CN114779553B - Optical phased array chip and optical phased array module - Google Patents
Optical phased array chip and optical phased array module Download PDFInfo
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/29—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the position or the direction of light beams, i.e. deflection
- G02F1/295—Analog deflection from or in an optical waveguide structure]
- G02F1/2955—Analog deflection from or in an optical waveguide structure] by controlled diffraction or phased-array beam steering
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/12007—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer
- G02B6/12009—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer comprising arrayed waveguide grating [AWG] devices, i.e. with a phased array of waveguides
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/29—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the position or the direction of light beams, i.e. deflection
- G02F1/292—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the position or the direction of light beams, i.e. deflection by controlled diffraction or phased-array beam steering
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- Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)
Abstract
The invention provides an optical phased array chip and an optical phased array assembly, wherein the optical phased array chip is configured to be reversely mounted on a circuit board to realize photoelectric packaging, and the optical phased array chip comprises: a substrate; a grating antenna array disposed on the substrate, including a plurality of antennas, each including a grating configured to emit light; a phase modulator array disposed on the substrate and including a plurality of phase modulators configured to modulate phases of the multi-path component beams incident to the plurality of antennas, respectively; a first electrode pad disposed on a side of the grating antenna array and the phase modulator array remote from the substrate and configured to receive an electrical signal to control the phase modulator, and a reflective layer disposed on a side of the grating antenna array remote from the substrate and configured to reflect light emitted away from the substrate such that light emitted from the grating antenna array substantially passes through the substrate.
Description
Technical Field
The invention relates to the technical field of optical phased arrays, in particular to an optical phased array chip and an optical phased array assembly.
Background
The Optical Phased Array (OPA) technology generates a specific phase difference between array waveguides through a modulation mode to realize the rotation of a light beam angle, is a flexible, rapid and accurate non-mechanical light beam directional scanning technology, and has the characteristics of high resolution, strong anti-interference performance, high confidentiality and the like. In order to realize modulation of the OPA optical chip, it is necessary to electrically connect the OPA optical chip and an integrated circuit that functions as modulation control.
Disclosure of Invention
Some embodiments of the present invention provide an optical phased array chip configured to be flip-chip mounted on a circuit board to realize an optoelectronic package, the optical phased array chip comprising:
a substrate;
a grating antenna array disposed on the substrate, including a plurality of antennas, each including a grating configured to emit light;
a phase modulator array disposed on the substrate and including a plurality of phase modulators configured to modulate phases of the multi-path component beams incident to the plurality of antennas, respectively;
a first electrode pad disposed on a side of the grating antenna array and the phase modulator array remote from the substrate, configured to receive an electrical signal to control the phase modulator phase modulation, an
The reflecting layer is arranged on one side, far away from the substrate, of the grating antenna array and is configured to reflect light rays emitted far away from the substrate so that the light rays emitted from the grating antenna array basically pass through the substrate to be emitted.
In some embodiments, the optical phased array chip further comprises:
a first cladding disposed between the grating antenna array and the substrate; and
a second cladding layer disposed between the grating antenna array and the reflective layer,
the thickness of the second cladding is a preset thickness, so that the first light emitted from the grating of each antenna in the direction towards the substrate and the reflected light emitted from the second light emitted from the direction away from the substrate after being reflected by the reflecting layer form constructive interference.
In some embodiments, the thickness of the second cladding layer at the predetermined thickness d satisfies the following equation:
wherein m is an integer not less than 1, Δ Φ is a phase difference between the reflected light and the second light, λ is a wavelength of the first light, the second light, and the reflected light, and n is a refractive index of the second cladding.
In some embodiments, an orthographic projection of the grating antenna array on the substrate at least partially overlaps an orthographic projection of the reflective layer on the substrate.
In some embodiments, an orthographic projection of the grating on the substrate falls within an orthographic projection of the reflective layer on the substrate.
In some embodiments, the reflective layer comprises a distributed bragg reflective layer.
In some embodiments, the optical phase control chip further comprises:
an optical splitting network disposed on the substrate and configured to split an input light into a plurality of split beams; and
a waveguide array disposed on the substrate and connected to the phase modulator array and the grating antenna array, the waveguide array including a plurality of optical transmission paths for transmitting the multi-path light beams phase-modulated by the phase modulators to the plurality of antennas,
wherein an orthographic projection of a first electrode pad on the substrate falls within an orthographic projection of at least one of the optical splitting network and the waveguide array on the substrate.
