CN114822604A - Memory bank installation method and related vehicle-mounted server and computing equipment - Google Patents

Memory bank installation method and related vehicle-mounted server and computing equipment Download PDF

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Publication number
CN114822604A
CN114822604A CN202110062366.1A CN202110062366A CN114822604A CN 114822604 A CN114822604 A CN 114822604A CN 202110062366 A CN202110062366 A CN 202110062366A CN 114822604 A CN114822604 A CN 114822604A
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CN
China
Prior art keywords
memory bank
protective shell
protective
cover
memory
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Pending
Application number
CN202110062366.1A
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Chinese (zh)
Inventor
马志华
栾熙鹏
王航
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Beijing Tusimple Technology Co Ltd
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Beijing Tusimple Technology Co Ltd
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Filing date
Publication date
Application filed by Beijing Tusimple Technology Co Ltd filed Critical Beijing Tusimple Technology Co Ltd
Priority to CN202110062366.1A priority Critical patent/CN114822604A/en
Publication of CN114822604A publication Critical patent/CN114822604A/en
Pending legal-status Critical Current

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    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
    • G11B33/02—Cabinets; Cases; Stands; Disposition of apparatus therein or thereon
    • G11B33/08—Insulation or absorption of undesired vibrations or sounds
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
    • G11B33/02—Cabinets; Cases; Stands; Disposition of apparatus therein or thereon
    • G11B33/04—Cabinets; Cases; Stands; Disposition of apparatus therein or thereon modified to store record carriers
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
    • G11B33/14—Reducing influence of physical parameters, e.g. temperature change, moisture, dust
    • G11B33/1406—Reducing the influence of the temperature
    • G11B33/1426—Reducing the influence of the temperature by cooling plates, e.g. fins
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
    • G11B33/14—Reducing influence of physical parameters, e.g. temperature change, moisture, dust
    • G11B33/1446—Reducing contamination, e.g. by dust, debris
    • G11B33/1466—Reducing contamination, e.g. by dust, debris sealing gaskets

Abstract

The invention provides a memory bank installation method, a related vehicle-mounted server and a related computing device, wherein the memory bank installation method comprises the following steps: installing a memory bank in a memory slot of a mainboard; attaching the damping member and the first heat-conducting member to the protective housing, and mounting the protective housing on the main board so that the first heat-conducting member and the damping member abut against the memory bank; and attaching the second heat-conducting piece to the protective shell cover, and mounting the protective shell cover on the mainboard and buckling the protective shell cover on the protective shell so that the second heat-conducting piece is abutted to the memory bank. According to the installation method, the memory bank is installed in the space limited by the protective shell and the protective shell cover in the installation process, and the shock absorption piece for absorbing vibration is arranged between the memory bank and the protective shell, so that the memory bank is well sealed, the memory bank can be prevented from vibrating, the phenomenon of dust deposition in the memory slot is avoided, and the connection reliability is ensured.

Description

Memory bank installation method and related vehicle-mounted server and computing equipment
Technical Field
The present disclosure relates to the field of automatic driving technologies, and in particular, to a method for installing a memory bank, and a related vehicle-mounted server and a related computing device.
Background
The memory mounting mode of the existing vehicle-mounted server and the automatic driving vehicle-mounted server is to directly insert a memory bank into a memory slot of a mainboard, and a connecting component is a golden finger which can support high-speed data transmission. The golden finger consists of a plurality of golden conductive contact blades, the contact mode with the slot is point contact, and the three-axis random vibration generated in the travelling crane can cause poor point contact with the slot, so that data transmission is interrupted, and server faults are caused.
Meanwhile, dust in the environment can be deposited in the memory slot and attached to the surface of the golden finger in the long-term operation process of the server, and faults such as memory loss, server crash or restart and the like caused by transmission interruption due to semi-conduction or conduction during the operation of the server cannot meet the operation requirement of the automatic driving software.
Disclosure of Invention
The embodiment of the invention provides a memory bank installation method, a related vehicle-mounted server and a related computing device, which can better seal the memory bank, avoid the vibration of the memory bank, avoid the phenomenon of dust deposition in a memory slot, ensure the connection reliability between the memory bank and the slot and further avoid the phenomenon of server failure caused by data interruption.
The method for installing the memory bank disclosed by the embodiment of the invention comprises the following steps:
installing a memory bank in a memory slot of a mainboard;
attaching a shock-absorbing member and a first heat-conducting member to a protective housing, and mounting the protective housing on the main board so that the first heat-conducting member and the shock-absorbing member abut against the memory bank;
attaching a second heat-conducting piece to a protective shell cover, and mounting the protective shell cover on the mainboard and buckling the protective shell cover on the main board so that the second heat-conducting piece abuts against the memory bank.
In some embodiments, the upper end of the protective shell is provided with a stop convex edge, and a mounting groove is defined in the protective shell cover; installing the protection shell cover on the main board and buckling the protection shell cover on the main board comprises the following steps: and stopping the stopping convex edge on the top wall of the mounting groove.
In some specific embodiments, a connecting member is used to lock the top wall of the mounting groove and the stop flange.
In some more specific embodiments, the protective housing and the connecting gap of the protective housing cover are sealed by using a sealant.
In some more specific embodiments, the protective enclosure and the joint between the protective enclosure cover and the main board are reinforced by hot melt adhesive.
In some embodiments, a first adhesive member is attached to the protection housing, and the first adhesive member is used to attach the lower end of the protection housing to the outer side wall of the memory slot.
In some embodiments, a second adhesive member is attached to the protective casing, and the lower end of the protective casing cover is attached to the outer side wall of the memory slot by using the second adhesive member.
In some embodiments, the protective enclosure and the protective enclosure cover are both hard aluminum alloy pieces.
In some embodiments, the first and second heat-conducting members are both thermally conductive silicone sheets.
The embodiment of the invention also discloses a vehicle-mounted server which comprises a mainboard and the memory bank, wherein the memory bank is installed on the mainboard by adopting the installation method.
The embodiment of the invention also discloses a computing device, which comprises: a main board having a memory slot; the memory bank is arranged in a memory slot of the mainboard; a first heat-conducting member and a second heat-conducting member; the memory bank is arranged in the memory bank, and a first heat conducting piece and a damping piece are arranged between the memory bank and the protective shell; and the memory bank is positioned in a space defined by the protective shell and the protective shell cover, and a second heat-conducting piece is arranged between the memory bank and the protective shell cover.
In some embodiments, the upper end of the protective shell is provided with a stop convex edge, and a mounting groove is defined in the protective shell cover; the stop convex edge is stopped on the top wall of the mounting groove.
In some embodiments, the computing device further comprises a connector for locking the top wall of the mounting groove and the stop flange.
In some embodiments, the protective housing and the connecting gap of the protective housing cover are sealed by a sealant.
In some embodiments, the protective housing and the connection between the protective housing cover and the main board are reinforced by hot melt adhesive.
In some embodiments, the lower end of the protective casing is bonded to the outer sidewall of the memory slot by a first adhesive member.
In some embodiments, the lower end of the protection cover is bonded to the outer sidewall of the memory slot by a second adhesive member.
In some embodiments, the protective enclosure and the protective enclosure cover are both hard aluminum alloy pieces.
In some embodiments, the first and second heat-conducting members are both thermally conductive silicone sheets.
According to the embodiment of the invention, the memory bank is arranged in the space defined by the protective shell and the protective shell cover, and the shock absorption piece for absorbing vibration is arranged between the memory bank and the protective shell, so that the memory bank is better sealed, the memory bank can be prevented from vibrating, the phenomenon of dust deposition in the memory slot is avoided, the connection reliability between the socket and the slot is ensured, and the phenomenon of server failure caused by data interruption is avoided.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
Fig. 1 is a flowchart of a memory bank mounting method according to an embodiment of the present invention.
Fig. 2 is a schematic structural diagram of components before the memory bank is mounted according to the embodiment of the present invention.
Fig. 3 is a schematic diagram of a step in a memory bank mounting method according to an embodiment of the present invention.
Fig. 4 is a schematic structural diagram of a part of components before the protective housing is installed according to the embodiment of the invention.
Fig. 5 is a schematic diagram of a step in a memory bank mounting method according to an embodiment of the present invention.
Fig. 6 is a schematic diagram of a step in a memory bank mounting method according to an embodiment of the present invention.
Fig. 7 is a schematic structural view of a part of components before the protective cover is mounted according to the embodiment of the present invention.
Fig. 8 is a schematic diagram of a step in a memory bank mounting method according to an embodiment of the present invention.
Fig. 9 is a schematic diagram of a step in a memory bank mounting method according to an embodiment of the present invention.
Fig. 10 is a schematic structural diagram of a motherboard on which a plurality of memory banks are mounted according to an embodiment of the present invention.
Reference numerals:
1. a main board; 11. a memory slot; 2. a memory bank; 3. a protective housing; 31. stopping the convex edge; 4. a shock absorbing member; 5. a first heat-conducting member; 6. a protective shell cover; 61. mounting grooves; 7. a second heat-conducting member; 8. a connecting member; 101. a first adhesive member; 102. and a second adhesive member.
Detailed Description
In order to make the technical problems solved, the technical solutions adopted and the technical effects achieved by the present invention clearer, the technical solutions of the present invention are further described below by way of specific embodiments with reference to the accompanying drawings.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the invention.
Furthermore, features defined as "first" and "second" may explicitly or implicitly include one or more of the features for distinguishing between descriptive features, non-sequential, non-trivial and non-trivial. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in a specific case to those of ordinary skill in the art.
A method of mounting a memory bank according to an embodiment of the present invention is described below with reference to fig. 1 to 10. Fig. 1 is a flowchart of a memory bank mounting method according to an embodiment of the present invention. Fig. 2 is a schematic structural diagram of components before the memory bank is mounted according to the embodiment of the present invention.
The embodiment of the invention discloses a memory bank installation method, which comprises the following steps of:
s1: installing the memory bank 2 in the memory slot 11 of the motherboard 1, as shown in fig. 3;
s2: attaching the damper 4 and the first heat-conductive member 5 to the protective case 3, and mounting the protective case 3 to the motherboard 1 such that the first heat-conductive member 5 and the damper 4 abut on the memory stick 2, as shown in fig. 5 and 6;
s3: the second heat-conducting member 7 is attached to the protective case cover 6, and the protective case cover 6 is mounted on the motherboard 1 and fastened to the protective case 3, so that the second heat-conducting member 7 abuts against the memory bank 2, as shown in fig. 8 and 9.
It can be understood that, in the installation method of the embodiment of the present invention, the memory bank 2 is protected in the space defined between the protection case cover 6 and the protection case 3, so that a phenomenon of dust deposition in the memory slot 11 is avoided, and further, failures such as transmission interruption, memory loss, even a server crash or restart, caused by dust deposition on the memory bank 2 are avoided. The shock absorbing member 4 can absorb triaxial random vibration generated in the driving process, and the phenomenon of poor contact between the memory strip 2 and the memory slot 11 is avoided, so that the phenomenon of server failure caused by data interruption is avoided. It should be additionally noted that the first heat conduction member 5 and the second heat conduction member 7 abutting against the side wall of the memory bank 2 can better transfer the heat of the memory bank 2, so as to avoid the overheating of the memory bank 2.
According to the memory bank installation method provided by the embodiment of the invention, the memory bank 2 is installed in the space defined by the protective shell 3 and the protective shell cover 6 in the installation process, and the vibration absorbing damping piece 4 is arranged between the memory bank 2 and the protective shell 3, so that the memory bank 2 is sealed well, the vibration of the memory bank 2 can be avoided, the phenomenon of dust deposition in the memory slot 11 is avoided, the connection reliability between the memory bank and the slot is ensured, and the phenomenon of server failure caused by data interruption is avoided.
In some embodiments, as shown in fig. 4 and 7, the upper end of the protective housing 3 is provided with the stop flange 31, the mounting groove 61 is defined in the protective housing cover 6, and in step S3, the protective housing cover 6 is snapped onto the protective housing 3, and the stop flange 31 is stopped on the top wall of the mounting groove 61. It can be understood that, install protecting sheathing 3 in mounting groove 61, and will end chimb 31 and end on the roof of mounting groove 61, the stability of being connected of protecting sheathing 3 and protecting shell cover has been ensured on the one hand, thereby avoided driving in-process protecting sheathing 3 and protecting shell cover to take place to rock and lead to the phenomenon of memory bank 2 and memory slot 11 contact failure to take place, on the other hand has promoted the leakproofness in the space of injecing between protecting sheathing 3 and the protecting shell cover, thereby further avoid memory bank 2 the phenomenon of dust deposit to appear.
In some specific embodiments, as shown in fig. 9, after step S3, the method further includes: s4: the top wall of the mounting groove 61 and the stop flange 31 are locked by the connecting member 8. This further improves the connection stability and connection sealing between the protective housing 3 and the protective housing cover 6. It should be additionally noted that in the embodiment of the present invention, the connecting member 8 may be a connecting screw or a connecting pin, which may be selected according to actual requirements. In addition, in order to ensure the connection stability of the protective casing 3 and the protective casing cover 6, the protective casing 3 and the protective casing cover 6 can be connected by adopting a snap structure, and the connection mode is not limited to the connection mode of the connecting piece 8.
In some more specific embodiments, after step S4, the method further includes: s5: and sealing the connecting gap between the protective shell 3 and the protective shell cover 6 by adopting sealant. It can be understood that, adopt connecting piece 8 with protecting sheathing 3 and the locking back of protecting sheathing lid, the connecting gap of protecting sheathing 3 and protecting sheathing still can get into the dust, still the dust sedimentary phenomenon is likely to appear in memory bank 2 after long-time the use to protecting sheathing 3 and protecting sheathing have probably to take place to rock at driving a vehicle in-process, and the protecting sheathing 3 and the visor that rock will drive the vibration of memory bank 2, thereby lead to memory bank 2 and the phenomenon of 11 contact failure of memory slot. In this embodiment, it has sealed gluey to fill in the joint gap of protecting sheathing 3 and protecting cap 6, has blockked the dust on the one hand and has got into the joint gap of protecting sheathing 3 and protecting cap, has avoided memory bank 2 the phenomenon that dust deposit appears furthest, and sealed gluey can absorb the rocking that protective sheathing 3 and protecting cap have probably to take place in the driving process of a vehicle on the other hand, has ensured memory bank 2 and the phenomenon of memory slot 11 contact failure.
Optionally, the sealant is a silicone structural adhesive. Of course, in other embodiments of the present invention, the sealant can be selected according to actual needs and is limited to the silicone structural adhesive.
In some more specific embodiments, after step S4 or S5, further comprising: s6: and reinforcing the joints of the protective shell 3 and the protective shell cover 6 with the main board 1 by adopting hot melt adhesive. It can be understood that although the joint gaps between the protective casing 3 and the protective casing cover 6 are filled with the sealant to absorb a part of the vibration, the joint between the protective casing 3 and the main board 1 may vibrate during driving, which may cause the memory bank 2 to vibrate. In this embodiment, the hot melt adhesive is used to reinforce the connection between the protection housing 3 and the protection housing cover 6 and the motherboard 1, so that the connection stability between the protection housing 3 and the protection housing cover 6 and the motherboard 1 is ensured, and the connection between the protection housing and the protection housing cover 6 and the motherboard 1 is prevented from vibrating during the driving process, thereby further preventing the memory bank 2 from vibrating and ensuring the connection reliability between the memory bank 2 and the memory slot 11.
In some embodiments, as shown in fig. 4 to 5, step S2 further includes: the first adhesive member 101 is attached to the protective casing 3, and the lower end of the protective casing 3 is attached to the outer side wall of the memory slot 11 by the first adhesive member 101. Therefore, the connection stability of the protective shell 3 and the memory slot 11 is ensured, the stability of the memory bank 2 is ensured, and the connection reliability of the memory bank 2 and the memory slot 11 is improved.
Optionally, the first adhesive member 101 is a double-sided tape, and of course, in other embodiments of the present invention, the first adhesive member 101 may be selected according to actual needs, and is not limited to the double-sided tape of this embodiment.
In some embodiments, as shown in fig. 7 to 8, step S3 further includes: the second adhesive member 102 is attached to the protection case cover 6, and the lower end of the protection case cover 6 is attached to the outer side wall of the memory slot 11 by using the second adhesive member 102. Therefore, the connection stability of the protective shell cover and the memory slot 11 is ensured, the stability of the memory bank 2 is ensured, and the connection reliability of the memory bank 2 and the memory slot 11 is improved.
Optionally, the second adhesive member 102 is a double-sided tape, and of course, in other embodiments of the present invention, the second adhesive member 102 may be selected according to actual needs, and is not limited to the double-sided tape of this embodiment.
In some embodiments, the protective enclosure 3 and the protective enclosure cover 6 are both hard aluminum alloy pieces. It can be understood that the protective housing 3 and the protective housing cover 6 are made of hard aluminum alloy, so that the strength of the protective housing 3 and the protective housing cover 6 can be improved, the quality of the protective housing 3 and the protective housing cover 6 can be reduced, and the quality of the whole vehicle-mounted server is reduced. Of course, in other embodiments of the present invention, the materials of the protective housing 3 and the protective housing cover 6 may be selected according to actual needs, and are not limited to the hard aluminum alloy of the embodiment.
In some embodiments, the first and second heat-conducting members 5 and 7 are both heat-conducting silicone sheets. Therefore, the heat conduction effect of the first heat conduction member 5 and the second heat conduction member 7 can be well ensured, and the phenomenon that the memory bank 2 is overheated is avoided. Of course, in other embodiments of the present invention, the materials of the first heat conduction member 5 and the second heat conduction member 7 can be selected according to actual needs, and are not limited to the heat conduction silicone grease of the embodiment.
In some embodiments, as shown in FIG. 10, multiple memory banks may be installed.
The following describes a memory bank mounting method according to a specific example of the present invention. The method for installing the memory bank comprises the following steps:
s1: installing the memory bank 2 in the memory slot 11 of the mainboard 1; specifically, the buckle of the memory slot 11 is opened firstly, then the memory bank 2 is inserted into the memory slot 11 of the mainboard 1, and finally the memory bank is pressed by force until the buckle is tightly clamped;
s2: attaching the shock absorbing member 4 to the stop flange 31 of the protective casing 3, attaching the first heat conducting member 5 and the first adhesive member 101 to the inner surface of the protective casing 3, and attaching the first adhesive member 101 on the protective casing 3 to the outer side wall of the memory slot 11, so that the first heat conducting member 5 abuts against the heat dissipation surface of the memory bank 2 and the shock absorbing member 4 stops against the top surface of the memory bank 2; specifically, when the first adhesive member 101 is attached, it is required to ensure that two ends of the protective casing 3 are flush with two opposite side walls of the memory slot 11, and the first heat-conducting member 5 compresses the memory bank 2;
s3: attaching the second heat conducting member 7 and the second adhesive member 102 to the protection housing cover 6, attaching the second adhesive member 102 of the protection housing cover 6 to the other outer sidewall of the memory slot 11, and supporting the top wall of the mounting groove 61 on the upper surface of the protection housing 3 (i.e., the upper surface of the stop flange 31), so that the second heat conducting member 7 abuts against the other heat dissipating surface of the memory bank 2; specifically, when the protection shell cover 6 is installed, two side walls, oppositely arranged by the installation groove 61, are flush with two ends of the protection shell 3, and after the two ends of the protection shell 3 are completely wrapped in the protection shell, the protection shell cover 6 is pressed tightly to enable the second heat-conducting piece 7 to be tightly attached to the memory bank 2;
s4: the top wall of the mounting groove 61 and the stop convex edge 31 are locked by connecting screws;
s5: sealing the connecting gap between the protective shell 3 and the protective shell cover 6 by adopting silicone structural adhesive;
s6: reinforcing the connection parts of the protective shell 3 and the protective shell cover 6 and the main board 1 by adopting hot melt adhesive;
s7: in the case where there are a plurality of memory banks, the steps S1-S6 are repeated until all the memory banks 2 are mounted.
The embodiment of the invention also discloses a vehicle-mounted server which comprises a mainboard 1 and the memory bank 2, wherein the memory bank 2 is installed on the mainboard by adopting the installation method.
The embodiment of the invention also discloses a computing device which can be a server, such as an on-board server. The computing device comprises a mainboard and a memory bank, wherein the memory bank is installed on the mainboard by adopting the method. The computing device includes: a main board 1 having a memory slot 11; the memory bank 2 is arranged in a memory slot 11 of the mainboard 1; a first heat-conducting member 5 and a second heat-conducting member 7; a protective shell 3, wherein a first heat conducting piece 5 and a damping piece 4 are arranged between the memory bank 2 and the protective shell 3; and a protective case cover 6, wherein the memory bank 2 is positioned in a space defined by the protective case 3 and the protective case cover 6, and a second heat conducting piece 7 is arranged between the memory bank 2 and the protective case cover 6.
According to the embodiment of the invention, the memory bank 2 is arranged in the space defined by the protective shell 3 and the protective shell cover 6, and the shock absorption piece 4 for absorbing vibration is arranged between the memory bank 2 and the protective shell 3, so that the sealing of the memory bank 2 is better realized, the vibration of the memory bank 2 can be avoided, the phenomenon of dust deposition in the memory slot 11 is avoided, the connection reliability between the memory bank and the slot is ensured, and the phenomenon of server failure caused by data interruption is avoided.
In the description herein, references to the description of "some embodiments," "other embodiments," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The above description is only a preferred embodiment of the present invention, and for those skilled in the art, the present invention should not be limited by the description of the present invention, which should be interpreted as a limitation.

Claims (19)

1. A memory bank installation method comprises the following steps:
installing a memory bank in a memory slot of a mainboard;
attaching a shock absorbing member and a first heat-conducting member to a protective case, and mounting the protective case to the main board so that the first heat-conducting member and the shock absorbing member abut against the memory bank; and
attaching a second heat-conducting piece to a protective shell cover, and mounting the protective shell cover on the mainboard and buckling the protective shell cover on the main board so that the second heat-conducting piece abuts against the memory bank.
2. The method of claim 1, wherein the first and second light sources are selected from the group consisting of,
the upper end of the protective shell is provided with a stop convex edge, and a mounting groove is defined in the protective shell cover;
wherein, install the protection cap on the mainboard and the lock includes on the protection housing:
and stopping the stopping convex edge on the top wall of the mounting groove.
3. The method of claim 2, further comprising:
and adopting a connecting piece to lock the top wall of the mounting groove and the stop convex edge.
4. The method of claim 3, further comprising:
and sealing the connection gap between the protective shell and the protective shell cover by adopting a sealant.
5. The method of claim 3, further comprising:
and reinforcing the protective shell and the joint of the protective shell cover and the mainboard by using a hot melt adhesive.
6. The method of claim 1, further comprising:
and attaching a first adhesive piece to the protective shell so as to adhere the lower end of the protective shell to the outer side wall of the memory slot through the first adhesive piece.
7. The method of claim 1, further comprising: and attaching a second adhesive piece to the protective shell cover so as to adhere the lower end of the protective shell cover to the outer side wall of the memory slot through the second adhesive piece.
8. The method of any of claims 1-7, wherein the protective enclosure and the protective enclosure cover are both hard aluminum alloy pieces.
9. The method of any of claims 1-7, wherein the first thermally conductive member and the second thermally conductive member are both thermally conductive silicone sheets.
10. An in-vehicle server comprising a motherboard and a memory bank, wherein the memory bank is mounted on the motherboard using the method of any of claims 1-9.
11. A computing device, comprising:
a main board having a memory slot;
the memory bank is arranged in the memory slot of the mainboard;
a first heat-conducting member and a second heat-conducting member;
the memory bank is arranged in the memory bank, and the first heat conducting piece and the shock absorbing piece are arranged between the memory bank and the protective shell;
and the memory bank is positioned in a space defined by the protective shell and the protective shell cover, and the second heat-conducting piece is arranged between the memory bank and the protective shell cover.
12. The computing device of claim 11, wherein the computing device,
the upper end of the protective shell is provided with a stop convex edge, and a mounting groove is defined in the protective shell cover;
wherein, the stop convex edge is stopped on the top wall of the mounting groove.
13. The computing device of claim 12, further comprising a connector to lock the top wall of the mounting slot and the stop ledge.
14. The computing device of claim 13, wherein the protective enclosure and the connection gap of the protective enclosure cover are sealed by a sealant.
15. The computing device of claim 13, wherein the protective enclosure and a connection of the protective enclosure cover to the motherboard are reinforced with hot melt adhesive.
16. The computing device of claim 11, wherein a lower end of the protective housing is bonded to an outer sidewall of the memory slot with a first adhesive.
17. The computing device of claim 11, wherein a lower end of the protective case cover is bonded to an outer sidewall of the memory slot by a second adhesive.
18. The computing device of any of claims 11-17, wherein the protective enclosure and the protective case cover are each hard aluminum alloy pieces.
19. The computing device of any of claims 11-17, wherein the first and second thermally conductive members are each a thermally conductive silicone sheet.
CN202110062366.1A 2021-01-18 2021-01-18 Memory bank installation method and related vehicle-mounted server and computing equipment Pending CN114822604A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110062366.1A CN114822604A (en) 2021-01-18 2021-01-18 Memory bank installation method and related vehicle-mounted server and computing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110062366.1A CN114822604A (en) 2021-01-18 2021-01-18 Memory bank installation method and related vehicle-mounted server and computing equipment

Publications (1)

Publication Number Publication Date
CN114822604A true CN114822604A (en) 2022-07-29

Family

ID=82523862

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202110062366.1A Pending CN114822604A (en) 2021-01-18 2021-01-18 Memory bank installation method and related vehicle-mounted server and computing equipment

Country Status (1)

Country Link
CN (1) CN114822604A (en)

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