CN114842757B - display screen - Google Patents
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- CN114842757B CN114842757B CN202210409244.XA CN202210409244A CN114842757B CN 114842757 B CN114842757 B CN 114842757B CN 202210409244 A CN202210409244 A CN 202210409244A CN 114842757 B CN114842757 B CN 114842757B
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/302—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements characterised by the form or geometrical disposition of the individual elements
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Abstract
The embodiment of the application discloses a display screen, which comprises: the device comprises a first substrate, at least two second substrates and a seam eliminating structure layer; the at least two second substrates are spliced and arranged on the first substrate; gaps exist between adjacent second substrates; the second substrate comprises a plurality of transparent film layers which are stacked; the gap eliminating structural layer fills gaps; the seam eliminating structure layer comprises at least two seam eliminating layers which are arranged in a layer-by-layer manner; a seam eliminating layer is correspondingly connected with at least one transparent film layer. In the seam eliminating layer and the transparent film layer connected with the seam eliminating layer, the complex refractive index of the seam eliminating layer is the same as that of a transparent film layer; in the display screen structure, in the gap eliminating layer and the transparent film layer connected with the gap eliminating layer, the complex refractive index of the gap eliminating layer is the same as that of the transparent film layer, so that gaps between the spliced second substrates can be eliminated visually, and large-size edge-seam-free display is realized.
Description
Technical Field
The application relates to the technical field of display, in particular to a display screen.
Background
The display technology is to splice small-size display screens into large-size display screens, and development and perfection of the technology are of great importance. At present, the problem that gaps among screens are difficult to eliminate still exists in display screen splicing. The gap for splicing the large-size screen not only can cut the whole image, but also is easy to misunderstand as a part of the image, and even misjudgment can be generated in high-end monitoring. How to eliminate gaps has been a hotspot explored by those skilled in the art of large-size tiled displays.
In the course of research and practice of the prior art, the inventors of the present application have found that it is important for the splice display of the crack elimination technique whether the optical properties of the crack-eliminating material and the film layer are consistent, which affects the light extraction efficiency. As can be seen from the equation n=n+ik, the complex refractive index N of the material is determined by both the real-part refractive index N and the imaginary-part extinction coefficient k. In the prior art, the optical glue with the same material is generally used for caulking, the optical glue with single optical characteristic cannot enable the optical path of each film layer of two spliced screens to be consistent, the variation difference between the optical path of light passing through the slit and the optical path of light passing through the screen is too large, the light is easily captured by human eyes, and the slit cannot be completely eliminated.
Disclosure of Invention
The embodiment of the application provides a display screen which can visually improve the display effect of eliminating seams.
An embodiment of the present application provides a display screen, including:
a first substrate;
at least two second substrates are spliced on the first substrate; a gap exists between the adjacent second substrates; the second substrate comprises a plurality of transparent film layers which are stacked;
the seam eliminating structure layer fills the gaps; the seam eliminating structure layer comprises at least two seam eliminating layers which are arranged in a layer-by-layer manner; one of the seam eliminating layers is correspondingly connected with at least one transparent film layer;
In the crack eliminating layer and the transparent film layer connected with the crack eliminating layer, the complex refractive index of the crack eliminating layer is the same as that of one transparent film layer.
Alternatively, in some embodiments of the present application, in the seam eliminating layer and the transparent film layer connected thereto, the refractive index and the extinction coefficient of the seam eliminating layer are the same as those of one of the transparent film layers.
Optionally, in some embodiments of the application, the deglitch layer includes a bulk film layer and transparent nanoparticles doped within the bulk film layer.
Optionally, in some embodiments of the present application, the number of the seam eliminating layers is the same as the number of the transparent film layers, and a thickness of the seam eliminating layers is equal to a thickness of the transparent film layers.
Optionally, in some embodiments of the application, the plurality of transparent film layers includes a substrate layer, an array inorganic layer, an array organic layer, a first encapsulation layer, a second encapsulation layer, and a third encapsulation layer; in the thickness direction of the display screen, the substrate layer, the array inorganic layer, the array organic layer, the first packaging layer, the second packaging layer and the third packaging layer are sequentially stacked;
The seam eliminating layer is connected with at least one of the substrate layer, the array inorganic layer, the array organic layer, the first packaging layer, the second packaging layer and the third packaging layer.
Optionally, in some embodiments of the present application, the number of the seam-eliminating layers is two, and the two seam-eliminating layers are a first seam-eliminating layer and a second seam-eliminating layer, and the first seam-eliminating layer is connected to the substrate layer, the array inorganic layer and the array organic layer; the second seam eliminating layer is connected to the first packaging layer, the second packaging layer and the third packaging layer.
Optionally, in some embodiments of the present application, the number of the seam-eliminating layers is three, and the three seam-eliminating layers are a first seam-eliminating layer, a second seam-eliminating layer and a third seam-eliminating layer, where the first seam-eliminating layer is connected to the substrate layer, and the second seam-eliminating layer is connected to the array inorganic layer and the array organic layer; the third seam eliminating layer is connected to the first packaging layer, the second packaging layer and the third packaging layer.
Optionally, in some embodiments of the present application, the number of the seam-eliminating layers is six, and the six seam-eliminating layers are a first seam-eliminating layer, a second seam-eliminating layer, a third seam-eliminating layer, a fourth seam-eliminating layer, a fifth seam-eliminating layer, and a sixth seam-eliminating layer; the first seam eliminating layer is connected with the substrate layer, the second seam eliminating layer is connected with the array inorganic layer, and the third seam eliminating layer is connected with the array organic layer; the fourth seam eliminating layer is connected to the first packaging layer, the fifth seam eliminating layer is connected to the second packaging layer, and the sixth seam eliminating layer is connected to the third packaging layer.
Optionally, in some embodiments of the present application, the first substrate includes a base, a driving functional layer disposed on the base, and a first conductive pad disposed on the driving functional layer;
the second substrate further comprises a second conductive pad, the second conductive pad is arranged on one side, close to the first substrate, of the substrate layer, and the first conductive pad and the second conductive pad are in binding connection.
Optionally, in some embodiments of the present application, the display screen further includes an adhesive, a gap is formed between the first substrate and the second substrate, and the adhesive is filled in the gap and connected to the first substrate and the second substrate; the seam eliminating structure layer is arranged on the adhesive.
