CN114864797A - Light-emitting panel and display device - Google Patents
Light-emitting panel and display device Download PDFInfo
- Publication number
- CN114864797A CN114864797A CN202210481289.8A CN202210481289A CN114864797A CN 114864797 A CN114864797 A CN 114864797A CN 202210481289 A CN202210481289 A CN 202210481289A CN 114864797 A CN114864797 A CN 114864797A
- Authority
- CN
- China
- Prior art keywords
- light
- light source
- transparent substrate
- emitting panel
- light emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 160
- 239000010410 layer Substances 0.000 claims description 106
- 238000009792 diffusion process Methods 0.000 claims description 42
- 239000002245 particle Substances 0.000 claims description 19
- 239000000463 material Substances 0.000 claims description 12
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 10
- 229910052709 silver Inorganic materials 0.000 claims description 10
- 239000004332 silver Substances 0.000 claims description 10
- 238000006243 chemical reaction Methods 0.000 claims description 9
- 239000002096 quantum dot Substances 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 239000012945 sealing adhesive Substances 0.000 claims 1
- 230000009286 beneficial effect Effects 0.000 description 13
- 229910000679 solder Inorganic materials 0.000 description 12
- 230000000694 effects Effects 0.000 description 10
- 238000000034 method Methods 0.000 description 10
- 239000000565 sealant Substances 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 238000007747 plating Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 7
- 238000002310 reflectometry Methods 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 6
- 239000012790 adhesive layer Substances 0.000 description 5
- 230000002829 reductive effect Effects 0.000 description 5
- 230000036961 partial effect Effects 0.000 description 4
- 230000002441 reversible effect Effects 0.000 description 4
- 238000002834 transmittance Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000000889 atomisation Methods 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 241001270131 Agaricus moelleri Species 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 239000000084 colloidal system Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005424 photoluminescence Methods 0.000 description 1
- 238000000103 photoluminescence spectrum Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
- H01L33/46—Reflective coating, e.g. dielectric Bragg reflector
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Planar Illumination Modules (AREA)
Abstract
The invention discloses a light-emitting panel and a display device, belonging to the technical field of display, wherein the light-emitting panel comprises a back plate and a light source substrate, and the light source substrate comprises a transparent substrate and a plurality of light sources positioned on one side of the transparent substrate; the light emitting panel is positioned on one side of the transparent substrate, which faces away from the light sources; the light source substrate and the back plate comprise a reflecting layer between them. The display device comprises the light-emitting panel. The light source substrate is reversely arranged on the back plate, the light emitting brightness of the light emitting panel can be ensured without increasing the driving power consumption, the starry phenomenon easily occurring in the prior art can be improved, the whole light emitting quality of the light emitting panel is favorably improved, and the using satisfaction of a user is improved.
Description
Technical Field
The invention relates to the technical field of display, in particular to a light-emitting panel and a display device.
Background
With the coming of the ultra-high-definition display era, higher requirements are put forward on the specifications of display image quality, resolution and the like, and the LED (Light-Emitting Diode) display technology shows more excellent performance than lcd (liquid Crystal display) and OLED (Organic Light-Emitting Diode), so the Mini LED or Micro LED technology has become a novel display technology with the most application prospect in the display field, and the Mini LED or Micro LED technology can also realize the Local adjustment (Local Dimming) design of direct backlight, achieve the screen effect in a high dynamic range, make the picture finer and finer, provide a high-brightness surface Light source, and improve the brightness of the whole module, thus becoming one of the research hotspots in the display technology field.
The basic structure in the Mini LED or Micro LED technology is that an LED chip is generally punched on a substrate on which signal lines are distributed, protective glue is filled in a spraying or film pressing mode, the LED chip is controlled through a circuit on the substrate, and the effects of surface light sources and local light emitting adjustment are achieved. Since the LED chip side is a light emitting surface, in consideration of the problems of circuit insulation and reflection, a white oil solder resist or white PI (polyimide) is generally used in the prior art to protect and reflect the circuit. However, the conventional solder resist is affected by the low reflectivity of materials such as white oil solder resist and white PI, and the reflectivity is further reduced after reflow soldering, which tends to result in poor optical effects. In the currently adopted scheme, in order to improve the optical effect, more power consumption needs to be used to achieve the required brightness when the light is emitted, so that the waste of power consumption is caused.
Therefore, it is an urgent need to provide a light-emitting panel and a display device capable of reducing power consumption and improving light-emitting brightness.
Disclosure of Invention
In view of the above, the present invention provides a light-emitting panel and a display device to solve the problem that the prior art cannot give good consideration to both the light-emitting brightness and the low power consumption.
The invention discloses a light-emitting panel, comprising: the backlight module comprises a back plate and a light source substrate, wherein the light source substrate comprises a transparent substrate and a plurality of light sources positioned on one side of the transparent substrate; the light emitting panel is positioned on one side of the transparent substrate, which faces away from the light sources; the light source substrate and the back plate comprise a reflecting layer between them.
Based on the same inventive concept, the invention also discloses a display device which comprises the light-emitting panel.
Compared with the prior art, the light-emitting panel and the display device provided by the invention at least realize the following beneficial effects:
the light-emitting panel comprises a back plate and light source substrates, wherein the light sources are positioned on one side of the transparent substrate facing the back plate, so that the light-emitting surfaces of the light sources face the back plate, the light-emitting surface of the light-emitting panel is positioned on one side of the transparent substrate facing away from the light sources, namely the light-emitting surfaces of the light sources and the light-emitting surface of the light-emitting panel are arranged in a reverse mode, a reflecting layer is further arranged between the light source substrates and the back plate, and the reflecting layer can reflect light emitted by the light sources back to the light-emitting surface of the light-emitting panel, so that the light-emitting surface of the light-emitting panel can normally emit light. The light source substrate is arranged on the back plate in a reverse mode, light emitted from the light emitting surface of the light source is reflected back to the surface of the light source substrate, which is far away from the light source side, through the reflecting layer and is emitted to the light emitting surface of the light emitting panel from the transparent substrate. The light source substrate is reversely arranged on the back plate, so that the side, facing the light emitting surface of the light emitting panel, of the light source substrate does not need to be provided with the white oil solder resist and the like which have a protection effect on the wiring structure, the influence of low reflectivity of the white oil solder resist and the like on the light emitting brightness can be avoided, and the light emitting brightness of the light emitting panel can be ensured without increasing the driving power consumption. The light source substrate is reversely arranged on the back plate, so that the light emitting surface of the light source is opposite to the light emitting surface of the light emitting panel, the defect that starry sky easily occurs on one side of the light emitting surface of the light source facing the light emitting surface of the light emitting panel can be avoided, namely, the phenomenon that the brightness of the corresponding position of the light emitting surface of the light source is high, and the brightness between adjacent light sources is low is avoided.
Of course, it is not necessary for any product in which the present invention is practiced to specifically achieve all of the above-described technical effects simultaneously.
Other features of the present invention and advantages thereof will become apparent from the following detailed description of exemplary embodiments thereof, which proceeds with reference to the accompanying drawings.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention.
Fig. 1 is a schematic plan view of a light-emitting panel provided by an embodiment of the invention;
FIG. 2 is a schematic sectional view taken along line A-A' of FIG. 1;
FIG. 3 is a schematic diagram of an optical path when the luminescent panel provided by the present embodiment emits light;
FIG. 4 is a structural diagram illustrating a process of attaching the reflective layer to the light source substrate and assembling the reflective layer with the back plate in FIG. 3;
FIG. 5 is a structural diagram illustrating a process of assembling the light source substrate with the reflective layer of FIG. 3 attached to the back plate;
FIG. 6 is a schematic view of another cross-sectional structure taken along line A-A' of FIG. 1;
FIG. 7 is a schematic diagram of a partial electrical connection structure in a driving circuit layer according to an embodiment of the present invention;
FIG. 8 is an enlarged partial schematic view of FIG. 1;
FIG. 9 is a schematic view of an alternative cross-sectional configuration taken along line A-A' of FIG. 1;
FIG. 10 is a schematic view of an alternative cross-sectional configuration taken along line A-A' of FIG. 1;
FIG. 11 is a schematic view of an alternative cross-sectional configuration taken along line A-A' of FIG. 1;
FIG. 12 is a schematic view of an alternative cross-sectional configuration taken along line A-A' of FIG. 1;
FIG. 13 is a schematic view of an alternative cross-sectional configuration taken along line A-A' of FIG. 1;
FIG. 14 is a schematic view of an alternative cross-sectional configuration taken along line A-A' of FIG. 1;
fig. 15 is a schematic plan view of a display device according to an embodiment of the present invention.
Detailed Description
Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that: the relative arrangement of the components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.
The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.
Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate.
In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.
Referring to fig. 1 and fig. 2 in combination, fig. 1 is a schematic plan view of a light-emitting panel according to an embodiment of the present invention, fig. 2 is a schematic cross-sectional view taken along a direction a-a' in fig. 1, and a light-emitting panel 000 according to an embodiment of the present invention includes: the back plate 10 and the light source substrate 20, the light source substrate 20 includes a transparent substrate 201 and a plurality of light sources 202 located at one side of the transparent substrate 201;
the light sources 202 are positioned on one side of the transparent substrate 201 facing the back plate 10, the light-emitting surface 202E of the light source 202 faces the back plate 10, and the light-emitting surface 000E of the light-emitting panel 000 is positioned on one side of the transparent substrate 201 facing away from the light sources 202;
the light source substrate 20 and the back plate 10 include a reflective layer 30 therebetween.
Specifically, the light emitting panel 000 provided in this embodiment may be a sub-millimeter light emitting diode (Mini LED) or Micro light emitting diode (Micro LED) light emitting panel, and the light emitting panel 000 includes a back plate 10 and a light source substrate 20, optionally, the back plate 10 of this embodiment may be an iron frame structure or other frame structures, further optionally, the light emitting panel 000 may further include a side plate integrated with the back plate 10, and a layout space for accommodating other structures of the light emitting panel 000 is formed by the side plate and the back plate 10. The light source substrate 20 includes a transparent substrate 201 and a plurality of light sources 202 located on one side of the transparent substrate 201, and the transparent substrate 201 may be used as a carrier substrate for the plurality of light sources 202. It is understood that, in this embodiment, the material for manufacturing the transparent substrate 201 is not specifically limited, and may be a glass material with high transparency, or may also be another material such as PI (polyimide) with high transparency, etc. the transparent substrate 201 is not limited in this embodiment, and only the transparent substrate 201 has high transmittance. Optionally, the plurality of light sources 202 may be arranged in an array on the transparent substrate 201, and the plurality of light sources 202 may be light sources 202 with the same color or different colors, or may also be arranged in other ways, which is not limited in this embodiment. Optionally, the transparent substrate 201 may further include other structures, such as a wiring structure (not illustrated in fig. 1 and 2) electrically connected to the light sources 202, for transmitting a driving signal to each light source 202, so that the light source 202 can receive the transmitted driving signal to emit light. Optionally, the light source 202 in this embodiment may include one of a micro-led or a sub-millimeter led. In this embodiment, a plurality of high-density micro-sized light source 202 arrays are integrally arranged on one side of the transparent substrate 201 to serve as display pixels or light-emitting pixels to realize image display, and optionally, when the light-emitting panel 000 of this embodiment is used as a display panel, the distance between pixel points can be reduced from a millimeter level to a micron level, and the light-emitting panel belongs to a self-luminous display. Optionally, the light-emitting panel 000 of this embodiment may also be used as a backlight, and each light-emitting pixel may be addressed and driven to light individually, so as to achieve a screen effect with a high dynamic range, and make the picture finer and smoother. The light-emitting panel 000 of the present embodiment can be used as a backlight of a liquid crystal display device, and can also be directly used as a display device.
