CN114824029A - LED support, manufacturing method thereof and LED device - Google Patents

LED support, manufacturing method thereof and LED device Download PDF

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Publication number
CN114824029A
CN114824029A CN202210344117.6A CN202210344117A CN114824029A CN 114824029 A CN114824029 A CN 114824029A CN 202210344117 A CN202210344117 A CN 202210344117A CN 114824029 A CN114824029 A CN 114824029A
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CN
China
Prior art keywords
groove
metal
frame
metal baffle
packaging
Prior art date
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Pending
Application number
CN202210344117.6A
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Chinese (zh)
Inventor
谭攀峰
邢美正
杨丽敏
谭青青
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Jufei Optoelectronics Co Ltd
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Shenzhen Jufei Optoelectronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Shenzhen Jufei Optoelectronics Co Ltd filed Critical Shenzhen Jufei Optoelectronics Co Ltd
Priority to CN202210344117.6A priority Critical patent/CN114824029A/en
Publication of CN114824029A publication Critical patent/CN114824029A/en
Priority to PCT/CN2023/085691 priority patent/WO2023186144A1/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

The invention provides an LED bracket, a manufacturing method thereof and an LED device, wherein the LED bracket comprises: the metal frame, the metal baffle, the insulating part and the insulating bracket; the metal frame comprises a first frame and a second frame; the first frame is separated from the second frame through a through groove; the metal baffle is provided with a first packaging groove which penetrates through the top surface and the bottom surface of the metal baffle, and the first packaging groove is communicated with the through groove; the bottom surface of the metal baffle is in contact with the front surface of the metal frame and is arranged opposite to the top surface of the metal baffle; the top surface of the metal baffle is provided with a groove; the insulating part fills the through groove of the metal frame; the insulating bracket covers the outer side wall of the metal baffle and forms a second packaging groove with at least part of the top surface of the metal baffle; at least part of the top surface of the metal baffle is a step surface between the first packaging groove and the second packaging groove, and the groove of the metal baffle is communicated with the second packaging groove; effectively prevent the plastic material to spill over the functional area on the metal framework, ensure the reliability when LED chip and LED support bond.

Description

LED support, manufacturing method thereof and LED device
Technical Field
The invention relates to the technical field of light emitting diodes, in particular to an LED bracket, a manufacturing method thereof and an LED device.
Background
With the wider application of LED devices, the market demand for LED devices is also higher. In the conventional LED device, an LED chip is fixed in a package groove of an LED support, the LED support at least includes a lead frame and a plastic support, and the plastic support is disposed on the lead frame and forms a package groove with the lead frame to accommodate the LED chip. When the plastic support is manufactured on the lead frame through injection molding, the plastic material easily overflows to the bottom of the packaging groove to influence the bonding of the LED chip and the LED support.
Therefore, how to provide an LED device with higher reliability is an urgent problem to be solved.
Disclosure of Invention
In view of the above deficiencies of the related art, an object of the present application is to provide an LED support, a manufacturing method thereof, and an LED device, which aim to solve the problem that in the prior art, a plastic material easily overflows into a functional region on a lead frame during an injection molding process to affect bonding between an LED chip and the lead frame.
The invention provides an LED bracket, which comprises: the metal baffle plate, the insulating component and the insulating bracket are arranged on the metal frame; wherein the content of the first and second substances,
the metal frame comprises a first frame and a second frame; the first frame is separated from the second frame through a through groove;
the metal baffle is provided with a bottom surface and a top surface which are oppositely arranged, and the bottom surface of the metal baffle is contacted with the front surface of the metal frame; the metal baffle is provided with a first packaging groove which penetrates through the top surface and the bottom surface of the metal baffle, and the first packaging groove is communicated with the through groove; the top surface of the metal baffle is provided with a groove;
the insulating part fills the through groove of the metal frame; the insulating bracket covers the outer side wall of the metal baffle and forms a second packaging groove with at least part of the top surface of the metal baffle; at least part of the top surface of the metal baffle is a step surface between the first packaging groove and the second packaging groove, and the groove on the top surface of the metal baffle is communicated with the second packaging groove.
Optionally, the first frame is provided with a first through hole penetrating through the front surface and the back surface of the first frame, and the second frame is provided with a second through hole penetrating through the front surface and the back surface of the second frame;
the insulating support also extends toward the inside of the metal frame to fill the first through hole and the second through hole.
Optionally, the height of the metal baffle is higher than that of the LED chip.
Optionally, an inner side wall of the metal baffle exposed to the first packaging groove is a reflecting surface.
Optionally, a surface of the metal frame exposed to the first package groove is a reflective surface.
