CN114786362A - 3D printing solder paste printing machine - Google Patents
3D printing solder paste printing machine Download PDFInfo
- Publication number
- CN114786362A CN114786362A CN202210636752.1A CN202210636752A CN114786362A CN 114786362 A CN114786362 A CN 114786362A CN 202210636752 A CN202210636752 A CN 202210636752A CN 114786362 A CN114786362 A CN 114786362A
- Authority
- CN
- China
- Prior art keywords
- printing
- solder paste
- shell
- circuit board
- control panel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 30
- 238000007639 printing Methods 0.000 title claims abstract description 24
- 238000010146 3D printing Methods 0.000 title claims abstract description 23
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 3
- 239000006071 cream Substances 0.000 claims 3
- 238000003860 storage Methods 0.000 abstract description 7
- 239000000463 material Substances 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 239000002699 waste material Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 description 5
- 229910000831 Steel Inorganic materials 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0005—Apparatus or processes for manufacturing printed circuits for designing circuits by computer
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Computer Hardware Design (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention relates to the field of solder paste printing, in particular to a 3D (three-dimensional) solder paste printer, which comprises a shell, a workbench, a control panel, a circuit board, a 3D printing nozzle and a solder paste storage and supply device, wherein the position, the size, the thickness and the shape required by printing are set by editing software in a control panel 8, and the printing can be automatically started by clicking and starting the printer, so that the performance and the requirement which cannot be provided by the traditional equipment are provided, the universality is improved, the material waste is reduced, and the production cost is saved.
Description
Technical Field
The invention relates to the field of solder paste printing, in particular to a 3D printing solder paste printing machine.
Background
The solder paste printer is mainly used for printing solder paste on a welding spot of a circuit board, and is responsible for accurately printing the solder paste on the circuit board through a die-opened silk screen in the processing process of the printed circuit board.
The traditional solder paste printer mainly has the following defects: (1) the printing device has a complex structure, high requirements on the precision of equipment and increased cost; (2) the printing steel mesh used in printing has uniqueness, and the number of the steel meshes is increased along with the increase of the number of products; (3) in the printing process, the solder paste is exposed in the air for a long time, so that the temperature and the viscosity of the solder paste are changed, and the stability of the printing quality is influenced; (4) in the printing process, a large amount of solder paste is attached to equipment, and special equipment is needed to clean, so that manpower and material resources are wasted, and the production cost is increased.
Disclosure of Invention
The invention aims to overcome the defects of the technology and provides a 3D printing solder paste printer.
In order to solve the technical problems, the technical scheme provided by the invention is a 3D printing solder paste printer which comprises a shell and a workbench fixed in the shell, wherein two circuit board conveying guide rails are arranged on the upper part of the workbench and are connected with the workbench and a circuit board in a sliding manner, a solder paste storage and supply device is arranged on the upper part in the shell, a 3D printing nozzle is arranged above the inner part of the shell and is connected with the solder paste storage and supply device through a telescopic hose, a sliding rail is arranged on the upper part in the shell, and the 3D printing nozzle is vertically connected with the sliding rail through the telescopic hose.
As an improvement, a control panel is arranged outside the shell and connected with a computer.
As an improvement, the shell is provided with an observation window, and the observation window is positioned at the upper part of the control panel.
As an improvement, the 3D printing spray head moving direction is perpendicular to the circuit board moving direction.
As an improvement, a digital driving device is arranged inside the circuit board.
As an improvement, a digital driving device is arranged inside the telescopic hose.
Compared with the prior art, the invention has the advantages that:
the device is reasonable in design, and solder paste materials are directly printed on the circuit board according to the required position, size and thickness by a 3D printing method; the performance and the requirement of controlling the printing thickness, which cannot be provided by the traditional equipment, are provided, the universality is improved through the editing of printing software, and the sealing and the storage of a hardware solder paste material of a unique steel mesh are not needed; materials are discharged according to the program requirements, so that the adhesive loss is reduced; the traditional printing assembly is cancelled, the investment of maintenance equipment is reduced, and the maintenance emission is reduced.
Drawings
FIG. 1 is a schematic view of the internal structure of the present invention;
FIG. 2 is a schematic top view of the present invention;
FIG. 3 is a schematic front view of the present invention;
FIG. 4 is a left side view structural diagram of the present invention.
FIGS. 1-4 show: 1. the printing device comprises a shell, 2, a workbench, 3, a circuit board conveying guide rail, 4, a circuit board, 5, a 3D printing spray head, 6, a telescopic hose, 7, a solder paste storage and supply device, 8, a control panel, 9, an observation window, 10 and a slide rail.
Detailed Description
The 3D printing solder paste printer of the invention is further described in detail with reference to the accompanying drawings.
With reference to the attached drawings 1-4, a 3D printing solder paste printing machine comprises a shell 1 and a workbench 2 fixed inside the shell 1, wherein two circuit board conveying guide rails 3 are arranged on the upper portion of the workbench 2, the circuit board conveying guide rails 3 are connected with the workbench 1 and a circuit board 4 in a sliding mode, a solder paste storage and supply device 7 is arranged on the upper portion inside the shell 1, a 3D printing nozzle 5 is arranged above the inside of the shell 1, the 3D printing nozzle 5 and the solder paste storage and supply device 7 are connected through an expansion hose 6, a slide rail 10 is arranged on the upper portion inside the shell 1, and the 3D printing nozzle 5 is vertically connected with the slide rail 10 through the expansion hose 6. As a preferred embodiment of the present embodiment, the cross section of the transmission shaft 3 and the cross section of the central hole of the cutting gear 14 are both configured as a regular polygon structure.
As a preferred embodiment of the present embodiment, a control panel 8 is disposed outside the housing 1, and the control panel 8 is connected to a computer.
As a preferred embodiment of the present embodiment, the housing 1 is provided with a viewing window 9, and the viewing window 9 is located at the upper part of the control panel 8.
As a preferred embodiment of this embodiment, the movement direction of the 3D printing nozzle 5 is perpendicular to the movement direction of the circuit board 4.
As a preferred embodiment of this embodiment, a digital driving device is disposed inside the circuit board 4.
As a preferred embodiment of the present embodiment, a digital driving device is provided inside the flexible hose 6.
When the invention is implemented, firstly, the position, size, thickness and shape required by printing are set through the editing of software in the control panel 8, the printing can be automatically started by clicking and starting the invention, and the printing progress and condition can be observed through the observation window 9 at any time in the printing process.
The present invention and its embodiments have been described above, and the description is not intended to be limiting, and the drawings show only one embodiment of the present invention, and the actual structure is not limited thereto. In summary, those skilled in the art should be able to conceive of the present invention without creative design of the similar structural modes and embodiments without departing from the spirit of the present invention, and all such modifications should fall within the protection scope of the present invention.
Claims (6)
1. The utility model provides a 3D prints tin cream printing machine, includes shell (1) and is fixed in workstation (2) of shell (1) inside, its characterized in that: workstation (2) upper portion is equipped with two circuit board conveying guide rail (3), circuit board conveying guide rail (3) sliding connection workstation (1) and circuit board (4), the inside upper portion of shell (1) is equipped with the tin cream and stores feeding device (7), the inside top of shell (1) is equipped with 3D and prints shower nozzle (5), 3D prints shower nozzle (5) and stores feeding device (7) with the tin cream and connects through bellows (6), the inside upper portion of shell (1) is equipped with one slide rail (10), 3D prints shower nozzle (5) and passes through bellows (6) vertical connection with slide rail (10).
2. The 3D printing solder paste printer of claim 1, wherein: the shell (1) outside is equipped with control panel (8), control panel (8) are connected with the computer.
3. The 3D printing solder paste printer of claim 1, wherein: the shell (1) is provided with an observation window (9), and the observation window (9) is positioned on the upper part of the control panel (8).
4. The 3D printing solder paste printer of claim 1, wherein: the 3D printing nozzle (5) is perpendicular to the circuit board (4) in the moving direction.
5. The 3D printing solder paste printer of claim 1, wherein: and a digital driving device is arranged in the circuit board (4).
6. The 3D printing solder paste printer of claim 1, wherein: and a digital driving device is arranged in the telescopic hose (6).
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111458031 | 2021-12-02 | ||
| CN2021114580318 | 2021-12-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114786362A true CN114786362A (en) | 2022-07-22 |
Family
ID=82422050
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210636752.1A Pending CN114786362A (en) | 2021-12-02 | 2022-06-07 | 3D printing solder paste printing machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114786362A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101032880A (en) * | 2006-03-10 | 2007-09-12 | 雅马哈发动机株式会社 | Screen printing device |
| JP2009300429A (en) * | 2008-05-15 | 2009-12-24 | Panasonic Corp | Method and device for inspecting printed solder paste |
| CN104669397A (en) * | 2013-11-26 | 2015-06-03 | 西安中科麦特电子技术设备有限公司 | Pottery product producing 3D (three-dimensional) printing device |
| CN105946233A (en) * | 2016-06-17 | 2016-09-21 | 季鹏凯 | Multi-nozzle 3D spray-head, printing method, and 3D printer |
| CN107182172A (en) * | 2017-07-10 | 2017-09-19 | 成都联创鸿发科技有限公司 | The process of 3D printing soldering paste body on printed circuit board |
| CN108356955A (en) * | 2018-04-26 | 2018-08-03 | 同济大学 | A kind of experimental water cement-based material 3D printer |
-
2022
- 2022-06-07 CN CN202210636752.1A patent/CN114786362A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101032880A (en) * | 2006-03-10 | 2007-09-12 | 雅马哈发动机株式会社 | Screen printing device |
| JP2009300429A (en) * | 2008-05-15 | 2009-12-24 | Panasonic Corp | Method and device for inspecting printed solder paste |
| CN104669397A (en) * | 2013-11-26 | 2015-06-03 | 西安中科麦特电子技术设备有限公司 | Pottery product producing 3D (three-dimensional) printing device |
| CN105946233A (en) * | 2016-06-17 | 2016-09-21 | 季鹏凯 | Multi-nozzle 3D spray-head, printing method, and 3D printer |
| CN107182172A (en) * | 2017-07-10 | 2017-09-19 | 成都联创鸿发科技有限公司 | The process of 3D printing soldering paste body on printed circuit board |
| CN108356955A (en) * | 2018-04-26 | 2018-08-03 | 同济大学 | A kind of experimental water cement-based material 3D printer |
Non-Patent Citations (1)
| Title |
|---|
| 吕俊杰: "《SMT设备与维护》", 华中科技大学出版社, pages: 23 - 24 * |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |