CN114774048B - Preparation method of strain gauge patch adhesive with high thermal conductivity and strain sensor - Google Patents
Preparation method of strain gauge patch adhesive with high thermal conductivity and strain sensor Download PDFInfo
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
- G01B7/16—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge
- G01B7/18—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge using change in resistance
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2217—Oxides; Hydroxides of metals of magnesium
- C08K2003/222—Magnesia, i.e. magnesium oxide
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/28—Nitrogen-containing compounds
- C08K2003/282—Binary compounds of nitrogen with aluminium
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/382—Boron-containing compounds and nitrogen
- C08K2003/385—Binary compounds of nitrogen with boron
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2463/00—Presence of epoxy resin
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Inorganic Chemistry (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention discloses a preparation method of strain gauge paster glue with high heat conductivity and a strain sensor, and belongs to the field of sensor preparation. According to the invention, steam in-situ polymerization is adopted to uniformly coat a layer of high-heat-conductivity polymer polypyrrole on the surface of a compound with high heat conductivity coefficient; secondly, adding the compound particles uniformly coated with the PPy into the component A of the epoxy adhesive, and uniformly stirring; because the PPy with high heat conductivity is doped by sulfamic acid, partial NH in sulfamate in the PPy 2 Can react with epoxy groups to connect the compound particles with the epoxy resin. The patch adhesive obtained by the method can timely transfer heat generated by strain metal in the working process of the strain gauge, so that the service life of the strain sensor is effectively prolonged, and the process is very suitable for mass industrial production.
Description
Technical Field
The invention relates to the field of sensor preparation, in particular to a preparation method of strain gauge paster glue with high thermal conductivity and a strain sensor.
Background
The sensor enters the aspects of daily life due to the rapid development of the intelligent society. The strain sensor is a device for converting a strain signal into an electric signal, and has wider and wider application in the aspects of weighing, damage induction, gas leakage monitoring, motion monitoring, aerospace, national defense and military industry and the like.
In the existing strain sensor, the resistance strain sensor has the advantages of high precision, long service life, simple structure, good frequency response characteristic, easy miniaturization and the like, and is the sensor with the largest dosage. The sensor mainly comprises an elastomer, a resistance strain gauge, a compensation resistance, a shell and the like, wherein the strain gauge is bonded on the elastomer by using an organic adhesive to test the strain amount. However, in the process of operating the resistance strain gauge, the resistance of the strain metal usually reaches hundreds or even thousands of ohms, and a large amount of heat is generated when the resistance is changed by energizing test, so that if the strain gauge is repeatedly operated, more heat is necessarily accumulated. The surface of the strain gauge is generally protected by silica gel, and heat is difficult to be rapidly dissipated through the surface. Therefore, most of the heat is transferred to the metal elastomer by means of the adhesive layer of the patch and finally dissipated.
And the strain gauge works in a long-term working process or under a high-temperature environment, if the accumulated heat of the strain gauge cannot be timely emitted, the repeated and large thermal expansion and contraction can damage the original polymer bonding structure, and finally the service life of the sensor is shortened. Epoxy resin-based strain gauge paster glue prepared by Chinese patent CN 112126394A has the risk that heat cannot be timely emitted in the process of working for a long time.
Disclosure of Invention
Aiming at the problems in the prior art, the first aim of the invention is to provide a preparation method of strain gauge paster glue with high heat conductivity, which can timely transfer heat generated by strain metal in the working process of a strain gauge, thereby effectively prolonging the service life of a strain sensor and being very suitable for mass industrialized production; a second object is to provide a strain sensor comprising the patch gel.
In order to solve the problems, the invention adopts the following technical scheme.
