CN114842496A - Drawing partitioning method, laser processing method, device and storage medium - Google Patents

Drawing partitioning method, laser processing method, device and storage medium Download PDF

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Publication number
CN114842496A
CN114842496A CN202210497830.4A CN202210497830A CN114842496A CN 114842496 A CN114842496 A CN 114842496A CN 202210497830 A CN202210497830 A CN 202210497830A CN 114842496 A CN114842496 A CN 114842496A
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China
Prior art keywords
dimensional
dimensional galvanometer
rotation angle
laser
laser processing
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CN202210497830.4A
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Chinese (zh)
Inventor
赖伟明
罗晓明
陈国栋
杨朝辉
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Shenzhen Hans CNC Technology Co Ltd
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Shenzhen Hans CNC Technology Co Ltd
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Priority to CN202210497830.4A priority Critical patent/CN114842496A/en
Publication of CN114842496A publication Critical patent/CN114842496A/en
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V30/00—Character recognition; Recognising digital ink; Document-oriented image-based pattern recognition
    • G06V30/40—Document-oriented image-based pattern recognition
    • G06V30/42—Document-oriented image-based pattern recognition based on the type of document
    • G06V30/422—Technical drawings; Geographical maps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/10—Image acquisition
    • G06V10/12—Details of acquisition arrangements; Constructional details thereof
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/20—Image preprocessing
    • G06V10/24—Aligning, centring, orientation detection or correction of the image
    • G06V10/242—Aligning, centring, orientation detection or correction of the image by image rotation, e.g. by 90 degrees
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/20—Image preprocessing
    • G06V10/25—Determination of region of interest [ROI] or a volume of interest [VOI]
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/40—Extraction of image or video features
    • G06V10/44—Local feature extraction by analysis of parts of the pattern, e.g. by detecting edges, contours, loops, corners, strokes or intersections; Connectivity analysis, e.g. of connected components
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V30/00—Character recognition; Recognising digital ink; Document-oriented image-based pattern recognition
    • G06V30/10—Character recognition
    • G06V30/14—Image acquisition
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V30/00—Character recognition; Recognising digital ink; Document-oriented image-based pattern recognition
    • G06V30/10—Character recognition
    • G06V30/14—Image acquisition
    • G06V30/146—Aligning or centring of the image pick-up or image-field
    • G06V30/1463—Orientation detection or correction, e.g. rotation of multiples of 90 degrees
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V30/00—Character recognition; Recognising digital ink; Document-oriented image-based pattern recognition
    • G06V30/10—Character recognition
    • G06V30/14—Image acquisition
    • G06V30/146—Aligning or centring of the image pick-up or image-field
    • G06V30/147—Determination of region of interest
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V30/00—Character recognition; Recognising digital ink; Document-oriented image-based pattern recognition
    • G06V30/10—Character recognition
    • G06V30/18—Extraction of features or characteristics of the image
    • G06V30/1801—Detecting partial patterns, e.g. edges or contours, or configurations, e.g. loops, corners, strokes or intersections

Abstract

The application relates to a drawing partitioning method, a laser processing device and a storage medium, wherein the drawing partitioning method comprises the following steps: acquiring a drawing file to be subjected to laser processing, wherein the drawing file comprises at least one operation figure to be subjected to laser processing in a two-dimensional coordinate system; adjusting the rotation angle of the two-dimensional galvanometer area under the two-dimensional coordinate system according to the at least one operation graph to be processed by laser and preset shape data of the two-dimensional galvanometer area, and controlling the two-dimensional galvanometer area to rotate according to the corresponding rotation angle; and partitioning the drawing file by using the rotated two-dimensional galvanometer area. According to the technical scheme, the drawing file in the laser processing operation process can be partitioned more reasonably, the number of required partitions is reduced, and therefore the efficiency of the laser processing operation can be finally improved.

Description

Drawing partitioning method, laser processing method, device and storage medium
Technical Field
The invention relates to the technical field of laser processing, in particular to a drawing file partitioning method, a laser processing device and a storage medium in laser processing operation.
Background
With the development of automation technology, the application of laser processing equipment is more and more extensive. For example, the laser processing equipment can be used for punching or cutting a board such as a PCB. The principle is that a high-power laser beam is used for irradiating a plate material, so that the irradiated part of the plate material is heated and evaporated, and a hole or a kerf is formed.
When a laser processing device performs a laser processing operation, a figure to be processed is generally drawn in a drawing file, and then a sheet material is processed based on the figure. When the area of a plate to be processed is large, the processing breadth of a galvanometer of laser processing equipment is limited, at this time, a drawing file is generally required to be partitioned, the laser processing equipment only processes a graph in one partition at each time during subsequent processing, and after one partition is processed, a laser head and a platform for bearing the plate are relatively moved, so that the laser head processes the graph in the next partition until the processing of the whole plate is completed.
