CN114822252A - Display module, manufacturing method thereof and display device - Google Patents

Display module, manufacturing method thereof and display device Download PDF

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Publication number
CN114822252A
CN114822252A CN202210424712.0A CN202210424712A CN114822252A CN 114822252 A CN114822252 A CN 114822252A CN 202210424712 A CN202210424712 A CN 202210424712A CN 114822252 A CN114822252 A CN 114822252A
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CN
China
Prior art keywords
layer
section
heat dissipation
substrate
display
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Pending
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CN202210424712.0A
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Chinese (zh)
Inventor
罗淼
刘�文
伏安
詹峰
卿太峰
程金旭
吴锐奇
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BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
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Application filed by BOE Technology Group Co Ltd, Chengdu BOE Optoelectronics Technology Co Ltd filed Critical BOE Technology Group Co Ltd
Priority to CN202210424712.0A priority Critical patent/CN114822252A/en
Publication of CN114822252A publication Critical patent/CN114822252A/en
Pending legal-status Critical Current

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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body

Abstract

The present disclosure provides a display module, a manufacturing method thereof and a display device, wherein the display module comprises: the display device comprises a substrate and a display module, wherein the substrate comprises an overlapping section and a display section which are oppositely arranged, and a bending section which is used for bending and connecting the overlapping section and the display section; the first supporting layer is arranged on one side of the display section close to the overlapping section; the second supporting layer is arranged on one side, close to the display section, of the overlapping section; the bonding layer is arranged between the first supporting layer and the second supporting layer and is used for bonding the first supporting layer and the second supporting layer so as to keep the bending state of the bending section; a chip setting part connected to the overlapping section for setting a chip for driving the substrate; the heat dissipation layer is arranged on one side, away from the substrate, of the first support layer, and a preset distance exists between one end of the heat dissipation layer and the bending section, so that the overlapping section and the chip arrangement portion are located in a space formed by the preset distance.

Description

Display module, manufacturing method thereof and display device
Technical Field
The disclosure relates to the technical field of display, and in particular relates to a display module, a manufacturing method of the display module and a display device.
Background
With the popularization of the OLED (Organic Light-Emitting Diode) technology, the main technical trend of the current mobile phone design is to thin and narrow the frame, so as to reduce the display module as much as possible and increase the internal space of the mobile phone as a whole.
Generally, bending an FPC (Flexible Printed Circuit) in the display module to the back of the screen body by using a bending process is a main means for realizing a narrow frame, but the FPC inevitably occupies a space of a battery in a mobile phone, and the display module causes a green screen phenomenon of the display module due to conductivity of a polarization film material when a copper bar test is performed.
Disclosure of Invention
In view of the above, the present disclosure provides a display module, a method for manufacturing the same, and a display device, so as to solve or partially solve the above technical problems.
Based on the above-mentioned purpose, the first aspect of this disclosure provides a display module assembly, includes:
the display device comprises a substrate and a display module, wherein the substrate comprises an overlapping section and a display section which are oppositely arranged, and a bending section which is used for bending and connecting the overlapping section and the display section;
the first supporting layer is arranged on one side of the display section close to the overlapping section;
the second supporting layer is arranged on one side, close to the display section, of the overlapping section;
the bonding layer is arranged between the first supporting layer and the second supporting layer and is used for bonding the first supporting layer and the second supporting layer so as to keep the bending state of the bending section;
a chip setting part connected to the overlapping section for setting a chip for driving the substrate;
the heat dissipation layer is arranged on one side, away from the substrate, of the first support layer, and a preset distance exists between one end of the heat dissipation layer and the bending section, so that the overlapping section and the chip arrangement portion are located in a space formed by the preset distance.
In a second aspect of the present disclosure, a method for manufacturing a display module is provided, the method including:
providing a substrate, wherein the substrate comprises an overlapping section, a display section and a bending section for bending and connecting the overlapping section and the display section;
forming a first supporting layer on the non-light-emitting side of the display segment;
forming a second supporting layer on the non-light-emitting side of the overlapping section;
forming a chip setting part on the overlapping section;
forming a heat dissipation layer on one side of the first support layer, which is far away from the substrate, wherein a preset distance is reserved between one end of the heat dissipation layer and the bending section, so that the overlapping section and the chip arrangement part are positioned in a space formed by the preset distance;
and forming an adhesive layer between the first supporting layer and the second supporting layer so as to keep the bending state of the bending section.
In a third aspect of the disclosure, a display device is provided, which includes the display module set as described in any one of the above.
As can be seen from the above, according to the display module, the manufacturing method thereof and the display device provided by the disclosure, the thickness of the chip setting part of the display module formed on the display section in a direction perpendicular to the display section is reduced by using the predetermined distance between the heat dissipation layer and the bending section in the display module, and the reserved space at the end of the subsequent finishing machine is increased. The existence of predetermined distance has also made overlap section in the display module assembly and has not had original heat dissipation layer between the display segment, has reduced the radius of bending segment, and then has realized that display module assembly's frame narrows. And through the existence of predetermined distance, the electric charge on the display section can be led away through the conduction path formed by the chip setting part and the heat dissipation layer, and the problem of green display caused by the electric charge in the display module is avoided.
Drawings
In order to clearly illustrate the technical solutions of the present disclosure or related technologies, the drawings used in the embodiments or related technologies description will be briefly introduced below, and obviously, the drawings in the following description are only embodiments of the present disclosure, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a schematic structural diagram of an original display module in the related art;
fig. 2a shows a schematic structural diagram of a display module according to an embodiment of the disclosure;
FIG. 2b shows a schematic view of a bend segment radius of an embodiment of the present disclosure;
fig. 3a is a schematic structural diagram of a substrate in a method for manufacturing a display module according to an embodiment of the disclosure;
fig. 3b is a schematic structural diagram illustrating the formation of the first supporting layer in the method for manufacturing a display module according to the embodiment of the disclosure;
fig. 3c is a schematic structural diagram illustrating the formation of a second supporting layer in the method for manufacturing a display module according to the embodiment of the disclosure;
fig. 3d is a schematic structural diagram of forming a chip setting part in the display module manufacturing method according to the embodiment of the disclosure;
FIG. 3e is a schematic cross-sectional view illustrating a structure of forming a heat dissipation layer in a method for manufacturing a display module according to an embodiment of the disclosure;
FIG. 3f is a cross-sectional view of a schematic structural diagram illustrating the formation of a heat dissipation layer in a method for manufacturing a display module according to an embodiment of the disclosure;
fig. 3g shows a schematic structural diagram of forming a bonding layer in the method for manufacturing a display module according to the embodiment of the disclosure;
fig. 3h shows a schematic structural diagram of foam rolling in the display module manufacturing method according to the embodiment of the disclosure.
Description of reference numerals: 100. an original display module;
110. original heat dissipation layer, 120, original adhesive layer;
200. a display module;
210. the chip comprises a heat dissipation layer, a first supporting layer, a second supporting layer, a substrate 230, a second supporting layer, a;
300. the display module before bending;
310. foam, 320, a first protective film, 330 and a second protective film.
Detailed Description
For the purpose of promoting a better understanding of the objects, aspects and advantages of the present disclosure, reference is made to the following detailed description taken in conjunction with the accompanying drawings.
It is to be noted that technical terms or scientific terms used in the embodiments of the present disclosure should have a general meaning as understood by those having ordinary skill in the art to which the present disclosure belongs, unless otherwise defined. The use of "first," "second," and similar terms in the embodiments of the disclosure is not intended to indicate any order, quantity, or importance, but rather to distinguish one element from another. The word "comprising" or "comprises", and the like, means that the element or item listed before the word covers the element or item listed after the word and its equivalents, but does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships may also be changed accordingly.
The embodiment of the present application provides a display module, which may be applied to display devices such as televisions, mobile phones, computers, notebook computers, tablet computers (pads), Personal Digital Assistants (PDAs), and vehicle-mounted computers, and the display device having the display module is not limited in the present application.
The display module may include an OLED display panel, a Quantum Dot Light Emitting diode (QLED) display panel, and the like. The OLED display panel has advantages of small size, portability, capability of being bent and folded, narrow frame, and the like, and is increasingly applied to the high-performance display field.
The following embodiments of the present application are all explained by taking an example that the display module includes an OLED display panel.
In the related art, as shown in fig. 1, in the original display module 100 having the bending process characteristic, the substrate 230 in the original display module 100 can be divided into an overlapping section a, a bending section b and a display section c. The display section c is provided with a first supporting layer 220a and a heat dissipation layer 210 on one side close to the overlapping section a, and the overlapping section a is bent towards the first supporting layer 220a and then connected with the heat dissipation layer 210 through an adhesive layer 260.
In addition, a polarizing layer 240a, an adhesive film layer 240b and a cover plate layer 250 are further disposed on a side of the display segment c away from the overlapping segment c. The display section c is bonded to the polarizing layer, the polarizing layer 240a is bonded to the cover plate layer 250 through the adhesive film layer 240b, and the display content of the display section c can be viewed through the cover plate layer 250.
Problems with this are: the heat dissipation layer 210 causes the thickness e formed by bending the substrate 230 in the overlapping section a to increase, and causes the radius r of the bent section b to increase, thereby causing the bent section b to occupy more space in the horizontal direction of the heat dissipation layer 210 under the condition that the substrate 230 is bent at the same angle of 180 degrees. Moreover, the static electricity formed on the cover plate layer 250 is conducted to the substrate 230 and the first supporting layer 220a through the optical adhesive overflowing from the adhesive film layer 240b attached to the panel 500, and the first supporting layer 220a has polarization characteristics, so that the static electricity on the supporting layer 200a can act together with Vss traces and the like on the periphery of the substrate 230 to form a strong fringe electric field, which causes Vth to be biased, thereby causing a display greening phenomenon and affecting the subjective experience of a user on the display effect of the mobile phone.
Based on the above problem, an embodiment of the present disclosure provides a display module, as shown in fig. 2a, the display module 200 includes:
a substrate 230 including an overlapping section a and a display section c disposed opposite to each other, and a bending section b bending and connecting the overlapping section and the display section;
the first supporting layer 220a is arranged on one side of the display segment c close to the overlapping segment a;
a second support layer 220b disposed at a side of the overlapping section a adjacent to the display section c;
an adhesive layer 260 disposed between the first support layer 220a and the second support layer 220b for adhering the first support layer 220a and the second support layer 220b to maintain the bent state of the bent section b;
a chip setting part 280 connected to the overlapping section a, for setting a chip for driving the substrate 230;
and a heat dissipation layer 210 disposed on a side of the first support layer 220a away from the substrate 230, wherein a predetermined distance exists between one end of the heat dissipation layer 210 and the bent section b, so that the overlapping section a and the chip disposing part 280 are located in a space formed by the predetermined distance.
In specific implementation, the substrate 230 may be made of flexible materials such as OLED, and the chip setting portion 280 is connected to the bent overlapping section a of the substrate 230, so that the space occupied by the chip setting portion 280 in the horizontal direction of the substrate 230 can be reduced, and the frame of the display module 200 is narrowed. In order to maintain the reliability of the display screen of the display segment c without the substrate 230 being deformed in the bent state, the first support layer 220a may be disposed on the non-light-emitting side of the display segment c, and the second support layer 220b may be disposed on the non-light-emitting side of the overlapping segment a. In order to maintain the bent state of the bent section b, an adhesive layer 260 is disposed between the first and second support layers 220a and 220 b. In order to satisfy the heat dissipation requirement of the substrate 230, the heat dissipation layer 210 is disposed on the side of the first support layer 220a away from the display segment c, and the heat dissipation layer 210 may be a Super Clean Foam (SCF) protective film.
The predetermined distance d is between the heat dissipation layer 210 and the bending section b, and the chip placement portion 280 and the overlapping section a are located in the space formed by the predetermined distance d. That is, the projection of the overlapping segment a formed by bending the substrate 230 onto the display segment c does not overlap with the projection of the heat dissipation layer 210 onto the display segment c, and the projection of the chip placement portion 280 onto the display segment c does not overlap with the projection of the heat dissipation layer 210 onto the display segment c.
Specifically, as shown in fig. 2b, the thickness of the bending section b of the original display module 100 in the direction perpendicular to the display section a is e 1 The thickness of the bending section b of the display module 200 in the direction perpendicular to the display section a is e 2 . Since the bending section b of the original display module 100 is formed by bending the substrate 230 by 180 degrees, the radius r of the bending section b of the original display module 100 1 Is a thickness e 1 Half of that. Similarly, the radius r of the bending section b of the display module 200 2 Is a thickness e 2 Half of that. That is, the thickness of the bending section b can be reduced while the space occupied by the bending section b in the direction parallel to the display section a can be reduced.
In this way, the predetermined distance d may avoid adding the heat dissipation layer 210 between the overlapping section a and the display section c, and may avoid adding the heat dissipation layer 210 between the chip setting portion 280 and the display section c. It is possible to reduce the radius of the substrate 230 formed by bending and to reduce the thickness of the chip set portion 280 formed in the direction perpendicular to the display section c.
It is understood that the heat dissipation layer 210 is bonded to the first support layer 220a, the first support layer 220a is bonded to the display segment c, the second support layer 220b is bonded to the overlapping segment a, and the bonding layers are bonded to the first support layer 220a and the second support layer 220b, respectively, and the specific bonding manner is not particularly limited herein.
Through the scheme, the thickness of the chip setting part of the display module formed on the vertical display section is reduced by utilizing the preset distance between the heat dissipation layer and the bending section in the display module, and the reserved space of the subsequent whole machine end is increased. The existence of predetermined distance has also made overlap section in the display module assembly and has not had original heat dissipation layer between the display segment, has reduced the radius of bending segment, and then has realized that display module assembly's frame narrows. And through the existence of predetermined distance, the electric charge on the display section can be led away through the conduction path formed by the chip setting part and the heat dissipation layer, and the problem of green display caused by the electric charge in the display module is avoided.
In some embodiments, the display module further includes a patch, and the chip setting portion is connected to the overlapping section and the heat dissipation layer through the patch.
In specific implementation, when the chip setting portion 280 is pressed with the overlapping segment a by a bonding manner, a part of the chip setting portion 280, a part of the overlapping segment a, and a part of the heat dissipation layer 210 are covered by the patch 290, wherein a side of the patch 290 close to the chip setting portion 280 is provided with glue. In this way, the patch 290 can bond the chip placement portion 280, the overlapping segment a and the heat dissipation layer 210, so as to connect the chip placement portion 280, the overlapping segment a and the heat dissipation layer 210, and provide a connection basis for a subsequent charge conduction path.
In some embodiments, the heat dissipation layer includes a conductive copper foil connected to the chip placement portion through a conductive cloth on the patch.
In practical implementation, the conductive copper foil of the heat dissipation layer 210 can be used as a ground portion of the display module 200, i.e., a zero potential point of the display module. Moreover, the area of the conductive copper foil of the heat dissipation layer 210 can ensure that the conductive copper foil always maintains a zero potential with respect to the charges generated by the display module through friction.
A conductive cloth may be disposed on a side of the patch 290 close to the chip-disposing part 280 such that the copper-clad portion of the chip-disposing part 280, the overlapping section a, and the conductive copper foil of the heat dissipation layer 210 are electrically connected. Thus, the conductive copper foil provides a zero potential point for a conduction path of subsequent charges, and the zero potential point can be always maintained at zero potential.
In some embodiments, the display module further includes a conductive adhesive portion disposed between the first supporting layer and the chip disposing portion and located in a space formed by the heat dissipation layer and the adhesive layer, and a thickness of the chip disposing portion and the conductive adhesive portion perpendicular to the substrate is the same as a thickness of the heat dissipation layer.
In specific implementation, the conductive adhesive portion 270 is adhered to the first supporting layer 220a and the chip mounting portion 280. In this way, the first support layer 220a is connected to the chip mounting portion 280 by the double-sided adhesive conductive bonding portion 270. After the conductive adhesive portion 270 is completely adhered to the chip mounting portion 280 and the first support layer 220a, the thickness of the chip mounting portion 280 and the conductive adhesive portion 270 in the direction perpendicular to the substrate 230 is the same as the thickness of the heat dissipation layer 210. Thus, on the basis of reducing the thickness of the chip setting part 280 of the display module formed on the substrate 230 in a direction perpendicular to the substrate 230, the height of the chip setting part 280 is ensured to be the same as that of the heat dissipation layer 210 on the substrate 230, the situation that one of the chip setting part 280 and the heat dissipation layer 210 bears stress due to the height difference is avoided, and the stamping effect on the chip setting part 280 is reduced.
In some embodiments, the material of the conductive adhesive comprises conductive foam.
In specific implementation, the conductive bonding portion 270 may be formed of conductive foam with adhesive on both sides, so as to provide a conductive path for subsequently guiding away charges, and the flexibility of the conductive foam may also reduce the stamping effect of the chip disposing portion 280.
In some embodiments, the conductive adhesive portion electrically connects the first supporting layer and the chip disposing portion through the conductive foam.
In specific implementation, the conductive adhesive portion 270 may adhere the first supporting layer 220a and the chip mounting portion 280, so as to electrically connect the first supporting layer 220a and the chip mounting portion 280. Thus, the charge conducted to the first support layer 220a and the display segment c can flow to zero potential through the following conductive paths: the conductive bonding portion 270 → the chip disposing portion 280 → the conductive cloth of the patch 290 → the conductive copper foil of the heat dissipation layer 210, so that the charge conducted to the first supporting layer 220a by the optical adhesive overflowing from the adhesive film layer 240b of the cover plate layer 250 disappears, and the greening phenomenon caused by the electrification of the first supporting layer 220a is avoided.
In some embodiments, the display module further comprises a polarizing layer, a film layer and a cover plate layer, the polarizing layer is arranged on one side of the substrate, which is far away from the first supporting layer, and the polarizing layer at least covers the display section;
the adhesive film layer is arranged on one side, away from the substrate, of the polarizing layer, and the covering surface of the adhesive film layer is the same as that of the polarizing layer;
the apron layer set up in the glued membrane layer deviates from one side on polarisation layer, the apron layer covers at least the glued membrane layer.
In a specific implementation, the substrate 230, the polarizing layer 240a (Polarizer, POL for short), the Adhesive film layer 240b (Thermal-metal optical Adhesive, TOCA for short), and the cover plate layer 250 are sequentially bonded along the light emitting direction, and the polarizing layer 240a can transmit light having the same vibration direction as the transmission axis of the polarizing layer 240a among light emitted from the display section c of the substrate 230, and absorb light having the vibration direction perpendicular to the transmission axis of the polarizing layer 240a among the light. The cover plate layer 250 can protect the display module, and the light emitted from each sub-pixel in the display layer c can be emitted through the cover plate layer 250. In this way, the supporting capability of the substrate 230 is further increased by the arrangement of the polarizing layer 240a, the adhesive film layer 240b and the cover plate layer 250, and the protection of the substrate 230 on the light-emitting side is realized.
Based on the same inventive concept, the present embodiment provides a method for manufacturing a display module, the method including:
step 301, providing a substrate, where the substrate includes an overlapping section, a display section, and a bending section that bends and connects the overlapping section and the display section.
As shown in fig. 3a, the substrate 230 includes an overlapping section a, a display section c, and a bending section b. Wherein, the direction shown by the arrow is the light-emitting side of the substrate.
Step 302, forming a first supporting layer on a non-light-emitting side of the display segment.
As shown in fig. 3b, the first supporting layer 220a may be formed on the non-light-emitting side of the display segment c by means of bonding, and the formed first supporting layer 220a may cover the display segment c. Specifically, a glue is applied to one side of the first supporting layer 220a, and the side to which the glue is applied is brought into contact with the non-light-emitting side of the display section c to form the first supporting layer 220a on the display section c.
Step 303, forming a second supporting layer on the non-light-emitting side of the overlapping section.
As shown in fig. 3c, the second support layer 220b may be formed on the non-light-emitting side of the display segment c by means of bonding, and the second support layer 220b may be formed to cover the repeating segment a. Specifically, a glue is applied to one side of the first support layer 220a, and the side to which the glue is applied is brought into contact with the non-light-emitting side of the display segment c to form the second support layer 220b on the display segment.
Step 304, forming a chip setting part on the overlapped segment.
As shown in fig. 3d, the chip setting part 280 may be connected with the overlap section a by means of bonding. The binding refers to the precise positioning and hot pressing technique used to crimp and conduct the chip setting portion 280 and the overlapping segment a. Thus, the substrate 230 can be driven by the chip setting part 280 to complete the display.
And 305, forming a heat dissipation layer on one side of the first support layer, which is far away from the substrate, wherein a preset distance exists between one end of the heat dissipation layer and the bending section, so that the overlapping section and the chip arrangement part are located in a space formed by the preset distance.
As shown in fig. 3e, the heat dissipation layer 210 may be formed on a side of the first support layer 220a facing away from the substrate 230 by bonding, and a predetermined distance d exists between one end of the formed heat dissipation layer 210 and the bent section b. In this way, the heat dissipation layer 210 is formed such that the subsequent overlapping section a and the chip placement portion 280 are located in a space formed at a predetermined distance during the process of bending the substrate 230.
The space formed by the predetermined distance before bending the substrate 230 is shown in fig. 3 f.
Step 306, forming an adhesive layer between the first support layer and the second support layer to maintain the bending state of the bending section.
As shown in fig. 3g, the first and second support layers 220a and 220b may be bonded by a double-sided adhesive bonding layer 260, and the chip set part 280 may be bonded to the first support layer 220a by a double-sided adhesive conductive bonding part 270. Specifically, the conductive adhesive portion 270 may be formed in step 305 or may be formed in step 304. Thus, the bent state of the bent segments in the substrate 230 is secured by the bonding effect of the adhesive layer 260.
Through the scheme, the thickness of the chip setting part of the display module formed on the vertical display section is reduced by utilizing the preset distance between the heat dissipation layer and the bending section in the display module, and the reserved space of the subsequent whole machine end is increased. The existence of predetermined distance has also made overlap section in the display module assembly and has not had original heat dissipation layer between the display segment, has reduced the radius of bending segment, and then has realized that display module assembly's frame narrows. And through the existence of predetermined distance, the electric charge on the display section can be led away through the conduction path formed by the chip setting part and the heat dissipation layer, and the problem of green display caused by the electric charge in the display module is avoided.
In some embodiments, step 305 specifically includes:
step 3051, the first supporting layer deviates from one side of the substrate forms a foam and a heat dissipation layer, wherein one end of the foam is aligned with one end of the display section, the other end of the foam is connected with one end of the heat dissipation layer, and the foam is perpendicular to the thickness of the substrate in the direction and the heat dissipation layer are the same.
Step 3052, gluing the side, far away from the substrate, of the foam, and covering a protective film on the heat dissipation layer and the side, far away from the substrate, of the foam.
Step 3053, rolling the protective film by using a roller, and attaching the heat dissipation layer to one side of the first support layer, which is far away from the substrate, to form the heat dissipation layer;
step 3054, removing the protective film of the foam and the foam, wherein the preset distance is formed between one end of the heat dissipation layer and the bending section.
In the above solution, as shown in fig. 3h, the foam 310 may be a foam body with glue on one side, and the heat dissipation layer 210 may be a radiator with glue on one side and having a heat dissipation function. The foam 310 and the heat dissipation layer 210 are formed on one side of the first support layer 220a away from the substrate 230, one side of the heat dissipation layer 210 in contact with the first support layer 220a is a surface with glue, one side of the foam 310 in contact with the first support layer 220a is a surface without glue, and the height of the foam 310 in the direction perpendicular to the substrate is consistent with that of the heat dissipation layer 210. Thus, when the protective film is rolled by a roller subsequently, the situation that one of the foam 310 and the heat dissipation layer 210 bears stress due to the height difference between the foam 310 and the heat dissipation layer 210 is avoided, and the stamping effect of the first support layer 220a on the foam 310 part is reduced.
The heat dissipation layer 210 and the foam 310 are covered with a protective film on the side with the adhesive. Specifically, the coverage scheme of the protective film may be two: (1) the protective film may include a first protective film 320 covering the heat dissipation layer 210 and a second protective film 330 covering the foam 310; (2) the protective film may entirely cover the heat dissipation layer 210 and the foam 310, and the protective film may have a cut edge at a boundary between the heat dissipation layer 210 and the foam 310 for easy division (the cut edge is not shown in the figure, and the boundary between the first protective film 320 and the second protective film 330 may be used as the cut edge). Thus, the protective film on the heat dissipation layer 210 is not pulled when the foam 310 is subsequently removed.
The protective film is rolled by the roller, because the side of the heat dissipation layer 210, which is in contact with the first support layer 220a, is the side with glue, and the side of the foam 310, which is in contact with the first support layer 220a, is the side without glue, the heat dissipation layer 210 with glue on the single surface is bonded with the first support layer 220a by the pressure applied on the protective film by the roller, and the bonding between the foam 310 with glue on the single surface and the protective film is firmer by the roller rolling. Thus, the formation of the heat dissipation layer 210 on the first support layer 220a is completed by rolling with the roller, which provides a foundation for the subsequent arrangement of the chip arrangement portion through the predetermined distance between the heat dissipation layer 210 and the bending section.
It should be noted that the method of the embodiments of the present disclosure may be executed by a single device, such as a computer or a server. The method of the embodiment can also be applied to a distributed scene and is completed by the mutual cooperation of a plurality of devices. In such a distributed scenario, one of the devices may only perform one or more steps of the method of the embodiments of the present disclosure, and the devices may interact with each other to complete the method.
Based on the same inventive concept, the present embodiment provides a display device, which includes the display module according to any one of the above embodiments.
Optionally, the display device may further include a touch panel disposed on the display module.
In this embodiment, the display device is a flexible display device.
In this embodiment, the display device includes a narrow-bezel display device or a frameless display device.
In this embodiment, the display device may be applied to any product or component with a display function, such as a mobile phone, a display, a tablet computer, a television, a notebook computer, a digital photo frame, and a navigator.
It should be noted that the above describes some embodiments of the disclosure. Other embodiments are within the scope of the following claims. In some cases, the actions or steps recited in the claims may be performed in a different order than in the embodiments described above and still achieve desirable results. In addition, the processes depicted in the accompanying figures do not necessarily require the particular order shown, or sequential order, to achieve desirable results. In some embodiments, multitasking and parallel processing may also be possible or may be advantageous.
Those of ordinary skill in the art will understand that: the discussion of any embodiment above is meant to be exemplary only, and is not intended to intimate that the scope of the disclosure, including the claims, is limited to these examples; within the idea of the present disclosure, also technical features in the above embodiments or in different embodiments may be combined, steps may be implemented in any order, and there are many other variations of the different aspects of the embodiments of the present disclosure as described above, which are not provided in detail for the sake of brevity.
In addition, well-known power/ground connections to Integrated Circuit (IC) chips and other components may or may not be shown in the provided figures for simplicity of illustration and discussion, and so as not to obscure the embodiments of the disclosure. Furthermore, devices may be shown in block diagram form in order to avoid obscuring embodiments of the present disclosure, and this also takes into account the fact that specifics with respect to implementation of such block diagram devices are highly dependent upon the platform within which the embodiments of the present disclosure are to be implemented (i.e., specifics should be well within purview of one skilled in the art). Where specific details (e.g., circuits) are set forth in order to describe example embodiments of the disclosure, it should be apparent to one skilled in the art that the embodiments of the disclosure can be practiced without, or with variation of, these specific details. Accordingly, the description is to be regarded as illustrative instead of restrictive.
While the present disclosure has been described in conjunction with specific embodiments thereof, many alternatives, modifications, and variations of these embodiments will be apparent to those of ordinary skill in the art in light of the foregoing description. For example, other memory architectures (e.g., dynamic ram (dram)) may use the discussed embodiments.
The disclosed embodiments are intended to embrace all such alternatives, modifications and variances which fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalents, improvements, and the like that may be made without departing from the spirit or scope of the embodiments of the present disclosure are intended to be included within the scope of the disclosure.

Claims (10)

1. A display module, comprising:
the display device comprises a substrate and a display module, wherein the substrate comprises an overlapping section and a display section which are oppositely arranged, and a bending section which is used for bending and connecting the overlapping section and the display section;
the first supporting layer is arranged on one side of the display section close to the overlapping section;
the second supporting layer is arranged on one side, close to the display section, of the overlapping section;
the bonding layer is arranged between the first supporting layer and the second supporting layer and is used for bonding the first supporting layer and the second supporting layer so as to keep the bending state of the bending section;
a chip setting part connected to the overlapping section for setting a chip for driving the substrate;
the heat dissipation layer is arranged on one side, away from the substrate, of the first support layer, and a preset distance exists between one end of the heat dissipation layer and the bending section, so that the overlapping section and the chip arrangement portion are located in a space formed by the preset distance.
2. The display module according to claim 1, wherein the display module further comprises a patch, and the chip setting part is connected with the overlapping section and the heat dissipation layer through the patch.
3. The display module according to claim 2, wherein the heat dissipation layer comprises a conductive copper foil connected to the chip setting part through a conductive cloth on the patch.
4. The display module according to claim 1, wherein the display module further comprises a conductive adhesive portion disposed between the first supporting layer and the chip disposing portion and located in a space formed by the heat dissipation layer and the adhesive layer, and a thickness of the chip disposing portion and the conductive adhesive portion in a direction perpendicular to the substrate is the same as a thickness of the heat dissipation layer.
5. The display module of claim 4, wherein the material of the conductive adhesive comprises conductive foam.
6. The display module according to claim 5, wherein the conductive adhesive portion electrically connects the first supporting layer and the chip disposing portion through the conductive foam.
7. The display module according to claim 1, wherein the display module further comprises a polarizing layer, a film layer and a cover plate layer, the polarizing layer is disposed on a side of the substrate facing away from the first supporting layer, and the polarizing layer covers at least the display section;
the glue film layer is arranged on one side of the polarizing layer, which is far away from the substrate, and the covering surface of the glue film layer is the same as that of the polarizing layer;
the apron layer set up in the glued membrane layer deviates from one side on polarisation layer, the apron layer covers at least the glued membrane layer.
8. A manufacturing method of a display module comprises the following steps:
providing a substrate, wherein the substrate comprises an overlapping section, a display section and a bending section for bending and connecting the overlapping section and the display section;
forming a first supporting layer on the non-light-emitting side of the display segment;
forming a second supporting layer on the non-light-emitting side of the overlapping section;
forming a chip setting part on the overlapping section;
forming a heat dissipation layer on one side of the first support layer, which is far away from the substrate, wherein a preset distance is reserved between one end of the heat dissipation layer and the bending section, so that the overlapping section and the chip arrangement part are positioned in a space formed by the preset distance;
and forming an adhesive layer between the first supporting layer and the second supporting layer so as to keep the bending state of the bending section.
9. The method for manufacturing a display module according to claim 8, wherein the forming a heat dissipation layer on a side of the first support layer facing away from the substrate, wherein a predetermined distance is formed between one end of the heat dissipation layer and the bent segment includes:
forming foam and a heat dissipation layer on one side of the first support layer, which is far away from the substrate, wherein one end of the foam is aligned with one end of the display section, the other end of the foam is connected with one end of the heat dissipation layer, and the thickness of the foam in the direction perpendicular to the substrate is the same as that of the heat dissipation layer;
gluing one side of the foam far away from the substrate, and covering a protective film on the heat dissipation layer and one side of the foam far away from the substrate;
rolling the protective film by using a roller, and attaching the heat dissipation layer to one side of the first support layer, which is far away from the substrate, to form the heat dissipation layer;
and removing the protective film corresponding to the foam and the foam, wherein the preset distance is formed between one end of the heat dissipation layer and the bending section.
10. A display device, comprising the display module according to any one of claims 1 to 7.
CN202210424712.0A 2022-04-20 2022-04-20 Display module, manufacturing method thereof and display device Pending CN114822252A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210424712.0A CN114822252A (en) 2022-04-20 2022-04-20 Display module, manufacturing method thereof and display device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210424712.0A CN114822252A (en) 2022-04-20 2022-04-20 Display module, manufacturing method thereof and display device

Publications (1)

Publication Number Publication Date
CN114822252A true CN114822252A (en) 2022-07-29

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210424712.0A Pending CN114822252A (en) 2022-04-20 2022-04-20 Display module, manufacturing method thereof and display device

Country Status (1)

Country Link
CN (1) CN114822252A (en)

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