A preparation method of strain gauge paster glue with high heat conductivity comprises the following steps:
s1, adding high heat conduction particles into a stirrer, spraying an aqueous solution of sulfamic acid and ammonium persulfate on the surfaces of the high heat conduction particles through a spray head in the stirring process, and continuously stirring for 10-30 minutes after the spraying is finished, and uniformly mixing;
s2, continuing stirring, slowly introducing pyrrole steam through an interface on the stirrer within 1 hour, continuing stirring for 1-3 hours after the steam is introduced, taking out the reacted mixture from the stirrer, and drying at 80 ℃ for 1-2 hours to obtain a filler M;
s3, adding a solvent into the epoxy resin, and fully and uniformly mixing, wherein the epoxy resin is one of E51 and E44, and the solvent is a mixed solvent of tetramethyl-dipentamethylenedione, n-butanol and ethyl acetate; continuously adding filler M into the diluted epoxy resin, and uniformly mixing by adopting a ball milling mode to obtain a component A;
s4, adding a solvent into cardanol, and fully and uniformly mixing the solvent, namely a mixed solvent of tetramethyl dipentamethylenedione, n-butanol and ethyl acetate, so as to obtain a component B;
s5, uniformly mixing the component A and the component B in the using process to obtain a mixture C; the mixture C was cured in a mold at 90℃for 2 hours to obtain a sheet.
Further, the high heat conductivity particles in S1 are one or more of aluminum nitride, boron nitride, silicon carbide, graphite and magnesium oxide, and the particle diameter is smaller than 30 micrometers.
Further, the mass ratio of the high heat conduction particles in the step S1, water, sulfamic acid and ammonium persulfate is 100:5:1:0.5-2.5.
Further, the mass ratio of the high heat conduction particles to the added pyrrole in the S2 is 100:0.2-2.
Further, the mixing ratio of tetramethyl dipentamethylenedione, n-butanol and ethyl acetate in the mixed solvent in S3 and S4 is 1:1:1.
further, the mass ratio of the epoxy resin to the solvent in the step S3 is 1:2-3.
Further, the mass ratio of the epoxy resin to the filler M in the S3 is 1:0.5-1.
Further, the mass ratio of the cardanol to the solvent in the S4 is 1:0.3-0.7.
Further, the mass ratio of A to B in the mixture in S5 is 1:0.3-0.5.
Further, the stirrer in the step S1 comprises an operation table, a reactor, a spray head, a conduit, a pump, a valve, a beaker, a two-neck flask and a water bath kettle; the reactor is fixedly connected to the upper end of the operating platform, 2 guide pipes are respectively and slidably connected to the upper end of the reactor, one ends of the 2 guide pipes are respectively and fixedly connected with 2 spray heads, the 2 spray heads are located on the inner side of the reactor, the pump is fixedly connected to the middle end of the left guide pipe, the other end of the left guide pipe is located on the inner side of a beaker filled with aqueous solution of sulfamic acid and ammonium persulfate, the valve is fixedly connected to the middle end of the right guide pipe, the other end of the right guide pipe is slidably connected to one of two necks of the two-necked flask, and the two-necked flask is located on the inner side of the water bath.
A strain gauge sensor comprises the strain gauge paster rubber with high heat conductivity.
In summary, due to the adoption of the technical scheme, the invention has the advantages that:
(1) The heat conduction coefficient of the patch adhesive obtained by the scheme reaches more than 2.8W/m.K, and heat generated by strain metal in the working process of the strain gauge can be transferred out in time, so that the service life of the strain sensor is effectively prolonged.
(2) The shearing strength of the patch adhesive bonded stainless steel sheet obtained by the scheme is greater than 26MPa, the bonding strength is high, and the service life of the strain sensor can be greatly prolonged.
(3) The scheme adopts steam in-situ polymerization to uniformly coat a layer of high-heat-conductivity polymer polypyrrole on the surface of high-heat-conductivity particles with high heat conductivity coefficient, and the process is very suitable for mass industrialized production.
Drawings
FIG. 1 is a schematic diagram of a general structure of a strain gauge sensor;
FIG. 2 is a schematic diagram of the reaction mechanism of PPy-encapsulated high thermal conductivity particles with epoxy;
fig. 3 is a schematic view of a production apparatus for the filler M.
The reference numerals in the figures illustrate:
1 operation table, 2 reactor, 3 shower nozzle, 4 pipe, 5 pump, 6 valve, 7 beaker, 8 two-neck flask and 9 water bath.
Detailed Description
Example 1
S1, adding aluminum nitride into a stirrer shown in FIG. 3, spraying an aqueous solution of sulfamic acid and ammonium persulfate on the surface of the aluminum nitride through a spray head in the stirring process, wherein the mass ratio of the aluminum nitride to the water to the sulfamic acid to the ammonium persulfate is 100:5:1:0.5, and continuing stirring for 10 minutes and uniformly mixing.
S2, continuing stirring, and slowly introducing pyrrole steam through an interface on the stirrer within 1 hour, wherein the mass ratio of aluminum nitride to added pyrrole is 100:0.4, and continuing stirring for 2 hours after the steam is introduced. The mixture after the reaction was taken out of the stirrer and baked at 80℃for 1 hour to obtain filler M.
S3, adding a solvent into the epoxy resin, fully and uniformly mixing, wherein the epoxy resin is E51, and the solvent is a mixed solvent (1/3) of tetramethyl-dipentamethylenedione, n-butanol and ethyl acetate, and the mass ratio of the epoxy resin to the solvent is 1:2. And continuously adding filler M into the diluted epoxy resin, wherein the mass ratio of the epoxy resin to the filler M is 1:0.9, and uniformly mixing the epoxy resin and the filler M by adopting a ball milling mode to obtain a component A.
S4, adding a solvent into cardanol, fully and uniformly mixing, wherein the solvent is a mixed solvent of tetramethyl-dipentamethylenedione, n-butanol and ethyl acetate (1/3 of each solvent), and the mass ratio of the cardanol to the solvent is 1:0.7, so as to obtain a component B.
S5, uniformly mixing the component A and the component B in the using process to obtain a mixture C, wherein the mass ratio of the component A to the mixture B in the mixture is 1:0.3. The mixture C was cured in a mold at 90℃for 2 hours to give a sheet-like article having dimensions of 10mm (length). Times.10 mm (width). Times.1 mm (thickness), which was tested for heat conductivity of 2.92W/m.K. According to GB/T6328-1999, the shear strength of the bonded stainless steel sheet of mixture C after curing is 29.3MPa.
Example 2
S1, adding boron nitride into a stirrer shown in FIG. 3, spraying an aqueous solution of sulfamic acid and ammonium persulfate on the surface of the boron nitride through a spray head in the stirring process, wherein the mass ratio of the boron nitride to the water to the sulfamic acid to the ammonium persulfate is 100:5:1:1, and continuously stirring for 15 minutes to uniformly mix.
S2, continuing stirring, and slowly introducing pyrrole steam through an interface on the stirrer within 1 hour, wherein the mass ratio of boron nitride to added pyrrole is 100:0.8, and continuing stirring for 1.5 hours after the steam is introduced. The mixture after the reaction was taken out of the stirrer and baked at 80℃for 2 hours to obtain filler M.
S3, adding a solvent into the epoxy resin, fully and uniformly mixing, wherein the epoxy resin is E51, the solvent is a mixed solvent of tetramethyl dipentamethylenedione, n-butanol and ethyl acetate (1/3 of each solvent), and the mass ratio of the epoxy resin to the solvent is 1:2.2. And continuously adding filler M into the diluted epoxy resin, wherein the mass ratio of the epoxy resin to the filler M is 1:0.8, and uniformly mixing the epoxy resin and the filler M by adopting a ball milling mode to obtain a component A.
S4, adding a solvent into cardanol, fully and uniformly mixing, wherein the solvent is a mixed solvent of tetramethyl-dipentamethylenedione, n-butanol and ethyl acetate (1/3 of each solvent), and the mass ratio of the cardanol to the solvent is 1:0.6, so as to obtain a component B.
