CN114855130B - Preparation method and preparation device of chromium-coated copper composite powder with low laser reflectivity - Google Patents
Preparation method and preparation device of chromium-coated copper composite powder with low laser reflectivity Download PDFInfo
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- CN114855130B CN114855130B CN202210457247.0A CN202210457247A CN114855130B CN 114855130 B CN114855130 B CN 114855130B CN 202210457247 A CN202210457247 A CN 202210457247A CN 114855130 B CN114855130 B CN 114855130B
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 74
- 239000011651 chromium Substances 0.000 title claims abstract description 59
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 42
- 239000010949 copper Substances 0.000 title claims abstract description 42
- 239000000843 powder Substances 0.000 title claims abstract description 35
- 239000002131 composite material Substances 0.000 title claims abstract description 32
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 title claims abstract description 28
- 229910052804 chromium Inorganic materials 0.000 title claims abstract description 28
- 238000002360 preparation method Methods 0.000 title claims abstract description 21
- 238000002310 reflectometry Methods 0.000 title claims abstract description 21
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims abstract description 68
- 229910052786 argon Inorganic materials 0.000 claims abstract description 35
- 238000004544 sputter deposition Methods 0.000 claims abstract description 33
- 238000010438 heat treatment Methods 0.000 claims abstract description 17
- 238000003756 stirring Methods 0.000 claims abstract description 16
- 230000007246 mechanism Effects 0.000 claims abstract description 10
- 238000009826 distribution Methods 0.000 claims abstract description 9
- 239000007789 gas Substances 0.000 claims description 22
- 239000002245 particle Substances 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 15
- 239000010410 layer Substances 0.000 claims description 13
- 230000009471 action Effects 0.000 claims description 12
- 239000011259 mixed solution Substances 0.000 claims description 7
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 claims description 6
- 235000011114 ammonium hydroxide Nutrition 0.000 claims description 6
- BFNBIHQBYMNNAN-UHFFFAOYSA-N ammonium sulfate Chemical compound N.N.OS(O)(=O)=O BFNBIHQBYMNNAN-UHFFFAOYSA-N 0.000 claims description 6
- 229910052921 ammonium sulfate Inorganic materials 0.000 claims description 6
- 235000011130 ammonium sulphate Nutrition 0.000 claims description 6
- 238000000151 deposition Methods 0.000 claims description 6
- 230000008021 deposition Effects 0.000 claims description 6
- 239000012153 distilled water Substances 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- 238000006243 chemical reaction Methods 0.000 claims description 5
- 238000009413 insulation Methods 0.000 claims description 4
- 238000012216 screening Methods 0.000 claims description 4
- 239000013077 target material Substances 0.000 claims description 3
- 239000011241 protective layer Substances 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 abstract description 10
- 238000000576 coating method Methods 0.000 abstract description 10
- 230000007547 defect Effects 0.000 abstract description 4
- 238000012423 maintenance Methods 0.000 abstract description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 5
- 230000005684 electric field Effects 0.000 description 4
- 150000002500 ions Chemical class 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 239000000654 additive Substances 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000021715 photosynthesis, light harvesting Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
- C23C14/021—Cleaning or etching treatments
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/25—Process efficiency
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Powder Metallurgy (AREA)
Abstract
The invention discloses a preparation method and a preparation device of chromium-coated copper composite powder with low laser reflectivity, wherein the preparation method comprises a fluidized bed, a sputtering chamber communicated with the inside of the fluidized bed is connected to the bottom of the fluidized bed, an airflow distribution plate is arranged between the fluidized bed and the sputtering chamber, a target emitter is arranged in the sputtering chamber, an argon source component is connected to the bottom of the sputtering chamber, a stirring mechanism is arranged in the fluidized bed, a heating device is arranged on the side wall of the fluidized bed, and an exhaust port is arranged at the top of the fluidized bed. According to the invention, the chromium-coated copper composite powder is prepared by adopting the double functions of a fluidized bed and a sputtering method, so that the defects of easy falling off, poor adhesion and the like of a coating easily occurring in the traditional coating preparation method are overcome, the compact chromium-coated copper composite powder is obtained, and the equipment is simple and easy to maintain in subsequent maintenance.
Description
Technical Field
The invention belongs to the field of metal powder coating, and particularly relates to a preparation method and a preparation device of chromium-coated copper composite powder with low laser reflectivity.
