CN114800277A - Dresser, dressing method for polishing pad, and manufacturing method for glass substrate - Google Patents

Abstract

The invention provides a dresser, a dressing method of a polishing pad and a manufacturing method of a glass substrate. The diamond dresser grinds and removes the surface of the polishing pad, and therefore, there is a problem that the service life of the polishing pad is shortened. Further, the method of removing clogging substances from the fine holes of the polishing pad using the brush dresser has a problem that the clogging substances accumulated in the fine holes cannot be reliably removed, although the surface of the polishing pad is hard to be ground. The invention aims to provide a dresser and a dressing method which can prevent the grinding surface of a grinding pad from being damaged or roughened, remove blocking substances on the grinding surface of the grinding pad and uniformly dress the grinding surface of the grinding pad. The dresser of the present invention is characterized by comprising: a cylindrical main body portion having a curved surface; and a trimming portion formed on the curved surface of the main body, wherein the height of the trimming portion from the curved surface of the main body is 1.0mm to 30 mm.

Description

Dresser, dressing method for polishing pad, and manufacturing method for glass substrate

Technical Field

The present invention relates to a dresser for dressing a polishing pad, a dressing method using the dresser, and a manufacturing method of a glass substrate using the dresser.

Background

For example, a glass substrate used for a Flat Panel Display (FPD) such as an LCD (Liquid Crystal Display) and an OLED (Organic Light-Emitting Diode) is polished by a polishing apparatus. For example, patent document 1 describes a method of polishing the surface of a glass substrate using a polishing pad and slurry.

The polishing pad is provided with a large number of micropores, grooves, and the like (hereinafter also referred to as "micropores") for holding abrasive grains dispersed in the slurry, and the abrasive grains held on the polishing surface of the polishing pad by the micropores are used for polishing. However, when the polishing of the glass substrate is repeated, clogging occurs in the micropores of the polishing surface of the polishing pad, and therefore, the polishing accuracy and polishing efficiency of the glass substrate are lowered, and for example, the surface of the glass substrate may become uneven or it may take a long time to polish.

Therefore, after a predetermined number of glass substrates are polished, a dresser or the like having electrodeposited diamond fine particles is brought into contact with the polishing surface of the polishing pad to scrape a range for polishing the glass substrates in the polishing surface of the polishing pad, thereby eliminating clogging. Patent document 2 discloses a diamond dresser and a brush dresser each including a brush, each of which is configured to electrodeposit fine particles of diamond to form an abrasive grain layer.

Prior art documents

Patent document

Patent document 1: japanese patent laid-open publication No. 2004-122351

Patent document 2: japanese laid-open patent publication No. 11-333698

Disclosure of Invention

Problems to be solved by the invention

However, the diamond dresser described in patent document 2 has a problem that the service life of the polishing pad is shortened because the surface of the polishing pad is ground and removed. In particular, in a suede-type polishing pad in which a foamed layer of polyurethane (hereinafter, also referred to as "NAP layer") is provided on the polishing surface of the polishing pad, the NAP layer is easily ground by a diamond dresser, and the life of the polishing pad is easily shortened.

Further, the method of removing clogging substances from the fine holes of the polishing pad using the brush dresser has a problem that the clogging substances accumulated in the fine holes cannot be reliably removed, although the surface of the polishing pad is hard to be ground. Further, when the polishing pad is a suede-type polishing pad, the NAP layer on the polishing surface is broken, and unevenness occurs on the polishing surface of the polishing pad, which causes problems such as insufficient reduction in the surface roughness and waviness of the glass substrate to be polished, and uneven surface roughness of the glass substrate to be polished.

The inventors have also found that when a circular flat plate dresser of the type disclosed in patent document 2 is used, unevenness is likely to occur in removal accuracy of clogging substances on the polishing surface. This is considered to be because the contact time of the polishing pad with the dresser varies depending on the location.

For example, when a circular flat plate-shaped dresser is used and a polishing pad is rotated relative to the circular flat plate-shaped dresser, the contact time with the dresser differs between the center portion and the outer peripheral portion of the polishing pad. Therefore, for example, when the contact time between the outer peripheral portion of the polishing pad and the dresser is shorter than the contact time between the central portion of the polishing pad and the dresser, there is a possibility that the clogging substance in the central portion of the polishing pad is removed but the clogging substance in the outer peripheral portion of the polishing pad is not removed.

The invention aims to provide a dresser and a dressing method which can prevent a grinding surface of a grinding pad from being damaged or generating roughness and coarsening, can remove blocking substances on the grinding surface of the grinding pad, and can uniformly dress the grinding surface of the grinding pad.

Means for solving the problems

(1) The dresser of the present invention is characterized by comprising: a cylindrical main body portion having a curved surface; and a finishing part formed on the curved surface of the main body part, wherein the finishing part has a height of more than 1.0mm and less than 30mm from the curved surface of the main body part.

(2) The dresser of (1), wherein the dressing portion is formed in a spiral shape along a curved surface of the main body portion, and the dressing portion is formed at a lead angle of 10 ° or more and 80 ° or less with respect to a direction perpendicular to an axial direction of the main body portion.

(3) The dresser of (2), wherein the number of dressing portions formed in a spiral shape along the curved surface of the main body portion is 3 or more and 30 or less.

(4) The dresser of (2) or (3), wherein a pitch of the dressing portion in an axial direction of the body portion is 10mm or more and 200mm or less.

(5) The dresser of any one of (2) to (4), wherein a width of the dressing portion in a direction perpendicular to an extending direction of the dressing portion is 1.0mm or more and 25mm or less.

(6) The dresser of any one of (1) to (5), wherein an axial length of the body portion is 1500mm or more and 5500mm or less.

(7) The dresser of any one of (1) to (6), wherein the diameter of the body portion is 30mm or more and 200mm or less.

(8) The dresser of any one of (1) to (7), wherein the dressing portion has an end surface that comes into contact with a polishing surface of the polishing pad at the time of dressing, and a side surface that connects the end surface and the main body portion, and a chamfered portion is formed between the end surface and the side surface.

(9) The dresser of any one of (1) to (8), wherein the dressing portion has an end surface that abuts a polishing surface of a polishing pad during dressing and a side surface that connects the end surface and the main body portion, and the end surface of the dressing portion has a recess.

(10) The dresser of (9), wherein a depth of the recess is 0.1mm or more and 0.8mm or less.

(11) A dressing method of a polishing pad, the dressing method dressing a polishing surface of a polishing pad using the dresser described in (1) to (10), characterized in that the dressing portion is rotated about a central axis of the main body portion as a rotation axis while being brought into contact with the polishing surface of the polishing pad, and the dresser and the polishing pad are relatively moved to dress the polishing surface of the polishing pad.

(12) The method of dressing a polishing pad according to (11), wherein the dressing tool is swung in an axial direction of the main body, and the polishing surface of the polishing pad is dressed.

(13) The method of dressing a polishing pad according to (11) or (12), wherein the polishing surface of the polishing pad is dressed while supplying slurry to the polishing surface of the polishing pad.

(14) A method for producing a glass substrate, comprising a polishing step of polishing the glass substrate with a polishing pad dressed with the dresser of any one of (1) to (10).

(15) The method for producing a glass substrate according to (14), wherein the glass substrate is for a display.

Effects of the invention

According to the present invention, it is possible to provide a dresser and a dressing method that can prevent damage to or roughening of a polishing surface of a polishing pad, remove clogging substances on the polishing surface of the polishing pad, and uniformly dress the polishing surface of the polishing pad.

Drawings

Fig. 1 is a plan view showing a first embodiment.

Fig. 2 is a cross-sectional view 2-2 of fig. 1.

Fig. 3 is an enlarged view of the finishing portion in the cross-sectional view 2-2 of fig. 1.

Fig. 4 is a plan view showing a modification of the first embodiment.

Fig. 5 is a plan view showing the second embodiment.

Fig. 6 is a cross-sectional view of 6-6 of fig. 5.

Fig. 7 is a plan view showing the third embodiment.

Fig. 8 is a cross-sectional view 8-8 of fig. 7.

Fig. 9 is a plan view showing the fourth embodiment.

Fig. 10 is a plan view showing a modification of the fourth embodiment.

Fig. 11 is a plan view showing the fifth embodiment.

Fig. 12 is a conceptual diagram illustrating a principle of removing clogging substances using the dresser of the present invention.

Fig. 13 is a plan view of a dressing method using the dresser according to the first embodiment.

Fig. 14 is a side view of a dressing method using the dresser shown in the first embodiment.

Detailed Description

Hereinafter, embodiments of the present invention will be described together with examples shown in the drawings.

Fig. 1 to 11 are conceptual views showing a dresser of the present invention, fig. 12 is a conceptual view showing a principle of removing clogging substances using the dresser of the present invention, and fig. 13 and 14 are conceptual views showing a dressing method. Fig. 13 and 14 illustrate a dresser according to the first embodiment of fig. 1.

Fig. 1 to 11 are conceptual views of a dresser used for dressing a polishing pad used for polishing a glass substrate. The glass substrate is used for Flat Panel Displays (FPD) such as LCDs (liquid crystal displays), OLEDs (Organic Light-Emitting diodes), and the like.

The dresser of the invention has a cylindrical main body part and a curved surface; and a trimming portion formed on the curved surface of the main body portion. In the present specification, the axial direction of the columnar body portion is referred to as the X direction, and the direction perpendicular to the axial direction is referred to as the Y direction.

(first embodiment)

As shown in fig. 1, in the first embodiment, the dressing section 14 is formed in a spiral shape along the curved surface of the main body 12. In the first embodiment, the number of threads, the pitch P, the lead L, and the lead angle α are defined as follows.

(number of strips)

In the first embodiment, the number of threads (number of threads) is the number of the dressing portions 14 formed in a spiral shape along the curved surface of the main body 12. The number of the dressers 10 shown in fig. 1 is 3. Therefore, when the dresser 10 shown in fig. 1 is cut by the cutting plane 2-2, the dressing portion 14 is formed at the curved surface 3 of the body portion 12 as shown in fig. 2.

The larger the number of the polishing pad, the higher the removal performance of the clogging substances of the polishing pad. Therefore, the number of the strands is preferably 3 or more, more preferably 5 or more, and still more preferably 10 or more. If the number of the finishing portions is too large, the finishing portions 14 may be present too densely on the curved surface of the body 12, and the removal performance may be deteriorated. Therefore, the number of the strands is preferably 30 or less, more preferably 25 or less, and still more preferably 20 or less.

(Pitch P)

In the first embodiment, the pitch P is a distance in the X direction of the dressing portion 14 formed in a spiral shape along the curved surface of the main body portion 12. The smaller the pitch P, the more densely the dressing portion 14 is formed on the curved surface of the main body 12. When the pitch P is too small, the curved surface of the body 12 is excessively densely covered with the dressing portion 14, and thus the removal performance of the clogging substance may be deteriorated. Therefore, the pitch P is preferably 10mm or more, more preferably 15mm or more, and further preferably 20mm or more. If the pitch P is too large, the frequency of contact between the dressing section 14 and the polishing surface of the polishing pad during dressing decreases, and the removal performance of the clogging substances may decrease. Therefore, the pitch P is preferably 200mm or less, more preferably 100mm or less, and still more preferably 50mm or less.

(lead L)

In the first embodiment, the lead L is a distance that the dressing portion 14 travels in the X direction when the dressing portion 14 is wound around the curved surface of the cylindrical body portion 12 for one circumference, focusing on a specific dressing portion 14, in one or more dressing portions 14 formed in a spiral shape along the curved surface of the body portion 12. Therefore, in the case of the dresser having the number of 1, the lead L and the pitch P are matched, but in the case where the number of 1 is not, the lead L is not matched, and the lead L is a product of the number of the thread P and the pitch. Therefore, the lead L is determined by the number of the lead pieces and the pitch P, and is not particularly limited.

(lead angle α)

In the first embodiment, the lead angle α is an acute angle α (0 ° < α < 90 °) formed by the dressing section 14 and a direction (Y direction) perpendicular to the axial direction of the main body section 12. When the lead angle α is too small, the removal performance of the clogging substance is lowered. Therefore, the lead angle α is preferably 10 ° or more, more preferably 20 ° or more, further preferably 30 ° or more, and particularly preferably 40 ° or more. Further, when the lead angle α is too large, the removal performance of the clogging substance is also lowered. Therefore, the lead angle α is preferably 80 ° or less, more preferably 70 ° or less, further preferably 60 ° or less, and particularly preferably 50 ° or less.