S5, uniformly mixing the component A and the component B in the using process to obtain a mixture C, wherein the mass ratio of the component A to the mixture B in the mixture is 1:0.35. The mixture C was cured in a mold at 90℃for 2 hours to give a sheet-like article having dimensions of 10mm (length). Times.10 mm (width). Times.1 mm (thickness), which was tested for heat conductivity of 2.8W/m.K. According to GB/T6328-1999, the shear strength of the bonded stainless steel sheet of mixture C after curing is 26.6MPa.
Example 3
S1, adding silicon carbide into a stirrer shown in FIG. 3, spraying an aqueous solution of sulfamic acid and ammonium persulfate on the surface of the silicon carbide through a spray head in the stirring process, wherein the mass ratio of the silicon carbide to the water to the sulfamic acid to the ammonium persulfate is 100:5:1:1.5, and continuing stirring for 10-30 minutes to uniformly mix.
S2, continuing stirring, and slowly introducing pyrrole steam through an interface on the stirrer within 1 hour, wherein the mass ratio of silicon carbide to added pyrrole is 100:1.2, and continuing stirring for 2 hours after the steam is introduced. The mixture after the reaction was taken out of the stirrer and baked at 80℃for 1.5 hours to obtain filler M.
S3, adding a solvent into the epoxy resin, fully and uniformly mixing, wherein the epoxy resin is E44, and the solvent is a mixed solvent (1/3) of tetramethyl-dipentamethylenedione, n-butanol and ethyl acetate, and the mass ratio of the epoxy resin to the solvent is 1:2.5. And continuously adding filler M into the diluted epoxy resin, wherein the mass ratio of the epoxy resin to the filler M is 1:0.8, and uniformly mixing the epoxy resin and the filler M by adopting a ball milling mode to obtain a component A.
S4, adding a solvent into cardanol, fully and uniformly mixing, wherein the solvent is a mixed solvent of tetramethyl-dipentamethylenedione, n-butanol and ethyl acetate (1/3 of each solvent), and the mass ratio of the cardanol to the solvent is 1:0.5, so as to obtain a component B.
S5, uniformly mixing the component A and the component B in the using process to obtain a mixture C, wherein the mass ratio of the component A to the mixture B in the mixture is 1:0.4. The mixture C was cured in a mold at 90℃for 2 hours to give a sheet-like article having dimensions of 10mm (length). Times.10 mm (width). Times.1 mm (thickness), which was tested for a heat conductivity of 2.93W/m.K. According to GB/T6328-1999, the shear strength of the bonded stainless steel sheet of mixture C after curing is 28.6MPa.
Example 4
S1, adding graphite into a stirrer shown in FIG. 3, spraying an aqueous solution of sulfamic acid and ammonium persulfate on the surface of the graphite through a spray head in the stirring process, wherein the mass ratio of the graphite to the water to the sulfamic acid to the ammonium persulfate is 100:5:1:2, and continuously stirring for 25 minutes to uniformly mix.
S2, continuing stirring, and slowly introducing pyrrole steam through an interface on the stirrer within 1 hour, wherein the mass ratio of graphite to added pyrrole is 100:1.5, and continuing stirring for 2.5 hours after the steam is introduced. The mixture after the reaction was taken out of the stirrer and baked at 80℃for 2 hours to obtain filler M.
S3, adding a solvent into the epoxy resin, fully and uniformly mixing, wherein the epoxy resin is E44, the solvent is a mixed solvent of tetramethyl dipentamethylenedione, n-butanol and ethyl acetate (1/3 of each solvent), and the mass ratio of the epoxy resin to the solvent is 1:2.8. And continuously adding filler M into the diluted epoxy resin, wherein the mass ratio of the epoxy resin to the filler M is 1:0.8, and uniformly mixing the epoxy resin and the filler M by adopting a ball milling mode to obtain a component A.
