CN114905254A - Electronic board pressing method - Google Patents

Abstract

The invention discloses an electronic board pressing method, which comprises two pressing methods, wherein the electronic board is put back to the original position after being pressed in the first method, the electronic boards A3 and A4 are taken out in the second method, and the rest electronic boards are alternately put back in the same position after being pressed. Aiming at the stamping process of a connecting plate of an electronic product, the invention effectively reduces time waste, improves the utilization rate of materials and labor productivity by optimizing operation steps and processes while ensuring the requirements of the size, shape and position precision of a workpiece, realizes the improvement of productivity and is worthy of popularization.

Description

Electronic board pressing method

Technical Field

The invention relates to the technical field of electronic board manufacturing, in particular to a method for laminating an electronic board.

Background

With the continuous development of electronic circuit technology, various electronic boards make great progress in the functions and manufacturing processes that can be realized, and provide reliable and economical basic hardware support for electronic equipment in various industries.

A pressing process is partially needed in the production of electronic boards, and at present, the problem of low productivity caused by waste of operation time exists in the process production process. In order to solve the technical problem, the inventor provides an electronic board laminating method.

Disclosure of Invention

In order to solve the technical problem, the technical scheme provided by the invention is an electronic board laminating method which comprises the following steps:

a pressing method for electronic boards includes two pressing methods, wherein,

the first method comprises the following specific steps:

s1, placing an A1 electronic board on a N1 pressing machine from a V1, and continuously pressing the A1 electronic board for N seconds;

s2. in the process of pressing the electronic board N1, placing the electronic board A2 on a N2 pressing machine from the V1, and continuously pressing the electronic board A2 for N seconds;

s3, in the process of pressing N2, the pressed A1 electronic board is placed back to the A1 position on the V1;

s4, placing the A3 electronic board on an N1 pressing machine from the V1, and continuously pressing the A3 electronic board for N seconds;

s5, in the process of pressing the N1, the pressed A2 electronic board is placed back to the A2 position on the V1;

s6, placing the A4 electronic board on an N2 pressing machine from the V1, and continuously pressing the A4 electronic board for N seconds;

s7, in the process of pressing N2, the pressed A3 electronic board is placed back to the A3 position on the V1;

s8, uncovering the lower right corner of the V1 to expose the V2 stacked below the V1 and the B1 electronic board placed on the V2;

s9, placing the B1 electronic board on an N1 pressing machine from the V2, and continuously pressing the B1 electronic board for N seconds;

s10. in the process of pressing the N1, the pressed A4 electronic board is put back to the A4 position on the V1;

s11, removing the V1 from the rolling production line;

s12, repeating the operation process of S2-S11 on the electronic boards on the V2-Vn until all the electronic boards are pressed;

the second method comprises the following specific steps:

s1, pressing the A3 and A4 electronic boards on V1, and putting the A3 and A4 electronic boards on one side;

s2, placing the A1 electronic board on an N1 pressing machine from the V1, and continuously pressing the A1 electronic board for N seconds;

s3. in the process of pressing the electronic board N1, placing the electronic board A2 on a N2 pressing machine from the V1, and continuously pressing the electronic board A2 for N seconds;

s4, removing the V1 from the rolling production line;

s5. in the process of N2 pressing, the pressed A1 electronic board is placed on the V2 at the B1 position, meanwhile, the B1 electronic board is placed on an N1 pressing machine, and the B1 electronic board is continuously pressed for N seconds;

s6. in the process of pressing the N1, placing the pressed A2 electronic board on the V2 at the B2 position, simultaneously placing the B2 electronic board in an N2 pressing machine, and continuously pressing the B2 electronic board for N seconds;

s7. in the process of N2 pressing, placing the pressed B1 electronic board on a V2 at a B3 position, simultaneously placing the B3 electronic board on an N1 pressing machine, and continuously pressing the B3 electronic board for N seconds;

s8, in the process of pressing the N1, placing the pressed B2 electronic board on a V2 at a B4 position, simultaneously placing the B4 electronic board in an N2 pressing machine, and continuously pressing the B4 electronic board for N seconds;

s9, at the moment, the B3 electronic board is arranged on an N1 laminating machine, the B4 electronic board is arranged on an N2 laminating machine, and the V2 is moved away from the rolling production line;

s10, repeating the operation flow from S5 to S9 on the electronic boards on the V3-Vn until all the electronic boards are pressed.

