CN114812898B - Component with thin film sensor and preparation method - Google Patents
Component with thin film sensor and preparation method Download PDFInfo
- Publication number
- CN114812898B CN114812898B CN202210233384.6A CN202210233384A CN114812898B CN 114812898 B CN114812898 B CN 114812898B CN 202210233384 A CN202210233384 A CN 202210233384A CN 114812898 B CN114812898 B CN 114812898B
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- Prior art keywords
- film sensor
- rod
- thin film
- component
- pressing rod
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- 239000010409 thin film Substances 0.000 title claims description 24
- 238000002360 preparation method Methods 0.000 title claims description 10
- 238000003825 pressing Methods 0.000 claims abstract description 23
- 239000000758 substrate Substances 0.000 claims abstract description 13
- 239000011159 matrix material Substances 0.000 claims abstract description 4
- 239000000853 adhesive Substances 0.000 claims abstract 4
- 230000001070 adhesive effect Effects 0.000 claims abstract 4
- 239000010408 film Substances 0.000 claims description 27
- 230000006835 compression Effects 0.000 claims description 13
- 238000007906 compression Methods 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 238000004140 cleaning Methods 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 abstract description 6
- 238000000034 method Methods 0.000 description 4
- 239000012790 adhesive layer Substances 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 210000001503 joint Anatomy 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
The invention relates to the technical field of materials and sensing, in particular to a component with a film sensor, which comprises a substrate, wherein an adhesive area is arranged at the top of the substrate, the film sensor is adhered to the surface of the adhesive area, four groups of mounting seats are distributed on the top matrix of the substrate, connecting rods are rotatably connected on the mounting seats, a pressing rod is pinned between one ends of the four groups of connecting rods far away from the mounting seats, the pressing rod is of a U-shaped structure, the middle part of the pressing rod is connected with a plurality of groups of abutting rods, a slot is arranged at the end part of the pressing rod, and a sliding block is slidingly connected with the inner side of the slot.
Description
Technical Field
The invention relates to the technical field of materials and sensing, in particular to a component with a film sensor and a preparation method thereof.
Background
Even today in the information age, structural materials are the main bodies of various large projects, machines and vehicles, and fatigue, damage, fracture and even destruction are inevitably generated in the service process of the structural materials, and life and property safety of people is seriously endangered, so that the full life cycle monitoring of the structural health state of the structural materials is needed, for example, in civil buildings, a thin film sensor is usually adhered to the surface of a stainless steel substrate to detect the stress of the structural materials.
However, at present, the piezoresistive/piezoelectric sensor is stuck on the surface of a structural member, the existing stainless steel substrate lacks of fixing the thin film sensor, and the adhesive layer of the thin film sensor is often failed along with the change of environment and time, so that the monitoring reliability and stability of the thin film sensor are affected, and therefore, the thin film sensor is worthy of improvement.
Disclosure of Invention
The invention aims to solve the defects of the prior art, and provides a component with a film sensor and a preparation method thereof.
In order to achieve the above purpose, the present invention adopts the following technical scheme:
the utility model provides a component with film sensor, includes the base member, the top of base member is provided with the bonding district, and the surface bonding of bonding district has film sensor, four groups mount pad of top matrix distribution of base member, it is connected with the connecting rod to rotate on the mount pad, and the pin joint has the depression bar between the one end that the mount pad was kept away from to four groups connecting rod, and the depression bar is U type structure and middle part connection have multiunit butt pole, the tip of depression bar is provided with the fluting, and grooved inboard sliding connection has the slider, and the recess that is used for holding film sensor's wire has been seted up to the bottom of slider, the top of depression bar is provided with the gliding drive part of drive slider, be provided with the fixing device who is used for fixed depression bar on the mount pad.
Preferably, the driving component is a bolt, the bolt is in threaded connection with the compression bar, and one end of the bolt penetrating through the compression bar is in rotary connection with the sliding block.
Preferably, the fixing device is an inserted bar inserted on the end face of the mounting seat, a spring connected with the inserted bar and the mounting seat is sleeved on the outer side of the inserted bar, and a slot matched with the inserted bar in an inserted manner is formed in the side wall, close to the inserted bar, of the pressure bar.
Preferably, the slots are horizontally provided with a plurality of groups, and the width of each slot is twice that of each inserting rod.
Preferably, one end of the inserted link, which is close to the compression bar, is provided with a wedge structure.
Preferably, the abutment rod is provided with three groups.
Preferably, rubber pads are arranged at the bottoms of the pressing rod and the abutting rod.
The preparation method of the component with the film sensor comprises the following steps:
s1, cleaning a bonding area on the surface of a substrate, welding four groups of mounting seats on the end surface of the substrate along the outer sides of four corners of the bonding area, and simultaneously assembling a connecting rod and a compression bar;
s2, attaching the film sensor to the bonding area, simultaneously rotating the pressing rod to press the surface of the film sensor, and placing the lead of the film sensor in the groove of the sliding block;
s3, adjusting the bolts to enable the sliding blocks to move downwards to compress the lead wires of the film sensor;
s4, inserting the inserted bar on the mounting seat, connecting and fixing the inserted bar through a spring, and inserting one end of the inserted bar into a slot of the compression bar to fix the compression bar, thereby completing the preparation of the component with the film sensor.
The component with the film sensor and the preparation method provided by the invention have the beneficial effects that: according to the invention, the thin film sensor is pressed by arranging the pressing rod on the substrate, so that the problem that an adhesive layer fails after the thin film sensor works for a long time in the prior art is effectively solved, and meanwhile, the lead of the thin film sensor is fixedly protected by the arranged sliding block, so that the lead is prevented from being damaged, the design is reasonable, the structure is simple and practical, and the thin film sensor has certain commercial value.
Drawings
FIG. 1 is a schematic diagram of a structure of a component with a thin film sensor and a method for manufacturing the same according to the present invention;
FIG. 2 is a top view of a component with a thin film sensor and a method of manufacturing the same according to the present invention;
FIG. 3 is an enlarged schematic view of a structure of a component with a thin film sensor and a method for manufacturing the same according to the present invention;
fig. 4 is a schematic diagram of a slider structure with a thin film sensor and a method for manufacturing the same according to the present invention.
In the figure: 1. a base; 2. a bonding region; 3. a thin film sensor; 4. a mounting base; 5. a connecting rod; 6. a compression bar; 7. a butt joint rod; 8. slotting; 9. a slide block; 10. a groove; 11. a bolt; 12. a rod; 13. a spring; 14. a slot.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments.
Referring to fig. 1-4, a component with film sensor, including base member 1, the top of base member 1 is provided with bonding area 2, bonding area 2's surface bonds and has film sensor 3, four groups mount pad 4 are distributed to the matrix at the top of base member 1, rotate on the mount pad 4 and be connected with connecting rod 5, the pin joint has depression bar 6 between the one end that four groups connecting rod 5 kept away from mount pad 4, depression bar 6 is U type structure and the middle part is connected with multiunit butt pole 7, butt pole 7 is provided with three groups, the tip of depression bar 6 is provided with fluting 8, the inboard sliding connection of fluting 8 has slider 9, the recess 10 that is used for holding film sensor 3 is seted up to the bottom of slider 9, the top of depression bar 6 is provided with the drive part that is used for driving slider 9 to slide, be provided with the fixing device who is used for fixing depression bar 6 on the mount pad 4.
More specifically, the driving member is a bolt 11, the bolt 11 is screwed with the pressing rod 6, and one end of the bolt penetrating through the pressing rod 6 is rotatably connected with the slider 9.
The fixing device is a plug rod 12 inserted on the end face of the mounting seat 4, a spring 13 connected with the plug rod 12 and the mounting seat 4 is sleeved on the outer side of the plug rod 12, slots 14 which are in plug fit with the plug rod 12 are formed in the side wall of the pressure rod 6, which is close to the plug rod 12, a plurality of groups of slots 14 are horizontally arranged, the width of each slot 14 is twice that of the plug rod 12, and a wedge-shaped structure is arranged at one end of the plug rod 12, which is close to the pressure rod 6.
In the invention, rubber pads are arranged at the bottoms of the pressure rod 6 and the abutting rod 7 for protecting the surface of the film sensor 3.
The preparation method of the component with the film sensor comprises the following steps:
s1, cleaning a bonding area 2 on the surface of a substrate 1, simultaneously welding four groups of mounting seats 4 on the end surface of the substrate 1 along the outer sides of four corners of the bonding area 2, and simultaneously assembling a connecting rod 5 and a compression bar 6;
s2, attaching the film sensor 3 to the bonding area 2, simultaneously pressing the rotary pressing rod 6 on the surface of the film sensor 3, and placing the lead of the film sensor 3 in the groove 10 of the sliding block 9;
s3, adjusting the bolts 11 to enable the sliding blocks 9 to move downwards to compress the lead wires of the film sensor 3;
s4, inserting the inserting rod 12 on the mounting seat 4, connecting and fixing the inserting rod through the spring 13, and inserting one end of the inserting rod 12 into the slot 14 of the pressing rod 6 to fix the pressing rod 6, so that the preparation of the component with the film sensor is completed.
The foregoing is only a preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art, who is within the scope of the present invention, should make equivalent substitutions or modifications according to the technical scheme of the present invention and the inventive concept thereof, and should be covered by the scope of the present invention.
Claims (6)
1. A component with a thin film sensor comprising a substrate (1), characterized in that: the device is characterized in that an adhesive area (2) is arranged at the top of the base body (1), a thin film sensor (3) is adhered to the surface of the adhesive area (2), four groups of mounting seats (4) are distributed on the top matrix of the base body (1), connecting rods (5) are connected to the mounting seats (4) in a rotating mode, a pressing rod (6) is connected between one ends of the four groups of connecting rods (5) far away from the mounting seats (4) in a pin joint mode, the pressing rod (6) is of a U-shaped structure, a plurality of groups of supporting rods (7) are connected to the middle of the pressing rod, a groove (8) is formed in the end portion of the pressing rod (6), a sliding block (9) is connected to the inner side of the groove (8) in a sliding mode, a groove (10) for containing a lead of the thin film sensor (3) is formed in the bottom of the sliding block (9), a driving part for driving the sliding of the sliding block (9) is arranged at the top of the pressing rod (6), and a fixing device for fixing the pressing rod (6) is arranged on the mounting seat (4).
The driving component is a bolt (11), the bolt (11) is in threaded connection with the compression bar (6), and one end of the bolt penetrating through the compression bar (6) is in rotary connection with the sliding block (9);
the fixing device is a plug rod (12) inserted on the end face of the mounting seat (4), a spring (13) connected with the plug rod (12) and the mounting seat (4) is sleeved on the outer side of the plug rod (12), and a slot (14) in plug fit with the plug rod (12) is formed in the side wall, close to the plug rod (12), of the pressure rod (6).
2. A component with a thin film sensor according to claim 1, wherein: the slots (14) are horizontally provided with a plurality of groups, and the width of each slot (14) is twice that of the corresponding inserted bar (12).
3. A component with a thin film sensor according to claim 1, wherein: one end of the inserted link (12) close to the compression bar (6) is provided with a wedge-shaped structure.
4. A component with a thin film sensor according to claim 1, wherein: the abutting rod (7) is provided with three groups.
5. A component with a thin film sensor according to claim 1, wherein: rubber pads are arranged at the bottoms of the compression bar (6) and the supporting connection bar (7).
6. The method of manufacturing a member with a thin film sensor according to claim 1, comprising the steps of:
s1, cleaning a bonding area (2) on the surface of a substrate (1), simultaneously welding four groups of mounting seats (4) on the end surface of the substrate (1) along the outer sides of four corners of the bonding area (2), and simultaneously assembling a connecting rod (5) and a compression bar (6);
s2, attaching the film sensor (3) to the bonding area (2), simultaneously pressing the rotary pressing rod (6) on the surface of the film sensor (3), and placing the lead of the film sensor (3) in the groove (10) of the sliding block (9);
s3, adjusting the bolts (11) to enable the sliding blocks (9) to move downwards to compress the lead wires of the film sensor (3);
s4, inserting the inserting rod (12) on the mounting seat (4), connecting and fixing the inserting rod through the spring (13), and inserting one end of the inserting rod (12) into the slot (14) of the pressing rod (6) to fix the pressing rod (6), so that the preparation of the component with the film sensor is completed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210233384.6A CN114812898B (en) | 2022-03-10 | 2022-03-10 | Component with thin film sensor and preparation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210233384.6A CN114812898B (en) | 2022-03-10 | 2022-03-10 | Component with thin film sensor and preparation method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114812898A CN114812898A (en) | 2022-07-29 |
| CN114812898B true CN114812898B (en) | 2023-10-27 |
Family
ID=82529567
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210233384.6A Active CN114812898B (en) | 2022-03-10 | 2022-03-10 | Component with thin film sensor and preparation method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114812898B (en) |
Citations (14)
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|---|---|---|---|---|
| JPH09292298A (en) * | 1996-02-29 | 1997-11-11 | Matsushita Electric Works Ltd | Manufacture of pressure sensor |
| JP2004020545A (en) * | 2002-06-20 | 2004-01-22 | Fuji Electric Holdings Co Ltd | Pressure sensor device |
| DE102010030319A1 (en) * | 2010-06-21 | 2011-12-22 | Robert Bosch Gmbh | Pressure sensor module has pressure measurement chip that is housed in housing, where pressure measurement chip is impinged with pressure over opening |
| CN103486961A (en) * | 2013-05-31 | 2014-01-01 | 电子科技大学 | Component with thin film sensor and preparation method |
| CN203929293U (en) * | 2014-05-28 | 2014-11-05 | 北京汽车研究总院有限公司 | A kind of hold-down mechanism |
| WO2015093358A1 (en) * | 2013-12-19 | 2015-06-25 | 株式会社村田製作所 | Pressing sensor |
| CN204679199U (en) * | 2015-06-26 | 2015-09-30 | 中国工程物理研究院总体工程研究所 | Split type sputtered thin film pressure transducer |
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2022
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| CN213688789U (en) * | 2020-12-31 | 2021-07-13 | 浙江金池科技有限公司 | Detection device of film pressure sensor |
| CN112729635A (en) * | 2021-02-20 | 2021-04-30 | 河北省建筑科学研究院有限公司 | Computer-based real-time monitoring method for stress state of steel-concrete composite beam |
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| Publication number | Publication date |
|---|---|
| CN114812898A (en) | 2022-07-29 |
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