CN114828549A - Server cabinet and data center - Google Patents

Abstract

The invention relates to a server cabinet and a data center, wherein the server cabinet comprises a closed cabinet body, an IT equipment unit, a liquid-air heat exchanger and a fan, the IT equipment unit, the liquid-air heat exchanger and the fan are all arranged in the closed cabinet body, the liquid-air heat exchanger and the IT equipment unit are mutually connected in series or in parallel on a cooling liquid pipeline, the liquid-air heat exchanger is arranged on the windward side of the IT equipment unit or the leeward side of the IT equipment unit, and the fan is used for generating airflow blowing to the IT equipment unit in the closed cabinet body and blowing the airflow flowing through the IT equipment unit to the IT equipment unit after being cooled by the liquid-air heat exchanger. Therefore, in the process of cooling the IT equipment unit in the closed cabinet body through the liquid-air heat exchanger and the fan, airflow circularly flows inside the closed cabinet body all the time and cannot diffuse to the outside of the closed cabinet body, so that the problems of overhigh temperature and overlarge noise in a machine room are effectively reduced, and the working environment of operation and maintenance personnel is improved.

Description

Server cabinet and data center

Technical Field

The disclosure relates to the technical field of data centers, in particular to a server cabinet and a data center.

Background

Along with the wide application of internet, cloud calculation etc, data center presents the growth of explosion formula, at present, in order to realize the cooling heat dissipation to data center, can set up the air conditioning unit that is used for blowing cold wind to the computer lab inside usually in the computer lab, seted up air intake and air outlet on the server rack, and be provided with the fan in the server rack, the fan is used for making wind flow into inside the server rack from the air intake to make the inside wind of flowing into the server rack flow out from the air outlet behind the equipment in the cooling server rack. In the process of using the scheme to radiate the data center, the machine room can generate interference such as large environmental noise and airflow, and the temperature in the machine room can reach 35-40 degrees when the machine room is hot in summer, so that the working environment of operation and maintenance personnel can be influenced.

In addition, still have the cooling method of submergence liquid cooling, promptly, submerge the server rack in the coolant liquid completely, but the cooling method cost of submergence liquid cooling is higher, and the waterproof sealing performance requirement to the server rack is high, also is not convenient for the daily fortune dimension of fortune dimension personnel to data center.

Disclosure of Invention

The purpose of the present disclosure is to provide a server cabinet and a data center, so as to solve technical problems existing in the related art.

In order to achieve the above object, according to a first aspect of the present disclosure, there is provided a server rack including:

a closed cabinet body;

the IT equipment unit is arranged in the closed cabinet body;

a liquid-air heat exchanger arranged in the closed cabinet body and connected with the IT equipment unit in series or in parallel on a cooling liquid pipeline, the liquid-air heat exchanger is arranged on the windward side of the IT equipment unit or the leeward side of the IT equipment unit,

and the fan is arranged in the closed cabinet body and used for generating airflow blowing to the IT equipment unit in the closed cabinet body, and cooling the airflow flowing through the IT equipment unit through the liquid-air heat exchanger and then blowing to the IT equipment unit.

Optionally, the server cabinet further includes a housing, the IT equipment unit and the fan are both installed in the housing, an air inlet and an air outlet are formed in the housing, the IT equipment unit is located between the air inlet and the air outlet, an air duct through which air flows is formed between an outer wall of the housing and an inner wall of the closed cabinet, and the air inlet and the air outlet are both communicated with the air duct;

the liquid-air heat exchanger is positioned in the shell and is close to the air inlet; or the liquid-air heat exchanger is positioned in the shell and is close to the air outlet; or the liquid-air heat exchanger is positioned outside the shell and close to the air inlet; or the liquid-air heat exchanger is positioned outside the shell and close to the air outlet.

Optionally, a gap is formed between the outer wall of the shell and the inner wall of the closed cabinet, and the gap is the air duct; alternatively, the first and second electrodes may be,

the server cabinet further comprises an air pipe, the air pipe is arranged between the inner wall of the closed cabinet body and the outer wall of the shell, and the air channel is formed inside the air pipe.

Optionally, the IT equipment unit includes a central processing unit, a hard disk drive, a network interface controller, a dual in-line memory module, and a power supply;

the hard disk drive and the network interface controller are both arranged close to the windward side, the power supply is arranged close to the leeward side, and the central processing unit and the dual in-line storage module are arranged between the hard disk drive and the network interface controller and between the power supply.

Optionally, the liquid-air heat exchanger is disposed adjacent to the power supply, and the fan is located between the hard disk drive and the network interface controller and the central processor and the dual in-line memory module.

Optionally, the central processing unit is provided with a plurality of cold plates, the central processing unit and the cold plates are both provided in plurality, the plurality of cold plates and the plurality of central processing units are arranged in a one-to-one correspondence manner, the plurality of cold plates are mutually connected in series or in parallel to form a cold plate group, and the cold plate group and the liquid-air heat exchanger are mutually connected in series or in parallel.

Optionally, the server cabinet further includes a temperature sensor, the temperature sensor is disposed on a windward side of the IT equipment unit and configured to detect a temperature of the air flow cooled by the liquid-air heat exchanger, and the temperature sensor is electrically connected to the fan, so that a rotation speed of the fan can be adjusted according to a temperature value detected by the temperature sensor.

Optionally, the water inlet of the cooling liquid pipeline is used for being connected with the water outlet of the cooling tower, and the water outlet of the cooling liquid pipeline is used for being connected with the water inlet of the cooling tower.

Optionally, the server cabinet further includes a water inlet connection structure and a water outlet connection structure, the water inlet connection structure is connected to the first water inlet interface and the first water outlet interface, the water outlet connection structure is connected to the second water inlet interface and the second water outlet interface, the first water inlet interface is used for being connected to the water outlet of the cooling tower, the first water outlet interface is connected to the water inlet of the cooling liquid pipeline, the second water inlet interface is connected to the water outlet of the cooling liquid pipeline, and the second water outlet interface is used for being connected to the water inlet of the cooling tower;

be formed with first through-hole and second through-hole on the airtight cabinet body, the connection structure of intaking wears to locate first through-hole, just first interface of intaking is located airtight cabinet is external, go out water connection structure and wear to locate the second through-hole, just second interface of going out water is located airtight cabinet is external, intake connection structure with be provided with first sealing member between the first through-hole, go out water connection structure with be provided with the second sealing member between the second through-hole.

Optionally, the number of the IT equipment units and the number of the cooling liquid pipelines are multiple, and the multiple cooling liquid pipelines and the multiple IT equipment units are arranged in a one-to-one correspondence manner;

the water inlet connecting structure is a water distributor, the number of the first water outlet interfaces is multiple, and the multiple first water outlet interfaces are correspondingly connected with the water inlets of the multiple cooling liquid pipelines one by one;

the water outlet connecting structure is a water collector, the number of the second water inlet connectors is multiple, and the second water inlet connectors are connected with the water outlets of the cooling liquid pipelines in a one-to-one correspondence mode.

Optionally, the liquid-air heat exchanger is a surface cooler.

According to a second aspect of the present disclosure, a data center includes a server rack as described above.

Optionally, the data center further includes a cooling tower, a water inlet of the cooling liquid pipeline of the server cabinet is connected to a water outlet of the cooling tower, and a water outlet of the cooling liquid pipeline of the server cabinet is connected to a water inlet of the cooling tower.

Through the technical scheme, the liquid-air heat exchanger and the IT equipment unit are mutually connected in series or in parallel on the cooling liquid pipeline, so that on one hand, the cooling liquid can exchange heat with the IT equipment unit in the flowing process of the cooling liquid in the cooling liquid pipeline to bring heat generated by the IT equipment unit out of the closed cabinet body, on the other hand, the fan blows airflow to the IT equipment unit, the airflow exchanges heat with the IT equipment unit to bring heat generated by the IT equipment away, the IT equipment unit can be further cooled and radiated, and after the airflow blown by the fan exchanges heat with the IT equipment unit to become high-temperature airflow, the high-temperature airflow can exchange heat with the high-temperature airflow when flowing through the liquid-air heat exchanger, so that the high-temperature airflow is cooled to become low-temperature airflow and then blown to the IT equipment unit again, the circulation purging of the IT equipment is achieved, and the heat dissipation effect of the IT equipment unit is improved.

By the technical scheme, the IT equipment unit in the server cabinet can be cooled in a liquid cooling and air cooling combined mode, for liquid cooling, the liquid-air heat exchanger and the IT equipment unit are connected in series or in parallel on a cooling liquid pipeline, and when cooling liquid in the cooling liquid pipeline flows through the IT equipment unit, the cooling liquid can exchange heat with the IT equipment unit, absorb heat of the IT equipment unit, and realize liquid cooling of the IT equipment unit; for air cooling, the fan blows airflow to the IT equipment unit, the airflow exchanges heat with the IT equipment unit and takes away heat generated by the IT equipment unit, a further cooling and heat dissipation effect can be achieved on the IT equipment unit, when the airflow with higher temperature absorbing the heat of the IT equipment unit flows through the liquid-air heat exchanger, cooling liquid in the liquid-air heat exchanger exchanges heat with the airflow with higher temperature, so that the airflow with higher temperature is cooled, and the cooled airflow with lower temperature is blown to the IT equipment unit again, namely, under the action of the fan, circulating airflow flowing through the IT equipment unit and the liquid-air heat exchanger is generated in the closed cabinet body, and continuous air cooling of the IT equipment unit is achieved.

And, because the airtight effect of the airtight cabinet body, the cooling air current of cooling IT equipment unit is at the internal circulation of airtight cabinet all the time and flows, can not flow the airtight cabinet body to the airtight cabinet body also can play certain sound-proof ability, thereby can effectively reduce the too high, the too big problem of noise of temperature in the computer lab, promote fortune dimension personnel's operational environment experience and fortune dimension efficiency.

In addition, compare with the technical scheme who cools off the server rack through the mode of submergence liquid cooling, this disclosure need not to be with the server rack submergence in the coolant liquid, and the cooling cost is lower, also is more convenient for the daily fortune dimension of fortune dimension personnel.

Additional features and advantages of the disclosure will be set forth in the detailed description which follows.

Drawings

The accompanying drawings, which are included to provide a further understanding of the disclosure and are incorporated in and constitute a part of this specification, illustrate embodiments of the disclosure and together with the description serve to explain the disclosure without limiting the disclosure. In the drawings:

FIG. 1 is a schematic top view of a server rack provided by an exemplary embodiment of the present disclosure, wherein the top of the housing is not shown and the direction of the arrows is the direction of airflow;

FIG. 2 is a schematic top view of a server rack provided by an exemplary embodiment of the present disclosure, wherein the top of the housing and the air duct are not shown and the liquid-to-air heat exchanger is disposed inside the housing;

FIG. 3 is a schematic top view of a server rack provided by another exemplary embodiment of the present disclosure, wherein the top of the enclosure and the air duct are not shown and the liquid-to-air heat exchanger is disposed outside the enclosure;

