CN114836036B - Heat conduction material with vertical orientation structure and preparation method and application thereof - Google Patents

Heat conduction material with vertical orientation structure and preparation method and application thereof Download PDF

Info

Publication number
CN114836036B
CN114836036B CN202210632875.8A CN202210632875A CN114836036B CN 114836036 B CN114836036 B CN 114836036B CN 202210632875 A CN202210632875 A CN 202210632875A CN 114836036 B CN114836036 B CN 114836036B
Authority
CN
China
Prior art keywords
vertical orientation
heat conducting
heat
fan
gears
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202210632875.8A
Other languages
Chinese (zh)
Other versions
CN114836036A (en
Inventor
王玉琼
吕卫帮
高宁萧
杨文刚
曲抒旋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Institute of Nano Tech and Nano Bionics of CAS
Qiantang Science and Technology Innovation Center
Original Assignee
Suzhou Institute of Nano Tech and Nano Bionics of CAS
Qiantang Science and Technology Innovation Center
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suzhou Institute of Nano Tech and Nano Bionics of CAS, Qiantang Science and Technology Innovation Center filed Critical Suzhou Institute of Nano Tech and Nano Bionics of CAS
Priority to CN202210632875.8A priority Critical patent/CN114836036B/en
Publication of CN114836036A publication Critical patent/CN114836036A/en
Application granted granted Critical
Publication of CN114836036B publication Critical patent/CN114836036B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C08K3/041—Carbon nanotubes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C08K3/042—Graphene or derivatives, e.g. graphene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C08K7/18—Solid spheres inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C08K2003/382—Boron-containing compounds and nitrogen
    • C08K2003/385—Binary compounds of nitrogen with boron
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P20/00—Technologies relating to chemical industry
    • Y02P20/10—Process efficiency

Abstract

The application provides a heat conduction material with a vertical orientation structure, and a preparation method and application thereof. The preparation method of the heat conduction material with the vertical orientation structure comprises the following steps: 1) Placing the planar heat conducting material between the gears, and enabling the planar heat conducting material to form a fan-like structure with vertical orientation through the meshing effect between the gears; 2) And (3) injecting an elastic material simultaneously during the engagement to fix the fan-like structure formed in the step (1) so as to obtain the heat conducting material with the vertical orientation structure. The heat conducting material prepared by the application can realize the controllable preparation of a vertical orientation structure, has high heat conducting performance in vertical orientation, good compression retraction elasticity and strength, and improves the operability of subsequent die cutting.

