CN114789167A - Particle removing device and removing method - Google Patents
Particle removing device and removing method Download PDFInfo
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- CN114789167A CN114789167A CN202210714798.0A CN202210714798A CN114789167A CN 114789167 A CN114789167 A CN 114789167A CN 202210714798 A CN202210714798 A CN 202210714798A CN 114789167 A CN114789167 A CN 114789167A
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- pressure
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- injection
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/04—Cleaning by suction, with or without auxiliary action
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Abstract
The invention belongs to the technical field of display panel manufacturing, and particularly discloses a particle removing device and a particle removing method. The particle removing device comprises a pulse gas generating assembly and an injection assembly, wherein the injection assembly is provided with an injection cavity and a recovery cavity which are not communicated with each other, the recovery opening of the recovery cavity surrounds a jet orifice of the injection cavity, the recovery cavity is in a negative pressure state, and the pulse gas generating assembly is used for providing high-pressure pulse gas for the injection cavity. During cleaning operation, the jet orifice faces the surface to be cleaned, and high-pressure pulse gas generated by the pulse gas generating assembly is jetted to the surface to be cleaned through the jet orifice to blow and suspend particles on the surface to be cleaned; under the suction action of the recovery cavity in a negative pressure state, the blown suspended particles enter the recovery cavity from the recovery port, and the surface to be cleaned is cleaned. The high-pressure pulse gas can effectively destroy the boundary layer between the high-pressure pulse gas and the surface to be cleaned, and generates larger impact force on the surface to be cleaned, so that more particles with smaller size are blown up, and the cleaning effect is good.
Description
Technical Field
The invention relates to the technical field of display panel manufacturing, in particular to a particle removing device and a particle removing method.
Background
In the process of manufacturing display screens or semiconductor wafers, it is necessary to clean the particles on the surface of the products, otherwise, the particles may cause the products to be bad, and the moisture content of the surface of the products is very strict in some process stages, which do not allow the particles to be cleaned by a wet method, but only by a dry method.
The existing dry cleaning method mainly comprises two methods: plasma cleaning methods and vacuum pumping methods. The plasma cleaning method is characterized in that oxygen in the air is bombarded by plasma, so that monatomic oxygen and ozone molecules are generated, and the monatomic oxygen has strong oxidizing property, so that organic pollutants attached to the surface of a product can be effectively removed, but inorganic pollutants such as dust, scraps and the like cannot be removed. However, in the current display factory, organic contaminants on the display glass surface are very difficult to be generated in the process stage requiring dry cleaning, while inorganic particulate contaminants are more effectively removed, so that the application of the plasma cleaning method is more limited. The vacuum suction method is to suck dust on the surface of the display glass by using a vacuum pump, but it is difficult to effectively remove particles with small sizes (such as micron-sized particles).
Disclosure of Invention
The invention aims to provide a particle removing device and a particle removing method, which can effectively remove tiny organic particles and inorganic particles on the surface of a product and have a good cleaning effect.
In order to realize the purpose, the following technical scheme is provided:
in a first aspect, a particle removing device is provided, which comprises a pulse gas generating assembly and an injection assembly, wherein the injection assembly is provided with an injection cavity and a recovery cavity which are not communicated with each other, the recovery port of the recovery cavity surrounds the injection port of the injection cavity, the recovery cavity is in a negative pressure state, and the pulse gas generating assembly is used for providing high-pressure pulse gas for the injection cavity.
Optionally, the pulse gas generating assembly comprises a high pressure gas supply assembly and a pulse generating assembly, the pulse generating assembly comprising:
the stator is internally provided with an accommodating cavity, a first air passage and a second air passage;
the rotor is provided with at least one third air passage and movably arranged in the accommodating cavity so that the first air passage and the second air passage are communicated through the at least one third air passage;
and when the third air passage is communicated with the first air passage and the second air passage, high-pressure gas in the high-pressure gas supply assembly sequentially passes through the first air passage, the third air passage and the second air passage and then enters the injection cavity.
Optionally, the pulse gas generating assembly further includes a driving element, an output end of the driving element is connected to the mover to drive the mover to move in the accommodating cavity, and an output speed of the output end of the driving element is adjustable.
Optionally, the high pressure gas supply subassembly includes first gas supply subassembly and second gas supply subassembly, first gas supply subassembly with the second gas supply subassembly alternatively to the pulse produces the subassembly and provides high-pressure gas, the high-pressure gas's that first gas supply subassembly provided pressure is greater than the high-pressure gas's that the second gas supply subassembly provided pressure.
Optionally, the pulse gas generating assembly further comprises a bypass pipeline, one end of the bypass pipeline is communicated with the gas outlet of the high-pressure gas supply assembly, the other end of the bypass pipeline is communicated with the injection cavity, and a bypass valve is arranged on the bypass pipeline.
Optionally, the pulse gas generation assembly further comprises a first filter disposed between the pulse generation assembly and the injection assembly.
Optionally, the injection cavity comprises an acceleration cavity and a uniform pressure cavity which are communicated with each other, and the high-pressure pulse gas is ejected out of the injection port after sequentially flowing through the acceleration cavity and the uniform pressure cavity.
Optionally, the spray assembly includes a spray housing on which the spray chamber and the recovery chamber are configured.
In a second aspect, there is provided a particle removing method using the particle removing apparatus as described above, the particle removing method including:
s1, the pulse gas generating assembly provides the generated high-pressure pulse gas to an injection cavity of the injection assembly;
s2, spraying the high-pressure pulse gas in the spraying cavity to the surface to be cleaned through the spraying opening, and blowing up the particles on the surface to be cleaned by the high-pressure pulse gas;
and S3, allowing the blown particles to enter a recovery cavity of the injection assembly through a recovery port.
Optionally, the bypass valve conducts a bypass line, and a part of high-pressure gas in the high-pressure gas supply assembly enters the injection cavity of the injection assembly through the bypass line.
The invention has the beneficial effects that:
according to the particle cleaning device and the cleaning method provided by the invention, when cleaning operation is carried out, the jet orifice faces to the surface to be cleaned, high-pressure pulse gas generated by the pulse gas generating assembly is jetted to the surface to be cleaned through the jet orifice of the jet cavity, and particles on the surface to be cleaned are blown and suspended; under the suction action of the recovery cavity in a negative pressure state, the blown suspended particles enter the recovery cavity through the recovery port, so that the surface to be cleaned is cleaned. The high-pressure pulse gas, namely the high-pressure gas injected at intervals, is provided for the surface to be cleaned, and the high-pressure gas injected at intervals can effectively break a boundary layer between the high-pressure pulse gas and the surface to be cleaned, so that larger impact force can be generated on the surface to be cleaned, more particles with smaller size can be blown, and the cleaning effect is improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments of the present invention will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the contents of the embodiments of the present invention and the drawings without creative efforts.
FIG. 1 is a schematic view of a particle removal apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a pulse generating assembly according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a high pressure gas supply assembly provided by an embodiment of the present invention;
FIG. 4 is a schematic view of a jetting assembly provided by an embodiment of the present invention;
FIG. 5 is a schematic diagram of a negative pressure generating assembly, a fourth pressure gauge, a second filter, and a fifth pressure gauge according to an embodiment of the present invention;
FIG. 6 is a graph of the flow rate of gas injected onto a surface to be cleaned during a single stator rotation cycle with a bypass valve closed according to an embodiment of the present invention;
FIG. 7 is a graph of the flow rate of gas injected onto a surface to be cleaned during one cycle of stator rotation with the bypass valve open according to an embodiment of the present invention.
Reference numerals are as follows:
100. a surface to be cleaned;
1. a pulse gas generating assembly; 2. a spray assembly; 3. a negative pressure generating assembly; 4. a fourth pressure gauge; 5. a second filter; 6. a fifth pressure gauge;
11. a high pressure gas supply assembly; 12. a pulse generating component; 13. a bypass line; 14. a bypass valve; 15. a first filter; 16. a second pressure gauge; 17. a third pressure gauge;
111. a first gas supply assembly; 112. a second gas supply assembly;
1111. an intake valve; 1112. a pressure regulating valve; 1113. a first shut-off valve; 1114. a first pressure gauge;
1121. a high pressure fan; 1122. a second stop valve;
121. a stator; 1211. an accommodating cavity; 1212. a first air passage; 1213. a second air passage;
122. a mover; 1221. a third air passage;
123. a drive member;
21. a spray housing; 22. an ejection chamber; 23. a recovery chamber;
221. an acceleration chamber; 221a, an air inlet;
222. a uniform pressure chamber; 2221. a first uniform pressure chamber; 2222. a second uniform pressure cavity; 2222a, an ejection port;
23a, a recovery port; 23b, an exhaust port.
Detailed Description
In order to make the technical problems solved, technical solutions adopted and technical effects achieved by the present invention clearer, the technical solutions of the embodiments of the present invention will be described in further detail below with reference to the accompanying drawings. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. Wherein the terms "first position" and "second position" are two different positions.
In the description of the present invention, it should be noted that the terms "mounted," "connected," and "connected" are to be construed broadly and encompass, for example, both fixed and removable connections unless otherwise explicitly stated or limited; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The present invention provides a particle removing apparatus, which can be mainly applied to the preparation of display screens or semiconductors, and is used to remove particles on display panels or wafers, wherein the size of the removed particles can be as small as micron level. As shown in fig. 1, the particle removing apparatus of the present embodiment includes a pulse gas generating assembly 1 and a spraying assembly 2. The direction of flow of the gas is indicated by arrows in fig. 1. The pulse gas generating assembly 1 is used for generating high-pressure pulse gas. The injection assembly 2 is provided with an injection cavity 22 and a recovery cavity 23 which are not communicated with each other. The recovery port 23a of the recovery chamber 23 is provided around the ejection port 2222a of the ejection chamber 22, and the recovery chamber 23 is in a negative pressure state. The pulse gas generating assembly 1 is used for supplying high-pressure pulse gas to the injection cavity 22 of the injection assembly 2, and the high-pressure pulse gas entering the injection cavity 22 is ejected through the injection port 2222 a.
When the cleaning operation is performed, the injection port 2222a is made to face the surface 100 to be cleaned, the high-pressure pulse gas generated by the pulse gas generating assembly 1 is injected to the surface 100 to be cleaned through the injection port 2222a of the injection cavity 22, and the particulate matters on the surface 100 to be cleaned are blown up and suspended; under the suction action of the recovery chamber 23 in a negative pressure state, the blown-up suspended particulate matter enters the recovery chamber 23 through the recovery port 23a, thereby cleaning the surface 100 to be cleaned. The blown-up particulate matter is suspended around the injection port 2222a, and for this reason, the recovery port 23a is provided around the injection port 2222a so that the blown-up suspended particulate matter can enter the recovery chamber 23 from the recovery port 23a as much as possible.
When a constant flow rate of gas is injected against the surface 100 to be cleaned, a boundary layer exists. Due to the existence of the boundary layer, the closer to the surface 100 to be cleaned, the lower the flow velocity of the injected gas, the smaller the kinetic energy of the gas, and there is not enough energy to blow up particles (especially small-sized particles) attached to the surface 100 to be cleaned, so that the cleaning effect is limited. The particle cleaning device of the embodiment provides high-pressure pulse gas, namely high-pressure gas injected at intervals to the surface to be cleaned 100, and the high-pressure gas injected at intervals can effectively break a boundary layer between the high-pressure pulse gas and the surface to be cleaned 100, so that a larger impact force can be generated on the surface to be cleaned 100, more particles with smaller size can be blown up, and the cleaning effect is improved. The size range of the particles which can be removed by the existing dry cleaning method is more than 5 μm, while the size range of the particles which can be dry-cleaned by the embodiment is enlarged to more than 3 μm, and the cleaning effect is better.
It should be noted that, in the present embodiment, the pressure of the high-pressure pulse gas applied inside the ejection chamber 22 is about 0.3Mpa, and the maximum pressure value is about 0.7Mpa, which is sufficient for removing micron-sized particles from the display panel. When the purging operation is performed, the pressure of the high-pressure pulse gas acting inside the injection chamber 22 may be adjusted to 0.3Mpa to 0.7Mpa, and if the purging effect is good, the pressure of the high-pressure pulse gas acting inside the injection chamber 22 may be gradually reduced, provided that the purging effect can be ensured.
It can be understood that the cleaning effect can be improved by adjusting the frequency of the high-pressure pulse gas (i.e. the number of times of spraying the high-pressure gas in a certain period of time) and the spraying pressure to effectively break the boundary layer between the high-pressure pulse gas and the surface 100 to be cleaned. Illustratively, the frequency of the high-pressure pulsed gas may be up to 700Hz-1000 Hz.
Alternatively, the pulse gas generation assembly 1 includes a high pressure gas supply assembly 11 and a pulse generation assembly 12. The high-pressure gas supply assembly 11 is used to supply high-pressure gas to the pulse generating assembly 12. The pulse generating assembly 12 is used to convert the high pressure gas into high pressure pulse gas, so that the high pressure gas is intermittently sprayed to the surface 100 to be cleaned. Referring to fig. 1 and 2, the pulse generating assembly 12 includes a stator 121 and a mover 122. The stator 121 is provided therein with a receiving cavity 1211, a first air passage 1212, and a second air passage 1213. At least one third air passage 1221 is provided on the mover 122. The mover 122 is movably disposed in the accommodating cavity 1211, so that the at least one third air passage 1221 connects or disconnects the first air passage 1212 and the second air passage 1213. The direction of flow of the gas is indicated by arrows in fig. 2. When the third air passage 1221 connects the first air passage 1212 and the second air passage 1213, the high-pressure air in the high-pressure air supply assembly 11 sequentially passes through the first air passage 1212, the third air passage 1221, and the second air passage 1213, and then enters the injection cavity 22 of the injection assembly 2. When the mover 122 cuts off the first air passage 1212 and the second air passage 1213, high-pressure air cannot enter the injection chamber 22 of the injection assembly 2 through the first air passage 1212 and the second air passage 1213. In this way, by alternately switching on and off the first air passage 1212 and the second air passage 1213, the high-pressure gas is intermittently introduced into the ejection chamber 22 and is eventually ejected to the surface to be cleaned 100, so that the continuous high-pressure gas supplied from the high-pressure gas supply assembly 11 is converted into the intermittent high-pressure gas (i.e., the high-pressure pulse gas).
Optionally, the pulse gas generating assembly 1 further includes a driving element 123, an output end of the driving element 123 is connected to the mover 122 to drive the mover 122 to move in the accommodating cavity 1211, and an output speed of the output end of the driving element 123 is adjustable. The output speed of the output end of the driving member 123 is adjusted, so that the moving speed of the mover 122 in the accommodating cavity 1211 is adjusted, and the frequency of the third air passage 1221 for connecting and disconnecting the first air passage 1212 and the second air passage 1213 is adjusted, that is, the frequency of the high-pressure pulse gas is adjusted, so that the boundary layer is effectively damaged, and a good cleaning effect is achieved. Illustratively, the drive 123 is a servo motor.
In this embodiment, the mover 122 rotates in the receiving cavity 1211, so that the third air passage 1221 connects or disconnects the first air passage 1212 and the second air passage 1213. In other embodiments, the driving member 122 may be configured to move within the accommodating cavity 1211 to enable the third air passage 1221 to connect or disconnect the first air passage 1212 and the second air passage 1213.
In this embodiment, two third air passages 1221 are provided, and when the mover 122 rotates for one cycle, the two third air passages 1221 respectively conduct the first air passage 1212 and the second air passage 1213 once. In other embodiments, one or more third air passages 1221 may be disposed on the mover 122, so that when the mover 122 rotates for one period, the first air passage 1212 and the second air passage 1213 are conducted one or more times, thereby adjusting the frequency of the high-pressure pulse gas. Alternatively, the stator 121 may be opened so that the mover 122 having a different number of the third air passages 1221 may be replaced.
Alternatively, referring to fig. 1 and 3, the high pressure gas supply assembly 11 includes a first gas supply assembly 111 and a second gas supply assembly 112, the first gas supply assembly 111 and the second gas supply assembly 112 alternatively supply high pressure gas to the pulse generating assembly 12, and the pressure of the high pressure gas supplied from the first gas supply assembly 111 is greater than that of the high pressure gas supplied from the second gas supply assembly 112. Due to the difference in adhesion force caused by van der waals force of the surface 100 to be cleaned or physical properties of the particles, such as static electricity or surface tension, the particles with larger adhesion force are difficult to remove, and high-pressure pulse gas with larger injection pressure is required to impact the surface 100 to be cleaned. When the particles on the surface 100 to be cleaned have a weak adhesion force and are easy to remove, the surface 100 to be cleaned may be impacted by high-pressure pulse gas with a small injection pressure. Through setting up the first air feed subassembly 111 and the second air feed subassembly 112 that the pressure is different to the alternative is used, guarantees to treat the clean effect of cleaning face 100, reduces the energy consumption simultaneously, saves the cost.
Optionally, the first air supply assembly 111 includes a high pressure air source (not shown), an air inlet valve 1111, a pressure regulating valve 1112, and a first stop valve 1113, which are arranged in sequence. The high-pressure gas source is high-pressure gas with larger pressure, such as compressed air or compressed nitrogen and the like. The high-pressure air source is communicated with the pulse generating assembly 12 through a first pipeline, and the air inlet valve 1111, the pressure regulating valve 1112 and the first stop valve 1113 are all arranged on the first pipeline. When the air inlet valve 1111 is opened, high-pressure air in the high-pressure air source enters the first pipeline. When the first stop valve 1113 opens the first pipeline, the high-pressure gas in the first pipeline flows into the pulse generating assembly 12. The pressure regulating valve 1112 is for regulating the flow rate of the high-pressure gas in the first line.
Further optionally, the first gas supply assembly 111 further includes a first pressure gauge 1114 disposed on the first pipeline, the first pressure gauge 1114 being configured to detect a pressure in the first pipeline. When the pressure detected by first pressure gauge 1114 decreases, the opening degree of intake valve 1111 is increased; when the pressure detected by the first pressure gauge 1114 rises, the opening degree of the intake valve 1111 is decreased.
Optionally, second air supply assembly 112 includes a high pressure blower 1121 and a second shutoff valve 1122. An air outlet of the high pressure fan 1121 is communicated with the pulse generating assembly 12 through a second pipeline. The second shut-off valve 1122 is provided on the second pipe. When the high pressure fan 1121 is started, surrounding air is sucked into the high pressure fan 1121 through an air inlet on the high pressure fan 1121, the high pressure fan 1121 rotates and accelerates the sucked air, and the accelerated air flows into the second pipeline through an air outlet. When the second shut-off valve 1122 opens the second conduit, the accelerated air enters the pulse generating assembly 12. When second cutoff valve 1122 cuts off the second pipe, high pressure fan 1121 does not operate. The pressure of the accelerated air is less than the pressure of the high-pressure gas in the high-pressure gas source.
Illustratively, the maximum pressure of the high-pressure gas supplied by the first gas supply assembly 111 is about 0.7MPa, and the pressure of the high-pressure gas acting inside the final injection chamber 22 is about 0.3MPa to about 0.7MPa after being adjusted by a pressure adjusting member (e.g., a pressure adjusting valve 1112). The pressure of the high-pressure gas supplied by the second gas supply assembly 112 is about 0.01MPa, and the pressure of the high-pressure gas acting in the final injection chamber 22 is about 0.006MPa to 0.01MPa after being adjusted by the pressure adjusting member.