(Main body part)

The main body 12 of the dresser 10 of the present invention has a cylindrical shape with a curved surface. The material of the body 12 is not particularly limited, and is, for example, stainless steel. The main body 12 may have a hollow structure. By forming the hollow structure, the weight of the dresser can be reduced, and the dresser can be driven with a small amount of power.

When the diameter of the body 12 is large, a large number of dressing portions 14 can be formed on the curved surface of the body 12, and therefore improvement in the removal performance of the clogging substances per rotation of the dresser 10 can be expected. Therefore, the diameter of the body 12 is preferably 20mm or more, more preferably 40mm or more, further preferably 60mm or more, and particularly preferably 80mm or more. If the diameter of the main body portion 12 is small, the dresser 10 of the present invention can be rotationally driven with a smaller power, and the dressing apparatus using the dresser 10 of the present invention can be made to have a simple structure. Therefore, the diameter of the body 12 is preferably 300mm or less, more preferably 200mm or less, further preferably 150mm or less, and particularly preferably 120mm or less.

When the polishing pad is circular, the axial length of the main body 12 is preferably longer than the diameter of the polishing pad. When the polishing pad has a rectangular shape, the axial length of the main body 12 is preferably longer than at least one side of the rectangular polishing pad. This enables the polishing surface to be finished at one time, thereby improving polishing efficiency. The axial length of the main body 12 can be adjusted as appropriate depending on the size of the polishing pad to be dressed, but is, for example, 1500mm or more and 5500mm or less.

(finishing part)

The dressing portion 14 is a convex portion formed on the curved surface of the main body 12, and is a portion for dressing the polishing pad. Fig. 3 is an enlarged view of the dresser 14 shown in fig. 2. The dressing section 14 has an end face 16 that comes into contact with the polishing surface of the polishing pad during dressing, and a side face 18 that connects the end face 16 and the main body section 12. Also, a chamfered portion 20 may be formed between the end surface 16 and the side surface 18.

The material of the trimming portion 14 may be different from that of the main body portion 12, but it is preferable to use the same material from the viewpoint of ease of processing. The finishing section 14 is made of, for example, stainless steel.

When the height H of the dressing section 14 is too low, it is difficult to remove the clogging substance of the polishing pad. Therefore, the height H of the dressing section 14 is 1.0mm or more, preferably 2.0mm or more, more preferably 3.0mm or more, and further preferably 5.0mm or more. If the height H of the dressing portion 14 is too high, a force is applied to the vicinity of the body 12 of the dressing portion 14 when removing the clogging material, and the dressing portion 14 may be deformed. Therefore, the height H of the dressing section 14 is 30mm or less, preferably 20mm or less, more preferably 15mm or less, and further preferably 10mm or less.

In the first embodiment, the width W of the dressing section 14 is measured in a direction perpendicular to the extending direction of the dressing section 14 (the direction inclined by the lead angle α from the Y direction). If the width W of the dressing portion 14 is too small, the strength is low, and the dressing portion 14 may be deformed. Therefore, the width W of the dressing section 14 is preferably 1.0mm or more, more preferably 2.0mm or more, and further preferably 3.0mm or more. When the width W of the dressing section 14 is small, the pressure applied when pressing the polishing pad is high, and therefore the removal performance of the clogging substance is improved. Therefore, the width W of the dressing section 14 is preferably 15mm or less, more preferably 10mm or less, further preferably 8.0mm or less, and particularly preferably 5.0mm or less.

In the first embodiment, the aspect ratio H/W (dimensionless) of the finishing part 14 obtained by dividing the height H of the finishing part 14 by the width W is preferably 5.0 or less, more preferably 3.0 or less, and particularly preferably 2.0 or less. When the aspect ratio is not more than the upper limit, the dressing portion is less likely to be deformed. The aspect ratio is preferably 0.1 or more, more preferably 0.5 or more, and further preferably 1.0 or more.

Also, the corner formed by the end face 16 and the side face 18 of the finishing part 14 is preferably chamfered. In this case, a chamfered portion 20 is formed between the end face 16 and the side face 18. The chamfered portion 20 is preferably a C-chamfer or an R-chamfer. By chamfering the corner, it is possible to suppress the generation of irregularities on the polishing surface of the polishing pad during dressing. This is particularly effective when used in a suede-type polishing pad having a NAP layer formed on the polishing surface of the polishing pad.

The C chamfer and the R chamfer may be formed by removing corners formed by the end faces and the side faces of the trimmed portions. Therefore, in the case of the C chamfer, the chamfer depth is, for example, 0.3mm to 1.0 mm. The C chamfer is preferable because it facilitates processing. The R chamfer has a smooth shape, and therefore, the occurrence of irregularities on the polishing surface of the polishing pad during dressing can be further suppressed.

(modification of the first embodiment)

Fig. 4 shows a modification of the first embodiment. The dresser 10 shown in fig. 4 has a concave portion 22 on the end surface 16 of the dressing portion 14.

(concave part of end face of finishing part)

In fig. 4, the recess 22 is formed along the width direction of the trimming portion 14, but the orientation thereof is not limited, and may be formed along the axial direction of the cylindrical body portion 12, for example. By forming the concave portion 22 on the end surface 16 of the dressing portion, the removal performance of the clogging substance is improved. The width of the recess 22 is preferably 0.1mm or more, more preferably 0.3mm or more, and further preferably 0.5mm or more. If the lower limit value is not less than the lower limit value, the removal performance of the clogging substance by the concave portion 22 is improved. The width of the recess 22 is preferably 2.0mm or less, more preferably 1.5mm or less, and still more preferably 1.2mm or less.

The depth of the recess 22 is preferably 0.1mm or more, more preferably 0.2mm or more, and still more preferably 0.3mm or more. If the lower limit value is not less than the lower limit value, the removal performance of the clogging substance by the concave portion 22 can be expected to be improved. The depth of the recess 22 is preferably 0.8mm or less, more preferably 0.7mm or less, and still more preferably 0.6mm or less.

Since the strength of the trimming portion 14 may decrease when the distance between the adjacent recesses 22 is too small, the distance between the adjacent recesses 22 is preferably 1.0mm or more, more preferably 2.0mm or more, and still more preferably 3.0mm or more. Further, when the distance between adjacent recesses 22 is too large, improvement in removal performance by the recesses 22 cannot be expected. Therefore, the distance between adjacent recesses 22 is preferably 50mm or less, more preferably 30mm or less, and still more preferably 20mm or less.

Hereinafter, the dresser of the second to fifth embodiments is described. The dresser of the second to fifth embodiments differs in the shape of the dressing portion from the dresser of the first embodiment. The dresser of the second to fifth embodiments is the same as the dresser of the first embodiment except for the case where the shape of the dressing portion is not specified, the height and width of the dressing portion, and the chamfer of the corner formed by the end face and the side face.

(second embodiment)

A dresser 10 of a second embodiment is shown in fig. 5. The dressing section 14 of the dresser 10 of the second embodiment is formed parallel to the axial direction (X direction) of the main body 12. The dresser 10 of the second embodiment has a plurality of dresser portions 14 on the curved surface of the body 12. The plurality of trimming portions 14 are formed in a stripe shape. The number of the trimming portions 14 is not particularly limited, and is, for example, 3 to 30. Fig. 6 is a 6-6 sectional view of the dresser 10 of the second embodiment. In the dresser 10 shown in fig. 6, 8 dressing portions 14 are formed.

In the case of the dresser 10 of the second embodiment, the width W of the dresser portion 14 is measured in a direction perpendicular to the axial direction of the body portion 12. In the dresser 10 of the second embodiment as well, the improvement of the removal performance of the clogging substance can be expected by providing the concave portion 22 (see fig. 4) in the end surface 16 of the dressing portion 14.

(third embodiment)

A dresser 10 of a third embodiment is shown in fig. 7. The dressing portion 14 of the dresser 10 of the third embodiment is formed in a zigzag shape (zigzag) on the curved surface of the main body 12. In addition to the zigzag shape, the wave-like shape such as a sine curve (sine curve) may be formed. In the case of a wave shape such as a sine curve, since the corners are smaller than those of a zigzag shape, it is possible to suppress the polishing surface of the polishing pad from being damaged. Fig. 8 is a sectional view of the dresser 10 of the third embodiment. In the dresser 10 of fig. 8, 6 dressing portions 14 are formed. In the dresser 10 of the third embodiment as well, the improvement of the removal performance of the clogging substance can be expected by providing the concave portion 22 (see fig. 4) in the end surface 16 of the dressing portion 14.