In the embodiment of the application, the complex refractive index of the crack eliminating layer is the same as that of the transparent film layer in the crack eliminating layer and the transparent film layer connected with the crack eliminating layer in the display screen structure, so that the gap between the second substrates can be eliminated visually, and the display of large-size edge-free cracks is realized.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a display screen according to a first embodiment of the present application;
FIG. 2 is a schematic top view of a display screen according to the present application;
FIG. 3 is a schematic view of a first substrate structure according to the present application;
FIG. 4 is a schematic view of a second substrate structure according to the present application;
FIG. 5 is a schematic view of an optical path at a slit, a is a schematic view of an optical path without a slit eliminating structure layer, and b is a schematic view of an optical path with a slit eliminating structure layer added;
fig. 6 is a schematic structural diagram of a display screen according to a second embodiment of the present application;
fig. 7 is a schematic structural diagram of a display screen according to a third embodiment of the present application;
fig. 8 is a schematic structural diagram of a display screen according to a fourth embodiment of the present application;
fig. 9 is a schematic structural diagram of a display screen according to a fifth embodiment of the present application.
Reference numerals illustrate:
the display panel 200, the first substrate 10, the second substrate 20, the slit 30, the slit structure layer 40, the nano particles 401, the filler 402, the first slit layer 411/421/431/441/451, the second slit layer 412/422/432/442/452, the third slit layer 423/433/453, the fourth slit layer 434/454, the fifth slit layer 435/455, the sixth slit layer 436/456, the transparent film layer 21, the substrate layer 211, the array inorganic layer 212, the array organic layer 213, the first encapsulation layer 214, the second encapsulation layer 215, the third encapsulation layer 216, the driving chip 13, the substrate 11, the driving function layer 12, the first conductive pad 14, the second conductive pad 22, the adhesive 50, and the gap 60.
Detailed Description
The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to fall within the scope of the application. Furthermore, it should be understood that the detailed description is presented herein for purposes of illustration and description only, and is not intended to limit the application. In the present application, unless otherwise indicated, terms of orientation such as "upper" and "lower" are used to generally refer to the upper and lower positions of the device in actual use or operation, and specifically the orientation of the drawing figures; while "inner" and "outer" are for the outline of the device.
An embodiment of the present application provides a display screen 200, which will be described in detail below. The following description of the embodiments is not intended to limit the preferred embodiments.
Embodiment 1,
Referring to fig. 1, 2, 3 and 4, an embodiment of the present application provides a display screen 200, including: a first substrate 10, at least two second substrates 20, and a seam-eliminating structural layer 40. At least two second substrates 20 are disposed on the first substrate 10 in a spliced manner. A gap 30 exists between adjacent second substrates 20. The second substrate 20 includes a transparent film layer 21 in a multilayer stack arrangement. The seam-eliminating structural layer 40 fills the seam 30. The seam-eliminating structure layer 40 includes at least two seam-eliminating layers disposed one upon the other. A seam eliminating layer is correspondingly connected with at least one transparent film layer. In the seam eliminating layer and the transparent film layer connected with the seam eliminating layer, the complex refractive index of the seam eliminating layer is the same as that of a transparent film layer.
Referring to fig. 5, it can be understood that in the present embodiment, in the seam eliminating layer and the transparent film layer connected thereto, the complex refractive index of the seam eliminating layer is the same as that of the transparent film layer, so that the gap 30 between the spliced second substrates 20 can be visually eliminated, and a large-size display without edge seams can be realized.
Alternatively, in this embodiment, in the seam eliminating layer and the transparent film layer connected thereto, the refractive index and the extinction coefficient of the seam eliminating layer are the same as those of a transparent film layer.
It can be understood that, in this embodiment, the refractive index and the extinction coefficient of the slit eliminating layer are the same as those of a transparent film layer, so that the optical path of the original light is not changed as much as possible, and the light emitting effect of the slit 30 matched with the display screen 200 is achieved. It will be appreciated that the materials of the seam eliminating layer include: one or more of acrylic, organosilicon, epoxy resin or polyurethane. It will be appreciated that in some embodiments, the material of the crack-eliminating layer may be the same as the material of the corresponding transparent film layer.
Optionally, in this embodiment, the crack-eliminating layer includes a bulk film layer and transparent nanoparticles 401, and the nanoparticles 401 are doped in the bulk film layer.
It will be appreciated that in this embodiment, the material of the crack removing layer has its inherent refractive index, and the purpose of adjusting the refractive index of the crack removing layer is achieved by doping transparent nanoparticles 401 in the bulk film layer to change the refractive index of the crack removing layer. The nanoparticle 401 includes: silica, silicon carbide, hydroxyapatite or barium titanate.
Optionally, the material of the seam eliminating layer may further include a matting material mixed in the bulk film layer. The matting material may be a pigment or an ink.
Alternatively, in some embodiments, the seam-eliminating layer may also include only the bulk film layer.
Alternatively, in the present embodiment, the multilayer transparent film layer 21 includes a substrate layer 211, an array inorganic layer 212, an array organic layer 213, a first encapsulation layer 214, a second encapsulation layer 215, and a third encapsulation layer 216. In the thickness direction of the display panel 200, a substrate layer 211, an array inorganic layer 212, an array organic layer 213, a first encapsulation layer 214, a second encapsulation layer 215, and a third encapsulation layer 216 are sequentially stacked. A crack removing layer connects at least one of the substrate layer 211, the array inorganic layer 212, the array organic layer 213, the first encapsulation layer 214, the second encapsulation layer 215, and the third encapsulation layer 216.
It is understood that when a crack removing layer is connected to at least one of the substrate layer 211, the array inorganic layer 212, the array organic layer 213, the first encapsulation layer 214, the second encapsulation layer 215, and the third encapsulation layer 216, an optical path of the transparent film layer connected to the crack removing layer can be implemented without being changed. In this embodiment, the first substrate 10 further includes a thin film transistor (not shown in the drawings). The array inorganic layer 212 covers the thin film transistors. The material of the array organic layer 213 is organic photoresist, and the array organic layer 213 includes a spacer, a pixel defining layer and a planarization layer. The material of the substrate layer 211 includes polyimide, polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyethersulfone, or polyarylate. The material of the array inorganic layer 212 includes silicon nitride or silicon oxide. The material of the first encapsulation layer 214 includes silicon oxynitride, silicon nitride, silicon oxide, aluminum oxide, or terbium oxide. The materials of the second encapsulation layer 215 include: polyacrylate, high density polyethylene, polypropylene, polystyrene, polyethylene terephthalate, polyethersulfone or polyimide. The materials of the third encapsulation layer 216 include: silicon oxynitride, silicon nitride, silicon oxide, aluminum oxide, or terbium oxide.
The number of the seam eliminating layers is two, the two seam eliminating layers are a first seam eliminating layer 411 and a second seam eliminating layer 412, and the first seam eliminating layer 411 is connected with the substrate layer 211, the array inorganic layer 212 and the array organic layer 213; the second crack stop layer 412 is connected to the first encapsulation layer 214, the second encapsulation layer 215, and the third encapsulation layer 216.
It will be appreciated that in this embodiment, two seam eliminating layers are used to achieve the light emitting effect of the seam 30 matching the display screen 200. In this embodiment, the first seam eliminating layer 411 is connected with the substrate layer 211, the array inorganic layer 212 and the array organic layer 213 at the same time, and the second seam eliminating layer 412 is connected with the first packaging layer 214, the second packaging layer 215 and the third packaging layer 216 at the same time, so as to reduce the manufacturing difficulty of the seam eliminating layer and save the process. It can be understood that the extinction coefficient is also affected by the thickness of the film layer, so that adjusting the thickness of the seam eliminating layer can also play a role in adjusting the extinction coefficient, and the selection range of materials is further enlarged.
Wherein the refractive index of the first slit layer 411 is equal to the refractive index of one of the substrate layer 211, the array inorganic layer 212, and the array organic layer 213, and the extinction coefficient of the first slit layer 411 is also equal to the extinction coefficient of the same one of the substrate layer 211, the array inorganic layer 212, and the array organic layer 213. For example, the refractive index of the first crack removing layer 411 is equal to the refractive index of the substrate layer 211, and the extinction coefficient of the first crack removing layer 411 is equal to the extinction coefficient of the substrate layer 211.
The refractive index of the second crack removing layer 412 is equal to the refractive index of one of the first, second and third encapsulation layers 214, 215 and 216, and the extinction coefficient of the second crack removing layer 412 is also equal to the extinction coefficient of the same one of the first, second and third encapsulation layers 214, 215 and 216. For example, the refractive index of the second crack stop layer 412 is equal to the refractive index of the first encapsulation layer 214, and the extinction coefficient of the second crack stop layer 412 is equal to the extinction coefficient of the first encapsulation layer 214.
Optionally, the thickness of the first crack removing layer 411 is equal to the sum of the thicknesses of the substrate layer 211, the array inorganic layer 212, and the array organic layer 213. The thickness of the second crack removing layer 412 is equal to the sum of the thicknesses of the first encapsulation layer 214, the second encapsulation layer 215, and the third encapsulation layer 216.
Alternatively, in the present embodiment, the first substrate 10 includes a base 11, a driving functional layer 12, and a first conductive pad 14, the driving functional layer 12 is disposed on the base 11, and the first conductive pad 14 is disposed on the driving functional layer 12. The second substrate 20 further includes a second conductive pad 22, where the second conductive pad 22 is disposed on a side of the substrate layer 211 near the first substrate 10, and the first conductive pad 14 is bonded to the second conductive pad 22.
It will be appreciated that in this embodiment, the second conductive pad 22 is electrically connected to the thin film transistor. The first substrate 10 further includes a driving chip 13 disposed in the frame region.
Optionally, in some embodiments of the present application, the display screen 200 further includes an adhesive paste 50, a gap 60 is formed between the first substrate 10 and the second substrate 20, and the adhesive paste 50 is filled in the gap 60 and connected to the first substrate 10 and the second substrate 20; the seam-eliminating structure layer 40 is disposed on the adhesive 50.
It will be appreciated that in the present embodiment, the adhesive paste 50 may function to fix the first substrate 10 and the second substrate 20. In some embodiments, the effect of the display screen 200 against water and oxygen can be further improved by doping the adhesive 50 with a desiccant.
Embodiment II,
Referring to fig. 2, 3, 4 and 6, an embodiment of the present application provides a display screen 200, including: a first substrate 10, at least two second substrates 20, and a seam-eliminating structural layer 40. At least two second substrates 20 are disposed on the first substrate 10 in a spliced manner. A gap 30 exists between adjacent second substrates 20. The second substrate 20 includes a transparent film layer 21 in a multilayer stack arrangement. The seam-eliminating structural layer 40 fills the seam 30. The seam-eliminating structure layer 40 includes at least two seam-eliminating layers disposed one upon the other. A seam eliminating layer is correspondingly connected with at least one transparent film layer. In the seam eliminating layer and the transparent film layer connected with the seam eliminating layer, the complex refractive index of the seam eliminating layer is the same as that of a transparent film layer.
Referring to fig. 5, it can be understood that in the present embodiment, in the structure of the display screen 200, in the seam eliminating layer and the transparent film layer connected thereto, the complex refractive index of the seam eliminating layer is the same as that of the transparent film layer, so that the gap 30 between the spliced second substrates 20 can be eliminated visually, and a large-size display without side seams can be realized.
Alternatively, in this embodiment, in the seam eliminating layer and the transparent film layer connected thereto, the refractive index and the extinction coefficient of the seam eliminating layer are the same as those of a transparent film layer.
It can be understood that, in this embodiment, the refractive index and the extinction coefficient of the slit eliminating layer are the same as those of a transparent film layer, so that the optical path of the original light is not changed as much as possible, and the light emitting effect of the slit 30 matched with the display screen 200 is achieved. It will be appreciated that the materials of the seam eliminating layer include: one or more of acrylic, organosilicon, epoxy resin or polyurethane. It will be appreciated that in some embodiments, the material of the crack-eliminating layer may be the same as the material of the corresponding transparent film layer.
Optionally, in this embodiment, the crack-eliminating layer includes a bulk film layer and transparent nanoparticles 401, and the nanoparticles 401 are doped in the bulk film layer.
It will be appreciated that in this embodiment, the material of the crack removing layer has its inherent refractive index, and the purpose of adjusting the refractive index of the crack removing layer is achieved by doping transparent nanoparticles 401 in the bulk film layer to change the refractive index of the crack removing layer. The nanoparticle 401 includes: silica, silicon carbide, hydroxyapatite or barium titanate.
Optionally, the material of the seam eliminating layer may further include a matting material mixed in the bulk film layer. The matting material may be a pigment or an ink.
Alternatively, in some embodiments, the seam-eliminating layer may also include only the bulk film layer.
Alternatively, in the present embodiment, the multilayer transparent film layer 21 includes a substrate layer 211, an array inorganic layer 212, an array organic layer 213, a first encapsulation layer 214, a second encapsulation layer 215, and a third encapsulation layer 216. In the thickness direction of the display panel 200, a substrate layer 211, an array inorganic layer 212, an array organic layer 213, a first encapsulation layer 214, a second encapsulation layer 215, and a third encapsulation layer 216 are sequentially stacked. A crack removing layer connects at least one of the substrate layer 211, the array inorganic layer 212, the array organic layer 213, the first encapsulation layer 214, the second encapsulation layer 215, and the third encapsulation layer 216.
It is understood that when a crack removing layer is connected to at least one of the substrate layer 211, the array inorganic layer 212, the array organic layer 213, the first encapsulation layer 214, the second encapsulation layer 215, and the third encapsulation layer 216, an optical path of the transparent film layer connected to the crack removing layer can be implemented without being changed. In this embodiment, the first substrate 10 further includes a thin film transistor (not shown in the drawings). The array inorganic layer 212 covers the thin film transistors. The material of the array organic layer 213 is organic photoresist, and the array organic layer 213 includes a spacer, a pixel defining layer and a planarization layer. The material of the substrate layer 211 includes polyimide, polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyethersulfone, or polyarylate. The material of the array inorganic layer 212 includes silicon nitride or silicon oxide. The material of the first encapsulation layer 214 includes silicon oxynitride, silicon nitride, silicon oxide, aluminum oxide, or terbium oxide. The materials of the second encapsulation layer 215 include: polyacrylate, high density polyethylene, polypropylene, polystyrene, polyethylene terephthalate, polyethersulfone or polyimide. The materials of the third encapsulation layer 216 include: silicon oxynitride, silicon nitride, silicon oxide, aluminum oxide, or terbium oxide.
Optionally, in some embodiments of the present application, the number of the seam-eliminating layers is three, and the three seam-eliminating layers are a first seam-eliminating layer 421, a second seam-eliminating layer 422, and a third seam-eliminating layer 423, where the first seam-eliminating layer 421 is connected to the substrate layer 211, and the second seam-eliminating layer 422 is connected to the array inorganic layer 212 and the array organic layer 213; the third crack removing layer 423 is connected to the first, second and third encapsulation layers 214, 215 and 216.
Wherein the refractive index of the first crack removing layer 421 is equal to the refractive index of the substrate layer 211; the extinction coefficient of the first crack stop layer 421 is equal to the extinction coefficient of the substrate layer 211.
The refractive index of the second crack removing layer 422 is equal to the refractive index of one of the array inorganic layer 212 and the array organic layer 213, and the extinction coefficient of the second crack removing layer 422 is also equal to the extinction coefficient of the same one of the array inorganic layer 212 and the array organic layer 213. For example, the second crack stop layer 422 is equal to the refractive index of the array inorganic layer 212, and the extinction coefficient of the second crack stop layer 422 is equal to the extinction coefficient of the array inorganic layer 212.
The refractive index of the third slit layer 423 is equal to the refractive index of one of the first, second, and third encapsulation layers 214, 215, and 216, and the extinction coefficient of the third slit layer 423 is also equal to the extinction coefficient of one of the first, second, and third encapsulation layers 214, 215, and 216. For example, the third crack removing layer 423 is equal to the refractive index of the first encapsulation layer 214, and the extinction coefficient of the third crack removing layer 423 is equal to the extinction coefficient of the first encapsulation layer 214. It can be appreciated that in this embodiment, three seam eliminating layers are adopted, so that the light emitting effect of the seam 30 matched with the display screen 200 can be further improved. It can be understood that the extinction coefficient is also affected by the thickness of the film layer, so that adjusting the thickness of the seam eliminating layer can also play a role in adjusting the extinction coefficient, and the selection range of materials is further enlarged.
Optionally, the thickness of the first crack removing layer 421 is equal to the thickness of the substrate layer 211. The thickness of the second crack removing layer 422 is equal to the sum of the thicknesses of the array inorganic layer 212 and the array organic layer 213. The thickness of the third crack removing layer 423 is equal to the sum of the thicknesses of the first encapsulation layer 214, the second encapsulation layer 215, and the third encapsulation layer 216.
Alternatively, in the present embodiment, the first substrate 10 includes a base 11, a driving functional layer 12, and a first conductive pad 14, the driving functional layer 12 is disposed on the base 11, and the first conductive pad 14 is disposed on the driving functional layer 12. The second substrate 20 further includes a second conductive pad 22, where the second conductive pad 22 is disposed on a side of the substrate layer 211 near the first substrate 10, and the first conductive pad 14 is bonded to the second conductive pad 22.
It will be appreciated that in this embodiment, the second conductive pad 22 is electrically connected to the thin film transistor. The first substrate 10 further includes a driving chip 13 disposed in the frame region.
Optionally, in some embodiments of the present application, the display screen 200 further includes an adhesive paste 50, a gap 60 is formed between the first substrate 10 and the second substrate 20, and the adhesive paste 50 is filled in the gap 60 and connected to the first substrate 10 and the second substrate 20; the seam-eliminating structure layer 40 is disposed on the adhesive 50.
It will be appreciated that in the present embodiment, the adhesive paste 50 may function to fix the first substrate 10 and the second substrate 20. In some embodiments, the effect of the display screen 200 against water and oxygen can be further improved by doping the adhesive 50 with a desiccant.
Third embodiment,
Referring to fig. 2, 3, 4 and 7, an embodiment of the present application provides a display screen 200, including: a first substrate 10, at least two second substrates 20, and a seam-eliminating structural layer 40. At least two second substrates 20 are disposed on the first substrate 10 in a spliced manner. A gap 30 exists between adjacent second substrates 20. The second substrate 20 includes a transparent film layer 21 in a multilayer stack arrangement. The seam-eliminating structural layer 40 fills the seam 30. The seam-eliminating structure layer 40 includes at least two seam-eliminating layers disposed one upon the other. A seam eliminating layer is correspondingly connected with at least one transparent film layer. In the seam eliminating layer and the transparent film layer connected with the seam eliminating layer, the complex refractive index of the seam eliminating layer is the same as that of a transparent film layer.
Referring to fig. 5, it can be understood that in the present embodiment, in the structure of the display screen 200, in the seam eliminating layer and the transparent film layer connected thereto, the complex refractive index of the seam eliminating layer is the same as that of the transparent film layer, so that the gap 30 between the spliced second substrates 20 can be eliminated visually, and a large-size display without side seams can be realized.
Alternatively, in this embodiment, in the seam eliminating layer and the transparent film layer connected thereto, the refractive index and the extinction coefficient of the seam eliminating layer are the same as those of a transparent film layer.
It can be understood that, in this embodiment, the refractive index and the extinction coefficient of the slit eliminating layer are the same as those of a transparent film layer, so that the optical path of the original light is not changed as much as possible, and the light emitting effect of the slit 30 matched with the display screen 200 is achieved. It will be appreciated that the materials of the seam eliminating layer include: one or more of acrylic, organosilicon, epoxy resin or polyurethane. It will be appreciated that in some embodiments, the material of the crack-eliminating layer may be the same as the material of the corresponding transparent film layer.