Background
The Selective Laser Melting (SLM) technology has been developed for forming and applying iron-based alloys, titanium alloys, aluminum alloys, and the like. However, for copper materials, the high reflectivity of pure copper to 1064nm wavelength (the wavelength of laser commonly used in SLM devices) laser and its excellent thermal conductivity, and the high energy dissipation capability during SLM molding, make it difficult to process pure copper using SLM technology. The method for reducing the reflectivity of the copper alloy powder to the laser is a direct means for solving the problem, and the coating of the alloy coating with low reflectivity on the surface of pure copper can ensure the alloy powder to be fully melted, so that the copper alloy part with high density is formed. Therefore, the development of a pure copper powder coated low-reflectivity coating is the most direct solution for manufacturing and forming high-density copper alloy by laser additive, is also an important research direction for promoting the application and development of the copper alloy in the aspect of complex structural parts, and the prior art cannot solve the problem.
Disclosure of Invention
In order to overcome the defects and the existing problems in the prior art, the invention provides a preparation method and a preparation device of the chromium-copper-clad composite powder with low laser reflectivity, which can prepare the chromium-copper-clad composite powder with low laser reflectivity and solve the difficulty of processing pure copper by an SLM technology.
The invention is realized by the following technical scheme:
the preparation method of the chromium-coated copper composite powder with low laser reflectivity comprises the following steps: s1, putting pure copper powder into a mixed solution prepared from ammonium sulfate, ammonia water and distilled water, and uniformly stirring until an oxide layer on the surface of the pure copper powder is removed; s2, placing the pure copper powder with the oxide layer removed in a fluidized bed, continuously introducing argon to exhaust air in the fluidized bed, and heating the fluidized bed to a temperature range of 300-400 ℃; s3, a target generator is positioned between the argon gas inlet and the fluidized bed, a Cr target is arranged on the target emitter, and the Cr target generates a sputtering phenomenon under the action of electrons and argon gas; s4, cr particles which are sputtered and overflowed by the Cr target enter the fluidized bed under the action of a magnetic field and argon, and the pure copper powder is stirred, and the Cr particles and the pure copper powder undergo a deposition reaction to form the chromium-coated copper composite powder.
The step S1 is preceded by a step S0 of screening the pure copper powder to obtain the pure copper powder with the particle size of 15-53 mu m.
And the mass ratio of the ammonium sulfate, the ammonia water and the distilled water of the mixed solution in the step S1 is 5:10:100.
The thickness of the Cr layer of the chromium-coated copper composite powder is not less than 30nm.
The invention is also realized by the following technical scheme:
the preparation device of the chromium-coated copper composite powder with the low laser reflectivity comprises a fluidized bed, wherein a sputtering chamber communicated with the inside of the fluidized bed is connected to the bottom of the fluidized bed, an air flow distribution plate is arranged between the fluidized bed and the sputtering chamber, a target material emitter is arranged in the sputtering chamber, an argon source component is connected to the bottom of the sputtering chamber, a stirring mechanism is arranged in the fluidized bed, a heating device is arranged on the side wall of the fluidized bed, and an exhaust port is arranged at the top of the fluidized bed.
The target emitter comprises a polar plate and a copper back plate, a magnet group is arranged between the polar plate and the copper back plate, and the polar plate is connected with a power supply.
The air flow distribution plate is uniformly provided with a plurality of air flow holes, and the aperture of each air flow hole is smaller than 15 mu m.
The heating device comprises a heating ring wound on the outer wall of the fluidized bed, and a heat insulation protective layer is arranged outside the heating ring.
The argon gas source assembly comprises an argon gas bottle, the argon gas bottle is connected to the bottom of the sputtering chamber through an air supply pipe, and a rotameter is arranged on the air supply pipe.
The stirring mechanism is connected with a grounding wire.
According to the invention, the chromium-coated copper composite powder is prepared by adopting the double functions of the fluidized bed and the sputtering method, so that the defects that a coating is easy to fall off, poor in adhesion and the like easily caused by the traditional coating preparation method are overcome, the chromium-coated copper composite powder with compact combination is obtained, the equipment is simple, the subsequent maintenance is easy, the laser absorptivity of the obtained chromium-coated copper composite powder can be effectively improved, the full melting and forming in the laser additive manufacturing process are ensured, and the application and development of copper alloy in the aspect of complex structural parts are promoted.
Drawings
FIG. 1 is a flow chart of a preparation method of the present invention;
FIG. 2 is a schematic structural view of the production apparatus of the present invention;
fig. 3 is a schematic diagram of the structure of a target emitter according to the present invention.
In the figure: 1-fluidized bed, 11-exhaust port, 2-sputtering chamber, 3-gas flow distribution plate, 4-argon source component, 41-argon bottle, 42-gas supply pipe, 43-rotameter, 5-target emitter, 51-polar plate, 52-copper back plate, 53-magnet group, 6-stirring mechanism, 7-heating device, 8-pure copper powder and 9-Cr target.
