CN114792077A - Static simulation method, system and computer equipment for semiconductor process cycle - Google Patents
Static simulation method, system and computer equipment for semiconductor process cycle Download PDFInfo
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Abstract
The application relates to a static simulation method, a system, computer equipment and a computer readable storage medium of a semiconductor process cycle. The static simulation method of the semiconductor process period comprises the following steps: acquiring standard cycle time, a rework probability threshold value and a rework reference time of a target process step; acquiring the random probability of a target batch needing reworking after the target process step through a random function, wherein the random probability is more than or equal to 0 and less than or equal to 1; judging whether the random probability is smaller than a rework probability threshold value or not; if the random probability is smaller than the rework probability threshold, acquiring estimated rework time of the target batch after the target process step according to the rework reference time; and obtaining the estimated cycle time of the target batch in the target process step according to the sum of the standard cycle time and the estimated rework time. The embodiment of the application can effectively improve the simulation accuracy.
Description
Technical Field
The present application relates to the field of semiconductor simulation technologies, and in particular, to a static simulation method, system, computer device, and computer-readable storage medium for a semiconductor process cycle.
Background
With the development of semiconductor technology, semiconductor simulation technology has emerged for simulation and estimation of semiconductor production processes. The semiconductor simulation method comprises a static simulation method and a dynamic simulation method. When the dynamic simulation method is used for production simulation, production resources (such as a device list), a product processing flow sequence and standard processing Time (Process Time) are established in the system, so that materials are processed in a real-world-like processing mode and enter and exit the device in a virtual production environment, and more materials are automatically queued in front of the device to be processed. The dynamic simulation mode can realize high-accuracy simulation prediction, but the difficulty is high and the cost is high.
The static simulation method is low in creation difficulty, so that the simulation cost can be effectively saved. In the conventional static simulation method, when the production simulation is performed, the prediction is performed according to a fixed production flow and a given standard cycle time of each step and according to time. However, in actual production, after a process step, there are often some defective products, and at this time, the products need to be re-processed (i.e., reworked). Rework can result in the actual cycle time of the process step not being the standard cycle time.
Therefore, the conventional static simulation method has a low accuracy due to the difference from the practice.
Disclosure of Invention
Based on this, the present application provides a static simulation method, system, computer device and computer-readable storage medium capable of improving accuracy.
A static simulation method of a semiconductor process cycle comprises the following steps:
acquiring standard cycle time, a rework probability threshold and rework reference time of a target process step;
acquiring the random probability of a target batch needing to be reworked after the target process step through a random function, wherein the random probability is more than or equal to 0 and less than or equal to 1;
judging whether the random probability is smaller than the rework probability threshold;
if the random probability is smaller than the rework probability threshold, acquiring estimated rework time of the target batch after the target process step according to the rework reference time;
and obtaining the estimated cycle time of the target batch in the target process step according to the sum of the standard cycle time and the estimated rework time.
In one embodiment, after the determining whether the random probability is smaller than the rework probability threshold, the method further includes:
and if the random probability is not less than the rework probability threshold, acquiring the estimated rework time of the target batch as zero.
In one embodiment, the range of the random function is 0 to 1, and the random probability is the value of the random function.
In one of the embodiments, the first and second electrodes are,
before the estimated rework time of the target batch after the target process step is obtained according to the rework reference time, the method further includes:
acquiring the rework fluctuation time of the target batch;
the obtaining of the estimated rework time of the target batch after the target process step according to the rework reference time includes:
and acquiring the estimated rework time of the target batch according to the rework reference time and the rework fluctuation time.
In one of the embodiments, the first and second parts of the device,
the acquiring of the rework fluctuation time of the target batch comprises:
acquiring a fluctuation coefficient of the target process step;
and acquiring the rework fluctuation time of the target batch according to the fluctuation coefficient and the random probability.
In one embodiment, the fluctuation coefficient of the target process step is obtained, and a time correction constant is also obtained, and the time correction constant is used for adjusting the rework reference time.
In one embodiment, the method for acquiring the fluctuation coefficient and the time constant includes:
acquiring a historical reworking time range of the target process step according to the actual reworking time of the plurality of historical reworking batches subjected to the target process step;
and acquiring an initial fluctuation coefficient and an initial time correction constant, and adjusting the fluctuation coefficient and the time correction constant until the difference between the estimated rework time range and the historical rework time range is controlled within a preset range.
In one embodiment, the ripple factor and the time correction constant are adjusted simultaneously.
In one embodiment, obtaining the rework probability threshold for the target process step comprises:
and acquiring the rework probability threshold according to the rework rates of multiple groups of historical batches passing through the target process step.
