CN114878020A - Passive temperature measurement system based on photovoltaic power generation - Google Patents
Passive temperature measurement system based on photovoltaic power generation Download PDFInfo
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- CN114878020A CN114878020A CN202210508073.6A CN202210508073A CN114878020A CN 114878020 A CN114878020 A CN 114878020A CN 202210508073 A CN202210508073 A CN 202210508073A CN 114878020 A CN114878020 A CN 114878020A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K13/00—Thermometers specially adapted for specific purposes
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/02—Means for indicating or recording specially adapted for thermometers
- G01K1/024—Means for indicating or recording specially adapted for thermometers for remote indication
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
- H02J7/34—Parallel operation in networks using both storage and other dc sources, e.g. providing buffering
- H02J7/35—Parallel operation in networks using both storage and other dc sources, e.g. providing buffering with light sensitive cells
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K2215/00—Details concerning sensor power supply
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K2219/00—Thermometers with dedicated analog to digital converters
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Abstract
The invention relates to a passive temperature measurement system based on photovoltaic power generation, which comprises an electric field forced power acquisition module, a photovoltaic power generation module, a power supply compensation circuit and a temperature measurement monitoring component, wherein the input end of the electric field forced power acquisition module is connected with two different potential points in the environment, the first-stage output end of the electric field forced power acquisition module and the output end of the photovoltaic power generation module are correspondingly connected with the two input ends of the power supply compensation circuit, and the second-stage output end of the electric field forced power acquisition module is connected with the power supply input end of the temperature measurement monitoring component; the output end of the power supply compensation circuit is connected with the power supply input end of the temperature measurement monitoring assembly, the power supply compensation circuit detects the voltage of the electric field forced power acquisition module and adopts the photovoltaic power generation module to supply power to the power supply input end of the temperature measurement monitoring assembly according to the voltage detection result; and the output end of the temperature measurement monitoring component is provided with a radio frequency antenna for monitoring the environmental temperature and sending the environmental temperature through the radio frequency antenna. The invention ensures that the system has enough working power supply, is beneficial to the miniaturization of the system, prolongs the service life of the system and reduces the influence of external interference.
Description
Technical Field
The invention relates to the technical field of automatic detection, in particular to a passive temperature measurement system based on photovoltaic power generation.
Background
The existing temperature measurement system generally needs to additionally provide a working power supply, and a power supply module generally has a large volume, so that the system is difficult to miniaturize. And part of temperature measurement systems adopt a wireless power supply mode, and energy is taken in a high-voltage magnetic field through an induction coil, but the power taking mode is greatly influenced by the change of the magnetic field environment and has poor stability. Therefore, it is necessary to design a temperature measurement system suitable for an unsupervised environment and having advantages of small size, stability, and long service life.
Disclosure of Invention
The invention provides a passive temperature measurement system based on photovoltaic power generation, aiming at the technical problems in the prior art, wherein the passive temperature measurement system mainly utilizes the potential difference between different potential points in the prior environment to take electricity and simultaneously utilizes the photovoltaic power generation to compensate, so that the temperature measurement system has enough working power supply on the premise of not additionally designing a special power supply module; the temperature measurement core component is packaged by SIP, so that the miniaturization of the system is realized, the interference of an external environment magnetic field is reduced, and the overall service life of the system is prolonged; the temperature measurement result is sent out through the antenna, and remote reporting of the monitoring data is achieved.
The technical scheme for solving the technical problems is as follows:
a passive temperature measurement system based on photovoltaic power generation comprises an electric field forced power taking module, a photovoltaic power generation module, a power supply compensation circuit and a temperature measurement monitoring assembly, wherein two input ends of the electric field forced power taking module are respectively connected with two different potential points in the environment; the output end of the power supply compensation circuit is connected with the power supply input end of the temperature measurement monitoring assembly, and the power supply compensation circuit is used for detecting the voltage of the electric field forced power acquisition module and performing voltage compensation on the power supply input end of the temperature measurement monitoring assembly by adopting the voltage of the photovoltaic power generation module according to a voltage detection result; and the output end of the temperature measurement monitoring assembly is provided with a radio frequency antenna for monitoring the ambient temperature and sending the ambient temperature through the radio frequency antenna.
On the basis of the technical scheme, the invention can be improved as follows.
Preferably, the temperature measurement monitoring assembly comprises a microcontroller, a temperature measurement module and a radio frequency module which are packaged into a whole;
the output end of the temperature measuring module is connected with the input end of the microcontroller and is used for monitoring an environmental temperature value;
the output end of the microcontroller is connected with the input end of the radio frequency module and used for carrying out signal conversion on the temperature value and judging a monitoring result according to the temperature value and a preset threshold value;
and the output end of the radio frequency module is connected to an external antenna through a packaging pin and used for converting a monitoring result into a radio frequency signal to be sent out.
Preferably, the temperature measurement monitoring component comprises a temperature measurement monitoring chip U3 for SIP packaging of the microcontroller, the temperature measurement module and the radio frequency module, and further comprises resistors R2-R6 and a capacitor C5, a reset pin NRST of the temperature measurement monitoring chip U3 is connected in series with a resistor R2 and then is connected with a power input pin VCC of the temperature measurement monitoring chip U3 to be connected with a second-stage output end of the electric field strong power acquisition module and an output end of the power compensation circuit, an antenna interface ANT of the temperature measurement monitoring chip U3 is connected with an external antenna, a UART1_ TX pin and a UART1_ RX pin of the temperature measurement monitoring chip U3 are used as debugging channels and are grounded through a resistor R3 and a resistor R4 respectively, a SWCLK pin and a SWDIO pin of the temperature measurement monitoring chip U3 are used as program burning channels, the SWCLK pin is grounded through a resistor R5, the SWDIO pin is connected to a power supply input end VCC of the temperature measurement monitoring chip U3 through a resistor R6, and the power supply input end VCC of the temperature measurement monitoring chip U3 is also grounded after being connected with a capacitor C5 in series; the temperature measurement monitoring chip U3 is also provided with a plurality of spare pins, and each spare pin is grounded through a resistor.
Preferably, the temperature measuring module comprises a temperature measuring chip U31 and a resistor R12; the microcontroller comprises a microcontroller chip U32, a resistor R13-a resistor R14 and a capacitor C7-a capacitor C8; the radio frequency module comprises a radio frequency chip U33, capacitors C9-C16 and an inductor L3; the power input ends VDD of the temperature measurement chip U31, the microcontroller chip U32 and the radio frequency chip U33 are correspondingly connected to the power input end VCC of the temperature measurement monitoring chip U3, and grounding ends of the temperature measurement chip U31, the microcontroller chip U32 and the radio frequency chip U33 are connected with the grounding end of the temperature measurement monitoring chip U3; the detection output end DQ of the temperature measurement chip U31 is connected to the power input end VDD through a pull-up resistor R12, and the detection output end DQ is connected to the sampling signal input end PD4 of the microcontroller chip U32; the microcontroller chip U32 is in communication connection with the radio frequency chip U33 through an SPI bus, at least two output ends of the microcontroller chip U32 are respectively connected with an interrupt signal end IRQ and an enable end CE of the radio frequency chip U33, an SWCLK pin and an SWDIO pin of the microcontroller chip U32 are respectively and correspondingly connected with an SWCLK pin and an SWDIO pin of the temperature measurement monitoring chip U3, the SWCLK pin and the SWDIO pin of the microcontroller chip U32 are respectively and correspondingly grounded through a resistor R13 and a resistor R14, a VCAP pin and a VDD pin of the microcontroller chip U32 are respectively and correspondingly grounded through a capacitor C7 and a capacitor C8, and the microcontroller chip U32 is additionally provided with a plurality of input and output pins serving as standby pins and is in one-to-one corresponding connection with the standby pins of the temperature measurement monitoring chip U3; the VDD pin of the radio frequency chip U33 is grounded through capacitors C9-C12 which are connected in parallel, a crystal oscillator XTAL is connected in series between a clock signal pin X0 and a clock signal pin X1 of the radio frequency chip U33, the clock signal pins X0 and X1 are grounded through a capacitor C15 and a capacitor C16 respectively, a radio frequency communication end ANT of the radio frequency chip U33 is connected with an antenna interface ANT of the temperature measurement monitoring chip U3 correspondingly after being sequentially connected with a capacitor C13 and an inductor L3 in series, and the common ends of the inductor L3 and the antenna interface ANT of the temperature measurement monitoring chip U3 are grounded through a capacitor C14.
Preferably, the photovoltaic power generation module comprises a photovoltaic battery pack, a photovoltaic voltage conversion chip U1, voltage dividing resistors R15 and R16, capacitors C1 to C3 and an inductor L1, wherein a voltage output end of the photovoltaic battery pack is connected to an input end VIN of the photovoltaic voltage conversion chip U1, one end of each of the voltage dividing resistors R15 and R16 is connected to a voltage output end VIN of the photovoltaic battery pack after being connected in series, the other end of each of the voltage dividing resistors is grounded, a common end of the voltage dividing resistors R15 and R16 is connected to an enable end RUN, a power supply pin VCC, an OS1 pin, an MPP pin and an ILIMSEL pin of the photovoltaic voltage conversion chip U1 after being connected in series, an energy storage capacitor pin VSTORE, an energy storage enable end ENVSTR and a pin VCAP of the photovoltaic voltage conversion chip U1 are shorted and grounded through a capacitor C3, a switch control pin SW1 of the photovoltaic voltage conversion chip U1 is connected in series with the inductor L1 and the capacitor C1 in series in sequence and then grounded, a switch control pin SW2 of the photovoltaic voltage conversion chip U1 is connected in series and then grounded, and a voltage conversion chip OS2 of the photovoltaic voltage conversion chip OS1 is connected in series, The open-drain output pin PGOOD, the pin SS1 and the pin SS2 are all grounded, the output terminal VOUT of the photovoltaic voltage conversion chip U1 is grounded after being connected in series with the capacitor C2, and the output terminal VOUT of the photovoltaic voltage conversion chip U1 is used for outputting the output voltage of the photovoltaic power generation module.
Preferably, the power compensation circuit comprises a voltage management chip U2 and a resistor R1, a reset terminal RST of the voltage management chip U2 is grounded through the resistor R1, one input terminal VIN _1 of the voltage management chip U2 is connected to an output terminal of the photovoltaic power generation module, another input terminal VIN _2 of the voltage management chip U2 is connected to a first-stage output terminal of the field-enhanced power acquisition module, an output terminal of the voltage management chip U2 is connected to a power input terminal of the temperature measurement monitoring module, and the voltage management chip U2 is configured to connect the output terminal of the photovoltaic power generation module and the power input terminal of the temperature measurement monitoring module when detecting that the voltage of the field-enhanced power acquisition module is lower than a preset value, so as to perform voltage compensation on the power input terminal of the temperature measurement monitoring module through the output voltage of the photovoltaic power generation module.
Preferably, the electric field forced electricity taking module comprises a bridge rectifier module, a voltage comparison module and a boost module, two input ends of the bridge rectifier module are correspondingly connected with two electricity taking potential points with different voltages, and a direct current output end of the bridge rectifier module is used as a first-stage output end of the electric field forced electricity taking module; the positive electrode of the direct current output end of the bridge rectifier module is connected with the input end of the voltage comparison module and the input end of the boost module, a reference voltage is arranged in the voltage comparison module, the output end of the voltage comparison module is connected with the enabling end of the boost module, the positive electrode of the direct current output end of the bridge rectifier module is connected with the input end of the boost module, and the output end of the boost module is used as the second-stage output end of the electric field forced power acquisition module and is connected with the power supply input end of the temperature measurement monitoring assembly; the output end of the boost module is also connected with the input end of the voltage comparison module and the enabling end of the boost module.
Preferably, the bridge rectifier module comprises diodes D1-D4 and a capacitor C4, the diodes D1-D4 form a rectifier bridge, a cathode of the diode D1 and an anode of the diode D3 are connected to one point of taking an electric potential, a cathode of the diode D2 and an anode of the diode D4 are connected to another point of taking an electric potential, a cathode of the diode D3 is shorted with a cathode of the diode D4 and serves as a positive electrode VCap of a direct current output end of the bridge rectifier module, and an anode of the diode D1 and an anode of the diode D2 are grounded and serve as a negative electrode of the direct current output end of the bridge rectifier module; the capacitor C14 is disposed between the positive electrode VCap of the dc output terminal of the bridge rectifier module and the negative electrode of the dc output terminal of the bridge rectifier module.
Preferably, the voltage comparison module includes a voltage comparison chip U4, a reference voltage is set in the voltage comparison chip U4, the positive electrode VCap of the dc output terminal of the bridge rectifier module and the output terminal Vout of the boost module are connected to the input terminal VDD of the voltage comparison chip U4, the VSS pin of the voltage comparison chip U4 is grounded, and the output terminal OUT of the voltage comparison chip U4 is connected to the enable terminal of the boost module.
Preferably, the boost module includes a boost chip U5, an inductor L2, a resistor R11, a resistor R17, a resistor R18, a capacitor C6, and a diode D5, an input terminal Vin of the boost chip U5 is connected to a positive electrode VCap of a dc output terminal of the bridge rectifier module, an enable terminal EN of the boost chip U5 is connected to an output terminal OUT of the voltage comparison chip U4, a RON pin of the boost chip U5 is connected in series with a resistor R11 and then grounded, a BST pin of the boost chip U5 is connected in series with the capacitor C6 and then connected to a SW pin of the boost chip U5, and a SW pin of the boost chip U5 is connected in series with an inductor L2 and then serves as an output terminal Vout of the boost module; an output end Vout of the boost module is connected in series with a forward biased diode D5 and then connected to an enable end EN of a boost chip U5, and the output end Vout of the boost module is connected to an input end VDD of the voltage comparison chip U4; the output terminal Vout of the boost module is connected in series with the resistor R17 and the resistor R18 and then grounded, and the common terminal of the resistor R17 and the resistor R18 is connected to the feedback pin FB of the boost chip U5.
The invention has the beneficial effects that: according to the passive temperature measurement system based on photovoltaic power generation, provided by the invention, the current is formed by mainly utilizing the potential difference between different potential points in the existing environment to take electricity, and meanwhile, the photovoltaic power generation is used for power supply compensation, so that the temperature measurement system has enough working power supply on the premise of not additionally designing a special power supply module, and the miniaturization of the overall design of the system is facilitated. The temperature measurement core component is packaged into a temperature measurement monitoring component, so that the miniaturization of the system is realized, the interference of an external environment magnetic field is reduced, and the overall stability and the service life of the system are improved. The temperature measurement result is sent by the antenna, so that the remote reporting of the monitoring data is realized, and the centralized management of the temperature measurement at multiple positions is facilitated.
Drawings
FIG. 1 is a block diagram of the temperature measurement system of the present invention;
FIG. 2 is a schematic diagram of a photovoltaic power generation module circuit of the temperature measurement system of the present invention;
FIG. 3 is a schematic diagram of a power supply compensation circuit of the temperature measurement system of the present invention;
FIG. 4 is a schematic diagram of the wiring of the temperature measurement monitoring module package chip of the temperature measurement system of the present invention;
FIG. 5 is a schematic diagram of the wiring of the temperature measurement module inside the temperature measurement monitoring assembly of the temperature measurement system of the present invention;
FIG. 6 is a schematic diagram of the wiring of the microcontroller in the temperature measurement monitoring module of the temperature measurement system of the present invention;
FIG. 7 is a schematic diagram of the wiring of the RF module inside the temperature measurement monitoring assembly of the temperature measurement system of the present invention;
FIG. 8 is a schematic circuit diagram of a bridge rectifier module of the temperature measurement system of the present invention;
FIG. 9 is a schematic circuit diagram of a voltage comparison module of the temperature measurement system of the present invention;
FIG. 10 is a schematic circuit diagram of a boost module of the thermometry system of the present invention.
Detailed Description
The principles and features of this invention are described below in conjunction with the following drawings, which are set forth by way of illustration only and are not intended to limit the scope of the invention.
The passive temperature measurement system based on photovoltaic power generation provided in fig. 1 to 4 includes an electric field forced power acquisition module, a photovoltaic power generation module, a power compensation circuit and a temperature measurement monitoring module, wherein the photovoltaic power generation module generates power by a photoelectric effect of a semiconductor; the two input ends of the electric field forced electricity taking module are respectively connected with two different potential points in the environment, and form current through the potential difference between the two points to take electricity; the electric field forced electricity taking module comprises two stages of output ends, the first stage output end of the electric field forced electricity taking module and the output end of the photovoltaic power generation module are connected with two input ends of the power supply compensation circuit in a one-to-one correspondence mode, and the output end of the power supply compensation circuit is connected with the power supply input end of the temperature measurement monitoring assembly; the second-stage output end of the electric field forced electricity taking module is connected with the power supply input end of the temperature measurement monitoring assembly and is used for directly providing a working power supply for the temperature measurement monitoring assembly; the power supply compensation circuit is used for detecting the voltage of the first-stage output end of the electric field forced electricity taking module, comparing the voltage with a preset value to judge whether the working power supply of the temperature measurement monitoring assembly needs to be compensated or not, if the output voltage of the electric field forced electricity taking module is judged to be low, opening a power supply channel of the photovoltaic power generation module for the temperature measurement monitoring assembly, and performing voltage compensation on the power supply input end of the temperature measurement monitoring assembly by adopting the voltage of the photovoltaic power generation module to ensure that the temperature measurement monitoring assembly has enough voltage to finish temperature measurement and monitor result reporting work; and the output end of the temperature measurement monitoring assembly is provided with a radio frequency antenna for monitoring the ambient temperature and sending the ambient temperature through the radio frequency antenna.
The temperature measurement system of this embodiment mainly utilizes the potential difference formation electric current between the different potential points in the current environment to get the electricity, uses photovoltaic power generation to compensate simultaneously, guarantees that the temperature measurement system possesses sufficient working power supply under the prerequisite of not additionally designing dedicated power module, does benefit to the miniaturization of system global design. The temperature measurement core component is packaged into a temperature measurement monitoring component, so that the miniaturization of the system is realized, the interference of an external environment magnetic field is reduced, and the overall stability and the service life of the system are improved. The temperature measurement result is sent by the antenna, so that the remote reporting of the monitoring data is realized, and the centralized management of the temperature measurement at multiple positions is facilitated.
On the basis of the above technical solution, the present embodiment can be further improved as follows.
With reference to the pin U3 of the packaged chip in FIG. 4 and the internal circuit diagrams of the temperature measurement monitoring assembly in FIGS. 5-7, the temperature measurement monitoring assembly includes a microcontroller, a temperature measurement module and a radio frequency module which are packaged together;
the output end of the temperature measuring module is connected with the input end of the microcontroller and is used for monitoring an environmental temperature value;
the output end of the microcontroller is connected with the input end of the radio frequency module and used for carrying out signal conversion on the temperature value and judging a monitoring result according to the temperature value and a preset threshold value;
the output end of the radio frequency module is connected to an external antenna through a packaging pin and used for converting a monitoring result into a radio frequency signal to be sent out.
The temperature measurement monitoring assembly comprises a temperature measurement monitoring chip U3 formed by SIP packaging of a microcontroller, a temperature measurement module and a radio frequency module, and further comprises resistors R2-R10 and a capacitor C5. The reset pin NRST of the temperature measurement monitoring chip U3 is connected in series with the resistor R2 and then is connected with the power input pin VCC of the temperature measurement monitoring chip U3 together to be connected with the second-stage output end of the electric field forced power acquisition module and the output end of the power compensation circuit, and the power compensation circuit is used for acquiring a working power supply. An antenna interface ANT of the temperature measurement monitoring chip U3 is connected with an external antenna and used for receiving and transmitting radio frequency signals through the antenna. The UART1_ TX pin and the UART1_ RX pin of the temperature measurement monitoring chip U3 are used as debugging channels and are grounded through a resistor R3 and a resistor R4 respectively, and the debugging channels are used for debugging the temperature measurement monitoring chip U3 by workers. The SWCLK pin and the SWDIO pin of the temperature measurement monitoring chip U3 are used as program burning channels, the SWCLK pin is grounded through a resistor R5, and the SWDIO pin is connected to a power supply input end VCC of the temperature measurement monitoring chip U3 through a resistor R6, so that a worker can conveniently burn the program into the temperature measurement monitoring chip U3. The power supply input end VCC of the temperature measurement monitoring chip U3 is also connected in series with the capacitor C5 and then grounded for filtering the input power supply. The temperature measurement monitoring chip U3 is further provided with a plurality of spare pins, and each spare pin is grounded through a resistor (for example, resistors R7-R10).
More specifically, fig. 5 is a schematic circuit diagram of the temperature measurement module, fig. 6 is a schematic circuit diagram of the microcontroller, and fig. 7 is a schematic circuit diagram of the rf module.
In order to further realize the miniaturization of the system, the packaging structure of the temperature measurement monitoring assembly adopts SIP packaging, and the structure simultaneously reduces the influence of a high-voltage environment on the whole temperature measurement monitoring circuit.
The temperature measuring module comprises a temperature measuring chip U31 and a resistor R12; the microcontroller comprises a microcontroller chip U32, a resistor R13-a resistor R14 and a capacitor C7-a capacitor C8; the radio frequency module comprises a radio frequency chip U33, capacitors C9-C16 and an inductor L3. The power input end VDD of the temperature measurement chip U31, the microcontroller chip U32 and the radio frequency chip U33 are correspondingly connected to the power input end VCC of the temperature measurement monitoring chip U3, the grounding ends of the temperature measurement chip U31, the microcontroller chip U32 and the radio frequency chip U33 are connected with the grounding end of the temperature measurement monitoring chip U3, and the three chips are powered by the electric field power-taking module and the photovoltaic power generation module. The temperature measuring chip U31 is a micro temperature sensor, and the microcontroller chip U32 can be realized by a common singlechip. The detection output end DQ of the temperature measurement chip U31 is connected to a high level, such as the power input end VDD thereof, through a pull-up resistor R12, and the detection output end DQ thereof is connected to the sampling signal input end PD4 of the microcontroller chip U32, for sending the monitored temperature signal to the microcontroller chip U32 for processing. The microcontroller chip U32 is in communication connection with the radio frequency chip U33 through an SPI bus, and high-speed full-duplex communication between the microcontroller chip U32 and the radio frequency chip U33 is achieved. At least two output ends of the microcontroller chip U32 are respectively connected to the interrupt signal end IRQ and the enable end CE of the rf chip U33, and are configured to control signal transceiving of the rf chip U33. The SWCLK pin and the SWDIO pin of the microcontroller chip U32 are respectively and correspondingly connected with the SWCLK pin and the SWDIO pin of the temperature measurement monitoring chip U3, and the SWCLK pin and the SWDIO pin of the microcontroller chip U32 are respectively grounded through a pull-down resistor R13 and a pull-down resistor R14, so that the potentials of the SWCLK pin and the SWDIO pin are pulled up. The SWCLK pin and the SWDIO pin are used as reserved program burning channels, so that program burning and debugging of the system are facilitated. The input/output pins PD5 and PD6 of the microcontroller chip U32 are respectively and correspondingly connected with a UART1_ TX pin and a UART1_ RX pin of the temperature measurement monitoring chip U3, and are used as debugging channels, so that the later debugging of the temperature measurement monitoring chip U3 is facilitated. The VCAP pin and the VDD pin of the microcontroller chip U32 are grounded through a capacitor C7 and a capacitor C8, respectively, for filtering the power supply. The microcontroller chip U32 is further provided with a plurality of input/output pins as spare pins, and the spare pins are connected with the spare pins (for example, pins PB4, PC4, PC5, PC6, etc.) of the temperature measurement monitoring chip U3 in a one-to-one correspondence manner, so as to be used for expansion of other subsequent functions. And the VDD pin of the radio frequency chip U33 is grounded through the parallel capacitors C9-C12 and is used for filtering the power input into the radio frequency chip U33. The crystal oscillator XTAL is connected in series between the clock signal pins X0 and X1 of the radio frequency chip U33, and the clock signal pins X0 and X1 are grounded through a capacitor C15 and a capacitor C16 respectively, so as to provide a clock signal for the radio frequency chip U33. The radio frequency communication end ANT of the radio frequency chip U33 is connected with the antenna interface ANT of the temperature measurement monitoring chip U3 correspondingly after being sequentially connected with the capacitor C13 and the inductor L3 in series, and the common end of the inductor L3 and the antenna interface ANT of the temperature measurement monitoring chip U3 is grounded through the capacitor C14. The microcontroller chip U32 sends the processed (for example, analog-to-digital conversion) temperature value and the result of comparing the temperature value with the preset temperature threshold value to the radio frequency chip U33, and the radio frequency chip U33 converts the digital signal into a radio frequency signal and sends the radio frequency signal through a radio frequency antenna ANT connected to an output ANT of the radio frequency chip U33, so as to be received by the remote communication device. Similarly, the remote device may also set the parameters of the system by sending radio frequency signals to the system.
As shown in fig. 2, the photovoltaic power generation module includes a photovoltaic cell set (not shown), a photovoltaic voltage conversion chip U1, voltage dividing resistors R15 and R16, capacitors C1 to C3, and an inductor L1. In this embodiment, the photovoltaic voltage conversion chip U1 can stabilize and convert the unstable direct current output by the photovoltaic battery pack to output a stable direct current for the back-end circuit. The voltage output end of the photovoltaic battery pack is connected to the input end VIN of the photovoltaic voltage conversion chip U1 to provide the electric energy converted by the photoelectric effect; one end of each of voltage dividing resistors R15 and R16 is connected with a voltage output end VIN of the photovoltaic battery pack after being connected in series, the other end of each of the voltage dividing resistors R15 and R16 is grounded, the common end of each of the voltage dividing resistors R15 and R16 is connected with an enable end RUN, a power supply pin VCC, an OS1 pin, an MPP pin and an ILIMSEL pin of the photovoltaic voltage conversion chip U1, and the voltage dividing resistors R15 and R16 provide enable signals and working power supply for the photovoltaic voltage conversion chip U1 after voltage reduction. An energy storage capacitor pin VSTORE, an energy storage enabling end ENVSTR and a pin VCAP of the photovoltaic voltage conversion chip U1 are in short circuit and are grounded through a capacitor C3, and a capacitor C3 is used for filtering; the switch control pin SW1 of the photovoltaic voltage conversion chip U1 is sequentially connected in series with an inductor L1 and a capacitor C1 and then grounded, the switch control pin SW2 of the photovoltaic voltage conversion chip U1 is connected in series with the capacitor C1 and then grounded, the pin OS2, the open-drain output pin PGOOD, the pin SS1 and the pin SS2 of the photovoltaic voltage conversion chip U1 are all grounded, the output end VOUT of the photovoltaic voltage conversion chip U1 is connected in series with the capacitor C2 and then grounded, and the output end VOUT of the photovoltaic voltage conversion chip U1 is used for outputting the output voltage of the photovoltaic power generation module to a rear-end power utilization circuit.
As shown in fig. 3, the power compensation circuit includes a voltage management chip U2 and a resistor R1, wherein the voltage management chip U2 may be implemented by a common single chip and its peripheral circuits. The reset end RST of the voltage management chip U2 is grounded through a resistor R1, one input end VIN _1 of the voltage management chip U2 is connected with the output end of the photovoltaic power generation module, the other input end VIN _2 of the voltage management chip U2 is connected with the first-stage output end (see a potential point VCap in fig. 8) of the electric field forced power acquisition module, and the output end of the voltage management chip U2 is connected with the power supply input end of the temperature measurement monitoring component U3. The voltage management chip U2 is configured to, when detecting that the voltage VCap of the first-stage output terminal of the electric field forced power acquisition module is lower than a preset value, connect the output terminal of the photovoltaic power generation module (see a potential point VOUT in fig. 2) and the power input terminal of the temperature measurement monitoring module (see a potential point VOUT in fig. 4), so as to perform voltage compensation on the power input terminal of the temperature measurement monitoring module through the output voltage VOUT of the photovoltaic power generation module.
As shown in fig. 8 to 10, the electric field forced power taking module includes a bridge rectifier module, a voltage comparison module and a boost module, as shown in fig. 8, two input ends of the bridge rectifier module are correspondingly connected to two power taking potential points with different voltages, a dc output end of the bridge rectifier module is used as a first-stage output end of the electric field forced power taking module and is connected to an input end of a power compensation circuit, as shown in fig. 3, where an output voltage is used as a sampling point for the power compensation circuit to perform voltage monitoring on the electric field forced power taking module; as shown in fig. 9 and 10, the positive electrode of the dc output terminal of the bridge rectifier module is connected to the input terminal of the voltage comparison module and the input terminal of the boost module, the voltage comparison module is internally provided with a reference voltage, the output terminal of the voltage comparison module is connected to the enable terminal of the boost module, the positive electrode of the dc output terminal of the bridge rectifier module is connected to the input terminal of the boost module, and the output terminal of the boost module is used as the second output terminal of the field strength acquisition module and is connected to the power input terminal of the temperature measurement monitoring module, so as to directly supply power to the temperature measurement monitoring module. The output end of the boost module is also connected with the input end of the voltage comparison module and the enabling end of the boost module, and is used for feeding back the voltage of the input end of the temperature measurement monitoring assembly to the input end of the voltage comparison module and the enabling end of the boost module; when the voltage at the input end of the temperature measurement monitoring assembly is lower due to the energy consumption of a subsequent power utilization circuit, the voltage at the input end of the input voltage comparison module is reduced, and the voltage comparison module compares the voltage at the input end with the reference voltage and then outputs an enable signal to control the boost module to work; similarly, the output voltage of the boost module is fed back to the enabling end of the boost module, and the boost module is controlled to work together with the enabling signal output by the voltage comparison module, so that the electric field forced power taking module forms a closed-loop control relation and is more sensitive to the adjustment of the power supply.
In this embodiment, the voltage comparison module compares the dc power output by the bridge rectifier module and the voltage output by the boost module with a reference voltage inside the voltage comparison module. Because the direct current output by the bridge rectifier module is relatively stable, and the voltage output by the boost module is directly used for the consumption of the subsequent temperature measurement monitoring component and the antenna, the voltage comparison module mainly monitors the change of the voltage at the output end (corresponding to the power input end of the temperature measurement monitoring component) of the boost module. When the voltage of the output end (corresponding to the power input end of the temperature measurement monitoring component) of the boost module is higher, the voltage comparison module outputs a control signal to control the boost module to work as an enabling signal of the boost module, and at the moment, the boost module boosts the direct current output by the bridge rectifier module and supplies the boosted direct current to the subsequent temperature measurement monitoring component and the antenna. With reference to the power compensation circuit shown in fig. 3, when the voltage management chip U2 detects that the voltage input by the voltage comparison module (the voltage corresponds to the first-stage output voltage of the electric field forced power module) is lower due to the consumption of the subsequent temperature measurement monitoring module and the antenna, the voltage at the output terminal of the boost module (the voltage corresponds to the second-stage output voltage of the electric field forced power module) correspondingly decreases, and at this time, the voltage management chip U2 turns on the power compensation channel, and the output voltage VOUT of the photovoltaic power generation module is used to perform voltage compensation on the power input terminal of the temperature measurement monitoring module. In the process of voltage compensation, the voltage of the power supply input end of the temperature measurement monitoring assembly rises, correspondingly, the voltage of the output end of the boost module rises, when the voltage rises to a critical point, the voltage comparison module detects that the voltage of the output end of the boost module rises, the boost module is controlled to work by the voltage comparison module, meanwhile, the voltage compensation channel is closed by the voltage management chip U2, at the moment, the electric field forced electricity taking module continues to supply power for the temperature measurement monitoring assembly, and the photovoltaic power generation module continues to store energy. Therefore, at the power input end of the temperature measurement monitoring assembly, the photovoltaic power generation module and the electric field forced power taking module are alternately conducted and complementary in time sequence to supply power to the temperature measurement monitoring assembly, and the reliability of long-term work of the temperature measurement monitoring assembly is enhanced.
As shown in fig. 8, the bridge rectifier module includes diodes D1-D4 and a capacitor C4, the diodes D1-D4 form a rectifier bridge, specifically, a cathode of the diode D1 and an anode of the diode D3 are connected to a point for taking electric potential, a cathode of the diode D2 and an anode of the diode D4 are connected to another point for taking electric potential, and a current can be formed between the two points for taking electric potential due to a voltage difference between the two points for taking electric potential; the cathode of the diode D3 is in short circuit with the cathode of the diode D4 and serves as the positive electrode VCap of the direct current output end of the bridge rectifier module, and the anode of the diode D1 and the anode of the diode D2 are grounded and serve as the negative electrode of the direct current output end of the bridge rectifier module; the capacitor C14 is disposed between the positive electrode VCap of the dc output terminal of the bridge rectifier module and the negative electrode of the dc output terminal of the bridge rectifier module. The capacitor C4 can reduce the influence of high voltage/magnetic field sudden change in the external environment on the system, and protect the rectifier bridge and the subsequent circuits thereof.
As shown in fig. 9, the voltage comparison module includes a voltage comparison chip U4, a reference voltage is set in the voltage comparison chip U4, a positive electrode VCap of a dc output terminal of the bridge rectifier module and an output terminal Vout of the boost module are connected to an input terminal VDD of the voltage comparison chip U4, with reference to fig. 9 and 10, a VSS pin of the voltage comparison chip U4 is grounded, and an output terminal OUT of the voltage comparison chip U4 is connected to an enable terminal EN of the boost module. The voltage comparison chip U4 compares the voltage output by the bridge rectifier module and the voltage at the input end of the temperature measurement monitoring component with the reference voltage, and outputs a control signal UVLO as an enable signal of the boost module to control the operation of the boost module. Because the voltage at the input end of the temperature measurement monitoring component is periodically changed, the control signal UVLO output by the voltage comparison chip U4 is also periodically changed, and the control signal UVLO controls the boost module to be periodically turned on and off, so as to realize boosting.
As shown in fig. 10, the boost module includes a boost chip U5, an inductor L2, a resistor R11, a resistor R17, a resistor R18, a capacitor C6, and a diode D5, an input terminal Vin of the boost chip U5 is connected to a positive electrode VCap of a dc output terminal of the bridge rectifier module, an enable terminal EN of the boost chip U5 is connected to an output terminal OUT of the voltage comparison chip U4, a RON pin of the boost chip U5 is connected in series with a resistor R11 and then grounded, a BST pin of the boost chip U5 is connected in series with the capacitor C6 and then connected to a SW pin of the boost chip U5, and a SW pin of the boost chip U5 is connected in series with the inductor L2 and then serves as an output terminal Vout of the boost module; an output end Vout of the boost module is connected in series with a forward-biased anti-reverse diode D5 and then is connected to an enable end EN of a boost chip U5, and the output end Vout of the boost module is connected to an input end VDD of the voltage comparison chip U4; the output end Vout of the boost module is connected in series with the voltage dividing resistor R17 and the voltage dividing resistor R18 and then grounded, and the common end of the voltage dividing resistor R17 and the voltage dividing resistor R18 is connected to the feedback pin FB of the boost chip U5.
The boost chip U5 boosts the input dc of the bridge rectifier module under the comprehensive control of the control signal UVLO output by the voltage comparison chip U4 and the voltage Vout at its output terminal, thereby outputting the boosted voltage to the temperature measurement monitoring module. The resistor R17 and the resistor R18 form a group of voltage dividing resistors, sampling voltage is provided for the voltage feedback end FB of the boost chip U6, and the boost chip U6 is protected.
According to the passive temperature measurement system based on photovoltaic power generation, provided by the embodiment, the potential difference between different potential points in the existing environment is mainly utilized for power taking, and the photovoltaic power generation is used for compensation, so that the two power supply modes are alternately conducted and have different time sequences, and the temperature measurement system is ensured to have enough working power supply on the premise of not additionally designing a special power supply module; the temperature measurement core component is packaged by SIP, so that the miniaturization of the system is realized, the interference of an external environment magnetic field is reduced, and the overall service life of the system is prolonged; the temperature measurement result is sent out through the antenna, and remote reporting of the monitoring data is achieved.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (10)
1. A passive temperature measurement system based on photovoltaic power generation is characterized by comprising an electric field forced electricity taking module, a photovoltaic power generation module, a power supply compensation circuit and a temperature measurement monitoring component, wherein two input ends of the electric field forced electricity taking module are respectively connected with two different potential points in the environment; the output end of the power supply compensation circuit is connected with the power supply input end of the temperature measurement monitoring assembly, and the power supply compensation circuit is used for detecting the voltage of the electric field forced power acquisition module and performing voltage compensation on the power supply input end of the temperature measurement monitoring assembly by adopting the voltage of the photovoltaic power generation module according to a voltage detection result; and the output end of the temperature measurement monitoring assembly is provided with a radio frequency antenna for monitoring the ambient temperature and sending the ambient temperature through the radio frequency antenna.
2. The photovoltaic power generation-based passive temperature measurement system according to claim 1, wherein the temperature measurement monitoring component comprises a microcontroller, a temperature measurement module and a radio frequency module which are packaged into a whole;
the output end of the temperature measuring module is connected with the input end of the microcontroller and is used for monitoring an environmental temperature value;
the output end of the microcontroller is connected with the input end of the radio frequency module and used for carrying out signal conversion on the temperature value and judging a monitoring result according to the temperature value and a preset threshold value;
the output end of the radio frequency module is connected to an external antenna through a packaging pin and used for converting a monitoring result into a radio frequency signal to be sent out.
3. The passive temperature measurement system based on photovoltaic power generation as claimed in claim 2, wherein the temperature measurement monitoring component includes a temperature measurement monitoring chip U3 for SIP packaging of the microcontroller, the temperature measurement module and the RF module, and further includes resistors R2-R6 and a capacitor C5, a reset pin NRST of the temperature measurement monitoring chip U3 is connected in series with a resistor R2 and then connected with a second-stage output terminal of the electric field forced power acquisition module and an output terminal of the power compensation circuit together with a power input pin VCC of the temperature measurement monitoring chip U3, an antenna interface ANT of the temperature measurement monitoring chip U3 is connected with an external antenna, a UART1_ TX pin and a UART1_ RX pin of the temperature measurement monitoring chip U3 are used as debugging channels and grounded through a resistor R3 and a resistor R4 respectively, a SWCLK pin and a SWDIO pin of the temperature measurement monitoring chip U3 are used as program programming channels, the SWCLK pin is grounded through a resistor R5, the SWDIO pin is connected to a power input terminal VCC of the temperature measurement monitoring chip U3 through a resistor R6, the power supply input end VCC of the temperature measurement monitoring chip U3 is also connected with the capacitor C5 in series and then is grounded; the temperature measurement monitoring chip U3 is also provided with a plurality of spare pins, and each spare pin is grounded through a resistor.
4. The photovoltaic power generation-based passive temperature measurement system according to claim 3, wherein the temperature measurement module comprises a temperature measurement chip U31 and a resistor R12; the microcontroller comprises a microcontroller chip U32, a resistor R13-a resistor R14 and a capacitor C7-a capacitor C8; the radio frequency module comprises a radio frequency chip U33, capacitors C9-C16 and an inductor L3; the power input ends VDD of the temperature measurement chip U31, the microcontroller chip U32 and the radio frequency chip U33 are correspondingly connected to the power input end VCC of the temperature measurement monitoring chip U3, and grounding ends of the temperature measurement chip U31, the microcontroller chip U32 and the radio frequency chip U33 are connected with the grounding end of the temperature measurement monitoring chip U3; the detection output end DQ of the temperature measurement chip U31 is connected to the power input end VDD through a pull-up resistor R12, and the detection output end DQ is connected to the sampling signal input end PD4 of the microcontroller chip U32; the microcontroller chip U32 is in communication connection with the radio frequency chip U33 through an SPI bus, at least two output ends of the microcontroller chip U32 are respectively connected with an interrupt signal end IRQ and an enable end CE of the radio frequency chip U33, an SWCLK pin and an SWDIO pin of the microcontroller chip U32 are respectively and correspondingly connected with an SWCLK pin and an SWDIO pin of the temperature measurement monitoring chip U3, the SWCLK pin and the SWDIO pin of the microcontroller chip U32 are respectively and correspondingly grounded through a resistor R13 and a resistor R14, a VCAP pin and a VDD pin of the microcontroller chip U32 are respectively and correspondingly grounded through a capacitor C7 and a capacitor C8, and the microcontroller chip U32 is additionally provided with a plurality of input and output pins serving as standby pins and is in one-to-one corresponding connection with the standby pins of the temperature measurement monitoring chip U3; the VDD pin of the radio frequency chip U33 is grounded through capacitors C9-C12 which are connected in parallel, a crystal oscillator XTAL is connected in series between a clock signal pin X0 and a clock signal pin X1 of the radio frequency chip U33, the clock signal pins X0 and X1 are grounded through a capacitor C15 and a capacitor C16 respectively, a radio frequency communication end ANT of the radio frequency chip U33 is connected with an antenna interface ANT of the temperature measurement monitoring chip U3 correspondingly after being sequentially connected with a capacitor C13 and an inductor L3 in series, and the common ends of the inductor L3 and the antenna interface ANT of the temperature measurement monitoring chip U3 are grounded through a capacitor C14.
5. The passive temperature measurement system based on photovoltaic power generation as claimed in claim 1, wherein the photovoltaic power generation module includes a photovoltaic battery pack, a photovoltaic voltage conversion chip U1, voltage dividing resistors R15 and R16, capacitors C1 to C3, and an inductor L1, a voltage output terminal of the photovoltaic battery pack is connected to an input terminal VIN of the photovoltaic voltage conversion chip U1, one end of the voltage dividing resistors R15 and R16 is connected in series to a voltage output terminal VIN of the photovoltaic battery pack, and the other end is grounded, a common terminal of the voltage dividing resistors R15 and R16 is connected to an enable terminal RUN of the photovoltaic voltage conversion chip U1, a power supply pin VCC, an OS1 pin, an MPP pin, and an ILIMSEL pin, an energy storage capacitor pin VSTORE, an energy storage enable terminal ENVSTR, and a pin VCAP of the photovoltaic voltage conversion chip U1 are shorted and grounded through a capacitor C3, a switch control pin 1 of the photovoltaic voltage conversion chip U1 is connected in series with an inductor L828456 and a capacitor C53 in series in turn and then grounded, and a switch control pin SW 867 of the photovoltaic voltage conversion chip U1 is connected in series to a capacitor C867 and then grounded, the pin OS2, the open-drain output pin PGOOD, the pin SS1 and the pin SS2 of the photovoltaic voltage conversion chip U1 are all grounded, the output terminal VOUT of the photovoltaic voltage conversion chip U1 is grounded after being connected in series with the capacitor C2, and the output terminal VOUT of the photovoltaic voltage conversion chip U1 is used for outputting the output voltage of the photovoltaic power generation module.
6. The passive temperature measurement system based on photovoltaic power generation as claimed in claim 1, the power supply compensation circuit comprises a voltage management chip U2 and a resistor R1, wherein a reset end RST of the voltage management chip U2 is grounded through the resistor R1, one input end VIN _1 of the voltage management chip U2 is connected with the output end of the photovoltaic power generation module, the other input end VIN _2 of the voltage management chip U2 is connected with the first-stage output end of the electric field forced power acquisition module, the output end of the voltage management chip U2 is connected with the power supply input end of the temperature measurement monitoring component, the voltage management chip U2 is used for connecting the output end of the photovoltaic power generation module and the power supply input end of the temperature measurement monitoring component when detecting that the voltage of the electric field forced power acquisition module is lower than a preset value, therefore, the output voltage of the photovoltaic power generation module is used for carrying out voltage compensation on the power input end of the temperature measurement monitoring assembly.
7. The photovoltaic power generation-based passive temperature measurement system according to claim 6, wherein the electric field forced power acquisition module comprises a bridge rectifier module, a voltage comparison module and a boost module, two input ends of the bridge rectifier module are correspondingly connected with two power acquisition potential points with different voltages, and a direct current output end of the bridge rectifier module is used as a first-stage output end of the electric field forced power acquisition module; the positive electrode of the direct current output end of the bridge rectifier module is connected with the input end of the voltage comparison module and the input end of the boost module, a reference voltage is arranged in the voltage comparison module, the output end of the voltage comparison module is connected with the enabling end of the boost module, the positive electrode of the direct current output end of the bridge rectifier module is connected with the input end of the boost module, and the output end of the boost module is used as the second-stage output end of the electric field forced power acquisition module and is connected with the power supply input end of the temperature measurement monitoring assembly; the output end of the boost module is also connected with the input end of the voltage comparison module and the enabling end of the boost module.
8. The passive temperature measurement system based on photovoltaic power generation of claim 7, wherein the bridge rectifier module comprises diodes D1-D4 and a capacitor C4, the diodes D1-D4 form a rectifier bridge, the cathode of the diode D1 and the anode of the diode D3 are connected to a point of taking electric potential together, the cathode of the diode D2 and the anode of the diode D4 are connected to another point of taking electric potential together, the cathode of the diode D3 is shorted with the cathode of the diode D4 to serve as the positive electrode VCap of the dc output terminal of the bridge rectifier module, the anode of the diode D1 and the anode of the diode D2 are grounded to serve as the negative electrode of the dc output terminal of the bridge rectifier module; the capacitor C14 is disposed between the positive electrode VCap of the dc output terminal of the bridge rectifier module and the negative electrode of the dc output terminal of the bridge rectifier module.
9. The passive temperature measurement system based on photovoltaic power generation as claimed in claim 7 or 8, wherein the voltage comparison module includes a voltage comparison chip U4, a reference voltage is set in the voltage comparison chip U4, a positive electrode VCap of a dc output terminal of the bridge rectifier module and an output terminal Vout of the boost module are connected to an input terminal VDD of the voltage comparison chip U4, a VSS pin of the voltage comparison chip U4 is grounded, and an output terminal OUT of the voltage comparison chip U4 is connected to an enable terminal of the boost module.
10. The photovoltaic power generation-based passive temperature measurement system according to claim 9, wherein the boost module comprises a boost chip U5, an inductor L2, a resistor R11, a resistor R17, a resistor R18, a capacitor C6 and a diode D5, an input end Vin of the boost chip U5 is connected to a positive electrode VCap of a dc output end of the bridge rectifier module, an enable end EN of the boost chip U5 is connected to an output end OUT of the voltage comparison chip U4, a pin RON of the boost chip U5 is connected in series with a resistor R11 and then grounded, a pin BST of the boost chip U5 is connected in series with a capacitor C6 and then connected with a pin SW of the boost chip U5, and a pin SW of the boost chip U5 is connected in series with an inductor L2 and then serves as an output end Vout of the boost module; an output end Vout of the boost module is connected in series with a forward biased diode D5 and then connected to an enable end EN of a boost chip U5, and the output end Vout of the boost module is connected to an input end VDD of the voltage comparison chip U4; the output terminal Vout of the boost module is connected in series with the resistor R17 and the resistor R18 and then grounded, and the common terminal of the resistor R17 and the resistor R18 is connected to the feedback pin FB of the boost chip U5.
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