to be processed of the glass 2 reaches a preset processing standard, and cleaning the circuit board by using ethanol under the condition of adding ultrasonic waves after the processing is finished to remove the residual hard particles 31.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that various changes and modifications can be made by those skilled in the art without departing from the spirit of the invention, and these changes and modifications are all within the scope of the invention. Therefore, the protection scope of the present patent should be subject to the appended claims.
Claims (10)
1. A hard particle photoacoustic resonance assisted glass processing method is characterized by comprising the following steps:
determining a region to be processed of glass, and soaking the glass to be processed in working solution added with hard particles;
step (b), applying ultrasonic vibration to the working solution, and simultaneously using laser to cooperate with ultrasonic to carry out coupling, wherein: when positive pressure is applied to the working solution by ultrasonic vibration, laser is used for irradiating a to-be-processed area of the glass, so that hard particles in the working solution collide with or are ground with the to-be-processed area, and the material of the to-be-processed area is removed; when the ultrasonic vibration applies negative pressure to the working solution, the laser is used for irradiating the area to be processed of the glass to ablate;
and (c) continuously applying positive pressure and negative pressure to the working solution by the ultrasonic vibration in the step (b) until the area to be processed of the glass reaches a preset processing standard.
2. The hard particle photoacoustic resonance-assisted glass processing method according to claim 1, wherein the hard particles in the working solution are boron carbide, cubic phase boron nitride or tungsten carbide, and the particle size of the hard particles is 1 to 200 μm.
3. The hard particle photoacoustic resonance assisted glass processing method of claim 2, wherein the working fluid is a mixture of tungsten carbide and ethylene glycol, wherein the mass ratio of tungsten carbide to ethylene glycol is 1: (2-2.5).
4. The hard-particle photoacoustic resonance-assisted glass processing method of claim 2, wherein a black pigment is further added to the working fluid.
5. The hard-particle photoacoustic resonance-assisted glass processing method of claim 2, wherein hydrogen fluoride is further added to the working fluid.
6. The method for processing glass assisted by photoacoustic resonance of hard particles according to claim 1, wherein in step (b), when the ultrasonic vibration applies positive pressure to the working fluid, the glass is irradiated with laser, the laser irradiation vaporizes the liquid around the surface to be processed to form bubbles, and the bubbles are broken to make the hard particles collide with or grind the area to be processed, so as to remove the material in the area to be processed, wherein the energy of the laser pulse is represented by the following relation:
in the formula: e is laser single pulse energy, D is laser spot irradiation diameter, and D is (1-10) D Hard particles P is bubble bursting pressure, P is 10-1000 MPa, H is evaporation enthalpy of the working solution, R is a gas constant, and T is thermodynamic temperature of the bubbles.
7. The hard particle photoacoustic resonance-assisted glass processing method according to claim 1, wherein in the step (b), the laser ultrasonic mechanism is used to apply ultrasonic vibration to the working fluid, and the laser ultrasonic mechanism is used to emit laser to couple with the ultrasonic wave, wherein the laser ultrasonic mechanism comprises an ultrasonic horn, a laser emitter and a damper, the laser emitter is installed in the ultrasonic horn, the damper is arranged between the ultrasonic horn and the laser emitter, and a laser emitting port of the laser emitter is arranged coaxially with the ultrasonic horn.
8. The hard particle photoacoustic resonance-assisted glass processing method according to claim 7, wherein in step (b), the ultrasonic vibration is directed perpendicular to the surface to be processed, and the vibration frequency of the ultrasonic horn is 10kHz to 100 kHz.
9. The hard-particle photoacoustic resonance assisted glass processing method of claim 1, wherein step (a) further comprises washing and drying the glass before determining the region of the glass to be processed.
10. The hard particle photoacoustic resonance-assisted glass processing method according to claim 1, wherein the step (c) is followed by a step (d) of monitoring the processing effect by a CCD visual monitoring system, increasing the number of hard particles in the working fluid and increasing the frequency and action time of ultrasonic vibration if a preset processing standard is not met, and repeating the steps (a) to (c).
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| US20040248503A1 (en) * | 2003-06-09 | 2004-12-09 | David Benderly | Vibratory material removal system, tool and method |
| CN113924276A (en) * | 2019-06-28 | 2022-01-11 | Hoya株式会社 | Method for manufacturing glass plate and method for manufacturing magnetic disk |
| CN112864026A (en) * | 2021-03-23 | 2021-05-28 | 成都迈科科技有限公司 | Process for processing TGV through hole by combining laser and HF wet etching |
| CN113732515A (en) * | 2021-09-26 | 2021-12-03 | 中国科学院宁波材料技术与工程研究所 | Controllable liquid flow-vibration coupling auxiliary laser milling and polishing processing method and system |
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