In one embodiment, obtaining the rework reference time for the target process step comprises:
and acquiring the rework reference time according to the actual rework time of the plurality of historical rework batches subjected to the target process step.
In one embodiment, the rework reference time is a median or average of rework times of each historical rework lot that passed through the target process step.
A semiconductor static simulation system, comprising:
the system comprises an acquisition module, a processing module and a processing module, wherein the acquisition module is used for acquiring standard cycle time, a rework probability threshold and rework reference time of a target process step;
the calculation module is used for acquiring the random probability that the target batch needs to be reworked after passing through the target process step through a random function, wherein the random probability is more than or equal to 0 and less than or equal to 1;
the judging module is used for judging whether the random probability is smaller than the rework probability threshold value or not;
and the control module is used for acquiring the estimated rework time of the target batch according to the rework reference time when the random probability is smaller than the rework probability threshold, and acquiring the estimated cycle time of the target batch in the target process step according to the sum of the standard cycle time and the estimated rework time.
In one of the embodiments, the first and second parts of the device,
the obtaining module is further used for obtaining a fluctuation coefficient of the target process step and obtaining the rework fluctuation time of the target batch according to the fluctuation coefficient and the random probability;
and the control module is used for acquiring the estimated rework time of the target batch according to the rework reference time and the rework fluctuation time.
In one of the embodiments, the first and second parts of the device,
the acquisition module acquires a time correction constant while acquiring the fluctuation coefficient of the target process step, wherein the time correction constant is used for adjusting the rework reference time;
the obtaining module is further configured to obtain a historical rework time range of the target process step according to actual rework times of the plurality of historical rework batches subjected to the target process step;
the system also comprises a parameter adjusting module, wherein the parameter adjusting module is used for acquiring an initial fluctuation coefficient and an initial time correction constant, and adjusting the fluctuation coefficient and the time correction constant until the difference between the estimated rework time range and the historical rework time range is controlled within a preset range.
A computer device comprising a memory storing a computer program and a processor implementing the steps of the method of any preceding claim when the processor executes the computer program.
A computer-readable storage medium, on which a computer program is stored which, when being executed by a processor, carries out the steps of the method of any of the above.
According to the static simulation method, the static simulation system, the computer equipment and the computer readable storage medium for the semiconductor process period, the random probability is obtained through the random function in the process of obtaining the estimated period time of the target batch in the target process step, so that whether the target batch is reworked or not can be simulated. And when the target batch needs to be reworked, acquiring the estimated cycle time according to the sum of the standard cycle time and the estimated reworking time. Therefore, the method of the embodiment of the application can take the rework time into consideration in the static simulation, and the result of the estimated cycle time is linked with whether the rework is needed or not through the random probability, so that the actual situation can be effectively simulated, and the simulation accuracy is improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments or the conventional technologies of the present application, the drawings used in the descriptions of the embodiments or the conventional technologies will be briefly introduced below, it is obvious that the drawings in the following descriptions are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a flow diagram illustrating a method for static simulation of a semiconductor process cycle according to one embodiment;
FIG. 2 is a schematic flowchart illustrating a method for static simulation of a semiconductor process cycle in accordance with another embodiment;
FIG. 3 is a flow chart illustrating a method for static simulation of a semiconductor process cycle in accordance with yet another embodiment;
FIG. 4a is a historical rework time range in an embodiment, FIG. 4b is an estimated rework time range before parameter adjustment in the embodiment, and FIG. 4c is an estimated rework time range after parameter adjustment in the embodiment;
FIG. 5 is a block diagram of a static simulation system for a semiconductor process cycle in one embodiment;
FIG. 6 is a block diagram of a static simulation system for a semiconductor process cycle in one embodiment.
Description of the reference numerals: 100-an acquisition module, 200-a calculation module, 300-a judgment module, 400-a control module and 500-a parameter adjusting module.
Detailed Description
To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Embodiments of the present application are given in the accompanying drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the present application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
As used herein, the singular forms "a", "an" and "the" may include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises/comprising," "includes" or "including," or "having," and the like, specify the presence of stated features, integers, steps, operations, components, parts, or combinations thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof.
In one embodiment, referring to fig. 1, a method for static simulation of a semiconductor process cycle is provided, which includes:
step S100, standard cycle time, a rework probability threshold value and rework reference time of a target process step are obtained;
step S200, acquiring the random probability of the target batch needing reworking after the target process step through a random function, wherein the random probability is more than or equal to 0 and less than or equal to 1; the random function may be random function in EXCEL or random () and srad () in C language, but is not limited thereto.
Step S300, judging whether the random probability is smaller than a rework probability threshold;
step S500, if the random probability is smaller than the rework probability threshold, obtaining estimated rework time of the target batch after the target process step according to the rework reference time;
and S700, obtaining the estimated cycle time of the target batch in the target process step according to the sum of the standard cycle time and the estimated rework time.
In step S100, the standard cycle time of the target process step can be obtained by new construction, or can be selected from the established existing standard cycle times. The rework probability threshold of the target process step may be obtained through calculation, or may be selected from the calculated existing rework probability thresholds. The rework reference time of the target process step can be obtained through calculation, and can also be selected from the calculated existing rework reference time. There is no limitation to this.
The standard cycle time, rework probability threshold, and rework reference time for the target process step are described in detail below.
First, the standard cycle time of the target process step, i.e. the standard CT of the target process step, may be specifically the standard time from the last station when a batch of chip materials enters the target process step for processing to the station where the target process step is left after the processing is completed.
Here, when the chip material is processed in a batch, the chip material may be loaded in a standard hermetic cassette (SMIF POD), and each cassette may contain 25 pieces, thereby forming a batch of the chip material.
Specifically, the standard cycle time of the target process step may include its standard processing time and standard waiting time. Wherein, the standard processing time of the target process step can be as follows: a batch of chip material is processed at the target process step at a standard time from entering the tool to finishing processing (i.e., processing is completed at the site where the target process step is left) after leaving the tool. The standard wait time for the target process step may be: a batch of chip material is processed from the end of the last process step of the target process step (i.e., from the end of the last station) to the beginning of the target process step.
When the target process step is the first step in the process, the standard processing time is zero.
Meanwhile, the rework probability threshold is a probability value used for judging whether rework will occur during simulation.
In particular, the chip material may be processed in batches, and in an actual production process, a plurality of batches of chip material may be processed in each process step. For a process step, there are lots that need to be reworked and there are lots that do not. While the proportion of lots that need to be reworked will not typically exceed a predetermined proportion. This predetermined proportion in the target process step can be modeled here with a rework probability threshold to make the simulated behavior characteristics consistent with practice.
As an example, the rework probability threshold in the target process step may be obtained based on rework rates of multiple sets of historical lots through the target process step.
In particular, there may be multiple lots in a set of historical lots. For example, a set of historical batches may belong to one historical parent, and different historical batches may be affiliated with different historical parents. And in each group of historical batches, the proportion of the batch needing to be reworked in the group of historical batches is the reworking ratio of the group of historical batches passing through the target process step. The rework rate may vary from set to set of historical lots, but it may have a maximum value. A rework probability threshold in the target process step may be obtained from the maximum value. Specifically, the maximum value may be used as the rework probability threshold, or a value greater than the maximum value may be used as the rework probability threshold, where the comparison is not limited.
Of course, the manner of obtaining the rework probability threshold is not limited to this, and may be set by a person skilled in the art according to historical experience.
Meanwhile, the rework reference time is a reference time for performing rework for the simulation calculation.
In an actual production process, a batch of chip materials are processed through one process step, so that some unqualified products usually exist, and at the moment, the products need to be reworked, and the reworking needs a certain time. This time in the target process step is simulated here with the rework reference time so that the simulated behavior characteristics are consistent with practice.
In step S200, the random function is a function for generating a random number. The random probability takes a value between 0 and 1 and can be obtained according to a numerical value generated by a random function.
As an example, the random function may range in value from 0 to 1. At this time, the random probability is a value of a random function, so that the processing mode of acquiring the random probability is simpler and more convenient.
Of course, the range of the random function is not limited thereto. For example, the random function may have a value in the range of-1 to 0. At this time, the absolute value of the random function may be taken again, so as to obtain the random probability.
The random probability takes a value between 0 and 1, so that the probability that the target batch needs to be reworked after passing through the target process step can be simulated.
In step S300, as described above, the ratio of lots to be reworked among lots processed in one process step does not generally exceed a predetermined ratio. The rework probability threshold simulates the predetermined fraction of the target process step.
Meanwhile, the proportion of the lot to be reworked among the lots processed in the target process step may also be regarded as the probability that rework may occur for each lot of the lots. Therefore, the probability that rework may occur for each lot processed in the target process step should not exceed the rework probability threshold.
Therefore, whether the target batch is reworked or not can be simulated and judged by judging whether the random probability of the target batch needing to be reworked after passing through the target process step is smaller than the rework probability threshold value or not.
In step S500, if the random probability that the target lot needs to be reworked after passing through the target process step is smaller than the rework probability threshold, the rework time of the target lot can be simulated.
At this time, the estimated rework time of the target batch after the target process step is obtained according to the rework reference time. Specifically, the estimated rework time may be equal to the rework reference time, or may have a certain fluctuation based on the rework reference time, which is not limited herein.
In step S700, the estimated cycle time of the target batch in the target process step can be expressed as:
CT 1 ＝T 1 +T 2 ，
wherein, CT 1 Estimated cycle time, T, for a target batch at a target process step 1 Is the standard cycle time of the target process step, T 2 The estimated rework time for the target lot through the target process step.
Here, it is understood that the above target lot is one of lots processed in the target process step. When processing of a plurality of batches of chip materials in a target process step is to be simulated, simulation can be performed with each batch as a target batch, respectively. And multiple process steps may be involved in the production process. Each process step can be taken as a target process step, so that the production period of the whole production process can be accurately estimated.
In the static simulation method of the embodiment, in the process of obtaining the estimated cycle time of the target batch in the target process step, the random probability is obtained through the random function, so that whether the target batch is reworked or not can be simulated. And when the target batch needs to be reworked, acquiring the estimated cycle time according to the sum of the standard cycle time and the estimated reworking time. Therefore, the method can take the rework time into consideration in the static simulation, and the result of the estimated cycle time is linked with whether rework is needed or not through the random probability, so that the actual situation can be effectively simulated, and the simulation accuracy is improved.
Meanwhile, when a plurality of batches of chip materials are processed in the target process step, rework probabilities obtained by respectively using each batch as a target batch are generated by random functions, which are not necessarily the same. Therefore, simulation of different rework probabilities can be performed for different batches, and the accuracy of the overall simulation is improved.
In an embodiment, referring to fig. 2, after the step S300, the method further includes:
and step S600, if the random probability is not less than the rework probability threshold, acquiring the estimated rework time of the target batch as zero.
As explained above, the probability that rework may occur for each lot processed in the target process step should not exceed the rework probability threshold. Thus, a target lot is not unreasonably unlikely to occur if the random probability that it will need rework through the target process step is not less than the rework probability threshold. Therefore, in this case, it is possible to simulate a situation in which the target lot is not reworked.
At this time, the estimated cycle time CT of the target lot obtained in step S700 in the target process step 1 Can be equal to the standard cycle time T of the target process step 1 。
It should be noted that, in the embodiment, when the random probability that the target lot needs to be reworked after passing through the target process step is equal to the rework probability threshold, the target lot is regarded as not being reworked. In other embodiments, the target lot may be considered as having rework when the random probability that the target lot needs rework after passing through the target process step is equal to the rework probability threshold. This may depend on the manner in which the rework probability threshold is valued. For example, the ratio of a lot to be reworked among lots processed through the target process step is set to P. When the rework probability threshold value is the maximum value of P, rework can occur as the target batch. And when the rework probability threshold value is a value greater than the maximum value of P, the target batch can be regarded as not to be reworked.
In an embodiment, referring to fig. 3, before step S500, the method further includes:
step S400, the rework fluctuation time of the target batch is obtained.
The rework fluctuation time is a time for fluctuating the rework reference time up and down.
At this time, in step S500, the estimated rework time of the target batch is obtained according to the rework reference time and the rework fluctuation time.
The estimated rework time of the target lot may be expressed as:
T 2 ＝T 21 +T 22 ，
wherein, T 2 Estimated rework time, T, for a target batch through a target process step 21 Is a target process stepHeavy duty reference time of, T 22 The rework surge time through the target process step for the target lot.
In this embodiment, the estimated rework time of the target batch takes the rework fluctuation time into consideration, so that the simulation is closer to reality, and the simulation accuracy is improved.
In one embodiment, step S400 includes:
step S410, obtaining the fluctuation coefficient of the target process step;
and step S420, acquiring the rework fluctuation time of the target batch according to the fluctuation coefficient and the random probability.
In step S410, the fluctuation coefficient is a coefficient for scaling the random probability to obtain a target batch rework fluctuation time through the target process step.
In step S420, the obtaining expression of the rework fluctuation time of the target batch may be:
T 22 ＝k*rand，
wherein, T 22 The rework fluctuation time of the target batch passing through the target process step, k is the fluctuation coefficient of the target process step, and rand is the random probability that the target batch needs rework after passing through the target process step.
In the embodiment, the random probability is effectively scaled through the fluctuation coefficient, so that random rework fluctuation time can be obtained within a certain range, and simulation is closer to reality. Meanwhile, different batches are taken as target batches at the moment, and different rework fluctuation time can be obtained. Different batches of rework fluctuation time fluctuate around a certain time (rework reference time) differently, thereby improving simulation accuracy.
In one embodiment, the step S410 obtains a time correction constant for adjusting the rework reference time at the same time as obtaining the fluctuation coefficient of the target process step.
At this time, in step S500, the estimated rework time of the target batch after the target process step is obtained according to the sum of the adjusted rework reference time and the rework fluctuation time.
In this embodiment, the initially obtained rework reference time may be further adjusted by referring to the time constant, so that the simulation is more accurate.
As an example, step S410 may include at this time:
step S411, acquiring a historical rework time range of the target process step according to actual rework time of a plurality of historical rework batches passing through the target process step;
in step S412, an initial fluctuation coefficient and an initial time correction constant are obtained, and the fluctuation coefficient and the time correction constant are adjusted until the difference between the estimated rework time range and the historical rework time range is controlled within a preset range.
In step S411, the plurality of historical rework lots for the target process step may include, for example, n historical rework lots. Each batch has an actual rework time. The n batches have n actual rework times. The range of the n actual rework times may be used as the historical rework time range of the target process step.
In step S412, the initial fluctuation coefficient may be newly created, or may be a default value of the system, or may be selected from existing coefficients stored in the system, or the like. Similarly, the initial time correction constant may be newly established, or may be a default value of the system, or may be selected from existing constants stored in the system, or the like.
The maximum value of the estimated rework time range is set to be t11, and the minimum value is dt 12. The maximum value of the historical rework time range is dt21, the minimum value is dt22, and the difference between the estimated rework time range and the historical rework time range is controlled within a preset range as the difference between dt1 and dt2, that is, the difference between dt11 and dt21 and the difference between dt12 and dt22 are both controlled within the preset range.
In this embodiment, step S412 is a parameter adjusting step, which performs the 1 st adjustment by using the initial fluctuation coefficient and the initial time correction constant, and then may adjust the fluctuation coefficient and the time correction constant to perform multiple parameter adjustments. It will be appreciated that if the condition is satisfied at the 1 st adjustment, then the parameter adjustment, i.e., the ripple factor and the time correction constant, may not be adjusted at any later time.
Here, the fluctuation coefficient and the time correction constant may be adjusted simultaneously or may be adjusted in a distributed manner, and the comparison is not limited here. The following description will be made by taking the simultaneous adjustment of both as an example.
Before parameter adjustment, the range of the random probability is 0 to 1, and the range of the rework fluctuation time is 0 to 1; the rework reference time is T 21a ，T 21a The initial rework reference time. At this time, an estimated rework time frame T may be obtained 21a To (T) 21a +1) of where T 21 Is the rework reference time of the target process step.
After the ith adjustment of the basic coefficient, the range of the random probability is expanded or reduced to 0 to k i ，k i The fluctuation coefficient for the ith adjustment; the rework reference time is T 21a +dt i ，dt i The constant is corrected for the time of the ith adjustment. At this time, a rework fluctuation time range of 0 to k may be obtained i Thereby obtaining an estimated rework time frame (T) 21a +dt i ) To (T) 21a +dt i +k i ) Wherein T is 21 Is the rework reference time of the target process step.
Specifically, referring to fig. 4a to 4c, for example, the historical rework time range is as shown in fig. 4a, the estimated rework time range is as shown in fig. 4b before the parameter adjustment is performed, and the estimated rework time range is as shown in fig. 4c after the parameter adjustment is performed, which is substantially the same as the range of fig. 4 a.
In one embodiment, the step S100 of obtaining the rework reference time of the target process step includes: and acquiring the rework reference time according to the actual rework time of the plurality of historical rework batches passing through the target process step.
At this time, the rework reference time is obtained by calculation, and is more objective and effective.
As an example, the rework reference time may be a median value of rework times of the respective historical rework lots through the target process step. At this time, the influence of accidental interference factors can be filtered.
Of course, the rework reference time may be obtained by other calculation methods, for example, the rework reference time may also be an average of the rework times of the historical rework batches passing through the target process step.
It should be understood that although the various steps in the flowcharts of fig. 1-3 are shown in order as indicated by the arrows, the steps are not necessarily performed in order as indicated by the arrows. The steps are not performed in the exact order shown and described, and may be performed in other orders, unless explicitly stated otherwise. Moreover, at least some of the steps in fig. 1-3 may include multiple steps or multiple stages, which are not necessarily performed at the same time, but may be performed at different times, and the order of performing the steps or stages is not necessarily sequential, but may be performed alternately or alternately with other steps or at least some of the steps or stages in other steps.
In one embodiment, referring to fig. 5, a semiconductor static simulation system is provided, which includes: the device comprises an acquisition module 100, a calculation module 200, a judgment module 300 and a control module 400.
The obtaining module 100 is configured to obtain a standard cycle time, a rework probability threshold, and a rework reference time of a target process step.
The calculation module 200 is configured to obtain a random probability that the target batch needs to be reworked after passing through the target process step through a random function, where the random probability is greater than or equal to 0 and less than or equal to 1.
The determining module 300 is configured to determine whether the random probability is smaller than a rework probability threshold.
The control module 400 is configured to obtain an estimated rework time of the target batch according to the rework reference time when the random probability is smaller than the rework probability threshold, and obtain an estimated cycle time of the target batch in the target process step according to a sum of the standard cycle time and the estimated rework time.
In one embodiment, the control module 400 is further configured to obtain the estimated rework time of the target batch as zero when the random probability is not less than the rework probability threshold.
In one embodiment, the obtaining module 100 is further configured to obtain the rework fluctuation time of the target lot. The control module 400 is configured to obtain an estimated rework time of the target batch according to the rework reference time and the rework fluctuation time.
In one embodiment, the obtaining module 100 is configured to obtain a fluctuation coefficient of a target process step, and obtain a rework fluctuation time of a target batch according to the fluctuation coefficient and the random probability. The control module 400 is configured to obtain an estimated rework time of the target batch according to the rework reference time and the rework fluctuation time.
In one embodiment, the obtaining module 100 obtains the fluctuation coefficient of the target process step and also obtains a time correction constant, and the time correction constant is used for adjusting the rework reference time.
In one embodiment, the obtaining module 100 is further configured to obtain the historical rework time range of the target process step according to actual rework times of a plurality of historical rework batches passing through the target process step.
Referring to fig. 6, the system further includes a parameter adjustment module 500. The parameter adjusting module 500 is configured to obtain an initial fluctuation coefficient and an initial time correction constant, and adjust the fluctuation coefficient and the time correction constant until a difference between an estimated rework time range and a historical rework time range is controlled within a preset range.
In one embodiment, the parameter adjustment module 500 adjusts the ripple factor and the time correction constant simultaneously.
In one embodiment, the obtaining module 100 is configured to obtain the rework probability threshold according to a rework rate of the multiple sets of historical lots through the target process step.
In one embodiment, the obtaining module 100 is configured to obtain the rework reference time according to actual rework times of a plurality of historical rework batches passing through the target process step.
For specific limitations of the semiconductor static simulation system, reference may be made to the above limitations of the semiconductor static simulation method, which are not described herein again. The modules in the semiconductor static simulation system can be wholly or partially realized by software, hardware and a combination thereof. The modules can be embedded in a hardware form or independent of a processor in the computer device, and can also be stored in a memory in the computer device in a software form, so that the processor can call and execute operations corresponding to the modules. It should be noted that, in the embodiment of the present application, the division of the module is schematic, and is only one logic function division, and another division manner may be available in actual implementation.
In one embodiment, there is also provided a computer device comprising a memory and a processor, the memory having a computer program stored therein, the processor when executing the computer program implementing the steps of:
step S100, acquiring standard cycle time, a rework probability threshold value and rework reference time of a target process step;
step S200, acquiring the random probability of the target batch needing reworking after the target process step through a random function, wherein the random probability is more than or equal to 0 and less than or equal to 1;
step S300, judging whether the random probability is smaller than a rework probability threshold;
step S500, if the random probability is smaller than the rework probability threshold, obtaining estimated rework time of the target batch after the target process step according to the rework reference time;
and step S700, obtaining the estimated cycle time of the target batch in the target process step according to the sum of the standard cycle time and the estimated rework time.
In one embodiment, the processor when executing the computer program further performs the steps of:
and step S600, if the random probability is not less than the rework probability threshold, acquiring the estimated rework time of the target batch as zero.
In one embodiment, the processor, when executing the computer program, further performs the steps of:
step S400, the rework fluctuation time of the target batch is obtained.
At this time, in step S500, the estimated rework time of the target batch is obtained according to the rework reference time and the rework fluctuation time.
In one embodiment, the processor, when executing the computer program, further performs the steps of:
acquiring a fluctuation coefficient of a target process step; and acquiring the rework fluctuation time of the target batch according to the fluctuation coefficient and the random probability.
In one embodiment, the processor when executing the computer program further performs the steps of:
and acquiring a time correction constant while acquiring the fluctuation coefficient of the target process step, wherein the time correction constant is used for adjusting the rework reference time.
In one embodiment, the processor, when executing the computer program, further performs the steps of:
acquiring a historical reworking time range of the target process step according to the actual reworking time of the plurality of historical reworking batches subjected to the target process step; and acquiring an initial fluctuation coefficient and an initial time correction constant, and adjusting the fluctuation coefficient and the time correction constant until the difference between the estimated rework time range and the historical rework time range is controlled within a preset range.
In one embodiment, the processor when executing the computer program further performs the steps of:
the fluctuation coefficient and the time correction constant are adjusted at the same time.
In one embodiment, the processor when executing the computer program further performs the steps of:
and acquiring a rework probability threshold according to the rework rates of the multiple groups of historical batches subjected to the target process step.
In one embodiment, the processor, when executing the computer program, further performs the steps of: and acquiring the rework reference time according to the actual rework time of the plurality of historical rework batches passing through the target process step.
In one embodiment, a computer-readable storage medium is provided, having a computer program stored thereon, which when executed by a processor, performs the steps of:
step S100, standard cycle time, a rework probability threshold value and rework reference time of a target process step are obtained;
step S200, acquiring the random probability of the target batch needing reworking after the target process step through a random function, wherein the random probability is more than or equal to 0 and less than or equal to 1;
step S300, judging whether the random probability is smaller than a rework probability threshold value;
step S500, if the random probability is smaller than the rework probability threshold, obtaining estimated rework time of the target batch after the target process step according to the rework reference time;
and S700, obtaining the estimated cycle time of the target batch in the target process step according to the sum of the standard cycle time and the estimated rework time.
In one embodiment, the computer program when executed by the processor further performs the steps of:
and step S600, if the random probability is not less than the rework probability threshold, acquiring the estimated rework time of the target batch as zero.
In one embodiment, the computer program when executed by the processor further performs the steps of:
step S400, the rework fluctuation time of the target batch is obtained.
In step S500, the estimated rework time of the target batch is obtained according to the rework reference time and the rework fluctuation time.
In one embodiment, the computer program when executed by the processor further performs the steps of:
acquiring a fluctuation coefficient of a target process step; and acquiring the rework fluctuation time of the target batch according to the fluctuation coefficient and the random probability.
In one embodiment, the computer program when executed by the processor further performs the steps of:
and acquiring a time correction constant while acquiring the fluctuation coefficient of the target process step, wherein the time correction constant is used for adjusting the rework reference time.
In one embodiment, the computer program when executed by the processor further performs the steps of:
acquiring a historical rework time range of the target process step according to actual rework time of a plurality of historical rework batches subjected to the target process step; and acquiring an initial fluctuation coefficient and an initial time correction constant, and adjusting the fluctuation coefficient and the time correction constant until the difference between the estimated rework time range and the historical rework time range is controlled within a preset range.
In one embodiment, the computer program when executed by the processor further performs the steps of:
the fluctuation coefficient and the time correction constant are adjusted at the same time.
In one embodiment, the computer program when executed by the processor further performs the steps of:
and acquiring a rework probability threshold according to the rework rates of the plurality of groups of historical batches passing through the target process step.
In one embodiment, the computer program when executed by the processor further performs the steps of: and acquiring the rework reference time according to the actual rework time of the plurality of historical rework batches passing through the target process step.
It will be understood by those skilled in the art that all or part of the processes of the methods of the embodiments described above can be implemented by hardware instructions of a computer program, which can be stored in a non-volatile computer-readable storage medium, and when executed, can include the processes of the embodiments of the methods described above. Any reference to memory, storage, database or other medium used in the embodiments provided herein can include at least one of non-volatile and volatile memory. Non-volatile Memory may include Read-Only Memory (ROM), magnetic tape, floppy disk, flash Memory, optical Memory, or the like. Volatile Memory can include Random Access Memory (RAM) or external cache Memory. By way of illustration and not limitation, RAM can take many forms, such as Static Random Access Memory (SRAM) or Dynamic Random Access Memory (DRAM), among others.
In the description herein, references to the term "one embodiment" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, a schematic description of the above terminology may not necessarily refer to the same embodiment or example.
All possible combinations of the technical features in the above embodiments may not be described for the sake of brevity, but should be considered as being within the scope of the present disclosure as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is specific and detailed, but not to be understood as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (16)
1. A static simulation method of a semiconductor process cycle is characterized by comprising the following steps:
acquiring standard cycle time, a rework probability threshold and rework reference time of a target process step;
obtaining the random probability of the target batch needing to be reworked after the target process step through a random function, wherein the random probability is more than or equal to 0 and less than or equal to 1;
judging whether the random probability is smaller than the rework probability threshold;
if the random probability is smaller than the rework probability threshold, obtaining estimated rework time of the target batch after the target process step according to the rework reference time;
and obtaining the estimated cycle time of the target batch in the target process step according to the sum of the standard cycle time and the estimated rework time.
2. The static simulation method of claim 1, wherein after determining whether the random probability is less than the rework probability threshold, further comprising:
and if the random probability is not smaller than the rework probability threshold, acquiring the estimated rework time of the target batch as zero.
3. The static simulation method of claim 1, wherein the random function has a value ranging from 0 to 1, and the random probability is a value of the random function.
4. The static simulation method of claim 1,
before the estimated rework time of the target batch after the target process step is obtained according to the rework reference time, the method further includes:
acquiring the rework fluctuation time of the target batch;
the obtaining of the estimated rework time of the target batch after the target process step according to the rework reference time includes:
and acquiring the estimated rework time of the target batch according to the rework reference time and the rework fluctuation time.
5. The static simulation method of claim 4,
the obtaining of the rework fluctuation time of the target batch includes:
acquiring a fluctuation coefficient of the target process step;
and acquiring the rework fluctuation time of the target batch according to the fluctuation coefficient and the random probability.
6. The static simulation method of claim 5, wherein a time correction constant is obtained while obtaining the fluctuation coefficient of the target process step, and the time correction constant is used for adjusting the rework reference time.
7. The static simulation method of claim 6, wherein the method for obtaining the fluctuation coefficient and the time constant comprises:
acquiring a historical rework time range of the target process step according to actual rework time of a plurality of historical rework batches passing through the target process step;
and acquiring an initial fluctuation coefficient and an initial time correction constant, and adjusting the fluctuation coefficient and the time correction constant until the difference between the estimated rework time range and the historical rework time range is controlled within a preset range.
8. The static simulation method of claim 7, wherein the ripple factor and the time correction constant are adjusted simultaneously.
9. The static simulation method of claim 1, wherein obtaining the rework probability threshold for the target process step comprises:
and acquiring the rework probability threshold according to the rework rates of the plurality of groups of historical batches passing through the target process step.
10. The static simulation method of claim 1, wherein obtaining the rework reference time for the target process step comprises:
and acquiring the rework reference time according to the actual rework time of the plurality of historical rework batches subjected to the target process step.
11. The static simulation method of claim 10, wherein the rework reference time is a median or mean of rework times of each historical rework lot that passed through the target process step.
12. A semiconductor static simulation system, comprising:
the system comprises an acquisition module, a processing module and a processing module, wherein the acquisition module is used for acquiring standard cycle time, a rework probability threshold and rework reference time of a target process step;
the calculation module is used for acquiring the random probability of the target batch needing reworking after the target process step through a random function, wherein the random probability is more than or equal to 0 and less than or equal to 1;
the judging module is used for judging whether the random probability is smaller than the rework probability threshold value;
and the control module is used for acquiring the estimated rework time of the target batch according to the rework reference time when the random probability is smaller than the rework probability threshold, and acquiring the estimated cycle time of the target batch in the target process step according to the sum of the standard cycle time and the estimated rework time.
13. The semiconductor static simulation system of claim 12,
the obtaining module is further used for obtaining a fluctuation coefficient of the target process step and obtaining the rework fluctuation time of the target batch according to the fluctuation coefficient and the random probability;
and the control module is used for acquiring the estimated rework time of the target batch according to the rework reference time and the rework fluctuation time.
14. The semiconductor static simulation system of claim 13,
the acquisition module acquires a time correction constant while acquiring the fluctuation coefficient of the target process step, wherein the time correction constant is used for adjusting the rework reference time;
the obtaining module is further configured to obtain a historical rework time range of the target process step according to actual rework times of the plurality of historical rework batches subjected to the target process step;
the system also comprises a parameter adjusting module, wherein the parameter adjusting module is used for acquiring an initial fluctuation coefficient and an initial time correction constant, and adjusting the fluctuation coefficient and the time correction constant until the difference between the estimated rework time range and the historical rework time range is controlled within a preset range.
15. A computer device comprising a memory and a processor, the memory storing a computer program, characterized in that the processor realizes the steps of the method of any one of claims 1 to 11 when executing the computer program.
16. A computer-readable storage medium, on which a computer program is stored, which, when being executed by a processor, carries out the steps of the method of any one of claims 1 to 11.
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