(fourth embodiment)

A dresser 10 of a fourth embodiment is shown in fig. 9. The dressing section 14 of the dresser 10 of the fourth embodiment is formed in a grid pattern on the curved surface of the body 12. The size of each of the trimming portions 14 is, for example, a rectangular shape having one side of 3.0mm to 30 mm. The shape of each of the trimming portions 14 is not limited to a rectangular shape. As shown in fig. 10, the shape of each of the trimming portions 14 shown in fig. 9 may be replaced with a circular shape from a rectangular shape. That is, the dressing section 14 may be formed in a bead shape. The diameter of the rounded trimming portion 14 is not particularly limited, and is, for example, 3.0mm to 30 mm. In the dresser 10 of the fourth embodiment as well, the improvement of the removal performance of the clogging substance can be expected by providing the concave portion 22 (see fig. 4) in the end surface 16 of the dressing portion 14.

(fifth embodiment)

The dressing section 14 of the dresser 10 shown in fig. 11 is formed in a mesh shape. The width of the modified portion 14 forming the mesh is preferably 1.0mm or more, more preferably 2.0mm or more, and further preferably 3.0mm or more. If the lower limit or more is set, the deformation of the dressing section 14 can be prevented. The width W of the dressing section 14 is preferably 15mm or less, more preferably 10mm or less, further preferably 8.0mm or less, and particularly preferably 5.0mm or less. When the width W of the dressing section 14 is small, the pressure applied when pressing against the polishing pad becomes high, and therefore, the removal performance of the clogging substance is considered to be improved. In the dresser 10 of the fifth embodiment as well, the improvement of the removal performance of the clogging substance can be expected by providing the concave portion 22 (see fig. 4) in the end surface 16 of the dressing portion 14.

(principle of removing clogging substance by dresser according to embodiment of the present invention)

Fig. 12 is a diagram conceptually showing the principle of removing the clogging substance 26 by the dresser 10 of the present invention. The polishing pad 28 is made of, for example, synthetic resin fibers, nonwoven fabric, polyurethane, or the like, and is a porous material having many fine pores 24. The fine holes 24 hold abrasive grains in the slurry, and the glass substrate is pressed against the polishing surface of the polishing pad 28, thereby polishing the glass substrate.

However, as the polishing operation proceeds, abrasive grains, polishing dust, and the like having a decreased polishing ability are clogged in the fine holes 24 of the polishing pad 28, and new abrasive grains cannot be retained. Therefore, the dresser 10 dresses the polishing pad 28 every time a predetermined number of glass substrates are polished.

As shown in fig. 12(a) to 12(c), the finishing section 14 presses the convex portion on which the fine holes 24 are formed from the side surface direction of the convex portion, thereby removing the clogging substance 26 of the fine holes 24. At this time, the clogging substances 26 can be removed from the micropores 24 of the polishing pad 28 by setting the height H (see fig. 3) of the dressing portion 14 from the curved surface of the main body 12 to 1.0mm or more. Since the dresser 10 moves relative to the polishing pad 28, the dresser portion 14 sequentially presses the adjacent convex portions. Eventually, the clogging substances 26 are removed from the fine pores 24 over the entire surface of the polishing pad.

(dressing method of dresser according to embodiment of the present invention)

Dressing of the polishing pad by the dresser of the present invention was performed as follows. The polishing pad 28 is located on the XY plane as shown in fig. 13. The dresser 10 is positioned above the polishing surface of the polishing pad 28 on which polishing of a predetermined number of glass substrates has been completed, and the dressing portion 14 is brought into contact with the polishing surface of the polishing pad 28. Next, the dresser 10 is rotated about the central axis of the main body 12 as a rotation axis, and is moved from one end portion of the polishing pad 28 toward the other end portion (in the direction of arrow a). The moving direction is a direction orthogonal to the axial direction of the main body 12. At this time, the slurry 32 may be supplied from the slurry supply unit 30 to the polishing surface of the polishing pad 28. By trimming while supplying the slurry 32, the clogging substances 26 can be efficiently removed. As the slurry 32, for example, cerium oxide is used.

Further, dressing may be performed while swinging the dresser 10 in the axial direction (the direction of arrow B) of the body 12. This enables efficient removal of the clogging substance 26.

