CN114823420A - LED chip transfer device - Google Patents

LED chip transfer device Download PDF

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Publication number
CN114823420A
CN114823420A CN202210359443.4A CN202210359443A CN114823420A CN 114823420 A CN114823420 A CN 114823420A CN 202210359443 A CN202210359443 A CN 202210359443A CN 114823420 A CN114823420 A CN 114823420A
Authority
CN
China
Prior art keywords
chip
led chip
inductive switch
transmission
led
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202210359443.4A
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Chinese (zh)
Inventor
李林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
Original Assignee
Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd filed Critical Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority to CN202210359443.4A priority Critical patent/CN114823420A/en
Publication of CN114823420A publication Critical patent/CN114823420A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

The invention discloses an LED chip transfer device. The LED chip transfer device comprises a carrying platform, a plurality of transmission members with adjustable intervals and a first inductive switch; the carrier is provided with a plurality of chip through holes; the chip inlet end of the transmission component is connected with the chip through hole; first inductive switch is located the junction of chip entry end and chip via hole, and after first inductive switch sensed the LED chip and passed, first inductive switch's valve was closed. The invention can adjust the distance between the transmission components according to the distance between the LED chips arranged on the receiving substrate, and can quickly match the requirements of different LED chip distances; and the first inductive switch is used for controlling each transmission component to only allow one LED chip to fall down at each time, so that the condition that a plurality of LED chips are overlapped at the same position on the receiving substrate is avoided, and the transfer efficiency and the success rate of the LED chips are improved.

Description

LED chip transfer device
Technical Field
The invention relates to the technical field of display, in particular to an LED chip transfer device.
Background
The use of LED (light emitting diode) display screens is becoming more and more popular. According to the difference of the dot pitches, the LED display technology can be divided into a small-pitch LED display technology, a Mini-LED display technology and a Micro-LED display technology. And due to the smaller chip size of the Mini-LED and the Micro-LED, higher pixel density (PPI) can be realized, and excellent display effect is achieved.
In the Mini-LED and Micro-LED display technologies, how to improve the efficiency of mass transfer of LED chips is a problem which needs to be solved urgently on the mass production line of LED display panels.
Disclosure of Invention
Based on the above defects in the prior art, the present invention provides an LED chip transfer device, which can improve the transfer efficiency of LED chips.
In order to achieve the above object, the present invention provides an LED chip transferring device, which at least comprises:
a carrier having a plurality of chip vias formed therein;
the chip inlet ends of the transmission members are connected with the chip through holes;
the first inductive switch is positioned at the joint of the chip inlet end and the chip through hole, and when the first inductive switch senses that the LED chip passes through, the valve of the first inductive switch is closed.
Optionally, the LED chip detection device further comprises a second inductive switch, the second inductive switch is located at the chip outlet end of the transmission member, and when the second inductive switch senses that the LED chip passes through the second inductive switch, a valve of the second inductive switch is closed.
Optionally, a slide rail is connected between the chip via holes, and the chip inlet end is slidably connected with the slide rail.
Optionally, a hollowed-out sliding groove is connected between the chip through holes, and the chip inlet end is in sliding connection with the sliding groove.
Optionally, a groove is formed in a side wall of the sliding groove, a latch is formed at an inlet end of the chip, and the latch is slidably connected with the groove.
Optionally, the transmission member further includes a first transmission pipe, a second transmission pipe and a bending portion with adjustable bending degree, the first transmission pipe and the second transmission pipe are connected through the bending portion, and the chip inlet end of the first transmission pipe is connected with the chip via hole.
Optionally, the pipe diameter of the bending part is larger than the pipe diameters of the first transmission pipe and the second transmission pipe.
Optionally, the transmission member further comprises an electromagnetic sheet generating a force on the LED chip, the electromagnetic sheet being located in the bent portion.
Optionally, the bending portion further includes a flexible tube made of a flexible material, and two ends of the flexible tube are respectively communicated with the first transmission tube and the second transmission tube.
Optionally, the cross-sectional dimension of the transmission member is less than 1.5 times the dimension of the LED chip.
Compared with the prior art, the invention has the beneficial effects that at least: the LED chip transfer device comprises a carrying platform, a plurality of transmission members with adjustable intervals and a first inductive switch; the carrier is provided with a plurality of chip through holes; the chip inlet end of the transmission component is connected with the chip through hole; first inductive switch is located the junction of chip entry end and chip via hole, and after first inductive switch sensed the LED chip and passed, first inductive switch's valve was closed. The invention can adjust the distance between the transmission components according to the distance between the LED chips arranged on the receiving substrate, and can quickly match the requirements of different LED chip distances; and the first inductive switch is used for controlling each transmission component to only allow one LED chip to fall down at each time, so that the condition that a plurality of LED chips are overlapped at the same position on the receiving substrate is avoided, and the transfer efficiency and the success rate of the LED chips are improved.
Drawings
In order to illustrate the embodiments or the technical solutions in the prior art more clearly, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the invention, and it is obvious for a person skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a first schematic structural diagram of an LED chip transfer device according to an embodiment of the present invention;
FIG. 2 is a first cross-sectional view of a via of a chip according to an embodiment of the invention;
FIG. 3 is a second cross-sectional view of a through hole of a chip according to an embodiment of the invention;
fig. 4 is a schematic structural diagram of an LED chip transfer device according to an embodiment of the present invention.
Detailed Description
The following description of the various embodiments refers to the accompanying drawings that illustrate specific embodiments in which the invention may be practiced. In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referenced module or element must have a particular orientation, be constructed in a particular orientation, and be operated, and thus should not be construed as limiting the present invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
An embodiment of the present invention provides an LED chip transfer device, as shown in fig. 1, the LED chip transfer device at least includes: a carrier 100, a plurality of transmission members 200 with adjustable intervals and a first inductive switch 300; the carrier 100 is formed with a plurality of chip via holes 101; the chip inlet end 201 of the transfer member 200 is connected with the chip via hole 101; the first inductive switch 300 is located at the connection position of the chip inlet end 201 and the chip through hole 101, and when the first inductive switch 300 senses that the LED chip passes through, the valve of the first inductive switch 300 is closed;
specifically, when transferring an LED chip to the receiving substrate, the LED chip falls into the transmission member 200, passes through the first inductive switch 300, the first inductive switch 300 senses that the LED chip passes through, and then the first inductive switch 300 closes the valve, so that the next LED chip to be transferred cannot fall into the transmission member 200 together with the LED chip, and the next LED chip is prevented from also falling into the position corresponding to the receiving substrate, which causes the occurrence of the condition of overlapping the LED chips on the receiving substrate, resulting in the failure of transferring the LED chips.
The LED chip transfer device of this embodiment can adjust the distance between the transmission members 200 according to the distance between the LED chips disposed on the receiving substrate, and can quickly match the requirements of different distances between the LED chips; and the first inductive switch 300 controls each transmission component 200 to allow only one LED chip to fall down at a time, so that the situation that a plurality of LED chips are overlapped at the same position on the receiving substrate is avoided, and the huge transfer efficiency and success rate of the LED chips are improved.
By using the LED chip transfer device of the embodiment, the pre-arrangement action in the process of transferring the LED chips in a large quantity can be reduced, and the time and the production cost are saved.
In one embodiment, the LED chip transferring apparatus further includes a second inductive switch 400, the second inductive switch 400 is located at the chip outlet end 202 of the transmission member 200, and when the second inductive switch 400 senses that the LED chip passes through, a valve of the second inductive switch 400 is closed.
After the second inductive switch 400 induces that the LED chip passes through, it indicates that the LED chip has passed through the transmission member 200 and dropped on the position corresponding to the receiving substrate, and at this time, the valve of the second inductive switch 400 is closed, so as to prevent the next LED chip from dropping on the position corresponding to the receiving substrate, which may cause the LED chip to be stacked on the receiving substrate, resulting in the LED chip transfer failure.
In the embodiment, it can be more reliably ensured that only one LED chip is allowed to fall down in each transmission member 200 through the first inductive switch 300 and the second inductive switch 400, so that the situation that a plurality of LED chips are stacked at the same position on the receiving substrate is avoided, and the huge transfer efficiency and the success rate of the LED chips are improved.
In one embodiment, the transfer member 200 may be a funnel tube structure 210, and the cross-sectional size of the funnel tube structure 210 is slightly larger than the size of the LED chip, so that the LED chip is prevented from being turned upside down in the transfer member 200.
In one embodiment, as shown in fig. 1 and 2, a slide rail a is connected between the chip through holes 101, and the chip inlet end 201 is slidably connected to the slide rail a. Specifically, the position on the slide rail a corresponding to the chip via hole 101 is a through hole, so that the LED chip can fall onto the receiving substrate from the chip via hole 101, the through hole on the slide rail a, and the transmission member 200.
The chip inlet end 201 can be clamped with the slide rail A and can slide on the slide rail A, the transmission component 200 can be moved according to the distance between the LED chips arranged on the receiving substrate, the transmission component 200 can be moved on the slide rail A, the distance between the adjacent transmission components 200 can be adjusted, the LED chips fall on the corresponding positions of the target substrate through the transmission component 200, and the process steps of pre-arrangement of the LED chips are saved.
In one embodiment, as shown in fig. 3, a hollow chute B is connected between the chip through holes 101, and the chip inlet 201 is slidably connected to the chute B. The chip inlet end 201 can be clamped in the sliding groove B, the transmission component 200 can move on the sliding groove B, the distance between the adjacent transmission components 200 can be adjusted conveniently and quickly, and the LED chip transfer efficiency is improved.
Furthermore, a groove C is formed on the side wall of the sliding groove B, a clamping tongue 203 is formed at the chip inlet end 201, and the clamping tongue 203 is connected with the groove C in a sliding mode. This makes it possible to stably move the transmission member 200 through the chute B. In order to make the sliding smoother, lubricating oil can be smeared in the grooves C.
In one embodiment, as shown in fig. 4, the transmission member 200 may be a robot arm structure 220, and may specifically include a first transmission pipe 221, a second transmission pipe 222 and a bending portion 223 with an adjustable bending degree, the first transmission pipe 221 and the second transmission pipe 222 are connected by the bending portion 223, and the chip inlet end 201 of the first transmission pipe 221 is connected with the chip via 101. Specifically, the transmission member 200 may be a mechanical arm structure 220, and the distance between chip outlets of the adjacent transmission members 200 is adjusted by adjusting the bending degree of the bending portion 223, so as to adapt to the distance requirement of the LED chips on the receiving substrate, and save the process steps of pre-arrangement of the LED chips.
In one embodiment, the diameter of the bending portion 223 is larger than the diameters of the first transmission pipe 221 and the second transmission pipe 222. This makes it possible to make the LED chip fall more smoothly in the bent portion 223, avoiding being caught in the bent portion 223.
In one embodiment, the transmission member 200 further includes an electromagnetic sheet 224 generating a force to the LED chip, and the electromagnetic sheet 224 is located in the bending portion 223. The LED chip is guided to fall and move in the bent portion 223 by the attraction of the electromagnetic sheet 224 to the LED chip, and the LED chip is prevented from turning over in the bent portion 223.
In an embodiment, the bending portion 223 includes a flexible tube made of a flexible material, two ends of the flexible tube are respectively communicated with the first transmission tube 221 and the second transmission tube 222, and the falling position of the LED chip can be adjusted by bending the flexible tube, so as to meet the requirements of different distances between the LED chips. Meanwhile, the support member can make the first transmission pipe 221, the second transmission pipe 222 communicate with each other and the connection of the hose more stable.
Further, the bending portion 223 may further include a telescopic support link, and both ends of the support link are respectively connected to the first transmission pipe 221 and the second transmission pipe 222. The support link may be telescoped in length to fit the length of the hose, while the support link may stabilize the connection of the first transmission pipe 221, the second transmission pipe 222, and the hose.
In one embodiment, the cross-sectional dimension of the transmission member 200 is less than 1.5 times the dimension of the LED chip. This prevents the transfer member 200 from being oversized and the LED chip from flipping upside down when falling down in the transfer member 200.
In one embodiment, the inner wall of the transmission member 200 is smooth. This may make the LED chip more smoothly drop in the transfer member 200.
In the field of Micro Light Emitting diode (Micro Light Emitting diode) Display, in order to manufacture a Light Emitting diode Display, Micro LED chips need to be transferred from an original substrate to a receiving substrate to be arranged in an array, and the LED chips on different receiving substrates have different pitches. In order to solve the problem, the prior art is realized by pre-arrangement, different pre-arrangement templates need to be manufactured at different intervals, so that the production cost is increased, and the production efficiency is reduced.
In an embodiment of the present invention, the LED chip transferring apparatus includes a carrier 1, a funnel structure 210, a first inductive switch 300, and a second inductive switch 400; the carrier 1 is formed with a plurality of chip via holes 101; the chip inlet end 201 of the funnel structure 210 is connected with the chip via hole 101; the first inductive switch 300 is located at the connection position of the chip inlet end 201 and the chip through hole 101, and when the first inductive switch 300 senses that the LED chip passes through, the valve of the first inductive switch 300 is closed; the second inductive switch 400 is located at the chip outlet end 202 of the funnel structure 210, and when the second inductive switch 400 senses that the LED chip passes through, the valve of the second inductive switch 400 is closed. When transferring an LED chip to the receiving substrate, the LED chip falls into the transmission member 200, passes through the first inductive switch 300, the first inductive switch 300 senses that the LED chip passes through, and then the first inductive switch 300 closes the valve, so as to prevent the next LED chip to be transferred from falling into the funnel structure 210 along with the LED chip; after the second inductive switch 400 induces that the LED chip passes through, it indicates that the LED chip has passed through the funnel structure 210 and falls on the position corresponding to the receiving substrate, and at this time, the valve of the second inductive switch 400 is closed, so as to prevent the next LED chip from falling on the position corresponding to the receiving substrate, which may result in the occurrence of the situation of LED chip superposition on the receiving substrate, and thus LED chip transfer failure.
Wherein, the cross-sectional dimension of the funnel tube structure 210 is slightly larger than the dimension of the LED chip; be connected with slide rail A between the chip via hole 101, chip entry end 201 and slide rail A sliding connection. Chip entry end 201 can with slide rail A joint to can slide on slide rail A, can be according to the LED chip interval that sets up on the receiving substrate, remove funnel tube structure 210, make funnel tube structure 210 move on slide rail A, with the interval between the adjacent funnel tube structure 210 of adjustment, the LED chip falls the position that corresponds on the target substrate through funnel tube structure 210 like this.
In another embodiment of the present invention, the LED chip transferring apparatus includes a carrier 1, a mechanical arm structure 220, a first inductive switch 300, and a second inductive switch 400; the carrier 1 is formed with a plurality of chip via holes 101; the chip inlet end 201 of the robot arm structure 220 is connected to the chip via hole 101; the first inductive switch 300 is located at the connection position of the chip inlet end 201 and the chip through hole 101, and when the first inductive switch 300 senses that the LED chip passes through, the valve of the first inductive switch 300 is closed; the second inductive switch 400 is located at the chip outlet end 202 of the mechanical arm structure 220, and when the second inductive switch 400 senses that the LED chip passes through, the valve of the second inductive switch 400 is closed. When transferring one LED chip to the receiving substrate, the LED chip falls into the mechanical arm structure 220 and passes through the first inductive switch 300, the first inductive switch 300 senses that the LED chip passes through, and then the first inductive switch 300 closes the valve, so as to prevent the next LED chip to be transferred from falling into the mechanical arm structure 220 together with the LED chip; after the second inductive switch 400 senses that the LED chip passes through, it indicates that the LED chip has passed through the mechanical arm structure 220 and falls on the position corresponding to the receiving substrate, and at this time, the second inductive switch 400 closes the valve, so as to prevent the next LED chip from falling on the position corresponding to the receiving substrate, which may cause the LED chip to be stacked on the receiving substrate, resulting in the LED chip being failed to be transferred.
The mechanical arm structure 220 includes a first transmission pipe 221, a second transmission pipe 222 and a bending portion 223 with adjustable bending degree, the first transmission pipe 221 and the second transmission pipe 222 are connected through the bending portion 223, and the chip inlet end 201 of the first transmission pipe 221 is connected with the chip via hole 101. Specifically, the pitch between the chip outlets of the adjacent transmission members 200 is adjusted by adjusting the degree of bending of the bending portion 223 to adapt to the pitch requirement of the LED chips on the receiving substrate. The pipe diameter of the bending portion 223 is larger than the pipe diameters of the first transmission pipe 221 and the second transmission pipe 222. The electromagnetic sheet 224 is disposed in the bent portion 223, and the LED chip is guided to fall and move in the bent portion 223 by the attraction of the electromagnetic sheet 224 to the LED chip, and meanwhile, the LED chip is prevented from turning over in the bent portion 223. The bending portion 223 further includes a flexible tube made of a flexible material and a support connecting rod, two ends of the flexible tube are respectively communicated with the first transmission tube 221 and the second transmission tube 222, and two ends of the support connecting rod are respectively connected with the first transmission tube 221 and the second transmission tube 222. The hose can be bent by a large angle, and the requirements of different intervals of the LED chips can be met. Meanwhile, the support connecting rod can enable the first transmission pipe 221, the second transmission pipe 222 to be communicated and the connection of the hose to be more stable.
In an embodiment, the chip through holes 101 may be connected to each other by a sliding rail a or a sliding groove B, and the chip inlet end 201 of the mechanical arm structure 220 may be connected to the sliding rail a or the sliding groove B, so that the position of the LED chip falling onto the receiving substrate may be adjusted by moving the position of the mechanical arm on the carrier 1, and the position of the LED chip falling onto the receiving substrate may also be adjusted by adjusting the position of the chip outlet of the mechanical arm.
The LED chip transfer device provided by the embodiment of the invention can conveniently and quickly adjust the distance between the transmission components 200 according to the distance between the LED chips arranged on the receiving substrate, can quickly match the requirements of different LED chip distances, and saves the process steps of pre-arrangement of the LED chips; in addition, the first inductive switch 300 and the second inductive switch 400 are used for controlling each transmission component 200 to only allow one LED chip to fall down at each time, so that the condition that a plurality of LED chips are overlapped at the same position on the receiving substrate is avoided, and the LED chip transfer efficiency is improved.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims (10)

1. An LED chip transfer device, characterized by comprising at least:
a carrier having a plurality of chip vias formed therein;
the chip inlet ends of the transmission members are connected with the chip through holes;
the first inductive switch is positioned at the joint of the chip inlet end and the chip through hole, and when the first inductive switch senses that the LED chip passes through, a valve of the first inductive switch is closed.
2. The LED chip transfer device according to claim 1, further comprising a second inductive switch located at the chip outlet end of the transmission member, wherein a valve of the second inductive switch is closed when the second inductive switch senses the LED chip passing through.
3. The LED chip transfer device of claim 1, wherein a slide rail is connected between the chip through holes, and the chip inlet end is slidably connected with the slide rail.
4. The LED chip transfer device of claim 1, wherein a hollowed-out chute is connected between the chip through holes, and the chip inlet end is slidably connected with the chute.
5. The LED chip transfer device according to claim 4, wherein a groove is formed on a side wall of the sliding groove, and a latch is formed at the chip inlet end and is slidably connected with the groove.
6. The LED chip transfer device according to claim 1, wherein the transmission member further comprises a first transmission tube, a second transmission tube and a bending portion with adjustable bending degree, the first transmission tube and the second transmission tube are connected through the bending portion, and the chip inlet end of the first transmission tube is connected with the chip via hole.
7. The LED chip transfer device according to claim 6, wherein the pipe diameter of the bending part is larger than the pipe diameters of the first transmission pipe and the second transmission pipe.
8. The LED chip transfer device of claim 6, wherein said transmission member further comprises an electromagnetic sheet generating a force on said LED chip, said electromagnetic sheet being located in said bent portion.
9. The LED chip transfer device according to claim 6, wherein the bent portion further comprises a flexible tube made of a flexible material, and two ends of the flexible tube are respectively communicated with the first transmission tube and the second transmission tube.
10. The LED chip transfer device of claim 1, wherein a cross-sectional dimension of said transfer member is less than 1.5 times a dimension of said LED chip.
CN202210359443.4A 2022-04-06 2022-04-06 LED chip transfer device Pending CN114823420A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210359443.4A CN114823420A (en) 2022-04-06 2022-04-06 LED chip transfer device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210359443.4A CN114823420A (en) 2022-04-06 2022-04-06 LED chip transfer device

Publications (1)

Publication Number Publication Date
CN114823420A true CN114823420A (en) 2022-07-29

Family

ID=82534960

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210359443.4A Pending CN114823420A (en) 2022-04-06 2022-04-06 LED chip transfer device

Country Status (1)

Country Link
CN (1) CN114823420A (en)

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