CN114902085A - Resin composition for low-reflection light-shielding layer, and low-reflection light-shielding layer and low-reflection light-shielding laminate using same - Google Patents
Resin composition for low-reflection light-shielding layer, and low-reflection light-shielding layer and low-reflection light-shielding laminate using same Download PDFInfo
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- CN114902085A CN114902085A CN202180007778.3A CN202180007778A CN114902085A CN 114902085 A CN114902085 A CN 114902085A CN 202180007778 A CN202180007778 A CN 202180007778A CN 114902085 A CN114902085 A CN 114902085A
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- shielding layer
- reflection light
- resin particles
- solid content
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- 229910052749 magnesium Inorganic materials 0.000 description 1
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- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
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- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
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- 238000004519 manufacturing process Methods 0.000 description 1
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- 229910052982 molybdenum disulfide Inorganic materials 0.000 description 1
- 229910000476 molybdenum oxide Inorganic materials 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 150000002791 naphthoquinones Chemical class 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
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- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
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- 150000004893 oxazines Chemical class 0.000 description 1
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- 229920006289 polycarbonate film Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
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- 229920002530 polyetherether ketone Polymers 0.000 description 1
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- 229920000642 polymer Polymers 0.000 description 1
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- 229920001155 polypropylene Polymers 0.000 description 1
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- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 239000004172 quinoline yellow Substances 0.000 description 1
- IZMJMCDDWKSTTK-UHFFFAOYSA-N quinoline yellow Chemical compound C1=CC=CC2=NC(C3C(C4=CC=CC=C4C3=O)=O)=CC=C21 IZMJMCDDWKSTTK-UHFFFAOYSA-N 0.000 description 1
- 229940051201 quinoline yellow Drugs 0.000 description 1
- 235000012752 quinoline yellow Nutrition 0.000 description 1
- 238000007152 ring opening metathesis polymerisation reaction Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000000344 soap Substances 0.000 description 1
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- 125000005402 stannate group Chemical group 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
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- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 1
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- 150000004867 thiadiazoles Chemical class 0.000 description 1
- 229930192474 thiophene Natural products 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- TUQOTMZNTHZOKS-UHFFFAOYSA-N tributylphosphine Chemical compound CCCCP(CCCC)CCCC TUQOTMZNTHZOKS-UHFFFAOYSA-N 0.000 description 1
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- BSVBQGMMJUBVOD-UHFFFAOYSA-N trisodium borate Chemical compound [Na+].[Na+].[Na+].[O-]B([O-])[O-] BSVBQGMMJUBVOD-UHFFFAOYSA-N 0.000 description 1
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 description 1
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- 239000011787 zinc oxide Substances 0.000 description 1
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- BNEMLSQAJOPTGK-UHFFFAOYSA-N zinc;dioxido(oxo)tin Chemical compound [Zn+2].[O-][Sn]([O-])=O BNEMLSQAJOPTGK-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/02—Diffusing elements; Afocal elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/02—Bodies
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Laminated Bodies (AREA)
- Optical Elements Other Than Lenses (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
Abstract
The invention provides a low reflection light shield layer with small surface reflectivity and L value. A resin composition for a low-reflection light-shielding layer, comprising at least a binder resin, a coloring material, resin particles and a dispersion medium, wherein the content of the binder resin is 1 to 30% by mass in total in terms of solid content, the content of the coloring material is 0.1 to 35% by mass in total in terms of solid content, and the content of the resin particles is 50 to 95% by mass in total in terms of solid content. Here, the resin particles preferably have an average particle size of 3 to 20 μmDiameter D 50 . In addition, the resin particles preferably contain colored resin particles.
Description
Technical Field
The present invention relates to a resin composition for a low-reflection light-shielding layer having a novel composition, and a low-reflection light-shielding layer laminate using the same.
Background
In various optical devices such as single-lens reflex cameras, small-sized cameras, video cameras, and smart phones, light-shielding members having high light-shielding properties and low gloss are used from the viewpoint of removing unnecessary incident light and reflected light and suppressing the occurrence of halos, lens halos, ghosts, and the like. For example, lens units, such as light blocking plates and light blocking rings, which are interposed between lenses for blocking unnecessary light, and camera modules are mounted on various optical devices. In addition, in shutters, diaphragm members, and the like of various optical apparatuses such as single-lens reflex cameras, compact cameras, video cameras, and the like, members having light-shielding properties are used from the viewpoint of preventing the occurrence of halos, ghosts, and the like due to external light.
On the other hand, due to the remarkable progress of the sensing technology in recent years, the introduction of advanced sensing technology has been studied in various moving bodies (hereinafter, referred to as "moving carriers") such as automobiles, trains, electric trains, ships, cargo ships, aircrafts, airships, rockets, conveyors, and vehicles. For example, in order to detect an obstacle (for example, another vehicle, a pedestrian, a guardrail, a house, or the like) existing in front of a host vehicle, development of an automobile in which an optical sensor such as a lens unit (a camera module) including an imaging element or an infrared sensor is provided in a vehicle interior has been advanced.
Conventionally, as a light-shielding member for various optical devices, a light-shielding member obtained by coating a metal thin film with a black paint has been used. However, in recent years, replacement of lightweight plastic materials is being studied.
As such a light-shielding member made of a nonmetal, the present applicant has proposed a light-shielding member for optical devices, which comprises a film base and a light-shielding film formed on at least one surface of the base, wherein the light-shielding film comprises a binder resin, carbon black, a particulate lubricant and fine particles, the binder resin and the lubricant are contained in respective proportions of 70 wt% or more and 5 to 15 wt%, and the lubricant has a density higher than that of the fine particles (see patent document 1).
Documents of the prior art
Patent document
Patent document 1: japanese patent laid-open publication No. 2011-123255
Disclosure of Invention
Problems to be solved by the invention
In the technique of patent document 1, a light-shielding film contains 70 wt% or more of a binder resin and about 2 to 5 wt% of fine particles such as silica, and further contains 5 to 15 wt% of a specific lubricant having a low density. However, in this formula, the light-shielding film has a diffuse reflectance (550nm) including regular reflection and a diffuse reflectance (905nm) including regular reflection both as large as 5% or more, and there is still room for improvement in the surface reflectance. In recent years, from the viewpoint of design, etc., the popularity of low-gloss and deep black designs having a high-grade feeling is increasing, and accommodation thereof is being sought. However, in the technique of patent document 1, for example, the CIE 1976L a b color space L value is 25 or more, and there is still room for improvement in terms of the blackness.
In general, the surface reflectance of the light-shielding film tends to decrease as the surface roughness (Ra, Rz, etc.) of the light-shielding film increases. On the other hand, the larger the surface roughness (Ra, Rz, etc.) of the light-shielding film, the larger the L value in CIE 1976L a b color space tends to be. That is, in the design guideline described in patent document 1, when the surface roughness (Ra, Rz, etc.) of the light-shielding film is increased in order to reduce the surface reflectance of the light-shielding film, the L value is also increased at the same time, and 3 of low surface reflectance, low L value, and low surface roughness cannot be simultaneously achieved. Therefore, new design guidelines are sought that can achieve these 3 at the same time.