Description

Heat conduction material with vertical orientation structure and preparation method and application thereof
Technical Field
The application belongs to the technical field of heat conducting materials, relates to a heat conducting material and a preparation method and application thereof, and particularly relates to a heat conducting material with a vertical orientation structure and a preparation method and application thereof.
Background
Along with the technical development of the fields of 5G, big data, artificial intelligence, internet of things, industry 4.0 and the like, the power density of electronic devices is continuously increased, so that in order to ensure timely discharge of heat generated by heating electronic components and effectively prevent electromagnetic signals from affecting other devices, efficient heat conduction and electromagnetic shielding integrated materials and schemes are urgently needed to ensure the efficiency, reliability, safety, durability and continuous stability of products.
The traditional vertical heat conduction material is mainly prepared by filling high heat conduction ceramic particles such as aluminum nitride, aluminum oxide, pengpeng nitride, silicon carbide and other materials in a high polymer matrix, but the prepared thermal interface material has low heat conductivity, the heat conductivity is mostly 1-5W/m.K, the electromagnetic shielding effect is not achieved, and the heat dissipation problem caused by the large increase of the power density of each electronic component is difficult to be satisfied.
The metal material has higher heat conduction performance and electromagnetic shielding efficiency, but does not have compressibility, cannot fill air gaps among devices, and cannot effectively reduce interface thermal resistance.
Carbon nanomaterials have ultra-high thermal conductivity and have been widely used to solve the heat dissipation problem. However, when the carbon nanomaterial is used, a filling mode is adopted, and the thermal conductivity cannot meet the requirement; the constructed vertically oriented array has problems such as substrate dependence and difficulty in industrial production. At present, two modes are mainly adopted, namely, graphene or carbon nano tubes and a High polymer material are blended, but the vertical heat conductivity of the obtained material is difficult to exceed 10W/m.K, and the vertical heat conductivity coefficient of a matrix is 10W/m.K when the composite material contains 25vol% of graphene along with the product stability caused by uneven dispersion of the nano material in a High polymer matrix, namely, park et al (High Through-Plane Thermal Conduction of Graphene Nanoflake Filled Polymer Composites Melt-Processed in an L-Shape Kinked Tube, ACsappl.Mater.interfaces 2015,7,15256.) is used for dispersing and directionally arranging graphene fillers in the polymer; another application method is to construct a vertically oriented graphene or carbon nanotube array, and uses an alcohol-based Electric Field assisted PECVD method to prepare a VG array with a height of 18.7 μm, wherein the vertical thermal conductivity can reach 53.5W/m·k, and the thermal conductivity of the material is high but the application convenience is still problematic for users, such as the beginner of beijing university Zhang Jin (Electric-Field-Assisted Growth of Vertical Graphene Arrays and the Application in Thermal Interface Materials, adv. Funct. Mater.2020,30,2003302).
CN109881038B discloses a thermally conductive electromagnetic shielding composite material, comprising a polymer matrix composite material and a thermally conductive electromagnetic shielding film skeleton with a vertically oriented structure embedded therein; and the heat conduction electromagnetic shielding film skeleton is parallel to the extension direction of the polymer matrix composite; the heat-conducting electromagnetic shielding film skeleton is a composite film of any one or more of gold foil, silver foil, copper foil, nickel foil, aluminum foil, iron foil, titanium foil, zinc foil, chromium foil, cobalt foil, stainless steel plate and metal alloy; the thickness of the heat conduction electromagnetic shielding film skeleton is 0.01mm-0.2mm. The application has low cost, simple structure, simple and easy manufacture and mass production, and can be used as a thermal interface material and an electromagnetic shielding material of electronic devices. However, the vertical structure of the material is a simple mechanical design and processing method, such as a calendaring method, to make the high heat conduction shielding film into a vertical orientation structure, and the controllable preparation of the vertical orientation structure cannot be realized, so that the heat conduction coefficient and the compressibility are required to be further improved.
Therefore, it is necessary to develop a material having high heat conductive properties and good compression properties in a vertically oriented structure.
Disclosure of Invention
Aiming at the defects of the prior art, the application aims to provide the heat conducting material with the vertical orientation structure, and the preparation method and the application thereof.
One of the purposes of the application is to provide a preparation method of a heat conducting material with a vertical orientation structure, and the application adopts the following technical scheme:
a preparation method of a heat conducting material with a vertical orientation structure comprises the following steps:
1) Placing the planar heat conducting material between the gears, and enabling the planar heat conducting material to form a fan-like structure with vertical orientation through the meshing effect between the gears;
2) And (3) injecting an elastic material simultaneously during the engagement to fix the fan-like structure formed in the step (1) so as to obtain the heat conducting material with the vertical orientation structure.
According to the preparation method of the heat conduction material with the vertical orientation structure, the fan-like structure with the vertical orientation is formed by controlling the gear meshing effect, so that the gap of the fan-like structure with the vertical orientation can be effectively controlled, and the controllable preparation of the vertical orientation structure, such as the vertical orientation height and the vertical orientation width of the film, is realized; simultaneously injecting an elastic material, thereby effectively regulating and controlling the vertical heat conduction performance and the compressibility rebound performance of the film; solves the problems of low thermal conductivity, small compressibility of pure carbon materials and metal materials, single performance and the like of the current thermal interface materials; the heat conduction material prepared by the application can realize high heat conduction in the vertical direction and compressible joint filling capability, the vertical orientation heat conduction coefficient of the prepared heat conduction material is 6-600W/m.K, the compression ratio is 10-60%, the vertical structural stability can be kept in the subsequent die cutting and using processes, the situation of slag falling and the like can be avoided, and the heat conduction material can be applied to the fields of heat management materials and the like.
In the step 1), the distance between the gears is 0.01-1000 mu m, for example 0.01 μm, 0.02 μm, 0.03 μm, 0.04 μm, 0.05 μm, 0.06 μm, 0.07 μm, 0.08 μm, 0.09 μm, 0.1 μm, 0.2 μm, 0.3 μm, 0.4 μm, 0.5 μm, 0.6 μm, 0.7 μm, 0.8 μm, 0.9 μm, 1 μm, 2 μm, 3 μm, 4 μm, 5 μm, 6 μm, 7 μm, 8 μm, 9 μm, 10 μm, 11 μm 12 μm, 13 μm, 14 μm, 15 μm, 16 μm, 17 μm, 18 μm, 19 μm, 20 μm, 21 μm, 22 μm, 23 μm, 24 μm, 25 μm, 26 μm, 27 μm, 28 μm, 29 μm, 30 μm, 31 μm, 32 μm, 33 μm, 34 μm, 35 μm, 36 μm, 37 μm, 38 μm, 39 μm, 40 μm, 41 μm, 42 μm, 12 μm, 13 μm, 14 μm, 15 μm, 16 μm, 17 μm, 18 μm, 19 μm, 20 μm, 21 μm, 22 μm, 23 μm, 24 μm, 25 μm, 26 μm, 27 μm, and 28 μm, 29 μm, 30 μm, 31 μm, 32 μm, 33 μm, 34 μm, 35 μm, 36 μm, 37 μm, 38 μm, 39 μm, 40 μm, 41 μm, 42 μm, and, 600 μm, 700 μm, 800 μm, 900 μm or 1000 μm, preferably 0.1 to 50 μm, more preferably 0.5 to 20 μm; the depth of the gear is 10 to 5000 μm, for example, 10 μm, 20 μm, 30 μm, 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, 100 μm, 200 μm, 300 μm, 400 μm, 500 μm, 600 μm, 700 μm, 800 μm, 900 μm, 1000 μm, 1500 μm, 2000 μm, 2500 μm, 3000 μm, 3500 μm, 4000 μm, 4500 μm, 5000 μm, etc., preferably 30 to 2000 μm, more preferably 50 to 1000 μm.
In step 1), the fan-like structure has a gap of 0.005 to 1000 μm, for example, 0.005 μm, 0.01 μm, 0.05 μm, 0.1 μm, 0.5 μm, 1 μm, 5 μm, 10 μm, 15 μm, 20 μm, 25 μm, 30 μm, 35 μm, 40 μm, 45 μm, 50 μm, 55 μm, 60 μm, 65 μm, 70 μm, 75 μm, 80 μm, 85 μm, 90 μm, 95 μm, 100 μm, 200 μm, 300 μm, 400 μm, 500 μm, 600 μm, 700 μm, 800 μm, 900 μm or 1000 μm, etc., preferably 0.001 to 50 μm, further preferably 0.001 to 20 μm. The fan-like shape has a height of 10 to 5000 μm, for example, 10 μm, 20 μm, 30 μm, 50 μm, 60 μm, 80 μm, 100 μm, 200 μm, 300 μm, 400 μm, 500 μm, 600 μm, 700 μm, 800 μm, 900 μm, 1000 μm, 1500 μm, 2000 μm, 2500 μm, 3000 μm, 3500 μm, 4000 μm, 4500 μm or 5000 μm, etc., preferably 30 to 2000 μm, further preferably 50 to 1000 μm.
In the step 1), the planar heat conducting material is a carbon-based film and/or an inorganic heat conducting film.
Preferably, the carbon-based thin film is one of graphite, graphene, carbon tube or carbon fiber.
Preferably, the inorganic heat conductive film is one of a nitride film or an oxide heat conductive film.
In step 1), the planar heat conductive material has a thickness of 2 to 200 μm, for example, 2 μm, 5 μm, 10 μm, 15 μm, 20 μm, 25 μm, 30 μm, 35 μm, 40 μm, 45 μm, 50 μm, 55 μm, 60 μm, 65 μm, 70 μm, 75 μm, 80 μm, 85 μm, 90 μm, 95 μm, 100 μm, 105 μm, 110 μm, 115 μm, 120 μm, 125 μm, 130 μm, 135 μm, 140 μm, 145 μm, 150 μm, 160 μm, 165 μm, 170 μm, 175 μm, 180 μm, 185 μm, 190 μm, 195 μm or 200 μm, etc., preferably 5 to 50 μm, and more preferably 10 to 30 μm. Density of 0.3-4g/cm 3 For example 0.3g/cm 3 、0.4g/cm 3 、0.5g/cm 3 、0.6g/cm 3 、0.7g/cm 3 、0.8g/cm 3 、0.9g/cm 3 、1g/cm 3 、1.1g/cm 3 、1.2g/cm 3 、1.3g/cm 3 、1.4g/cm 3 、1.5g/cm 3 、1.6g/cm 3 、1.7g/cm 3 、1.8g/cm 3 、1.9g/cm 3 、2g/cm 3 、2.1g/cm 3 、2.2g/cm 3 、2.3g/cm 3 、2.4g/cm 3 、2.5g/cm 3 、2.6g/cm 3 、3g/cm 3 、3.2g/cm 3 、3.5g/cm 3 、3.8g/cm 3 、4g/cm 3 Etc., preferably 0.6-2.5g/cm 3 Further preferably 1-2g/cm 3 。
Preferably, the planar thermal conductivity of the planar thermal conductive material is 10 to 3000W/m.K, for example, 10W/m.K, 20W/m.K, 30W/m.K, 40W/m.K, 50W/m.K, 60W/m.K, 70W/m.K, 80W/m.K, 90W/m.K, 100W/m.K, 200W/m.K, 300W/m.K, 400W/m.K, 500W/m.K, 600W/m.K, 700W/m.K, 800W/m.K, 900W/m.K, 1000W/m.K, 1500W/m.K, 2000W/m.K, 2500W/m.K, 3000W/m.K, or the like. In the step 2), the elastic material is any one or a mixture of at least two of silica gel resin, silicone rubber resin, acrylic resin, epoxy resin, rubber resin and polyurethane elastomer containing heat conducting filler; the addition of the heat conducting filler can improve the heat conductivity coefficient of the elastic material and reduce the heat resistance of the whole material; the heat conducting filler is any one or a mixture of at least two of graphite, graphene, carbon tubes, carbon fibers, nitrides or oxides.
Preferably, the mass of the heat conducting filler accounts for 0-90% of the mass of the elastic material; for example, 0, 1%, 5%, 10%, 15%, 20%, 25%, 30%, 35%, 40%, 45%, 50%, 55, 60%, 65%, 70%, 75%, 80%, 85%, 90%, etc.
Preferably, when the consumption of the heat-conducting filler exceeds 90% of the system, the system has the conditions of high viscosity, low compression ratio, easy powder falling and the like caused by too much heat-conducting filler; in contrast, when the amount of the heat conductive filler is 0, that is, the amount of the silica gel resin, the silicone rubber resin, the acrylic resin, the epoxy resin, the rubber resin, and the urethane elastomer added is 100%, the coefficient of heat conductivity of the system is reduced, but the use and the compression ratio are easy, so that a proper filling ratio is selected according to practical situations.
The step 2) is followed by a step of extruding the fixed fan-like structure, and the gap of the fan-like structure can be reduced in an extruding mode, so that the gap of the vertical orientation film structure is effectively controlled, the controllable preparation of the vertical orientation structure is realized, and the vertical orientation heat conductivity and the compression performance are further improved.
Wherein the pressure of the extrusion is 0.01-20MPa, for example 0.01MPa, 0.1MPa, 0.5MPa, 1MPa, 2MPa, 3MPa, 4MPa, 5MPa, 6MPa, 7MPa, 8MPa, 9MPa, 10MPa, 11MPa, 12MPa, 13MPa, 14MPa, 15MPa, 16MPa, 17MPa, 18MPa, 19MPa or 20MPa, etc.
Preferably, the gap of the fan-like structure is reduced by 5-60% after extrusion.
The second purpose of the application is to provide the heat conduction material with the vertical orientation structure prepared by the preparation method.
It is a further object of the present application to provide an application of the second heat conductive material with a vertically oriented structure, in which the heat conductive material with a vertically oriented structure is used for preparing a heat management material, for example, the heat conductive material with a vertically oriented structure is used in the fields of computers, telecommunications, durable consumer goods, medical appliances, industrial machinery, automobile electronics, etc., so as to solve the problem that the vertical heat conductivity of the existing material is not high.
Compared with the prior art, the application has the beneficial effects that:
the heat conducting material with the vertical orientation structure can realize the controllable preparation of the vertical orientation structure, has high heat conducting performance in vertical orientation, good compression retraction elasticity and strength, and improves the operability of subsequent die cutting. Specifically, the thermal conductivity coefficient of the vertical orientation of the prepared thermal conductive material is 6-600W/m.K, the compression ratio is 10-60%, and the vertical structural stability and the slag falling and other conditions can be kept in the subsequent die cutting and using processes.
Drawings
FIG. 1 is a schematic structural view of a thermally conductive material having a vertically oriented structure according to the present application;
FIG. 2 is an SEM plan view of a thermally conductive material having a vertically oriented structure;
FIG. 3 is a microscopic view of a thermally conductive material having a vertically oriented structure;
fig. 4 is a perspective view of a thermally conductive material having a vertically oriented structure.
Detailed Description
The technical scheme of the application is further described below by means of specific embodiments with reference to fig. 1-4.
The various starting materials of the present application are commercially available, or may be prepared according to methods conventional in the art, unless specifically indicated.
Example 1
The preparation method of the heat conducting material with the vertical orientation structure of the embodiment comprises the following steps:
a commercially available graphite film having a density of 1.8g/cm was placed between two intermeshing gears 3 The plane heat conductivity coefficient is 1200W/m.K, and the thickness is 12 mu m; the distance between the gears is 30 mu m, and the depth of the gears is 100 mu m; graphite film is formed into a vertical orientation by the meshing action between gearsThe sector structure is simultaneously injected with elastic silica gel resin (model is DOW SYLGARD 184), and the formed sector-like structure has an intermediate gap of about 20 μm and a height of about 140 μm, so as to obtain the heat conducting material with a vertical orientation structure.
The structure diagram of the heat conducting material manufactured in this embodiment is shown in fig. 1, the plane SEM is shown in fig. 2, the microscopic diagram of the heat conducting material with the vertical orientation structure is shown in fig. 3, the fan-like structure is shown in fig. 4, and it can be seen that the heat conducting material manufactured in this embodiment has a good vertical orientation structure.
Example 2
The preparation method of the heat conducting material with the vertical orientation structure of the embodiment comprises the following steps:
a commercially available graphite film having a density of 1.8g/cm was placed between two intermeshing gears 3 The plane heat conductivity coefficient is 1200W/m.K, and the thickness is 12 mu m; the distance between the gears is 30 mu m, and the depth of the gears is 100 mu m; the graphite film is formed into a sector-like structure with vertical orientation through the meshing effect between the gears, meanwhile, elastic silica gel resin (model DOW SYLGARD 184) is injected, the formed sector-like structure with vertical orientation is extruded, the pressure is 10MPa, the middle gap of the formed sector-like structure is about 14 mu m, and the height of the sector-like structure is about 140 mu m, so that the heat conducting material with the vertical orientation structure is obtained.
Example 3
A commercially available graphite film having a density of 1.8g/cm was placed between two intermeshing gears 3 The plane heat conductivity coefficient is 1200W/m.K, and the thickness is 12 mu m; the distance between the gears is 30 mu m, and the depth of the gears is 100 mu m; the graphite film forms a sector-like structure with vertical orientation through the meshing effect between gears, meanwhile, an elastic material is injected, the elastic material consists of 5% of graphene, 5% of carbon nano tubes and 90% of elastic silica gel resin (model DOW SYLGARD 184) in percentage by mass, the formed sector-like structure with vertical orientation is extruded under the pressure of 10MPa, the middle gap of the formed sector-like structure is about 14 mu m, and the height of the sector-like structure is about 140 mu m, so that the graphite film is obtainedA thermally conductive material having a vertically oriented structure.
Example 4
The difference between this example and example 3 is that the graphite film is replaced by an inorganic high heat conduction film prepared by suction filtration, specifically a mixed film of flaky boron nitride and spherical aluminum oxide, and the specific process is that the flaky boron nitride and spherical aluminum oxide are mixed according to the mass ratio of 8:2, and the film is prepared by suction filtration, and the density of the prepared inorganic high heat conduction film is 2.4g/cm 3 The thickness was 100. Mu.m, the thermal conductivity was 50W/mK, and the same as in example 3 was repeated.
Example 5
This embodiment differs from embodiment 3 in that the gear pitch is 200 μm, and the other is the same as embodiment 3.
Example 6
The difference between this example and example 3 is that the graphite film is replaced with a carbon nanotube/graphene composite film prepared by coating, specifically, the mass ratio of carbon nanotube to graphene is 2:8, mixing, preparing a carbon nano tube/graphene composite film in a coating mode, wherein the density of the prepared composite film is 1.4g/cm 3 The thickness was 50. Mu.m, the planar thermal conductivity was 1000W/mK, and the same as in example 3 was repeated.
Example 7
This example differs from example 3 in that the gear pitch was replaced with 1000 μm at 30 μm, and the other is the same as example 2.
Example 8
This example differs from example 3 in that the elastic silicone resin was replaced with an acrylic resin, and the other is the same as in example 3.
Example 9
The difference between this example and example 3 is that the elastic material is composed of, in mass percent, 70% of elastic silica gel resin, 15% of carbon nanotubes and 15% of graphene, and the other is the same as that of example 3.
Example 10
This example differs from example 3 in that the elastic material is composed of 10% by mass of an elastic silicone resin, 40% by mass of boron nitride and 50% by mass of silicon dioxide, and the other is the same as example 3.
Example 11
The difference between this embodiment and embodiment 3 is that the pitch of the gears is 0.01 μm, and the other is the same as that of embodiment 3.
Example 12
This example differs from example 3 in that the extrusion pressure was too high, 30MPa, and otherwise the same as in example 3, the film was broken during the preparation.
Example 13
The difference between this embodiment and embodiment 3 is that the elastic material is different from the elastic material, and the elastic material is composed of 5% of elastic silica gel resin, 45% of carbon nanotubes and 50% of graphene according to mass percentage, and the other materials are the same as those of embodiment 3, when the elastic heat-conducting composite material is injected, the situation that uniformity is poor, slag is easy to fall off after drying, the vertical orientation structure of the heat-conducting film is difficult to maintain and the like are caused by high viscosity, and the increase amplitude of the vertical heat-conducting coefficient of the system is very low.
Example 14
The difference between this embodiment and embodiment 3 is that the pitch of the gears is 1500 μm, and the other is the same as that of embodiment 3.
Comparative example 1
The present comparative example differs from example 1 in that in step 1), a heat conductive material was prepared by a conventional calendering method, specifically: the film is pressed by a calender, and the film with a vertical orientation structure cannot be prepared, and only the film can be more compact in the plane direction.
Comparative example 2
This comparative example differs from example 1 in that in step 1), no elastic material was injected, and the other is the same as example 1.
The thermal conductivity of the films prepared in examples 1-14 and comparative examples 1-2 was measured by the laser thermal conductivity method (relaxation resistance, LFA 447), and the test results are shown in table 1.
TABLE 1
As can be seen from Table 1, the heat conducting material with the vertical orientation structure prepared by the application can realize the controllable preparation of the vertical orientation structure, has high heat conducting property in vertical orientation, good compression retraction elastic energy and strength, and improves the operability of subsequent die cutting. Specifically, the heat conductivity coefficient of the vertical orientation is 6-600W/m.K, and the compression ratio is 10-60%.
In comparative examples 1-3, the vertical thermal conductivity of the thermally conductive material was improved by the vertical structure of the compressed film of example 2, and by the addition of the thermally conductive filler to the elastomeric silicone resin of example 3, both with respect to example 1.
Compared with the embodiment 3, the embodiment 6 replaces the planar heat conduction material with the carbon nano tube/graphene composite film prepared by suction filtration or coating, and the two films can well prepare a vertically oriented structure and obtain a higher vertical heat conduction coefficient.
In example 5 and example 7, the vertical thermal conductivity of the thermal conductive material was gradually decreased by changing the gear pitch from 30 μm to 200 μm and 1000 μm, respectively, with respect to example 3.
In example 8, the elastic material was replaced with acrylic resin, and the vertical thermal conductivity of the thermal conductive material was not changed much, so that the compression ratio of the thermal conductive material was lowered, compared with example 3.
Compared with example 3, example 9 increases the amount of the heat conductive filler, decreases the amount of the elastic silicone resin, and increases the vertical heat conductivity of the heat conductive material from 356W/mK to 461W/mK.
Compared with example 3, in example 10, the 10% graphene carbon nanotube composite heat conductive filler is replaced by 90% inorganic heat conductive filler, and even if the amount of the inorganic heat conductive filler is greatly increased, the vertical heat conductivity coefficient of the prepared heat conductive material is greatly reduced, and the compression rate is also greatly reduced.
Too much pressure for the extrusion of example 12 relative to example 3 can cause breakage of the film.
Compared with example 3, example 13 has the advantages that the system is easy to remove slag and the vertical orientation structure of the heat conducting material is easy to damage because the heat conducting filler is excessively added into the elastic resin system.
The vertical thermal conductivity of the thermally conductive material was greatly reduced relative to example 3, in which the gear gap was increased in example 14.
Comparative example 1 a conventional calendaring process was used to prepare a thermally conductive material, and the process used in comparative example 1 failed to achieve a vertically oriented structure and the thermally conductive material had a lower vertical thermal conductivity than the material prepared by the gear engagement method of the present application.
Comparative example 2, without the injection of the elastic material, makes it difficult for the heat conductive material to maintain a vertically oriented structure, which is easily damaged during subsequent processing.
The detailed process equipment and process flow of the present application are described by the above embodiments, but the present application is not limited to, i.e., it does not mean that the present application must be practiced depending on the detailed process equipment and process flow. It should be apparent to those skilled in the art that any modification of the present application, equivalent substitution of raw materials for the product of the present application, addition of auxiliary components, selection of specific modes, etc., falls within the scope of the present application and the scope of disclosure.
The preferred embodiments of the present application have been described in detail above, but the present application is not limited to the specific details of the above embodiments, and various simple modifications can be made to the technical solution of the present application within the scope of the technical concept of the present application, and all the simple modifications belong to the protection scope of the present application.
In addition, the specific features described in the above embodiments may be combined in any suitable manner, and in order to avoid unnecessary repetition, various possible combinations are not described further.
Moreover, any combination of the various embodiments of the application can be made without departing from the spirit of the application, which should also be considered as disclosed herein.

Claims (9)

1. A method for preparing a thermally conductive material having a vertically oriented structure, comprising the steps of:
1) Placing the planar heat conducting material between the gears, and enabling the planar heat conducting material to form a fan-like structure with vertical orientation through the meshing effect between the gears;
2) Simultaneously injecting an elastic material during the biting so as to fix the fan-like structure formed in the step 1), thereby obtaining the heat conducting material with the vertical orientation structure;
in the step 1), the distance between the gears is 0.01-1000 mu m, the depth of the gears is 10-100 mu m, the gap of the fan-like structure is 0.005-1000 mu m, and the height of the fan-like structure is 10-5000 mu m;
in the step 1), the planar heat conducting material is a carbon-based film, and the carbon-based film is one of graphite, graphene, carbon tube or carbon fiber;
the step 2) is followed by a step of extruding the fixed fan-like structure, wherein the extruding pressure is 0.01-20MPa.
2. The method according to claim 1, wherein in step 1), the planar heat conductive material has a thickness of 2 to 200 μm and a density of 0.3 to 4g/cm 3 。
3. The method of claim 1, wherein the planar thermal conductivity of the planar thermally conductive material is 10-3000W/m-K.
4. The method according to claim 1, wherein in the step 2), the elastic material is any one or a mixture of at least two of a silicone resin, an acrylic resin, an epoxy resin, a rubber resin, and a polyurethane elastomer containing a heat conductive filler.
5. The method according to claim 4, wherein the heat conductive filler is any one or a mixture of at least two of graphite, graphene, carbon tubes, carbon fibers, nitrides, or oxides.
6. The method according to claim 4, wherein the mass of the heat conductive filler is 0 to 90% of the mass of the elastic material.
7. The method of claim 1, wherein the gaps between the fan-like structures are reduced by 5-60% after extrusion.
8. A heat conductive material having a vertically oriented structure obtained by the production method according to any one of claims 1 to 7.
9. Use of a thermally conductive material with a vertically oriented structure as claimed in claim 8 for the preparation of a thermal management material.
CN202210632875.8A 2022-06-06 2022-06-06 Heat conduction material with vertical orientation structure and preparation method and application thereof Active CN114836036B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210632875.8A CN114836036B (en) 2022-06-06 2022-06-06 Heat conduction material with vertical orientation structure and preparation method and application thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210632875.8A CN114836036B (en) 2022-06-06 2022-06-06 Heat conduction material with vertical orientation structure and preparation method and application thereof

Publications (2)

Publication Number Publication Date
CN114836036A CN114836036A (en) 2022-08-02
CN114836036B true CN114836036B (en) 2023-10-03

Family

ID=82574162

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210632875.8A Active CN114836036B (en) 2022-06-06 2022-06-06 Heat conduction material with vertical orientation structure and preparation method and application thereof

Country Status (1)

Country Link
CN (1) CN114836036B (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005146057A (en) * 2003-11-12 2005-06-09 Polymatech Co Ltd High-thermal-conductivity molding and method for producing the same
CN103805144A (en) * 2014-03-04 2014-05-21 中国科学院宁波材料技术与工程研究所 Graphene heat conducting film and preparation method thereof
CN109109394A (en) * 2017-06-23 2019-01-01 卫普实业股份有限公司 Elastic film composite material and its manufacturing method
CN109881038A (en) * 2019-03-08 2019-06-14 深圳先进技术研究院 A kind of thermally conductive electromagnetic shielding composite material and preparation method thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005146057A (en) * 2003-11-12 2005-06-09 Polymatech Co Ltd High-thermal-conductivity molding and method for producing the same
CN103805144A (en) * 2014-03-04 2014-05-21 中国科学院宁波材料技术与工程研究所 Graphene heat conducting film and preparation method thereof
CN109109394A (en) * 2017-06-23 2019-01-01 卫普实业股份有限公司 Elastic film composite material and its manufacturing method
CN109881038A (en) * 2019-03-08 2019-06-14 深圳先进技术研究院 A kind of thermally conductive electromagnetic shielding composite material and preparation method thereof

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
"Tropical Cyclone Intensification Simulated in the Ooyama-Type Three-Layer Model with a Multilevel Boundary Layer";RONG FEI etal;《JOURNAL OF THE ATMOSPHERIC SCIENCES》;第1卷(第1期);3799-3813 *
"基于外力诱导取向的高导热聚合物基复合材料研究进展";陈海斌等;《复合材料学报》;第39卷(第4期);1486-1497 *

Also Published As

Publication number Publication date
CN114836036A (en) 2022-08-02

Similar Documents

Publication Publication Date Title
Liu et al. 3D lamellar-structured graphene aerogels for thermal interface composites with high through-plane thermal conductivity and fracture toughness
Ma et al. Highly thermal conductivities, excellent mechanical robustness and flexibility, and outstanding thermal stabilities of aramid nanofiber composite papers with nacre-mimetic layered structures
Xiao et al. Preparation of highly thermally conductive epoxy resin composites via hollow boron nitride microbeads with segregated structure
JP6671735B2 (en) Manufacturing method of heat conductive sheet
Niu et al. Recent progress on thermally conductive and electrical insulating rubber composites: Design, processing and applications
CN110945647B (en) Heat conducting fin
EP2871674B1 (en) Thermally conductive sheet
JP2003112915A (en) Graphitized carbon powder and heat conductive composite material composition
JP2005146057A (en) High-thermal-conductivity molding and method for producing the same
CN113321933B (en) Longitudinal high-thermal-conductivity gasket, preparation method and application
JP2003321554A (en) Heat-conductive molding and method for producing the same
CN112251026A (en) Heat-conducting gasket with fillers orderly arranged in inclined manner and preparation method thereof
CN108368418B (en) Two-dimensional heat conducting material and use thereof
Yang et al. Methods for enhancing the thermal properties of epoxy matrix composites using 3D network structures
CN112280540A (en) Preparation method of high-thermal-conductivity graphene-metal particle composite material
Li et al. Liquid bridge: liquid metal bridging spherical BN largely enhances the thermal conductivity and mechanical properties of thermal interface materials
CN109486204A (en) A kind of heat conductive insulating composite material and preparation method
CN114836036B (en) Heat conduction material with vertical orientation structure and preparation method and application thereof
Jiang et al. Highly thermally conductive and negative permittivity epoxy composites by constructing the carbon fiber/carbon networks
CN112080137B (en) Heat-conducting, electromagnetic-shielding and high-strength nylon 6 composite material and preparation method thereof
CN112280541A (en) Preparation method of high-thermal-conductivity composite material based on graphitized poly-dopamine-coated metal particles
CN110894338B (en) Controllable deformation accurate regulation and control composite material based on super-elastic network and preparation method and application thereof
US20240120254A1 (en) Thermally-conductive sheet and electronic device
CN111674115B (en) Artificial graphite flake high-orientation arranged heat conducting sheet and preparation method thereof
Zhao et al. SiC nanowires bridged graphene aerogels with a vertically aligned structure for highly thermal conductive epoxy resin composites and their mechanism

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant