CN114783930B - Wafer positioning apparatus and control method thereof - Google Patents
Wafer positioning apparatus and control method thereof Download PDFInfo
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- CN114783930B CN114783930B CN202210732910.3A CN202210732910A CN114783930B CN 114783930 B CN114783930 B CN 114783930B CN 202210732910 A CN202210732910 A CN 202210732910A CN 114783930 B CN114783930 B CN 114783930B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
Abstract
The embodiment of the invention provides wafer positioning equipment and a control method thereof, and relates to the technical field of semiconductors. The wafer positioning equipment comprises a positioning cavity, a water cooling disc, a wafer positioner, a wafer positioning sensor and a wafer positioning rotary disc, wherein the positioning cavity is internally provided with an accommodating cavity; the water cooling disc is arranged in the accommodating cavity through a bracket, and a gap is formed in the water cooling disc; the wafer positioner is arranged at the bottom of the positioning cavity and extends into the gap; the wafer positioning sensor is arranged at the top of the positioning cavity and is opposite to the wafer positioner; the wafer positioning rotary disc is arranged at the top of the wafer positioner and is positioned in the notch, the top surface of the wafer positioning rotary disc is used for bearing wafers, and the top surface of the wafer positioning rotary disc is higher than the top surface of the water cooling disc. The wafer positioning equipment can integrate the positioning function and the cooling function into one cavity, and has the advantages of simple structure, reasonable collocation and lower cost.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a wafer positioning device and a control method thereof.
Background
Currently, in semiconductor processing equipment, wafers are gradually transferred from an atmospheric environment to a process chamber for processing. In the process, the wafer is transferred by a vacuum transfer platform consisting of a series of atmospheric equipment, vacuum equipment and the like. A wafer transmission cavity, a wafer lifting cavity, a wafer positioning cavity and a wafer cooling cavity are arranged in the vacuum transmission platform. According to different processes, for example, a wafer positioning cavity and a cooling cavity are required to be configured in an etching process; the degumming process does not need a wafer positioning cavity, and only needs to be provided with a wafer cooling cavity under special conditions.
Three kinds of technology modules can be adapted on the vacuum transmission platform, the positioning cavity and the cooling cavity are used as options, corresponding functional cavities need to be selected according to the technology modules, the structural design is complex, the whole platform cannot be unified and normalized, and the cost is increased due to the addition of the cavities.
Disclosure of Invention
The invention aims to provide a wafer positioning device and a control method thereof, which can integrate a positioning function and a cooling function in one cavity, and have the advantages of simple structure, reasonable collocation and lower cost.
Embodiments of the invention may be implemented as follows:
in a first aspect, the present invention provides a wafer positioning apparatus, comprising:
the positioning cavity is internally provided with an accommodating cavity;
the water cooling disc is arranged in the accommodating cavity through a bracket, and a gap is formed in the water cooling disc;
the wafer positioner is arranged at the bottom of the positioning cavity and extends into the gap;
the wafer positioning sensor is arranged at the top of the positioning cavity and is opposite to the wafer positioner;
and the wafer positioning turntable is arranged at the top of the wafer positioner and is positioned in the notch, the top surface of the wafer positioning turntable is used for bearing the wafer, and the top surface of the wafer positioning turntable is higher than that of the water cooling disc.
The wafer positioning equipment provided by the embodiment of the invention has the beneficial effects that:
1. the positioning cavity is integrated with a component for positioning the wafer and a water cooling disc, and the positioning function and the cooling function are integrated in one cavity, so that the integration of functions is realized, the complexity of design is reduced, and the cost is reduced;
2. the water cooling disc is provided with a notch for accommodating the wafer positioner and the wafer positioning rotary disc, so that the positioning function and the cooling function are not simply superposed together, but are structurally improved and matched with each other, the occupied space is not increased, and the cooling and the positioning can be carried out simultaneously.
In an alternative embodiment, the indentation extends from the center of the water-cooled tray to the edge of the water-cooled tray.
Like this, compare and offer in the inside of water cooling dish in the breach, the breach is offered at the edge of water cooling dish, and wafer positioning sensor installs in the breach, perhaps the breach of water cooling dish assembles on wafer positioning sensor, and all compare conveniently.
In an alternative embodiment, the wafer positioning turntable is located in the center of the water-cooled plate.