The rotation direction (the arrow C direction) of the dresser 10 at the contact point of the dresser 10 and the polishing pad 28 is preferably the same direction as the traveling direction (the arrow a direction) of the dresser 10 with respect to the polishing pad 28. This makes it easier for the dressing section 14 to press the side surface of the convex portion of the polishing surface of the polishing pad 28, and therefore, the clogging substance 26 can be removed efficiently.

After the dresser 10 is moved from one end portion to the other end portion of the polishing pad 28, the dressing portion 14 may be separated from the polishing pad 28, the polishing pad 28 and the dresser 10 may be relatively rotated in the XY plane, and then dressing may be performed again. By relatively rotating the polishing pad 28 and the dresser 10 in the XY plane and dressing the polishing pad 28 from a plurality of directions, the clogging substance 26 of the polishing pad 28 can be reliably removed. That is, for example, in the case of using the circular polishing pad 28 as shown in fig. 13, the polishing pad 28 is rotated around the point O.

According to the above configuration, it is possible to remove the clogging substances 26 on the polishing surface of the polishing pad 28 while suppressing the damage to the polishing surface of the polishing pad 28 or the roughening of the polishing surface of the polishing pad 28, and it is possible to uniformly finish the polishing surface of the polishing pad 28.

Description of the reference symbols

10 … trimmer;

12 … a body portion;

14 … finishing part;

16 … end faces;

18 … side;

20 … chamfering;

22 … recess;

24 … micro holes;

26 … plugging material;

28 … polishing pad;

30 … slurry supply;

32 … slurry;

34 … spray nozzle.

Claims (15)

1. A dresser for dressing a polishing surface of a polishing pad, comprising:

a cylindrical main body portion having a curved surface; and

a trimming portion formed on the curved surface of the main body portion,

the trimming portion has a height of 1.0mm or more and 30mm or less from the curved surface of the main body portion.

2. The trimmer of claim 1, wherein,

the dressing portion is formed in a spiral shape along the curved surface of the main body portion, and the dressing portion is formed at a lead angle of 10 ° or more and 80 ° or less with respect to a direction perpendicular to the axial direction of the main body portion.

3. The trimmer of claim 2, wherein,

the number of the trimming portions formed in a spiral shape along the curved surface of the main body portion is 3 or more and 30 or less.

4. The trimmer of claim 2 or 3, wherein,

the pitch of the dressing portion in the axial direction of the main body is 10mm to 200 mm.

5. The conditioner of any one of claims 2-4,

the width of the trimming portion in a direction perpendicular to the extending direction of the trimming portion is 1.0mm to 25 mm.

6. The dresser of any one of claims 1 to 5,

the axial length of the main body part is more than 1500mm and less than 5500 mm.

7. The dresser of any one of claims 1-6,

the diameter of the main body is 30mm to 200 mm.

8. The dresser of any one of claims 1 to 7,

the dressing portion has an end face abutting against a polishing surface of the polishing pad at the time of dressing and a side face connecting the end face and the main body portion,

a chamfered portion is formed between the end surface and the side surface.

9. The dresser of any one of claims 1 to 8,

the dressing portion has an end face abutting against a polishing surface of the polishing pad at the time of dressing and a side face connecting the end face and the main body portion,

the end surface of the finishing portion has a recess.

10. The trimmer of claim 9, wherein,

the depth of the recess is 0.1mm to 0.8 mm.

11. A method for dressing a polishing pad is provided,

the dressing method for dressing an abrasive surface of an abrasive pad using the dresser according to any one of claims 1 to 10,

rotating the dresser about a central axis of the main body as a rotation axis while bringing the dresser into contact with a polishing surface of the polishing pad,

dressing the polishing surface of the polishing pad by relatively moving the dresser and the polishing pad.

12. The method for conditioning a polishing pad according to claim 11, wherein,

the dresser is configured to dress the polishing surface of the polishing pad while swinging the dresser in an axial direction of the main body.

13. The method for conditioning a polishing pad according to claim 11 or 12, wherein,

the method includes dressing the polishing surface of the polishing pad while supplying slurry to the polishing surface of the polishing pad.

14. A method for producing a glass substrate, comprising a polishing step of polishing the glass substrate with a polishing pad dressed with the dresser according to any one of claims 1 to 10.

15. The method for manufacturing a glass substrate according to claim 14, wherein,

the glass substrate is used for a display.

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