Optionally, an inner side wall of the metal baffle exposed to the first packaging groove is obliquely arranged towards the outer side of the metal baffle.
Based on the same inventive concept, the present application also provides an LED device, comprising: the LED support as set forth above, and the LED chip and the packaging adhesive layer arranged on the LED support; the LED chip is arranged in the first packaging groove and is electrically connected with the metal frame; the packaging adhesive layer is arranged in the first packaging groove and the second packaging groove to wrap the LED chip.
Optionally, the package glue layer includes a first package glue layer disposed in the first package groove and a second package glue layer disposed in the second package groove.
Optionally, the hardness of the first encapsulation adhesive layer is lower than that of the second encapsulation adhesive layer.
Based on the same inventive concept, the application also provides a manufacturing method of the LED bracket, which comprises the following steps:
providing a metal frame; wherein the metal frame comprises a first frame and a second frame; the first frame is separated from the second frame through a through groove;
forming a metal baffle on the metal frame; the metal baffle plate is provided with a bottom surface and a top surface which are oppositely arranged, and the bottom surface of the metal baffle plate is contacted with the front surface of the metal frame; the metal baffle is provided with a first packaging groove which penetrates through the top surface and the bottom surface of the metal baffle, and the first packaging groove is communicated with the through groove; the top surface of the metal baffle is provided with a groove;
forming an insulating part and an insulating bracket on the metal frame; wherein the insulating member fills the through groove of the metal frame; the insulating support covers the outer side wall of the metal baffle and forms a second packaging groove with at least part of the top surface of the metal baffle, at least part of the top surface of the metal baffle is a step surface between the first packaging groove and the second packaging groove, and the groove on the top surface of the metal baffle is communicated with the second packaging groove.
The invention provides an LED bracket, a manufacturing method thereof and an LED device, wherein the LED bracket comprises: the metal baffle plate, the insulating part and the insulating bracket are arranged on the metal frame; wherein the metal frame comprises a first frame and a second frame; the first frame is separated from the second frame through a through groove; the metal baffle is provided with a bottom surface and a top surface which are oppositely arranged, and the bottom surface of the metal baffle is contacted with the front surface of the metal frame; the metal baffle is provided with a first packaging groove which penetrates through the top surface and the bottom surface of the metal baffle, and the first packaging groove is communicated with the through groove; the top surface of the metal baffle is provided with a groove; the insulating part fills the through groove of the metal frame; the insulating bracket covers the outer side wall of the metal baffle and forms a second packaging groove with at least part of the top surface of the metal baffle; at least part of the top surface of the metal baffle is a step surface between the first packaging groove and the second packaging groove, and the groove on the top surface of the metal baffle is communicated with the second packaging groove. Therefore, the metal baffle plate with the groove at the top is arranged on the metal frame, so that an isolation barrier can be formed at the groove of the metal baffle plate when the insulating part is manufactured, plastic materials are effectively prevented from overflowing into the functional area of the metal frame, and the reliability of the bonding of the LED chip and the LED support can be ensured.
Drawings
FIG. 1 is a top view of an LED support provided in accordance with an alternative embodiment of the present invention;
FIG. 2 is a first schematic sectional view taken along line A-A of an LED holder according to an alternative embodiment of the present invention;
FIG. 3 is a schematic sectional view A-A of an LED support according to an alternative embodiment of the present invention;
FIG. 4 is a schematic cross-sectional view A-A of an LED support according to an alternative embodiment of the present invention;
FIG. 5 is a cross-sectional view of an LED support taken along line A-A in accordance with an alternative embodiment of the present invention;
FIG. 6 is a top view of an LED device provided in accordance with an alternative embodiment of the present invention;
FIG. 7 is a first schematic cross-sectional view B-B of an LED device according to another alternative embodiment of the present invention;
FIG. 8 is a schematic cross-sectional view B-B of an LED device according to another alternative embodiment of the present invention;
fig. 9 is a schematic flow chart illustrating a method for manufacturing an LED support according to yet another alternative embodiment of the present invention;
description of reference numerals:
10-a metal frame; 101-a first frame; 1011-first connection area; 1012-a first extension region; 1013-a first functional area; 102-a second frame; 1021-a second connection area; 1022 — a second extension region; 1023-a second functional area; 20-a metal baffle; 201-a first encapsulation slot; 202-grooves; 30-an insulating member; 40-an insulating support; 401-a second encapsulation slot; 50-LED chip; 60-packaging adhesive layer; 601-a first encapsulation glue layer; 602-second encapsulation glue layer.