The present embodiment provides a plurality of light sources 202 on the side of the transparent substrate 201 facing the back-plate 10, so that the light emitting surface 202E of the light source 202 faces the back plate 10, and the light emitting surface 000E of the light emitting panel 000 is located on the side of the transparent substrate 201 away from the light source 202, that is, the light emitting surface 202E of the light source 202 is opposite to the light emitting surface 000E of the light emitting panel 000, the light emitting surface 202E of the light source 202 faces the rear plate 10, but not the light emitting surface 000E of the light emitting panel 000, and the present embodiment further provides a reflective layer 30 between the light source substrate 20 and the back plate 10, i.e., the light emitting surface 202E of the light source 202 faces the reflective layer 30 between the light source substrate 20 and the back plate 10, as shown in fig. 3, fig. 3 is a schematic light path diagram of the light-emitting panel provided in this embodiment when emitting light, the reflective layer 30 may reflect the light L emitted from the light source 202 back to the light-emitting surface 000E of the light-emitting panel 000, so that the light-emitting surface 000E of the light-emitting panel 000 can emit light normally. In the present embodiment, the light source substrate 20 is reversely placed on the back plate 10, the reflective layer 30 is disposed between the light source substrate 20 and the back plate 10, light emitted from the light emitting surface 202E of the light source 202 is reflected back to the surface 20A of the light source substrate 20 on the side away from the light source 202 by the reflective layer 30, and is emitted from the transparent substrate 201 to the light emitting surface 000E of the light emitting panel 000, because the transparent substrate 201 is made of glass or PI with high transmittance, and the reflective layer 30 can be made of a material with high reflectance, light reflected from the reflective layer 30 back to the transparent substrate 201 can be better emitted from the surface 20A of the light source substrate 20 on the side away from the light source 202, and because the light source substrate 20 of the present embodiment is reversely placed on the back plate 10, the side of the light source substrate 20 facing the light emitting surface 000E of the light emitting panel 000, i.e. there is no need to dispose a white oil solder resist or white PI for protecting the wiring structure, so as to avoid the influence of the brightness caused by the low reflectance of the white oil solder resist or the white PI, the light emitting luminance of the light emitting panel 000 can be ensured without increasing the driving power consumption. The light source substrate 20 of the present embodiment is reversely disposed on the back plate 10, such that the light emitting surface 202E of the light source 202 is opposite to the light emitting surface 000E of the light emitting panel 000, and a bad phenomenon that starry sky easily occurs on a side of the light emitting surface 202E of the light source 202 facing the light emitting surface 000E of the light emitting panel 000 can be avoided, that is, a phenomenon that brightness of a corresponding position of the light emitting surface 202E of the light source 202 is high and brightness between adjacent light sources 202 is low is avoided, and further, the light source substrate 20 disposed in the present embodiment is reversely disposed on the back plate 10, such that the starry sky phenomenon can be effectively improved, and light emitting quality is further improved.
It should be noted that, in the drawings of the present embodiment, the structure of the light-emitting panel is only exemplarily shown, and in a specific implementation, the structure of the light-emitting panel includes, but is not limited to, a protective layer (not filled in the drawings) located on a light-emitting surface side of the light-emitting panel 000, and may also include other structures capable of achieving a display function, for example, when the light source 202 is a blue light source, the light-emitting panel 000 may further include a color conversion layer to achieve a full-color image display, which can be specifically understood with reference to the structure of the Mini LED or Micro LED light-emitting panel in the related art, and this embodiment is not described herein again. It should be further noted that the shape and size of the light source 202 in the drawings of this embodiment are only schematic, and in practical implementation, the size and shape of the light source 202 may also be set according to actual requirements, and this embodiment is not particularly limited.
In some alternative embodiments, please refer to fig. 1 and fig. 2 in combination, in this embodiment, the light source substrate 20 includes an adhesive layer 203, the adhesive layer 203 is disposed on a side of the transparent substrate 201 facing the reflective layer 30, and the adhesive layer 203 covers the plurality of light sources 202.
This embodiment explains that one side of the transparent substrate 201 facing the reflective layer 30 includes the sealant layer 203 covering the plurality of light sources 202, the sealant layer 203 can be made of a material which is transparent and has little influence on the light path, the sealant layer 203 can protect the light sources 202, and when the light sources 202 are prevented from being impacted, the gap between the light source substrate 20 and the reflective layer 30 can be filled, and the overall stability of the panel can be ensured.
In some alternative embodiments, please continue to refer to fig. 1 and fig. 2 in combination, in this embodiment, the sealant layer 203 includes a first portion 2031 and a second portion 2032, an orthogonal projection of the first portion 2031 on the transparent substrate 201 overlaps an orthogonal projection of the light source 202 on the transparent substrate 201, and an orthogonal projection of the second portion 2032 on the transparent substrate 201 is located between two adjacent light sources 202;
the first portion 2031 is in direct contact with the light source 202, and the second portion 2032 is in direct contact with the transparent substrate 201.
This embodiment explains that the sealant layer 203 may include at least two portions, namely a first portion 2031 and a second portion 2032, where an orthographic projection of the first portion 2031 on the transparent substrate 201 overlaps with an orthographic projection of the light source 202 on the transparent substrate 201, that is, the first portion 2031 is a portion of the sealant layer 203 directly covering a surface of the light source 202 and directly contacting with the light emitting surface 202E of the light source 202, an orthographic projection of the other second portion 2032 of the sealant layer 203 on the transparent substrate 201 is located between two adjacent light sources 202, that is, the second portion 2032 is a portion of the sealant layer 203 other than the portion contacting with the light emitting surface 202E of the light source 202, a surface of the second portion 2032 facing the transparent substrate 201 may directly contact with a surface of the transparent substrate 201 facing the reflective layer 30, or a surface of the second portion 2032 facing the transparent substrate 201 may directly contact with a surface of the transparent substrate 201 facing the reflective layer 30, so that there is no need to provide a wiring structure for protecting the light source substrate 20 on the light source substrate 20 White oil solder resist or white PI, whole light source substrate 20 does not include white oil solder resist or white PI material that the reflectivity is low promptly, and then can avoid white oil solder resist or the lower influence to light emitting luminance of light source substrate 20 of white PI reflectivity, when need not to promote the drive consumption, can effectively guarantee light emitting panel 000's light emitting luminance.
It can be understood that, in this embodiment, the manufacturing material of the adhesive sealing layer 203 is not specifically limited, and in the specific implementation, the light emitting panel in the related art can be referred to protect the light source and fill the space gap, so that the adhesive sealing material with better stability of the whole module is configured, which is not described herein again.
In some alternative embodiments, please refer to fig. 1-3, 4 and 5 in combination, fig. 4 is a schematic structural diagram illustrating a process of attaching the reflective layer to the light source substrate and assembling the reflective layer to the back plate in fig. 3, fig. 5 is a schematic structural diagram illustrating a process of assembling the reflective layer to the light source substrate after attaching the reflective layer to the back plate in fig. 3, in this embodiment, the reflective layer 30 includes any one of a reflective film, a reflective sheet or a silver plating layer.
This embodiment explains that the reflective layer 30 between the back plate 10 and the light source substrate 20 may be a reflective sheet or a reflective film, as shown in fig. 4, the reflective sheet or the reflective film may be attached to one side of the light emitting surface 202E of the light source substrate 20, which is prefabricated and at least includes the light source 202 and the transparent substrate 201, before the back plate 10 and the light source substrate 20 are assembled in the assembly process of the light emitting panel 000, and then the reflective layer 30 and the light source substrate 20 are disposed on the back plate 10, so that the light source substrate 20 is located on the side of the reflective layer 30 away from the back plate 10. Alternatively, as shown in fig. 5, the reflective layer 30 between the back plate 10 and the light source substrate 20 in this embodiment may also be a silver plating layer, and the silver plating layer may be coated or plated on the back plate 10 by using materials such as silver before the back plate 10 and the light source substrate 20 are assembled in the assembly process of the light emitting panel 000, so that a thin silver plating layer with high reflectivity may be formed as the reflective layer 30, the thickness of the reflective layer 30 of the reflective sheet or the reflective film may generally be more than 50 micrometers, and the thickness of the reflective layer 30 of the silver plating layer may generally be reduced to within 1 micrometer, so the thickness of the entire panel may be reduced by the reflective layer 30 of the silver plating layer; then, the prefabricated light source substrate 20 at least comprising the light source 202 and the transparent substrate 201 is arranged on the silver plating layer, so that the transparent substrate 201 is positioned on one side of the light source 202 away from the silver plating layer.
In some optional embodiments, please refer to fig. 1-3, 7 and 8 in combination, fig. 6 is a schematic cross-sectional structure of a direction a-a' in fig. 1, fig. 7 is a schematic partial electrical connection structure in a driving circuit layer according to an embodiment of the present invention, and fig. 8 is a schematic partial enlarged structure of fig. 1, in which in this embodiment, the light source substrate 20 includes a driving circuit layer 204, the driving circuit layer 204 includes a plurality of signal lines 2041, and a manufacturing material of the signal lines 2041 includes a transparent conductive material.
The embodiment explains that the light source substrate 20 may include a driving circuit layer 204, the driving circuit layer 204 is used for arranging a plurality of signal lines 2041 for providing driving electrical signals for the light source 202, and the signal lines 2041 enable the light source 202 to receive signals for light emitting display. In this embodiment, the signal line 2041 is made of a transparent conductive material, such as Indium Tin Oxide (ITO), Indium Zinc Oxide (IZO), or aluminum-doped zinc oxide (AZO), so that the signal line 2041 in the driving circuit layer 204 is a conductive wire made of a high-transmittance material, which is beneficial to improving the light transmittance of the light source substrate 20, and ensures that the light L reflected back to the light source substrate 20 through the reflective layer 30 can be emitted from the surface 20A of the light source substrate 20 on the side deviating from the light source 202 as much as possible, thereby further improving the light emitting brightness of the light emitting panel 000.
Optionally, in the light emitting panel 000 provided in this embodiment, the light sources 202 may be sub-millimeter light emitting diodes (Mini LEDs) or Micro light emitting diodes (Micro LEDs), at least one light source 202 may form one light emitting unit 00, as shown in fig. 7, one light emitting unit 00 may include four light sources 202, or one light emitting unit 00 may further include other numbers of light sources 202, which is not limited in this embodiment. The driving circuit layer 204 may include switching devices electrically connected to the light emitting units 00 as switches, and the on time of the switching devices may be controlled by outputting different Pulse Width Modulation signals (PWM) to the signal line 2041, thereby adjusting the light emitting luminance of each light emitting element. As shown in fig. 7 and 8, the driving circuit layer 204 of the light emitting panel 000 provided in this embodiment may further include a driving transistor T, the driving transistor T is used as a switching element, and whether the light source 202 is powered on or not can be realized, a gate of the driving transistor T is electrically connected to one driving signal line 20411, the driving signal line 20411 provides a PWM driving signal (Pulse Width Modulation) to the gate of each driving transistor T, that is, the driving signal line 20411 can provide a Pulse Width Modulation signal through a driving chip (not shown), and different gray scales of the light source 202 are realized by adjusting different Pulse widths (duty ratios) of the PWM driving signal input by the driving chip, where the larger the selectable duty ratio is, the higher the brightness is.
It is understood that the light emitting panel 000 in the present embodiment may include a plurality of light emitting units 00, each light emitting unit 00 may include one driving transistor T and at least one light source 202 (each light emitting unit may include one driving transistor T and a plurality of light sources 202), a gate of the driving transistor T in each light emitting unit 00 is electrically connected to one driving signal line 20411, that is, one driving signal line 20411 is led out independently from each light emitting unit 00, and each driving signal line 20411 individually inputs one driving signal to a gate of the driving transistor T for controlling the brightness of the plurality of light sources 202 in the light emitting unit 00.
As shown in fig. 7 and 8, the light emitting panel 000 of the present embodiment may further include a plurality of other signal lines 2041, such as a first voltage signal line 20412 (which may be a PVDD power signal line) and a second voltage signal line 20413 (which may be a PVEE power signal line), wherein a first pole of the driving transistor T is electrically connected to a negative pole of the light source 202, a second pole of the driving transistor T is electrically connected to the second voltage signal line 20413, and a positive pole of the light source 202 is electrically connected to the first voltage signal line 20412. The first voltage signal line 20412 is used to input a PVDD voltage signal to the light emitting panel 000, the second voltage signal line 20413 is used to input a PVEE voltage signal to the light emitting panel 000, the PVDD voltage signal and the PVEE voltage signal can be provided by an external power supply, and the brightness (i.e., gray scale) of the light source 202 is controlled by the length of the power-on time of the light source 202. Optionally, the input voltage of the second voltage signal line 20413 may be a fixed voltage, and further optionally, the input voltage of the second voltage signal line 20413 is zero, and the input voltage of the first voltage signal line 20412 is greater than or equal to the threshold voltage of the light source 202. In the light source 202 driven by the PWM method, the value of the PVDD voltage signal depends on the threshold voltage of the light source 202, so the input voltage of the first voltage signal line 20412 needs to be greater than or equal to the threshold voltage of the light source 202, and the value of the PVEE voltage signal generally takes a zero potential, so the input voltage of the second voltage signal line 20413 is zero. It can be understood that different gray scales of the light source 202 of the light source substrate 20 of the embodiment are realized by adjusting different pulse widths (duty ratios) of the PWM driving signals input by the driving chip, and the larger the duty ratio is, the larger the brightness is, each driving transistor T can be independently controlled without scanning driving control, and the control is simple, flexible and good in dynamic response, and is beneficial to improving the contrast ratio.
It should be noted that fig. 8 of the present embodiment only illustrates a wiring manner of the plurality of first voltage signal lines 20412, the plurality of second voltage signal lines 20413, and the plurality of driving signal lines 20411 on the light emitting panel 000, in a specific implementation, the wiring manner of the various signal lines on the light emitting panel includes, but is not limited to, that shown in fig. 8, and may be other wiring, only the requirement is satisfied that the gate of the driving transistor T is connected to one driving signal line 20411, the first pole of the driving transistor T is electrically connected to the negative pole of the light source 202, the second pole of the driving transistor T is electrically connected to the second voltage signal line 20413, and the positive pole of the light source 202 is electrically connected to the first voltage signal line 20412, which is not described herein again.
It should be further noted that the shapes and sizes of the light source 202 and the driving transistor T in fig. 8 of this embodiment are only schematic, in a specific implementation, the actual size of the driving transistor T may be larger than the actual size of the light source 202, the actual size of the driving transistor T may be equal to the actual size of the light source 202, the actual size of the driving transistor T may also be smaller than the actual size of the light source 202, the shapes of the light source 202 and the driving transistor T may also be the same or different, or may also be other shapes, and this embodiment is not limited in particular.
In some alternative embodiments, please refer to fig. 1 and 9 in combination, fig. 9 is a schematic cross-sectional view taken along a-a' direction in fig. 1, in which a side of the transparent substrate 201 facing away from the light source 202 includes a plurality of prism structures 40.
The present embodiment explains that a plurality of prism structures 40 may be disposed on a side of the transparent substrate 201 of the light source substrate 20 facing the light emitting surface 000E of the light emitting panel 000, the prism structures 40 may be triangular prism bars, a plurality of prism structures 40 are disposed on a side of the transparent substrate 201 facing away from the light source 202, and a direction of a light ray L reflected from the reflective layer 30 to the surface 20A of the light source substrate 20 facing away from the light source 202 may be changed by the prism structures 40, so that the light ray L is emitted in a direction perpendicular to the light emitting surface 000E of the light emitting panel 000 as much as possible when the light ray L is emitted through the prism structures 40, thereby increasing light rays in a perpendicular direction and being beneficial to improving the brightness of the light emitting panel 000.
Optionally, as shown in fig. 9, the light source substrate 20 includes a first region 20P and a second region 20Q, the light sources 202 are located in the first region 20P, and the second region 20Q is located between two adjacent light sources 202; a plurality of prismatic structures 40 are located at least in the second region 20Q.
This embodiment explains that on the side of the transparent substrate 201 away from the light sources 202, at least the prism structures 40 are disposed in the second region 20Q of the light source substrate 20 between two adjacent light sources 202, because the light L emitted from the light sources 202 is reflected back to the light emitting surface 000E of the light emitting panel 000 through the reflective layer 30, the light L is mainly reflected from the second region 20Q of the light source substrate 20 between two adjacent light sources 202 to the side surface 20A of the light source substrate 20 away from the light sources 202, and the plurality of prism structures 40 are disposed at least in the second region 20Q, so that the brightness between two adjacent light sources 202 can be better improved, and the light emitting effect of the light emitting panel 000 is further ensured.
Alternatively, as shown in fig. 1 and 10, fig. 10 is another schematic sectional view along the direction a-a' in fig. 1, in this embodiment, the plurality of prism structures 40 are further located in the first region 20P, and the arrangement density of the plurality of prism structures 40 in the second region 20Q is greater than the arrangement density of the plurality of prism structures 40 in the first region 20P.
This embodiment explains that on the side of the transparent substrate 201 away from the light sources 202, while a plurality of prism structures 40 are disposed in the second area 20Q of the light source substrate 20 between two adjacent light sources 202, a plurality of prism structures may also be disposed in the first area 20P at the position opposite to the light sources 202, and the prism structures 40 may be all triangular prism strips, so that the light emitted from the light emitting surface 000E of the entire light emitting panel 000 is emitted as much as possible in the direction perpendicular to the light emitting surface 000E of the light emitting panel 000, thereby increasing the light in the vertical direction of the light emitting surface of the light emitting panel 000, and being beneficial to better improving the overall brightness of the light emitting panel 000. In addition, in the embodiment, the arrangement density of the plurality of prism structures 40 in the second area 20Q is set to be greater than the arrangement density of the plurality of prism structures 40 in the first area 20P, optionally, the distance W2 between two adjacent prism structures 40 in the second area 20Q may be smaller than the distance W1 between two adjacent prism structures 40 in the first area 20P, or other arrangement modes may also be adopted, so that the arrangement density of the plurality of prism structures 40 in the second area 20Q is greater than the arrangement density of the plurality of prism structures 40 in the first area 20P, and further, by setting the arrangement density of the prism structures 40 in the second area 20Q to be greater, the brightness between two adjacent light sources 202 is further improved, the light-emitting uniformity of the whole light-emitting surface 000E of the light-emitting panel 000 is facilitated, and the light-emitting quality is improved.
Alternatively, as shown in fig. 1 and 11, fig. 11 is another schematic sectional structure diagram along the direction of a-a' in fig. 1, in this embodiment, the plurality of prism structures 40 are not only located in the first region 20P but also located in the second region 20Q, the plurality of prism structures 40 include a first prism strip 401 and a second prism strip 402, the first prism strip 401 is located in the first region 20P, the second prism strip 402 is located in the second region 20Q, and the height H1 of the first prism strip 401 is smaller than the height H2 of the second prism strip 402.
This embodiment explains that on the side of the transparent substrate 201 away from the light sources 202, while a plurality of prism structures 40 are disposed in the second area 20Q of the light source substrate 20 between two adjacent light sources 202, a plurality of prism structures may also be disposed in the first area 20P at the position opposite to the light sources 202, and the prism structures 40 may be all triangular prism strips, so that the light emitted from the light emitting surface 000E of the entire light emitting panel 000 is emitted as much as possible in the direction perpendicular to the light emitting surface 000E of the light emitting panel 000, thereby increasing the light in the vertical direction of the light emitting surface of the light emitting panel 000, and being beneficial to better improving the overall brightness of the light emitting panel 000. In addition, in the embodiment, the height H1 of the first prism bar 401 located in the first area 20P is smaller than the height H2 of the second prism bar 402 located in the second area 20Q, and the thicker the second prism bar 402 is, the more light rays can be converted, so that the higher the light emitting brightness in the range of the second area 20Q between the adjacent light sources 202 is, which is beneficial to the light emitting uniformity of the whole light emitting surface 000E of the light emitting panel 000 and the improvement of the light emitting quality.
It is understood that the height H1 of the first prism bars 401 in the first region 20P in the present embodiment is smaller than the height H2 of the second prism bars 402 in the second region 20Q, and the arrangement density of the plurality of first prism bars 401 in the first region 20P may be smaller than the arrangement density of the plurality of second prism bars 402 in the second region 20Q, that is, the prism bars between adjacent light sources 202 are dense and large, and the prism bars at positions where the light sources 202 are directly facing are thin and sparse, so that the height and arrangement density of the prism bars are combined, and the light emitting uniformity of the entire light emitting surface 000E of the light emitting panel 000 is better.
In some alternative embodiments, please refer to fig. 1 and 12 in combination, fig. 12 is a schematic cross-sectional view taken along direction a-a' in fig. 1, in which a side of the transparent substrate 201 facing away from the light source 202 includes a diffusion layer 50, and the diffusion layer 50 includes a plurality of diffusion particles 501.
This embodiment explains that the side of the transparent substrate 201 of the light source substrate 20 facing the light emitting surface 000E of the light emitting panel 000 may be provided with the diffusion layer 50, the diffusion layer 50 may be doped with a plurality of diffusion particles 501, and the diffusion layer 50 doped with the diffusion particles 501 is attached to the side of the transparent substrate 201 away from the backlight 202, which may perform an atomization function, may diffuse the light reflected from the reflective layer 30 back to the surface 20A of the light source substrate 20 away from the light source 202, and is beneficial to uniformizing the light emitting brightness of the light emitting panel 000.
Optionally, the diffusion layer 50 may be an adhesive layer doped with a plurality of diffusion particles 501, in this embodiment, the diffusion layer 50 of the colloid is disposed on one side of the transparent substrate 201 away from the light source 202, because the light source substrate 20 is reversely disposed on the back plate 10, two sides of the transparent substrate 201 may have adhesive layers (the diffusion layer 50 of the colloid on one side of the transparent substrate 201 away from the light source 202 and the sealant layer 203 of the transparent substrate 201 toward one side of the light source 202), which is beneficial to reducing a warping phenomenon caused by shrinkage when a single-sided adhesive of the transparent substrate 201 is applied, and is further beneficial to reducing a warping degree of the light source substrate 20, and improving light emitting quality.
It is understood that fig. 12 of this embodiment only shows the shape, size, arrangement density and doping position of the diffusion particles 501 by way of example, in a specific implementation, the structure of the diffusion particles 501 in the diffusion layer 50 includes, but is not limited to, other structures, and this embodiment is not limited to this, and only needs to satisfy that the diffusion layer 50 has the light diffusion effect.
Optionally, referring to fig. 1 and fig. 13 in combination, fig. 13 is another schematic cross-sectional structure view along the direction a-a' in fig. 1, in this embodiment, the diffusion layer 50 includes a third region 50P and a fourth region 50Q, and the orthographic projection of the light source 202 on the diffusion layer 50 is located at the third region 50P;
the arrangement density of the plurality of diffusion particles 501 in the third region 50P is greater than the arrangement density of the plurality of diffusion particles 501 in the fourth region 50Q.
This embodiment explains that the side of the transparent substrate 201 of the light source substrate 20 facing the light-emitting surface 000E of the light-emitting panel 000 may be provided with the diffusion layer 50, the diffusion layer 50 doped with the diffusion particles 501 is attached to the side of the transparent substrate 201 facing away from the backlight 202, and may perform an atomization effect to diffuse the light reflected from the reflection layer 30 back to the surface 20A of the light source substrate 20 facing away from the light source 202, which is beneficial to uniformizing the light-emitting brightness of the light-emitting panel 000, and at the same time, the diffusion layer 501 may also be designed differently, specifically, the diffusion layer 50 includes a third region 50P and a fourth region 50Q, the orthographic projection of the light source 202 on the diffusion layer 50 is located in the third region 50P, the rest region of the diffusion layer 50 is the fourth region 50Q, the arrangement density of the plurality of diffusion particles 501 in the third region 50P facing the light source 202 is greater than the arrangement density of the plurality of diffusion particles 501 in the fourth region 50Q, optionally, the distance between two adjacent diffusion particles 501 in the third region 50P may be smaller than the distance between two adjacent diffusion particles 501 in the fourth region 50Q, so that the arrangement density of the plurality of diffusion particles 501 in the third region 50P is greater than the arrangement density of the plurality of diffusion particles 501 in the fourth region 50Q. In this embodiment, the arrangement density of the plurality of diffusion particles 501 in the third region 50P opposite to the light source 202 is set to be relatively high, so that the diffusion degree of the region where the light source 202 is located is relatively high, the atomization degree is relatively high, the over-brightness of the light emitting brightness of the region where the light source 202 is opposite to is avoided, the brightness difference between the light emitting brightness of the adjacent two light sources 202 is reduced, and the starry phenomenon of the luminescent panel 000 in the light emitting process can be effectively improved.
In some alternative embodiments, please refer to fig. 1 and 14 in combination, fig. 14 is a schematic cross-sectional view taken along a-a' direction in fig. 1, in which the light source 202 includes a blue light source; optionally, the blue light source may include one of a blue micro-led or a blue sub-millimeter led; the side of the transparent substrate 201 facing away from the light source 202 comprises a color conversion layer 60.
This embodiment explains that when the light source 202 of the light source substrate 20 in the light emitting panel 000 is a blue light source, a color conversion layer 60 may be further provided on the side of the transparent substrate 201 facing away from the light source 202, and white light may be formed using the blue light source in combination with the color conversion layer 60 for color conversion. Alternatively, the color conversion layer 60 may include one of a quantum dot film or a fluorescent coating. The Quantum Dot layer can excite pure green light and red light under the excitation of blue light, and the Quantum Dot (QD) is a luminescent semiconductor crystal which has narrow and adjustable photoluminescence spectrum, high photoluminescence Quantum efficiency and inherent thermal stability of inorganic materials, can effectively convert the light of a blue luminescent element into blue, green and red with high saturation, and further can be mixed to form high-quality white light, thereby displaying the color with the widest color gamut on a screen and being beneficial to improving the display effect. The phosphor-coated color conversion layer 60 can further reduce the overall thickness of the light-emitting panel 000, which is advantageous for achieving a slim design of the panel.
In some alternative embodiments, referring to fig. 15, fig. 15 is a schematic plan view of a display device according to an embodiment of the present invention, and the display device 111 according to the embodiment includes the light emitting panel 000 according to the embodiment of the present invention. Alternatively, the display device 111 may be the light-emitting panel 000 in the above embodiment of the present invention, and directly perform display. Or the display device 111 may also be a liquid crystal display device, in which case the light-emitting panel 000 of the present embodiment may be used as a direct-type backlight, and the present embodiment is not particularly limited to the type of the display device 111, and may be set according to actual requirements when implemented. The embodiment of fig. 15 is only an example of a mobile phone, and the display device 111 is described, it is understood that the display device 111 provided in the embodiment of the present invention may be another display device 111 having a display function, such as a computer, a television, and a vehicle-mounted display device, and the present invention is not limited thereto. The display device 111 provided in the embodiment of the present invention has the beneficial effects of the light-emitting panel 000 provided in the embodiment of the present invention, and specific descriptions of the light-emitting panel 000 in the above embodiments can be specifically referred to, and details are not repeated herein.
As can be seen from the above embodiments, the light-emitting panel and the display device provided by the present invention at least achieve the following advantages:
the light-emitting panel comprises a back plate and light source substrates, wherein the light sources are positioned on one side of the transparent substrate facing the back plate, so that the light-emitting surfaces of the light sources face the back plate, the light-emitting surface of the light-emitting panel is positioned on one side of the transparent substrate facing away from the light sources, namely the light-emitting surfaces of the light sources and the light-emitting surface of the light-emitting panel are arranged in a reverse mode, a reflecting layer is further arranged between the light source substrates and the back plate, and the reflecting layer can reflect light emitted by the light sources back to the light-emitting surface of the light-emitting panel, so that the light-emitting surface of the light-emitting panel can normally emit light. The light source substrate is arranged on the back plate in a reverse mode, light emitted from the light emitting surface of the light source is reflected back to the surface of the light source substrate, which is far away from the light source side, through the reflecting layer and is emitted to the light emitting surface of the light emitting panel from the transparent substrate. The light source substrate is reversely arranged on the back plate, so that the side, facing the light emitting surface of the light emitting panel, of the light source substrate does not need to be provided with the white oil solder resist and the like which have a protection effect on the wiring structure, the influence of low reflectivity of the white oil solder resist and the like on the light emitting brightness can be avoided, and the light emitting brightness of the light emitting panel can be ensured without increasing the driving power consumption. The light source substrate is reversely arranged on the back plate, so that the light emitting surface of the light source is opposite to the light emitting surface of the light emitting panel, the defect that starry sky easily occurs on one side of the light emitting surface of the light source facing the light emitting surface of the light emitting panel can be avoided, namely, the phenomenon that the brightness of the corresponding position of the light emitting surface of the light source is high, and the brightness between adjacent light sources is low is avoided.
Although some specific embodiments of the present invention have been described in detail by way of examples, it should be understood by those skilled in the art that the above examples are for illustrative purposes only and are not intended to limit the scope of the present invention. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.
Claims (14)
1. A light-emitting panel, comprising: the backlight module comprises a back plate and a light source substrate, wherein the light source substrate comprises a transparent substrate and a plurality of light sources positioned on one side of the transparent substrate;
the light sources are positioned on one side of the transparent substrate facing the back plate, the light emitting surfaces of the light sources face the back plate, and the light emitting surface of the light emitting panel is positioned on one side of the transparent substrate facing away from the light sources;
and a reflecting layer is arranged between the light source substrate and the back plate.
2. The luminescent panel according to claim 1, wherein the light source substrate comprises a sealing layer on a side of the transparent substrate facing the reflective layer, the sealing layer covering a plurality of the light sources.
3. The luminescent panel according to claim 2,
the sealing adhesive layer comprises a first part and a second part, the orthographic projection of the first part on the transparent substrate is overlapped with the orthographic projection of the light source on the transparent substrate, and the orthographic projection of the second part on the transparent substrate is positioned between two adjacent light sources;
the first portion is in direct contact with the light source and the second portion is in direct contact with the transparent substrate.
4. The luminescent panel according to claim 1, wherein the reflective layer comprises any one of a reflective film or a reflective sheet or a silver plated layer.
5. The light-emitting panel according to claim 1, wherein the light source substrate comprises a driver circuit layer including a plurality of signal lines, and a material of the signal lines comprises a transparent conductive material.
6. The light-emitting panel according to claim 1, characterized in that a side of the transparent substrate facing away from the light source comprises a plurality of prism structures.
7. The luminescent panel according to claim 6, wherein the light source substrate comprises a first region where the light sources are located and a second region where the second region is located between two adjacent ones of the light sources;
a plurality of the prismatic structures are located at least in the second region.
8. The luminescent panel according to claim 7, wherein a plurality of the prism structures are further located in the first region, and wherein an arrangement density of the plurality of the prism structures in the second region is larger than an arrangement density of the plurality of the prism structures in the first region.
9. The luminescent panel according to claim 7, wherein the plurality of prism structures include a first prism bar and a second prism bar, a height of the first prism bar being smaller than a height of the second prism bar;
the first prism strip is located in the first region, and the second prism strip is located in the second region.
10. The luminescent panel according to claim 1, wherein a side of the transparent substrate facing away from the light source comprises a diffusion layer comprising a plurality of diffusion particles.
11. The luminescent panel according to claim 10,
the diffusion layer comprises a third area and a fourth area, and the orthographic projection of the light source on the diffusion layer is located at the third area;
the arrangement density of the plurality of diffusion particles in the third region is greater than the arrangement density of the plurality of diffusion particles in the fourth region.
12. The luminescent panel according to claim 1, wherein the light source comprises a blue light source;
the side of the transparent substrate facing away from the light source comprises a color conversion layer.
13. The light-emitting panel according to claim 12, wherein the color conversion layer comprises one of a quantum dot film or a fluorescent coating.
14. A display device characterized by comprising the light-emitting panel according to any one of claims 1 to 13.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210481289.8A CN114864797A (en) | 2022-05-05 | 2022-05-05 | Light-emitting panel and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210481289.8A CN114864797A (en) | 2022-05-05 | 2022-05-05 | Light-emitting panel and display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114864797A true CN114864797A (en) | 2022-08-05 |
Family
ID=82634599
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210481289.8A Pending CN114864797A (en) | 2022-05-05 | 2022-05-05 | Light-emitting panel and display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114864797A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115509046A (en) * | 2022-09-29 | 2022-12-23 | 厦门天马微电子有限公司 | Backlight module, display panel, control method of display panel and display device |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20190278134A1 (en) * | 2016-05-19 | 2019-09-12 | Sharp Kabushiki Kaisha | Backlight device and display apparatus including same |
| US20190346113A1 (en) * | 2018-05-08 | 2019-11-14 | Beijing Boe Optoelectronics Technology Co., Ltd. | Backlight and method for manufacturing the same, display apparatus |
| CN111045253A (en) * | 2019-12-30 | 2020-04-21 | 华为技术有限公司 | Backlight module and liquid crystal display device |
| US20200166183A1 (en) * | 2018-11-22 | 2020-05-28 | Beijing Boe Optoelectronics Technology Co., Ltd. | Light source, display apparatus, illumination apparatus and method for manufacturing light source |
| CN113534536A (en) * | 2021-07-14 | 2021-10-22 | 武汉华星光电半导体显示技术有限公司 | Backlight module, preparation method thereof and display device |
| CN113960837A (en) * | 2021-10-29 | 2022-01-21 | 上海天马微电子有限公司 | Double-sided display device |
-
2022
- 2022-05-05 CN CN202210481289.8A patent/CN114864797A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20190278134A1 (en) * | 2016-05-19 | 2019-09-12 | Sharp Kabushiki Kaisha | Backlight device and display apparatus including same |
| US20190346113A1 (en) * | 2018-05-08 | 2019-11-14 | Beijing Boe Optoelectronics Technology Co., Ltd. | Backlight and method for manufacturing the same, display apparatus |
| US20200166183A1 (en) * | 2018-11-22 | 2020-05-28 | Beijing Boe Optoelectronics Technology Co., Ltd. | Light source, display apparatus, illumination apparatus and method for manufacturing light source |
| CN111045253A (en) * | 2019-12-30 | 2020-04-21 | 华为技术有限公司 | Backlight module and liquid crystal display device |
| CN113534536A (en) * | 2021-07-14 | 2021-10-22 | 武汉华星光电半导体显示技术有限公司 | Backlight module, preparation method thereof and display device |
| CN113960837A (en) * | 2021-10-29 | 2022-01-21 | 上海天马微电子有限公司 | Double-sided display device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115509046A (en) * | 2022-09-29 | 2022-12-23 | 厦门天马微电子有限公司 | Backlight module, display panel, control method of display panel and display device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN112863390B (en) | Light-emitting module, backlight module and display device | |
| USRE45805E1 (en) | Display device | |
| KR100717226B1 (en) | Light source unit, illumination device using the same, and display device using the same | |
| KR101157233B1 (en) | Apparatus of light emitting diode backlight and liquid crystal display device using thereof | |
| KR101308752B1 (en) | Liquid crystal display device | |
| CN109557721B (en) | Backlight module and display device | |
| CN111240094B (en) | Area light source | |
| KR101764397B1 (en) | Container unit and Display device including the same | |
| KR20120056001A (en) | Backlight unit and liquid crystal display device | |
| CN109904295B (en) | LED device, manufacturing method thereof and display panel | |
| US20200083280A1 (en) | Top emission microled display and bottom emission microled display and a method of forming the same | |
| EP2530375B1 (en) | Light guide design for edge-illumination in a backlight unit | |
| KR102383645B1 (en) | Display device | |
| US20240168328A1 (en) | Hybrid display device and spliced display device | |
| CN114864797A (en) | Light-emitting panel and display device | |
| US11543690B2 (en) | Display device | |
| WO2019012793A1 (en) | Light emitting device, display device, and illuminating device | |
| KR101264700B1 (en) | backlight unit | |
| KR20080073950A (en) | Backlight unit and liquid crystal display having the same | |
| KR20070065079A (en) | Led lamp unit, backlight assembly having the same and display deive having the same | |
| KR101827970B1 (en) | backlight unit and display apparatus for using the same | |
| JP2001006416A (en) | Backlight structure | |
| KR20080062259A (en) | Light divice, method of fabricating the same, backlight unit and liquid crystal display divice having the same | |
| CN112987394B (en) | Display device | |
| CN109326585B (en) | Backlight module, manufacturing method thereof and display device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |