CN114859990A - Heat dissipation method based on real-time temperature and temperature rise rate - Google Patents
Heat dissipation method based on real-time temperature and temperature rise rate Download PDFInfo
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- CN114859990A CN114859990A CN202210146067.0A CN202210146067A CN114859990A CN 114859990 A CN114859990 A CN 114859990A CN 202210146067 A CN202210146067 A CN 202210146067A CN 114859990 A CN114859990 A CN 114859990A
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/1927—Control of temperature characterised by the use of electric means using a plurality of sensors
- G05D23/193—Control of temperature characterised by the use of electric means using a plurality of sensors sensing the temperaure in different places in thermal relationship with one or more spaces
- G05D23/1931—Control of temperature characterised by the use of electric means using a plurality of sensors sensing the temperaure in different places in thermal relationship with one or more spaces to control the temperature of one space
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
Abstract
The application discloses a heat dissipation method based on real-time temperature and temperature rise rate, which is characterized in that the method is used for dissipating heat of a system using an IGBT, and comprises the following steps: the method comprises the following steps: the temperature of the system when the system reaches a steady state under different working conditions is different due to the change of the environmental temperature, and the corresponding heat dissipation level is designed for the real-time temperature under different environmental temperatures; the heat dissipation level directly corresponds to the output power of the corresponding fan, and the output power of the fan is correspondingly improved by 20% when the heat dissipation level is increased by one; step two: the temperature rise rate of the system under different environmental temperatures is different, and the corresponding heat dissipation level is set for the temperature rise rate under different environmental temperatures; step three: when the system operates, the real-time temperature of the IGBT is collected, the temperature rise rate is obtained, and whether heat dissipation is needed or not is judged by combining the environment temperature and the real-time temperature; step four: and if the heat dissipation is needed by judgment, selecting the highest heat dissipation level in the heat dissipation levels respectively corresponding to the temperature rise rate and the real-time temperature for heat dissipation.
Description
Technical Field
The application relates to a heat dissipation method based on real-time temperature and temperature rise rate, which is based on temperature control combining IGBT temperature rise rate and temperature detection and belongs to the technical field of IGBT temperature control.
Background
At present, with the continuous development of power electronic technology, power electronic power components including Insulated Gate Bipolar Transistor (IGBT) modules are used as key devices in a power electronic converter system, and the reliability and the service life of the power electronic power components are closely related to the safe and reliable operation of the system. According to the statistical result, the failure of the power device accounts for about 21% of the fault of the whole converter system. During the operation of the system, there are many factors causing the failure of the power device, mainly including temperature, humidity, vibration, pollution and dust, and the most important failure cause is the failure caused by the temperature factor, and it accounts for about 55% of the failure of the whole power device. In the normal working process of the IGBT module, the current and the voltage flowing through the IGBT can fluctuate repeatedly along with the change of working conditions, and the fluctuation of junction temperature is caused, so that the average junction temperature of the IGBT is 60-80 ℃, and the junction temperature difference caused by the average junction temperature of the IGBT can reach 70-90 ℃ or even higher. When temperature fluctuates, materials of all layers in the IGBT module can expand by heating and contract by cooling, and because the thermal expansion coefficients of the materials of all layers are not completely consistent, the difference between the thermal expansion coefficients can cause the IGBT module to be subjected to repeated action of thermal stress when the temperature changes repeatedly, so that the interconnection structure of the module is damaged, the electrothermal characteristic of the IGBT module is changed, and even permanent failure is caused.
In conclusion, the temperature is a main factor causing the failure of the IGBT, and has a large influence on the long-term operation stability of the system. In the technology on the market, for realizing the temperature control of the IGBT, the real-time temperature of the module is generally detected directly, then the heat dissipation system is started to dissipate heat after the module reaches a certain temperature threshold value, and the temperature control system cannot set a lower heat dissipation threshold value due to the consideration of power consumption, cannot flexibly cope with the environmental temperature, and cannot continuously run in an ideal environment due to the influence of the environmental temperature and the actual use power consumption when the equipment runs normally. Therefore, the IGBT cannot sufficiently dissipate heat due to a high heat dissipation threshold, and the IGBT module temperature is repeatedly and drastically changed, thereby affecting the IGBT service life. If the heat dissipation threshold is lowered, the problem of increased system power consumption is caused by only one-gear heat dissipation threshold determination.
Therefore, in order to ensure long-term reliable operation of the IGBT, it is necessary to study a reliable temperature control method.
Disclosure of Invention
The utility model provides an aim at synthesizes IGBT temperature rise rate and temperature detection, adopts different heat dissipation levels to dispel the heat, guarantees to reduce the system energy consumption under different operating modes under the prerequisite that possess the most suitable radiating effect.