Detailed Description
To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present application are given in the accompanying drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
With the wider application of the LED device, the market demand for the LED device is higher and higher. In the conventional LED device, an LED chip is fixed in a package groove of an LED support, the LED support at least includes a lead frame and a plastic support, and the plastic support is disposed on the lead frame and forms a package groove with the lead frame to accommodate the LED chip. When the plastic support is manufactured on the lead frame through injection molding, the plastic material easily overflows to the bottom of the packaging groove to influence the bonding of the LED chip and the LED support. Therefore, how to provide an LED device with higher reliability is an urgent problem to be solved.
Based on this, the present application intends to provide a solution to the above technical problem, the details of which will be explained in the following embodiments.
An alternative embodiment of the invention:
the present embodiment provides an LED support, as shown in fig. 1 and fig. 2, the LED support at least includes a metal frame 10, and a metal baffle 20, an insulating member 30 and an insulating support 40 disposed on the metal frame 10; wherein the content of the first and second substances,
the metal frame 10 includes a first frame 101 and a second frame 102; the first frame 101 is separated from the second frame 102 by a through slot;
the metal baffle 20 has a bottom surface and a top surface which are oppositely arranged, and the bottom surface of the metal baffle 20 is contacted with the front surface of the metal frame 10; the metal baffle 20 is provided with a first packaging groove 201 penetrating through the top surface and the bottom surface of the metal baffle 20, and the first packaging groove 201 is communicated with the through groove; a groove 202 is arranged on the top surface of the metal baffle plate 20;
the insulating member 30 fills the through groove of the metal frame 10; the insulating bracket 40 covers the outer side wall of the metal baffle 20 and forms a second packaging groove 401 with at least part of the top surface of the metal baffle 20; at least part of the top surface of the metal baffle 20 is a step surface between the first package groove 201 and the second package groove 401, and the groove 202 on the top surface of the metal baffle 20 is communicated with the second package groove 401.
It can be understood that after the metal frame and the metal baffle are manufactured by adopting a stamping or etching process, when the insulating part is manufactured by adopting an injection molding process, the injection molding material extends into the groove of the metal baffle and forms a barrier so as not to overflow to the surface of the metal frame and the surface of the metal baffle exposed to the first packaging groove, so that the reliability of the bonding of the LED chip and the LED bracket can be ensured.
In the present embodiment, the metal frame includes, but is not limited to, a copper frame or a copper alloy frame. The metal baffle and the metal frame can be made of the same material, and the metal baffle and the metal frame can also be of a structure which is integrally formed by the same material. Through setting up metal frame and metal baffle as an organic whole, after forming the LED device, the heat that produces when the LED chip is luminous can be downwards with the help of metal frame water conservancy diversion, also can be to producing thermal heat conduction effect around with the help of metal baffle water conservancy diversion to promote the LED device during operation. Optionally, the height of the metal baffle plate can be higher than that of the LED chip, so that more heat can be guided by the metal baffle plate, and the heat conduction effect of heat generated by the LED device during working is further improved.
It is to be understood that the metal baffle includes a top surface, a bottom surface, and a sidewall disposed between the top surface and the bottom surface. Because the metal baffle is also provided with a first packaging groove which penetrates through the top surface and the bottom surface of the metal baffle, the inner side wall of the metal baffle is exposed out of the first packaging groove. The opening shape of the first packaging groove includes, but is not limited to, a circle or a rectangle. The top surface of the metal baffle plate is provided with a groove, and the width and the depth of the groove can be flexibly designed according to actual requirements.
It is also understood that the metal frame may include a first frame and a second frame, for example, the first frame is a positive electrode frame and the second frame is a negative electrode frame. The first frame and the second frame are separated from each other, namely a through groove is arranged between the first frame and the second frame. Optionally, a first step is further disposed at an end of the first frame close to the through groove, and a second step is disposed at an end of the second frame close to the through groove, so that a through groove with a larger accommodating space can be formed between the first frame and the second frame, and when the through groove is filled with the insulating member, more insulating members can be filled to improve the isolation effect, and the bonding path between the insulating member and the first frame and the bonding path between the insulating member and the second frame can be increased to increase the bonding force.
It is also understood that the metal frame includes a front surface and a back surface which are oppositely arranged, and the bottom surface of the metal baffle plate is in contact with the front surface of the metal frame, so that the back surface of the metal frame is far away from the metal baffle plate. Based on the specific arrangement positions of the metal baffle, the insulating support and the LED chip on the metal frame, the front surface of the metal frame can be divided into areas. Since the metal frame includes the first frame and the second frame, the front surface of the metal frame includes the front surface of the first frame and the front surface of the second frame. At the moment, a connecting area for contacting with the insulating support, an extending area for contacting with the metal baffle and a functional area for fixing and electrically connecting with the LED chip can be respectively divided on the front surface of the first frame and the front surface of the second frame; for example, as shown in fig. 3, a first connection area 1011, a first extension area 1012 and a first function area 1013 are provided on the front surface of the first frame, and a second connection area 1021, a second extension area 1022 and a second function area 1023 are provided on the front surface of the second frame; the first functional area 1013 and the second functional area 1023 are exposed in the first package slot 201, the first connection area 1011 can be connected to the first extension area 1012, and the second connection area 1021 can be connected to the second extension area 1022. Optionally, a through hole is further formed inside the metal frame so that the insulating support can extend from the connecting area on the front surface of the metal frame to the back surface of the metal frame; for example, as shown in fig. 4, the first frame 101 is provided with a first through hole penetrating through the front and back surfaces of the first frame 101, and the second frame 102 is provided with a second through hole penetrating through the front and back surfaces of the second frame 102; the insulating support 40 provided on the metal frame 10 at this time extends downward while filling the first and second through holes. Alternatively, as shown in fig. 5, the sidewall of the first through hole and/or the second through hole has a step. The first through hole and the second through hole are additionally arranged, and the step surface is additionally arranged on the first through hole or the second through hole, so that the contact area of the insulating support and the metal frame is increased, and the binding force is increased.
In this embodiment, in order to increase the light extraction efficiency, the inner side wall of the metal baffle exposed in the first package groove may be a reflective surface; and/or the surface of the metal frame exposed to the first packaging groove is a reflecting surface. For example, a thin highly reflective metal layer can be electroplated on the inner side wall of the metal baffle and/or the surface of the metal frame to form the reflective surface, and the material of the highly reflective metal layer includes, but is not limited to, any one or more of silver, nickel and gold. In addition, the inner side wall of the metal baffle plate and the upper surface of the metal frame can be polished to be smoother, and more light rays can be reflected out of the LED support.
In the present embodiment, the insulating member and the insulating support may be made of the same material, such as thermoplastic resin; and the insulating member and the insulating support may be integrally formed. The insulating support arranged on the metal frame is also coated on the outer side wall of the metal baffle, and the top surface of the insulating support is higher than that of the metal baffle. The insulating support and at least part of the top surface of the metal baffle plate form a second packaging groove, and the second packaging groove is communicated with the first packaging groove on the metal baffle plate and the groove on the top surface of the metal baffle plate. The opening size of the second packaging groove is larger than that of the first packaging groove, and the opening shape of the second packaging groove can be the same as that of the first packaging groove, including but not limited to circular or rectangular. As shown in fig. 5, the insulating support 40 may cover a portion of the top surface of the metal baffle 20, and an inner side wall of the insulating support 40 exposed to the second package groove 401 is close to an outer side of the groove 202, where the outer side of the groove 202 is a side far from the first package groove 201; the groove of the metal baffle can be used as an isolation groove, isolation blocking can be formed at the groove of the metal baffle when the insulating support is manufactured, and plastic materials are effectively prevented from overflowing to a functional area on the metal frame or a reflecting surface of the metal baffle, so that the follow-up LED chip can be more firmly fixed with the LED support.
In this embodiment, as shown in fig. 5, in order to increase the light emitting angle, the inner sidewall of the insulating support 40 exposed to the second package groove 401 may be disposed to be inclined toward the outer side of the insulating support 40, and/or the inner sidewall of the metal baffle 20 exposed to the first package groove 201 may be disposed to be inclined toward the outer side of the metal baffle 20, so as to facilitate forming an LED device with a larger light emitting angle. The inclination angle of the inner sidewall of the insulating support 40 and the inclination angle of the inner sidewall of the metal baffle 20 can be flexibly set according to actual requirements, and are not limited herein.
According to the LED support provided by the invention, the metal baffle plate with the groove at the top is arranged on the metal frame, so that an isolation barrier can be formed at the groove of the metal baffle plate when an insulating part is manufactured, plastic materials are effectively prevented from overflowing to the functional area on the metal frame, and the reliability of bonding the LED chip and the LED support can be ensured.
Another alternative embodiment of the invention:
the present embodiment provides an LED device, as shown in fig. 6 and 7, including: the LED support provided in any of the previous embodiments, and the LED chip 50 and the encapsulant layer 60 disposed on the LED support; the LED chip 50 is arranged in the first packaging groove and electrically connected with the metal frame; the packaging adhesive layer 60 is disposed in the first packaging groove and the second packaging groove to wrap the LED chip 50.
In the present embodiment, as shown in fig. 2 to 5 and 7, the LED support includes a metal frame 10, and a metal baffle 20, an insulating member 30 and an insulating support 40 provided on the metal frame 10; the metal frame 10 has a through groove for receiving the insulating member 30; a first packaging groove 201 with an opening is formed in the metal baffle plate 20 in a hollow manner, and a groove 202 is formed in the top surface of the metal baffle plate 20; the insulating support 40 covers the outer sidewall of the metal baffle 20 and forms a second packaging groove 401 with the top surface of the metal baffle 20. At this time, the second package recess 401 communicates with the first package recess 201 and the recess 202, respectively. Generally, the height of the metal baffle 20 is higher than that of the LED chip, that is, the depth of the first packaging groove is greater than that of the LED chip, so that the LED chip can be placed in the first packaging groove and fixed in electrical connection with the metal frame. For example, the metal frame 10 includes a first frame 101 and a second frame 102, the first frame 101 is provided with a first functional region, and the second frame is provided with a second functional region. At least one LED chip 50 may be disposed on the first functional region of the first frame 101 and/or the second functional region of the second frame 102. Such LED chips include, but are not limited to, blue LED chips. Because add a metal baffle in advance on metal crate and make insulating support and metal crate on the functional area not direct contact, still add the recess at this metal baffle's top to the plastic material spills over the functional area on the inside wall of metal baffle and the metal crate when preventing the preparation insulating support. At the moment, the upper surface of the metal frame and the functional area are smooth, so that the LED chip can be stably connected with the metal frame. In addition, a packaging adhesive layer can be filled in the first packaging groove and the second packaging groove of the LED support to wrap the LED chip to play a role in protection. Because the top that is equipped with metal step and metal step still is equipped with the recess, has just also increased the area of contact and the combination route of encapsulation glue film and LED support, can make the connection of encapsulation glue film and LED support more firm. In addition, the specific types of the packaging adhesive layer can be selected as required, including but not limited to a low-refractive-index transparent adhesive layer, a high-refractive-index transparent adhesive layer, a quantum-dot-containing fluorescent adhesive layer, a high-hardness transparent adhesive layer or a low-hardness transparent adhesive layer, so as to meet different application requirements. In addition, two or more than two packaging adhesive layers can be arranged in the LED support. For example, as shown in fig. 8, a first packaging glue layer 601 is filled in a first packaging groove of the LED support, and a second packaging glue layer 602 is filled in a second packaging groove of the LED support. At this time, at least a portion of the top surface of the metal baffle may be a boundary between the first encapsulant layer 601 and the second encapsulant layer 602. Because the top surface of the metal baffle is also provided with a groove, the groove can provide a filling position for an adhesive used for fixing the second packaging adhesive layer or provide a clamping position for the second packaging adhesive layer so as to indirectly improve the packaging bonding capacity and increase the air tightness. Optionally, the first packaging adhesive layer can be a low-refractive-index transparent adhesive layer, and is strong in crack resistance and poor in air tightness; the second packaging adhesive layer can be a high-refractive-index transparent adhesive layer containing quantum dots, and the air tightness is good. The high-protection sealing glue layer can be adopted at two levels or at the rear level, so that the high heat resistance and blue light resistance of the packaging body are improved, and the problem of low air tightness caused by high transmittance (such as oxygen permeation and moisture permeability) of the primary packaging material is solved. Alternatively, the first encapsulating glue layer may be a soft glue layer with hardness standard Shore D ≦ 62, including but not limited to 60, 55, 50, 40, and the like. The lower the hardness of the soft gel layer, the stronger the crack resistance. The soft adhesive layer is selected as the packaging adhesive layer closest to the LED chip, and the anti-cracking capacity of the soft adhesive layer is utilized to improve the reliability of the LED packaging with high radiation and high heat release. The second encapsulating adhesive layer may be a stiff adhesive layer having a hardness standard Shore D > 62, including but not limited to 65, 70, 75, 80, and the like. The hard adhesive layer can protect the inner soft adhesive layer and the LED chip and improve air tightness. And a second-level packaging scheme and a higher-level packaging scheme can be arranged, and a packaging adhesive layer formed later can be effectively prevented from being in direct contact with a heat source by utilizing a multi-level packaging mode, so that the safety performance is improved. The dual requirements of high crack resistance and high air tightness protection of the light-emitting device can be met, and the light-emitting device can be applied to isolation of non-heat-resistant material packaging. Optionally, the first encapsulating adhesive layer is a transparent encapsulating adhesive layer with hardness standard Shore D less than 40, or a mixed soft glue containing other brightening agents is selected, and the second encapsulating adhesive layer is a fluorescent film containing quantum dots. At this time, the light source generated by the LED chip can excite the quantum dots to mix to form the white light with high color gamut.
According to the LED device provided by the invention, the LED support is provided with the metal baffle, and the top surface of the metal baffle is also provided with the groove, so that plastic materials are effectively prevented from overflowing to the functional area on the metal frame, and the reliability of the bonding of the LED chip and the LED support can be ensured. Still have first encapsulation groove and second encapsulation groove through the LED support, at least partial top surface of metal baffle is the step face between first encapsulation groove and the second encapsulation groove to do benefit to and adopt the multilayer level packaging scheme, satisfy different application demands. The stepped surface is provided with a groove, so that the contact area of the sealing glue and the LED support can be increased to enable the sealing glue and the LED support to be connected more firmly, and when a multi-stage packaging scheme is adopted, the adhesive for fixing the layer of packaging glue provides a filling position, or a clamping position is provided for the layer of packaging glue to indirectly improve the packaging combination capacity and increase the air tightness.
Yet another alternative embodiment of the invention:
the present embodiment provides a method for manufacturing an LED support, as shown in fig. 9, the method for manufacturing an LED support at least includes the following steps:
s101: providing a metal frame; wherein the metal frame comprises a first frame and a second frame; the first frame and the second frame are separated by a through groove.
In this embodiment, the first frame and the second frame may be formed by stamping or etching. The metal frame includes, but is not limited to, a copper frame or a copper alloy frame. Optionally, a first step is further disposed at an end of the first frame close to the through groove, and a second step is further disposed at an end of the second frame close to the through groove, at this time, a through groove with a larger accommodating space may be formed between the first frame and the second frame, so as to reserve a larger filling position for the insulating member, and also facilitate increasing a bonding path between the insulating member to be filled and the metal frame to increase bonding force. Optionally, the metal frame includes a front surface and a back surface which are arranged oppositely, and the front surface of the metal frame may be divided in advance based on the specific arrangement positions of the subsequent metal baffle, the insulating support and the LED chip on the metal frame, respectively. Since the metal frame includes the first frame and the second frame, the front surface of the metal frame includes the front surface of the first frame and the front surface of the second frame. At the moment, a connecting area for contacting with the insulating support, an extending area for contacting with the metal baffle and a functional area for fixing and electrically connecting with the LED chip can be respectively divided on the front surface of the first frame and the front surface of the second frame; for example, a first connecting region, a first extending region and a first functional region are arranged on the front surface of the first frame, and a second connecting region, a second extending region and a second functional region are arranged on the front surface of the second frame; wherein the first connection region may be connected to the first extension region and the second connection region may be connected to the second extension region. Optionally, a through hole can also be arranged inside the metal frame so that the insulating support to be formed can extend from the connecting area of the front surface of the metal frame to the back surface of the metal frame; for example, a first through hole penetrating the front and rear surfaces of the first frame is formed at the first connection region of the first frame, and a second through hole penetrating the front and rear surfaces of the second frame is formed at the second connection region of the second frame; the first through hole and the second through hole are respectively used for providing a reserved position for the insulating component to be filled. Optionally, a step is further formed for the sidewall of the first through hole and/or the second through hole. The first through hole and the second through hole are additionally arranged, and the step surface is additionally arranged for the first through hole or the second through hole, so that the contact area between the insulating support to be formed and the metal frame is increased, and the binding force is increased. In order to increase the light extraction efficiency, the front surface of the first frame and the front surface of the second frame can be reflecting surfaces. For example by plating a thin highly reflective metal layer on the first frame or the second frame to form the reflective surface. The material of the high reflective metal layer includes, but is not limited to, any one or more of silver, nickel and gold.
S102: forming a metal baffle on the metal frame; the metal baffle plate is provided with a bottom surface and a top surface which are oppositely arranged, and the bottom surface of the metal baffle plate is contacted with the front surface of the metal frame; the metal baffle is provided with a first packaging groove which penetrates through the top surface and the bottom surface of the metal baffle, and the first packaging groove is communicated with the through groove; the top surface of the metal baffle is provided with a groove.
