CN114867200A - Suspension strip line filter and micro-assembly circuit integrated module - Google Patents
Suspension strip line filter and micro-assembly circuit integrated module Download PDFInfo
- Publication number
- CN114867200A CN114867200A CN202210635981.1A CN202210635981A CN114867200A CN 114867200 A CN114867200 A CN 114867200A CN 202210635981 A CN202210635981 A CN 202210635981A CN 114867200 A CN114867200 A CN 114867200A
- Authority
- CN
- China
- Prior art keywords
- impedance line
- low
- filter
- pcb
- pass filter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000725 suspension Substances 0.000 title claims abstract description 22
- 230000008030 elimination Effects 0.000 claims abstract description 7
- 238000003379 elimination reaction Methods 0.000 claims abstract description 7
- 230000010354 integration Effects 0.000 claims abstract description 5
- 238000000034 method Methods 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 7
- 239000003990 capacitor Substances 0.000 description 5
- 238000001914 filtration Methods 0.000 description 4
- 238000002955 isolation Methods 0.000 description 3
- 238000004088 simulation Methods 0.000 description 3
- 230000015556 catabolic process Effects 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000010363 phase shift Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/201—Filters for transverse electromagnetic waves
- H01P1/203—Strip line filters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/201—Filters for transverse electromagnetic waves
- H01P1/203—Strip line filters
- H01P1/2039—Galvanic coupling between Input/Output
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Control Of Motors That Do Not Use Commutators (AREA)
Abstract
The utility model provides a suspension stripline filter and little assembled circuit integration module, high pass filter, low pass filter, band elimination filter, little assembled circuit adopt the printing mode to integrate on printed circuit board PCB, switch chip, well power amplifier, circuit equalizer weld on printed circuit board PCB, high pass filter, low pass filter adopt suspension stripline structure which characterized in that: the ground layer of the PCB adopts a suspended structure, and a three-dimensional fine adjustment space is provided for the assembly of the high-pass filter, the low impedance line of the low-pass filter and the high impedance line.
Description
Technical Field
The invention relates to the technical field of printed circuits, in particular to a suspension strip line filter and micro-assembly circuit integrated module.
Background
In the prior art, the low impedance line is a pure microstrip line, the high impedance line is a suspension strip line, and the existing design scheme is as follows: the grounding size of the microstrip line is designed to be consistent with the size of the boss of the cavity. When the independent filter is assembled and debugged, the PCB area of the filter is small, the assembly deviation is small, the method has no problem, and the independent debugging is easy.
When the whole module is assembled by adopting a large-area Printed Circuit Board (PCB), the high-impedance line of the filter is moved to the position of the cavity corresponding to the low-impedance line, so that the assembly is easy to deviate, the equivalent inductance value is reduced, and the deviation is generated from the design value; when the high impedance line and the low impedance line are provided with a large number of bias conditions, the indexes of the whole filter have large bias; since the filter is connected to the components of the whole module, it becomes very difficult or even impossible to debug the filter alone, which is fatal to the module integration.
Disclosure of Invention
The invention aims to integrate a suspended strip line filter and a micro-assembly circuit on a Printed Circuit Board (PCB), wherein the stratum of the PCB adopts a suspension mode, so that the assembly precision of a low impedance line and a high impedance line of the filter is improved, and the suspended strip line filter and the micro-assembly circuit integrated module is provided.
The technical solution for realizing the purpose of the invention is as follows:
the utility model provides a suspension stripline filter and little assembled circuit integration module, high pass filter, low pass filter, band elimination filter, little assembled circuit adopt the printing mode to integrate on printed circuit board PCB, switch chip, well power amplifier, circuit equalizer weld on printed circuit board PCB, high pass filter, low pass filter adopt suspension stripline structure which characterized in that: the ground layer of the PCB adopts a suspended structure, and a three-dimensional fine adjustment space is provided for the assembly of the high-pass filter, the low impedance line of the low-pass filter and the high impedance line.
Compared with the prior art, the invention has the following remarkable advantages: (1) the high-pass filter, the low-pass filter, the band-stop filter and the micro-assembly circuit are integrated on a Printed Circuit Board (PCB) in a printing mode; (2) the high-pass filter and the low-pass filter adopt the suspension strip line structure, and the suspension strip line structure has the characteristics of low equivalent dielectric constant and small dielectric loss and is greatly helpful for realizing better selectivity of the filter; (3) the switch chip has the following functions and advantages: wide frequency, low insertion loss, high isolation, self-driven function and nanosecond switching speed; (4) and the ground layer of the PCB adopts a suspended structure, so that a three-dimensional fine adjustment space is provided for the assembly of the high-pass filter, the low impedance line of the low-pass filter and the high impedance line.
The present invention is described in further detail below with reference to the attached drawing figures.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a circuit block diagram of a functional module of a suspension stripline filter and micro-assembly circuit integrated module.
Fig. 2 is a schematic diagram of a suspended stripline model of a module integrating a suspended stripline filter and a micro-assembly circuit.
FIG. 3 is a simulation model diagram of a high-pass filter of a module integrated by a suspended stripline filter and a micro-assembly circuit.
FIG. 4 is a schematic diagram of a simulation model of a high pass filter of a module integrated with a suspended stripline filter and a micro-assembly circuit.
FIG. 5 is a cross-sectional view of a PCB assembly adjustment, high impedance line, low impedance line of a suspended stripline filter and microfabricated integrated circuit module.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
Referring to fig. 1, a block diagram of a circuit structure of a functional module of a suspension stripline filter and micro-assembly integrated circuit module is shown.
The input signal is input from the input interface of the high-pass filter, the output interface of the high-pass filter is connected with the input interface of the first amplifier, the output interface of the first switch chip is connected with the input interface of the first switch chip, the output interface of the first switch chip is respectively connected with the input interface of the first band-stop filter and the input interface of the second switch chip, the output interface of the first band-stop filter is connected with the input interface of the second switch chip, the output interface of the second switch chip is connected with the input interface of the second amplifier, the output interface of the second amplifier is connected with the input interface of the temperature compensation attenuator, the output interface of the temperature compensation attenuator is connected with the input interface of the circuit equalizer, and the output interface of the circuit equalizer is connected with the input interface of the third switch chip, the output interface of the third switch chip is respectively connected with the input interface of the second band-stop filter and the input interface of the fourth switch chip, the output interface of the second band-stop filter is connected with the input interface of the fourth switch chip, the output interface of the fourth switch chip is connected with the input interface of the third amplifier, the output interface of the third amplifier is connected with the input interface of the low-pass filter, and the output interface of the low-pass filter outputs the signal.
The circuit equalizer plays a role in compensating signal loss and degradation in the functional module of the integrated module of the suspended strip line filter and the micro-assembly circuit.
The medium power amplifier includes: the first amplifier, the second amplifier, the third amplifier.
The temperature-compensated attenuator is arranged between the second amplifier and the third amplifier: the first function is that the temperature change of the middle power amplifier can be directly sensed, and the temperature characteristic of the middle power amplifier is easily compensated in real time; the second function is that an isolation function is performed between the second amplifier and the third amplifier, and the second amplifier and the third amplifier are effectively prevented from self-exciting; the temperature compensation attenuator belongs to a passive device, and has no distortion, phase shift and time delay; the fourth function is to simplify the circuit design and manufacture of the middle power amplifier.
The switch chip includes: the first switch chip, the second switch chip, the third switch chip and the fourth switch chip.
The switch chip has the following functions and advantages: wide frequency, low insertion loss, high isolation, self-driven function and nanosecond switching speed.
The power supply part of the integrated module of the suspension strip line filter and the micro-assembly circuit is directly penetrated from the back of the PCB for power supply and control; the printed circuit board PCB control line is provided with the series resistor to improve the anti-static breakdown capability and the surge capability; the PCB control line is directly connected with the power supply glass insulator; the output ends of the switch chips are respectively added with the blocking capacitors, so that mutual influence is avoided.
Example 1:
the high-pass filter, the low-pass filter, the first band-stop filter, the second band-stop filter, the first amplifier, the second amplifier, the third amplifier, the first switch chip, the second switch chip, the third switch chip, the fourth switch chip, the temperature compensation attenuator and the circuit equalizer have different specifications and different electrical performance parameters.
The first switch chip, the second switch chip and the first band elimination filter form a band elimination switch filtering group 1; the third switch chip, the fourth switch chip and the second band elimination filter form a band elimination switch filtering group 2.
The electrical performance parameters (@25 ℃,50 Ω) of the integrated module of the suspended strip line filter and the micro-assembly circuit are as follows:
band-stop switch filtering group 1, C1=0 straight-through; c1=1 stop band channel; passband frequency (GHz): c band 1, KV band 1, remark: when the stop band channel is switched; stop band frequency (GHz): an X wave band 1; stop band rejection (dBc): 70 dBc.
Band-stop switch filtering group 2, C2=0 straight-through; c2=1 stop band channel; passband frequency (GHz): c band 2, KV band 2, remark: when the stop band channel is switched; stop band frequency (GHz): the X wave band is 2; stop band rejection (dBc): 35 dBc.
Passband frequency (GHz): c band, X band, KV band; gain (dB) at full temperature: 2dB +/-1 dB; noise coefficient: less than or equal to 12 dB; -30dBm input, full temperature condition, amplitude uniformity: less than or equal to +/-0.8 dB; input P-1: not less than 12 dBm; input and output standing waves: 1.8; high-pass out-of-band inhibition (dBc): the wave band is more than or equal to 35@ S; low-pass out-of-band rejection (dBc): the band is more than or equal to 35@ KU; c1 and C2 control levels: the high level is 3-5V; operating voltage (V): +5V, -5V;
working temperature (. degree. C.): -40 to +70 ℃; storage temperature (. degree. C.): -55 to +85 ℃; radio frequency input output interface: SMP-J-L; a feed interface: J66M1-131-9ZK (short side up).
J66M1-131-9ZK pin definition: pin number-function definition
Pin number 1- + 5V;
pin number 2-GND;
pin number 3-5V;
pin number 4-GND;
pin numbers 5, 6, 7-NC;
pin number 8-C1;
pin number 9-C2.
With reference to fig. 2, the high impedance line is a suspended strip line, and fig. 2 is a schematic diagram of a suspended strip line model as a basic structural unit of the high pass filter and the low pass filter.
Referring to fig. 3 and 4, a high-pass filter is taken as an example, and fig. 3 is a simulation model of the high-pass filter. It can be seen from the high-pass filter equivalent schematic diagram in fig. 4 that there are five capacitors to ground, and the capacitance values of the capacitors are low, so that a low-impedance line is used to equate to the capacitors to ground, a high-impedance line is used to equate to the inductors, and the middle series capacitor is realized by using a coupling line.
Referring to fig. 5, a cross-sectional view of a suspension stripline filter and PCB assembly with low impedance line, high impedance line and integrated module of a micro-assembly circuit is shown.
The low-impedance line (106) is a pure microstrip line, the high-impedance line (101) is a suspension strip line, the low-impedance line (106) is printed on the upper surface of a microstrip routing layer (103) of the PCB, and the high-impedance line (101) is suspended on the upper surface of the microstrip routing layer (103) of the PCB; the thickness of the low impedance line (106) is T, the suspension height of a ground layer (105) of the PCB is H, and the suspension height of the high impedance line (101) suspended on a microstrip routing layer (103) of the PCB is H (102); the ground layer (105) of the PCB is suspended by a height H, and the three-dimensional micro-adjustment height of the high-impedance line (101) and the microstrip routing layer (103) of the PCB is H + H; the height condition that the microstrip routing layer (103) of the PCB drives the low impedance line (106) and the high impedance line (101) to have is as follows: (H + H) > T.