Optionally, in this embodiment, the crack-eliminating layer includes a bulk film layer and transparent nanoparticles 401, and the nanoparticles 401 are doped in the bulk film layer.
It will be appreciated that in this embodiment, the material of the crack removing layer has its inherent refractive index, and the purpose of adjusting the refractive index of the crack removing layer is achieved by doping transparent nanoparticles 401 in the bulk film layer to change the refractive index of the crack removing layer. The nanoparticle 401 includes: silica, silicon carbide, hydroxyapatite or barium titanate.
Optionally, the material of the seam eliminating layer may further include a matting material mixed in the bulk film layer. The matting material may be a pigment or an ink.
Alternatively, in some embodiments, the seam-eliminating layer may also include only the bulk film layer.
Optionally, the material of the seam eliminating layer may further include a matting material mixed in the bulk film layer. The matting material may be a pigment or an ink.
Alternatively, in some embodiments, the seam-eliminating layer may also include only the bulk film layer.
Alternatively, in the present embodiment, the multilayer transparent film layer 21 includes a substrate layer 211, an array inorganic layer 212, an array organic layer 213, a first encapsulation layer 214, a second encapsulation layer 215, and a third encapsulation layer 216. In the thickness direction of the display panel 200, a substrate layer 211, an array inorganic layer 212, an array organic layer 213, a first encapsulation layer 214, a second encapsulation layer 215, and a third encapsulation layer 216 are sequentially stacked. A crack removing layer connects at least one of the substrate layer 211, the array inorganic layer 212, the array organic layer 213, the first encapsulation layer 214, the second encapsulation layer 215, and the third encapsulation layer 216.
It is understood that when a crack removing layer is connected to at least one of the substrate layer 211, the array inorganic layer 212, the array organic layer 213, the first encapsulation layer 214, the second encapsulation layer 215, and the third encapsulation layer 216, an optical path of the transparent film layer connected to the crack removing layer can be implemented without being changed. In this embodiment, the first substrate 10 further includes a thin film transistor (not shown in the drawings). The array inorganic layer 212 covers the thin film transistors. The material of the array organic layer 213 is organic photoresist, and the array organic layer 213 includes a spacer, a pixel defining layer and a planarization layer. The material of the substrate layer 211 includes polyimide, polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyethersulfone, or polyarylate. The material of the array inorganic layer 212 includes silicon nitride or silicon oxide. The material of the first encapsulation layer 214 includes silicon oxynitride, silicon nitride, silicon oxide, aluminum oxide, or terbium oxide. The materials of the second encapsulation layer 215 include: polyacrylate, high density polyethylene, polypropylene, polystyrene, polyethylene terephthalate, polyethersulfone or polyimide. The materials of the third encapsulation layer 216 include: silicon oxynitride, silicon nitride, silicon oxide, aluminum oxide, or terbium oxide.
Optionally, in some embodiments of the present application, the number of the seam-eliminating layers is six, and the six seam-eliminating layers are a first seam-eliminating layer 431, a second seam-eliminating layer 432, a third seam-eliminating layer 433, a fourth seam-eliminating layer 434, a fifth seam-eliminating layer 435, and a sixth seam-eliminating layer 436; the first crack removing layer 431 is connected to the substrate layer 211, the second crack removing layer 432 is connected to the array inorganic layer 212, and the third crack removing layer 433 is connected to the array organic layer 213; the fourth crack stop layer 434 is connected to the first encapsulation layer 214, the fifth crack stop layer 435 is connected to the second encapsulation layer 215, and the sixth crack stop layer 436 is connected to the third encapsulation layer 216.
Optionally, the thickness of the first crack removing layer 431 is equal to the thickness of the substrate layer 211, the thickness of the second crack removing layer 432 is equal to the thickness of the array inorganic layer 212, and the thickness of the third crack removing layer 433 is equal to the thickness of the array organic layer 213; the fourth crack stop layer 434 has a thickness equal to the thickness of the first encapsulation layer 214, the fifth crack stop layer 435 has a thickness equal to the thickness of the second encapsulation layer 215, and the sixth crack stop layer 436 has a thickness equal to the thickness of the third encapsulation layer 216.
It will be appreciated that in this embodiment, six seam eliminating layers are used to maximize the light emitting effect of the seam 30 matching the display screen 200. It can be understood that the extinction coefficient is also affected by the thickness of the film layer, so that adjusting the thickness of the seam eliminating layer can also play a role in adjusting the extinction coefficient, and the selection range of materials is further enlarged.
Wherein the refractive index of the first crack layer 431 is equal to the refractive index of the substrate layer 211; the extinction coefficient of the first crack stop layer 431 is equal to the extinction coefficient of the substrate layer 211. The refractive index of the second crack stop layer 432 is equal to the refractive index of the array inorganic layer 212; the extinction coefficient of the third crack stop layer 433 is equal to the extinction coefficient of the array inorganic layer 212. The refractive index of the third slit layer 433 is equal to the refractive index of the array organic layer 213; the extinction coefficient of the third crack stop layer 433 is equal to the extinction coefficient of the array organic layer 213. The refractive index of the fourth crack stop layer 434 is equal to the refractive index of the first encapsulation layer 214; the extinction coefficient of the fourth crack stop layer 434 is equal to the extinction coefficient of the first encapsulation layer 214. The refractive index of the fifth crack stop layer 435 is equal to the refractive index of the second encapsulation layer 215; the extinction coefficient of the fifth crack stop layer 435 is equal to the extinction coefficient of the second encapsulant layer 215. The refractive index of the sixth crack stop layer 436 is equal to the refractive index of the third encapsulation layer 216; the extinction coefficient of the sixth crack stop layer 436 is equal to the extinction coefficient of the third encapsulation layer 216.
Alternatively, in the present embodiment, the first substrate 10 includes a base 11, a driving functional layer 12, and a first conductive pad 14, the driving functional layer 12 is disposed on the base 11, and the first conductive pad 14 is disposed on the driving functional layer 12. The second substrate 20 further includes a second conductive pad 22, where the second conductive pad 22 is disposed on a side of the substrate layer 211 near the first substrate 10, and the first conductive pad 14 is bonded to the second conductive pad 22.
It will be appreciated that in this embodiment, the second conductive pad 22 is electrically connected to the thin film transistor. The first substrate 10 further includes a driving chip 13 disposed in the frame region.
Optionally, in some embodiments of the present application, the display screen 200 further includes an adhesive paste 50, a gap 60 is formed between the first substrate 10 and the second substrate 20, and the adhesive paste 50 is filled in the gap 60 and connected to the first substrate 10 and the second substrate 20; the seam-eliminating structure layer 40 is disposed on the adhesive 50.
It will be appreciated that in the present embodiment, the adhesive paste 50 may function to fix the first substrate 10 and the second substrate 20. In some embodiments, the effect of the display screen 200 against water and oxygen can be further improved by doping the adhesive 50 with a desiccant.
Fourth embodiment,
Referring to fig. 2, 3, 4 and 8, an embodiment of the present application provides a display screen 200, including: a first substrate 10, at least two second substrates 20, and a seam-eliminating structural layer 40. At least two second substrates 20 are disposed on the first substrate 10 in a spliced manner. A gap 30 exists between adjacent second substrates 20. The second substrate 20 includes a transparent film layer in a multilayer stack arrangement. The seam-eliminating structural layer 40 fills the seam 30. The seam-eliminating structure layer 40 includes at least two seam-eliminating layers disposed one upon the other. A seam eliminating layer is correspondingly connected with at least one transparent film layer. In the seam eliminating layer and the transparent film layer connected with the seam eliminating layer, the complex refractive index of the seam eliminating layer is the same as that of a transparent film layer.
Referring to fig. 5, it can be understood that in the present embodiment, in the structure of the display screen 200, in the seam eliminating layer and the transparent film layer connected thereto, the complex refractive index of the seam eliminating layer is the same as that of the transparent film layer, so that the gap 30 between the spliced second substrates 20 can be eliminated visually, and a large-size display without side seams can be realized.
Alternatively, in this embodiment, in the slit removing layer and the transparent film layer connected thereto, the refractive index and the extinction coefficient of the slit removing layer are respectively different from those of a transparent film layer.
It can be understood that under the condition of ensuring that the complex refractive indexes of the crack eliminating layer and the transparent film layer connected with the crack eliminating layer are the same, the optical path of the original light can not be changed, and the light emitting effect of the matching of the crack 30 and the display screen 200 can be realized. It should be noted that: the complex refractive index of a material is determined by both the real-part refractive index and the imaginary-part extinction coefficient. Therefore, the complex refractive index of the crack eliminating layer and the connected transparent film layer can be the same by adjusting the refractive index and the extinction coefficient. It will be appreciated that the materials of the seam eliminating layer include: one or more of acrylic, organosilicon, epoxy resin or polyurethane. It will be appreciated that in some embodiments, the material of the crack-eliminating layer may be the same as the material of the corresponding transparent film layer.
Alternatively, in some embodiments of the present application, the crack-eliminating layer comprises a bulk film layer, transparent nanoparticles 401, and filler 402, the nanoparticles 401 and filler 402 being doped within the bulk film layer.
In this embodiment, by adding the nanoparticles 401 and the filler 402, the refractive index and the extinction coefficient of the seam eliminating layer are respectively changed, so that the selection of materials can be further enlarged, and the difficulty in selecting the materials and the difficulty in preparing the materials can be reduced. The nanoparticle 401 includes: silica, silicon carbide, hydroxyapatite or barium titanate. The filler 402 includes: pigments or inks.
Alternatively, in some embodiments, the seam-eliminating layer may also include only the bulk film layer.
Alternatively, in the present embodiment, the multilayer transparent film layer 21 includes a substrate layer 211, an array inorganic layer 212, an array organic layer 213, a first encapsulation layer 214, a second encapsulation layer 215, and a third encapsulation layer 216. In the thickness direction of the display panel 200, a substrate layer 211, an array inorganic layer 212, an array organic layer 213, a first encapsulation layer 214, a second encapsulation layer 215, and a third encapsulation layer 216 are sequentially stacked. A crack removing layer connects at least one of the substrate layer 211, the array inorganic layer 212, the array organic layer 213, the first encapsulation layer 214, the second encapsulation layer 215, and the third encapsulation layer 216.
It is understood that when a crack removing layer is connected to at least one of the substrate layer 211, the array inorganic layer 212, the array organic layer 213, the first encapsulation layer 214, the second encapsulation layer 215, and the third encapsulation layer 216, an optical path of the transparent film layer connected to the crack removing layer can be implemented without being changed. In this embodiment, the first substrate 10 further includes a thin film transistor (not shown in the drawings). The array inorganic layer 212 covers the thin film transistors. The material of the array organic layer 213 is organic photoresist, and the array organic layer 213 includes a spacer, a pixel defining layer and a planarization layer. The material of the substrate layer 211 includes polyimide, polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyethersulfone, or polyarylate. The material of the array inorganic layer 212 includes silicon nitride or silicon oxide. The material of the first encapsulation layer 214 includes silicon oxynitride, silicon nitride, silicon oxide, aluminum oxide, or terbium oxide. The materials of the second encapsulation layer 215 include: polyacrylate, high density polyethylene, polypropylene, polystyrene, polyethylene terephthalate, polyethersulfone or polyimide. The materials of the third encapsulation layer 216 include: silicon oxynitride, silicon nitride, silicon oxide, aluminum oxide, or terbium oxide.
The number of the seam eliminating layers is two, the two seam eliminating layers are a first seam eliminating layer 441 and a second seam eliminating layer 442, and the first seam eliminating layer 441 is connected with the substrate layer 211, the array inorganic layer 212 and the array organic layer 213; the second gap elimination layer 442 is connected to the first package layer 214, the second package layer 215, and the third package layer 216.
It will be appreciated that in this embodiment, two seam eliminating layers are used to achieve the light emitting effect of the seam 30 matching the display screen 200. In this embodiment, the first seam eliminating layer 441 is simultaneously connected with the substrate layer 211, the array inorganic layer 212 and the array organic layer 213, and the second seam eliminating layer 442 is simultaneously connected with the first packaging layer 214, the second packaging layer 215 and the third packaging layer 216, so as to reduce the manufacturing difficulty of the seam eliminating layer and save the process. It can be understood that the extinction coefficient is also affected by the thickness of the film layer, so that adjusting the thickness of the seam eliminating layer can also play a role in adjusting the extinction coefficient, and the selection range of materials is further enlarged.
Optionally, the thickness of the first crack removing layer 441 is equal to the sum of the thicknesses of the substrate layer 211, the array inorganic layer 212, and the array organic layer 213. The thickness of the second gap elimination layer 442 is equal to the sum of the thicknesses of the first encapsulation layer 214, the second encapsulation layer 215, and the third encapsulation layer 216.
Alternatively, in the present embodiment, the first substrate 10 includes a base 11, a driving functional layer 12, and a first conductive pad 14, the driving functional layer 12 is disposed on the base 11, and the first conductive pad 14 is disposed on the driving functional layer 12. The second substrate 20 further includes a second conductive pad 22, where the second conductive pad 22 is disposed on a side of the substrate layer 211 near the first substrate 10, and the first conductive pad 14 is bonded to the second conductive pad 22.
It will be appreciated that in this embodiment, the second conductive pad 22 is electrically connected to the thin film transistor. The first substrate 10 further includes a driving chip 13 disposed in the frame region.
Optionally, in some embodiments of the present application, the display screen 200 further includes an adhesive paste 50, a gap 60 is formed between the first substrate 10 and the second substrate 20, and the adhesive paste 50 is filled in the gap 60 and connected to the first substrate 10 and the second substrate 20; the seam-eliminating structure layer 40 is disposed on the adhesive 50.
It will be appreciated that in the present embodiment, the adhesive paste 50 may function to fix the first substrate 10 and the second substrate 20. In some embodiments, the effect of the display screen 200 against water and oxygen can be further improved by doping the adhesive 50 with a desiccant.
Fifth embodiment (V),
Referring to fig. 2, 3, 4 and 9, an embodiment of the present application provides a display screen 200, including: a first substrate 10, at least two second substrates 20, and a seam-eliminating structural layer 40. At least two second substrates 20 are disposed on the first substrate 10 in a spliced manner. A gap 30 exists between adjacent second substrates 20. The second substrate 20 includes a transparent film layer in a multilayer stack arrangement. The seam-eliminating structural layer 40 fills the seam 30. The seam-eliminating structure layer 40 includes at least two seam-eliminating layers disposed one upon the other. A seam eliminating layer is correspondingly connected with at least one transparent film layer. In the seam eliminating layer and the transparent film layer connected with the seam eliminating layer, the complex refractive index of the seam eliminating layer is the same as that of a transparent film layer.
Referring to fig. 5, it can be understood that in the present embodiment, in the structure of the display screen 200, in the seam eliminating layer and the transparent film layer connected thereto, the complex refractive index of the seam eliminating layer is the same as that of the transparent film layer, so that the gap 30 between the spliced second substrates 20 can be eliminated visually, and a large-size display without side seams can be realized.
Alternatively, in this embodiment, in the slit removing layer and the transparent film layer connected thereto, the refractive index and the extinction coefficient of the slit removing layer are respectively different from those of a transparent film layer.
It can be understood that under the condition of ensuring that the complex refractive indexes of the crack eliminating layer and the transparent film layer connected with the crack eliminating layer are the same, the optical path of the original light can not be changed, and the light emitting effect of the matching of the crack 30 and the display screen 200 can be realized. It should be noted that: the complex refractive index of a material is determined by both the real-part refractive index and the imaginary-part extinction coefficient. Therefore, the complex refractive index of the crack eliminating layer and the connected transparent film layer can be the same by adjusting the refractive index and the extinction coefficient. It will be appreciated that the materials of the seam eliminating layer include: one or more of acrylic, organosilicon, epoxy resin or polyurethane. It will be appreciated that in some embodiments, the material of the crack-eliminating layer may be the same as the material of the corresponding transparent film layer.
Alternatively, in some embodiments of the present application, the crack-eliminating layer comprises a bulk film layer, transparent nanoparticles 401, and filler 402, the nanoparticles 401 and filler 402 being doped within the bulk film layer.
In this embodiment, by adding the nanoparticles 401 and the filler 402, the refractive index and the extinction coefficient of the seam eliminating layer are respectively changed, so that the selection of materials can be further enlarged, and the difficulty in selecting the materials and the difficulty in preparing the materials can be reduced. The nanoparticle 401 includes: silica, silicon carbide, hydroxyapatite or barium titanate. The filler 402 includes: pigments or inks.
Alternatively, in some embodiments, the seam-eliminating layer may also include only the bulk film layer.
Optionally, in the present embodiment, the multi-layer transparent film layer includes a substrate layer 211, an array inorganic layer 212, an array organic layer 213, a first encapsulation layer 214, a second encapsulation layer 215, and a third encapsulation layer 216. In the thickness direction of the display panel 200, a substrate layer 211, an array inorganic layer 212, an array organic layer 213, a first encapsulation layer 214, a second encapsulation layer 215, and a third encapsulation layer 216 are sequentially stacked. A crack removing layer connects at least one of the substrate layer 211, the array inorganic layer 212, the array organic layer 213, the first encapsulation layer 214, the second encapsulation layer 215, and the third encapsulation layer 216.
It is understood that when a crack removing layer is connected to at least one of the substrate layer 211, the array inorganic layer 212, the array organic layer 213, the first encapsulation layer 214, the second encapsulation layer 215, and the third encapsulation layer 216, an optical path of the transparent film layer connected to the crack removing layer can be implemented without being changed. In this embodiment, the first substrate 10 further includes a thin film transistor (not shown in the drawings). The array inorganic layer 212 covers the thin film transistors. The material of the array organic layer 213 is organic photoresist, and the array organic layer 213 includes a spacer, a pixel defining layer and a planarization layer. The material of the substrate layer 211 includes polyimide, polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyethersulfone, or polyarylate. The material of the array inorganic layer 212 includes silicon nitride or silicon oxide. The material of the first encapsulation layer 214 includes silicon oxynitride, silicon nitride, silicon oxide, aluminum oxide, or terbium oxide. The materials of the second encapsulation layer 215 include: polyacrylate, high density polyethylene, polypropylene, polystyrene, polyethylene terephthalate, polyethersulfone or polyimide. The materials of the third encapsulation layer 216 include: silicon oxynitride, silicon nitride, silicon oxide, aluminum oxide, or terbium oxide.
Alternatively, in some embodiments of the present application, the number of the seam eliminating layers is the same as the number of the transparent film layers, and the thickness of the seam eliminating layers is equal to the thickness of the transparent film layers.
It will be appreciated that in this embodiment, the number of the slit removing layers is the same as the number of the transparent film layers, and the thickness of the slit removing layers is equal to that of the transparent film layers, so that the complexity of the optical path of the transparent film layers connected to the slit removing layers can be reduced.
Optionally, in this embodiment, the number of the seam-eliminating layers is six, and the six seam-eliminating layers are a first seam-eliminating layer 451, a second seam-eliminating layer 452, a third seam-eliminating layer 453, a fourth seam-eliminating layer 454, a fifth seam-eliminating layer 455, and a sixth seam-eliminating layer 456; the first crack removing layer 451 is connected to the substrate layer 211, the second crack removing layer 452 is connected to the array inorganic layer 212, and the third crack removing layer 453 is connected to the array organic layer 213; the fourth seam layer 454 is connected to the first encapsulation layer 214, the fifth seam layer 455 is connected to the second encapsulation layer 215, and the sixth seam layer 456 is connected to the third encapsulation layer.
It will be appreciated that in this embodiment, six seam eliminating layers are used to maximize the light emitting effect of the seam 30 matching the display screen 200. It can be understood that the extinction coefficient is also affected by the thickness of the film layer, so that adjusting the thickness of the seam eliminating layer can also play a role in adjusting the extinction coefficient, and the selection range of materials is further enlarged.
Optionally, the thickness of the first crack removing layer 451 is equal to the thickness of the substrate layer 211, the thickness of the second crack removing layer 452 is equal to the thickness of the array inorganic layer 212, and the thickness of the third crack removing layer 453 is equal to the thickness of the array organic layer 213; the fourth crack stop layer 454 has a thickness equal to the thickness of the first encapsulation layer 214, the fifth crack stop layer 455 has a thickness equal to the thickness of the second encapsulation layer 215, and the sixth crack stop layer 456 has a thickness equal to the thickness of the third encapsulation layer 216.
Alternatively, in the present embodiment, the first substrate 10 includes a base 11, a driving functional layer 12, and a first conductive pad 14, the driving functional layer 12 is disposed on the base 11, and the first conductive pad 14 is disposed on the driving functional layer 12. The second substrate 20 further includes a second conductive pad 22, where the second conductive pad 22 is disposed on a side of the substrate layer 211 near the first substrate 10, and the first conductive pad 14 is bonded to the second conductive pad 22.
It will be appreciated that in this embodiment, the second conductive pad 22 is electrically connected to the thin film transistor. The first substrate 10 further includes a driving chip 13 disposed in the frame region.
Optionally, in some embodiments of the present application, the display screen 200 further includes an adhesive paste 50, a gap 60 is formed between the first substrate 10 and the second substrate 20, and the adhesive paste 50 is filled in the gap 60 and connected to the first substrate 10 and the second substrate 20; the seam-eliminating structure layer 40 is disposed on the adhesive 50.
It will be appreciated that in the present embodiment, the adhesive paste 50 may function to fix the first substrate 10 and the second substrate 20. In some embodiments, the effect of the display screen 200 against water and oxygen can be further improved by doping the adhesive 50 with a desiccant.
The foregoing has outlined a detailed description of a display 200 according to an embodiment of the present application, wherein specific examples are provided herein to illustrate the principles and embodiments of the present application, and the above examples are provided to assist in understanding the method and core concepts of the present application; meanwhile, as those skilled in the art will have variations in the specific embodiments and application scope in light of the ideas of the present application, the present description should not be construed as limiting the present application.
Claims (9)
1. A display screen, comprising:
a first substrate;
at least two second substrates are spliced on the first substrate; a gap exists between the adjacent second substrates; the second substrate comprises a plurality of transparent film layers which are stacked;
the seam eliminating structure layer fills the gaps; the seam eliminating structure layer comprises at least two seam eliminating layers which are arranged in a layer-by-layer manner; one of the seam eliminating layers is correspondingly connected with at least one transparent film layer;
In the crack eliminating layer and the transparent film layer connected with the crack eliminating layer, the complex refractive index of the crack eliminating layer is the same as that of one transparent film layer;
the transparent film layer comprises a substrate layer, an array inorganic layer, an array organic layer, a first packaging layer, a second packaging layer and a third packaging layer; in the thickness direction of the display screen, the substrate layer, the array inorganic layer, the array organic layer, the first packaging layer, the second packaging layer and the third packaging layer are sequentially stacked;
the seam eliminating layer is connected with at least one of the substrate layer, the array inorganic layer, the array organic layer, the first packaging layer, the second packaging layer and the third packaging layer.
2. The display screen of claim 1, wherein in the crack-eliminating layer and the transparent film layer connected thereto, the refractive index and the extinction coefficient of the crack-eliminating layer are the same as those of one of the transparent film layers.
3. The display screen of claim 1, wherein the crack-eliminating layer comprises a bulk film layer and transparent nanoparticles doped within the bulk film layer.
4. The display screen of claim 1, wherein the number of the seam eliminating layers is the same as the number of the transparent film layers, and the thickness of the seam eliminating layers is equal to the thickness of the transparent film layers.
5. The display screen of claim 4, wherein the number of the seam-eliminating layers is two, the two seam-eliminating layers are a first seam-eliminating layer and a second seam-eliminating layer, and the first seam-eliminating layer is connected to the substrate layer, the array inorganic layer and the array organic layer; the second seam eliminating layer is connected to the first packaging layer, the second packaging layer and the third packaging layer.
6. The display screen of claim 4, wherein the number of said seam-eliminating layers is three, and the three seam-eliminating layers are a first seam-eliminating layer, a second seam-eliminating layer and a third seam-eliminating layer, said first seam-eliminating layer being connected to said substrate layer, said second seam-eliminating layer being connected to said array inorganic layer and said array organic layer; the third seam eliminating layer is connected to the first packaging layer, the second packaging layer and the third packaging layer.
7. The display screen of claim 4, wherein the number of the seam-eliminating layers is six, and the six seam-eliminating layers are a first seam-eliminating layer, a second seam-eliminating layer, a third seam-eliminating layer, a fourth seam-eliminating layer, a fifth seam-eliminating layer and a sixth seam-eliminating layer; the first seam eliminating layer is connected with the substrate layer, the second seam eliminating layer is connected with the array inorganic layer, and the third seam eliminating layer is connected with the array organic layer; the fourth seam eliminating layer is connected to the first packaging layer, the fifth seam eliminating layer is connected to the second packaging layer, and the sixth seam eliminating layer is connected to the third packaging layer.
8. The display screen of claim 4, wherein the first substrate comprises a base, a drive function layer disposed on the base, and a first conductive pad disposed on the drive function layer;
the second substrate further comprises a second conductive pad, the second conductive pad is arranged on one side, close to the first substrate, of the substrate layer, and the first conductive pad and the second conductive pad are in binding connection.
9. The display screen of claim 8, further comprising an adhesive, wherein a gap is formed between the first substrate and the second substrate, wherein the adhesive fills the gap and is connected to the first substrate and the second substrate; the seam eliminating structure layer is arranged on the adhesive.
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