Some embodiments of the invention provide an optical phased array assembly, comprising:
the optical phased array chip described in the previous embodiment; and
a circuit board including a substrate and a second electrode pad disposed on the substrate; and
a bump pad disposed between the first electrode pad and the second electrode pad, configured to electrically connect the first electrode pad and the second electrode pad to transmit the electrical signal.
In some embodiments, the bump is implanted on a side of the first electrode pad away from the substrate.
In some embodiments, the bump is implanted on a side of the second electrode pad away from the substrate.
In some embodiments, the circuit board further comprises:
a third electrode pad disposed on the substrate and configured to access the electrical signal;
the second electrode pad is electrically connected with the third electrode pad through a circuit, and the circuit is fan-shaped.
Compared with the related technology, the scheme of the embodiment of the invention at least has the following beneficial effects:
through set up the reflection stratum on optical phased array chip for when optical phased array chip flip-chip to the circuit board, the light of optical phased array chip outgoing passes basically the substrate is kept away from the circuit board outgoing improves light-emitting efficiency.
Through the thickness of rational design second covering for the light intensity increase of the optical phased array chip transmission of flip-chip on the circuit board improves luminous efficiency.
The reflecting layer adopts a distributed Bragg reflecting layer, so that the light emitting efficiency of the optical phased array chip is improved.
The first electrode pad of the optical phased array chip and the second electrode pad of the circuit board are connected through the projection welding points, the process is simple, and the generation efficiency is high.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention. It is obvious that the drawings in the following description are only some embodiments of the invention, and that for a person skilled in the art, other drawings can be derived from them without inventive effort. In the drawings:
fig. 1 is a schematic structural diagram of an optical phased array chip according to some embodiments of the present invention;
FIG. 2 is a schematic diagram of a partial cross-sectional structure of the optical phased array chip flip-chip mounted on a circuit board of FIG. 1 according to some embodiments of the present invention;
fig. 3 is an optical path diagram of the emergent rays of an antenna provided by some embodiments of the present invention;
FIG. 4 is a schematic diagram of an optical phase control chip according to some embodiments of the present invention;
FIG. 5 is a schematic diagram of a circuit board according to some embodiments of the present invention; and
fig. 6 is a schematic structural diagram of an optical phased array assembly according to some embodiments of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail with reference to the accompanying drawings. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The terminology used in the embodiments of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in the examples of the present invention and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise, and "a plurality" typically includes at least two.
It should be understood that the term "and/or" as used herein is merely one type of association that describes an associated object, meaning that three relationships may exist, e.g., a and/or B may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter associated objects are in an "or" relationship.
It should be understood that although the terms first, second, third, etc. may be used to describe in embodiments of the present invention, these should not be limited to these terms. These terms are only used to distinguish one from another. For example, a first may also be referred to as a second, and similarly, a second may also be referred to as a first, without departing from the scope of embodiments of the present invention.
It is also noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that an article or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such article or apparatus. Without further limitation, the recitation of an element by the phrase "comprising a" does not exclude the presence of additional like elements in a commodity or device comprising the element.
In the related art, an optical chip, such as an optical phased array chip, generally needs to be packaged with an integrated circuit for realizing modulation of the optical chip, and in particular, the optical chip and the integrated circuit are packaged with each other mainly in the following manners:
firstly, routing is suitable for the condition of less routing, the process is simple, the price is low, and the process is mature;
secondly, the solder bump and the circuit board fan out are applicable to the condition of more connecting wires, the process is relatively simple, the price is relatively low, and the process is relatively mature;
and thirdly, through silicon vias are suitable for the condition that the number of connecting wires is large, such as ultra-large-scale photoelectric interconnection, and have the disadvantages of complex process, high cost and immature process.
For an optical phased array chip, large-scale photoelectric interconnection is often needed, the first method is complex in routing and basically impossible, the third method is immature in process, complex in process and high in cost, the second method is relatively mature and relatively simple in process, and the second method is generally recommended to further realize the photoelectric interconnection between the optical phased array chip and an integrated circuit.
However, in the related art, in the practical operation of the second method, the optical phased array chip usually needs to be flip-mounted on the circuit board, and the general optical phased array chip emits light from the upper surface, and after the optical phased array chip is flip-mounted on the circuit board, at least a part of the light emitting surface of the optical phased array chip is shielded by the substrate, which affects the light emission efficiency of the optical phased array chip.
The invention provides an optical phased array chip, which is configured to be flipped on a circuit board to realize photoelectric packaging, and comprises: a substrate; a grating antenna array disposed on the substrate, including a plurality of antennas, each including a grating configured to emit light; a phase modulator array disposed on the substrate and including a plurality of phase modulators configured to modulate phases of the multi-path component beams incident to the plurality of antennas, respectively; a first electrode pad disposed on a side of the grating antenna array and the phase modulator array remote from the substrate and configured to receive an electrical signal to control the phase modulator phase modulation, and a reflective layer disposed on a side of the grating antenna array remote from the substrate and configured to reflect light exiting the grating antenna array such that the light exiting the grating antenna array substantially exits through the substrate.
According to the invention, the reflecting layer is arranged on the optical phased array chip, so that when the optical phased array chip is inversely arranged on the circuit board, the light emitted by the optical phased array chip basically penetrates through the substrate and is emitted far away from the circuit board, and the light emitting efficiency is improved.
Alternative embodiments of the present invention are described in detail below with reference to the accompanying drawings.
Fig. 1 is a schematic structural diagram of an optical phased array chip according to some embodiments of the present invention, and fig. 2 is a schematic partial cross-sectional structural diagram of the optical phased array chip flip-chip mounted on a circuit board according to some embodiments of the present invention in fig. 1.
As shown in fig. 1 and 2, the present invention provides an optical phased array chip 1000 configured to be flip-chip mounted on a circuit board 2000 to realize an optoelectronic package, the optical phased array chip 1000 including: a substrate 10, and a grating antenna array 100 and a phase modulator array 300 disposed on the substrate 10.
The substrate 10 is, for example, a silicon-based substrate. A grating antenna array 100 is arranged on said substrate 10 and comprises a plurality of antennas 30, each comprising a grating 31 configured to emit light. The plurality of antennas are arranged, for example, in parallel with each other as shown in fig. 1.
A phase modulator array 300 is disposed on the substrate 10, and includes a plurality of phase modulators 301, and the plurality of phase modulators 301 are configured to modulate the phases of the plurality of divided beams incident to the plurality of antennas 30, respectively. The optical phased array chip 1000 may perform scanning by modulating the phase of each light beam in the plurality of antennas 30 such that the grating antenna array 100 of the optical phased array chip 1000 emits light directed in different directions.
Optical phased array chip 1000 further comprises a first electrode pad 80, the first electrode pad 80 being arranged on a side of said grating antenna array 100 and said phase modulator array 300 remote from said substrate 10 and configured to receive electrical signals for controlling phase modulation of said phase modulator 301, the first electrode pad 80 being electrically connected to a circuit board 2000, for example to a second electrode pad 110 on the circuit board 2000, for example via a bump 90, for accessing said electrical signals, said electrical signals being provided, for example, by an integrated circuit connected to the circuit board 2000. As shown in fig. 2, when the optical phased array chip 1000 is mounted on the circuit board 2000 through the first electrode pads 80, the optical phased array chip 1000 is flip-chip mounted.
The optical phased-array chip 1000 further includes a reflective layer 50, the reflective layer 50 is disposed on a side of the grating antenna array 100 away from the substrate 10, and is configured to reflect light emitted away from the substrate 10 such that the light emitted from the grating antenna array 100 substantially passes through the substrate 10, as shown in fig. 2, the light emitted from the grating antenna array 100 includes, for example, a first light 1 emitted toward the substrate 10 and a second light 2 emitted away from the substrate 10, the first light 1 passes through the substrate 10, the second light 2 enters the reflective layer 50, and is reflected at the reflective layer 50, and further passes through the substrate 10.
Compared with the conventional light emitting mode of the front side of the OPA optical chip, the light emitting mode of the optical phased array chip has the advantages that the reflecting layer 50 is arranged, so that the light emitted by the optical phased array chip 1000 penetrates through the substrate 10 to be emitted, when the optical phased array chip is inversely installed on the circuit board, the circuit board cannot shield the light emitted by the optical phased array chip 1000, and the light emitting efficiency is improved.
In some embodiments, the optical phased array chip 1000 further includes a first cladding layer 20 and a second cladding layer 40 as described in fig. 1 and 2.
A first cladding layer 20 is arranged between the grating antenna array 100 and the substrate 10; a second cladding layer 40 is arranged between the grating antenna array 100 and the reflective layer 50. The first cladding 20 and the second cladding 40 are made of, for example, a silicon dioxide material, and both cover the plurality of antennas 30 of the grating antenna array 100, so that the multiple sub-beams can be transmitted in the plurality of antennas 30 respectively, for example, transmitted by total reflection between a first interface between the first cladding 20 and the antennas 30 and a second interface between the second cladding 40 and the antennas 30. The partial beams transmitted in the antenna 30 emerge at the grating 31, i.e. generate the first light ray 1 and the second light ray 2, for example, as described above.
The thickness of the second cladding 40 is a predetermined thickness, so that the first light ray 1 emitted from the grating 31 of each antenna 30 in the direction toward the substrate 10 and the reflected light ray 3 reflected by the reflective layer 50 from the second light ray 2 emitted from the substrate form constructive interference. The arrangement makes the light intensity emitted by the grating antenna array 100 as large as possible, thereby enhancing the light emitting efficiency and avoiding light loss.
Fig. 3 is an optical diagram of an outgoing light beam of an antenna according to some embodiments of the present invention. With reference to fig. 1 to fig. 3, in order to improve the emission efficiency of the light emitted from the back of the grating antenna array 100, in some embodiments, the first light ray 1 and the reflected light ray 3 form constructive interference, that is, after the first light ray 1 and the reflected light ray 3 are superimposed, the amplitude of the resultant light ray is greater than the amplitude of the first light ray 1 or the reflected light ray 3, at this time, the light intensity of the resultant light ray after the constructive interference of the first light ray 1 and the reflected light ray 3 is increased compared to that of the first light ray 1 or the reflected light ray 3, so as to improve the back light emission efficiency of the grating antenna array.
In some embodiments of the present invention, the constructive interference formed by the first light ray 1 and the reflected light ray 3 is, for example, complete constructive interference, that is, the first light ray 1 and the reflected light ray 3 are in-phase interference, that is, the phase difference between the first light ray 1 and the reflected light ray 3 is an integral multiple of 2 pi, at this time, the amplitude of the combined light ray formed by overlapping the first light ray 1 and the reflected light ray 3 is the largest, and the light intensity is the largest, so that the back light emission efficiency of the grating antenna array is maximized.
Specifically, as shown in fig. 3, the thickness of the second cladding layer 40 needs to satisfy a predetermined condition to make the first light ray 1 and the reflected light ray 3 interfere in phase. Let d be the thickness of the second cladding 40, n be the refractive index of the second cladding 40, λ be the wavelength of the first light 1 and the second light 2 emitted from the grating 31 of the antenna 30, and λ be the wavelength of the second light 2 after being reflected by the reflective layer 50, that is, λ is the wavelength of the reflected light 3. The exit angles of the first light ray 1 and the second light ray 2 emitted from the grating 31 of the antenna 30 are both θ, wherein the exit angle of the first light ray 1 is an acute angle between the exit direction of the first light ray 1 and the normal direction perpendicular to the antenna 30, and the exit angle of the second light ray 2 is an acute angle between the exit direction of the second light ray 2 and the normal direction perpendicular to the surface of the antenna 30. According to the principle of perfect constructive interference, when the thickness d of the second cladding layer 40 satisfies the following formula (1), the interference formed by the first light ray 1 and the reflected light ray 3 is perfect constructive interference, and the specific condition is that:
where m is an integer not less than 1, and Δ Φ is a phase difference between the reflected light ray 3 and the second light ray 2, that is, a phase difference generated when the second light ray 2 is reflected by the reflective layer 50, and the phase difference Δ Φ is related to a material of the mirror layer 50 and an exit angle θ of the second light ray 2.
That is, the thickness of the second cladding 40 needs to satisfy the predetermined thickness d to realize that the interference formed by the first light 1 and the reflected light 3 is complete constructive interference, so as to improve the light extraction efficiency of the grating antenna array 100.
As can be seen from equation (1), whether the first light ray 1 and the reflected light ray 3 form complete constructive interference or not is related to the refractive index n of the second cladding 40, the thickness of the second cladding, the exit angle θ of the second light ray 2, and the phase difference between the reflected light ray 3 and the second light ray 2. The refractive index n of the second cladding 40 depends on its material and the exit angle θ of the second light ray 2 depends on its phase of modulation and the structure of the grating 31. The phase difference Δ Φ between the reflected light ray 3 and the second light ray 2 is related to the material of the mirror layer 50 and the exit angle θ of the second light ray 2.
In some embodiments, as shown in fig. 1 and 2, an orthographic projection of the grating antenna array 100 on the substrate 10 at least partially overlaps with an orthographic projection of the reflective layer 50 on the substrate. With this arrangement, the second light 2 emitted from the antenna 30 can be incident on the reflective layer 50, and can be reflected by the reflective layer 50 and then emitted through the substrate 10. The reflective layer 50 needs to reflect the second light ray 2 as much as possible, and its area can be as large as possible.
In some embodiments, as shown in fig. 1 and 2, an orthogonal projection of the grating 31 on the substrate 10 falls within an orthogonal projection of the reflective layer 50 on the substrate 10.
In some embodiments, the reflective layer 50 may be, for example, a metal reflective layer, such as a metal material made of silver, gold, copper, or the like by evaporation.
In some embodiments, the reflective layer 50 may be, for example, a distributed bragg reflector, which is an adjustable multilayer structure composed of two optical materials, for example, a multilayer structure composed of two optical materials alternately, and the thickness of each layer structure is 1/4 of the optical length of the second light ray 2. With a distributed bragg reflector layer, the loss of the second light 2 can be reduced as much as possible, so that it is substantially completely reflected.
Fig. 4 is a schematic diagram of an optical phased-chip 1000 according to some embodiments of the invention. In some embodiments, as shown in fig. 1, 2 and 4, the optical phased-chip 1000 further includes an optical splitting network 200 and a waveguide array 400 disposed on the substrate 10.
The optical splitting network 200, for example, includes a plurality of optical splitting devices configured to split input light generated by an optical source into a plurality of split beams. The multiple sub-beams are in one-to-one correspondence with the plurality of phase modulators 301 of the phase modulator array 300, and each sub-beam is phase modulated by its corresponding phase modulator 301.
The waveguide array 400 is connected to the phase modulator array 300 and the grating antenna array 100, the waveguide array 400 includes a plurality of optical transmission paths 401, and the plurality of optical transmission paths 401 respectively transmit the multi-path sub-beams phase-modulated by the plurality of phase modulators 301 to the plurality of antennas 30. The plurality of optical transmission paths 401 correspond one-to-one to the plurality of phase modulators 301 and the plurality of antennas 30. The multi-path light splitting beams are respectively subjected to phase modulation, and then the corresponding antennas emit corresponding light rays, so that the emitting direction of the light rays output by the grating antenna array 100 can be controlled, and light wave scanning is realized.
As shown in fig. 1-4, the orthographic projection of the first electrode pad 80 on the substrate 10 falls within the orthographic projection of at least one of the optical splitting network 200, the phase modulator array 300 and the waveguide array 400 on the substrate 10, so as to avoid the first electrode pad 80 overlapping the grating antenna array 100 to block light.
In some embodiments, as shown in fig. 1-4, the number of first electrode pads 80 is multiple, for example arranged in an array.
Fig. 5 is a schematic structural diagram of a circuit board according to some embodiments of the present invention, and fig. 6 is a schematic structural diagram of an optical phased array assembly according to some embodiments of the present invention, and referring to fig. 1 to 6, a bump is disposed between an optical phased array chip 1000 and a circuit board 2000, which is shielded by the optical phased array chip 1000, and the position of the bump 90 is marked in fig. 6. Referring to fig. 1 to 6, an optical phased array assembly according to some embodiments of the present invention includes an optical phased array chip 1000 and a circuit board 2000 described in the foregoing embodiments, where the optical phased array chip 1000 is electrically connected to the circuit board 2000. The circuit board 2000 includes a substrate 60 and a second electrode pad 110 disposed on the substrate 60, and the circuit board 2000 is, for example, a silicon-based circuit board, i.e., the material of the substrate 60 is, for example, silicon. Specifically, the optical phased array assembly further includes a bump pad 90, the bump pad 90 being disposed between the first electrode pad 80 and the second electrode pad 110, configured to electrically connect the first electrode pad 80 and the second electrode pad 110 to transmit the electrical signal. The number of the bump pads 90, the first electrode pads 80, and the second electrode pads 110 is plural, and the three are all in one-to-one correspondence with each other, and in the optical phased array assembly, the corresponding bump pads 90, the first electrode pads 80, and the second electrode pads 110 are overlapped with each other.
In some embodiments, the bump 90 is implanted on the side of the first electrode pad 80 away from the substrate 10, that is, before the optical phased array chip 1000 is flip-chip connected to the circuit board 2000, the bump 90 may be implanted on the optical phased array chip 1000, specifically, the bump 90 is implanted on the first electrode pad 80, and then the optical phased array chip 1000 is flip-chip connected to the circuit board 2000 by using a soldering process, so that the first electrode pad 80 and the second electrode pad 110 are electrically connected through the bump 90.
In some embodiments, the bump 90 may be implanted on the circuit board 2000 before the optical phased array chip 1000 is flip-chip connected to the circuit board 2000, that is, the bump 90 may be implanted on the circuit board 2000, specifically, the bump 90 is implanted on the second electrode pad 110, and then the optical phased array chip 1000 is flip-chip connected to the circuit board 2000 by using a soldering process, so that the first electrode pad 80 and the second electrode pad 110 are electrically connected through the bump 90.
In some embodiments, as shown in fig. 5 and 6, the circuit board 2000 further comprises a third electrode pad 130 disposed on the substrate 60 and configured to access the electrical signal, for example, the third electrode pad 130 may be connected to an external integrated circuit for generating the electrical signal for controlling the phase modulation of the phase modulator 301. The third electrode pad 130 may be electrically connected to the integrated circuit by, for example, soldering using a bump pad.
In some embodiments, the second electrode pad 110 and the third electrode pad 130 are electrically connected by a circuit 120, and the circuit 120 is disposed on the substrate 60, for example, in a fan shape.
In some embodiments, the optical phased array assembly may further comprise an integrated circuit generating said electrical signal for controlling the phase modulation of said phase modulator 301, which is electrically connected to the third electrode pad 130 of the circuit board 2000. The integrated circuit is connected to the circuit board 2000 by soldering, for example.
The first electrode pad of the optical phased array chip and the second electrode pad of the circuit board are connected through the projection welding points to form the interconnection package of the optical phased array chip and the integrated circuit, namely the optical phased array assembly, and the optical phased array assembly is simple in process and high in generation efficiency.
The invention also provides a manufacturing method of the optical phased array component, which comprises the following steps:
s1: providing an optical phased array chip and a circuit board;
optical phased array chip 1000 as shown in the previous embodiments, optical phased array chip 1000 includes a first electrode pad 80 on its front surface, disposed on the side of the grating antenna array 100 and the phase modulator array 300 away from the substrate 10, for receiving electrical signals to control the phase modulator 301 to modulate phase. The circuit board 2000 includes a substrate 60 and a second electrode pad 110 disposed on the substrate 60.
S2: implanting bump pads on the optical phased array chip 1000 or the circuit board 2000;
specifically, in some embodiments, for example, the bump pads 90 are implanted on the first electrode pads 80 of the optical phased array chip 1000, that is, the bump pads 90 are generated on the side of the first electrode pads 80 away from the substrate 10, and the number of the bump pads 90 and the number of the first electrode pads 80 are multiple, and the two numbers correspond to each other.
In other embodiments, for example, the bump 90 is implanted on the second electrode pad 110 of the circuit board 2000, that is, the bump 90 is formed on the side of the second electrode pad 110 away from the substrate 60, and the number of the bump 90 and the number of the second electrode pad 110 are multiple, and the two are in one-to-one correspondence.
S3: the optical phased array chip 1000 is mounted on a circuit board 2000.
Specifically, when the optical phased array chip 1000 is flip-chip mounted on the circuit board 2000, the first electrode pads 80 of the optical phased array chip 1000 are soldered to the second electrode pads 110 of the circuit board 2000 by the solder bumps 90.
In some embodiments, the manufacturing method may further include the steps of:
s4: the integrated circuit is mounted on the circuit board 2000.
Specifically, the integrated circuit is soldered on the circuit board 2000, and the electrode substrate of the integrated circuit and the third electrode pad 130 of the circuit board 2000 are soldered by bump soldering.
It will be understood by those skilled in the art that the order in which the optical phased array chip 1000 is mounted on the circuit board 2000 and the integrated circuit is mounted on the circuit board 2000 may be interchanged according to actual needs.
All parts in the specification are described in a mode of combining parallel and progressive, each part is mainly described to be different from other parts, and the same and similar parts among all parts can be referred to each other.
In the above description of the disclosed embodiments, features described in various embodiments in this specification can be substituted for or combined with each other to enable those skilled in the art to make or use the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Finally, it should be noted that: the embodiments are described by way of example, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. The system or the device disclosed by the embodiment corresponds to the method disclosed by the embodiment, so that the description is simple, and the relevant points can be referred to the method part for description.
The above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (11)
1. An optical phased array chip configured to be flip-chip mounted to a circuit board to implement an optoelectronic package, the optical phased array chip comprising:
a substrate;
a grating antenna array disposed on the substrate, including a plurality of antennas, each including a grating configured to emit light;
a phase modulator array disposed on the substrate, including a plurality of phase modulators configured to modulate phases of the plurality of component beams incident to the plurality of antennas, respectively;
a first electrode pad disposed on a side of the grating antenna array and the phase modulator array remote from the substrate, configured to receive an electrical signal to control the phase modulator phase modulation, an
The reflecting layer is arranged on one side, far away from the substrate, of the grating antenna array and is configured to reflect light rays far away from the substrate so that the light rays emitted by the grating antenna array penetrate through the substrate to be emitted.
2. The optical phased array chip of claim 1, wherein the optical phased array chip further comprises:
a first cladding disposed between the grating antenna array and the substrate; and
a second cladding layer disposed between the grating antenna array and the reflective layer,
the thickness of the second cladding is preset, so that constructive interference is formed between first light rays emitted from the grating of each antenna in the direction towards the substrate and reflected light rays emitted from the grating of each antenna in the direction away from the substrate after the second light rays are reflected by the reflecting layer.
3. The optical phased array chip of claim 2, wherein the thickness of the second cladding layer is a predetermined thickness d that satisfies the following equation:
wherein m is an integer not less than 1, Δ Φ is a phase difference between the reflected light and the second light, λ is a wavelength of the first light, the second light, and the reflected light, and n is a refractive index of the second cladding.
4. The optical phased array chip of any of claims 1 to 3, wherein an orthographic projection of the grating antenna array on the substrate at least partially overlaps an orthographic projection of the reflective layer on the substrate.
5. The optical phased array chip of claim 4, wherein an orthographic projection of the grating on the substrate falls within an orthographic projection of the reflective layer on the substrate.
6. The optical phased array chip of any of claims 1 to 3, wherein the reflective layer comprises a distributed Bragg reflector layer.
7. The optical phased array chip of any of claims 1-3, wherein the optical phased array chip further comprises:
an optical splitting network disposed on the substrate and configured to split an input light into a plurality of split beams; and
a waveguide array disposed on the substrate and connected to the phase modulator array and the grating antenna array, the waveguide array including a plurality of optical transmission paths for transmitting the multi-path light beams phase-modulated by the phase modulators to the plurality of antennas,
wherein an orthographic projection of a first electrode pad on the substrate falls within an orthographic projection of at least one of the optical splitting network and the waveguide array on the substrate.
8. An optical phased array assembly, comprising:
the optical phased array chip of any one of claims 1-7; and
a circuit board including a substrate and a second electrode pad disposed on the substrate; and
a bump pad disposed between the first electrode pad and the second electrode pad, configured to electrically connect the first electrode pad and the second electrode pad to transmit the electrical signal.
9. The optical phased array assembly of claim 8, wherein the bump pads are disposed on a side of the first electrode pads remote from the substrate.
10. The optical phased array assembly of claim 8, wherein the bump pads are disposed on a side of the second electrode pads away from the substrate.
11. The optical phased array assembly of claim 8, wherein the circuit board further comprises:
a third electrode pad disposed on the substrate and configured to access the electrical signal;
the second electrode pad is electrically connected with the third electrode pad through a circuit, and the circuit is fan-shaped.
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Effective date of registration: 20231027 Address after: Room 313, third floor, building 3, Xisanqi building materials City, Haidian District, Beijing 100096 Patentee after: Beijing Moore core optical semiconductor technology Co.,Ltd. Address before: 100096 Xisanqi, Haidian District, Beijing Patentee before: Beijing Moore core light Technology Co.,Ltd. |