In order to achieve the above object, the present application provides a heat dissipation method based on real-time temperature and temperature rise rate, which is characterized in that the method is used for dissipating heat of a system using an IGBT, and comprises the following steps:
the method comprises the following steps: the temperature of the system when the system reaches a steady state under different working conditions is different due to the change of the environmental temperature, and the corresponding heat dissipation level is designed for the real-time temperature under different environmental temperatures; the heat dissipation level directly corresponds to the output power of the corresponding fan, and the output power of the fan is correspondingly improved by 20% when the heat dissipation level is increased by one;
step two: the temperature rise rate of the system under different environmental temperatures is different, and the corresponding heat dissipation level is set for the temperature rise rate under different environmental temperatures;
step three: when the system operates, the real-time temperature of the IGBT is collected, the temperature rise rate is obtained, and whether heat dissipation is needed or not is judged by combining the environment temperature and the real-time temperature;
step four: and if the heat dissipation is needed by judgment, selecting the highest heat dissipation level in the heat dissipation levels respectively corresponding to the temperature rise rate and the real-time temperature for heat dissipation.
In the first step and the second step, the common environmental temperature is divided into three grades, and the specific environmental temperature and each corresponding heat dissipation grade are shown in tables 1, 2 and 3;
TABLE 1. Heat dissipation levels at ambient temperature of zero degrees Centigrade
| Real time temperature | 10℃ | 20℃ | 35℃ | 40℃ | 45℃ |
| Heat dissipation level | 1 | 2 | 3 | 4 | 5 |
| Rate of temperature rise | 20℃/min | 35℃/min | 60℃/min | 80℃/min | 90℃/min |
| Heat dissipation level | 1 | 2 | 3 | 4 | 5 |
；
TABLE 2. Heat dissipation levels at an ambient temperature of twenty degrees Celsius
| Real time temperature | 25℃ | 35℃ | 45℃ | 50℃ | 60℃ |
| Heat dissipation level | 1 | 2 | 3 | 4 | 5 |
| Rate of temperature rise | 10℃/min | 30℃/min | 50℃/min | 70℃/min | 80℃/min |
| Heat dissipation level | 1 | 2 | 3 | 4 | 5 |
；
TABLE 3 Heat dissipation levels at ambient temperature of thirty degrees Celsius
| Real time temperature | 35℃ | 40℃ | 50℃ | 55℃ | 65℃ |
| Heat dissipation level | 1 | 2 | 3 | 4 | 5 |
| Rate of temperature rise | 10℃/min | 20℃/min | 35℃/min | 40℃/min | 60℃/min |
| Heat dissipation level | 1 | 2 | 3 | 4 | 5 |
。
In the third step, considering that the ambient temperature does not change frequently in a short time, the slow clock is adopted to collect the ambient temperature once every 1 h.
The invention has the following beneficial technical effects:
compared with the commonly used heat dissipation method in the market, the invention has wider heat dissipation range due to setting a plurality of heat dissipation grades, so that the heat dissipation can be carried out at lower real-time temperature or temperature rise rate. Therefore, the IGBT is ensured to have a relatively gentle temperature rise rate. The damage of an IGBT interconnection structure caused by the rapid change of the temperature of the IGBT is avoided, and the service life of the whole system is shortened. Compared with the traditional heat dissipation method, the invention can adapt the rotating speed of the fan to the actual running state of the system on the premise of ensuring the heat dissipation effect, thereby reducing the power consumption of the heat dissipation system and effectively reducing the energy consumption of the whole system.
Drawings
Fig. 1 is a flowchart of a heat dissipation method provided in the embodiment.
Detailed Description
In order to make the present application more comprehensible, preferred embodiments are described in detail below with reference to the accompanying drawings.
Examples
The embodiment provides a temperature control method based on combination of IGBT temperature rise rate and temperature detection, which is characterized in that different heat dissipation levels are set, and the most appropriate heat dissipation level is selected on the basis of comprehensively considering the temperature rise rate and the real-time temperature, so that the temperature fluctuation frequency of the IGBT in work is reduced, the overall service life of the IGBT is prolonged, and the long-term stable operation of a system is ensured. Meanwhile, different heat dissipation grades are adopted for heat dissipation, and the system energy consumption under different working conditions can be reduced on the premise of having the most appropriate heat dissipation effect.
The specific technical scheme comprises the following steps:
the method comprises the following steps: under the premise that the temperature of the system reaching the steady state under different working conditions is different due to the change of the environmental temperature, matching the corresponding heat dissipation level for the real-time temperature under different environmental temperatures; as shown in tables 1, 2 and 3 below. The heat dissipation level directly corresponds to the output power of the corresponding fan, and the output power of the corresponding fan is correspondingly improved by 20% when the heat dissipation level is increased by one.
Step two: considering that the temperature rise rates of the system at different environmental temperatures are different, the corresponding heat dissipation levels are set for the temperature rise rates at different environmental temperatures. The heat dissipation levels corresponding to the respective temperature rise rates at different ambient temperatures are shown in tables 1, 2, and 3 below.
Step three: when the system operates, the temperature of the IGBT is collected in real time, the temperature rise rate is obtained, and whether the adjustment of the heat dissipation level is needed or not is judged by combining the environment temperature and the real-time temperature. If the current real-time temperature or temperature rise rate exceeds the real-time temperature or temperature rise rate corresponding to the adjacent heat dissipation level, the output power of the fan is adjusted to the output power of the heat dissipation level actually corresponding to the current time.
Step four: and if the real-time temperature and the temperature rise rate correspond to different heat dissipation levels, comprehensively selecting the highest heat dissipation level of the temperature rise rate and the real-time temperature for heat dissipation in order to ensure safe and reliable operation of the system.
In the first step and the second step, considering that different working conditions of the system and different environmental temperatures can affect the temperature and the temperature rise rate of the system, considering the actual application scene of a product, dividing the common environmental temperature into three grades, and matching different heat dissipation grades for the real-time temperature and the temperature rise rate of the system at different environmental temperatures in a mode of combining simulation and actual test. The specific ambient temperature and its corresponding heat dissipation levels are shown in tables 1, 2 and 3.
In the third step, considering that the ambient temperature does not change frequently in a short time, the slow clock is adopted to collect the ambient temperature once every 1 h. The temperature rise rate is selected and calculated by the following formula:
given that the rate of temperature change is much lower than the system clock rate, the computing module may be configured with a slow clock to reduce the occupation of system resources.
And in the fourth step, based on the consideration of reducing the energy consumption and the heat dissipation effect of the system, after the real-time temperature and the temperature rise rate level of the system are judged, the highest heat dissipation level at the level is selected for heat dissipation. This ensures that an optimum level of heat dissipation is provided at all stages of system operation.
The complete working flow of the heat dissipation method is shown in fig. 1.
TABLE 1. Heat dissipation levels at ambient temperature of zero degrees Centigrade
| Real time temperature | 10℃ | 20℃ | 35℃ | 40℃ | 45℃ |
| Heat dissipation level | 1 | 2 | 3 | 4 | 5 |
| Rate of temperature rise | 20℃/min | 35℃/min | 60℃/min | 80℃/min | 90℃/min |
| Heat dissipation level | 1 | 2 | 3 | 4 | 5 |
TABLE 2. Heat dissipation levels at an ambient temperature of twenty degrees Celsius
| Real time temperature | 25℃ | 35℃ | 45℃ | 50℃ | 60℃ |
| Heat dissipation level | 1 | 2 | 3 | 4 | 5 |
| Rate of temperature rise | 10℃/min | 30℃/min | 50℃/min | 70℃/min | 80℃/min |
| Heat dissipation level | 1 | 2 | 3 | 4 | 5 |
TABLE 3 Heat dissipation levels at ambient temperature of thirty degrees Celsius
| Real time temperature | 35℃ | 40℃ | 50℃ | 55℃ | 65℃ |
| Heat dissipation level | 1 | 2 | 3 | 4 | 5 |
| Rate of temperature rise | 10℃/min | 20℃/min | 35℃/min | 40℃/min | 60℃/min |
| Heat dissipation level | 1 | 2 | 3 | 4 | 5 |
Claims (3)
1. A heat dissipation method based on real-time temperature and temperature rise rate is used for dissipating heat of a system using an IGBT and comprises the following steps:
the method comprises the following steps: the temperature of the system when the system reaches a steady state under different working conditions is different due to the change of the environmental temperature, and the corresponding heat dissipation level is designed for the real-time temperature under different environmental temperatures; the heat dissipation level directly corresponds to the output power of the corresponding fan, and the output power of the fan is correspondingly improved by 20% when the heat dissipation level is increased by one;
step two: the temperature rise rates of the system at different environmental temperatures are different, and corresponding heat dissipation levels are set for the temperature rise rates at different environmental temperatures;
step three: when the system operates, the real-time temperature of the IGBT is collected, the temperature rise rate is obtained, and whether heat dissipation is needed or not is judged by combining the environment temperature and the real-time temperature;
step four: and if the heat dissipation is needed by judgment, selecting the highest heat dissipation level in the heat dissipation levels respectively corresponding to the temperature rise rate and the real-time temperature for heat dissipation.
2. The heat dissipation method based on real-time temperature and temperature rise rate according to claim 1, wherein in the first step and the second step, the common ambient temperature is divided into three levels, and the specific ambient temperature and each corresponding heat dissipation level are shown in tables 1, 2 and 3;
TABLE 1. Heat dissipation levels at ambient temperature of zero degrees Centigrade
；
TABLE 2. Heat dissipation levels at an ambient temperature of twenty degrees Celsius
；
TABLE 3 Heat dissipation levels at ambient temperature of thirty degrees Celsius
。
3. The heat dissipation method based on real-time temperature and temperature rise rate according to claim 1, wherein in the third step, in consideration of the fact that the ambient temperature does not change frequently in a short time, the slow clock is used to collect the ambient temperature once every 1 h.
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