In this embodiment, the metal baffle and the metal frame may be made of the same material, such as copper or copper alloy. The LED light source can also be provided with the metal frame and the metal baffle as a whole, after the LED device is formed, heat generated when the LED chip emits light can be guided downwards by means of the metal frame and can be guided around by means of the metal baffle, and therefore the heat conduction effect of the heat generated when the LED device works is improved. Optionally, the height of the metal baffle plate can be higher than that of the LED chip, so that more heat can be guided by the metal baffle plate, and the heat conduction effect of heat generated by the LED device during working is further improved. It is to be understood that the metal baffle includes a top surface, a bottom surface, and a sidewall disposed between the top surface and the bottom surface. Because the first packaging groove penetrating through the top surface and the bottom surface of the metal baffle is formed on the metal baffle, the inner side wall of the metal baffle is exposed out of the first packaging groove. The opening shape of the first packaging groove includes, but is not limited to, a circle or a rectangle. The top surface of the metal baffle plate is provided with a groove, and the width and the depth of the groove can be flexibly designed according to actual requirements. In order to increase the light extraction efficiency, the inner side wall of the metal baffle exposed to the first packaging groove can be further arranged as a reflecting surface, for example, a thin high-reflection metal layer is electroplated on the inner side wall of the first packaging groove to form the reflecting surface. The material of the high reflective metal layer includes, but is not limited to, any one or more of silver, nickel and gold. In order to increase the light emitting angle, the inner side wall of the metal baffle plate exposed to the first packaging groove can be inclined towards the outer side of the metal baffle plate, so that an LED device with a larger light emitting angle can be formed.
S103: forming an insulating member and an insulating support on the metal frame; wherein the insulating part fills the through groove of the metal frame; the insulating support covers the outer side wall of the metal baffle and forms a second packaging groove with at least part of the top surface of the metal baffle, at least part of the top surface of the metal baffle is a step surface between the first packaging groove and the second packaging groove, and the groove in the top surface of the metal baffle is communicated with the second packaging groove.
In the present embodiment, the insulating member and the insulating support may be made of the same material, such as thermoplastic resin; and the insulating member and the insulating support may be integrally formed. The metal frame is further coated with the outer side wall of the metal baffle through the injection molded insulating support, and the top surface of the insulating support is higher than that of the metal baffle. And the insulating support and at least part of the top surface of the metal baffle are also arranged to form a second packaging groove, and the second packaging groove is communicated with the first packaging groove on the metal baffle and the groove on the top surface of the metal baffle. The opening size of the second packaging groove is larger than that of the first packaging groove, and the opening shape of the second packaging groove can be the same as that of the first packaging groove, including but not limited to circular or rectangular. In addition, the inner side wall of the insulating support exposed to the second packaging groove can be inclined towards the outer side of the insulating support, so that the LED device with a larger light-emitting angle can be formed. In addition, the insulating support can cover part of the top surface of the metal baffle plate, one end of the insulating support exposed on the inner side wall of the second packaging groove and the outer side of the top surface of the metal baffle plate close to the groove are arranged on the insulating support, and the outer side of the groove is far away from the first packaging groove; the metal baffle plate is beneficial to forming isolation barrier at the groove of the metal baffle plate when the insulating support is manufactured, so that plastic materials are prevented from overflowing to a functional area on the metal frame or a reflecting surface of the metal baffle plate, and the connection between a follow-up LED chip and the LED support is more firm.
In the manufacturing method of the LED bracket provided in this embodiment, a metal baffle plate with a groove and a first package groove is formed on a metal frame, and then an insulating bracket and a second package groove are formed on the metal frame by surrounding the metal baffle plate; so that at least part of the top surface of the metal baffle is a step surface between the first packaging groove and the second packaging groove. When the insulating support is manufactured, the groove of the metal baffle plate can be isolated and blocked, so that the plastic material is effectively prevented from overflowing to the functional area on the metal frame, and the reliability of the bonding of the LED chip and the LED support can be ensured.
The LED device provided in the foregoing embodiments can be applied to various light emitting fields, for example, it can be manufactured into a backlight module applied to a display backlight field (which can be a backlight module of a terminal such as a television, a display, a mobile phone, etc.). It can be applied to a backlight module at this time. The display backlight module can be applied to the fields of display backlight, key backlight, shooting, household lighting, medical lighting, decoration, automobiles, traffic and the like. When the LED backlight source is applied to the key backlight field, the LED backlight source can be used as a key backlight light source of mobile phones, calculators, keyboards and other devices with keys; when the camera is applied to the field of shooting, a flash lamp of a camera can be manufactured; when the lamp is applied to the field of household illumination, the lamp can be made into a floor lamp, a table lamp, an illuminating lamp, a ceiling lamp, a down lamp, a projection lamp and the like; when the lamp is applied to the field of medical illumination, the lamp can be made into an operating lamp, a low-electromagnetic illuminating lamp and the like; when the decorative material is applied to the decorative field, the decorative material can be made into various decorative lamps, such as various colored lamps, landscape illuminating lamps and advertising lamps; when the material is applied to the field of automobiles, the material can be made into automobile lamps, automobile indicating lamps and the like; when the lamp is applied to the traffic field, the lamp can be made into various traffic lamps and can also be made into various street lamps. The above applications are only a few applications exemplified by the present embodiment, and it should be understood that the application of the LED device in the present embodiment is not limited to the above exemplified fields.
It is to be understood that the invention is not limited to the examples described above, but that modifications and variations may be effected thereto by those of ordinary skill in the art in light of the foregoing description, and that all such modifications and variations are intended to be within the scope of the invention as defined by the appended claims.

Claims (10)

1. An LED support, comprising: the metal baffle plate, the insulating component and the insulating bracket are arranged on the metal frame; wherein the content of the first and second substances,
the metal frame comprises a first frame and a second frame; the first frame is separated from the second frame through a through groove;
the metal baffle is provided with a bottom surface and a top surface which are oppositely arranged, and the bottom surface of the metal baffle is contacted with the front surface of the metal frame; the metal baffle is provided with a first packaging groove which penetrates through the top surface and the bottom surface of the metal baffle, and the first packaging groove is communicated with the through groove; the top surface of the metal baffle is provided with a groove;
the insulating part fills the through groove of the metal frame; the insulating bracket covers the outer side wall of the metal baffle and forms a second packaging groove with at least part of the top surface of the metal baffle; at least part of the top surface of the metal baffle is a step surface between the first packaging groove and the second packaging groove, and the groove on the top surface of the metal baffle is communicated with the second packaging groove.
2. The LED support of claim 1, wherein the first frame has a first through hole formed therethrough, and the second frame has a second through hole formed therethrough;
the insulating support also extends toward the inside of the metal frame to fill the first through hole and the second through hole.
3. The LED support of claim 1, wherein the metal bezel has a height greater than a height of the LED chip.
4. The LED holder according to any one of claims 1 to 3, wherein an inner side wall of the metal bezel exposed to the first packaging groove is a reflecting surface.
5. The LED holder according to any one of claims 1 to 3, wherein a surface of the metal frame exposed to the first package groove is a reflective surface.
6. The LED holder according to any one of claims 1 to 3, wherein an inner side wall of the metal bezel exposed to the first packaging groove is disposed obliquely toward an outer side of the metal bezel.
7. An LED device, comprising: the LED support of any of claims 1-6, and an LED chip and an encapsulant layer disposed on the LED support; the LED chip is arranged in the first packaging groove and is electrically connected with the metal frame; the packaging adhesive layer is arranged in the first packaging groove and the second packaging groove to wrap the LED chip.
8. The LED device of claim 7, wherein the encapsulation glue layer comprises a first encapsulation glue layer disposed within the first encapsulation groove and a second encapsulation glue layer disposed within the second encapsulation groove.
9. The LED device of claim 8, wherein the first encapsulant layer has a lower hardness than the second encapsulant layer.
10. A manufacturing method of an LED bracket is characterized by comprising the following steps:
providing a metal frame; wherein the metal frame comprises a first frame and a second frame; the first frame is separated from the second frame through a through groove;
forming a metal baffle on the metal frame; the metal baffle plate is provided with a bottom surface and a top surface which are oppositely arranged, and the bottom surface of the metal baffle plate is contacted with the front surface of the metal frame; the metal baffle is provided with a first packaging groove which penetrates through the top surface and the bottom surface of the metal baffle, and the first packaging groove is communicated with the through groove; the top surface of the metal baffle is provided with a groove;
forming an insulating part and an insulating bracket on the metal frame; wherein the insulating member fills the through groove of the metal frame; the insulating support covers the outer side wall of the metal baffle and forms a second packaging groove with at least part of the top surface of the metal baffle, at least part of the top surface of the metal baffle is a step surface between the first packaging groove and the second packaging groove, and the groove on the top surface of the metal baffle is communicated with the second packaging groove.
CN202210344117.6A 2022-03-31 2022-03-31 LED support, manufacturing method thereof and LED device Pending CN114824029A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN202210344117.6A CN114824029A (en) 2022-03-31 2022-03-31 LED support, manufacturing method thereof and LED device
PCT/CN2023/085691 WO2023186144A1 (en) 2022-03-31 2023-03-31 Led device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210344117.6A CN114824029A (en) 2022-03-31 2022-03-31 LED support, manufacturing method thereof and LED device

Publications (1)

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CN114824029A true CN114824029A (en) 2022-07-29

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Country Link
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023186144A1 (en) * 2022-03-31 2023-10-05 深圳市聚飞光电股份有限公司 Led device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023186144A1 (en) * 2022-03-31 2023-10-05 深圳市聚飞光电股份有限公司 Led device

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