Because the wafer positioning rotary disc is supported at the central position of the wafer, under the condition that the wafer positioning rotary disc is positioned at the central position of the water cooling disc, the central position of the water cooling disc is superposed with the central position of the wafer, so that the superposed area of the water cooling disc and the wafer is maximized, and the water cooling disc has the highest cooling efficiency and the most uniform cooling efficiency on the wafer.
In an alternative embodiment, the shape of the indentation is adapted to the contour of the wafer positioner.
Therefore, the area of the notch is the minimum, the area of the water cooling disc is the maximum, and the cooling efficiency can be ensured.
In an alternative embodiment, the notch is U-shaped.
Thus, the notch is simple in form and convenient to process, and the wafer positioning sensor is convenient to install in the notch.
In an alternative embodiment, the water-cooled disk has a diameter greater than or equal to the diameter of the wafer.
Therefore, the water cooling disc can cool the whole side surface of the wafer simultaneously, and the cooling effect is good.
In an alternative embodiment, the top surface of the water-cooled tray is recessed to form relief grooves extending from the center of the water-cooled tray to the edge of the water-cooled tray, the relief grooves being adapted to receive fingers for holding the wafer.
Therefore, after the wafer falls on the wafer positioning turntable, the mechanical fingers just enter the receding groove and can recede from the water cooling disc through the receding groove, collision to other parts in the process of withdrawing the mechanical fingers is avoided, and particularly, the mechanical fingers are prevented from rubbing the wafer.
In an alternative embodiment, the distance from the top surface of the wafer positioning turntable to the bottom surface of the evacuation slot is greater than the thickness of the robot finger.
Therefore, the depth of the concession groove is enough, and the mechanical finger can be completely suspended in the concession groove after moving downwards to be separated from the wafer, so that collision or scratch is avoided.
In an optional embodiment, the wafer positioning apparatus further includes a first joint, a second joint, and a third joint, the first joint is connected to the bottom of the water cooling tray, the second joint is connected to the inner wall of the positioning cavity, the third joint is connected to the outer wall of the positioning cavity, the first joint and the second joint are communicated through a hose, the second joint and the third joint are communicated, and the third joint is used for externally connecting a water source.
Therefore, water is supplied to the water cooling disc through the joint, and the airtightness of the positioning cavity cannot be influenced.
In a second aspect, the present invention provides a control method for a wafer positioning apparatus, the control method being applied to the wafer positioning apparatus of the foregoing embodiment, the control method comprising:
controlling the internal water circulation of the water cooling disc to carry out thermal radiation cooling on the wafer;
controlling the wafer positioning turntable to drive the wafer to rotate;
and controlling the wafer positioning sensor to detect the reference position on the wafer, and controlling the wafer positioning turntable to stop rotating when the reference position is detected to reach the specified position so as to complete the positioning of the wafer.
In this way, not only is the positioning of the wafer achieved in the positioning chamber, but also cooling of the wafer is achieved.
In an alternative embodiment, the step of controlling the wafer positioning sensor to detect a reference position on the wafer, and controlling the wafer positioning turntable to stop rotating when the reference position is detected, and the step of completing the positioning of the wafer comprises:
controlling an LED module of the wafer positioning sensor to emit light to the wafer and form a shadow below the wafer;
controlling a CCD module of a wafer positioner to detect a shadow cast on a wafer so as to obtain edge information of the wafer;
and controlling the wafer positioning turntable to drive the wafer to rotate according to the edge information, so that the reference position on the wafer reaches the specified position, and positioning the wafer.
Thus, the positioning process of the wafer is simple and the positioning is accurate.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic structural diagram of a wafer positioning apparatus according to a first embodiment of the present invention;
fig. 2 to 5 are schematic views illustrating the operation of the wafer positioning apparatus.
Icon: 100-a wafer positioning device; 110-a positioning cavity; 111-connection port; 120-a scaffold; 130-water cooling pan; 131-a notch; 132-a yield groove; 140-a wafer positioner; 141-a CCD module; 150-wafer positioning sensor; 151-LED module; 160-wafer positioning turntable; 170-a first joint; 180-a second joint; 190-a third joint; 200-a wafer; 210-mechanical fingers.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that if the terms "upper", "lower", "inside", "outside", etc. indicate an orientation or a positional relationship based on that shown in the drawings or that the product of the present invention is used as it is, this is only for convenience of description and simplification of the description, and it does not indicate or imply that the device or the element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention.
Furthermore, the appearances of the terms "first," "second," and the like, if any, are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
It should be noted that the features of the embodiments of the present invention may be combined with each other without conflict.
First embodiment
Referring to fig. 1, the present embodiment provides a wafer positioning apparatus 100, the wafer positioning apparatus 100 includes a positioning chamber 110, a water cooling plate 130, a wafer positioner 140, a wafer positioning sensor 150, a wafer positioning turntable 160, a first joint 170, a second joint 180, and a third joint 190.
The positioning cavity 110 is a box structure, two opposite sidewalls of the positioning cavity 110 are provided with connectors 111, and the connectors 111 can be used for connecting with a process cavity or a feeding cavity.
The water cooling plate 130 is installed in the accommodating cavity through the bracket 120, and the bracket 120 is supported on the bottom of the positioning cavity 110, so that stable installation and use of the water cooling plate 130 are ensured. The first joint 170 is connected to the bottom of the water cooling tray 130, the second joint 180 is connected to the inner wall of the positioning cavity 110, the third joint 190 is connected to the outer wall of the positioning cavity 110, the first joint 170 and the second joint 180 are communicated through a hose, the second joint 180 and the third joint 190 are communicated, and the third joint 190 is used for externally connecting a water source. The number of the first joint 170, the second joint 180 and the third joint 190 is two, so that the circulation of cooling water is realized. Therefore, water is supplied to the water cooling disc 130 through the joint, cooling water enters the vacuum from the atmospheric environment, and the airtightness of the positioning cavity 110 is not affected.
The water cooling plate 130 is opened with a gap 131, and the wafer positioner 140 is installed at the bottom of the positioning cavity 110 and extends into the gap 131. A wafer positioning sensor 150 is mounted on top of the positioning chamber 110 and is disposed opposite the wafer positioner 140.
Specifically, the wafer positioning sensor 150 includes an LED module 151, and the LED module 151 is configured to emit light onto the wafer 200 to illuminate the edge of the wafer 200 and form a shadow under the wafer 200. The wafer positioner 140 includes a CCD module 141, the CCD module 141 is used for detecting the shadow cast on the wafer 200, so as to obtain the edge information of the wafer 200 and send it to the main controller, the main controller collects and analyzes the edge information sent by the CCD module 141 and controls the wafer positioning turntable 160 to drive the wafer 200 to rotate, so that the reference position on the wafer 200 reaches the designated position, and the positioning of the wafer 200 is completed. The designated position here may be a position directly below the LED module 151.
The wafer positioning turntable 160 is installed on the top of the wafer positioner 140 and is located in the notch 131, the top surface of the wafer positioning turntable 160 is used for bearing the wafer 200, which can be satisfied with positioning the 100mm, 150mm and 200mm wafers 200, and the top surface of the wafer positioning turntable 160 is higher than the top surface of the water cooling disc 130. Thus, the wafer 200 will not rub against the water cooling plate 130 during the rotation of the wafer 200 by the wafer positioning turntable 160.
Specifically, the notch 131 extends from the center of the water cooling tray 130 to the edge of the water cooling tray 130. Thus, compared with the notch 131 formed in the water cooling tray 130, the notch 131 is formed in the edge of the water cooling tray 130, the wafer positioning sensor 150 is installed in the notch 131, or the notch 131 of the water cooling tray 130 is assembled to the wafer positioning sensor 150, which is convenient.
The shape of the notch 131 is adapted to the contour of the wafer positioner 140, and in this embodiment, the notch 131 is U-shaped. Thus, the area of the notch 131 is minimized, the area of the water cooling plate 130 is maximized, the cooling efficiency can be ensured, the notch 131 has a simple form, the processing is convenient, and the wafer positioning sensor 150 can be conveniently installed in the notch 131.
The wafer positioning turntable 160 is located at the center of the water cooling plate 130, and the diameter of the water cooling plate 130 is greater than or equal to the diameter of the wafer 200. Because the wafer positioning turntable 160 is supported at the central position of the wafer 200, in the case that the wafer positioning turntable 160 is located at the central position of the water cooling disc 130, the central position of the water cooling disc 130 coincides with the central position of the wafer 200, so that the overlapping area of the water cooling disc 130 and the wafer 200 is maximized, and the cooling efficiency of the water cooling disc 130 on the wafer 200 is highest and most uniform.
The top surface of the water cooling tray 130 is recessed to form a relief groove 132, the relief groove 132 extends from the center of the water cooling tray 130 to the edge of the water cooling tray 130, and the relief groove 132 is used for accommodating a robot finger 210 for holding the wafer 200. Thus, after the wafer 200 falls on the wafer positioning turntable 160, the robot fingers 210 just enter the receding grooves 132 and can recede from the water cooling tray 130 through the receding grooves 132, so as to prevent the robot fingers 210 from colliding with other parts in the receding process, and particularly prevent the robot fingers 210 from scratching the wafer 200.
The distance from the top surface of the wafer positioning turntable 160 to the bottom surface of the relief groove 132 is greater than the thickness of the robot finger 210. Thus, the depth of the receding groove 132 is enough, and the mechanical finger 210 can be completely suspended in the receding groove 132 after moving downward and separating from the wafer 200, so as to avoid collision or scratch.
Referring to fig. 2 to 5, the working process of the wafer positioning apparatus 100 according to the present embodiment:
1) referring to fig. 2 and 3, the wafer 200 is held by the fingers 210 and extends into the positioning cavity 110 until the wafer 200 is located right above the wafer positioning turntable 160, and at this time, the center of the wafer 200 substantially coincides with the center of the wafer positioning turntable 160;
2) referring to fig. 4 and 5, the wafer 200 is held by the mechanical finger 210 and moves vertically downward, after the wafer 200 contacts the wafer positioning turntable 160, the mechanical finger 210 gradually separates from the wafer 200, a gap is formed between the wafer 200 and the water cooling disc 130, the mechanical finger 210 is controlled to move downward for a preset distance, at this time, the mechanical finger 210 enters the receding groove 132, and then the mechanical finger 210 is controlled to recede from the positioning cavity 110, so that the mechanical finger 210 does not collide with or scratch the wafer 200 and the water cooling disc 130.
The wafer positioning apparatus 100 provided by the embodiment of the present invention has the following beneficial effects:
1. the positioning cavity 110 integrates not only the components for positioning the wafer 200, but also the water cooling disc 130, and integrates the positioning function and the cooling function into one cavity, thereby realizing the integration of the functions, reducing the complexity of the design and lowering the cost;
2. the water cooling disc 130 is provided with a notch 131 for accommodating the wafer positioner 140 and the wafer positioning turntable 160, so that the positioning function and the cooling function are not simply superposed together, but are structurally improved and matched with each other, not only the occupied space is not increased, but also the cooling and the positioning can be simultaneously carried out;
3. the water cooling disc 130 is provided with an escape groove 132, after the wafer 200 falls on the wafer positioning turntable 160, the mechanical finger 210 just enters the escape groove 132 and can escape from the water cooling disc 130 through the escape groove 132, so as to avoid the mechanical finger 210 from colliding with other parts in the process of escaping, and particularly avoid the mechanical finger 210 from scratching the wafer 200.
Second embodiment
The present embodiment provides a method for controlling a wafer positioning apparatus, which is applied to the wafer positioning apparatus 100 of the first embodiment, and the method includes:
step 1: the wafer 200 is cooled by thermal radiation by controlling the internal water circulation of the water-cooling plate 130.
Specifically, the temperature of the wafer 200 just after the previous processing step is up to 200 ℃, the wafer 200 is held by the mechanical fingers 210 and extends into the positioning cavity 110, and the wafer 200 is placed on the wafer positioning turntable 160, and then the internal water circulation of the water cooling plate 130 is controlled to perform heat radiation cooling on the wafer 200 until the temperature of the wafer 200 reaches room temperature.
The specific positioning process for controlling the internal water circulation of the water-cooling tray 130 is as follows: the two third joints 190 are connected to the water pump and the water tank, under the action of the water pump, circulating water sequentially passes through the third joint 190, the second joint 180, the hose on one side and the first joint 170 to enter the water cooling disc 130, the circulating water absorbs heat of the wafer 200 in the process of flowing inside the water cooling disc 130 to realize the effect of cooling the wafer 200, the circulating water after absorbing heat sequentially passes through the other first joint 170, the hose on the other side, the other second joint 180 and the other third joint 190 to return to the water tank for cooling, and the circulation is carried out to realize the continuous cooling of the wafer 200.