FIG. 4 is a schematic view of an assembly of a liquid-to-air heat exchanger and cold plates of a server rack provided by an exemplary embodiment of the present disclosure;

FIG. 5 is a schematic layout of the IT equipment units, the housings, the fans, and the liquid-air heat exchangers of the server rack provided by an exemplary embodiment of the present disclosure, wherein the direction pointed by the arrows is the flow direction of the airflow;

FIG. 6 is a schematic connection diagram of a cooling tower of a data center and water inlet and outlet connections of a server rack provided by an exemplary embodiment of the present disclosure;

FIG. 7 is a schematic diagram of the connection of the liquid-to-air heat exchanger, the cold plate and the cooling tower of the data center of the server rack provided by the first exemplary embodiment of the present disclosure;

FIG. 8 is a schematic diagram of the connection of the liquid-to-air heat exchanger, the cold plate and the cooling tower of the data center of the server rack provided by the second exemplary embodiment of the present disclosure;

FIG. 9 is a schematic diagram of the connection of the liquid-to-air heat exchanger, the cold plate and the cooling tower of the data center of the server rack provided by the third exemplary embodiment of the disclosure;

FIG. 10 is a schematic diagram of the connection of the liquid-to-air heat exchanger, the cold plate and the cooling tower of the data center of the server rack provided by the fourth exemplary embodiment of the present disclosure;

fig. 11 is a schematic perspective view of a server rack provided in an exemplary embodiment of the present disclosure.

Description of the reference numerals

2-coolant line; 10-a closed cabinet body; 11-a first via; 12-a second via; 20-IT equipment units; 201-a central processing unit; 202-hard disk drive; 203-network interface controller; 205-a power supply; 206-dual inline memory module; 30-liquid-air heat exchanger; 40-a fan; 50-a housing; 51-an air inlet; 52-air outlet; 53-air duct; 60-cold plate; 70-a temperature sensor; 80-a water inlet connection structure; 81-a water separator; 810-a first water inlet interface; 820-a first water outlet interface; 90-a water outlet connection structure; 91-a water collector; 910-a second water inlet interface; 920-a second water outlet interface; 100-cooling tower.

Detailed Description

The following detailed description of specific embodiments of the present disclosure is provided in connection with the accompanying drawings. It should be understood that the detailed description and specific examples, while indicating the present disclosure, are given by way of illustration and explanation only, not limitation.

In the present disclosure, unless otherwise specified, "inner and outer" mean inner and outer of the outline of the corresponding structure, and "distal and proximal" mean distal and proximal from the corresponding structure. Furthermore, the terms "first," "second," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.

Referring to fig. 1-11, according to a first aspect of the present disclosure, there is provided a server rack comprising: the air-conditioning system comprises a closed cabinet 10, an IT equipment unit 20, a liquid-air heat exchanger 30 and a fan 40, wherein the IT equipment unit 20, the liquid-air heat exchanger 30 and the fan 40 are all arranged in the closed cabinet 10, the liquid-air heat exchanger 30 and the IT equipment unit 20 are mutually connected in series or in parallel on a cooling liquid pipeline 2, the liquid-air heat exchanger 30 is arranged on the windward side of the IT equipment unit 20 or the leeward side of the IT equipment unit 20, and the fan 40 is used for generating air flow blowing towards the IT equipment unit 20 in the closed cabinet 10, cooling the air flow flowing through the IT equipment unit 20 through the liquid-air heat exchanger 30 and then blowing towards the IT equipment unit 20.

By the technical scheme, the IT equipment unit 20 in the server cabinet can be cooled in a liquid cooling and air cooling combined mode, for the liquid cooling, as the liquid-air heat exchanger 30 and the IT equipment unit 20 are connected in series or in parallel on the cooling liquid pipeline 2, when the cooling liquid in the cooling liquid pipeline flows through the IT equipment unit 20, the cooling liquid can exchange heat with the IT equipment unit 20, the heat of the IT equipment unit 20 is absorbed, and the liquid cooling of the IT equipment unit 20 is realized; for air cooling, the fan 40 blows an air flow to the IT equipment unit 20, the air flow exchanges heat with the IT equipment unit 20 and takes away the heat generated by the IT equipment unit 20, a further cooling and heat dissipation effect can be achieved on the IT equipment unit 20, when the air flow with higher temperature absorbing the heat of the IT equipment unit 20 flows through the liquid-air heat exchanger 30, the cooling liquid in the liquid-air heat exchanger 30 exchanges heat with the air flow with higher temperature, so as to cool the air flow with higher temperature, and the cooled air flow with lower temperature blows to the IT equipment unit 20 again, that is, under the action of the fan 40, a circulating air flow flowing through the IT equipment unit and the liquid-air heat exchanger 30 is generated in the closed cabinet 10, so as to achieve continuous air cooling of the IT equipment unit 20.

And, because the airtight effect of airtight cabinet body 10, the cooling air current of cooling IT equipment unit 20 is the internal circulation flow all the time at airtight cabinet body 10, can not flow airtight cabinet body 10 to airtight cabinet body 10 also can play certain sound-proof ability, thereby can effectively reduce the too high, the too big problem of noise of temperature in the computer lab, promote fortune dimension personnel's operational environment experience and fortune dimension efficiency.

In addition, compare with the technical scheme who cools off the server rack through the mode of submergence liquid cooling, this disclosure need not to be with the server rack submergence in the coolant liquid, and the cooling cost is lower, also is more convenient for the daily fortune dimension of fortune dimension personnel.

IT should be noted that, as mentioned above, the windward side of the IT equipment unit 20 refers to the side of the IT equipment unit 20 facing the airflow flowing through the IT equipment unit, and the leeward side of the IT equipment unit 20 refers to the side of the airflow flowing through the IT equipment unit 20 flowing out of the IT equipment unit.

In addition, as shown in fig. 7 to 10, the liquid-air heat exchanger 30 may be connected in series with the IT equipment unit 20 or in parallel with each other on the cooling liquid line 2, and for the case where the liquid-air heat exchanger 30 may be connected in series with the IT equipment unit 20 on the cooling line, the liquid-air heat exchanger 30 may be located upstream of the IT equipment unit 20 in the flow direction of the cooling liquid, or the IT equipment unit 20 may be located upstream of the liquid-air heat exchanger 30, which is not limited by the present disclosure. To the extent that the liquid-to-air heat exchanger 30 and the IT equipment unit 20 can be connected in parallel to each other on the cooling line, the cooling liquid line 2 can be split into two paths, one path flowing to the liquid-to-air heat exchanger 30 and the other path flowing to the IT equipment unit 20. Further, the present disclosure does not limit the coolant supply apparatus that supplies the low-temperature coolant to the coolant line 2, and the coolant supply apparatus may be a cooling tower 100, an air conditioning unit, or the like.

Alternatively, the number of the liquid-air heat exchanger 30 and the fan 40 may be one or more, and the disclosure is not limited thereto.

Optionally, in an embodiment provided by the present disclosure, as shown in fig. 1, fig. 2, fig. 3, and fig. 5, the server cabinet may further include a casing 50, the IT equipment unit 20 and the fan 40 are both installed in the casing 50, an air inlet 51 and an air outlet 52 are opened on the casing 50, the IT equipment unit 20 is located between the air inlet 51 and the air outlet 52, an air duct 53 through which air flows is provided between an outer wall of the casing 50 and an inner wall of the enclosed cabinet 10, and both the air inlet 51 and the air outlet 52 are communicated with the air duct 53. IT is understood that the windward side of the IT equipment unit 20 mentioned above is the side near the air inlet 51, and the leeward side of the IT equipment unit is the side near the air outlet 52.

Since the IT equipment unit 20 is disposed between the air inlet 51 and the air outlet 52 of the housing 50, when the fan 40 rotates, the air flow in the enclosed cabinet 10 flows into the housing 50 from the air inlet 51 of the housing 50, the air flow in the housing 50 flows from the air inlet 51 toward the air outlet 52, and the air flow flowing out of the air outlet 52 returns to a position close to the air inlet 51 via the air duct 53. That is to say, the housing 50 can divide the space inside the sealed cabinet 10, the air flow inside the housing 50 cools the IT equipment unit 20 and does not mix with the air flow outside the housing 50 in the process of flowing from the air inlet 51 to the air outlet 52, the air flow outside the housing 50 flows in the air duct 52 and does not mix with the air flow inside the housing 50, thereby being more beneficial to cooling the IT equipment unit 20, ensuring that the temperature of the air flow blowing to the IT equipment unit is not too high, and being also beneficial to guiding the flowing direction of the air flow inside the sealed cabinet 10, and enabling the air flow to flow circularly inside the sealed cabinet 10.

IT should be noted that, because the inside of the sealed cabinet 10 is a sealed space, when the fan 40 blows the air flow to the IT equipment unit 20, the windward side of the IT equipment unit 20 is a negative pressure, and the leeward side is a positive pressure, so that the air flow flowing out of the air outlet 52 of the casing 50 will flow back to the air inlet 51 of the casing 50 again along the air duct 53 between the outer wall of the casing 50 and the inner wall of the sealed cabinet 10 under the action of the pressure difference, so as to form the circulation of the air flow in the sealed cabinet 10, and no power equipment may be provided, thereby further reducing the energy consumption in the cooling process of the IT equipment unit 20.

In the present disclosure, the liquid-air heat exchanger 30 may be disposed in various positions, for example, the liquid-air heat exchanger 30 may be disposed inside the housing 50, or the liquid-air heat exchanger 30 may be disposed outside the housing 50. For the case where the liquid-air heat exchanger 30 is disposed inside the housing 50, in one embodiment provided by the present disclosure, the liquid-air heat exchanger 30 may be located inside the housing 50 and disposed adjacent to the air intake 51, such that the air flow entering the interior of the housing 50 from the air intake 51 flows through the liquid-air heat exchanger 30 to be cooled before flowing to the IT equipment unit 20. In another embodiment, as shown in fig. 1, 2, 3, and 5, the liquid-air heat exchanger 30 may be located within the housing 50 and located near the air outlet 52, such that the air flow after heat exchange by the IT equipment units 20 flows through the liquid-air heat exchanger 30 to be cooled, then flows out of the housing 50 from the air outlet 52, and finally returns to the air inlet 51.

For the case where the liquid-air heat exchanger 30 is disposed outside the housing 50, as shown in fig. 3, in one embodiment provided by the present disclosure, the liquid-air heat exchanger 30 may be located outside the housing 50 and disposed near the air intake 51; in another embodiment provided by the present disclosure, the liquid-air heat exchanger 30 may be located outside the housing 50 and disposed near the air outlet 52.

Alternatively, in one embodiment provided by the present disclosure, as shown in fig. 1, there may be a gap between the outer wall of the casing 50 and the inner wall of the enclosed cabinet 10, and the gap is an air duct 53. In this way, after the airflow blown by the fan 40 is blown toward the IT equipment unit 20 from the air inlet 51 of the housing 50, the airflow can flow out of the air outlet 52 of the housing 50, and flow back to the air inlet 51 again through the gap (i.e., the air duct 53) between the outer wall of the housing 50 and the closed cabinet 10, so as to achieve the circular purging of the IT equipment unit 20.

In another embodiment provided by the present disclosure, the server cabinet may further include an air duct disposed between the inner wall of the closed cabinet 10 and the outer wall of the casing 50, and the air duct 53 is formed inside the air duct. After the air flow blown by the fan 40 is blown to the IT equipment unit 20 from the air inlet 51 of the housing 50, the air flow flows out from the air outlet 52 of the housing 50, and then directly enters the air duct and flows back to the air inlet 51 of the housing 50 through the guidance of the air duct, so that the flow path of the air flow is standardized, and the air flow is prevented from being disturbed during the flow process, thereby affecting the cooling and heat dissipation effects of the IT equipment unit 20.

Of course, both ends of the air duct may be connected to the air inlet 51 and the air outlet 52 respectively, or may be connected to the air inlet 51 and the air outlet 52, as long as the air duct can be communicated with the air inlet 51 and the air outlet 52, and the air duct can guide the air flowing out from the air outlet 52 toward the air inlet 51, which is not limited in the present disclosure.

Optionally, as shown in fig. 1, 2, 3 and 5, the IT equipment unit 20 comprises a central processor 201, a hard disk drive 202, a network interface controller 203, a dual in-line memory module 206 and a power supply 205; the hard disk drive 202 and the network interface controller 203 are both arranged near the windward side, the power supply 205 is arranged near the leeward side, and the central processor 201 and the dual in-line memory module 206 are arranged between the hard disk drive 202 and the network interface controller 203 and the power supply 205. Since the hard disk drive 202 and the network interface controller 203 are weak in temperature and the temperature of the wind at the windward side is low, the hard disk drive 202 and the network interface controller 203 are disposed near the windward side of the IT equipment unit 20 to ensure cooling of the hard disk drive 202 and the network interface controller 203, and the power supply 205 is strong in the ability to withstand medium or high temperature, and thus the power supply 205 is disposed near the leeward side of the IT equipment unit 20.

Through the arrangement mode, after the air flow enters the IT equipment unit 20 from the windward side of the IT equipment unit 20, the air flow sequentially blows through the hard disk drive 202, the network interface controller 203, the dual in-line memory module 206, the central processing unit 201 and the power supply 205 and then flows out from the leeward side of the IT equipment unit 20, so that the cooling requirements of the hard disk drive 202, the network interface controller 203, the dual in-line memory module 206, the central processing unit 201 and the power supply 205 of the IT equipment unit 20 can be met.

Alternatively, the liquid-air heat exchanger 30 may be disposed adjacent to the power supply 205, and specifically, the liquid-air heat exchanger 30 may be disposed adjacent to the power supply 205 in the length direction of the IT equipment unit 20, or the liquid-air heat exchanger 30 may be disposed adjacent to the power supply 205 in the width direction of the IT equipment unit 20.

Alternatively, as shown in fig. 1, 2, 3, and 5, in one embodiment provided by the present disclosure, the fan 40 is located between the hard disk drive 202 and the network interface controller 203 and the central processor 201 and the dual in-line memory module 206.

In other embodiments provided by the present disclosure, the fan 40 may be disposed on the windward side of the IT equipment unit 20, or the fan 40 may be disposed on the leeward side of the IT equipment unit 20, and the present disclosure does not limit the specific location where the fan 40 is disposed as long as the air flow blowing to the IT equipment unit 20 is generated, and the air flow flowing through the IT equipment unit 20 is cooled by the liquid-air heat exchanger 30 and then blown to the IT equipment unit 20.

Optionally, the central processing unit 201 is provided with a plurality of cold plates 60, as shown in fig. 1 to 5, the central processing unit 201 and the cold plates 60 are both provided in plurality, and the plurality of cold plates 60 and the plurality of central processing units 201 are provided in one-to-one correspondence, as shown in fig. 7 to 10, the plurality of cold plates 60 are connected in series or in parallel to each other to form a cold plate group, and the cold plate group and the liquid-air heat exchanger 30 are connected in series or in parallel to each other.

In the process of cooling and dissipating heat of the IT equipment unit 20, the central processing unit 201 may be cooled by the cold plate 60, so as to effectively reduce the temperature of the central processing unit 201, and avoid bringing out the heat of the central processing unit 201 to cause an excessively high temperature near the central processing unit 201 in the process of flowing the air flow from the windward side of the IT equipment unit 20 to the leeward side of the IT equipment unit 20, thereby reversely heating the hard disk drive 202, the network interface controller 203, the dual in-line memory module 206, and the power supply 205, or affecting the heat dissipation of the air flow to the hard disk drive 202, the network interface controller 203, the dual in-line memory module 206, and the power supply 205, thereby ensuring the cooling effect and the cooling efficiency.

Optionally, in order to adjust the cooling effect on the IT equipment unit 20, in the present disclosure, as shown in fig. 5, the server cabinet may further include a temperature sensor 70, the temperature sensor 70 is disposed on the windward side of the IT equipment unit 20 and is used for detecting the temperature of the air flow cooled by the liquid-air heat exchanger 30, and the temperature sensor 70 is electrically connected to the fan 40, so that the rotation speed of the fan 40 can be adjusted according to the temperature value detected by the temperature sensor 70. A temperature sensor 70 is arranged on the windward side of the IT equipment unit 20, so that the temperature sensor 70 can detect the temperature of the air flow which is about to flow through the IT equipment unit 20, when the temperature of the air flow which is measured by the temperature sensor 70 and flows through the windward side is higher, the temperature of the cooling air which is about to blow to the IT equipment unit 20 is higher, at the moment, the rotating speed of the fan 40 can be adaptively adjusted to enable the air flow generated by the fan 40 to flow through the IT equipment unit 20 more quickly, and the cooling and heat exchange effects on the IT equipment unit 20 are improved; when the temperature of the airflow flowing through the windward side measured by the temperature sensor 70 is low, IT indicates that the temperature of the cooling air about to blow to the IT equipment unit 20 is low, and at this time, the rotation speed of the fan 40 can be adaptively reduced, so that the effect of cooling and heat dissipation of the IT equipment unit 20 can be achieved, unnecessary waste of cooling capacity is avoided, and energy consumption in the process of cooling and cooling the IT equipment unit 20 is saved.

As shown in fig. 5, in an embodiment that the server cabinet includes a housing 50, and the housing 50 is provided with an air inlet 51 and an air outlet 52, the temperature sensor 70 may be disposed at the air inlet 51 of the housing 50.

Alternatively, as shown in fig. 6-10, the water inlet of the cooling liquid pipeline 2 is used for connecting with the water outlet of the cooling tower 100, and the water outlet of the cooling liquid pipeline 2 is used for connecting with the water inlet of the cooling tower 100. Compared with the embodiment that the cooling capacity is provided by a plurality of devices (such as a compressor, an expansion valve, an evaporator and a condenser) in the air-conditioning cooling unit, the embodiment that the cooling tower 100 is connected with the cooling liquid pipeline 2 does not need to be applied to the air-conditioning cooling unit, so that the energy consumption required for cooling the IT device unit 20 is lower, and the total energy consumption of the data center is more favorably reduced, thereby reducing the PUE (Power Usage efficiency, Power utilization efficiency, PUE is the total device energy consumption/IT device energy consumption of the data center) of the data center, further reducing the carbon emission, and assisting the goals of "carbon peak, carbon neutralization".

Optionally, as shown in fig. 6, the server cabinet further includes a water inlet connection structure 80 and a water outlet connection structure 90, the water inlet connection structure 80 is connected to the cooling tower 100 and has a first water inlet 810 and a first water outlet 820, the water outlet connection structure 90 has a second water inlet 910 and a second water outlet 920, the first water inlet 810 is used for being connected to a water outlet of the cooling tower 100, the first water outlet 820 is connected to a water inlet of the cooling liquid pipeline 2, the second water inlet 910 is connected to a water outlet of the cooling liquid pipeline 2, and the second water outlet 920 is used for being connected to a water inlet of the cooling tower 100. In the process of cooling the IT equipment unit 20, the cooling liquid flows out from the water outlet of the cooling tower 100 and flows into the water inlet connection structure 80 through the first water inlet interface 810, the cooling liquid flowing into the water inlet connection structure 80 enters the cooling liquid pipeline 2 through the first water outlet interface 820, the liquid entering the cooling liquid pipeline 2 exchanges heat with the liquid-air heat exchanger 30 and the fan 40, becomes high-temperature cooling liquid and flows into the water outlet connection structure 90 through the second water inlet interface 910, and flows back into the cooling tower 100 from the second water outlet interface 920 of the water outlet connection structure 90 through the water inlet of the cooling tower 100, the high-temperature cooling liquid flowing back into the cooling tower 100 exchanges heat with the external atmosphere, becomes low-temperature cooling liquid and flows into the water inlet connection structure 80 from the water outlet of the cooling tower 100 again, and circulates in such a way, so that the cooling liquid continuously flows into the source in the cooling liquid pipeline 2, the IT equipment unit 20 is cooled and radiated continuously.

In addition, as shown in fig. 11, a first through hole 11 and a second through hole 12 may be formed on the sealed cabinet 10, the water inlet connection structure 80 is disposed through the first through hole 11, the first water inlet interface 810 is located outside the sealed cabinet 10, the water outlet connection structure 90 is disposed through the second through hole 12, the second water outlet interface 920 is located outside the sealed cabinet 10, a first sealing member is disposed between the water inlet connection structure 80 and the first through hole 11, and a second sealing member is disposed between the water outlet connection structure 90 and the second through hole 12. First through-hole 11 is used for supplying into water connection structure 80 to pass, the second is passed and is used for supplying out water connection structure 90 to pass, and be provided with first sealing member between connection structure 80 and first through-hole 11 of intaking, be provided with the second sealing member between play water connection structure 90 and second through-hole 12, thus, can guarantee the leakproofness of the airtight cabinet body 10 in first through-hole 11 and second through-hole 12 department, avoid heat or the noise in the airtight cabinet body 10 to leak from the clearance between first through-hole 11 and the connection structure 80 of intaking or the clearance between second through-hole 12 and play water connection structure 90, further promote the leakproofness of airtight cabinet body 10, avoid causing the influence to fortune dimension personnel's work.

