CN114890814A - Inorganic resin for thermal foaming process and preparation method thereof - Google Patents
Inorganic resin for thermal foaming process and preparation method thereof Download PDFInfo
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B28/00—Compositions of mortars, concrete or artificial stone, containing inorganic binders or the reaction product of an inorganic and an organic binder, e.g. polycarboxylate cements
- C04B28/24—Compositions of mortars, concrete or artificial stone, containing inorganic binders or the reaction product of an inorganic and an organic binder, e.g. polycarboxylate cements containing alkyl, ammonium or metal silicates; containing silica sols
- C04B28/26—Silicates of the alkali metals
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2111/00—Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
- C04B2111/00034—Physico-chemical characteristics of the mixtures
- C04B2111/00181—Mixtures specially adapted for three-dimensional printing (3DP), stereo-lithography or prototyping
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2111/00—Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
- C04B2111/40—Porous or lightweight materials
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2201/00—Mortars, concrete or artificial stone characterised by specific physical values
- C04B2201/10—Mortars, concrete or artificial stone characterised by specific physical values for the viscosity
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2201/00—Mortars, concrete or artificial stone characterised by specific physical values
- C04B2201/50—Mortars, concrete or artificial stone characterised by specific physical values for the mechanical strength
Abstract
The invention relates to an inorganic resin for a thermal foaming process, which comprises the following components: sodium silicate solution, PVA, sodium hydroxide, deionized water, surfactant, stabilizer, moisture absorption resisting agent, defoaming agent and coupling agent; wherein the weight percentages of the components are as follows: 45-55% of sodium silicate solution, 6-14% of PVA, 0.5-1.5% of sodium hydroxide, 13-19% of deionized water, 0.6-1.4% of surfactant, 17-23% of stabilizer, 0.8-1.2% of moisture absorption resistant agent, 0.3-0.7% of defoaming agent and 0.3-0.7% of coupling agent. The inorganic resin for the thermal foaming process provided by the invention has the surface tension of more than 50mN/m, the viscosity at 25 ℃ of less than or equal to 1.5 mPa.s, can effectively solve the problem that the existing binder can not realize continuous ink jet by a thermal foaming technology, has stable feed liquid, short mold drawing time (less than or equal to 3H) and 24H normal-temperature tensile strength of more than or equal to 1.5MPa, can meet the requirement of rapid molding, and has mild smell and no stimulation.
Description
Technical Field
The invention relates to the technical field of casting auxiliary materials, in particular to inorganic resin for a thermal foaming process.
Background
The 3D printing is the fastest developing technology among all additive rapid manufacturing technologies (RP), is the core technology of the third industrial revolution, and has been widely used in many fields such as aerospace, industrial design, biomedical, automobiles, food, and architecture. In the casting field, the 3D printing technology is slowly applied to the high-end casting field, and in the mold core field with complex modeling, the advantages of the 3D printing technology are more obvious.
Since 8 months 1980, it is good to apply the thermal foaming inkjet technology to the inkjet printer Y-80 for the first time, since the history of the inkjet printer began, since the thermal foaming inkjet technology is quite mature and low in cost, the thermal foaming technology began to be applied in the field of inkjet printers in batches, but the technology was always applied in the fields of printing and dyeing, the used ink is used in the printing and dyeing industry, and the application in the casting field is still blank. The binder used in the field of 3D printing of the existing sand core is mainly made of organic resin, and comprises furan resin and phenolic resin. These binders for casting are all organic systems, and the thermal foaming inkjet printing technology operates on the principle that ink is ejected onto a work surface by heating, expanding, and compressing the ink in a short time. When the thermal foaming printing head is used for printing, the phenomena of frame loss and discontinuous ink jet can occur, so that the molding sand is low in strength, the floating sand phenomenon is serious, and the printing operation is influenced. The thermal foaming technology has low operation frequency, high nozzle number and low use cost, so the thermal foaming ink-jet technology can improve the printing speed, improve the working efficiency of the printer and greatly reduce the printing cost. The existing inorganic binder for casting is small in surface tension (the piezoelectric printing head requires the surface tension to be less than or equal to 40mN/m), large in viscosity, poor in stability of feed liquid, long in drawing time and low in tensile strength at the normal temperature of 24h, and cannot be suitable for a thermal foaming technology in molding sand printing, so that the binder suitable for the thermal foaming ink-jet technology is developed, and the popularization and application of the 3D printing technology in the casting field can be further promoted.
Disclosure of Invention
Therefore, it is necessary to provide an inorganic resin for a thermal foaming process, which aims at the problems of small surface tension, large viscosity, poor feed liquid stability, long drawing time and low tensile strength at 24h and normal temperature of the existing inorganic binder for casting.
An inorganic resin for a thermal foaming process comprises the following components: sodium silicate solution, PVA, sodium hydroxide, deionized water, surfactant, stabilizer, moisture absorption resisting agent, defoaming agent and coupling agent; wherein the weight percentages of the components are as follows: 45-55% of sodium silicate solution, 6-14% of PVA, 0.5-1.5% of sodium hydroxide, 13-19% of deionized water, 0.6-1.4% of surfactant, 17-23% of stabilizer, 0.8-1.2% of moisture absorption resistant agent, 0.3-0.7% of defoaming agent and 0.3-0.7% of coupling agent.
Further, the modulus of the sodium silicate solution is 2.1-2.5.
Further, the surfactant is one or any combination of more than two of decyndiol, alkynediol polyether and dodecenyldiol polyether.
Further, the stabilizer is one or any combination of more than two of polyethylene glycol 400, diethylene glycol, triethylene glycol, ethylene glycol phenyl ether and hexamethylphosphoric triamide.
Further, the moisture absorption resistant agent is one or any combination of more than two of sodium carbonate, lithium carbonate and sodium tetraborate.
Further, the defoaming agent is one or any combination of more than two of acetylene glycol, high carbon ketone and polyoxyethylene polyoxypropylene amine ether.
Further, the coupling agent is one or any combination of more than two of gamma-glycidoxypropyltrimethoxysilane, gamma- (methacryloyloxy) propyltrimethoxysilane and N-beta- (aminoethyl) -gamma-aminopropylmethyldimethoxysilane.
A method for preparing inorganic resin for a thermal foaming process comprises the following steps:
s1: pumping sodium silicate solution, PVA and deionized water into a reaction kettle, heating to 60 ℃, and stirring for at least 3 min;
s2: adding sodium hydroxide into a reaction kettle, and stirring for at least 30 min;
s3: sequentially adding a surfactant and a stabilizer into a reaction kettle, and stirring for at least 30 min;
s4: adding the moisture absorption resistant agent, the defoaming agent and the coupling agent into the reaction kettle in sequence, and stirring for at least 30min to obtain the inorganic resin for the thermal foaming process;
s5: detecting and filling inert gas for packaging.
Furthermore, the surface tension of the inorganic resin for the thermal foaming process prepared by the method is more than 50mN/m, and the viscosity is less than or equal to 1.5 mPas.
Furthermore, the inorganic resin for the thermal foaming process prepared by the method has the drawing time of less than or equal to 3 hours and the normal-temperature tensile strength of more than or equal to 1.5MPa after 24 hours.
The inorganic resin for the thermal foaming process provided by the invention has the surface tension of more than 50mN/m, the viscosity at 25 ℃ of less than or equal to 1.5 mPa.s, can effectively solve the problem that the existing binder can not realize continuous ink jet by a thermal foaming technology, has stable feed liquid, short mold drawing time (less than or equal to 3H), and tensile strength of more than or equal to 1.5MPa at 24H and normal temperature, can meet the requirement of rapid molding, and has mild smell and no stimulation. The inorganic resin is low in production cost and use cost, when the inorganic resin is used for 3D sand mold printing, a printing head does not need to be repeatedly washed after the inorganic resin is started like a piezoelectric type spray head, and huge waste of feed liquid is caused. Furthermore, the inorganic resin does not adopt formaldehyde, furfuryl alcohol and phenol substances, so that the inorganic resin is free from peculiar smell, can effectively improve the environment of an operation site, and achieves the development concept of green casting.
Detailed Description
In order that the invention may be more fully understood, reference will now be made to the following more detailed description. The present invention may be embodied in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
In one embodiment, an inorganic resin for a thermal foaming process, the inorganic resin comprising the following components: sodium silicate solution, PVA, sodium hydroxide, deionized water, surfactant, stabilizer, moisture absorption resisting agent, defoaming agent and coupling agent; wherein the weight percentages of the components are as follows: 45-55% of sodium silicate solution, 6-14% of PVA, 0.5-1.5% of sodium hydroxide, 13-19% of deionized water, 0.6-1.4% of surfactant, 17-23% of stabilizer, 0.8-1.2% of moisture absorption resistant agent, 0.3-0.7% of defoaming agent and 0.3-0.7% of coupling agent.
The inorganic resin for the thermal foaming process provided by the invention has the surface tension of more than 50mN/m, the viscosity at 25 ℃ of less than or equal to 1.5 mPa.s, can effectively solve the problem that the existing binder can not realize continuous ink jet by a thermal foaming technology, has stable feed liquid, short mold drawing time (less than or equal to 3H), and the tensile strength at the normal temperature of 24H of more than or equal to 1.5MPa, namely the tensile strength at the normal temperature of more than or equal to 1.5MPa after being placed for 24H, can meet the requirement of rapid molding, and has mild and no stimulation in smell.
The inorganic resin for thermal foaming process will be described with reference to specific examples to further understand the inventive concept of the inorganic resin for thermal foaming process.
An inorganic resin for a thermal foaming process, the inorganic resin comprising the following components: sodium silicate solution, PVA, sodium hydroxide, deionized water, surfactant, stabilizer, moisture absorption resisting agent, defoaming agent and coupling agent; wherein the weight percentages of the components are as follows: 45-55% of sodium silicate solution, 6-14% of PVA, 0.5-1.5% of sodium hydroxide, 13-19% of deionized water, 0.6-1.4% of surfactant, 17-23% of stabilizer, 0.8-1.2% of moisture absorption resistant agent, 0.3-0.7% of defoaming agent and 0.3-0.7% of coupling agent.
Preferably, the sodium silicate solution has a modulus of 2.1 to 2.5. The larger the modulus of the sodium silicate solution is, the more the silica content is, and the more the silica content is, the more the viscosity of the sodium silicate solution is increased, the poor fluidity of the solution is, and the adverse effect on the ink jet printing operation is caused. Therefore, the sodium silicate solution with the modulus of 2.1-2.5 is selected, so that the stability of the system can be ensured, the high-temperature residual strength of the system can be increased, and the risks of fire running and box collapse in the casting process are reduced.
In the above inorganic resin system, PVA (polyvinyl alcohol) reacts with OH in sodium hydroxide - Condensation reaction is carried out to generate Si-O-C, thereby improving the strength performance index of the inorganic resin. Simultaneously, the sodium hydroxide can be added into the inorganic resin system to react with SiO in sodium silicate 2 Reaction to form SiO 4 2- By SiO 4 2- The modulus of the sodium silicate is adjusted, the viscosity of the inorganic resin can be reduced, the service life of the inorganic resin can be adjusted, and the hardening speed of the inorganic resin can be accelerated.
Preferably, the surfactant is any combination of one or more than two of decyndiol, alkynediol polyether and dodecenyldiol polyether. The combined surfactant is a low-foaming surfactant, has the characteristic of dispersing water-insoluble substances, can reduce dynamic surface tension, and has low foamability, thereby being beneficial to improving the ejection rate of a printing head and improving the printing effect.
Preferably, the stabilizer is one or any combination of more than two of polyethylene glycol 400, diethylene glycol, triethylene glycol, ethylene glycol phenyl ether and hexamethylphosphoric triamide. Thermal bubble jet printing technology utilizes a thin film resistor to instantaneously heat less than 5 microliters of ink to more than 300 ℃ in an ink ejection area to form countless micro-bubbles, and the bubbles are gathered into large bubbles at a very high speed (less than 10 microseconds) and spread to force ink droplets to be ejected from a nozzle. The temperature of the material liquid in the ink box is about 50 ℃, so that the stabilizer with low boiling point is easy to volatilize, and the ink jet is not uniform, so that the stability of the system can be further improved by selecting the stabilizers with boiling points above 200 ℃ or the combination thereof.
Preferably, the moisture absorption resistant agent is one or any combination of more than two of sodium carbonate, lithium carbonate and sodium tetraborate. The metal ion in the inorganic resin may be OH - After combination, the matrix is eroded to break Si-O-Si bonds, the inorganic resin is dissolved again, the bonding strength is reduced suddenly, and therefore, the free moisture-proof agent of carbonate and tetraborate can be reduced by adding the carbonate and the tetraborate into the inorganic resinMetal ions, thereby effectively improving the moisture absorption resistance of the inorganic resin.
Preferably, the defoaming agent is one or any combination of more than two of acetylene glycol, high carbon ketone and polyoxyethylene polyoxypropylene amine ether. The defoaming agent with one or more combinations has the performances of solubilization, decontamination, wetting, dispersion and the like, and can dissolve the surfactant adsorption layer to reduce the intermolecular compactness of the surfactant, thereby reducing the stability of foam and achieving the aim of quick defoaming.
Preferably, the coupling agent is one or any combination of more than two of gamma-glycidoxypropyltrimethoxysilane, gamma- (methacryloyloxy) propyltrimethoxysilane and N-beta- (aminoethyl) -gamma-aminopropylmethyldimethoxysilane. The silane coupling agent adopted by the combination can be combined with silicate, and can perform hydrolysis reaction to generate a group of silicon hydroxyl (Si-OH) through the action of silane oligomer and hydroxyl on the surface of the silicate, so that complexation is performed, a net-shaped three-dimensional structure is generated, and the strength of the inorganic resin is improved.
The preparation method of the inorganic resin for the thermal foaming process comprises the following steps:
s1: pumping sodium silicate solution, PVA and deionized water into a reaction kettle, heating to 60 ℃, and stirring for at least 30 min; in the step, PVA is dissolved in sodium silicate solution under the heating condition, and deionized water is added, so that the content of impurities in the inorganic resin system can be reduced, the dissolving rate of PVA is increased, and the viscosity of the inorganic resin system is reduced.
S2: adding sodium hydroxide into a reaction kettle, and stirring for at least 30 min; because the sodium silicate solution system is unstable, the ionization of the sodium silicate solution can be inhibited by adding sodium hydroxide, so that the stability of the inorganic resin system is improved.
S3: sequentially adding a surfactant and a stabilizer into a reaction kettle, and stirring for at least 30 min;
s4: adding the moisture absorption resistant agent, the defoaming agent and the coupling agent into the reaction kettle in sequence, and stirring for at least 30min to obtain the inorganic resin for the thermal foaming process;
s5: detecting, filling inert gas and packaging.
The inorganic resin for the thermal foaming process prepared by the method has the surface tension of more than 50mN/m and the viscosity of less than or equal to 1.5mPa & s.
The inorganic resin for the thermal foaming process prepared by the method has the drawing time of less than or equal to 3h, the tensile strength at the normal temperature of 24h is more than or equal to 1.5MPa, namely the tensile strength at the normal temperature of more than or equal to 1.5MPa after being placed for 24 h.
Example one
An inorganic resin for a thermal foaming process comprises the following chemical components in percentage by weight: 50% sodium silicate solution, 10% PVA, 1% sodium hydroxide, 16% deionized water, 1% dodecenyl diol polyether, 20% diethylene glycol, 1% sodium carbonate, 0.5% high carbon ketone and 0.5% gamma-glycidyl ether oxypropyl trimethoxy silane.
The preparation method of the inorganic resin for the thermal foaming process comprises the following steps:
s1, opening the reaction kettle and heating, pumping 50 weight percent of sodium silicate solution, 10 weight percent of PVA and 16 weight percent of deionized water into the enamel reaction kettle by using a vacuum pump, starting stirring, heating to 60 ℃, and stirring for more than 30 min;
s2, adding 1 percent by weight of sodium hydroxide, and continuing stirring for more than 30 min;
s3, adding 1 weight percent of dodecene glycol polyether and 20 weight percent of diethylene glycol in sequence, and continuing stirring for more than 30 min;
s4, sequentially adding 1 weight percent of sodium carbonate, 0.5 weight percent of high-carbon ketone and 0.5 weight percent of gamma-glycidyl ether oxypropyl trimethoxy silane, and continuously stirring for more than 30min to obtain the inorganic resin for the thermal foaming process;
s5; detecting, filling inert gas and packaging.
The inorganic resin for the thermal foaming process prepared by the method has the viscosity of 1.5 mPas (25 ℃) and the surface tension of 55mN/m, is tested on a machine by using a 3D ink-jet printer, the printer resolution is 0.04, the printing layer thickness is 0.32mm, the size of a working box is 300 x 200mm, an 8-shaped standard tensile test block is printed, the drawing time is 3H, the 24H normal-temperature tensile strength is 1.5MPa, namely the tensile strength at the normal temperature is 1.5MPa after the inorganic resin is placed for 24 hours, and the inorganic resin strength is attenuated by 8.5 percent after the inorganic resin is placed for 5 months.
Example two
S1, opening the reaction kettle and heating, pumping 45 weight percent of sodium silicate solution, 14 weight percent of PVA and 13 weight percent of deionized water into the enamel reaction kettle by using a vacuum pump, starting stirring, heating to 60 ℃, and stirring for more than 30 min;
s2, adding 1.4 percent by weight of sodium hydroxide, and continuing stirring for more than 30 min;
s3, sequentially adding 1.4 percent by weight of alkynediol polyether and 23 percent by weight of ethylene glycol phenyl ether, and continuously stirring for more than 30 min;
s4, sequentially adding 0.8 percent by weight of sodium tetraborate, 0.7 percent by weight of polyoxyethylene polyoxypropylene amine ether and 0.7 percent by weight of N-beta- (aminoethyl) -gamma-aminopropylmethyldimethoxysilane, and continuously stirring for more than 30min to obtain the inorganic resin for the thermal foaming process;
s5; detecting, filling inert gas and packaging.
The inorganic resin for the thermal foaming process prepared by the method has the viscosity of 1.3mPa & s (25 ℃) and the surface tension of 54mN/m, is tested on a machine by using a 3D ink-jet printer, the printer resolution is 0.04, the printing layer thickness is 0.32mm, the size of a working box is 300 x 200mm, an 8-shaped standard tensile test block is printed, the drawing time is 3H, the 24H normal-temperature tensile strength is 1.7MPa, namely the tensile strength at the normal temperature is 1.7MPa after the inorganic resin is placed for 24 hours, and the inorganic resin strength is attenuated by 7.8 percent after the inorganic resin is placed for 5 months.
EXAMPLE III
S1, opening the reaction kettle and heating, pumping 53 weight percent of sodium silicate solution, 6 weight percent of PVA and 13 weight percent of deionized water into the enamel reaction kettle by using a vacuum pump, starting stirring, heating to 60 ℃, and stirring for more than 30 min;
s2, adding 1.2 percent by weight of sodium hydroxide, and continuing stirring for more than 30 min;
s3, sequentially adding 1.4 percent by weight of decyne glycol and 23 percent by weight of polyethylene glycol 400, and continuously stirring for more than 30 min;
s4, sequentially adding 1.2 percent by weight of lithium carbonate, 0.6 percent by weight of alkynediol and 0.6 percent by weight of gamma- (methacryloyloxy) propyl trimethoxy silane, and continuously stirring for more than 30min to obtain the inorganic resin for the thermal foaming process;
s5; detecting, filling inert gas and packaging.
The inorganic resin for the thermal foaming process prepared by the method has the viscosity of 1.6mPa & s (25 ℃) and the surface tension of 57mN/m, is tested on a machine by using a 3D ink-jet printer, the printer resolution is 0.04, the printing layer thickness is 0.32mm, the size of a working box is 300 x 200mm, an 8-shaped standard tensile test block is printed, the drawing time is 2.5H, the 24H normal-temperature tensile strength is 1.6MPa, namely the tensile strength at the normal temperature is 1.6MPa after the inorganic resin is placed for 24 hours, and the inorganic resin strength is attenuated by 8 percent after the inorganic resin is placed for 5 months.
Example four
S1, opening the reaction kettle and heating, pumping 48 weight percent of sodium silicate solution, 6 weight percent of PVA and 18 weight percent of deionized water into the enamel reaction kettle by using a vacuum pump, starting stirring, heating to 60 ℃, and stirring for more than 30 min;
s2, adding 1.4 percent by weight of sodium hydroxide, and continuing stirring for more than 30 min;
s3, adding 1.4 percent by weight of dodecenyldiol polyether and 23 percent by weight of triethylene glycol in sequence, and continuing stirring for more than 30 min;
s4, sequentially adding 1.2 percent by weight of sodium carbonate, 0.5 percent by weight of alkynediol and 0.5 percent by weight of gamma-glycidoxypropyltrimethoxysilane, and continuously stirring for more than 30min to obtain the inorganic resin for the thermal foaming process;
s5; detecting, filling inert gas and packaging.
The inorganic resin for the thermal foaming process prepared by the method has the viscosity of 1.5 mPas (25 ℃) and the surface tension of 52mN/m, is tested on a machine by using a 3D ink-jet printer, the printer resolution is 0.04, the printing layer thickness is 0.32mm, the size of a working box is 300 x 200mm, an 8-shaped standard tensile test block is printed, the drawing time is 2.5H, the 24H normal-temperature tensile strength is 1.5MPa, namely the tensile strength at the normal temperature is 1.5MPa after the inorganic resin is placed for 24 hours, and the inorganic resin strength is attenuated by 8.2 percent after the inorganic resin is placed for 5 months.
EXAMPLE five
S1, opening the reaction kettle and heating, pumping 55 weight percent of sodium silicate solution, 7 weight percent of PVA and 13 weight percent of deionized water into the enamel reaction kettle by using a vacuum pump, starting stirring, heating to 60 ℃, and stirring for more than 30 min;
s2, adding 0.5 percent by weight of sodium hydroxide, and continuing stirring for more than 30 min;
s3, sequentially adding a mixture of decyne glycol and acetylene glycol polyether with the weight percentage of 1.1 percent and a mixture of diethylene glycol, triethylene glycol and ethylene glycol phenyl ether with the weight percentage of 22 percent, and continuously stirring for more than 30 min;
s4, sequentially adding 0.8 wt% of a mixture of sodium carbonate, lithium carbonate and sodium tetraborate, 0.3 wt% of a mixture of alkynediol and high-carbon ketone, and 0.3 wt% of a mixture of gamma-glycidoxypropyltrimethoxysilane and gamma- (methacryloyloxy) propyltrimethoxysilane, and continuously stirring for more than 30min to obtain the inorganic resin for the thermal foaming process;
s5; detecting, filling inert gas and packaging.
The inorganic resin for the thermal foaming process prepared by the method has the viscosity of 1.4mPa & s (25 ℃) and the surface tension of 50mN/m, is tested on a machine by using a 3D ink-jet printer, the printer resolution is 0.04, the printing layer thickness is 0.32mm, the size of a working box is 300 x 200mm, an 8-shaped standard tensile test block is printed, the drawing time is 2H, the 24H normal-temperature tensile strength is 1.7MPa, namely the tensile strength is 1.7MPa after the inorganic resin is placed for 24H at the normal temperature, and the inorganic resin strength is attenuated by 8.1 percent after the inorganic resin is placed for 5 months.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. The inorganic resin for the thermal foaming process is characterized by comprising the following components: sodium silicate solution, PVA, sodium hydroxide, deionized water, surfactant, stabilizer, moisture absorption resisting agent, defoaming agent and coupling agent; wherein the weight percentages of the components are as follows: 45-55% of sodium silicate solution, 6-14% of PVA, 0.5-1.5% of sodium hydroxide, 13-19% of deionized water, 0.6-1.4% of surfactant, 17-23% of stabilizer, 0.8-1.2% of moisture absorption resistant agent, 0.3-0.7% of defoaming agent and 0.3-0.7% of coupling agent.
2. The inorganic resin for a thermal foaming process according to claim 1, wherein the sodium silicate solution has a modulus of 2.1 to 2.5.
3. The inorganic resin for thermal foaming process according to claim 1, wherein the surfactant is any combination of one or more of decyndiol, acetylenic diol polyether and dodecenyldiol polyether.
4. The inorganic resin for thermal foaming process according to claim 1, wherein the stabilizer is one or more of polyethylene glycol 400, diethylene glycol, triethylene glycol, ethylene glycol phenyl ether, and hexamethylphosphoric triamide.
5. The inorganic resin for thermal foaming process according to claim 1, wherein the moisture absorption inhibitor is one or more of sodium carbonate, lithium carbonate and sodium tetraborate.
6. The inorganic resin for thermal foaming process according to claim 1, wherein the defoaming agent is one or more of acetylene glycol, high carbon ketone and polyoxyethylene polyoxypropylene ether.