S4, adding a solvent into cardanol, fully and uniformly mixing, wherein the solvent is a mixed solvent of tetramethyl-dipentamethylenedione, n-butanol and ethyl acetate (1/3 of each solvent), and the mass ratio of the cardanol to the solvent is 1:0.4, so as to obtain a component B.
S5, uniformly mixing the component A and the component B in the using process to obtain a mixture C, wherein the mass ratio of the component A to the mixture B in the mixture is 1:0.45. The mixture C was cured in a mold at 90℃for 2 hours to obtain a sheet-like article having dimensions of 10mm (length). Times.10 mm (width). Times.1 mm (thickness), which was measured for heat conductivity to be 2.97W/m.K. According to GB/T6328-1999, the shear strength of the bonded stainless steel sheet of mixture C after curing is 29.3MPa.
Example 5
S1, adding magnesium oxide into a stirrer shown in FIG. 3, spraying an aqueous solution of sulfamic acid and ammonium persulfate on the surface of the magnesium oxide through a spray head in the stirring process, wherein the mass ratio of the magnesium oxide to the water to the sulfamic acid to the ammonium persulfate is 100:5:1:0.5-2.5, and continuing stirring for 30 minutes to uniformly mix.
S2, continuing stirring, and slowly introducing pyrrole steam through an interface on the stirrer within 1 hour, wherein the mass ratio of magnesium oxide to added pyrrole is 100:2, and continuing stirring for 3 hours after the steam is introduced. The mixture after the reaction was taken out of the stirrer and baked at 80℃for 2 hours to obtain filler M.
S3, adding a solvent into the epoxy resin, fully and uniformly mixing, wherein the epoxy resin is E51, the solvent is a mixed solvent of tetramethyl dipentamethylenedione, n-butanol and ethyl acetate (1/3 of each solvent), and the mass ratio of the epoxy resin to the solvent is 1:3. And continuously adding filler M into the diluted epoxy resin, wherein the mass ratio of the epoxy resin to the filler M is 1:1, and uniformly mixing the epoxy resin and the filler M in a ball milling mode to obtain a component A.
S4, adding a solvent into cardanol, fully and uniformly mixing, wherein the solvent is a mixed solvent of tetramethyl-dipentamethylenedione, n-butanol and ethyl acetate (1/3 of each solvent), and the mass ratio of the cardanol to the solvent is 1:0.3, so as to obtain a component B.
S5, uniformly mixing the component A and the component B in the using process to obtain a mixture C, wherein the mass ratio of the component A to the mixture B in the mixture is 1:0.5. The mixture C was cured in a mold at 90℃for 2 hours to obtain a sheet-like article having dimensions of 10mm (length). Times.10 mm (width). Times.1 mm (thickness), which was tested for heat conductivity of 3.01W/m.K. According to GB/T6328-1999, the shear strength of the bonded stainless steel sheet of mixture C after curing is 29.8MPa.
As a result of comparison of examples 1 to 5, when the types of solutes, reaction conditions and amounts of raw materials to be fed used in the reaction were changed but the types of solutes, reaction conditions and amounts of raw materials to be fed were in accordance with the ranges described in the claims, sheets having dimensions of 10mm (length) ×10mm (width) ×1mm (thickness) were obtained, and the heat conductivity was measured to be 2.8W/m.K or more. According to GB/T6328-1999, the shear strength of the bonded stainless steel sheet of mixture C after curing is greater than 26 MPa.
The invention is not limited to the specific embodiments described above. The invention extends to any novel one, or any novel combination, of the features disclosed in this specification, as well as to any novel one, or any novel combination, of the steps of the method or process disclosed.
Claims (10)
1. The preparation method of the strain gauge paster adhesive with high heat conductivity is characterized by comprising the following steps of:
s1, adding high heat conduction particles into a stirrer, spraying an aqueous solution of sulfamic acid and ammonium persulfate on the surfaces of the high heat conduction particles through a spray head in the stirring process, and continuously stirring for 10-30 minutes after the spraying is finished, and uniformly mixing;
s2, continuing stirring, slowly introducing pyrrole steam through an interface on the stirrer within 1 hour, continuing stirring for 1-3 hours after the steam is introduced, taking out the reacted mixture from the stirrer, and drying at 80 ℃ for 1-2 hours to obtain a filler M;
s3, adding a solvent into the epoxy resin, and fully and uniformly mixing; continuously adding filler M into the diluted epoxy resin, and uniformly mixing by adopting a ball milling mode to obtain a component A;
s4, adding a solvent into cardanol, and fully and uniformly mixing to obtain a component B;
s5, uniformly mixing the component A and the component B in the using process to obtain a mixture C; the mixture C was cured in a mold to obtain a sheet.
2. The method for preparing the high-thermal-conductivity strain gauge paster rubber according to claim 1, which is characterized in that: the high heat conduction particles in the step S1 are one or more than two of aluminum nitride, boron nitride, silicon carbide, graphite and magnesium oxide, and the particle diameter is smaller than 30 microns.
3. The method for preparing the high-thermal-conductivity strain gauge paster rubber according to claim 1, which is characterized in that: the mass ratio of the high heat conduction particles in the S1 to the water to the sulfamic acid to the ammonium persulfate is 100:5:1:0.5-2.5.
4. The method for preparing the high-thermal-conductivity strain gauge paster rubber according to claim 1, which is characterized in that: the mass ratio of the high heat conduction particles to the added pyrrole in the S2 is 100:0.2-2.
5. The method for preparing the high-thermal-conductivity strain gauge paster rubber according to claim 1, which is characterized in that: the mixed solvent in S3 and S4 is a mixed solvent of tetramethyl dipentamethylenedione, n-butanol and ethyl acetate; the mixing proportion of the tetramethyl dipentamethylenedione, the n-butanol and the ethyl acetate in the mixed solvent is 1:1:1, a step of; the epoxy resin is one of E51 and E44.
6. The method for preparing the high-thermal-conductivity strain gauge paster rubber according to claim 1, which is characterized in that: the mass ratio of the epoxy resin to the solvent in the step S3 is 1:2-3; the mass ratio of the epoxy resin to the filler M in the S3 is 1:0.5-1.
7. The method for preparing the high-thermal-conductivity strain gauge paster rubber according to claim 1, which is characterized in that: the mass ratio of the cardanol to the solvent in the S4 is 1:0.3-0.7.
8. The method for preparing the high-thermal-conductivity strain gauge paster rubber according to claim 1, which is characterized in that: the mass ratio of A to B in the mixture in the S5 is 1:0.3-0.5.
9. The method for preparing the high-thermal-conductivity strain gauge paster rubber according to claim 1, which is characterized in that: the stirrer in the S1 comprises an operation table (1), a reactor (2), a spray head (3), a conduit (4), a pump (5), a valve (6), a beaker (7), a two-neck flask (8) and a water bath (9); reactor (2) fixed connection is in the upper end of operation panel (1), 2 pipe (4) sliding connection are in the upper end of reactor (2) respectively, 2 one end of 2 pipe (4) fixed connection 2 shower nozzles (3) respectively, 2 shower nozzles (3) are located the inboard of reactor (2), the middle end of left Bian Daoguan (4) is connected to pump (5) fixed connection, the other end of left Bian Daoguan (4) is located the inboard of beaker (7) of the aqueous solution that is equipped with sulfamic acid and ammonium persulfate, the middle end of right pipe (4) is connected to valve (6) fixed connection, one of them neck of two neck flasks (8) is connected to the other end sliding of right pipe (4), two neck flasks are located the inboard of water bath (9).
10. A strain gauge sensor, characterized by: a high thermal conductivity strain gage paste produced by the method of producing a high thermal conductivity strain gage paste as claimed in any one of claims 1-9.
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