Optionally, as shown in fig. 6, in the enclosed cabinet 10, there may be a plurality of IT equipment units 20 and a plurality of coolant pipelines 2, and the plurality of coolant pipelines 2 and the plurality of IT equipment units 20 are arranged in a one-to-one correspondence manner; the water inlet connecting structure 80 is a water distributor 81, the number of the first water outlet ports 820 is multiple, and the multiple first water outlet ports 820 are correspondingly connected with the water inlets of the multiple cooling liquid pipelines 2 one by one; the water outlet connection structure 90 is a water collector 91, the number of the second water inlet interfaces 910 is multiple, and the multiple second water inlet interfaces 910 are connected with the water outlets of the multiple coolant pipelines 2 in a one-to-one correspondence manner. Thus, when the cooling liquid flowing out from the water outlet of the cooling tower 100 flows into the water inlet connection structure 80, at this time, the cooling liquid in the water inlet connection structure 80 can flow into the plurality of cooling liquid pipelines 2 through the plurality of first water outlet interfaces 820, the cooling liquid flowing into each cooling liquid pipeline 2 can exchange heat with the corresponding IT equipment unit 20 and become high-temperature cooling liquid, after the IT equipment unit 20 is cooled, the high-temperature cooling liquid flows out from the water outlet of the cooling liquid pipeline 2 and flows back to the water outlet connection structure 90 through the plurality of second water inlet interfaces 910, the high-temperature cooling liquid in the water outlet connection structure 90 enters the cooling tower 100 through the second water outlet interface 920, the high-temperature cooling liquid flowing back into the cooling tower 100 after exchanging heat with the outside atmosphere becomes low-temperature cooling liquid and flows into the water inlet connection structure 80 from the water outlet of the cooling tower 100 again, so circulate to constantly flow into the coolant liquid to the source in coolant liquid pipeline 2, realize the incessant cooling heat dissipation to a plurality of IT equipment units 20.

Alternatively, in one embodiment provided by the present disclosure, as shown in fig. 4, the liquid-air heat exchanger 30 may be a surface air cooler.

Of course, in other embodiments provided by the present disclosure, the liquid-air heat exchanger 30 may also be a plate-fin heat exchanger or any other liquid-air heat exchanger 30 that meets the requirements, and in any case, the present disclosure does not limit the type or specific structure of the liquid-air heat exchanger 30.

According to a second aspect of the present disclosure, there is provided a data center comprising a server rack as described above. The data center has all the advantages of the server cabinet, and the details of the disclosure are not repeated herein.

Optionally, as shown in fig. 6 to 10, the data center further includes a cooling tower 100, the water inlet of the cooling liquid pipeline 2 of the server cabinet is connected to the water outlet of the cooling tower 100, and the water outlet of the cooling liquid pipeline 2 of the server cabinet is connected to the water inlet of the cooling tower 100.

The present disclosure discharges the heat of the IT equipment unit 20 to the atmosphere through the cooling tower 100, that is, the cooling capacity for both liquid cooling and air cooling of the IT equipment unit 20 comes from the cooling tower 100. Therefore, the problem that low-temperature cooling liquid is supplied to the IT equipment unit 20 and the liquid-air heat exchanger 30 through the air conditioner cooling unit can be avoided, the energy consumption required for cooling the IT equipment unit 20 is lower, the total energy consumption of the data center is reduced, the PUE of the data center is reduced, the carbon emission is reduced, and the purposes of carbon peak reaching and carbon neutralization are assisted.

And, because can not cool off through air conditioner cooling unit among the data center cooling system that this disclosure provided, promptly, can avoid using freon as the refrigerant, on the one hand, can avoid freon to reveal the circumstances emergence of polluting the environment, on the other hand, also can avoid the emission of fluoride. As the fluorine-containing gas is also a greenhouse gas, the emission of the fluorine-containing gas is avoided, and the greenhouse effect is increased.

In addition, compared with the technical scheme of cooling the data center in a mode of combining liquid cooling with air conditioner cold compensation, the data center provided by the disclosure has simpler architecture, higher reliability and lower cost, and can realize rapid deployment of the data center when the data center is deployed. Moreover, since the cooling temperature of the cooling tower 100 is related to the wet bulb temperature of the environment in which the cooling tower 100 is located, rather than the dry bulb temperature (i.e., the ambient temperature) of the environment in which the cooling tower 100 is located, the wet bulb temperature in most regions of the world can meet the temperature requirement of the cooling liquid flowing out of the cooling liquid outlet of the cooling tower 100, and therefore, the data center cooling system provided by the present disclosure is not easily restricted by the regional ambient temperature, and can be applied to most regions of the world.

Alternatively, the cooling tower 100 may be an open cooling tower, a closed cooling tower, a natural draft cooling tower, a mechanical draft cooling tower, a hybrid draft cooling tower, a wet cooling tower, a dry and wet cooling tower, or the like, and the present disclosure does not limit the specific type, number, size, shape, or the like of the cooling tower 100.

The preferred embodiments of the present disclosure are described in detail with reference to the accompanying drawings, however, the present disclosure is not limited to the specific details of the above embodiments, and various simple modifications may be made to the technical solution of the present disclosure within the technical idea of the present disclosure, and these simple modifications all belong to the protection scope of the present disclosure.

It should be noted that, in the foregoing embodiments, various features described in the above embodiments may be combined in any suitable manner, and in order to avoid unnecessary repetition, various combinations that are possible in the present disclosure are not described again.

In addition, any combination of various embodiments of the present disclosure may be made, and the same should be considered as the disclosure of the present disclosure, as long as it does not depart from the spirit of the present disclosure.

Claims (13)

1. A server rack, comprising:

a closed cabinet (10);

an IT equipment unit (20) disposed in the hermetic cabinet (10);

a liquid-air heat exchanger (30) arranged in the closed cabinet body (10) and connected with the IT equipment unit (20) in series or in parallel on a cooling liquid pipeline (2), wherein the liquid-air heat exchanger (30) is arranged on the windward side of the IT equipment unit (20) or the leeward side of the IT equipment unit (20),

the fan (40) is arranged in the closed cabinet body (10), and the fan (40) is used for generating airflow blowing to the IT equipment unit (20) in the closed cabinet body (10), cooling the airflow flowing through the IT equipment unit (20) through the liquid-air heat exchanger (30), and then blowing to the IT equipment unit (20).

2. The server cabinet according to claim 1, further comprising a housing (50), wherein the IT equipment unit (20) and the fan (40) are both installed in the housing (50), an air inlet (51) and an air outlet (52) are opened on the housing (50), the IT equipment unit (20) is located between the air inlet (51) and the air outlet (52), an air duct (53) through which air flows is arranged between an outer wall of the housing (50) and an inner wall of the airtight cabinet body (10), and both the air inlet (51) and the air outlet (52) are communicated with the air duct (53);

wherein the liquid-air heat exchanger (30) is located within the housing (50) and is disposed proximate to the air intake (51); or the liquid-air heat exchanger (30) is positioned in the shell (50) and is close to the air outlet (52); or the liquid-air heat exchanger (30) is positioned outside the shell (50) and close to the air inlet (51); alternatively, the liquid-air heat exchanger (30) is located outside the housing (50) and is disposed proximate to the air outlet (52).

3. The server cabinet according to claim 2, wherein a gap is provided between the outer wall of the housing (50) and the inner wall of the closed cabinet (10), and the gap is the air duct (53); alternatively, the first and second electrodes may be,

the server cabinet further comprises an air pipe, the air pipe is arranged between the inner wall of the closed cabinet body (10) and the outer wall of the shell (50), and the air channel (53) is formed inside the air pipe.

4. The server rack of claim 1, wherein the IT equipment unit (20) comprises a central processor (201), a hard disk drive (202), a network interface controller (203), a dual in-line memory module (206), and a power supply (205);

the hard disk drive (202) and the network interface controller (203) are both arranged close to the windward side, the power supply (205) is arranged close to the leeward side, and the central processing unit (201) and the dual in-line memory module (206) are arranged between the hard disk drive (202) and the network interface controller (203) and the power supply (205).

5. The server cabinet according to claim 4, wherein the liquid-to-air heat exchanger (30) is disposed adjacent to the power supply (205), the fan (40) being located between the hard disk drive (202) and the network interface controller (203) and the central processor (201) and the dual in-line memory module (206).

6. The server cabinet according to claim 4, wherein a plurality of cold plates (60) are disposed on the central processing unit (201), the central processing unit (201) and the cold plates (60) are both provided, the plurality of cold plates (60) and the plurality of central processing units (201) are disposed in a one-to-one correspondence, the plurality of cold plates (60) are connected in series or in parallel to each other to form a cold plate group, and the cold plate group and the liquid-air heat exchanger (30) are connected in series or in parallel to each other.

7. The server cabinet according to any one of claims 1 to 6, further comprising a temperature sensor (70), the temperature sensor (70) being disposed on a windward side of the IT equipment unit (20) and configured to detect a temperature of the airflow cooled by the liquid-air heat exchanger (30), the temperature sensor (70) being electrically connected to the fan (40) so that a rotation speed of the fan (40) is adjustable according to a temperature value detected by the temperature sensor (70).

8. The server cabinet according to any one of claims 1 to 6, wherein the water inlet of the cooling liquid pipe (2) is configured to be connected to a water outlet of a cooling tower (100), and the water outlet of the cooling liquid pipe (2) is configured to be connected to a water inlet of the cooling tower (100).

9. The server cabinet according to claim 8, further comprising a water inlet connection structure (80) and a water outlet connection structure (90), wherein the water inlet connection structure (80) is connected to have a first water inlet interface (810) and a first water outlet interface (820), the water outlet connection structure (90) has a second water inlet interface (910) and a second water outlet interface (920), the first water inlet interface (810) is used for being connected with a water outlet of the cooling tower (100), the first water outlet interface (820) is connected with a water inlet of the cooling liquid pipeline (2), the second water inlet interface (910) is connected with a water outlet of the cooling liquid pipeline (2), and the second water outlet interface (920) is used for being connected with a water inlet of the cooling tower (100);

be formed with first through-hole (11) and second through-hole (12) on the airtight cabinet body (10), connection structure (80) of intaking wears to locate first through-hole (11), just first interface (810) of intaking is located outside the airtight cabinet body (10), it wears to locate to go out water connection structure (90) second through-hole (12), just second interface (920) of going out is located outside the airtight cabinet body (10), intake connection structure (80) with be provided with first sealing member between first through-hole (11), go out water connection structure (90) with be provided with the second sealing member between second through-hole (12).

10. The server cabinet according to claim 9, wherein the IT equipment units (20) and the cooling liquid pipelines (2) are multiple, and the multiple cooling liquid pipelines (2) are arranged in one-to-one correspondence with the multiple IT equipment units (20);

the water inlet connecting structure (80) is a water distributor (81), the number of the first water outlets (820) is multiple, and the multiple first water outlets (820) are correspondingly connected with the water inlets of the multiple cooling liquid pipelines (2) one by one;

the water outlet connecting structure (90) is a water collector (91), the number of the second water inlet connectors (910) is multiple, and the second water inlet connectors (910) are connected with the water outlets of the cooling liquid pipelines (2) in a one-to-one correspondence mode.

11. The server cabinet according to any one of claims 1 to 6, wherein the liquid-air heat exchanger (30) is a surface cooler.

12. A data center comprising a server cabinet according to any one of claims 1 to 11.

13. The data center according to claim 12, further comprising a cooling tower (100), wherein the water inlet of the cooling liquid pipe (2) of the server cabinet is connected with the water outlet of the cooling tower (100), and the water outlet of the cooling liquid pipe (2) of the server cabinet is connected with the water inlet of the cooling tower (100).

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