Optionally, referring to fig. 1 and fig. 2 again, the pulse gas generating assembly 1 further includes a bypass line 13, one end of the bypass line 13 is communicated with the gas outlet of the high-pressure gas supply assembly 11, the other end is communicated with the injection cavity 22 of the injection assembly 2, and the bypass line 13 is provided with a bypass valve 14. During cleaning, the bypass valve 14 always conducts the bypass line 13, and a part of high-pressure gas is always sprayed to the surface 100 to be cleaned through the spraying chamber 22. Fig. 6 and 7 show the gas flow rate profile injected to the surface to be cleaned 100 during one rotation cycle of the stator 121 in both the cases of opening and closing the bypass valve 14. If the bypass pipeline 13 is not provided or the bypass valve 14 is not provided to cut off the bypass pipeline 13, only the high-pressure pulse gas generated by the pulse generating assembly 12 is sprayed to the surface to be cleaned 100, and then at the moment that the first air channel 1212 and the second air channel 1213 in the stator 121 are in a cut-off state, no high-pressure gas is sprayed to the surface to be cleaned 100, at this moment, the suspended particulate matters blown up before are easy to adhere to the surface to be cleaned 100 again, and the particulate matters with large adhesive force cannot be separated from the surface to be cleaned 100 with a certain probability, therefore, under the condition that the boundary layer breaking effect is not affected, a small amount of high-pressure gas is continuously supplied to the injection cavity 22 through the bypass pipeline 13, and can be prevented from adhering to the surface to be cleaned 100 again when the first air channel 1212 and the second air channel 1213 of the stator 121 are cut off, so that the cleaning effect is improved.
Optionally, referring to fig. 1 and 2, the pulse gas generation assembly 1 further comprises a first filter 15, the first filter 15 being disposed between the pulse generation assembly 12 and the injection assembly 2. The first filter 15 filters the high-pressure pulse gas generated by the pulse gas generating assembly 1, so as to prevent the high-pressure pulse gas from containing impurities to pollute the surface 100 to be cleaned.
Further alternatively, a second pressure gauge 16 and a third pressure gauge 17 are provided upstream and downstream of the first filter 15, respectively. When the pressure values detected by the second pressure gauge 16 and the third pressure gauge 17 are different greatly, it indicates that the pressure loss of the first filter 15 reaches the limit, and the first filter 15 should be replaced with a new one in time.
Alternatively, referring to fig. 1 and 4, the spray chamber 22 includes an acceleration chamber 221 and a uniform pressure chamber 222 communicating with each other. The direction of flow of the gas is indicated by arrows in both fig. 1 and 4. The high-pressure pulse gas flows through the acceleration chamber 221 and the uniform pressure chamber 222 in sequence, and is ejected from the ejection port 2222 a. The acceleration chamber 221 has an air inlet 221 a. The high-pressure pulse gas generated by the pulse gas generating assembly 1 firstly enters the accelerating cavity 221 through the gas inlet 221a, enters the uniform pressure cavity 222 after being accelerated in the accelerating cavity 221, is decelerated and fully uniformly pressurized in the uniform pressure cavity 222 and then is ejected out through the ejection opening 2222a, so that the uniformity of the gas ejected out through the ejection opening 2222a is kept highly consistent, and the consistency of the impact force on the particulate matters on the surface 100 to be cleaned is ensured.
Alternatively, the uniform pressure chamber 222 includes a first uniform pressure chamber 2221 and a second uniform pressure chamber 2222 that communicate with each other. The high-pressure pulse gas flowing out of the acceleration chamber 221 sequentially flows through the first equalizing chamber 2221 and the second equalizing chamber 2222 and is then ejected from the ejection opening 2222a, i.e., the high-pressure pulse gas is equalized twice, so that the uniformity of the gas ejected from the ejection opening 2222a is further improved. Illustratively, the first uniform pressure chamber 2221 is a cylindrical bore; the second equalizing chamber 2222 is a spherical hole.
Optionally, the injection assembly 2 comprises an injection housing 21, and an injection cavity 22 and a recovery cavity 23 are configured on the injection housing 21. That is, the injection chamber 22 and the recovery chamber 23 are both disposed on the same entity, which is convenient for processing, and can ensure the relative position of the recovery port 23a of the recovery chamber 23 and the injection port 2222a of the injection chamber 22, so that the suspended particulate matters blown up can be sucked into the recovery chamber 23 from the recovery port 23a as much as possible. Illustratively, the recovery chamber 23 is disposed around the injection chamber 22.
Optionally, referring to fig. 1 and 5, the particle removing device further comprises a negative pressure generating assembly 3, and the negative pressure generating assembly 3 is communicated with the recovery cavity 23 of the jetting assembly 2 through a recovery pipeline so as to enable the recovery cavity 23 to be under pressure. The recovery chamber 23 has an exhaust port 23b, and an end of the recovery line remote from the negative pressure generating member 3 communicates with the exhaust port 23 b. The discharge port of the negative pressure generating assembly 3 is optionally in communication with a plant exhaust system. The negative pressure generating assembly 3 is illustratively a vacuum pump.
Further optionally, the suction inlet of the negative pressure generating assembly 3 is provided with a fourth pressure gauge 4 for monitoring the exhaust pressure of the recovery chamber 23, maintaining the stability of the exhaust pressure, and thereby ensuring the recovery effect.
Optionally, the outlet of the negative pressure producing assembly 3 is provided with a second filter 5 for filtering and collecting the particulate matter drawn from the recovery chamber 23. Further optionally, a fifth pressure gauge 6 is arranged upstream of the second filter 5 for monitoring the status of the second filter 5 and for timely replacement of the second filter 5 with a new one. In other embodiments, the second filter 5 may be omitted, since the particles to be removed are smaller.
The particle removing device of the embodiment provides high-pressure pulse gas, namely high-pressure gas injected at intervals to the surface 100 to be cleaned, the high-pressure gas injected at intervals can effectively destroy a boundary layer between the high-pressure pulse gas and the surface 100 to be cleaned, so that particles with more quantity and smaller size can be blown up, the size range of the particles which can be dry-cleaned is more than 3 mu m, the integral structure is simple, mass production is easy, and pain spots in the industry are solved.
The pressure referred to in the present embodiment is a relative pressure. Relative pressure refers to the difference between the actual pressure inside the device and atmospheric pressure.
The embodiment further provides a particle removing method, which adopts the above particle removing apparatus, and the particle removing method includes:
s1, the pulse gas generating assembly 1 supplies the generated high-pressure pulse gas to the injection chamber 22 of the injection assembly 2.
S2, the high-pressure pulse gas in the injection chamber 22 is injected to the surface to be cleaned 100 through the injection port 2222a, and the high-pressure pulse gas blows up the particles on the surface to be cleaned 100.
S3, the blown particles enter the recovery chamber 23 of the jetting assembly 2 through the recovery port 23 a.
The high-pressure pulse gas generated by the pulse gas generating assembly 1 is sprayed to the surface 100 to be cleaned, and the high-pressure pulse gas effectively destroys a boundary layer between the high-pressure pulse gas and the surface 100 to be cleaned, so that more particles with smaller size can be blown up, and dry cleaning of the particles with the size of more than 3 mu m is realized.
Optionally, the bypass valve 14 opens the bypass line 13, and a portion of the high-pressure gas in the high-pressure gas supply assembly 11 enters the injection chamber 22 of the injection assembly 2 through the bypass line 13. During cleaning, the bypass valve 14 always conducts the bypass pipeline 13, and a part of high-pressure gas is always sprayed to the surface to be cleaned 100 through the spraying cavity 22, so that suspended particles blown up before the moment when the first air passage 1212 and the second air passage 1213 of the stator 121 are cut off are prevented from being reattached to the surface to be cleaned 100, and the cleaning effect is improved.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. Those skilled in the art will appreciate that the present invention is not limited to the particular embodiments described herein, and that various obvious changes, rearrangements and substitutions will now be apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.
Claims (10)
1. The particle removing device is characterized by comprising a pulse gas generating assembly (1) and a spraying assembly (2), wherein the spraying assembly (2) is provided with a spraying cavity (22) and a recovery cavity (23) which are not communicated with each other, a recovery port (23 a) of the recovery cavity (23) is arranged around a spraying port (2222 a) of the spraying cavity (22), the recovery cavity (23) is in a negative pressure state, and the pulse gas generating assembly (1) is used for providing high-pressure pulse gas for the spraying cavity (22).
2. A particle removal apparatus as claimed in claim 1, wherein the pulse gas generation assembly (1) comprises a high pressure gas supply assembly (11) and a pulse generation assembly (12), the pulse generation assembly (12) comprising:
the air conditioner comprises a stator (121), wherein a containing cavity (1211), a first air passage (1212) and a second air passage (1213) are arranged in the stator (121);
the rotor (122), at least one third air channel (1221) is arranged on the rotor (122), and the rotor (122) is movably arranged in the accommodating cavity (1211) so that the at least one third air channel (1221) conducts the first air channel (1212) and the second air channel (1213);
when the third air passage (1221) conducts the first air passage (1212) and the second air passage (1213), high-pressure air in the high-pressure air supply assembly (11) sequentially passes through the first air passage (1212), the third air passage (1221) and the second air passage (1213) and then enters the injection cavity (22).
3. The particle removing apparatus according to claim 2, wherein the pulse gas generating assembly (1) further comprises a driving member (123), an output end of the driving member (123) is connected to the mover (122) to drive the mover (122) to move in the accommodating chamber (1211), and an output speed of the output end of the driving member (123) is adjustable.
4. A particle removing apparatus as claimed in claim 2, wherein the high pressure gas supply assembly (11) comprises a first gas supply assembly (111) and a second gas supply assembly (112), the first gas supply assembly (111) and the second gas supply assembly (112) alternatively providing high pressure gas to the pulse generating assembly (12), the pressure of the high pressure gas provided by the first gas supply assembly (111) being greater than the pressure of the high pressure gas provided by the second gas supply assembly (112).
5. The particle removing device according to claim 2, wherein the pulse gas generating assembly (1) further comprises a bypass line (13), one end of the bypass line (13) is communicated with the gas outlet of the high pressure gas supply assembly (11), the other end is communicated with the injection chamber (22), and a bypass valve (14) is arranged on the bypass line (13).
6. The particle removal apparatus of claim 2, wherein the pulse gas generation assembly (1) further comprises a first filter (15), the first filter (15) being disposed between the pulse generation assembly (12) and the injection assembly (2).
7. The particle removing device according to any one of claims 1 to 5, wherein the ejection chamber (22) comprises an acceleration chamber (221) and a pressure equalizing chamber (222) which are communicated with each other, and the high-pressure pulse gas is ejected from the ejection port (2222 a) after sequentially flowing through the acceleration chamber (221) and the pressure equalizing chamber (222).
8. A particle removal apparatus as claimed in any one of claims 1 to 5, wherein the spray assembly (2) comprises a spray housing (21), the spray housing (21) having the spray chamber (22) and the recovery chamber (23) formed therein.
9. A particle removing method using the particle removing apparatus according to any one of claims 1 to 8, the particle removing method comprising:
s1, the pulse gas generating assembly (1) provides the generated high-pressure pulse gas to the injection cavity (22) of the injection assembly (2);
s2, spraying high-pressure pulse gas in the spraying cavity (22) to the surface (100) to be cleaned through the spraying opening (2222 a), and blowing up particles on the surface (100) to be cleaned by the high-pressure pulse gas;
s3, the blown particles enter the recovery cavity (23) of the injection assembly (2) through the recovery port (23 a).
10. A particle removal method as claimed in claim 9, wherein the bypass conduit (13) is vented by a bypass valve (14), and a portion of the high pressure gas in the high pressure gas supply assembly (11) passes through the bypass conduit (13) and into the injection chamber (22) of the injection assembly (2).
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| CN114789167B (en) | 2022-10-14 |
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