CN114807873A - Semiconductor processing equipment - Google Patents

Semiconductor processing equipment Download PDF

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Publication number
CN114807873A
CN114807873A CN202210294338.7A CN202210294338A CN114807873A CN 114807873 A CN114807873 A CN 114807873A CN 202210294338 A CN202210294338 A CN 202210294338A CN 114807873 A CN114807873 A CN 114807873A
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CN
China
Prior art keywords
mounting
positioning
semiconductor laser
laser chip
cavity surface
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CN202210294338.7A
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Chinese (zh)
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CN114807873B (en
Inventor
毛虎
毛森
焦英豪
陆凯凯
谭武烈
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Shenzhen Netopto Optoelectronics Co ltd
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Shenzhen Netopto Optoelectronics Co ltd
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C23C14/505—Substrate holders for rotation of the substrates

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Semiconductor Lasers (AREA)

Abstract

The invention discloses semiconductor processing equipment which is used for sequentially coating a front cavity surface and a rear cavity surface of a semiconductor laser chip and comprises a base, a mounting frame and a coating device, wherein a mounting cavity matched with the shape of the semiconductor laser chip is defined in the mounting frame, the mounting cavity is provided with an upper opening and a lower opening, the upper opening and the lower opening of the mounting cavity are used for respectively exposing the front cavity surface and the rear cavity surface when the semiconductor laser chip is mounted in the mounting cavity, the mounting frame is rotatably mounted on the base around a rotating shaft extending along the horizontal direction so as to have a first position with the upper opening facing upwards and a second position with the lower opening facing upwards, and the coating device is arranged above the mounting frame and is used for sputtering ions to the mounting frame. According to the semiconductor processing equipment provided by the invention, the front cavity surface and the rear cavity surface of the semiconductor laser chip are sequentially coated with films, the semiconductor laser chip does not need to be repeatedly assembled and disassembled, and the processing efficiency is improved.

