CN114865274A - Integrated dual-frequency dielectric resonator antenna module and electronic equipment - Google Patents
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Abstract
本发明公开了一种一体化双频介质谐振器天线模组及电子设备,包括介质基板和至少一个的天线单元,所述天线单元包括介质谐振器和第一连接部,所述介质谐振器包括大小不同的第一介质谐振器和第二介质谐振器,所述第一介质谐振器和第二介质谐振器通过所述第一连接部连接,所述第一介质谐振器和第二介质谐振器之间存在间隔;所述介质基板插入各天线单元的第一介质谐振器和第二介质谐振器之间的间隔中,且与各天线单元的第一介质谐振器和第二介质谐振器抵接;各天线单元中的介质谐振器依次相连且一体成型设置。本发明可实现单体双频,且便于介质谐振器的安装。
The invention discloses an integrated dual-frequency dielectric resonator antenna module and electronic equipment, comprising a dielectric substrate and at least one antenna unit, wherein the antenna unit includes a dielectric resonator and a first connecting part, and the dielectric resonator includes a first dielectric resonator and a second dielectric resonator of different sizes, the first dielectric resonator and the second dielectric resonator are connected by the first connection part, the first dielectric resonator and the second dielectric resonator There is a space therebetween; the dielectric substrate is inserted into the space between the first dielectric resonator and the second dielectric resonator of each antenna unit, and abuts against the first dielectric resonator and the second dielectric resonator of each antenna unit ; The dielectric resonators in each antenna unit are connected in sequence and integrally formed. The invention can realize single dual frequency, and is convenient for the installation of the dielectric resonator.
Description
技术领域technical field
本发明涉及无线通信技术领域,尤其涉及一种一体化双频介质谐振器天线模组及电子设备。The invention relates to the technical field of wireless communication, in particular to an integrated dual-frequency dielectric resonator antenna module and electronic equipment.
背景技术Background technique
根据3GPP TS38.101-2 5G终端射频技术规范和TR38.817终端射频技术报告可知,5GmmWave频段有n257(26.5-29.5GHz)、n258(24.25-27.25GHz)、n260(37-40GHz)、n261(27.5-28.35GHz)以及新增的n259(39.5-43GHz)。显然,在5G毫米波移动终端通信中,可以用多组天线来实现覆盖上述频段,但是其必将减小终端空间,那么用单天线实现双频甚至多频特性,将简化集成天线的结构和设计流程。According to 3GPP TS38.101-2 5G terminal radio frequency technical specification and TR38.817 terminal radio frequency technical report, 5G mmWave frequency bands include n257 (26.5-29.5GHz), n258 (24.25-27.25GHz), n260 (37-40GHz), n261 ( 27.5-28.35GHz) and the newly added n259 (39.5-43GHz). Obviously, in 5G millimeter-wave mobile terminal communication, multiple sets of antennas can be used to cover the above frequency bands, but it will definitely reduce the terminal space, so using a single antenna to achieve dual-frequency or even multi-frequency characteristics will simplify the structure of the integrated antenna and Design Flow.
一般而言,多频微带贴片天线是多数设计者首选,因为其具有结构简单、原理清晰以及性能可接受等优点。但是其需要复杂的介质基板叠层结构,并具有非一体式的双频实现方式等缺点,给目前5G毫米波双频天线的应用提出了挑战。Generally speaking, the multi-frequency microstrip patch antenna is the first choice of most designers because of its simple structure, clear principle and acceptable performance. However, it requires a complex laminated structure of dielectric substrates and has disadvantages such as a non-integrated dual-band implementation, which poses challenges to the current application of 5G millimeter-wave dual-band antennas.
一般设计的5G终端毫米波天线是1×4单元,所以使用安装时需要4个分立式的介质谐振器,那么粘接固定时也需要4次,这种设计方式造成的天线性能仿真与实际误差较大。The generally designed 5G terminal millimeter wave antenna is 1 × 4 units, so 4 discrete dielectric resonators are required for installation, and 4 times are required for bonding and fixing. The simulation and actual performance of the antenna caused by this design method The error is large.
发明内容SUMMARY OF THE INVENTION
本发明所要解决的技术问题是:提供一种一体化双频介质谐振器天线模组及电子设备,可实现单体双频,且便于介质谐振器的安装。The technical problem to be solved by the present invention is to provide an integrated dual-frequency dielectric resonator antenna module and electronic equipment, which can realize single dual-frequency and facilitate the installation of the dielectric resonator.
为了解决上述技术问题,本发明采用的技术方案为:一种一体化双频介质谐振器天线模组,包括介质基板和至少一个的天线单元,所述天线单元包括介质谐振器和第一连接部,所述介质谐振器包括大小不同的第一介质谐振器和第二介质谐振器,所述第一介质谐振器和第二介质谐振器通过所述第一连接部连接,所述第一介质谐振器和第二介质谐振器之间存在间隔;所述介质基板插入各天线单元的第一介质谐振器和第二介质谐振器之间的间隔中,且与各天线单元的第一介质谐振器和第二介质谐振器抵接;各天线单元中的介质谐振器依次相连且一体成型设置;所述第一介质谐振器的尺寸为3mm×3mm×0.85mm,所述第二介质谐振器的尺寸为2.5mm×2.5mm×0.6mm;所述第一介质谐振器和第二介质谐振器的介电常数为21。In order to solve the above technical problems, the technical solution adopted in the present invention is: an integrated dual-frequency dielectric resonator antenna module, comprising a dielectric substrate and at least one antenna unit, the antenna unit comprising a dielectric resonator and a first connection part , the dielectric resonator includes a first dielectric resonator and a second dielectric resonator with different sizes, the first dielectric resonator and the second dielectric resonator are connected by the first connection part, and the first dielectric resonator There is a gap between the first dielectric resonator and the second dielectric resonator of each antenna unit; the dielectric substrate is inserted into the gap between the first dielectric resonator and the second dielectric resonator of each antenna unit, and is connected to the first dielectric resonator and the second dielectric resonator of each antenna unit. The second dielectric resonator is in contact; the dielectric resonators in each antenna unit are connected in sequence and integrally formed; the size of the first dielectric resonator is 3mm×3mm×0.85mm, and the size of the second dielectric resonator is 2.5mm×2.5mm×0.6mm; the dielectric constant of the first dielectric resonator and the second dielectric resonator is 21.
本发明还提出一种电子设备,包括如上所述的一体化双频介质谐振器天线模组。The present invention also provides an electronic device, comprising the above-mentioned integrated dual-frequency dielectric resonator antenna module.
本发明的有益效果在于:通过将各天线单元中的介质谐振器一体化设置,可以减少安装时的安装次数,从而减少安装时的不确定因素,方便量产;通过将介质基板设置于第一介质谐振器和第二介质谐振器之间的间隔中,使得介质谐振器可通过自身结构与介质基板进行对位安装,可无需通过胶层粘接或焊接的方式将介质谐振器固定在介质基板上,可进一步提高安装的便利性;通过优化介质谐振器的尺寸和介电常数,可覆盖5G毫米波中的28GHz和39GHz频段。本发明可以实现单体双频,减少设计复杂程度,且便于介质谐振器的安装,可以大幅度减少安装产生的误差。The beneficial effects of the present invention are: by integrating the dielectric resonators in each antenna unit, the number of installations during installation can be reduced, thereby reducing uncertain factors during installation, and facilitating mass production; by arranging the dielectric substrate on the first In the space between the dielectric resonator and the second dielectric resonator, the dielectric resonator can be installed in alignment with the dielectric substrate through its own structure, and the dielectric resonator can be fixed on the dielectric substrate without adhesive layer bonding or welding. It can further improve the convenience of installation; by optimizing the size and dielectric constant of the dielectric resonator, it can cover the 28GHz and 39GHz frequency bands in the 5G millimeter wave. The present invention can realize single dual frequency, reduce the complexity of design, facilitate the installation of the dielectric resonator, and can greatly reduce the error caused by the installation.
附图说明Description of drawings
图1为本发明实施例一的一体化双频介质谐振器天线模组的侧面示意图;1 is a schematic side view of an integrated dual-frequency dielectric resonator antenna module according to
图2为本发明实施例一的各天线单元的介质谐振器和第一连接部的结构示意图;2 is a schematic structural diagram of a dielectric resonator and a first connection part of each antenna unit according to
图3为本发明实施例一的一体化双频介质谐振器天线模组的结构示意图;3 is a schematic structural diagram of an integrated dual-frequency dielectric resonator antenna module according to
图4为本发明实施例一的各天线单元的介质谐振器和第一连接部的侧面示意图;4 is a schematic side view of a dielectric resonator and a first connection part of each antenna unit according to
图5为本发明实施例一的一体化双频介质谐振器天线模组的俯视示意图;5 is a schematic top view of the integrated dual-frequency dielectric resonator antenna module according to
图6为本发明实施例一的一体化双频介质谐振器天线模组的仰视示意图;6 is a schematic bottom view of the integrated dual-frequency dielectric resonator antenna module according to
图7为本发明实施例一的天线模组的S参数示意图;7 is a schematic diagram of S parameters of the antenna module according to
图8为本发明实施例一的天线模组放入手机时的示意图。FIG. 8 is a schematic diagram of the antenna module according to
标号说明:Label description:
1、介质基板;2、天线单元;3、第二连接部;4、金属涂层;1. Dielectric substrate; 2. Antenna unit; 3. Second connecting part; 4. Metal coating;
11、第一金属层;12、第一介质层;13、第二介质层;14、天线地层;15、第三介质层;16、第四介质层;17、第二金属层;18、第一过孔;19、第二过孔;11, first metal layer; 12, first dielectric layer; 13, second dielectric layer; 14, antenna ground layer; 15, third dielectric layer; 16, fourth dielectric layer; 17, second metal layer; 18, first A via hole; 19. A second via hole;
111、第一馈电缝隙;112、第一信号输入口;111. A first feeding slot; 112. A first signal input port;
171、第二馈电缝隙;172、第二信号输入口;171, the second feeding slot; 172, the second signal input port;
21、第一介质谐振器;22、第二介质谐振器;23、第一连接部;24、第一微带馈电线;25、第二微带馈电线。21, the first dielectric resonator; 22, the second dielectric resonator; 23, the first connection part; 24, the first microstrip feed line; 25, the second microstrip feed line.
具体实施方式Detailed ways
为详细说明本发明的技术内容、所实现目的及效果,以下结合实施方式并配合附图详予说明。In order to describe in detail the technical content, achieved objects and effects of the present invention, detailed descriptions are given below with reference to the embodiments and the accompanying drawings.
请参阅图1,一种一体化双频介质谐振器天线模组,包括介质基板和至少一个的天线单元,所述天线单元包括介质谐振器和第一连接部,所述介质谐振器包括大小不同的第一介质谐振器和第二介质谐振器,所述第一介质谐振器和第二介质谐振器通过所述第一连接部连接,所述第一介质谐振器和第二介质谐振器之间存在间隔;所述介质基板插入各天线单元的第一介质谐振器和第二介质谐振器之间的间隔中,且与各天线单元的第一介质谐振器和第二介质谐振器抵接;各天线单元中的介质谐振器依次相连且一体成型设置;所述第一介质谐振器的尺寸为3mm×3mm×0.85mm,所述第二介质谐振器的尺寸为2.5mm×2.5mm×0.6mm;所述第一介质谐振器和第二介质谐振器的介电常数为21。Referring to FIG. 1, an integrated dual-frequency dielectric resonator antenna module includes a dielectric substrate and at least one antenna unit, the antenna unit includes a dielectric resonator and a first connecting portion, and the dielectric resonator includes different sizes the first dielectric resonator and the second dielectric resonator, the first dielectric resonator and the second dielectric resonator are connected through the first connection part, and the first dielectric resonator and the second dielectric resonator are connected between There is a gap; the dielectric substrate is inserted into the gap between the first dielectric resonator and the second dielectric resonator of each antenna unit, and is in contact with the first dielectric resonator and the second dielectric resonator of each antenna unit; each The dielectric resonators in the antenna unit are connected in sequence and integrally formed; the size of the first dielectric resonator is 3mm×3mm×0.85mm, and the size of the second dielectric resonator is 2.5mm×2.5mm×0.6mm; The dielectric constant of the first dielectric resonator and the second dielectric resonator is 21.
从上述描述可知,本发明的有益效果在于:可实现单体双频,且便于介质谐振器的安装。It can be seen from the above description that the beneficial effects of the present invention are that a single dual frequency can be realized, and the installation of the dielectric resonator is convenient.
进一步地,所述天线单元的数量为四个;还包括三个第二连接部,所述四个天线单元线性排列,且通过所述三个第二连接部依次相连;所述第二连接部的两端分别连接相邻的两个天线单元的第一介质谐振器或第二介质谐振器。Further, the number of the antenna units is four; it also includes three second connection parts, the four antenna units are linearly arranged and connected in sequence through the three second connection parts; the second connection parts The two ends of the antenna are respectively connected to the first dielectric resonator or the second dielectric resonator of two adjacent antenna units.
由上述描述可知,通过设置第二连接部连接各天线单元的介质谐振器,实现各天线单元的介质谐振器的一体化。As can be seen from the above description, the integration of the dielectric resonators of each antenna unit is realized by providing the second connection portion to connect the dielectric resonators of each antenna unit.
进一步地,所述第二连接部上涂覆有金属涂层。Further, the second connecting portion is coated with a metal coating.
由上述描述可知,可去除不同天线单元的介质谐振器之间的耦合。As can be seen from the above description, the coupling between the dielectric resonators of different antenna elements can be removed.
进一步地,所述第一介质谐振器和第二介质谐振器的形状均为长方体,所述第一连接部呈U形,所述第一连接部的一端与所述第一介质谐振器的侧面连接,所述第一连接部的另一端与所述第二介质谐振器的侧面连接。Further, the shapes of the first dielectric resonator and the second dielectric resonator are both rectangular parallelepipeds, the first connecting portion is U-shaped, and one end of the first connecting portion is connected to the side surface of the first dielectric resonator. connected, and the other end of the first connection part is connected to the side surface of the second dielectric resonator.
由上述描述可知,使得第一介质谐振器、第二介质谐振器和第一连接部可围合形成与介质基板适配的形状,便于介质基板插入第一介质谐振器和第二介质谐振器之间的间隔中。It can be seen from the above description that the first dielectric resonator, the second dielectric resonator and the first connecting portion can be enclosed to form a shape suitable for the dielectric substrate, so that the dielectric substrate can be easily inserted between the first dielectric resonator and the second dielectric resonator. in the interval.
进一步地,所述第一连接部的数量为两个,两个第一连接部的一端分别与所述第一介质谐振器相对的两个侧面连接,两个第一连接部的另一端分别与所述第二介质谐振器相对的两个侧面连接。Further, the number of the first connection parts is two, one end of the two first connection parts is respectively connected to the two opposite sides of the first dielectric resonator, and the other ends of the two first connection parts are respectively connected to the two sides of the first dielectric resonator. Two opposite sides of the second dielectric resonator are connected.
由上述描述可知,使得第一介质谐振器、第二介质谐振器和第一连接部可围合形成封闭的方环形,避免插入其中空区域的介质基板从侧面滑出。As can be seen from the above description, the first dielectric resonator, the second dielectric resonator and the first connecting portion can be enclosed to form a closed square ring, preventing the dielectric substrate inserted into the hollow region from sliding out from the side.
进一步地,所述第一连接部上涂覆有金属涂层。Further, the first connecting portion is coated with a metal coating.
由上述描述可知,可去除第一介质谐振器和第二介质谐振器之间的耦合。As can be seen from the above description, the coupling between the first dielectric resonator and the second dielectric resonator can be removed.
进一步地,所述介质基板包括依次层叠的第一金属层、第一介质层、第二介质层、天线地层、第三介质层、第四介质层和第二金属层,所述第一金属层设有与各天线单元一一对应的第一馈电缝隙和第一信号输入口,所述第二金属层上设有与各天线单元一一对应的第二馈电缝隙和第二信号输入口;所述第一介质层中设有与各第一信号输入口一一对应且贯穿所述第一介质层的第一过孔,所述第四介质层中设有与各第二信号输入口一一对应且贯穿所述第四介质层的第二过孔;所述第一介质谐振器与所述第一金属层抵接,且覆盖所述第一馈电缝隙;所述第二介质谐振器与所述第二金属层抵接,且覆盖所述第二馈电缝隙;Further, the dielectric substrate includes a first metal layer, a first dielectric layer, a second dielectric layer, an antenna ground layer, a third dielectric layer, a fourth dielectric layer and a second metal layer stacked in sequence, and the first metal layer A first feeding slot and a first signal input port corresponding to each antenna unit are provided, and a second feeding slot and a second signal input port corresponding to each antenna unit are provided on the second metal layer. ; The first dielectric layer is provided with a first via hole corresponding to each first signal input port and passing through the first dielectric layer, and the fourth dielectric layer is provided with each second signal input port One-to-one correspondence with the second via holes passing through the fourth dielectric layer; the first dielectric resonator abuts the first metal layer and covers the first feeding slot; the second dielectric resonates the device is in contact with the second metal layer and covers the second feeding slot;
所述天线单元还包括第一微带馈电线和第二微带馈电线,所述第一微带馈电线设置于所述第一介质层和第二介质层之间,所述第一微带馈电线的一端通过所述第一过孔与所述第一信号输入口连接,所述第一微带馈电线的另一端与所述第一馈电缝隙耦合;所述第二微带馈电线设置于所述第三介质层和第四介质层之间,所述第二微带馈电线的一端通过所述第二过孔与所述第二信号输入口连接,所述第二微带馈电线的另一端与所述第二馈电缝隙耦合。The antenna unit further includes a first microstrip feed line and a second microstrip feed line, the first microstrip feed line is arranged between the first dielectric layer and the second dielectric layer, the first microstrip feed line is One end of the feed line is connected to the first signal input port through the first via hole, and the other end of the first microstrip feed line is coupled with the first feed slot; the second microstrip feed line It is arranged between the third dielectric layer and the fourth dielectric layer, one end of the second microstrip feed line is connected to the second signal input port through the second via hole, and the second microstrip feed line is connected to the second signal input port. The other end of the wire is coupled with the second feeding slot.
进一步地,所述第一微带馈电线在所述第一金属层上的投影与所述第一馈电缝隙垂直相交;所述第二微带馈电线在所述第二金属层上的投影与所述第二馈电缝隙垂直相交。Further, the projection of the first microstrip feed line on the first metal layer vertically intersects with the first feed slot; the projection of the second microstrip feed line on the second metal layer perpendicularly intersect with the second feeding slot.
由上述描述可知,介质谐振器通过缝隙耦合的方式进行馈电。It can be seen from the above description that the dielectric resonator is fed by means of slot coupling.
进一步地,还包括第一射频芯片和第二射频芯片,所述第一射频芯片设置于所述第一金属层远离第一介质层的一面上,且分别与各第一信号输入口导通;所述第二射频芯片设置于所述第二金属层远离第四介质层的一面上,且分别与各第二信号输入口导通。Further, it also includes a first radio frequency chip and a second radio frequency chip, the first radio frequency chip is disposed on the side of the first metal layer away from the first dielectric layer, and is respectively connected to each first signal input port; The second radio frequency chip is disposed on the side of the second metal layer away from the fourth dielectric layer, and is connected to each of the second signal input ports respectively.
由上述描述可知,射频芯片用于为天线提供信号,第一介质谐振器和第二介质谐振器分别由不同的射频芯片提供信号。It can be seen from the above description that the radio frequency chip is used to provide signals for the antenna, and the first dielectric resonator and the second dielectric resonator are respectively provided with signals by different radio frequency chips.
本发明还提出一种电子设备,包括如上所述的一体化双频介质谐振器天线模组。The present invention also provides an electronic device, comprising the above-mentioned integrated dual-frequency dielectric resonator antenna module.
实施例一Example 1
请参照图1-8,本发明的实施例一为:一体化双频介质谐振器天线模组,可应用于5G毫米波移动端或者毫米波小基站。Referring to FIGS. 1-8 , the first embodiment of the present invention is an integrated dual-band dielectric resonator antenna module, which can be applied to a 5G millimeter-wave mobile terminal or a millimeter-wave small base station.
如图1所示,包括介质基板1和至少一个的天线单元2,本实施例中以包括四个天线单元2为例进行说明,四个天线单元2线性排列。As shown in FIG. 1 , a
结合图2所示,每个天线单元2均包括介质谐振器和第一连接部23,其中,介质谐振器包括大小不同的第一介质谐振器21和第二介质谐振器22,本实施例中,第一介质谐振器21的大小大于第二介质谐振器22的大小;第一介质谐振器21和第二介质谐振器22通过第一连接部23连接,第一介质谐振器21和第二介质谐振器22之间存在间隔。With reference to FIG. 2 , each
各天线单元2中的介质谐振器依次相连且一体成型设置;具体地,还包括第二连接部3,第二连接部3用于连接相邻的两个天线单元2的介质谐振器。由于本实施例的天线单元2的数量为四个,因此第二连接部3的数量为三个,四个天线单元2通过三个第二连接部3依次相连。其中,第二连接部3的两端分别连接相邻的两个天线单元2的第一介质谐振器21或第二介质谐振器22。本实施例中,第二连接部3的两端分别连接相邻的两个天线单元2的第一介质谐振器21。The dielectric resonators in each
结合图3所示,介质基板1插入各天线单元2的第一介质谐振器21和第二介质谐振器22之间的间隔中,且与各天线单元2的第一介质谐振器21和第二介质谐振器22抵接。Referring to FIG. 3 , the
本实施例中,第一介质谐振器21和第二介质谐振器22的形状均为长方体,第一连接部23呈U形。第一连接部23的数量为两个,两个第一连接部23的一端分别与第一介质谐振器21相对的两个侧面连接,两个第一连接部23的另一端分别与第二介质谐振器22相对的两个侧面连接,使得第一介质谐振器21、第二介质谐振器22和两个第一连接部23从侧面看可围合成封闭的方环形,如图4所示,介质基板1即位于该方环形的中空区域。优选地,介质基板的厚度与第一介质谐振器和第二介质谐振器之间的距离相同,介质基板的宽度与两个第一连接部(U形的)底边之间的距离相同,使得介质基板可刚好嵌入该方环形的中空区域。In this embodiment, the shapes of the first
进一步地,如图1所示,第一连接部23上涂覆有金属涂层4,如涂覆铜层,以去除第一介质谐振21和第二介质谐振器22之间的耦合。第二连接部3上也涂覆有金属涂层4,以去除不同天线单元2的介质谐振器之间的耦合。Further, as shown in FIG. 1 , the
本实施例中,第一介质谐振器21的尺寸为3mm×3mm×0.85mm,第二介质谐振器22的尺寸为2.5mm×2.5mm×0.6mm;第一介质谐振器21和第二介质谐振器22的介电常数为21。通过优化第一介质谐振器和第二介质谐振器的尺寸,使第一介质谐振器和第二介质谐振器分别激发出5G毫米波中的28GHz和39GHz频段。In this embodiment, the size of the first
如图1所示,介质基板1包括依次层叠的第一金属层11、第一介质层12、第二介质层13、天线地层14、第三介质层15、第四介质层16和第二金属层17,各天线单元2的第一介质谐振器21与第一金属层11抵接,各天线单元2的第二介质谐振器22与第二金属层17抵接。As shown in FIG. 1 , the
如图5所示,第一金属层11设有与各天线单元一一对应的第一馈电缝隙111和第一信号输入口112;各天线单元的第一介质谐振器21分别覆盖对应同一天线单元的第一馈电缝隙111。如图6所示,第二金属层17上设有与各天线单元一一对应的第二馈电缝隙171和第二信号输入口172;各天线单元的第二介质谐振器22分别覆盖对应同一天线单元的第二馈电缝隙171。As shown in FIG. 5 , the
如图1所示,第一介质层12中设有与各第一信号输入口一一对应且贯穿第一介质层12的第一过孔18,第四介质层16中设有与各第二信号输入口一一对应且贯穿第四介质层的第二过孔19。As shown in FIG. 1 , the first dielectric layer 12 is provided with a first via
结合图5-6所示,天线单元2还包括第一微带馈电线24和第二微带馈电线25,第一微带馈电线24设置于第一介质层12和第二介质层13之间,第一微带馈电线24的一端通过第一过孔18与第一信号输入口112连接,另一端与第一馈电缝隙耦合;第二微带馈电线25设置于第三介质层15和第四介质层16之间,第二微带馈电线25的一端通过第二过孔19与第二信号输入口172连接,所述第二微带馈电线25的另一端与所述第二馈电缝隙171耦合。5-6, the
进一步地,如图5所示,第一微带馈电线24在第一金属层11上的投影与第一馈电缝隙111垂直相交。如图6所示,第二微带馈电线25在第二金属层17上的投影与第二馈电缝隙171垂直相交。Further, as shown in FIG. 5 , the projection of the first
本实施例中,对应同一天线单元的第一馈电缝隙和第二馈电缝隙的形状和尺寸相同且位置对应,即第一馈电缝隙在第二金属层上的投影与第二馈电缝隙重合。同理,对应同一天线单元的第一微带馈电线和第二微带馈电线的形状和尺寸相同且位置对应。In this embodiment, the shape and size of the first feeding slot and the second feeding slot corresponding to the same antenna unit are the same and the positions are corresponding, that is, the projection of the first feeding slot on the second metal layer is the same as the second feeding slot. coincide. Similarly, the shape and size of the first microstrip feed line and the second microstrip feed line corresponding to the same antenna unit are the same and the positions are corresponding.
进一步地,还包括第一射频芯片(图中未示出)和第二射频芯片(图中未示出),第一射频芯片设置于第一金属层11远离第一介质层12的一面上,且分别与各第一信号输入口121导通;第二射频芯片设置于第二金属层17远离第四介质层16的一面上,且分别与各第二信号输入口172导通。Further, it also includes a first radio frequency chip (not shown in the figure) and a second radio frequency chip (not shown in the figure), and the first radio frequency chip is disposed on the side of the
其中,两个射频芯片分别用于为天线提供两个频段(28GHz和39GHz频段)的信号。射频芯片中包含的移相器和放大器等原件,移相器用于为天线单元间提供相位差以实现波束扫描的能力,放大器用于补偿移相器的损耗。Among them, the two radio frequency chips are respectively used to provide signals of two frequency bands (28GHz and 39GHz frequency bands) for the antenna. The phase shifter and amplifier included in the RF chip are used to provide the phase difference between the antenna units to achieve the ability of beam scanning, and the amplifier is used to compensate the loss of the phase shifter.
图7为本实施例的天线模组的S参数示意图,从图中可以看出,该天线模组覆盖了28GHz和39GHz双频段。FIG. 7 is a schematic diagram of the S-parameters of the antenna module of the present embodiment. It can be seen from the figure that the antenna module covers dual frequency bands of 28 GHz and 39 GHz.
图8为本实施例的天线模组安装至移动设备(如手机)时的示意图,其中,工作频段为28GHz的DRA(介质谐振器天线)负责屏幕前方空间覆盖,工作频段为39GHz的DRA负责背壳后方空间覆盖。进一步地,当两个本实施例的天线模组一正一反地放置在移动设备中,将会实现整个空间双频段的覆盖。8 is a schematic diagram of the antenna module of the present embodiment when installed on a mobile device (such as a mobile phone), wherein the DRA (dielectric resonator antenna) with a working frequency band of 28 GHz is responsible for the space coverage in front of the screen, and the DRA with a working frequency band of 39 GHz is responsible for the back space. The space behind the shell is covered. Further, when the two antenna modules of this embodiment are placed in the mobile device one by one and the other opposite, the coverage of the entire space with dual frequency bands will be achieved.
本实施例可以实现单体双频,减少设计复杂程度,且一体化的设计可以大幅度减少安装对位产生的误差,提高介质谐振器安装的便利性。This embodiment can realize single dual frequency, reduce the complexity of design, and the integrated design can greatly reduce the error caused by installation and alignment, and improve the convenience of installation of the dielectric resonator.
综上所述,本发明提供的一体化双频介质谐振器天线模组及电子设备,通过将各天线单元中的介质谐振器一体化设置,可以减少安装时的安装次数,从而减少安装时的不确定因素,方便量产;通过将介质基板设置于第一介质谐振器和第二介质谐振器之间的间隔中,使得介质谐振器可通过自身结构与介质基板进行对位安装,可无需通过胶层粘接或焊接的方式将介质谐振器固定在介质基板上,可进一步提高安装的便利性;通过优化介质谐振器的尺寸,可覆盖5G毫米波中的28GHz和39GHz频段。本发明可以实现单体双频,减少设计复杂程度,且便于介质谐振器的安装,可以大幅度减少安装产生的误差。To sum up, the integrated dual-frequency dielectric resonator antenna module and electronic equipment provided by the present invention can reduce the number of installations during installation by integrating the dielectric resonators in each antenna unit, thereby reducing the number of times during installation. Uncertain factors, convenient for mass production; by arranging the dielectric substrate in the interval between the first dielectric resonator and the second dielectric resonator, the dielectric resonator can be installed in alignment with the dielectric substrate through its own structure, without the need to pass The dielectric resonator is fixed on the dielectric substrate by adhesive layer bonding or welding, which can further improve the convenience of installation; by optimizing the size of the dielectric resonator, it can cover the 28GHz and 39GHz frequency bands in the 5G millimeter wave. The present invention can realize single dual frequency, reduce the complexity of design, facilitate the installation of the dielectric resonator, and can greatly reduce the error caused by the installation.
以上所述仅为本发明的实施例,并非因此限制本发明的专利范围,凡是利用本发明说明书及附图内容所作的等同变换,或直接或间接运用在相关的技术领域,均同理包括在本发明的专利保护范围内。The above descriptions are only examples of the present invention, and are not intended to limit the scope of the present invention. Any equivalent transformations made by using the contents of the description and drawings of the present invention, or directly or indirectly applied in related technical fields, are similarly included in the within the scope of patent protection of the present invention.
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