The conventional assembly scheme is: h =0, H < T, a large number of low impedance lines (106) are assembled in pairs with the high impedance lines (101), and errors also occur when the high impedance lines (101) are suspended positions due to positioning errors of the low impedance lines (106) printed on the microstrip routing layer (103) of the PCB; when the PCB area is small, the assembling deviation between the low impedance line (106) and the high impedance line (101) is small; when the PCB area is large, the assembling deviation between the low impedance line (106) and the high impedance line (101) is large, the low impedance line (106) can generate displacement and deformation phenomena, and the high impedance line (101) generates deformation phenomena; the equivalent inductance will be smaller and will deviate from the design value, and when the position of this kind appears more, the index of whole filter will appear more deviation, because the subassembly of connecting whole module, it will become more troublesome or even impossible to realize alone debugging. This situation is fatal to the module integration.
When H > 0, (H + H) > T,
the high-impedance line (101) is above the horizontal line of the low-impedance line (106), the ground layer (105) of the PCB is suspended, and the position relation between the high-impedance line (101) and the low-impedance line (106) has three-dimensional adjusting capacity; the position adjustment step between the high impedance line (101) and the low impedance line (106) is: the method comprises the steps of firstly, horizontally adjusting the high-impedance line (101) and the low-impedance line (106), secondly, vertically moving a ground layer (105) of the PCB to the high-impedance line (101), vertically adjusting the high-impedance line (101) and the low-impedance line (106), and thirdly, fixing the position of the PCB (104) after electrical performance parameters are met, and further fixing the relative position between the high-impedance line (101) and the low-impedance line (106).
The value range of h is 0.15 mm-0.3 mm.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (6)
1. The utility model provides a suspension stripline filter and little equipment circuit integration module, high pass filter, low pass filter, band elimination filter, little equipment circuit adopt the printing mode to integrate on printed circuit board PCB, high pass filter, low pass filter adopt the suspension stripline structure which characterized in that: the ground layer of the PCB adopts a suspended structure, and a three-dimensional fine adjustment space is provided for the assembly of the high-pass filter, the low impedance line of the low-pass filter and the high impedance line.
2. The integrated module of suspended stripline filter and micropackaged circuit of claim 1, wherein: the low-impedance line (106) is printed on the upper surface of the micro-strip routing layer (103) of the PCB, and the high-impedance line (101) is suspended on the upper surface of the micro-strip routing layer (103) of the PCB.
3. The integrated module of suspension strip line filter and micropackaged circuit of claim 1, 2, characterized in that: the three-dimensional micro-adjustment height of the ground layer (105) of the PCB is H + H, and the three-dimensional micro-adjustment height of the high-impedance line (101) and the micro-strip routing layer (103) of the PCB is H + H.
4. The integrated module of suspended strip line filter and micro assembly circuit as claimed in claim 2 or 3, wherein: the thickness of the low impedance line (106) is T, and the height condition that the low impedance line (106) and the high impedance line (101) are driven by the microstrip routing layer (103) of the PCB is as follows: (H + H) > T.
5. The integrated module of suspension strip line filter and micropackaged circuit of claims 3 and 4, wherein: the value range of h is 0.15 mm-0.3 mm.
6. The integrated module of suspended stripline filter and micropackaged circuit of claims 1 to 5, wherein: the position adjustment step between the high impedance line (101) and the low impedance line (106) is: the method comprises the steps of firstly, horizontally adjusting the high-impedance line (101) and the low-impedance line (106), secondly, vertically moving a ground layer (105) of the PCB to the high-impedance line (101), vertically adjusting the high-impedance line (101) and the low-impedance line (106), and thirdly, fixing the position of the PCB (104) after electrical performance parameters are met, and further fixing the relative position between the high-impedance line (101) and the low-impedance line (106).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210635981.1A CN114867200B (en) | 2022-06-07 | 2022-06-07 | Integrated module of suspension strip line filter and micro-assembly circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210635981.1A CN114867200B (en) | 2022-06-07 | 2022-06-07 | Integrated module of suspension strip line filter and micro-assembly circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114867200A true CN114867200A (en) | 2022-08-05 |
| CN114867200B CN114867200B (en) | 2024-05-07 |
Family
ID=82625111
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210635981.1A Active CN114867200B (en) | 2022-06-07 | 2022-06-07 | Integrated module of suspension strip line filter and micro-assembly circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114867200B (en) |
Citations (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4577171A (en) * | 1983-05-11 | 1986-03-18 | Telefunken Electronic Gmbh | Input circuit comprising at least two input paths |
| WO1996022671A1 (en) * | 1995-01-20 | 1996-07-25 | Minnesota Mining And Manufacturing Company | Electronic circuit structure |
| JPH10276006A (en) * | 1997-02-06 | 1998-10-13 | Hyundai Electron Ind Co Ltd | Low-pass filter for ultra high frequency |
| US20050206482A1 (en) * | 2004-03-17 | 2005-09-22 | Dutoit Nicolaas | Electronically tunable switched-resonator filter bank |
| US8607445B1 (en) * | 2005-01-10 | 2013-12-17 | Endicott Interconnect Technologies, Inc. | Substrate having internal capacitor and method of making same |
| US20140062620A1 (en) * | 2011-05-20 | 2014-03-06 | Trilithic, Inc. | Voltage tunable filters |
| WO2018076950A1 (en) * | 2016-10-31 | 2018-05-03 | Commscope Italy S.R.L. | Low-loss microstrip printed circuit board filtering devices |
| US20180182719A1 (en) * | 2016-12-28 | 2018-06-28 | Renesas Electronics Corporation | Semiconductor device |
| CN109037867A (en) * | 2018-08-23 | 2018-12-18 | 电子科技大学 | The patch filter structure of suspended substrate stripline is integrated based on medium |
| CN110311196A (en) * | 2019-06-18 | 2019-10-08 | 天津大学 | The 5G double-passband filter of suspended substrate stripline is integrated based on medium |
| US10658723B1 (en) * | 2019-06-25 | 2020-05-19 | United States Of America As Represented By Secretary Of The Navy | Integrated high pass filter for microwave system in package |
| US20210051798A1 (en) * | 2019-08-16 | 2021-02-18 | Samsung Electronics Co., Ltd. | Apparatus and printed circuit board including pcb embedded filter having via group patterns |
| CN112563704A (en) * | 2019-09-25 | 2021-03-26 | 天津大学 | Self-packaged wide-stop-band-pass filter based on medium integrated suspension line |
| CN112993498A (en) * | 2021-02-10 | 2021-06-18 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | Suspension strip line ultra-wideband adjustable zero-point band-pass filter |
| CN214013134U (en) * | 2021-01-19 | 2021-08-20 | 普联技术有限公司 | Microstrip low-pass filter |
| CN214626934U (en) * | 2021-03-15 | 2021-11-05 | 南宁国人射频通信有限公司 | Suspension line low pass filter |
| CN113991269A (en) * | 2021-09-18 | 2022-01-28 | 天津大学 | Miniaturized high-harmonic-suppression dual-passband filter based on dielectric integrated suspension line |
| CN216648560U (en) * | 2021-12-24 | 2022-05-31 | 航天科工通信技术研究院有限责任公司 | Low-pass filter for Ku-band miniaturized low-noise amplifier |
-
2022
- 2022-06-07 CN CN202210635981.1A patent/CN114867200B/en active Active
Patent Citations (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4577171A (en) * | 1983-05-11 | 1986-03-18 | Telefunken Electronic Gmbh | Input circuit comprising at least two input paths |
| WO1996022671A1 (en) * | 1995-01-20 | 1996-07-25 | Minnesota Mining And Manufacturing Company | Electronic circuit structure |