Description

Semiconductor processing equipment
Technical Field
The invention relates to the technical field of semiconductor processing, in particular to semiconductor processing equipment.
Background
Semiconductor lasers, also known as laser diodes, are lasers using semiconductor materials as working substances and are widely applied to aspects such as laser communication, optical storage, optical gyros, laser printing, distance measurement, radars and the like. The semiconductor laser chip is an important component of a semiconductor laser, and has a front cavity surface and a rear cavity surface which are oppositely arranged, and in order to effectively protect the cavity surfaces, the front cavity surface and the rear cavity surface need to be respectively coated with films when the semiconductor laser chip is processed. In the prior art, when the cavity surface coating is performed on a semiconductor laser chip, the semiconductor laser chip is usually placed in a clamp, the front cavity surface is exposed, then coating is performed, the semiconductor laser chip is detached and clamped again after the front cavity surface coating is completed, so that the rear cavity surface is exposed, then coating is performed, and the coating on the front cavity surface and the coating on the rear cavity surface are respectively completed, wherein the double-surface coating is inconvenient, repeated assembly and disassembly are needed, and the processing efficiency is low.
Disclosure of Invention
The invention mainly aims to provide semiconductor processing equipment, and aims to solve the problems that double-sided coating is inconvenient, needs to be repeatedly assembled and disassembled, and is low in processing efficiency in the prior art.
In order to achieve the above object, the present invention provides a semiconductor processing apparatus for sequentially coating a front cavity surface and a rear cavity surface of a semiconductor laser chip, the semiconductor processing apparatus comprising:
a base;
the mounting frame is internally provided with a mounting cavity matched with the semiconductor laser chip in shape, the mounting cavity is provided with an upper opening and a lower opening, the upper opening and the lower opening of the mounting cavity are used for exposing the front cavity surface and the rear cavity surface respectively when the semiconductor laser chip is mounted in the mounting cavity, and the mounting frame is rotatably mounted on the base around a rotating shaft extending along the horizontal direction so as to have a first position with the upper opening facing upwards and a second position with the lower opening facing upwards; and the number of the first and second groups,
and the coating device is arranged above the mounting rack and is used for sputtering ions to the mounting rack.
Optionally, an installation groove with an upper opening and a lower opening is arranged in the installation frame, the installation groove is provided with a first installation side wall and a second installation side wall which are arranged oppositely in the horizontal direction, and a third installation side wall and a fourth installation side wall which are arranged oppositely in the first direction, and the first direction is orthogonal to the horizontal direction and is arranged at an acute angle with the upper direction and the lower direction;
the first mounting side wall and the second mounting side wall are respectively provided with two positioning blocks;
the third side wall is provided with a clamping block which can move along the first direction;
when the clamping block moves towards the fourth side wall along the first direction to a preset position, the clamping block, the two positioning blocks and the fourth mounting side wall form the mounting cavity in an enclosing mode.
Optionally, the first mounting side wall and the second mounting side wall are respectively provided with a sliding groove extending along the first direction;
the two positioning blocks are slidably mounted on the two sliding grooves along the first direction respectively.
Optionally, the length of the sliding groove is greater than twice the length of the positioning block in the first direction.
Optionally, a through hole extending along the first direction is formed in the third side wall, and an end of the clamping block is inserted into the through hole.
Optionally, the mounting frame is further provided with a mounting hole which extends upwards from the inner wall of the through hole and penetrates through the outer wall of the mounting frame;
the mount also includes a pusher, the pusher including:
the rod body extends along the vertical direction, penetrates through the mounting hole and is provided with a tail end extending into the through hole; and the number of the first and second groups,
the disc cam is arranged at the tail end of the rod body, and the side part of the disc cam is abutted against the end part of the clamping block;
the rod body can rotate around the axis of the mounting hole, and the cam rotates along with the rod body so as to drive the clamping block to move along the first direction.
Optionally, the rod body is threadedly mounted to the mounting hole.
Optionally, a mounting support arm is arranged on the base, the mounting support arm is provided with a lower side surface which is flush with the lower opening, and a matching part is arranged on the lower side surface of the mounting support arm;
the positioning rod is arranged on the lower side surface of the mounting support arm and extends along the first direction, a positioning part is arranged on the positioning rod, and when the positioning rod is mounted on the mounting support arm, the positioning part and the matching part are mutually positioned and matched so as to mutually fix the positioning rod and the mounting support arm; and when the mounting bracket rotates and contacts with the positioning rod, the positioning part is separated from the matching part, so that the positioning rod is separated from the mounting support arm.
Optionally, the matching portion is a first magnetic portion, and the positioning portion is a second magnetic portion.
Optionally, the positioning rod is provided with a plurality of positioning rods, and the plurality of positioning rods are arranged at intervals along the horizontal direction.
According to the technical scheme, the mounting frame is rotatably mounted on the base around the rotating shaft extending along the horizontal direction, when the front cavity surface and the rear cavity surface of the semiconductor laser chip are subjected to film coating, the semiconductor laser chip is mounted in the mounting cavity of the mounting frame firstly, the front cavity surface is ensured to be exposed at the upper opening, the rear cavity surface is exposed at the lower opening, then the mounting frame is rotated to enable the mounting frame to be located at the first position with the upper opening facing upwards, the film coating device is used for coating the front cavity surface, then the mounting frame is rotated to enable the mounting frame to be located at the second position with the lower opening facing upwards, the film coating device is used for coating the rear cavity surface, the front cavity surface and the rear cavity surface of the semiconductor laser chip are sequentially coated in a front-back mode, the semiconductor laser chip does not need to be repeatedly mounted and dismounted, and the processing efficiency is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a semiconductor processing apparatus according to an embodiment of the present invention (without a semiconductor laser chip);
FIG. 2 is a schematic structural diagram of the semiconductor processing apparatus of FIG. 1 after a semiconductor laser chip is mounted thereon;
FIG. 3 is a bottom view of the semiconductor processing apparatus of FIG. 1;
fig. 4 is a schematic view of a portion of the semiconductor processing apparatus of fig. 1.
The reference numbers illustrate:
Figure BDA0003561553900000031
Figure BDA0003561553900000041
the implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that, if directional indications (such as up, down, left, right, front, and back … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative positional relationship between the components, the movement situation, and the like in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indications are changed accordingly.
In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and/or" appearing throughout includes three juxtapositions, exemplified by "A and/or B" including either A or B or both A and B. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
Semiconductor lasers, also known as laser diodes, are lasers using semiconductor materials as working substances and are widely applied to aspects such as laser communication, optical storage, optical gyros, laser printing, distance measurement, radars and the like. The semiconductor laser chip is an important component of a semiconductor laser, and has a front cavity surface and a rear cavity surface which are oppositely arranged, and in order to effectively protect the cavity surfaces, the front cavity surface and the rear cavity surface need to be respectively coated with films when the semiconductor laser chip is processed. In the prior art, when the cavity surface coating is performed on a semiconductor laser chip, the semiconductor laser chip is usually placed in a clamp, the front cavity surface is exposed, then coating is performed, the semiconductor laser chip is detached and clamped again after the front cavity surface coating is completed, so that the rear cavity surface is exposed, then coating is performed, and the coating on the front cavity surface and the coating on the rear cavity surface are respectively completed, wherein the double-surface coating is inconvenient, repeated assembly and disassembly are needed, and the processing efficiency is low.
In view of the above, the present invention provides a semiconductor processing apparatus, and referring to fig. 1 to 4, fig. 1 to 4 are embodiments of the semiconductor processing apparatus according to the present invention.
As shown in fig. 1 to 4, the semiconductor processing apparatus 100 is used to sequentially coat the front cavity surface and the rear cavity surface of a semiconductor laser chip 200, the semiconductor processing equipment 100 comprises a base 110, a mounting frame and a film coating device, wherein a mounting cavity 121 matched with the shape of the semiconductor laser chip 200 is defined in the mounting frame, the mounting cavity 121 is provided with an upper opening and a lower opening, the upper opening and the lower opening of the mounting cavity 121 are used for exposing the front cavity surface and the rear cavity surface respectively when the semiconductor laser chip 200 is mounted in the mounting cavity 121, the mounting bracket is rotatably mounted to the base 110 about a rotation axis extending in a horizontal direction, the coating device is arranged above the mounting frame and is used for sputtering ions to the mounting frame, so that the coating device is provided with a first position with the upper opening facing upwards and a second position with the lower opening facing upwards.
It should be noted that, in the state of fig. 1, the mounting rack is at the first position, at this time, the upper opening of the mounting cavity 121 is an upper opening, and the lower opening is a lower opening; in the state of fig. 2, the semiconductor laser chip 200 is mounted in the mount in the first position, and at this time, the upper surface of the semiconductor laser chip 200 is the front cavity surface and the lower surface is the rear cavity surface.
In the technical scheme of the invention, the mounting rack is rotatably mounted on the base 110 around the rotating shaft extending along the horizontal direction, when the front cavity surface and the rear cavity surface of the semiconductor laser chip 200 are subjected to film coating, the semiconductor laser chip 200 is firstly mounted in the mounting cavity 121 of the mounting rack, the front cavity surface is ensured to be exposed at the upper opening, the rear cavity surface is exposed at the lower opening, then the mounting rack is rotated to enable the mounting rack to be positioned at the first position with the upper opening facing upwards, the film coating device is used for coating the front cavity surface, then the mounting rack is rotated to enable the mounting rack to be positioned at the second position with the lower opening facing upwards, the film coating device is used for coating the rear cavity surface, the front cavity surface and the rear cavity surface of the semiconductor laser chip 200 are sequentially coated in a front-back mode, the semiconductor laser chip 200 does not need to be repeatedly mounted and dismounted, and the processing efficiency is improved.
Further, a mounting groove 122 with an upper opening and a lower opening is arranged in the mounting frame, the mounting groove 122 has a first mounting side wall 122a and a second mounting side wall 122b which are oppositely arranged in the horizontal direction, and a third mounting side wall 122c and a fourth mounting side wall 122d which are oppositely arranged in the first direction, and the first direction is orthogonal to the horizontal direction and forms an acute angle with the upper direction and the lower direction; the first mounting sidewall 122a and the second mounting sidewall 122b are respectively provided with two positioning blocks 123; the third side wall is provided with a clamping block 124 which can move along the first direction; when the clamping block 124 moves toward the fourth sidewall along the first direction to a preset position, the clamping block 124, the two positioning blocks 123 and the fourth installation sidewall 122d form the installation cavity 121. In the process of mounting the semiconductor laser chip 200 in the mounting cavity 121 of the mounting block, the two positioning blocks 123 position the left and right surfaces of the semiconductor laser chip 200, the fourth mounting sidewall 122d positions the lower side surface 111a of the semiconductor laser chip 200, and after the positioning is completed, the clamping block 124 is moved in the first direction to be downwardly close to and abut against the upper side surface of the semiconductor laser chip 200, so that the semiconductor laser chip 200 is clamped in the mounting cavity 121. The mounting mode is simple, and makes the mounting bracket structure comparatively simple.
Further, the first mounting sidewall 122a and the second mounting sidewall 122b are respectively provided with a sliding groove 125 extending along the first direction; the two positioning blocks 123 are slidably mounted on the two sliding grooves 125 along the first direction, respectively. Since the first direction is orthogonal to the horizontal direction and forms an acute angle with the vertical direction, as shown in fig. 1, in this way, during the process of changing the mounting frame from the first position to the second position, the positioning block 123 slides on the sliding groove 125 under the action of its own weight along the first direction away from the fourth mounting sidewall 122d to be separated from the original position (the position where the positioning block 123 is located when positioning the semiconductor laser chip 200), and therefore, after the front cavity surface and the rear cavity surface of the semiconductor laser chip 200 are coated with the film and the semiconductor laser chip 200 needs to be removed, the mounting rack is changed from the first position to the second position, the positioning block 123 is separated from the original position, and at least part of the left surface and the right surface of the semiconductor laser chip 200 are exposed, so that the semiconductor laser chip 200 can be clamped by manpower from the left side and the right side of the semiconductor laser chip 200 to take down the semiconductor laser chip 200, and the semiconductor laser chip 200 can be detached conveniently.
Further, the length L of the sliding groove 125 1 Is greater than the length L of the positioning block 123 in the first direction 2 Twice (see fig. 2 for details). So, after guaranteeing that the mounting bracket becomes the second position from primary importance, locating piece 123 breaks away from original position completely and makes semiconductor laser chip 200's the whole two faces of the left and right sides appear, and semiconductor laser chip 200 conveniently dismantles more.
The third side wall is provided with a through hole 126 extending along the first direction, and the end of the clamping block 124 is inserted into the through hole 126. Through pressing from both sides tight piece 124 activity and inserting in through-hole 126, realize pressing from both sides the activity of tight piece 124 along first direction, so, press from both sides tight piece 124 activity in-process more stable, difficult swing that appears.
The mounting frame is further provided with a mounting hole 127 extending upward from the inner wall of the through hole 126 and penetrating through the outer wall of the mounting frame, the mounting frame further comprises a pushing member 128, the pushing member 128 comprises a rod body 128a and a disc-shaped cam 128b, the rod body 128a extends in the up-down direction, the rod body 128a is arranged through the mounting hole 127, the rod body 128a has a tail end extending into the through hole 126, the disc-shaped cam 128b is arranged at the tail end of the rod body 128a, and the side part of the disc-shaped cam 128b abuts against the end part of the clamping block 124, wherein the rod body 128a is rotatably arranged around the axis of the mounting hole 127, and the cam rotates along with the shaft to drive the clamping block 124 to move in the first direction. The clamping block 124 is driven to move along the first direction by the rotating disc cam 128b, and the disc cam 128b is simple and compact in structure and low in design difficulty, so that the structure of the semiconductor processing equipment 100 is simplified, the compactness of the semiconductor processing equipment 100 is improved, and the design difficulty of the semiconductor processing equipment 100 is reduced.
Further, the rod body 128a is screw-mounted to the mounting hole 127. Thus, the rod body 128a is in threaded fit with the mounting hole 127, the rod body 128a can be automatically locked after being manually rotated by a certain angle, and looseness is prevented from occurring after the clamping block 124 clamps the semiconductor laser chip 200.
A mounting arm 111 is arranged on the base 110, the mounting arm 111 is provided with a lower side surface 111a which is flush with the lower opening, and the lower side surface 111a of the mounting arm 111 is provided with a matching part; the positioning rod 129 is installed on the lower side surface 111a of the installation support arm 111 and extends along the first direction, a positioning part is arranged on the positioning rod 129, and when the positioning rod 129 is installed on the installation support arm 111, the positioning part and the matching part are mutually positioned and matched, so that the positioning rod 129 and the installation support arm 111 are mutually fixed; and when the mounting bracket rotates to contact the positioning rod 129, the positioning portion is separated from the engagement portion, so that the positioning rod 129 is separated from the mounting arm 111. Firstly, the positioning rod 129 is installed on the installation support arm 111, and the positioning rod 129 and the installation support arm 111 are mutually fixed, so that when the semiconductor laser chip 200 is installed in the installation cavity 121 of the installation frame, the outer wall of the positioning rod 129 can position the rear cavity surface of the semiconductor laser chip 200, and the semiconductor laser chip 200 is more accurately installed and positioned and is more stably installed; afterwards, with the mounting bracket from the first position to the second position, at this in-process, the mounting bracket rotates and contacts and orders about locating lever 129 and installation support arm 111 separation with locating lever 129, and locating lever 129 leaves its original mounted position and gives way for the mounting bracket to make the rear cavity face of semiconductor laser chip 200 can not be sheltered from by locating lever 129 and show the under shed at installation cavity 121, the coating film of the rear cavity face of being convenient for, improve the coating film effect. Preferably, the positioning rod 129 is cylindrical, so that when the outer wall of the positioning rod 129 positions the rear cavity surface of the semiconductor laser chip 200, the outer wall of the positioning rod 129 is in line contact with the rear cavity surface, so that the contact area is reduced, friction is reduced, and the rear cavity surface is not easy to rub and damage.
It should be noted that the invention does not limit the specific structure of the positioning portion and the matching portion, for example, the positioning portion and the matching portion are respectively shape-adaptive buckles, and for example, the positioning portion and the matching portion are respectively adhesive layers that can be mutually adhered, for example, the matching portion is a first magnetic absorption portion, and the positioning portion is a second magnetic absorption portion. The embodiment of the invention realizes the mutual fixation or separation of the positioning rod 129 and the mounting support arm 111 through the matching of the first magnetic part and the second magnetic part, has long service life and easy separation of the positioning rod 129 and the mounting support arm 111, and improves the reliability of the structure of the positioning part and the matching part.
Further, the positioning rod 129 is provided in plural (two or more), and the plural positioning rods 129 are provided at intervals in the horizontal direction. Specifically, in the embodiment of the present invention, the two positioning rods 129 are arranged at intervals along the horizontal direction, so that the outer walls of the two positioning rods 129 position the rear cavity surface of the semiconductor laser chip 200, the positioning is more stable, and the mounting stability of the semiconductor laser chip 200 is further improved.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims (10)

1. A semiconductor processing apparatus for sequentially coating a front cavity surface and a rear cavity surface of a semiconductor laser chip, comprising:
a base;
the mounting frame is internally provided with a mounting cavity matched with the semiconductor laser chip in shape, the mounting cavity is provided with an upper opening and a lower opening, the upper opening and the lower opening of the mounting cavity are used for exposing the front cavity surface and the rear cavity surface respectively when the semiconductor laser chip is mounted in the mounting cavity, and the mounting frame is rotatably mounted on the base around a rotating shaft extending along the horizontal direction so as to have a first position with the upper opening facing upwards and a second position with the lower opening facing upwards; and the number of the first and second groups,
and the coating device is arranged above the mounting rack and used for sputtering ions to the mounting rack.
2. The semiconductor processing apparatus according to claim 1, wherein the mounting frame has a mounting groove opened upward and downward therein, the mounting groove having a first mounting sidewall and a second mounting sidewall disposed opposite to each other in a horizontal direction, and a third mounting sidewall and a fourth mounting sidewall disposed opposite to each other in a first direction, the first direction being orthogonal to the horizontal direction and disposed at an acute angle to the upward and downward directions;
the first mounting side wall and the second mounting side wall are respectively provided with two positioning blocks;
the third side wall is provided with a clamping block which can move along the first direction;
when the clamping block moves towards the fourth side wall along the first direction to a preset position, the clamping block, the two positioning blocks and the fourth mounting side wall form the mounting cavity in an enclosing mode.
3. The semiconductor processing apparatus according to claim 2, wherein the first mounting sidewall and the second mounting sidewall are respectively provided with a slide groove extending in the first direction;
the two positioning blocks are slidably mounted on the two sliding grooves along the first direction respectively.
4. The semiconductor processing apparatus of claim 3, wherein a length of the slide slot is greater than twice a length of the positioning block in the first direction.
5. The semiconductor processing apparatus according to claim 2, wherein a through hole extending in the first direction is provided in the third side wall, and an end portion of the clamping block is inserted into the through hole.
6. The semiconductor processing apparatus of claim 5, wherein the mounting frame further comprises mounting holes extending upwardly from an inner wall of the through-hole and through an outer wall of the mounting frame;
the mount also includes a pusher, the pusher including:
the rod body extends along the up-down direction, the rod body penetrates through the mounting hole, and the rod body is provided with a tail end extending into the through hole; and the number of the first and second groups,
the disc cam is arranged at the tail end of the rod body, and the side part of the disc cam is abutted against the end part of the clamping block;
the rod body can be arranged in a rotating mode around the axis of the mounting hole, and the cam rotates along with the rod body so as to drive the clamping block to move in the first direction.
7. The semiconductor processing apparatus of claim 6, wherein the shank is threadably mounted to the mounting hole.
8. The semiconductor processing apparatus of claim 2, wherein the base has a mounting arm thereon, the mounting arm having a lower side flush with the lower opening, the lower side of the mounting arm having an engagement portion;
the positioning rod is arranged on the lower side surface of the mounting support arm and extends along the first direction, a positioning part is arranged on the positioning rod, and when the positioning rod is mounted on the mounting support arm, the positioning part and the matching part are mutually positioned and matched so as to mutually fix the positioning rod and the mounting support arm; and when the mounting bracket rotates and contacts with the positioning rod, the positioning part is separated from the matching part, so that the positioning rod is separated from the mounting support arm.
9. The semiconductor processing apparatus of claim 8, wherein the engaging portion is a first magnetic attraction portion and the positioning portion is a second magnetic attraction portion.
10. The semiconductor processing apparatus according to claim 8, wherein a plurality of the positioning rods are provided, and the plurality of positioning rods are arranged at intervals in a horizontal direction.
CN202210294338.7A 2022-03-23 2022-03-23 Semiconductor processing equipment Active CN114807873B (en)

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CN114807873B CN114807873B (en) 2024-05-07

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111501042A (en) * 2020-06-02 2020-08-07 海南师范大学 Edge-emitting semiconductor laser chip cavity surface coating clamp

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN215251149U (en) * 2021-07-14 2021-12-21 潍坊先进光电芯片研究院 Vacuum lap-plating-preventing overturning tool for semiconductor laser production

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN215251149U (en) * 2021-07-14 2021-12-21 潍坊先进光电芯片研究院 Vacuum lap-plating-preventing overturning tool for semiconductor laser production

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111501042A (en) * 2020-06-02 2020-08-07 海南师范大学 Edge-emitting semiconductor laser chip cavity surface coating clamp
CN111501042B (en) * 2020-06-02 2023-09-01 海南师范大学 Edge-emitting semiconductor laser chip cavity surface coating clamp

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