The inventor finds in research that the image file partitioning technology in the prior art only partitions the image file into blocks of the same size which are repeatedly arranged according to the size of the galvanometer, and the result of partitioning usually contains more partitions, thereby increasing the number of laser processing operations and reducing the efficiency of the laser processing equipment.
Disclosure of Invention
The embodiment of the invention provides a drawing file partitioning method, a laser processing device and a storage medium, which can solve the technical problem that in the prior art, the partitioning result of a drawing file contains too many partitions, so that the laser processing efficiency is reduced.
In a first aspect, the present application provides a method for partitioning a drawing file, including:
acquiring a drawing file to be subjected to laser processing, wherein the drawing file comprises at least one operation figure to be subjected to laser processing in a two-dimensional coordinate system;
adjusting the rotation angle of the two-dimensional galvanometer area under the two-dimensional coordinate system according to the at least one operation graph to be processed by laser and preset shape data of the two-dimensional galvanometer area, and controlling the two-dimensional galvanometer area to rotate according to the corresponding rotation angle; and
and partitioning the at least one operation graph to be subjected to laser processing in the drawing file by utilizing the rotated two-dimensional galvanometer area.
With reference to the first aspect, in a possible implementation manner, the adjusting a rotation angle of the two-dimensional galvanometer region in the two-dimensional coordinate system according to the at least one operation pattern to be laser-processed and preset shape data of the two-dimensional galvanometer region includes:
superposing a two-dimensional galvanometer area under the two-dimensional coordinate system with the center of the at least one operation graph to be processed by laser;
enabling the two-dimensional galvanometer area to rotate according to a preset step length and traversing a preset angle range;
and determining the rotation angle of the maximum pixel point in the operation graph to be processed by the laser, and taking the rotation angle of the maximum pixel point as the rotation angle for adjusting the two-dimensional galvanometer area under the two-dimensional coordinate system.
With reference to the first aspect, in a feasible implementation manner, the preset step length is 1 to 10 °, and the preset angle range is 0 to 180 °.
With reference to the first aspect, in a possible implementation manner, the adjusting a rotation angle of the two-dimensional galvanometer region in the two-dimensional coordinate system according to the at least one operation pattern to be laser-processed and preset shape data of the two-dimensional galvanometer region includes:
determining the line segment direction between two edge pixel points with the maximum distance according to the coordinate data of the pixel points in the at least one operation graph to be processed by laser;
adjusting one diagonal direction of the two-dimensional galvanometer area to be parallel to the line segment direction;
and calculating the rotation angle of one diagonal line of the two-dimensional galvanometer area from the initial direction to the line segment direction, and taking the rotation angle as the rotation angle of the two-dimensional galvanometer area under the two-dimensional coordinate system.
With reference to the first aspect, in a possible implementation manner, the adjusting the rotation angle of the two-dimensional galvanometer region in the two-dimensional coordinate system includes: and receiving a rotation angle instruction input by a user, and taking the rotation angle instruction as the rotation angle of the two-dimensional galvanometer area in the two-dimensional coordinate system according to the rotation angle input by the user.
With reference to the first aspect, in a possible implementation manner, the partitioning the drawing file by using the rotated two-dimensional galvanometer area includes: and generating a plurality of two-dimensional galvanometer areas by partitioning the drawing file, wherein the rotation angles of the two-dimensional galvanometer areas under the two-dimensional coordinate system are the same or different.
In a second aspect, the present application provides a laser machining method comprising the method of partitioning drawings according to the first aspect, and performing a laser machining operation based on the partitioned drawings file.
With reference to the second aspect, in a possible implementation manner, according to the number of partitions in the partitioned drawing file, executing a corresponding number of times of laser processing operation; and
and before each laser processing operation, loading a two-dimensional galvanometer rotating angle galvanometer correction table, and rotating the two-dimensional galvanometer according to the rotating angle of the corresponding two-dimensional galvanometer area.
In a third aspect, the present application provides a drawing document partitioning apparatus, the apparatus comprising:
the system comprises a drawing file acquisition unit, a drawing file processing unit and a processing unit, wherein the drawing file acquisition unit is used for acquiring a drawing file to be subjected to laser processing, and the drawing file comprises at least one operation figure to be subjected to laser processing in a two-dimensional coordinate system;
the calculation unit is used for adjusting the rotation angle of the two-dimensional galvanometer area under the two-dimensional coordinate system according to the at least one operation graph to be processed by laser and preset shape data of the two-dimensional galvanometer area, and controlling the two-dimensional galvanometer area to rotate according to the corresponding rotation angle; and
and the partition execution unit is used for partitioning the at least one operation graph to be subjected to laser processing in the drawing file by using the rotated two-dimensional galvanometer area.
In a fourth aspect, the present application provides a computer-readable storage medium, where a computer program is stored in the computer-readable storage medium, and the computer program controls, when running, an apparatus where the computer-readable storage medium is located to execute the method for partitioning a drawing file according to the first aspect.
Based on the consideration that the image file partitioning technique in the prior art only divides the image file into blocks of the same size in a repeated arrangement according to the size of the galvanometer, the result of partitioning usually contains more partitions, in order to solve the technical problem, the method for partitioning the drawing file provided by the application firstly obtains the drawing file to be processed by laser, the drawing file comprises at least one operation figure to be processed by laser under a two-dimensional coordinate system, and according to the operation figure to be processed by laser, and the preset shape data of the two-dimensional galvanometer area, adjusting the rotation angle of the two-dimensional galvanometer area under a two-dimensional coordinate system, and controls the two-dimensional galvanometer area to rotate, the two-dimensional galvanometer area after rotation is used for partitioning the picture file, therefore, the partition number of the partition result of the drawing file can be reduced, the processing times of the laser processing equipment are finally reduced, and the working efficiency is improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive labor.
FIG. 1 is a schematic diagram of an application environment provided by an embodiment of the present application;
FIG. 2 is a flowchart illustrating a method for partitioning a drawing file according to an embodiment of the present disclosure;
FIG. 3a is a schematic structural diagram of a laser processing operation pattern of a drawing document in an embodiment of the present application;
FIG. 3b is a schematic diagram of the partitioning result at the default angle of the two-dimensional galvanometer area in the embodiment of the present application;
FIG. 3c is a schematic diagram illustrating the result of the division of the two-dimensional galvanometer area after the angle adjustment in the embodiment of the present application;
FIG. 4 is a functional block diagram of an apparatus for partitioning drawing files according to an embodiment of the present application;
fig. 5 is a schematic structural diagram of a computer device in an embodiment of the present application.
Detailed Description
For better understanding of the technical solutions of the present invention, the following detailed descriptions of the embodiments of the present invention are provided with reference to the accompanying drawings.
It should be understood that the described embodiments are only some embodiments of the invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The terminology used in the embodiments of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in the examples of the present invention and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It should be understood that the term "and/or" as used herein is merely one type of association that describes an associated object, meaning that three relationships may exist, e.g., a and/or B may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship.
It should be understood that although the terms first, second, third, etc. may be used to describe the terminals in the embodiments of the present invention, the terminals should not be limited by these terms. These terms are only used to distinguish one terminal from another. For example, a first terminal may also be referred to as a second terminal, and similarly, a second terminal may also be referred to as a first terminal, without departing from the scope of embodiments of the present invention.
The word "if" as used herein may be interpreted as "at … …" or "when … …" or "in response to a determination" or "in response to a detection", depending on the context. Similarly, the phrases "if determined" or "if detected (a stated condition or event)" may be interpreted as "when determined" or "in response to a determination" or "when detected (a stated condition or event)" or "in response to a detection (a stated condition or event)", depending on the context.
Referring to fig. 1, a schematic diagram of an application environment of the embodiment of the present application is shown.
The application environment of the embodiment of the application comprises a working platform 1, a plate 2 to be processed and laser processing equipment 3.
The laser processing equipment 3 has the function of realizing operations such as laser drilling, laser cutting, marking and the like aiming at the plate 2 to be processed. The laser processing apparatus 3 includes necessary lasers and optical path components. The laser is used for generating laser light, the optical path component can include but is not limited to a plurality of reflection components, and the reflection components are arranged on the optical path of the laser light output by the laser. In general, the laser processing apparatus 3 mainly processes a two-dimensional plate material. In order to process a two-dimensional plate, a two-dimensional galvanometer and a focusing mirror are usually included in a laser processing device. The two-dimensional galvanometer comprises an X galvanometer and a Y galvanometer which can be adjusted by processing point coordinates. The X galvanometer and the Y galvanometer are rotated by a motor in the laser processing equipment 3 respectively, the maximum processing breadth corresponding to the XY galvanometer can be obtained, the maximum processing breadth is called as a two-dimensional galvanometer area in the embodiment of the application, and the two-dimensional galvanometer area is usually rectangular and can be set. The focusing mirror of the laser processing device 3 is used for realizing the collection of laser energy, thereby realizing the final operations of punching, cutting and the like.
Before the laser processing equipment 3 processes the plate 2 to be processed, the light path inside the laser processing equipment 3 needs to be adjusted preliminarily. Then, the two-dimensional galvanometer and the focusing mirror need to be installed, and the optical paths of the focusing mirror and the two-dimensional galvanometer part need to be adjusted. At this time, the laser processing apparatus 3 is reset. Then the working platform 1 is adjusted to be flush with the plane of the two-dimensional galvanometer, and the X, Y directions of the working platform 1 are respectively kept consistent with the X, Y directions of the two-dimensional galvanometer. And finally, arranging the plate 2 to be processed on the working platform 1, wherein the surface of the plate 2 to be processed is flush with the surface of the working platform 1, namely, the plate 2 to be processed is uniformly adsorbed on the surface of the working platform 1. And the distance between the focusing mirror and the working platform 1 should be set as the theoretical focal length of the focusing mirror.
In the application environment of the embodiment of the present application, the laser processing device 3 controls the laser processing operation based on the laser processing control software. In the laser processing software in the embodiment of the present application, the control is realized in the form of a drawing file. And drawing the processing surface of the plate to be processed and the processing pattern on the processing surface in the figure file, wherein the processing pattern can be a closed pattern or a non-closed pattern. In the embodiment of the present application, the two-dimensional galvanometer area of the XY two-dimensional galvanometer is generally much smaller than the processing surface of the sheet material 2 to be processed. Therefore, in the figure file in the laser processing control software, the processing surface of the plate material 2 to be processed needs to be partitioned by using the two-dimensional galvanometer area. In the conventional technology, the processing surface of the plate 2 to be processed, the working platform 1 and the XY two-dimensional galvanometer are generally made to be consistent in the X-axis direction, the processing surface of the plate 2 to be processed, the working platform 1 and the XY two-dimensional galvanometer are made to be consistent in the Y-axis direction, and the two-dimensional galvanometer area is repeatedly arranged on the processing surface of the plate 2 to be processed along the X-axis direction and the Y-axis direction, so that the whole processing surface is covered. And in subsequent processing, sequentially processing according to the sequence of the subareas, moving the working platform 1 after each subarea is processed, enabling the laser head of the laser processing equipment 3 to coincide with the center of the next subarea, and continuously processing until the processing is finished.
The conventional art is generally disadvantageous in that an excessive number of partitions are required, and thus a greater number of machining times are required, which reduces the operating efficiency of the laser machining apparatus.
In order to improve the conventional technology, the laser processing device 3 in the embodiment of the present application may partition the drawing file in the laser processing control software more effectively, and reduce the number of partitions. Specifically, the laser processing apparatus 3 in the present application includes a memory and a processor, where the memory stores computer program instructions, and the processor implements the following steps when executing the computer program, so as to implement partitioning of a drawing file:
s1, acquiring a drawing file to be subjected to laser processing, wherein the drawing file comprises at least one operation figure to be subjected to laser processing in a two-dimensional coordinate system;
s2, adjusting the rotation angle of the two-dimensional galvanometer area under the two-dimensional coordinate system according to the at least one operation graph to be processed by laser and the shape data of the preset two-dimensional galvanometer area, and controlling the two-dimensional galvanometer area to rotate according to the corresponding rotation angle; and
and S3, partitioning the drawing file by using the rotated two-dimensional galvanometer area.
Further details regarding S1 through S3 are provided below.
And S1, acquiring a drawing file to be processed by laser.
Specifically, the actual content of the drawing file to be laser-processed is related to the specific sheet material to be processed, the actual figure to be processed, the size of the sheet material, and the shape and size of the figure to be processed.
In an embodiment of the present application, the drawing file includes at least one operation pattern to be laser-processed in a two-dimensional coordinate system. The two-dimensional coordinate system is an XY coordinate system. The operation pattern to be processed by laser is preferably a pattern of the same scale level as the two-dimensional galvanometer region. The preferred application scenario of the embodiment of the application is that a plurality of operation graphs are regularly arranged.
In figure 3a, which is a drawing of the present application, the content of a drawing is schematically depicted. In fig. 3a, the two-dimensional coordinate system is an XY coordinate system. In the figure file, four rows of operation figures to be processed by laser are arranged along the X direction. There are two rows of work patterns in the Y direction.
The scale level of each operation pattern is equivalent to the scale level of the two-dimensional galvanometer area. For example, the two-dimensional galvanometer region in the embodiment of the present application may be preset to 6500um × 6500um, and each of the operation images is a cross-cut line, with a width of 5000um and a height of 5000 um.
And S2, adjusting the rotation angle of the two-dimensional galvanometer area under the two-dimensional coordinate system according to the at least one operation graph to be processed by laser and the shape data of the preset two-dimensional galvanometer area, and controlling the two-dimensional galvanometer area to rotate according to the corresponding rotation angle.
Specifically, the two-dimensional galvanometer area is rotated under the two-dimensional coordinate system, so that the two-dimensional galvanometer area covers the operation patterns as much as possible, and a blank area in the drawing file is located outside the two-dimensional galvanometer area as much as possible, and the number of the subareas can be reduced.
In the examples of the present application, the two-dimensional galvanometer region set in a rotating manner in the present step will be explained in comparison with the conventional art.
Fig. 3b shows a partition method in the conventional technology. In this example, the two-dimensional galvanometer region is 6500um x 6500um, and each of the operation patterns has a width of 5000um and a height of 5000 um. Because the width of the operation graph is larger than the width of the two-dimensional galvanometer area, 6 two-dimensional galvanometer areas are needed to cover 4 operation graphs along the X-axis direction, and simultaneously, because the height of each operation graph is larger than the height of the two-dimensional galvanometer area, one two-dimensional galvanometer area cannot cover the height of one operation graph.
In the embodiment of the application, in order to cover the operation pattern as much as possible in the two-dimensional galvanometer region, an automatic adjustment mode can be adopted.
In one scenario, an automatic adjustment method includes:
(1) and (3) coinciding the two-dimensional galvanometer area under the two-dimensional coordinate system with the center of the operation graph to be processed by laser.
(2) And rotating the two-dimensional galvanometer area according to a preset step length and traversing a preset angle range. The preset step length can be 1-10 degrees, for example, the step length can be 1 degree (namely, the angle of 1 degree relative to the X axis is increased after each rotation of the two-dimensional galvanometer area), and the angle range can be 0-180 degrees.
(3) And determining the rotation angle of the maximum pixel point in the operation graph to be processed by the laser, and taking the rotation angle of the maximum pixel point as the rotation angle for adjusting the two-dimensional galvanometer area under the two-dimensional coordinate system.
In another scenario of the present application, there is provided another automatic adjustment method, including:
(1) and determining the line segment direction between the two edge pixel points with the largest distance according to the coordinate data of the pixel points in the operation graph to be subjected to laser processing.
(2) One diagonal direction of the two-dimensional galvanometer area is adjusted to be parallel to the line direction.
(3) And calculating the rotation angle of one diagonal line of the two-dimensional galvanometer area from the initial direction to the line segment direction, and taking the rotation angle as the rotation angle of the two-dimensional galvanometer area under the two-dimensional coordinate system.
In this embodiment of the application, it is preferable that, for a plurality of operation patterns which have the same size and are regularly arranged, a rotation angle instruction input by a user can be received, and the rotation angle instruction input by the user is used as a rotation angle of the two-dimensional galvanometer area in the two-dimensional coordinate system. For example, in fig. 3c, a 45 ° angle of rotation may be manually entered by the user so that a two-dimensional galvanometer region may include a task graphic.
And S3, partitioning the drawing file by using the rotated two-dimensional galvanometer area.
Specifically, the rotation angle of the two-dimensional galvanometer area can be adjusted correspondingly for each operation pattern, and the rotation angles of different two-dimensional galvanometer areas can be the same or different.
Taking fig. 3c as an example, the rotation angles of the two-dimensional mirror regions arranged regularly may be the same, for example, 45 ° at the same time, so that in fig. 3c, all the work patterns may be covered with 8 two-dimensional mirror regions, the numbers of which are 1 and 2 … 8, respectively. During the subsequent laser machining, the sequence of machining also corresponds from 1 to 8.
Fig. 2 is a schematic flowchart of a method for partitioning a drawing file according to an embodiment of the present disclosure.
Specifically, the method for partitioning the drawing file in the embodiment of the application comprises the following steps:
s21, acquiring a drawing file to be subjected to laser processing, wherein the drawing file comprises at least one operation figure to be subjected to laser processing in a two-dimensional coordinate system;
s22, adjusting the rotation angle of the two-dimensional galvanometer area under the two-dimensional coordinate system according to the at least one operation graph to be processed by laser and the shape data of the preset two-dimensional galvanometer area, and controlling the two-dimensional galvanometer area to rotate according to the corresponding rotation angle; and
and S23, partitioning the drawing file by using the rotated two-dimensional galvanometer area.
The method for partitioning the drawing file comprises the steps of firstly obtaining the drawing file to be subjected to laser processing, wherein the drawing file comprises at least one operation figure to be subjected to laser processing in a two-dimensional coordinate system, then adjusting the rotating angle of a two-dimensional galvanometer region in the two-dimensional coordinate system according to the operation figure to be subjected to laser processing and preset shape data of the two-dimensional galvanometer region, and partitioning the drawing file by using the rotated two-dimensional galvanometer region, so that the partition number of the drawing partition result can be reduced, the processing times of laser processing equipment are finally reduced, and the working efficiency is improved.
The above steps S21-S23 are further described in a more detailed embodiment of the present application.
And S21, acquiring a drawing file to be processed by laser.
Specifically, the actual content of the drawing file to be laser-processed is related to the specific sheet material to be processed, the actual figure to be processed, the size of the sheet material, and the shape and size of the figure to be processed.
In an embodiment of the present application, the drawing file includes at least one operation pattern to be laser-processed in a two-dimensional coordinate system. The two-dimensional coordinate system is an XY coordinate system. The operation pattern to be processed by laser is preferably a pattern of the same scale level as the two-dimensional galvanometer region. The preferred application scenario of the embodiment of the application is that a plurality of operation graphs are regularly arranged.
In figure 3a, which is a drawing of the present application, the content of a drawing is schematically depicted. In fig. 3a, the two-dimensional coordinate system is an XY coordinate system. In the figure file, four rows of operation figures to be processed by laser are arranged along the X direction. There are two rows of work patterns in the Y direction.
The scale level of each operation pattern is equivalent to the scale level of the two-dimensional galvanometer area. For example, the two-dimensional galvanometer region in the embodiment of the present application may be preset to 6500um × 6500um, and each of the operation images is a cross-cut line, with a width of 5000um and a height of 5000 um.
And S22, adjusting the rotation angle of the two-dimensional galvanometer area under the two-dimensional coordinate system according to the at least one operation graph to be processed by laser and the shape data of the preset two-dimensional galvanometer area, and controlling the two-dimensional galvanometer area to rotate according to the corresponding rotation angle.
Specifically, the two-dimensional galvanometer area is rotated under the two-dimensional coordinate system, so that the two-dimensional galvanometer area covers the operation patterns as much as possible, and a blank area in the drawing file is located outside the two-dimensional galvanometer area as much as possible, and the number of the subareas can be reduced.
In the examples of the present application, the two-dimensional galvanometer region set in a rotating manner in the present step will be explained in comparison with the conventional art.
Fig. 3b shows a partitioning method in the conventional technology. In this example, the two-dimensional galvanometer region is 6500um x 6500um, and each of the operation patterns has a width of 5000um and a height of 5000 um. Because the width of the operation graph is larger than the width of the two-dimensional galvanometer area, 6 two-dimensional galvanometer areas are needed to cover 4 operation graphs along the X-axis direction, and simultaneously, because the height of each operation graph is larger than the height of the two-dimensional galvanometer area, one two-dimensional galvanometer area cannot cover the height of one operation graph.
In the embodiment of the application, in order to cover the operation pattern as much as possible in the two-dimensional galvanometer region, automatic adjustment may be adopted.
In one scenario, an automatic adjustment method includes:
(1) and (3) coinciding the two-dimensional galvanometer area under the two-dimensional coordinate system with the center of the operation graph to be processed by laser.
(2) And rotating the two-dimensional galvanometer area according to a preset step length and traversing a preset angle range. For example, the step size may be 1 ° (i.e., the two-dimensional galvanometer region is increased by 1 ° with respect to the X-axis angle after each rotation), and the angle range may be 0 to 180 °.
(3) And determining the rotation angle containing the maximum pixel points in the operation graph, and adjusting the rotation angle of the two-dimensional galvanometer area in the two-dimensional coordinate system.
In another scenario of the present application, there is provided another automatic adjustment method, including:
(1) and determining the line segment direction between the two edge pixel points with the largest distance according to the coordinate data of the pixel points in the operation graph to be subjected to laser processing.
(2) One diagonal direction of the two-dimensional galvanometer area is adjusted to be parallel to the line direction.
(3) And calculating the rotation angle of one diagonal line of the two-dimensional galvanometer area from the initial direction to the line segment direction, and taking the rotation angle as the rotation angle of the two-dimensional galvanometer area under the two-dimensional coordinate system.
In the embodiment of the application, it is preferable that, for a plurality of operation patterns which are the same in size and regularly arranged, the rotation angle can be quickly and manually input, the rotation angle input by the user is received, and the rotation angle input by the user is used as the rotation angle of the two-dimensional galvanometer area in the two-dimensional coordinate system. For example, in fig. 3c, a 45 ° angle of rotation may be manually entered by the user so that a two-dimensional galvanometer region may include a task graphic.
And S23, partitioning the drawing file by using the rotated two-dimensional galvanometer area.
Specifically, the rotation angle of the two-dimensional galvanometer area can be adjusted correspondingly for each operation pattern, and the rotation angles of different two-dimensional galvanometer areas can be the same or different.
Taking fig. 3c as an example, the rotation angles of the two-dimensional mirror regions arranged regularly may be the same, for example, 45 ° at the same time, so that in fig. 3c, all the work patterns may be covered with 8 two-dimensional mirror regions, the numbers of which are 1 and 2 … 8, respectively. During the subsequent laser machining, the sequence of machining also corresponds from 1 to 8.
Correspondingly, the embodiment of the application provides a laser processing method, which comprises the drawing and document partitioning method in the embodiment.
The laser processing method provided in the embodiment of the present application can be applied, but is not limited to, in the application environment of fig. 1.
The laser processing device 3 may implement partitioning of the drawing, and the specific method for partitioning the drawing may refer to the foregoing embodiments, which are not described herein again.
The laser processing device 3 can also perform laser processing operation on the plate 2 to be processed according to the partitioned drawing file partitioning method provided by the embodiment of the application.
The number of times of laser processing is the number of partitions after the partition of the figure file, and in the embodiment of the application, the two-dimensional galvanometer area corresponding to each partition has different rotation angles relative to the X axis, and the rotation angles of a plurality of different two-dimensional galvanometer areas can be recorded in a two-dimensional galvanometer rotation angle galvanometer correction table. In the embodiment of the present application, the laser processing device 3 executes the number of times of the laser processing operations of the corresponding number according to the number of the partitions in the partitioned drawing file, loads the two-dimensional galvanometer rotation angle galvanometer correction table before each laser processing operation, and rotates the two-dimensional galvanometer according to the rotation angle of the corresponding two-dimensional galvanometer area.
In the laser processing method in the embodiment of the application, the drawing is better partitioned in the step of partitioning the drawing, each partition contains more operation patterns, and meanwhile, the blank area is arranged outside the partition as much as possible, so that the number of partitions is reduced, the laser processing times are correspondingly reduced, and the efficiency of the laser processing equipment is improved.
Fig. 4 is a functional block diagram of a drawing document partitioning apparatus according to an embodiment of the present application.
The drawing partitioning apparatus 400 includes:
the drawing file acquiring unit 401 is configured to acquire a drawing file to be laser-processed, where the drawing file includes at least one work pattern to be laser-processed in a two-dimensional coordinate system;
a calculating unit 402, configured to adjust a rotation angle of the two-dimensional galvanometer region in the two-dimensional coordinate system according to the at least one operation pattern to be laser-processed and shape data of a preset two-dimensional galvanometer region, and control the two-dimensional galvanometer region to rotate according to the corresponding rotation angle; and
and a partitioning execution unit 403, configured to partition the drawing file by using the rotated two-dimensional galvanometer region.
The application provides a drawing file subregion device, at first acquire the drawing file of treating laser beam machining, including at least one operation figure of treating laser beam machining under the two-dimensional coordinate system in the drawing file, again according to the operation figure of treating laser beam machining, and the regional shape data of the two-dimensional mirror that predetermines, adjust the rotation angle of two-dimensional mirror region under the two-dimensional coordinate system that shakes, and utilize the two-dimensional mirror region that shakes after the rotation to carry out the subregion to the drawing file, thereby can reduce the subregion figure of drawing file subregion result, finally reduce the processing number of times of laser beam machining equipment, improve work efficiency.
The embodiment of the application also provides a computer-readable storage medium, which comprises a stored program, wherein when the program runs, the device where the storage medium is located is controlled to execute the above-mentioned drawing file partitioning method.
The embodiment of the present application further provides a computer device 500, as shown in fig. 5. The computer device 500 of this embodiment includes: the processor 501, the memory 502, and the computer program 503 stored in the memory and capable of running on the processor 501, wherein when the processor 501 executes the computer program 503, the method for partitioning a drawing file of a laser processing apparatus in an embodiment is implemented, and for avoiding repetition, details are not repeated herein. Alternatively, the computer program is executed by the processor 501 to implement the functions of the models/units in the image partitioning apparatus in the embodiment, which are not described herein again to avoid redundancy.
The computer device 500 may be a desktop computer, a notebook computer, a palm computer, a cloud server, a laser processing device, or other computing devices. The computer device may include, but is not limited to, a processor 301, a memory 302. Those skilled in the art will appreciate that fig. 5 is merely an example of a computer device 500 and is not intended to limit the computer device 500 and may include more or fewer components than illustrated, or some of the components may be combined, or different components, e.g., the computer device may also include input output devices, network access devices, buses, etc.
The Processor 501 may be a Central Processing Unit (CPU), other general purpose Processor, a Digital Signal Processor (DSP), an Application Specific Integrated Circuit (ASIC), a Field Programmable Gate Array (FPGA) or other Programmable logic device, discrete Gate or transistor logic device, discrete hardware component, or the like. A general purpose processor may be a microprocessor or the processor may be any conventional processor or the like.
The storage 502 may be an internal storage unit of the computer device 500, such as a hard disk or a memory of the computer device 500. The memory 502 may also be an external storage device of the computer device 300, such as a plug-in hard disk provided on the computer device 500, a Smart Media Card (SMC), a Secure Digital (SD) Card, a Flash memory Card (Flash Card), and the like. Further, the memory 502 may also include both internal storage units and external storage devices for the computer device 500. The memory 502 is used for storing computer programs and other programs and data required by the computer device. The memory 502 may also be used to temporarily store data that has been output or is to be output.
It is clear to those skilled in the art that, for convenience and brevity of description, the specific working processes of the above-described systems, apparatuses and units may refer to the corresponding processes in the foregoing method embodiments, and are not described herein again.
In the embodiments provided in the present invention, it should be understood that the disclosed system, apparatus and method may be implemented in other ways. For example, the above-described apparatus embodiments are merely illustrative, and for example, the above-described division of units is merely one type of division of logical functions, and there may be other divisions when actually implemented, for example, a plurality of units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection through some interfaces, devices or units, and may be in an electrical, mechanical or other form.
The integrated unit implemented in the form of a software functional unit may be stored in a computer readable storage medium. The software functional unit is stored in a storage medium and includes several instructions for causing a computer device (which may be a personal computer, a server, or a network device) or a Processor (Processor) to execute some steps of the above methods according to various embodiments of the present invention. And the aforementioned storage medium includes: various media capable of storing program codes, such as a usb disk, a removable hard disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk, or an optical disk.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present invention should be included in the scope of the present invention.

Claims (10)

1. A method for partitioning a drawing file, comprising:
acquiring a drawing file to be subjected to laser processing, wherein the drawing file comprises at least one operation figure to be subjected to laser processing in a two-dimensional coordinate system;
adjusting the rotation angle of the two-dimensional galvanometer area under the two-dimensional coordinate system according to the at least one operation graph to be processed by laser and preset shape data of the two-dimensional galvanometer area, and controlling the two-dimensional galvanometer area to rotate according to the corresponding rotation angle; and
and partitioning the drawing file by utilizing the rotated two-dimensional galvanometer area.
2. The method for partitioning the figure file according to claim 1, wherein the adjusting the rotation angle of the two-dimensional galvanometer region in the two-dimensional coordinate system according to the at least one operation figure to be laser-processed and the preset shape data of the two-dimensional galvanometer region comprises:
superposing a two-dimensional galvanometer area under the two-dimensional coordinate system with the center of the at least one operation graph to be processed by laser;
enabling the two-dimensional galvanometer area to rotate according to a preset step length and traversing a preset angle range;
and determining the rotation angle of the maximum pixel point in the operation graph to be processed by the laser, and taking the rotation angle of the maximum pixel point as the rotation angle for adjusting the two-dimensional galvanometer area under the two-dimensional coordinate system.
3. The method of claim 2, wherein the predetermined step size is 1 to 10 °, and the predetermined angle is in a range of 0 to 180 °.
4. The method for partitioning the figure file according to claim 1, wherein the adjusting the rotation angle of the two-dimensional galvanometer region in the two-dimensional coordinate system according to the at least one operation figure to be laser-processed and the preset shape data of the two-dimensional galvanometer region comprises:
determining the line segment direction between two edge pixel points with the largest distance according to the coordinate data of the pixel points in the at least one operation figure to be processed by laser;
adjusting one diagonal direction of the two-dimensional galvanometer area to be parallel to the line segment direction;
and calculating the rotation angle of one diagonal line of the two-dimensional galvanometer area from the initial direction to the line segment direction, and taking the rotation angle as the rotation angle of the two-dimensional galvanometer area under the two-dimensional coordinate system.
5. The method for partitioning the figure file according to claim 1, wherein the adjusting the rotation angle of the two-dimensional galvanometer region in the two-dimensional coordinate system comprises: and receiving a rotation angle instruction input by a user, and taking the rotation angle instruction input by the user as a rotation angle of the two-dimensional galvanometer area in the two-dimensional coordinate system.
6. The image partitioning method according to claim 1, wherein the partitioning the drawing file by the rotated two-dimensional galvanometer area comprises: and generating a plurality of two-dimensional galvanometer areas by partitioning the drawing file, wherein the rotation angles of the two-dimensional galvanometer areas in the two-dimensional coordinate system are the same or different.
7. A laser processing method comprising the drawing partitioning method according to any one of claims 1 to 6, and performing a laser processing operation based on the partitioned drawing file.
8. The laser processing method according to claim 7, wherein a corresponding number of times of laser processing work is performed in accordance with the number of partitions in the partitioned drawing file; and
and before each laser processing operation, loading a two-dimensional galvanometer rotating angle galvanometer correction table, and rotating the two-dimensional galvanometer according to the rotating angle of the corresponding two-dimensional galvanometer area.
9. An apparatus for partitioning a drawing, the apparatus comprising:
the system comprises a drawing file acquisition unit, a drawing file processing unit and a processing unit, wherein the drawing file acquisition unit is used for acquiring a drawing file to be subjected to laser processing, and the drawing file comprises at least one operation figure to be subjected to laser processing in a two-dimensional coordinate system;
the calculation unit is used for adjusting the rotation angle of the two-dimensional galvanometer area under the two-dimensional coordinate system according to the at least one operation graph to be processed by laser and preset shape data of the two-dimensional galvanometer area, and controlling the two-dimensional galvanometer area to rotate according to the corresponding rotation angle; and
and the partition execution unit is used for partitioning the drawing file by utilizing the rotated two-dimensional galvanometer area.
10. A computer-readable storage medium, wherein a computer program is stored in the computer-readable storage medium, and the computer program controls an apparatus in which the computer-readable storage medium is located to execute the method according to any one of claims 1 to 6.
CN202210497830.4A 2022-05-09 2022-05-09 Drawing partitioning method, laser processing method, device and storage medium Pending CN114842496A (en)

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CN202210497830.4A CN114842496A (en) 2022-05-09 2022-05-09 Drawing partitioning method, laser processing method, device and storage medium

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