The present invention has been made in view of the above problems. That is, an object of the present invention is to provide a resin composition and the like having a novel composition that can realize a low-reflection light shielding layer having a small surface reflectance and L value. Another object of the present invention is to provide a resin composition having a novel composition that can realize a low-reflection light-shielding layer having a small surface reflectance, L value, and surface roughness.
Another object of the present invention is to provide a low-reflection light-shielding layer and a low-reflection light-shielding layer laminate, which have low surface reflectance and low L value. Another object of the present invention is to provide a low-reflection light-shielding layer and a low-reflection light-shielding layer laminate having a small surface reflectance, L value, and surface roughness. Further, the present invention has a more preferable object to provide a high-performance low-reflection member, a low-reflection member for optical devices, a light-shielding low-reflection member for optical devices, and the like, each of which uses the low-reflection light-shielding layer and the low-reflection light-shielding layered body.
Means for solving the problems
The present inventors have intensively studied the surface shape, optical properties, and the like of a film in order to solve the above problems, and as a result, have found a resin composition different from the conventional one, and have found that the above problems can be solved by the novel resin composition, and finally have completed the present invention.
[1] A resin composition for a low-reflection light-shielding layer, comprising at least a binder resin, a coloring material, resin particles and a dispersion medium, wherein the content of the binder resin is 1 to 30% by mass in total in terms of solid content relative to the total solid content, the content of the coloring material is 0.1 to 35% by mass in total in terms of solid content relative to the total solid content, and the content of the resin particles is 50 to 95% by mass in total in terms of solid content relative to the total solid content.
[2]According to the above [1]The resin composition for a low-reflection light-shielding layer, wherein the resin particles have an average particle diameter D of 3 to 20 [ mu ] m 50 。
[3] The resin composition for a low-reflection light-shielding layer according to [1] or [2], wherein the resin particles contain colored resin particles.
[4] A low-reflection light-shielding layer comprising at least a binder resin, a coloring material dispersed in the binder resin, and resin particles dispersed in the binder resin, wherein the binder resin is contained in a proportion of 1 to 30% by mass in total in terms of solid content, the coloring material is contained in a proportion of 0.1 to 35% by mass in total in terms of solid content, and the resin particles are contained in a proportion of 50 to 95% by mass in total in terms of solid content.
[5] The low reflection light-shielding layer according to item [4], wherein the resin particles contain colored resin particles.
[6]According to the above [4]]Or [5]]The low reflection light shielding layer is characterized in that the resin particles have an average particle diameter D of 3 to 20 [ mu ] m 50 。
[7] The low-reflection light-shielding layer according to any one of the above [4] to [6], wherein the surface roughness Ra of one surface side is 0.2 to 0.7 μm.
[8] The low-reflection light-shielding layer according to any one of the above [4] to [7], wherein the surface roughness Rz of one surface side is 2.0 to 5.0 μm.
[9] The low-reflection light-shielding layer according to any one of the above [4] to [8], wherein the 550mn diffuse reflectance (including regular reflectance) on the one surface side is 0.0% or more and less than 3.0%.
[10] The low-reflection light-shielding layer according to any one of the above [4] to [9], wherein the 905nm diffuse reflectance (including regular reflectance) on the one surface side is 0.0% or more and less than 3.0%.
[11] The low reflection light-shielding layer according to any one of [4] to [10], wherein the value of L in the CIE 1976 La b color space on one surface side is 0 to 18.
[12] The low-reflection light-shielding layer according to any one of [4] to [11], which has an optical density OD of 0.5 or more.
[13] The low-reflection light-shielding layer according to any one of the above [4] to [12], which has a thickness of 1 to 30 μm.
[14] A low-reflection light-shielding layer laminate comprising a base material and the low-reflection light-shielding layer according to any one of [4] to [13] provided on at least one principal surface side of the base material.
[15] A low-reflection light-shielding layer laminate comprising a base film, the low-reflection light-shielding layer according to any one of [4] to [13] provided on one main surface side of the base film, and the low-reflection light-shielding layer according to any one of [4] to [13] provided on the other main surface side of the base film.
Effects of the invention
According to the present invention, a resin composition having a novel composition which can realize a low-reflection light-shielding layer having a small surface reflectance and surface gloss, and the like can be provided. Further, according to a preferred embodiment of the present invention, a resin composition having a novel composition that can realize a low-reflection light shielding layer having a small surface reflectance, L value, and surface roughness, and the like can be provided. Further, according to the present invention, a low-reflection light-shielding layer and a low-reflection light-shielding layer laminate, etc., having small surface reflectance and surface gloss can be provided. Therefore, for example, deterioration or degradation of the captured image and detection accuracy of the optical sensor can be suppressed, and the captured image and detection accuracy can be further improved. Further, since a low-reflection light-shielding layer having a darker black appearance or the like can be realized, the design of various optical devices on which the low-reflection light-shielding layer is mounted can be improved. Further, according to the present invention, it is possible to realize a high-performance low-reflection member, a low-reflection member for an optical device, a light-shielding low-reflection member for an optical device, and the like, which are not newly designed in the past.
Drawings
Fig. 1 is a schematic cross-sectional view showing a low-reflection light-shielding layer 21 and a low-reflection light-shielding layer laminate 100 according to an embodiment.
Detailed Description
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. It should be noted that the positional relationship of the upper, lower, left, right, and the like is, unless otherwise noted, based on the positional relationship shown in the drawings. The dimensional ratios in the drawings are not limited to the illustrated ratios. The following embodiments are illustrative of the present invention, and the present invention is not limited thereto. In the present specification, for example, the expression of a numerical range of "1 to 100" includes both the upper limit value "100" and the lower limit value "1". Other numerical ranges are also expressed in the same manner.
The resin composition for a low-reflection light-shielding layer according to the first embodiment of the present invention (hereinafter, may be simply referred to as "resin composition") contains at least a binder resin, a coloring material, resin particles, and a dispersion medium. The binder resin, the coloring material, and the resin particles may be dispersed in the dispersion medium, but some of them may be dissolved in the dispersion medium.
As the binder resin, a binder resin known in the art can be used, and the kind thereof is not particularly limited. Specific examples thereof include thermoplastic resins and thermosetting resins such as poly (meth) acrylic resins, polyester resins, polyvinyl acetate resins, polyvinyl chloride resins, polyvinyl butyral resins, cellulose resins, polystyrene/polybutadiene resins, polyurethane resins, alkyd resins, acrylic resins, unsaturated polyester resins, epoxy ester resins, epoxy acrylate resins, urethane acrylate resins, polyester acrylate resins, polyether acrylate resins, phenol resins, melamine resins, urea resins, and diallyl phthalate resins, but the present invention is not particularly limited thereto. In addition, a thermoplastic elastomer, a thermosetting elastomer, an ultraviolet curable resin, an electron beam curable resin, or the like can be used. These can be used alone in 1, in addition can also be combined with more than 2. The binder resin may be appropriately selected and used according to the required performance and use. For example, in applications requiring heat resistance, thermosetting resins are preferred.
The content (total amount) of the binder resin in the resin composition is not particularly limited, and may be appropriately set to the extent necessary for film formation. From the viewpoint of achieving a low-reflection light shielding layer having more excellent surface reflectance and L value and further having lower surface roughness as required in consideration of the blending balance with other essential components and optional components, the content (total amount) of the binder resin is preferably 1 to 30% by mass in total, more preferably 2 to 25% by mass in total, further preferably 3 to 20% by mass in total, and particularly preferably 5 to 15% by mass in total, in terms of solid content relative to the total amount of solid content of the resin composition. When the coloring material or the resin particles contain a binder resin component, the binder resin component is also included in the total amount of the binder resin in the content ratio mentioned here.
As the coloring material, pigments and dyes known in the art can be used, and the kind thereof is not particularly limited. The light-shielding property and the light-transmitting property can be adjusted by appropriately selecting the type, particle size, and amount of the coloring material used. Specific examples include, but are not limited to, magnetite-based black, copper/iron/manganese-based black, titanium black, carbon black, and aniline black. The coloring material is preferably a black inorganic pigment or a black organic pigment, from the viewpoint of light-shielding properties, light-transmitting properties, ease of adjustment of color tone, and the like. These can be used alone in 1, in addition can also be combined with more than 2. Among these, inorganic pigments are desirable as coloring materials, and specifically, titanium black, carbon black, and aniline black are preferable, and carbon black and aniline black are more preferable. As the carbon black, those produced by various known production methods such as oil furnace black, lamp black, channel black, gas furnace black, acetylene black, thermal black, ketjen black, etc. are known, but the kind thereof is not particularly limited. In particular, conductive carbon black is preferably used as the coloring material from the viewpoint of imparting conductivity and preventing electrification due to static electricity. Carbon black has a long history, and various grades of carbon black monomers and carbon black dispersions are commercially available from mitsubishi chemical Corporation, asahacbon Corporation, royal pigment Corporation, RESINOCOLOR industrial Corporation, Cabot Corporation, DEGUSSA Corporation, for example, and can be appropriately selected from these according to the required performance and application. These can be used alone in 1, in addition can also be combined with more than 2.
The particle size of the coloring material may be appropriately set according to the type of the coloring material used, the required performance, and the like, and is not particularly limited. For example, when the coloring material is carbon black, the average particle diameter D 50 Preferably 0.01 to 2.0 μm, more preferably 0.05 to 1.0 μm, and still more preferably 0.08 to 0.5. mu.m. In the present specification, the average particle diameter D is 50 Means the volume-based median particle diameter (D) measured by a laser diffraction particle size distribution measuring apparatus (e.g., Shimadzu corporation: SALD-7000, etc.) 50 )。
The content (total amount) of the coloring material in the resin composition may be appropriately set in accordance with the required performance such as light-shielding property and low gloss, and is not particularly limited. From the viewpoint of achieving a low-reflection light-shielding layer having more excellent surface reflectance and L-value and further having lower surface roughness as required in consideration of the blending balance with other essential components and optional components, the content (total amount) of the coloring material is preferably 0.1 to 35% by mass in total, more preferably 1 to 30% by mass in total, further preferably 3 to 20% by mass in total, and particularly preferably 5 to 15% by mass in total, in terms of solid content relative to the total solid content of the resin composition. The content of the coloring material in the case of using colored resin particles as the resin particles is defined as the total of the mass of the coloring material and the mass of the coloring material contained in the resin particles (the total amount of the coloring material in the composition).
As the resin particles, those known in the art can be used, and the kind thereof is not particularly limited. Specifically, the resin particles include, but are not particularly limited to, resin particles of a fluororesin such as polymethyl methacrylate, polystyrene, polyester, polyurethane, silicone resin, polyvinylidene fluoride, and a rubber. These can be used alone in 1, in addition can also be combined with more than 2. The appearance of the resin particles may be any of transparent, translucent, and opaque, and is not particularly limited. The resin particles may be colorless or colored. For example, by using resin particles (colored resin particles) colored black, gray, purple, blue, brown, red, green, or the like, a low-reflection light-shielding layer having high optical density and high chroma can be realized even when the amount of the coloring material used is relatively small. In addition, by using the colored resin particles, the L value can be significantly reduced as compared with the case of using inorganic particles such as silica in particular.
From the viewpoint of obtaining the surface reflectance and L value described above, the resin particles preferably have a relatively large particle diameter. Specifically, the average particle diameter D of the resin particles 50 The lower limit of (B) is preferably 1 μm or more, more preferably 2 μm or more, further preferably 4 μm or more, and particularly preferably 5 μm or more. The upper limit is 30 μm or less, more preferably 20 μm or less, and particularly preferably 15 μm or less. From the viewpoint of productivity, handling properties, and the like, it is sometimes required to use an average particle diameter D having a degree of suppressing aggregation of resin particles at the time of coating or not excessively increasing the particle diameter of an aggregate even if the resin particles are assumed to be aggregated 50 The resin particles of (1).
The content (total amount) of the resin particles in the resin composition may be appropriately set in accordance with the required performance such as light-shielding property and low gloss, and is not particularly limited. From the viewpoint of achieving a low-reflection light shielding layer having more excellent surface reflectance and L value and further having lower surface roughness as required in consideration of the blending balance with other essential components and optional components, the content (total amount) of the resin particles is preferably 50 to 95% by mass in total, more preferably 55 to 90% by mass in total, and still more preferably 60 to 85% by mass in total, in terms of solid content relative to the total solid content of the resin composition. The content of the resin particles in the case of using colored resin particles as the resin particles is based on the mass of the resin particles containing the coloring material contained in the resin particles.
The resin composition of the present embodiment may contain a known coloring material in addition to the coloring material and the resin particles described above, in order to control the color tone. Examples of the color material include diarylmethane; triarylmethane-based; a thiadiazole series; methine systems such as merocyanine and pyrazolone methine; azomethine systems such as indoaniline, acetophenone azomethine, pyrazolomethylimine, imidazoleimine, and imidazoleimine; a xanthene group; an oxazine series; cyanomethylene systems such as dicyanostyrene and tricyanostyrene; a thiazine system; an azine system; acridine series; a benzene azo series; azo systems such as pyridone azo, thiophene azo, isothiazole azo, pyrrole azo, imidazole azo, thiadiazole azo, triazole azo, and bisazo; spiropyrans; indolino spiropyrane series; a fluorane series; naphthoquinone series; anthraquinone series; quinoline yellow, but is not particularly limited thereto. For example, 1 kind of known color materials of black, blue, green, yellow, and red may be used alone, or 2 or more kinds may be used in combination. When the color material is used, the content (total amount) of the color material may be appropriately set according to the required performance, and is not particularly limited, but considering the blending balance with other essential components and optional components, the total amount is preferably 0.1 to 10% by mass, more preferably 0.5 to 5% by mass, and still more preferably 1 to 3% by mass in terms of solid content relative to the total amount of solid content of the resin composition.
The resin composition may contain a known matting agent (matte agent) for adjusting the gloss, color tone, and the like of the resin composition. Examples of the matting agent include kaolin, calcined clay, uncalcined clay, silica (e.g., natural silica, fused silica, amorphous silica, hollow silica, wet silica, synthetic silica, fumed silica, etc.), aluminum compounds (e.g., boehmite, aluminum hydroxide, alumina, hydrotalcite, aluminum borate, aluminum nitride, etc.), magnesium compounds (e.g., magnesium aluminum silicate, magnesium carbonate, magnesium oxide, magnesium hydroxide, etc.), calcium compounds (e.g., calcium carbonate, calcium hydroxide, calcium sulfate, calcium sulfite, calcium borate, etc.), molybdenum compounds (e.g., molybdenum oxide, zinc molybdate, etc.), talc (e.g., natural talc, calcined talc, etc.), mica (mica), titanium oxide, zinc oxide, zirconium oxide, barium sulfate, zinc borate, barium metaborate, sodium borate, boron nitride, etc, And stannates such as boron nitride, silicon nitride, carbon nitride, strontium titanate, barium titanate, and zinc stannate, but the present invention is not limited thereto. These can be used alone in 1, in addition can also be combined with more than 2. When the matting agent is used, the content (total amount) of the matting agent may be appropriately set depending on the required performance, and is not particularly limited, but is preferably 0.1 to 10% by mass in total, more preferably 0.5 to 5% by mass in total, and still more preferably 1 to 3% by mass in total, in terms of solid content relative to the total solid content of the resin composition, from the viewpoint of achieving a low-reflection light shielding layer having more excellent surface reflectance and surface gloss in consideration of the blend balance with other essential components and optional components.
Further, the resin composition may contain various additives known in the art. Specific examples thereof include, but are not particularly limited to, lubricants, conductive agents, flame retardants, antibacterial agents, antifungal agents, antioxidants, plasticizers, resin curing agents, curing accelerators, leveling agents, flow control agents, defoaming agents, and dispersing agents. Examples of the lubricant include hydrocarbon lubricants such as polyethylene, paraffin wax, and wax; fatty acid-based lubricants such as stearic acid and 12-hydroxystearic acid; amide-based lubricants such as stearic acid amide, oleic acid amide, and erucic acid amide; ester lubricants such as butyl stearate and monoglyceride stearate; an alcohol-based lubricant; solid lubricants such as metal soaps, talc, molybdenum disulfide, and the like; polytetrafluoroethylene wax, etc., but is not particularly limited thereto. Among these, organic lubricants are particularly preferably used. When an ultraviolet-curable resin or an electron beam-curable resin is used as the binder resin, for example, a sensitizer such as n-butylamine, triethylamine or tri-n-butylphosphine, or an ultraviolet absorber can be used. These can be used alone in 1, in addition can also be combined with more than 2. The content ratio of these is not particularly limited, but is preferably 0.01 to 5% by mass in terms of solid content relative to the total solid content of the resin composition.
The dispersion medium is not particularly limited, and examples thereof include water; ketone solvents such as methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone; ester solvents such as methyl acetate, ethyl acetate, and butyl acetate; ether solvents such as methyl cellosolve and ethyl cellosolve; alcohol solvents such as methyl alcohol, ethyl alcohol and isopropyl alcohol, and mixed solvents thereof, but the present invention is not limited to these. The amount of the dispersion medium to be used is not particularly limited as long as the film formation of the low-reflection light shielding layer can be performed, but in general, the amount may be adjusted so that the total solid content of the resin composition becomes 10 to 90 mass%, preferably 20 to 80 mass%, and more preferably 25 to 70 mass%, from the viewpoint of workability, and the like.
The low-reflection light shielding layer 21 of the present embodiment can be obtained by applying the resin composition described above in a predetermined shape. Fig. 1 is a cross-sectional view showing a key part of a low reflection light shielding layer laminate 100 including the low reflection light shielding layer 21. The low-reflection light-shielding layer laminate 100 includes: a substrate 11, a low reflection light shielding layer 21 provided on one main surface 11a side of the substrate 11, and an adhesive layer 31 provided on the other main surface 11b side of the substrate 11. That is, the low reflection light shielding layer laminate 100 of the present embodiment has a laminate structure (3-layer structure) in which at least the low reflection light shielding layer 21, the base material 11, and the adhesive layer 31 are arranged in this order. In this laminated structure, the low reflection light shielding layer 21 is disposed on the outermost surface on the front side, the adhesive layer 31 is disposed on the outermost surface on the inner side, and the low reflection light shielding layer 21 and the adhesive layer 31 are disposed in a state of being exposed on the outermost surfaces on the front side and the inner side, respectively. In addition, any layer such as an antistatic layer, a protective layer, an antifouling layer, an antibacterial layer, an antireflection film, or a printing layer may be provided on the surface 21a of the low reflection light shielding layer 21 as necessary within a range not departing from the gist of the present invention. The surface 21a of the low-reflection light shielding layer 21 may be subjected to any surface treatment such as antistatic treatment, stain-proofing treatment, antibacterial treatment, and antireflection treatment as necessary within a range not departing from the gist of the present invention.
Here, the phrase "disposed on one (the other) surface side" in the present specification means not only the case where the low reflection light shielding layer 21 and the adhesive layer 31 are directly placed on the surface (for example, the main surface 11a and the main surface 11b) of the substrate 11 as in the present embodiment, but also the case where the low reflection light shielding layer 21 and the adhesive layer 31 are disposed apart from the substrate 11 by interposing an arbitrary layer (for example, a primer layer, an adhesive layer, a conductive layer, or the like), which is not shown, between the main surface 11a of the substrate 11 and the low reflection light shielding layer 21 and between the main surface 11b of the substrate 11 and the adhesive layer 31. The laminated structure including at least the low-reflection light-shielding layer 21 and the adhesive layer 31 includes not only a structure in which only the low-reflection light-shielding layer 21 and the adhesive layer 31 are directly laminated on the substrate 11 but also a structure in which any of the layers described above is further provided between layers having a 3-layer structure.
The type of the substrate 11 is not particularly limited as long as it can support the low reflection light shielding layer 21 and the adhesive layer 31. Specific examples of the substrate 11 include, but are not particularly limited to, metals, alloys, resin molded products, resin films, nonwoven fabrics, and glasses. As the metal or alloy, a metal material containing aluminum, magnesium, iron, or an alloy thereof is preferably used. In addition, from the viewpoint of dimensional stability, mechanical strength, weight reduction, and the like, it is preferable to use a synthetic resin as the base material 11. Specific examples of the synthetic resin include polyesters; ABS (acrylonitrile-butadiene-styrene); a polyimide; a polyamide; a polyamide-imide; polystyrene; a polycarbonate; (meth) acrylic acid series; a nylon system; polyolefin-based materials such as polyethylene and polypropylene; addition copolymers of norbornene and α -olefin, hydrogenated ring-opening metathesis polymers of norbornene, and cycloolefin systems such as cyclopentene, cyclohexene, 3-methylcyclohexene, and cyclooctene; a cellulose system; a polysulfone series; polyphenylene sulfide series; a polyethersulfone series; the polyether ether ketone resin is not particularly limited to these. In the present specification, "(meth) acrylic group" is a concept including both an acrylic group and a methacrylic group. These may be used alone in 1 kind, and in addition, may be used in any combination of 2 or more kinds. Further, a multilayer molded article (multicolor molded article) or a laminated film obtained by using these in any combination can be suitably used. Among these, the substrate 11 is preferably a substrate film of a synthetic resin from the viewpoints of dimensional stability, mechanical strength, weight reduction, and the like, and more preferably a polyester film, a polyimide film, a polycarbonate film, (meth) acrylic film, or a laminate film obtained by combining any of these films. In particular, a uniaxially or biaxially stretched film, particularly a biaxially stretched polyester film, is particularly preferable because it is excellent in mechanical strength and dimensional stability. In addition, in the heat-resistant application, polyimide films, polyamideimide films, and polyamide films are particularly preferable, and polyimide films and polyamideimide films are most preferable.
The thickness of the substrate 11 is not particularly limited and may be appropriately set according to the required performance and use. By providing the low-reflection light shielding layer 21 on the substrate 11, a surface having a small surface reflectance and a small surface gloss can be provided to the substrate 11 as a molded article, the substrate film as the film-shaped substrate 11, or the film-shaped or layered substrate 11, for example. In the case of using a base film as the film-shaped base material 11, the thickness of the base material 11 is set to 0.5 μm or more and less than 250 μm in view of weight reduction and thinning. The thickness of the base material 11 is preferably 36 μm or more and less than 250 μm from the viewpoint of strength, rigidity, and the like. On the other hand, the thickness of the base material 11 is preferably 1 μm or more and 50 μm or less, more preferably 1 μm or more and 25 μm or less, further preferably 4 μm or more and 10 μm or less, and particularly preferably 5 μm or more and 7 μm or less, from the viewpoint of further weight reduction and film thinning. From the viewpoint of improving the adhesiveness to the low-reflection light shielding layer 21 and the adhesive layer 31, the surface of the base material 11 may be subjected to various known surface treatments such as anchor treatment, corona treatment, and antistatic treatment, as necessary.
The appearance of the substrate 11 may be any one of transparent, translucent, and opaque, and is not particularly limited. For example, a foamed synthetic resin film such as a foamed polyester film or a synthetic resin film containing various pigments may be used. For example, a film having a high optical density can be obtained by using a synthetic resin film containing 1 or more kinds of dark pigments or dyes such as black, gray, purple, blue, brown, red, green, and the like. The pigment and dye used here may be appropriately selected from among those known in the art, and the type thereof is not particularly limited. Examples of the black pigment include black resin particles, magnetite black, copper/iron/manganese black, titanium black, and carbon black. Among these, black resin particles, titanium black, and carbon black are preferable because of their excellent concealing properties. These can be used alone in 1, in addition can also be combined with more than 2. When the substrate 11 contains a pigment or a dye, the content ratio thereof may be appropriately set according to the required performance and use, and is not particularly limited. The total content of the pigment and the dye is preferably 0.3 to 15% by mass, more preferably 0.4 to 12% by mass, and still more preferably 0.5 to 10% by mass, with respect to the total amount of the substrate 11, from the viewpoints of dimensional stability, mechanical strength, weight reduction, and the like.
The method for forming the low-reflection light-shielding layer 21 is not particularly limited, and a known method can be appropriately applied. The low-reflection light-shielding layer 21 can be obtained by applying and drying the resin composition on the base material 11 so as to have a predetermined thickness, and performing ionizing radiation treatment, heat treatment, pressure treatment, or the like as necessary. From the viewpoint of easily and inexpensively producing the high-performance low-reflection light-shielding layer 21 on the substrate 11 with good reproducibility, coating methods such as blade coating, dip coating, roll coating, bar coating, die coating, blade coating, air knife coating, kiss coating, spray coating, and spin coating are suitably used.
The thickness of the low-reflection light-shielding layer 21 is not particularly limited, and may be appropriately set according to the required performance and application, but is preferably 1 μm or more, more preferably 2 μm or more, further preferably 3 μm or more, particularly preferably 4 μm or more, and the upper limit side is preferably 30 μm or less, more preferably 25 μm or less, further preferably 20 μm or less, and particularly preferably 15 μm or less, from the viewpoint of the balance among high optical density, light weight, and thin film thickness.
The light-shielding property of the low reflection light-shielding layer 21 of the present embodiment may be appropriately set according to the required performance, and is not particularly limited. From the viewpoint of having higher light-shielding properties, the low-reflection light-shielding layer 21 preferably has an optical density OD of 0.5 or more, more preferably has an optical density OD of 1.0 or more, still more preferably has an optical density OD of 1.7 or more, and particularly preferably has an optical density OD of 2.0 or more. In the present specification, the Optical Density (OD) is a value measured by using a densitometer (X-Rite 361T: X-Rite) and a quadrature filter in accordance with ISO 5-2.
The adhesive layer 31 is provided on the principal surface 11b side of the substrate 11 and is a layer to be adhesively bonded to an adherend not shown. In this way, by adhesively bonding the adhesive layer 31 side to the adherend, a low-reflectance and low-gloss surface can be imparted to the adherend. The material constituting the adhesive layer 31 may be any material known in the art, and may be selected appropriately according to the surface material of the adherend (resin molded article, multilayer laminate using the resin molded article, nonwoven fabric, skin material, etc., metal, alloy, etc.), and the kind thereof is not particularly limited. For example, a rubber-based adhesive, an acrylic-based adhesive, an olefin-based adhesive, a silicone-based adhesive, or a urethane-based adhesive is preferably used.
The thickness of the adhesive layer 31 is not particularly limited, and may be appropriately set according to the required performance and application, but is preferably 0.1 μm or more, more preferably 0.2 μm or more, further preferably 0.5 μm or more, particularly preferably 1.0 μm or more, most preferably 3.0 μm or more, and the upper limit side is preferably 40 μm or less, more preferably 30 μm or less, further preferably 25 μm or less, particularly preferably 20 μm or less, and most preferably 10 μm or less, from the viewpoint of balance between weight reduction and film thinning.
As described above in detail, the low reflection light shielding layer laminate 100 of the present embodiment includes the low reflection light shielding layer 21 formed from the specific resin composition described above, and functions as a laminate film having a small surface reflectance and L value, and more preferably, a laminate film having a small surface reflectance, L value, and surface roughness. Therefore, by using the low-reflection light-shielding layer laminate 100 of the present embodiment as a low-reflection member, a low-reflection member for an optical device, a light-shielding member for an optical device, or the like, it is possible to suppress deterioration or lowering of the detection accuracy, for example, in the captured image of an optical sensor or the like.
Here, the surface reflectance of the low reflection light shielding layer laminate 100 (low reflection light shielding layer 21) of the present embodiment on the surface 21a side can be appropriately set in accordance with the required performance, and is not particularly limited. From the viewpoint of reducing the surface reflectance and the value of "L" and reducing the specular gloss, the 550nm diffuse reflectance (including regular reflectance) on the surface 21a side of the low-reflection light-shielding layer laminate 100 (low-reflection light-shielding layer 21) is preferably less than 3.0%, more preferably less than 2.8%, still more preferably less than 2.6%, and particularly preferably less than 2.4%. The lower limit of the diffusion reflectance at 550nm is not particularly limited, but the lower the value, the better, and therefore, the lower the value of 0.0% or more. Similarly, the diffusion reflectance (including regular reflectance) at 905nm on the front surface 21a side of the low reflection light-shielding layer laminate 100 (low reflection light-shielding layer 21) is preferably less than 3.0%, more preferably less than 2.8%, still more preferably less than 2.6%, and particularly preferably less than 2.4%. The lower limit of the diffusion reflectance of the same wavelength as 905nm is not particularly limited, but the lower the value, the better, the lower the value, and therefore, the lower the value may be 0.0% or more. In the present specification, the 550nm diffuse reflectance and the 905nm diffuse reflectance (including regular reflectance) mean values obtained by measuring the diffuse reflectance (including regular reflectance) (%) when light of each wavelength is incident, using a spectrophotometer (for example, SolidSpec-3700 (manufactured by shimadzu corporation)).
The value L of the CIE 1976L × a × b color space on the front surface 21a side of the low reflection light shielding layer laminate 100 (low reflection light shielding layer 21) according to the present embodiment may be appropriately set according to the required performance, and is not particularly limited. From the viewpoint of seeking a darker black appearance, and from the viewpoint of balancing low gloss, low reflectance, light absorption, and the like, the value of L on the surface 21a side of the low-reflection light-shielding layer laminate 100 (low-reflection light-shielding layer 21) is preferably 0 to 18, more preferably 16 or less, even more preferably 14 or less, and particularly preferably 13 or less. Here, the L value of the low reflection light shielding layer laminate 100 (low reflection light shielding layer 21) on the surface 21a side may be about the same as that of a conventional low reflection film or light shielding film (for example, 19 to 30), but it can be adjusted to a relatively small value by forming it from the above-mentioned specific resin composition, which is one of the features that the conventional technique does not have. Need to explainIn the present specification, the value of L a b color space means a value in accordance with JIS Z8720: 2012, using CIE standard illuminant D 65 The value measured with a spectrophotometer (for example, ZE6000 (manufactured by japan electric color corporation)).
On the other hand, the surface roughness Ra (arithmetic mean roughness) of the surface 21a side of the low reflection light-shielding layer laminate 100 (low reflection light-shielding layer 21) of the present embodiment may be appropriately set according to the required performance, but is not particularly limited, and is preferably 0.2 to 0.7 μm, more preferably 0.2 to 0.6 μm, further preferably 0.2 to 0.5 μm, and particularly preferably 0.3 to 0.5 μm from the viewpoint of reducing the surface reflectance and L x value and reducing the specular gloss. As is well known in the art, the surface roughness Ra is a parameter in the height direction of the surface irregularities, and represents the average of the absolute values of the height Zx of the roughness curve in the reference length. Here, the surface roughness Ra of the surface 21a side of the low reflection light-shielding layer laminate 100 (low reflection light-shielding layer 21) may be about the same as the surface roughness Ra of a conventional low reflection film or light-shielding film (for example, 1.0 to 2.0 μm), but it can be said that the surface roughness Ra can be adjusted to a relatively small value by forming the layer from the above-mentioned specific resin composition, which is one of the features that the conventional technique does not have.
The surface roughness Rz (maximum height) of the low reflection light shielding layer laminate 100 (low reflection light shielding layer 21) of the present embodiment on the surface 21a side can be appropriately set according to the required performance, but is not particularly limited, and is preferably 2.0 to 5.0 μm, more preferably 2.1 to 4.8 μm, further preferably 2.2 to 4.6 μm, and particularly preferably 2.5 to 4.5 μm from the viewpoint of reducing the surface reflectance and L value and reducing the specular gloss. As is well known in the art, the surface roughness Rz of the low-reflection light-shielding layer 21 is a parameter in the height direction of the surface irregularities, and indicates the sum of the maximum values of the projection height Zp and the recess depth Zv of the roughness curve in the reference length. Here, the surface roughness Rz on the surface 21a side of the low reflection light-shielding layer laminate 100 (low reflection light-shielding layer 21) may be the same as the surface roughness Rz of the low reflection film and the light-shielding film of the related art (for example, 6 to 12 μm), but it can be adjusted to a relatively small value by forming from the above-mentioned specific resin composition, which is one of the features that the related art does not have.
On the other hand, the surface roughness RSm of the low reflection light shielding layer laminate 100 (low reflection light shielding layer 21) of the present embodiment on the surface 21a side may be appropriately set according to the required performance, and is not particularly limited, but is preferably 20 to 70 μm, more preferably 30 to 65 μm, and further preferably 35 to 60 μm from the viewpoint of reducing the surface reflectance and L x value. Here, the surface roughness RSm is a parameter in the longitudinal direction (lateral direction) of the surface irregularities, and represents the average of the lengths Xs of the roughness curve elements in the reference length. That is, it can be understood as an average wavelength of the surface irregularities. The larger the surface roughness RSm is, the smaller the surface reflectance and the surface gloss are, and the smaller the specular gloss on the wide angle side tends to be. The longitudinal direction of the surface irregularities means one direction in the plane of the low-reflection light shielding layer 21 determined when the surface roughness RSm is measured, and for example, in the case of the rectangular low-reflection light shielding layer 21 in a plan view, the longitudinal direction or the in-plane transverse direction may be any one of, and the direction is not particularly limited.
The surface roughness Rsk of the low reflection light shielding layer laminate 100 (low reflection light shielding layer 21) of the present embodiment on the surface 21a side may be appropriately set according to the required performance, and is not particularly limited, but is preferably 0.1 to 3.0 μm, more preferably 0.2 to 2.0 μm, and even more preferably 0.3 to 1.0 μm, from the viewpoint of reducing the surface reflectance and L x value. Here, the surface roughness Rsk is a parameter in the height direction (depth direction) of the surface irregularities, and indicates the skew (skewness) of the roughness curve in the reference length. That is, it can be understood as representing the symmetry of the convex portion and the concave portion with the average line as the center. The larger the absolute value of the surface roughness Rsk is, the smaller the surface reflectance and the surface gloss are, and the smaller the specular gloss on the wide angle side tends to be.
The surface roughnesses Ra, Rz, RSm, and Rsk mean values measured and calculated in accordance with JIS standards (JIS B0601-2001 and JIS B0651-2001). Specifically, according to "geometric characteristics specification (GPS) -surface properties of the article: contour curve mode-wording, definition and surface property parameters, JIS B0601: 2001' can be measured using a 3-dimensional surface roughness meter such as a stylus surface roughness measuring instrument (SURFCM 1500SD2-3 DF: Tokyo precision Co.), and the surface roughness RSm and the like can be calculated using attached analysis software or general-purpose analysis software as necessary. More detailed measurement conditions are as follows.
Measuring length: 4.0mm
Cutoff wavelength: 0.8mm
Measuring speed: 0.6mm/s
A stylus: conical single crystal diamond having tip radius of 2 μm and apex angle of 60 °
The surface gloss on the surface 21a side of the low reflection light shielding layer laminate 100 (low reflection light shielding layer 21) of the present embodiment can be appropriately set according to the required performance, and is not particularly limited. From the viewpoint of achieving higher matte property, low surface gloss, and the like, the 60-degree specular gloss (JIS-Z8741: 1997) on the surface 21a side of the low reflection light shielding layer laminate 100 (low reflection light shielding layer 21) is preferably 0.0% or more and less than 1.0%, more preferably 0.0% or more and less than 0.5%, still more preferably 0.0% or more and less than 0.4%, and particularly preferably 0.0% or more and less than 0.3%. Similarly, the 45-degree specular gloss (JIS-Z8741: 1997) on the surface 21a side of the low reflection light shielding layer laminate 100 (low reflection light shielding layer 21) is preferably 0.0% or more and less than 1.0%, more preferably 0.0% or more and less than 0.5%, further preferably 0.0% or more and less than 0.4%, and particularly preferably 0.0% or more and less than 0.3%. Similarly, the 20-degree specular gloss on the surface 21a side of the low reflection light-shielding layer laminate 100 (low reflection light-shielding layer 21) (JIS-Z8741: 1997) is preferably 0.0% or more and less than 0.5%, more preferably 0.0% or more and less than 0.3%, still more preferably 0.0% or more and less than 0.2%, and particularly preferably 0.0% or more and less than 0.1%. In the present specification, the specular gloss means a specular gloss measured according to JIS-Z8741: 1997, the Gloss (specular Gloss) (%) on the surface 21a side of the low reflection light-shielding layer laminate 100 (low reflection light-shielding layer 21) at predetermined incident light receiving angles (45 ° and 60 °) was measured by using a digital Gloss Meter (Gloss Meter VG 7000: japan electrochrome corporation).
From the viewpoint of having high light-shielding properties as a light-shielding member, the Optical Density (OD) of the low-reflection light-shielding layer laminate 100 as a whole is preferably 1.5 or more, more preferably 2.0 or more, further preferably 2.5 or more, particularly preferably 3.0 or more, and most preferably 4.0 or more. The upper limit of the Optical Density (OD) is, of course, 6.0.
(modification example)
The present invention can be implemented by arbitrarily changing the configuration without departing from the scope of the present invention. In the first embodiment, the low reflection light shielding layer laminated body 100 having a laminated structure in which the low reflection light shielding layer 21 is provided on the base material 11 is described, but the present invention can be implemented even if the base material 11 and the adhesive layer 31 are omitted. For example, the light-shielding layer 21 may be peeled off from the substrate 11 and formed of a single-layer low-reflection light-shielding layer 21 alone. Similarly, the low-reflection light-shielding layer laminate having a 2-layer laminate structure in which the low-reflection light-shielding layer 21 is provided on the base material 11 without providing the adhesive layer 31 can be implemented. Further, in the first embodiment, only 1 layer of the low reflection light shielding layer 21 is provided on the substrate 11, but the low reflection light shielding layer 21 may be provided on each of the one main surface 11a side and the other main surface 11b side of the substrate 11. Further, a conductive layer may be provided between the base material 11 and the low-reflection light shielding layer 21.
Examples
The present invention will be described in detail below with reference to examples and comparative examples, but the present invention is not limited to these examples. The present invention can be carried out under various conditions as long as the object of the present invention can be achieved without departing from the gist of the present invention. In the following, unless otherwise specified, "part" means "part by mass".
(example 1)
The low-reflection light-shielding layer and the low-reflection light-shielding layer laminate of example 1 were produced by applying the following resin compositions prepared in the mass ratio shown in table 1 to one surface of a biaxially stretched PET film (total light transmittance (550 nm): 89.1%) having a thickness of 50 μm as a base material by a bar coating method and drying the resin compositions, and forming the low-reflection light-shielding layer shown in table 2 on the base material.
< coating liquid for resin layer >
Binder resin
(isocyanate-curable acrylic resin, resin solid content: 25% by mass)
Coloring material
(carbon Black resin Dispersion, average particle diameter D) 50 :25nm)
Resin particles
(Black acrylic beads, average particle diameter D) 50 :4.0μm)
Curing agent for resin
(polyisocyanate curing agent, solid content: 60% by mass)
Levelling agent
(organosilicon system, solid content: 10% by mass)
100 parts by mass of a dispersion medium
(MEK: toluene: 50 mixed solvent)
[ Table 1]
(examples 2 to 3)
The low-reflection light-shielding layers and the low-reflection light-shielding layer laminate of examples 2 and 3 were produced in the same manner as in example 1 except that the mass ratio of each component was changed as shown in table 1, and the low-reflection light-shielding layers described in table 2 were formed on the base material.
Comparative example 1
A low reflection light shielding layer and a low reflection light shielding layer laminate of comparative example 1 were produced in the same manner as in example 1, except that the amount of resin particles used was changed as shown in table 1.
Comparative example 2
As shown in Table 1, the average particle diameter D was used in place of the resin particles 50 A low reflection light shielding layer and a low reflection light shielding layer laminate of comparative example 2 were produced in the same manner as in example 1, except that the amorphous silica was 9.5 μm and the mass ratio of each component was changed.
The obtained low-reflection light-shielding layer laminates (low-reflection light-shielding layers) of examples 1 to 3 and comparative examples 1 to 2 were subjected to measurement and evaluation of the respective properties under the following conditions. The evaluation results are shown in table 1.
(1) Surface roughness Ra, Rz, RSm and Rsk
The surface roughness Ra, Rz, RSm, and Rsk (unit: μm) of the surface of the light-shielding layer were measured by a stylus surface roughness measuring instrument (SURFCM 1500SD2-3 DF: Tokyo precision Co.) in accordance with the method for measuring the arithmetic average roughness (Ra) of JIS-B0601 (2001).
(2) Reflectivity of 550nm and 905nm
The diffuse reflectance (including regular reflectance) (%) of the surface of the light-shielding layer when light of each wavelength was incident was measured for light of a wavelength of 550nm and a wavelength of 905nm using a spectrophotometer (for example, SolidSpec-3700 (manufactured by Shimadzu corporation)).
(3)L*
Using a spectrocolorimeter (for example, ZE6000 (manufactured by japan electric color corporation)), in accordance with JIS Z8720: 2012, using CIE standard illuminant D 65 Then, L of the surface of the light-shielding layer was measured.
(4) Degree of specular gloss
According to JIS-Z8741: 1997, the surface Gloss (specular Gloss) (%) of the surface of the light-shielding layer at a predetermined incident light receiving angle (20 °, 45 °, 60 °) was measured using a digital Gloss Meter (Gloss Meter VG 7000: japan electrochrome).
(5) Optical Density OD
The optical density of the first resin layer 21 was measured using an optical densitometer (X-Rite 361T: X-Rite Co.) according to ISO 5-2. In the measurement, a quadrature filter is used.
[ Table 2]
Industrial applicability
The present invention can be widely and effectively used as a low-reflection light-shielding member in applications requiring low surface reflectance and a deep black appearance, such as precision machinery, semiconductors, optical equipment, vehicles, and theater rooms. In particular, the present invention is particularly useful as a light shielding member (for example, a light shielding plate, a light shielding ring, or the like) or a sliding member (for example, a shutter, an aperture member, or the like) of various optical devices such as a high-performance single-lens reflex camera, a compact camera, a video camera, a mobile phone, a smartphone, a PDA information terminal, a projector, or the like.
Description of the reference numerals
100 low reflection light-shielding layer laminate
11 base material
11a plane (main plane)
11b plane (main plane)
21 low reflection light shielding layer
21a surface
31 adhesive layer
Claims (15)
1. A resin composition for a low-reflection light-shielding layer, which contains at least a binder resin, a coloring material, resin particles and a dispersion medium,
the content ratio of the binder resin is 1 to 30% by mass in total relative to the total amount in terms of solid content,
the content ratio of the coloring material is 0.1-35% by mass relative to the total amount in terms of solid content,
the content ratio of the resin particles is 50 to 95% by mass in total based on the total amount of the resin particles in terms of solid content.
2. The resin composition for a low-reflection light-shielding layer according to claim 1, wherein the resin particles have an average particle diameter D of 3 to 20 μm 50 。
3. The resin composition for a low reflection light shielding layer according to claim 1 or 2, wherein the resin particles contain colored resin particles.
4. A low-reflection light-shielding layer containing at least a binder resin, a coloring material dispersed in the binder resin, and resin particles dispersed in the binder resin,
the content ratio of the binder resin is 1 to 30% by mass in total in terms of solid content relative to the total solid content and in terms of solid content relative to the total solid content,
the content ratio of the coloring material is 0.1-35% by mass in total in terms of solid content relative to the total solid content,
the content of the resin particles is 50-95% by mass in total in terms of solid content relative to the total solid content.
5. The low reflection light-shielding layer according to claim 4, wherein the resin particles contain colored resin particles.
6. The low reflection light-shielding layer according to claim 4 or 5, wherein the resin particles have an average particle diameter D of 3 to 20 μm 50 。
7. A light-shielding layer according to any one of claims 4 to 6, wherein the surface roughness Ra of the one surface side is 0.2 to 0.7 μm.
8. A low reflection light-shielding layer according to any one of claims 4 to 7, wherein the surface roughness Rz of one surface side is 2.0 to 5.0 μm.
9. The low-reflection light-shielding layer according to any one of claims 4 to 8, wherein the 550nm diffuse reflectance on the one surface side is 0.0% or more and less than 3.0%,
the diffuse reflectance includes specular reflectance.
10. The light-shielding layer according to any one of claims 4 to 9, wherein the 905nm diffuse reflectance on one surface side is 0.0% or more and less than 3.0%,
the diffuse reflectance includes regular reflectance.
11. A low reflective light shield according to any one of claims 4 to 10 wherein the CIE 1976L a b color space on one surface side has a value of L x of from 0 to 18.
12. A low reflection light shielding layer according to any one of claims 4 to 11, which has an optical density OD of 0.5 or more.
13. A low reflection light-shielding layer according to any one of claims 4 to 12, which has a thickness of 1 to 30 μm.
14. A low-reflection light-shielding layer laminate comprising a base material and
a low reflection light-shielding layer according to any one of claims 4 to 13 provided on at least one main surface side of the base material.
15. A low-reflection light-shielding layer laminate comprising a base film,
The low-reflection light-shielding layer according to any one of claims 4 to 13 provided on one main surface side of the base film, and
the light-shielding layer for low reflection of any one of claims 4 to 13 provided on the other main surface side of the base film.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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JP2020038893A JP2021140072A (en) | 2020-03-06 | 2020-03-06 | Resin composition for low reflection light-shielding layer, and low reflection light-shielding layer and low reflection light-shielding layer laminate using the same |
JP2020-038893 | 2020-03-06 | ||
PCT/JP2021/004698 WO2021176967A1 (en) | 2020-03-06 | 2021-02-09 | Resin composition for low-reflection light-shielding layer, and low-reflection light-shielding layer and low-reflection light-shielding laminate using same |
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CN114902085A true CN114902085A (en) | 2022-08-12 |
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CN202180007778.3A Pending CN114902085A (en) | 2020-03-06 | 2021-02-09 | Resin composition for low-reflection light-shielding layer, and low-reflection light-shielding layer and low-reflection light-shielding laminate using same |
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JP (1) | JP2021140072A (en) |
KR (1) | KR20220144872A (en) |
CN (1) | CN114902085A (en) |
TW (1) | TW202200723A (en) |
WO (1) | WO2021176967A1 (en) |
Cited By (1)
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CN115058043A (en) * | 2022-08-18 | 2022-09-16 | 汕头市龙琪塑料制品有限公司 | High-density polyethylene medicine packaging material with nano slow-release antibacterial layer and preparation method and application thereof |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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US20230305197A1 (en) * | 2020-08-31 | 2023-09-28 | Somar Corporation | Light shielding member |
JP7298107B1 (en) * | 2022-12-19 | 2023-06-27 | 東洋インキScホールディングス株式会社 | Low-reflectivity laminate and method for producing the same |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10268105A (en) * | 1997-03-27 | 1998-10-09 | Somar Corp | Antireflection film |
JP2011064737A (en) * | 2009-09-15 | 2011-03-31 | Nikon Corp | Optical system component |
JP2012002895A (en) * | 2010-06-15 | 2012-01-05 | Nikon Corp | Optical component and coating |
JP2012208424A (en) * | 2011-03-30 | 2012-10-25 | Panasonic Corp | Light-diffusive coating composition and light diffusion member |
CN107286376A (en) * | 2016-04-11 | 2017-10-24 | 东洋油墨Sc控股株式会社 | Light shield layer formation resin combination and its manufacture method, light shield layer and light-proofness component |
JPWO2018052044A1 (en) * | 2016-09-16 | 2018-09-13 | ソマール株式会社 | Light shielding member for optical device |
JP2018192788A (en) * | 2017-05-18 | 2018-12-06 | キヤノン株式会社 | Film arranged at slide part such as shutter for camera |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011123255A (en) | 2009-12-10 | 2011-06-23 | Kimoto & Co Ltd | Light-blocking member for use in optical equipment |
JP7495776B2 (en) * | 2016-04-12 | 2024-06-05 | 日東電工株式会社 | Adhesive sheet with release liner |
-
2020
- 2020-03-06 JP JP2020038893A patent/JP2021140072A/en active Pending
-
2021
- 2021-02-09 KR KR1020227033929A patent/KR20220144872A/en unknown
- 2021-02-09 WO PCT/JP2021/004698 patent/WO2021176967A1/en active Application Filing
- 2021-02-09 CN CN202180007778.3A patent/CN114902085A/en active Pending
- 2021-02-23 TW TW110106290A patent/TW202200723A/en unknown
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10268105A (en) * | 1997-03-27 | 1998-10-09 | Somar Corp | Antireflection film |
JP2011064737A (en) * | 2009-09-15 | 2011-03-31 | Nikon Corp | Optical system component |
JP2012002895A (en) * | 2010-06-15 | 2012-01-05 | Nikon Corp | Optical component and coating |
JP2012208424A (en) * | 2011-03-30 | 2012-10-25 | Panasonic Corp | Light-diffusive coating composition and light diffusion member |
CN107286376A (en) * | 2016-04-11 | 2017-10-24 | 东洋油墨Sc控股株式会社 | Light shield layer formation resin combination and its manufacture method, light shield layer and light-proofness component |
JPWO2018052044A1 (en) * | 2016-09-16 | 2018-09-13 | ソマール株式会社 | Light shielding member for optical device |
JP2018192788A (en) * | 2017-05-18 | 2018-12-06 | キヤノン株式会社 | Film arranged at slide part such as shutter for camera |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115058043A (en) * | 2022-08-18 | 2022-09-16 | 汕头市龙琪塑料制品有限公司 | High-density polyethylene medicine packaging material with nano slow-release antibacterial layer and preparation method and application thereof |
CN115058043B (en) * | 2022-08-18 | 2022-11-22 | 汕头市龙琪塑料制品有限公司 | High-density polyethylene medicine packaging material with nano slow-release antibacterial layer and preparation method and application thereof |
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WO2021176967A1 (en) | 2021-09-10 |
JP2021140072A (en) | 2021-09-16 |
KR20220144872A (en) | 2022-10-27 |
TW202200723A (en) | 2022-01-01 |
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