7. The inorganic resin for thermal foaming process according to claim 1, wherein the coupling agent is one or more of γ -glycidoxypropyltrimethoxysilane, γ - (methacryloyloxy) propyltrimethoxysilane, and N- β - (aminoethyl) - γ -aminopropylmethyldimethoxysilane.
8. A method for preparing the inorganic resin for thermal foaming process according to any one of claims 1 to 7, comprising the steps of:
s1: pumping sodium silicate solution, PVA and deionized water into a reaction kettle, heating to 60 ℃, and stirring for at least 30 min;
s2: adding sodium hydroxide into a reaction kettle, and stirring for at least 30 min;
s3: sequentially adding a surfactant and a stabilizer into a reaction kettle, and stirring for at least 30 min;
s4: adding the moisture absorption resistant agent, the defoaming agent and the coupling agent into the reaction kettle in sequence, and stirring for at least 30min to obtain the inorganic resin for the thermal foaming process;
s5: detecting, filling inert gas and packaging.
9. The method for preparing the inorganic resin for thermal foaming process according to any one of claims 1 to 7, according to claim 8, wherein the obtained inorganic resin for thermal foaming process has a surface tension of > 50mN/m and a viscosity of ≤ 1.5 mPa-s.
10. The method for preparing the inorganic resin for thermal foaming process according to any one of claims 1 to 7, according to claim 8, wherein the obtained inorganic resin for thermal foaming process has a mold drawing time of less than or equal to 3h and a 24h room-temperature tensile strength of more than or equal to 1.5 MPa.
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| JPH11254854A (en) * | 1998-03-16 | 1999-09-21 | Toray Ind Inc | Direct writing type waterless lithographic printing plate and manufacture thereof |
| CN104923717A (en) * | 2015-06-04 | 2015-09-23 | 宁夏共享化工有限公司 | Inorganic binder for nonferrous metal 3D sand mould printing and preparation method thereof |
| CN105562623A (en) * | 2015-12-31 | 2016-05-11 | 华中科技大学 | Rapid molding method of sodium silicate sand mould |
| CN105579546A (en) * | 2013-09-27 | 2016-05-11 | 株式会社大赛璐 | Adhesive agent composition for semiconductor laminates |
| CN110000330A (en) * | 2019-03-28 | 2019-07-12 | 宁夏共享化工有限公司 | Inorganic binder is used in a kind of casting |
| CN111621064A (en) * | 2020-05-29 | 2020-09-04 | 宁夏共享化工有限公司 | Binder for 3D ink-jet printing |
| CN112409790A (en) * | 2020-10-27 | 2021-02-26 | 季华实验室 | Adhesive composition applied to 3D printing and application method thereof |
| CN114149548A (en) * | 2021-12-15 | 2022-03-08 | 厦门格林泰新材料科技有限公司 | Flame-retardant acrylic resin and solvent-type thermal foaming inkjet ink prepared from same |
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| JPH11254854A (en) * | 1998-03-16 | 1999-09-21 | Toray Ind Inc | Direct writing type waterless lithographic printing plate and manufacture thereof |
| CN105579546A (en) * | 2013-09-27 | 2016-05-11 | 株式会社大赛璐 | Adhesive agent composition for semiconductor laminates |
| CN104923717A (en) * | 2015-06-04 | 2015-09-23 | 宁夏共享化工有限公司 | Inorganic binder for nonferrous metal 3D sand mould printing and preparation method thereof |
| CN105562623A (en) * | 2015-12-31 | 2016-05-11 | 华中科技大学 | Rapid molding method of sodium silicate sand mould |
| CN110000330A (en) * | 2019-03-28 | 2019-07-12 | 宁夏共享化工有限公司 | Inorganic binder is used in a kind of casting |
| CN111621064A (en) * | 2020-05-29 | 2020-09-04 | 宁夏共享化工有限公司 | Binder for 3D ink-jet printing |
| CN112409790A (en) * | 2020-10-27 | 2021-02-26 | 季华实验室 | Adhesive composition applied to 3D printing and application method thereof |
| CN114149548A (en) * | 2021-12-15 | 2022-03-08 | 厦门格林泰新材料科技有限公司 | Flame-retardant acrylic resin and solvent-type thermal foaming inkjet ink prepared from same |
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| CN114890814B (en) | 2023-05-30 |
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