Detailed Description
The present invention will be described in further detail below with reference to the drawings and specific embodiments for the understanding of those skilled in the art.
Example 1
As shown in fig. 1, the preparation method of the chromium-coated copper composite powder with low laser reflectivity comprises the following steps:
s0, screening the pure copper powder, and screening out the pure copper powder with the particle size of 15-53 mu m, wherein the pure copper powder with the particle size is a common specification for additive manufacturing.
S1, placing pure copper powder into a mixed solution prepared from ammonium sulfate, ammonia water and distilled water, uniformly stirring, and removing surface oxides after oxide layers on the surface of the pure copper powder are removed, so that subsequent treatment is facilitated. Preferably, the mass ratio of the ammonium sulfate, the ammonia water and the distilled water of the mixed solution is 5:10:100, and the mixed solution can efficiently remove the oxide layer on the surface of the pure copper powder.
S2, placing the pure copper powder with the oxide layer removed in a fluidized bed, and continuously introducing argon to exhaust air in the fluidized bed, so that the effect of deposition is prevented from being influenced by residual air in the fluidized bed. The temperature of the fluidized bed is heated to be within the temperature range of 300-400 ℃, and the temperature environment is favorable for fully carrying out deposition reaction on the pure copper powder and Cr particles in the later stage, so that the quality of the chromium-coated copper composite powder is ensured.
S3, a target generator is positioned between the argon gas inlet and the fluidized bed, a Cr target is arranged on the target emitter, and the Cr target generates a sputtering phenomenon under the action of electrons and argon gas.
S4, cr particles overflowing during sputtering generated by the Cr target enter the fluidized bed under the action of a magnetic field and argon, the Cr particles and the pure copper powder are stirred to perform deposition reaction to form chromium-coated copper composite powder, the stirring of the pure copper powder can promote the pure copper powder to uniformly contact with the Cr particles, the thickness of Cr is uniform, and the thickness of a Cr layer of the chromium-coated copper composite powder is not less than 30nm.
The chromium-copper-clad composite powder is prepared by adopting the double functions of a fluidized bed and a sputtering method, so that the defects that the coating is easy to fall off, poor in adhesion and the like easily occurring in the traditional coating preparation method are overcome, and the compact-combination chromium-copper-clad composite powder is obtained.
Example two
As shown in fig. 2 and 3, a preparation device of chromium-coated copper composite powder with low laser reflectivity comprises a fluidized bed 1, wherein a sputtering chamber 2 communicated with the inside of the fluidized bed 1 is connected to the bottom of the fluidized bed 1, and pure copper powder 8 is placed in the fluidized bed 1. An air flow distribution plate 3 is arranged between the fluidized bed 1 and the sputtering chamber 2, a plurality of air flow holes are uniformly distributed on the air flow distribution plate 3, the aperture of each air flow hole is smaller than 15 mu m, pure copper powder can be prevented from falling into the sputtering chamber 2 by the aid of the arrangement of the air flow distribution plate 3, and air and particles in the sputtering chamber 2 can be guaranteed to enter the fluidized bed 1.
The sputtering chamber 2 is provided with a target emitter 5, and a Cr target 9 is arranged on the target emitter 5, so that the Cr target can generate sputtering reaction to overflow Cr particles. The bottom of the sputtering chamber 2 is connected with an argon source component 4, and the argon source component 4 can continuously introduce argon into the sputtering chamber 2. The target emitter 5 comprises a polar plate 51 and a copper back plate 52, a magnet group 53 is arranged between the polar plate 51 and the copper back plate 52, and the polar plate 51 is connected with a power supply. The argon gas source assembly 4 comprises an argon gas bottle 41, the argon gas bottle 41 is connected to the bottom of the sputtering chamber 2 through a gas supply pipe 42, and a rotameter 43 is arranged on the gas supply pipe 42, so that the structure is convenient for adjusting the amount of argon gas. The Cr target is placed on the copper backboard 52, electrons do swing motion under the combined action of an electric field and magnetic field force, and collide with working gas argon in the motion process, so that positive ions are decomposed, under the action of the electric field, the positive ions bombard the surface of the Cr target, atoms in the Cr target obtain energy and are in cascade collision, when the energy of atom aggregation exceeds the atom bonding energy, cr target atoms can escape from the surface of the target, a sputtering phenomenon is generated, and sputtered and overflowed Cr particles enter the fluidized bed 1 under the action of the magnetic field and the argon.
The fluidized bed 1 is internally provided with a stirring mechanism 6, and the stirring mechanism 6 is connected with a grounding wire. The stirring mechanism 6 is used for stirring the pure copper powder 8 in the fluidized bed 1. The side wall of the fluidized bed 1 is provided with a heating device 7, the heating device 7 comprises a heating ring wound on the outer wall of the fluidized bed, a heat insulation protection layer is arranged outside the heating ring, the heat insulation protection layer can prevent operators from being scalded, and the heating effect can be improved. The top of the fluidized bed 1 is provided with an exhaust port 11 for exhaust.