As a refinement, in both the first method and the second method, the duration of pressing is six seconds.

Compared with the prior art, the invention has the advantages that: aiming at the stamping process of a connecting plate of an electronic product, the invention effectively reduces time waste, improves the utilization rate of materials and labor productivity by optimizing operation steps and processes while ensuring the requirements of the size, shape and position precision of a workpiece, realizes the improvement of productivity and is worthy of popularization.

Drawings

Fig. 1 is an auxiliary explanatory view of a first method in the electronic board laminating method according to the present invention.

Fig. 2 is an auxiliary illustration of a second method of the electronic board laminating method according to the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be obtained by a person skilled in the art without inventive step based on the embodiments of the present invention, are within the scope of protection of the present invention.

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "inner", "outer", "vertical", "circumferential", "radial", "axial", and the like, indicate orientations and positional relationships based on those shown in the drawings, are only for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.

The electronic board laminating method of the present invention will be further described in detail with reference to the accompanying drawings.

Referring to the drawings, FIGS. 1-2 show two methods for pressing electronic boards, wherein,

the first method comprises the following specific steps:

s1, placing an A1 electronic board on a N1 pressing machine from a V1, and continuously pressing the A1 electronic board for N seconds;

s2. in the process of pressing the electronic board N1, placing the electronic board A2 on a N2 pressing machine from the V1, and continuously pressing the electronic board A2 for N seconds;

s3, in the process of pressing N2, the pressed A1 electronic board is placed back to the A1 position on the V1;

s4, placing the A3 electronic board on an N1 pressing machine from the V1, and continuously pressing the A3 electronic board for N seconds;

s5, in the process of pressing the N1, the pressed A2 electronic board is placed back to the A2 position on the V1;

s6, placing the A4 electronic board on an N2 pressing machine from the V1, and continuously pressing the A4 electronic board for N seconds;

s7, in the process of pressing N2, the pressed A3 electronic board is placed back to the A3 position on the V1;

s8, uncovering the lower right corner of the V1 to expose the V2 stacked below the V1 and the B1 electronic board placed on the V2;

s9, placing the B1 electronic board on an N1 pressing machine from the V2, and continuously pressing the B1 electronic board for N seconds;

s10. in the process of pressing the N1, the pressed A4 electronic board is put back to the A4 position on the V1;

s11, removing the V1 from the rolling production line;

s12, repeating the operation process of S2-S11 on the electronic boards on the V2-Vn until all the electronic boards are pressed;

the second method comprises the following specific steps:

s1, pressing the A3 and A4 electronic boards on V1, and putting the A3 and A4 electronic boards on one side;

s2, placing the A1 electronic board on an N1 laminating machine from the V1, and continuously pressing the A1 electronic board for N seconds;

s3. in the process of pressing the electronic board N1, placing the electronic board A2 on a N2 pressing machine from the V1, and continuously pressing the electronic board A2 for N seconds;

s4, removing the V1 from the rolling production line;

s5. in the process of N2 pressing, the pressed A1 electronic board is placed on the V2 at the B1 position, meanwhile, the B1 electronic board is placed on an N1 pressing machine, and the B1 electronic board is continuously pressed for N seconds;

s6. in the process of pressing the N1, placing the pressed A2 electronic board on the V2 at the B2 position, simultaneously placing the B2 electronic board in an N2 pressing machine, and continuously pressing the B2 electronic board for N seconds;

s7. in the process of N2 pressing, placing the pressed B1 electronic board on a V2 at a B3 position, simultaneously placing the B3 electronic board on an N1 pressing machine, and continuously pressing the B3 electronic board for N seconds;

s8, in the process of pressing the N1, placing the pressed B2 electronic board on a V2 at a B4 position, simultaneously placing the B4 electronic board in an N2 pressing machine, and continuously pressing the B4 electronic board for N seconds;

s9, at the moment, the B3 electronic board is arranged on an N1 laminating machine, the B4 electronic board is arranged on an N2 laminating machine, and the V2 is moved away from the rolling production line;

s10, repeating the operation flow from S5 to S9 on the electronic boards on the V3-Vn until all the electronic boards are pressed.

In the present embodiment, as shown in the figure, in both the first method and the second method, the duration of pressing is six seconds.

Formula for increasing yield of electronic board lamination:

y pieces 2(X pieces) -2(Z pieces)

2(X pieces) is the maximum total throughput of two press machines, 2 (z)

One) is the amount of production wasted in the production process representing two press machines

Piece X3600 sec/6 sec 10 h

Piece Z is t/6 seconds

X is the maximum total throughput of a press, y is the actual throughput, z is the wasted throughput of a press, t seconds is the time wasted during production, 6 seconds is the duration of pressing of the electronic board at O1, and 10 hours is the operating time. The emphasis is on reducing wasted time.

According to the invention, by changing the pressing and taking and placing sequence of the electronic board, the time wasted in operation is reduced, and the production capacity of a production line is further improved.

The present invention and its embodiments have been described above, and the description is not intended to be limiting, and the drawings are only one embodiment of the present invention, and the actual structure is not limited thereto. In summary, those skilled in the art should appreciate that they can readily use the disclosed conception and specific embodiments as a basis for designing or modifying other structures for carrying out the same purposes of the present invention without departing from the spirit and scope of the invention as defined by the appended claims.

Claims (2)

1. A method for laminating an electronic board is characterized in that: there are two types of pressing methods, among them,

the first method comprises the following specific steps:

s1, placing an A1 electronic board on a N1 pressing machine from a V1, and continuously pressing the A1 electronic board for N seconds;

s2. in the process of pressing the electronic board, taking the A2 from the V1, placing the electronic board in an N2 pressing machine, and continuously pressing the A2 electronic board for N seconds;

s3, in the process of pressing N2, the pressed A1 electronic board is placed back to the A1 position on the V1;

s4, placing the A3 electronic board on an N1 pressing machine from the V1, and continuously pressing the A3 electronic board for N seconds;

s5, in the process of pressing the N1, the pressed A2 electronic board is placed back to the A2 position on the V1;

s6, placing the A4 electronic board on an N2 pressing machine from the V1, and continuously pressing the A4 electronic board for N seconds;

s7, in the process of pressing N2, the pressed A3 electronic board is placed back to the A3 position on the V1;

s8, uncovering the lower right corner of the V1 to expose the V2 stacked below the V1 and the B1 electronic board placed on the V2;

s9, placing the B1 electronic board on an N1 pressing machine from the V2, and continuously pressing the B1 electronic board for N seconds;

s10. in the process of pressing the N1, the pressed A4 electronic board is put back to the A4 position on the V1;

s11, moving the V1 away from the rolling assembly line;

s12, repeating the operation process of S2-S11 on the electronic boards on the V2-Vn until all the electronic boards are pressed;

the second method comprises the following specific steps:

s1, pressing the A3 and A4 electronic boards on V1, and putting the A3 and A4 electronic boards on one side;

s2, placing the A1 electronic board on an N1 pressing machine from the V1, and continuously pressing the A1 electronic board for N seconds;

s3. in the process of pressing the electronic board N1, placing the electronic board A2 on a N2 pressing machine from the V1, and continuously pressing the electronic board A2 for N seconds;

s4, removing the V1 from the rolling production line;

s5. in the process of N2 pressing, the pressed A1 electronic board is placed on the V2 at the B1 position, meanwhile, the B1 electronic board is placed on an N1 pressing machine, and the B1 electronic board is continuously pressed for N seconds;

s6. in the process of pressing the N1, placing the pressed A2 electronic board on the V2 at the B2 position, simultaneously placing the B2 electronic board in an N2 pressing machine, and continuously pressing the B2 electronic board for N seconds;

s7. in the process of N2 pressing, placing the pressed B1 electronic board on a V2 at a B3 position, simultaneously placing the B3 electronic board on an N1 pressing machine, and continuously pressing the B3 electronic board for N seconds;

s8, in the process of pressing the N1, placing the pressed B2 electronic board on a V2 at a B4 position, simultaneously placing the B4 electronic board in an N2 pressing machine, and continuously pressing the B4 electronic board for N seconds;

s9, at the moment, the B3 electronic board is arranged on an N1 laminating machine, the B4 electronic board is arranged on an N2 laminating machine, and the V2 is moved away from the rolling production line;

s10, repeating the operation flow from S5 to S9 on the electronic boards on the V3-Vn until all the electronic boards are pressed.

2. An electronic board laminating method according to claim 1, wherein: in both the first and second methods, the duration of pressing is six seconds.

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