The water path inside the water cooling tray 130 may be S-shaped or directly designed as a cavity, and the two first joints 170 are respectively connected to two ends of the cavity. In this embodiment, water cooling disc 130 closes the two parts that set up including last lower cover, and the basin has all been seted up to one side that the two parts laminated each other, and after the two parts laminating, the basin concatenation on both sides forms the water route, and structural design is simple, easy dismounting.
Step 2: the wafer positioning turntable 160 is controlled to drive the wafer 200 to rotate, the wafer positioning sensor 150 is controlled to detect the reference position on the wafer 200, and when the reference position is detected to reach the designated position, the wafer positioning turntable 160 is controlled to stop rotating, so that the wafer 200 is positioned.
Specifically, after the temperature of the wafer 200 is cooled to room temperature, the wafer positioning turntable 160 is controlled to rotate the wafer 200, and the wafer positioning sensor 150 and the wafer positioner 140 are activated to perform positioning. Thus, the wafer 200 at room temperature can be attached to the wafer positioning turntable 160 more than at high temperature, which is beneficial to improving the stability of the wafer positioning turntable 160 driving the wafer 200.
The specific positioning process of the wafer positioning sensor 150 and the wafer positioner 140 is as follows: controlling the LED module 151 of the wafer positioning sensor 150 to emit light toward the wafer 200 and form a shadow under the wafer 200; the CCD module 141 controlling the wafer positioner 140 detects the shadow cast on the wafer 200, thereby obtaining edge information of the wafer 200; according to the edge information, the wafer positioning turntable 160 is controlled to drive the wafer 200 to rotate, so that the reference position on the wafer 200 reaches the designated position, and the wafer 200 is positioned. Like this, the location process to wafer 200 is simple, the location is accurate, and moreover, wafer 200 is in the room temperature state, is favorable to CCD module 141 to detect the shade of wafer 200 clearly, obtains more clear wafer 200's marginal information, because the marginal information of wafer 200 under the high temperature state is fuzzy a little relatively, often can influence the precision of location, leads to the follow-up processing yields to reduce.
It is easily understood that, in other embodiments, if the temperature of the wafer 200 is not high, step 1 and step 2 may not be performed sequentially or may be performed simultaneously, mainly according to the process required by the wafer 200, if the wafer 200 needs to be cooled and does not need to be positioned, step 1 may be employed, if the wafer 200 does not need to be cooled and needs to be positioned, step 2 may be employed, and if the wafer 200 needs to be cooled and needs to be positioned, step 1 and step 2 may be employed.
The control method of the wafer positioning equipment provided by the embodiment of the invention has the beneficial effects that:
1. not only the positioning of the wafer 200 but also the cooling of the wafer 200 are realized in the positioning cavity 110, and the positioning function and the cooling function can be used independently;
2. after the wafer 200 in the high-temperature state enters the positioning cavity 110, the water cooling disc 130 is firstly utilized to cool the wafer 200 to the room temperature, and then the positioning operation is performed on the wafer 200, so that the stability of the positioning process is facilitated, and the positioning accuracy can be improved;
3. based on the structural design of the wafer positioning device 100, the positioning function and the cooling function are reasonably integrated, so that the structure is simple, the cost is reduced, the realization of the positioning function cannot be influenced when the cooling function is started, and the improvement of the positioning function is facilitated.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. A wafer positioning apparatus, comprising:
the positioning device comprises a positioning cavity (110), wherein an accommodating cavity is formed inside the positioning cavity (110);
the water cooling disc (130) is installed in the accommodating cavity through a support (120), a notch (131) is formed in the water cooling disc (130), and the notch (131) extends to the edge of the water cooling disc (130) from the center of the water cooling disc (130);
the wafer positioner (140) is arranged at the bottom of the positioning cavity (110) and extends into the notch (131), and the shape of the notch (131) is matched with the outline of the wafer positioner (140);
the wafer positioning sensor (150) is arranged on the top of the positioning cavity (110) and is opposite to the wafer positioner (140);
the wafer positioning rotating disc (160) is installed on the top of the wafer positioner (140) and is positioned in the notch (131), the top surface of the wafer positioning rotating disc (160) is used for bearing a wafer (200), and the top surface of the wafer positioning rotating disc (160) is higher than the top surface of the water cooling disc (130).
2. The wafer positioning apparatus of claim 1, wherein the wafer positioning turntable (160) is located at a center position of the water-cooled plate (130).
3. Wafer positioning device according to claim 1, characterized in that the indentation (131) is U-shaped.
4. Wafer positioning apparatus according to claim 1, characterized in that the diameter of the water-cooled disc (130) is greater than or equal to the diameter of the wafer (200).
5. The wafer positioning apparatus of claim 4, wherein the top surface of the water cooled tray (130) is recessed to form a relief groove (132), the relief groove (132) extending from the center of the water cooled tray (130) to the edge of the water cooled tray (130), the relief groove (132) for receiving a mechanical finger (210) that grips the wafer (200).
6. The wafer positioning apparatus of claim 5, wherein a distance from a top surface of the wafer positioning turntable (160) to a bottom surface of the relief groove (132) is greater than a thickness of the robot finger (210).
7. The wafer positioning apparatus according to claim 1, further comprising a first joint (170), a second joint (180) and a third joint (190), wherein the first joint (170) is connected to the bottom of the water cooling plate (130), the second joint (180) is connected to the inner wall of the positioning cavity (110), the third joint (190) is connected to the outer wall of the positioning cavity (110), the first joint (170) and the second joint (180) are communicated through a hose, the second joint (180) and the third joint (190) are communicated, and the third joint (190) is used for externally connecting a water source.
8. A control method of a wafer positioning apparatus, characterized in that the control method is applied to the wafer positioning apparatus of claim 1, the control method comprising:
controlling internal water circulation of the water cooling tray (130) to perform thermal radiation cooling on the wafer (200);
controlling the wafer positioning turntable (160) to drive the wafer (200) to rotate;
and controlling the wafer positioning sensor (150) to detect a reference position on the wafer (200), and controlling the wafer positioning turntable (160) to stop rotating when the reference position is detected to reach a specified position, so as to complete the positioning of the wafer (200).
9. The method of claim 8, wherein the step of controlling the internal water circulation of the water cooling tray (130) to perform the thermal radiation cooling of the wafer (200) comprises:
the wafer (200) is subjected to thermal radiation cooling until the wafer (200) is cooled to room temperature.
10. The method of claim 8, wherein the step of controlling the wafer positioning sensor (150) to detect a reference position on the wafer (200) and controlling the wafer positioning turntable (160) to stop rotating when the reference position is detected, and the step of completing the positioning of the wafer (200) comprises:
controlling the LED module (151) of the wafer positioning sensor (150) to emit light to the wafer (200) and form a shadow under the wafer (200);
controlling a CCD module (141) of the wafer positioner (140) to detect a shadow cast on the wafer (200), thereby obtaining edge information of the wafer (200);
and controlling the wafer positioning turntable (160) to drive the wafer (200) to rotate according to the edge information, so that the reference position on the wafer (200) reaches a specified position, and positioning the wafer (200) is completed.
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09213770A (en) * | 1996-01-29 | 1997-08-15 | Toshiba Corp | Semiconductor wafer processor and alignment method in semiconductor wafer processor |
| CN101241840B (en) * | 2007-02-05 | 2010-09-29 | 东京毅力科创株式会社 | Vacuum processing apparatus and method |
| CN214672510U (en) * | 2021-03-01 | 2021-11-09 | 无锡邑文电子科技有限公司 | Wafer detection device suitable for photoresist stripping process |
| CN216624218U (en) * | 2021-12-09 | 2022-05-27 | 无锡邑文电子科技有限公司 | Wafer cold plate subassembly and cooling device |
-
2022
- 2022-06-27 CN CN202210732910.3A patent/CN114783930B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09213770A (en) * | 1996-01-29 | 1997-08-15 | Toshiba Corp | Semiconductor wafer processor and alignment method in semiconductor wafer processor |
| CN101241840B (en) * | 2007-02-05 | 2010-09-29 | 东京毅力科创株式会社 | Vacuum processing apparatus and method |
| CN214672510U (en) * | 2021-03-01 | 2021-11-09 | 无锡邑文电子科技有限公司 | Wafer detection device suitable for photoresist stripping process |
| CN216624218U (en) * | 2021-12-09 | 2022-05-27 | 无锡邑文电子科技有限公司 | Wafer cold plate subassembly and cooling device |
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