The working process comprises the following steps: firstly, pure copper powder 8 with an oxide layer removed is placed in a fluidized bed 1, a Cr target 9 is placed on a copper back plate 52, an argon bottle 41 is started, proper flow is regulated through a rotameter 43, air in the fluidized bed 1 is emptied, a target emitter 5 is powered on, electrons do swing motion under the combined action of an electric field and magnetic field force, and collide with argon serving as working gas in the motion process, so that positive ions are decomposed, the positive ions bombard the surface of the Cr target 9 under the action of the electric field, atoms in the Cr target 9 obtain energy and are in cascade collision, when the energy accumulated by the atoms exceeds the atomic bonding energy, cr target atoms can escape from the surface of the target to generate a sputtering phenomenon, sputtered and overflowed Cr particles enter the fluidized bed 1 under the action of the magnetic field and argon, and a stirring mechanism 6 continuously stirs the pure copper powder 8, and Cr particles entering the fluidized bed 1 react with the pure copper powder 8 in a deposition way to form chromium-coated copper composite powder.
The above embodiments are preferred embodiments of the present invention, and are not intended to limit the present invention, and any obvious substitutions are within the scope of the present invention without departing from the inventive concept of the present invention.
Claims (7)
1. The preparation method of the chromium-coated copper composite powder with low laser reflectivity comprises the following steps:
s1, putting pure copper powder into a mixed solution prepared from ammonium sulfate, ammonia water and distilled water, and uniformly stirring until an oxide layer on the surface of the pure copper powder is removed;
s2, placing the pure copper powder with the oxide layer removed in a fluidized bed, continuously introducing argon to exhaust air in the fluidized bed, and heating the fluidized bed to a temperature range of 300-400 ℃;
s3, a target generator is positioned between the argon gas inlet and the fluidized bed, a Cr target is arranged on the target emitter, and the Cr target generates a sputtering phenomenon under the action of electrons and argon gas;
s4, cr particles which are sputtered and overflowed by the Cr target enter a fluidized bed under the action of a magnetic field and argon, and the pure copper powder is stirred, and the Cr particles and the pure copper powder undergo a deposition reaction to form chromium-coated copper composite powder;
the preparation device used by the method comprises a fluidized bed and is characterized in that: the bottom of the fluidized bed is connected with a sputtering chamber communicated with the inside of the fluidized bed, an airflow distribution plate is arranged between the fluidized bed and the sputtering chamber, a target material emitter is arranged in the sputtering chamber, the bottom of the sputtering chamber is connected with an argon source assembly, a stirring mechanism is arranged in the fluidized bed, a heating device is arranged on the side wall of the fluidized bed, and an exhaust port is arranged at the top of the fluidized bed;
the target material emitter comprises a polar plate and a copper back plate, a magnet group is arranged between the polar plate and the copper back plate, and the polar plate is connected with a power supply;
the air flow distribution plate is uniformly provided with a plurality of air flow holes, and the aperture of each air flow hole is smaller than 15 mu m.
2. The method for preparing the chromium-coated copper composite powder with low laser reflectivity according to claim 1, which is characterized in that: the step S1 is preceded by a step S0 of screening the pure copper powder to obtain the pure copper powder with the particle size of 15-53 mu m.
3. The method for preparing the chromium-coated copper composite powder with low laser reflectivity according to claim 2, which is characterized in that: and the mass ratio of the ammonium sulfate, the ammonia water and the distilled water of the mixed solution in the step S1 is 5:10:100.
4. The method for preparing the chromium-coated copper composite powder with low laser reflectivity according to claim 3, wherein the method comprises the following steps: the thickness of the Cr layer of the chromium-coated copper composite powder is not less than 30nm.
5. The method for preparing the chromium-coated copper composite powder with low laser reflectivity according to claim 1, which is characterized in that: the heating device comprises a heating ring wound on the outer wall of the fluidized bed, and a heat insulation protective layer is arranged outside the heating ring.
6. The method for preparing the chromium-coated copper composite powder with low laser reflectivity according to claim 5, wherein the method comprises the following steps: the argon gas source assembly comprises an argon gas bottle, the argon gas bottle is connected to the bottom of the sputtering chamber through an air supply pipe, and a rotameter is arranged on the air supply pipe.
7. The method for preparing the chromium-coated copper composite powder with low laser reflectivity according to claim 6, wherein the method comprises the following steps: the stirring mechanism is connected with a grounding wire.
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