| JPH10276006A (en) * | 1997-02-06 | 1998-10-13 | Hyundai Electron Ind Co Ltd | Low-pass filter for ultra high frequency |
| US20050206482A1 (en) * | 2004-03-17 | 2005-09-22 | Dutoit Nicolaas | Electronically tunable switched-resonator filter bank |
| US8607445B1 (en) * | 2005-01-10 | 2013-12-17 | Endicott Interconnect Technologies, Inc. | Substrate having internal capacitor and method of making same |
| US20140062620A1 (en) * | 2011-05-20 | 2014-03-06 | Trilithic, Inc. | Voltage tunable filters |
| WO2018076950A1 (en) * | 2016-10-31 | 2018-05-03 | Commscope Italy S.R.L. | Low-loss microstrip printed circuit board filtering devices |
| US20180182719A1 (en) * | 2016-12-28 | 2018-06-28 | Renesas Electronics Corporation | Semiconductor device |
| CN109037867A (en) * | 2018-08-23 | 2018-12-18 | 电子科技大学 | The patch filter structure of suspended substrate stripline is integrated based on medium |
| CN110311196A (en) * | 2019-06-18 | 2019-10-08 | 天津大学 | The 5G double-passband filter of suspended substrate stripline is integrated based on medium |
| US10658723B1 (en) * | 2019-06-25 | 2020-05-19 | United States Of America As Represented By Secretary Of The Navy | Integrated high pass filter for microwave system in package |
| US20210051798A1 (en) * | 2019-08-16 | 2021-02-18 | Samsung Electronics Co., Ltd. | Apparatus and printed circuit board including pcb embedded filter having via group patterns |
| CN112563704A (en) * | 2019-09-25 | 2021-03-26 | 天津大学 | Self-packaged wide-stop-band-pass filter based on medium integrated suspension line |
| CN214013134U (en) * | 2021-01-19 | 2021-08-20 | 普联技术有限公司 | Microstrip low-pass filter |
| CN112993498A (en) * | 2021-02-10 | 2021-06-18 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | Suspension strip line ultra-wideband adjustable zero-point band-pass filter |
| CN214626934U (en) * | 2021-03-15 | 2021-11-05 | 南宁国人射频通信有限公司 | Suspension line low pass filter |
| CN113991269A (en) * | 2021-09-18 | 2022-01-28 | 天津大学 | Miniaturized high-harmonic-suppression dual-passband filter based on dielectric integrated suspension line |
| CN216648560U (en) * | 2021-12-24 | 2022-05-31 | 航天科工通信技术研究院有限责任公司 | Low-pass filter for Ku-band miniaturized low-noise amplifier |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114867200B (en) | 2024-05-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103956985A (en) | Band-pass filter with multi-layer structure | |
| US20050200436A1 (en) | Compact multilayer band-pass filter and method using interdigital capacitor | |
| CN104393853A (en) | Multilayer band-pass filter of novel resonance structure | |
| CN110875722B (en) | High frequency amplifier | |
| CN113922027A (en) | High-suppression dielectric filter | |
| CN114867200A (en) | Suspension strip line filter and micro-assembly circuit integrated module | |
| EP4246807A1 (en) | Band-pass filtering circuit and multiplexer | |
| CN216390937U (en) | WIFI6E band-pass filter, related equipment and chip | |
| CN114374369A (en) | Low temperature co-fired ceramic (LTCC) process-based duplexer with low-frequency transmission zero point | |
| CN112563696B (en) | Low-frequency dielectric filter and method for manufacturing same | |
| EP1076374A2 (en) | Nonreciprocal circuit device, composite electronic component, and communication apparatus incorporating the same | |
| CN111865252B (en) | High-suppression high-pass filter | |
| CN109755706B (en) | High out-of-band rejection electromagnetic shunt coupling filter | |
| CN216873167U (en) | Low-pass and band-pass duplexer based on LTCC process | |
| CN216873170U (en) | High-performance duplexer based on LTCC technology | |
| CN111555729A (en) | Novel band-pass filter | |
| CN216872227U (en) | High out-of-band rejection duplexer | |
| CN112002970A (en) | Miniaturized millimeter wave on-chip band-pass filter | |
| CN113922016A (en) | Filter and communication equipment | |
| CN111276776A (en) | Novel band-pass filter based on LTCC | |
| CN219181492U (en) | LTCC high-pass filter | |
| CN113422182B (en) | Adjustable low-pass filter based on impedance tuning | |
| CN117176100B (en) | Band-pass filter circuit and filter for improving in-band flatness | |
| CN117748073B (en) | Miniaturized millimeter wave ultra-wideband equalization filter circuit and adjusting method | |
| CN215266622U (en) | Amplitude equalizer in microwave signal transmission |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |